TW201411112A - Device for evaluating visibility of transparent substrate, device for positioning laminate, determination device, position detection device, device for evaluating surface state of metal foil, program, recording medium - Google Patents

Abstract

Through the present invention, the visibility of a transparent substrate is efficiently and precisely evaluated. The device of the present invention for evaluating the visibility of a transparent substrate is provided with: an image taking means for taking an image, through a transparent substrate, of a mark which is present under the transparent substrate; an observation point/brightness graph creating means for measuring, for an image obtained by the image taking, the brightness of each observation point along a direction intersecting the direction in which the observed mark extends, and creating an observation point/brightness graph; and a visibility evaluation means for evaluating the visibility of the transparent substrate on the basis of the slope of a brightness curve occurring from an end part of the mark to a portion in which the mark is not present in the observation point/brightness graph.

Description

Visibility evaluation device for transparent substrate, positioning device for laminated body, determination device, position detection device, evaluation device for surface state of metal foil, program, recording medium, method for manufacturing printed wiring board, and method for evaluating visibility of transparent substrate , positioning method of layer body, determination method, position detection method

The present invention relates to a visibility evaluation device for a transparent substrate, a positioning device for a laminate, a determination device, a position detection device, an evaluation device for a surface state of a metal foil, a program, a recording medium, a method of manufacturing a printed wiring board, and a transparent substrate. The visibility evaluation method, the positioning method of the laminated body, the determination method, and the position detection method.

For a small electronic device such as a smart phone or a tablet PC, a flexible printed wiring board (hereinafter referred to as an FPC (Flexible Printed Circuit)) is used in terms of ease of wiring or light weight. In recent years, with the high functionality of these electronic devices, the speed of signal transmission has been increasing, and impedance matching in FPC has also become an important factor. As a method of impedance matching for an increase in signal capacity, thick layering of a resin insulating layer (for example, polyimide) which is a base of an FPC is progressing. On the other hand, the FPC is processed such as bonding of a liquid crystal substrate or mounting of an IC wafer, but the alignment is performed by etching a copper foil in a laminate of a copper foil and a resin insulating layer. Since the resin insulating layer is formed by the positioning pattern, the visibility of the resin insulating layer becomes important.

As a method of evaluating the visibility of such a resin insulating layer, Patent Document 1 The image taken by the CCD (Charge Coupled Device) camera through the resin insulating layer was observed and evaluated. Furthermore, in Patent Document 2, it is evaluated whether or not the test pattern is deformed in an image photographed at an angle of 30° with respect to the horizontal plane of the resin insulating layer to be evaluated by the CCD camera.

[Previous Technical Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-309336

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2006-001056

However, in the case where the CCD camera is used for observation and the image is simply observed as in Patent Document 1, the accuracy of the visibility evaluation is limited. If it is not actually produced in the production line, it is impossible to judge whether or not it can pass. A transparent substrate is considered to have a mark provided by alignment or the like, and there is a problem in terms of manufacturing cost. The above-described case is the same as the method of evaluating whether or not the test pattern is deformed in the image as in Patent Document 2.

The present invention provides a visibility evaluation device for a transparent substrate which can efficiently and accurately evaluate the visibility of a transparent substrate, a visibility evaluation program for a transparent substrate, and a computer-readable recording medium on which the program is recorded. Moreover, the present invention provides a positioning device for a laminated body which can efficiently and accurately position a laminated body, a positioning program for a laminated body, a computer-readable recording medium on which the program is recorded, and a manufacturing of a printed wiring board. method. Moreover, the present invention provides a An evaluation device for evaluating the surface state of the copper foil on the surface of the copper foil with good efficiency and accuracy, an evaluation program for the surface state of the copper foil, a computer-readable recording medium on which the evaluation program is recorded, and a surface of the copper foil The evaluation method of the state. Further, the present invention provides a method for evaluating the visibility of a transparent substrate which can efficiently and accurately evaluate the visibility of a transparent substrate. Further, the present invention provides a method for efficiently and accurately positioning a laminated body, a method for efficiently and accurately determining whether or not a mark is present, and a method for efficiently and accurately detecting the position of a mark.

The inventors of the present invention have conducted intensive research and found that a mark is placed under the transparent substrate and photographed by a photographing means through the transparent substrate, and attention is paid to the observation point obtained from the image of the mark portion - brightness The slope of the brightness curve near the end of the mark drawn in the graph, and the slope of the brightness curve is evaluated, whereby the visibility of the transparent substrate is not affected by the type of the transparent substrate or the transparent substrate The effect of thickness is evaluated efficiently and accurately.

The present invention, which is based on the above findings, is a visibility evaluation device for a transparent substrate, comprising: a photographing means for passing a mark on the transparent substrate opposite to the transparent substrate Performing photographing; observing the location-brightness chart creating means for measuring the brightness of each observation point in the direction obtained by intersecting the direction in which the observed mark extends in the image obtained by the photographing, and creating an observation point-brightness chart; And a visibility evaluation means for evaluating the visibility of the transparent substrate based on the slope of the brightness curve generated from the end of the mark to the portion without the mark in the observation point-luminance chart.

In another aspect, the invention is a program for making a computer The visibility evaluation device of the transparent substrate of the invention functions.

In still another aspect, the present invention is a recording medium which records a program for causing a computer to function as a visibility evaluation device for a transparent substrate of the present invention and is readable by a computer.

In another aspect, the present invention provides a layered body positioning device for positioning a laminate of a metal and a resin, comprising: a photographing means for the laminated body of the metal and the resin having the mark, The above-mentioned mark is photographed through the above-mentioned resin; the observation point-brightness chart creating means measures the brightness of each observation point in the direction intersected with the direction in which the observed mark extends in the image obtained by the above-mentioned photographing. An observation point-brightness chart is produced; and a positioning means determines the position of the layered body by the slope of the brightness curve generated from the end of the mark to the portion without the mark in the observation point-luminance chart.

In still another aspect, the present invention is a program for causing a computer to function as a positioning device of the laminated body of the present invention.

In still another aspect, the present invention is a recording medium which records a program for causing a computer to function as a positioning device of the laminated body of the present invention and is readable by a computer.

In still another aspect, the present invention provides a method of manufacturing a printed wiring board, comprising the steps of: positioning a printed wiring board using the positioning device of the present invention, and mounting a component on the printed wiring board that has been positioned.

In another aspect, the present invention provides an apparatus for evaluating the surface state of a copper foil, comprising: a photographing means for photographing a mark through the transparent substrate, the mark being surface-treated by the surface-treated copper foil After the surface side is attached to at least one side of the transparent substrate, the surface-treated copper foil is removed by etching to be transparent after removing the surface-treated copper foil by etching. Below the substrate; observation point-brightness chart creating means for measuring the brightness of each observation point in the direction intersected with the direction in which the observed mark extends in the image obtained by the above-mentioned photographing, and making an observation point - brightness And a copper foil surface state evaluation means for evaluating visibility of the transparent substrate based on a slope of a brightness curve generated from an end portion of the mark to a portion without the mark in the observation point-luminance chart And the surface state of the copper foil was evaluated based on the evaluation result of the above visibility.

In still another aspect, the present invention is a program for causing a computer to function as an evaluation device for the surface state of the copper foil of the present invention.

In still another aspect, the present invention is a recording medium which records a program for causing a computer to function as an evaluation device for the surface state of the copper foil of the present invention and is readable by a computer.

In another aspect, the present invention provides a method for evaluating the surface state of a copper foil by photographing a mark through the transparent substrate, and the mark is attached to the surface of the surface-treated copper foil by surface treatment. After at least one side of the transparent substrate is removed by etching, the surface-treated copper foil is removed under the transparent substrate after the surface-treated copper foil is removed by etching, and the image obtained by the above-mentioned photographing is followed by Observing the brightness of each observation point in the direction in which the direction in which the mark extension intersects, and creating an observation point-brightness chart, and based on the portion from the mark to the portion without the mark in the above-mentioned observation place-brightness chart The visibility of the transparent substrate was evaluated by the slope of the luminance curve, and the surface state of the copper foil was evaluated based on the evaluation results of the visibility described above.

In another aspect, the present invention is a method for preparing a mark and a transparent substrate disposed on the mark, and using the CCD camera to pass through the transparent substrate to mark the mark Line photography, and for the image obtained by the above photography, the brightness of each observation point is measured along the direction of the above-mentioned mark observed and made into an observation point-brightness chart, and based on the above-mentioned observation point-brightness chart The visibility of the transparent substrate was evaluated by the slope of the brightness curve produced by the end of the mark to the portion without the mark.

In another aspect, the present invention provides a method for positioning a laminate of a metal and a resin, and the laminated body of the metal and the resin has a mark, and the mark is performed by the CCD camera through the resin. Photography, and the image obtained by the above photography is measured for the brightness of each observation point in a direction crossing the observed mark and is made into an observation point-luminance chart, and based on the above-mentioned mark in the above-mentioned observation place-brightness chart The position of the laminate of metal and resin is performed from the end portion to the slope of the brightness curve generated by the portion without the mark.

In still another aspect, the present invention provides a method of manufacturing a printed wiring board, comprising the steps of: positioning a printed wiring board using the positioning method of the present invention, and mounting a component on the printed wiring board that has been positioned.

In another aspect, the present invention is a determination method for determining whether or not there is a mark having a laminate of a metal and a transparent substrate, and is for a laminate having the mark of the metal and the transparent substrate, The mark is photographed through the transparent substrate, and the brightness of each observation point is measured in the direction of the image obtained by the photographing in the direction intersecting the direction in which the mark is extended, and the observation point-brightness chart is prepared. And determining whether or not the mark of the laminated body is present is based on a slope of a brightness curve generated from an end portion of the mark to a portion having no mark in the observation point-luminance chart.

In still another aspect, the present invention is a determining device for determining whether or not there is a device having a mark of a laminate of a metal and a transparent substrate, and comprising: a photographing means For the laminated body having the marked metal and the transparent substrate, the mark is photographed through the transparent substrate; the observation point-brightness chart creating means, the image obtained by the photographing, and the observed Measuring the brightness of each observation point in the direction in which the direction of the mark extension intersects and creating an observation point-brightness chart; and positioning means based on the portion from the mark to the portion without the mark in the observation point-luminance chart The slope of the brightness curve determines the position of the above-mentioned laminated body.

In still another aspect, the present invention is a program for causing a computer to function as a device for determining whether or not a mark having a laminate of a metal and a transparent substrate exists in the present invention.

In still another aspect, the present invention is a recording medium which records a program for causing a computer to function as a device for determining whether or not a mark of a laminate of a metal and a transparent substrate exists in the present invention, and is a computer Readable.

In another aspect, the present invention is a position detecting method for detecting a position of a mark of a laminate of a metal and a transparent substrate, and for the metal and the transparent substrate having the mark a layered body, the mark is photographed through the transparent substrate, and an image obtained by the photographing is measured in a direction intersecting the direction in which the observed mark extends, and the brightness of each observation point is measured and made into an observation point - A brightness chart, and a method of detecting the position of the mark based on the slope of the brightness curve generated from the end of the mark to the portion without the mark in the observation point-luminance chart.

In another aspect, the present invention is a position detecting device for detecting a position of a mark of a laminated body of a metal and a transparent substrate, and comprising: a photographing means for the metal having the mark a laminate with a transparent substrate, passing through the above transparent substrate The material is photographed with the above-mentioned mark; the observation point-brightness chart creating means determines the brightness of each observation point in the direction intersected with the direction in which the observed mark extends in the image obtained by the photographing, and makes the observation place a brightness chart; and a positioning means for determining the position of the layered body based on a slope of a brightness curve generated from an end portion of the mark to a portion having no mark in the observation point-luminance chart.

In still another aspect, the present invention is a program for causing a computer to function as a device for detecting a position of a mark on a laminate of a metal and a transparent substrate of the present invention.

In still another aspect, the present invention is a recording medium which records a program for causing a computer to function as a device for detecting a position of a mark of a metal and a transparent substrate of the present invention, and is a computer Readable.

According to the present invention, the visibility of the transparent substrate can be evaluated efficiently and accurately. Moreover, according to the present invention, the positioning of the laminated body can be performed efficiently and accurately. Moreover, according to the present invention, the surface state of the metal foil can be evaluated efficiently and accurately. Moreover, according to the present invention, it is possible to efficiently and accurately determine whether or not the mark is present. Moreover, according to the present invention, the position of the mark can be detected efficiently and accurately.

10‧‧‧ Visibility evaluation device for transparent substrate

11‧‧‧Photography

12‧‧‧ Computer (observation location - means of making brightness chart, means of visibility evaluation, smoothing means)

13‧‧‧ Display means

14‧‧‧Lighting means

15‧‧‧ platform

16‧‧‧ mark

17‧‧‧Transparent substrate

20‧‧‧Layer-positioning device

21‧‧‧Photography

22‧‧‧Computer (observation location - means of making brightness chart, positioning means, smoothing means)

23‧‧‧ Display means

24‧‧‧Lighting means

25‧‧‧ platform

26‧‧‧ mark

27‧‧‧Layer

10'‧‧‧Evaluation device for copper foil surface condition

11'‧‧‧Photography

12'‧‧‧Computer (observation location - brightness chart production means, copper foil surface state evaluation means, smoothing processing means)

13'‧‧‧ Display means

14'‧‧‧Lighting means

15'‧‧‧ platform

16'‧‧‧ mark

17'‧‧‧Transparent substrate

Fig. 1 is a schematic view showing a visibility evaluation device for a transparent substrate according to an embodiment of the present invention.

Fig. 2 is a flow chart showing a method for evaluating the visibility of a transparent substrate according to an embodiment of the present invention.

Fig. 3 is a schematic view showing Bt and Bb in the case where the mark width is about 1.3 mm.

Fig. 4 is a schematic view showing Bt and Bb in the case where the mark width is about 0.3 mm.

Figure 5 is a schematic diagram defining k1 and k2.

Fig. 6 is a schematic view showing a positioning device for a laminated body according to an embodiment of the present invention.

Fig. 7 is a flow chart showing a method of positioning a laminated body according to an embodiment of the present invention.

Fig. 8 is a schematic view showing a method of measuring the configuration of the photographing means and the method of measuring the slope of the luminance curve in the evaluation of the slope of the luminance curve in the case where the width of the mark is 0.1 to 0.4 mm.

Fig. 9 is a schematic view showing a method of measuring the configuration of the photographing means and the method of measuring the slope of the luminance curve in the evaluation of the slope of the luminance curve in the case where the width of the mark is 1.0 to 2.0 mm.

Fig. 10 is a schematic view showing an apparatus for evaluating the surface state of a copper foil according to an embodiment of the present invention.

Fig. 11 is a flow chart showing a method of evaluating the surface state of the copper foil according to the embodiment of the present invention.

(visibility evaluation device for transparent substrate, visibility evaluation method, visibility evaluation program, and recording medium)

Fig. 1 is a schematic view showing a visibility evaluation device 10 for a transparent substrate according to an embodiment of the present invention. The visibility evaluation device 10 for a transparent substrate according to an embodiment of the present invention includes means for photographing the mark 16 existing under the transparent substrate 17 provided on the stage 15 through the transparent substrate 17 a computer 12 that performs various processes based on image signals from the imaging means 11; a display means 13 that displays a specific image based on various signals from the computer 12; and a lighting means 14 that is transparent to the platform The substrate 17 and the mark 16 illuminate the light. The transparent substrate 17 to be evaluated in the present invention is not particularly limited, and may be a resin substrate such as glass or polyimide. Further, in the present invention, the term "transparent" also includes the case of having light transmittance. Furthermore, the mark in the present invention may be a mark printed on a printed matter such as paper. It can also be copper wiring, and it can be used in any form as long as it is a target mark. Further, the mark may be a printed matter, may be a metal, may be an inorganic substance, or may be an organic substance, and may be a target. If the mark is linear, the image obtained by photographing is measured along the direction of the observed mark and the brightness of each observation point is measured to make the operation of the observation point-brightness chart easier and preferable.

The flexible printed wiring board (FPC) performs processing such as bonding of a liquid crystal substrate or mounting of an IC chip, but the positional alignment at this time is resin insulation remaining after being etched through the copper foil which has passed through the copper clad laminate. The layer is visually recognized by the positioning pattern, so the visibility of the resin insulating layer becomes important. In order to evaluate the visibility of the resin insulating layer with good efficiency, in the present invention, the transparent substrate may be subjected to roughening treatment of the surface-treated metal foil having at least one surface subjected to surface treatment such as roughening treatment. After the surface side of the surface treatment is bonded to at least one surface of the transparent substrate, the metal foil is removed by etching. Further, the transparent substrate may be produced by bonding the surface-treated metal foil to the both surfaces of the surface of the transparent substrate after the surface treatment such as roughening treatment, and then etching the two surfaces. Metal foil removal. The metal foil is not particularly limited, and copper foil, aluminum foil, nickel foil, copper alloy foil, nickel alloy foil, aluminum alloy foil, stainless steel foil, iron foil, and iron alloy foil can be used.

The imaging device 11 includes an imaging device, an image processing unit including an image processing circuit that receives an output of the imaging device, a control unit configured by a control circuit such as a control image processing unit, and the like, and an optical unit including a lens or the like. System, etc. As the imaging means 11, for example, a CCD camera or the like can be used. The photographing means 11 photographs the mark 16 existing under the transparent substrate 17 provided on the stage 15 through the transparent substrate 17 and acquires an image.

The computer 12 performs various places based on image signals from the imaging means 11. Reason. The computer 12 has means for observing a location-brightness chart creating means for measuring the brightness of each observation point in a direction intersecting the direction in which the observed mark 16 extends in the image signal from the imaging means 11, and making the observation point a brightness chart; and a visibility evaluation means for evaluating the visibility of the transparent substrate 17 by the slope of the brightness curve generated from the end of the mark 16 to the portion without the mark 16 in the observation spot-brightness chart. The observation point-brightness chart making means can also measure the brightness of each observation point in a direction perpendicular to the direction in which the observed mark 16 extends and form an observation point-brightness chart.

Further, the computer 12 may further include a smoothing processing means for alleviating the unevenness of the brightness of the image obtained by the photographing by the photographing means 11, and the observation point-luminance chart creating means may also use the brightness after the smoothing process to form the observation point. - Brightness chart.

Further, the mark 16 existing under the transparent substrate 17 is a linear mark 16 printed on a printed matter laid under the transparent substrate 17, and the observation point-brightness chart creating means can also be used for the image obtained by photography. The brightness of each observation point is measured in a direction perpendicular to the direction in which the observed mark 16 extends, and an observation point-brightness chart is created.

The computer 12 has a memory as a means of memory. In the memory, the computer readable record (so-called storage) has an image from the digital imaging means 11, an observation point-brightness chart production formula, a visibility evaluation formula, and evaluation values in each stage, and the like. .

The display means 13 displays a specific image or numerical value such as an observation point-brightness chart, a visibility evaluation result, and the like based on various signals from the computer 12.

Next, a method for evaluating the visibility of the visibility evaluation device 10 using the transparent substrate of the above embodiment will be described with reference to a flowchart shown in FIG. 2. Furthermore, the flow chart shown in FIG. 2 is a visibility evaluation using the visibility evaluation device 10 of the transparent substrate of the present invention. The evaluation method which can be realized by the visibility evaluation device 10 of the present invention is not limited to the one shown in the flowchart of Fig. 2 . In particular, in FIG. 2, the smoothing process is performed before the observation point-brightness chart is formed on the image obtained by photographing, but is not limited thereto, and may be performed, for example, after the observation point-brightness chart is created. .

In the visibility evaluation method using the visibility evaluation device 10 having a transparent substrate, first, the mark 16 existing under the transparent substrate 17 is photographed by the photographing means 11 through the transparent substrate 17. The signal of the image photographed by the photographing means 11 is transmitted to the computer 12. The observation point-brightness chart creation means of the computer 12 measures the brightness of each observation point in the direction perpendicular to the direction in which the observed mark 16 extends, and creates an observation point-luminance chart for the image signal from the imaging means 11. The visibility evaluation method of the computer 12 evaluates the visibility of the transparent substrate 17 by the slope of the brightness curve generated from the end of the mark 16 to the portion without the mark 16 in the observation point-brightness chart. In the past, if it was not actually produced in the production line, it was impossible to determine whether or not the mark which can be disposed through the transparent substrate as being aligned or the like was provided, and there was a problem in terms of manufacturing cost. However, according to the visibility evaluation device 10 of the transparent substrate of the present invention, the visibility of the transparent substrate 17 can be easily and efficiently evaluated in the laboratory only in the laboratory.

When a polyimide substrate is used as the transparent substrate 17 to be evaluated in the present invention, the polyimide substrate may also have a thickness of 50 μm and a polyimide substrate before bonding to the metal foil. The difference between the highest average value Bt and the lowest average value Bb of the luminance curve generated from the end of the mark 16 to the portion without the mark 16 is ΔB(PI) [ΔB(PI)=Bt-Bb] is 20 or more and 33 The following. Further, when a polyimide substrate is used as the transparent substrate 17 to be evaluated in the present invention, the polyimide substrate can also be used in a thickness of 50 μm. The difference between the highest average value Bt and the lowest average value Bb of the brightness curve generated from the end of the polyimide 16 substrate before the metal foil to the portion without the mark 16 is ΔB(PI) [ΔB (PI)=Bt-Bb] is 50 or more and 65 or less.

The visibility evaluation means of the computer 12 can be evaluated by using the following three aspects: the surface-treated surface side of the surface-treated metal foil from the surface treatment such as roughening treatment is attached to the polyimide substrate. After at least one surface, the highest average Bt and the lowest average value Bb of the brightness curve generated from the end of the label 16 of the polyimide substrate obtained by etching to remove the metal foil from the end of the label 16 to the portion without the mark 16 The difference ΔB (ΔB = Bt - Bb); the ratio of ΔB / ΔB (PI); and the slope k1 expressed by the angle of the brightness curve in the specific depth range based on Bt.

Further, the visibility evaluation means of the computer 12 can determine that the difference between the highest average value Bt and the lowest average value Bb of the luminance curve generated from the end portion of the mark 16 to the portion without the mark 16 is ΔB. (ΔB=Bt-Bb) is a brightness curve in a depth range of 20 or more and 33 or less, a ratio of ΔB/ΔB (PI) of 0.7 or more, and Bt as a reference of 0.4 ΔB to 0.6 ΔB. The slope k1 indicated by the angle is 65° or more, and it is also possible to determine that the slope k1 of the luminance curve is 87° or less.

Further, the visibility evaluation means of the computer 12 may further use the slope k2 indicated by the angle of the luminance curve from the intersection of the luminance curve and Bt to the depth range of 0.1 ΔB based on Bt for evaluation. Further, it is also possible to determine that k2 is 30 or more.

According to such an evaluation device, the visibility of the transparent substrate can be evaluated efficiently and more accurately.

Preferably, the computer 12 further includes a smoothing processing means for mitigating the unevenness of the brightness of the image obtained by the imaging by the photographing means 11, and the observation point-luminance chart creating means The observation point-brightness chart is created using the smoothed brightness. The smoothing processing by the smoothing processing means is performed on the data (original waveform) of the noise including the luminance obtained by the image obtained by the photographing by the photographing means 11, whereby the unevenness of the brightness is moderated. Therefore, the visibility of the transparent substrate 17 can be evaluated more accurately. The smoothing processing by the smoothing processing means can be performed by various smoothing programs, for example, smoothing processing using a 2nd and 3rd order polynomial fitting method, smoothing processing using Fourier transform, or moving average method Smoothing processing, etc. Furthermore, the smoothing process can also be performed using various known smoothing programs. Further, the smoothing process of the luminance data may be performed on both the portion having the mark 16 and the portion having no mark 16, and the portion having the mark 16 may be performed on the portion having no mark 16 or partially.

Further, regarding the image obtained by the photographing by the photographing means 11, the observation point-brightness chart of the data (original waveform) including the noise of the brightness may be performed in advance before the smoothing of the brightness is performed. Production.

Here, the "highest average value Bt of the brightness curve", "the lowest average value Bb of the brightness curve", "the slope k1 of the brightness curve by the angle", and the following "the brightness curve are represented by angles" are used. The slope k2" will be described. Further, regarding the "minimum average value Bb of the luminance curve", the width of the mark 16 is made large (for example, the width of the mark 16 can be 0.7 mm or more, for example, 0.8 mm or more, for example, 5 mm or less, or 4 mm or less, for example, The width of the mark 16 is small (for example, the width of the mark 16 can be 0.01 mm or more, 0.05 mm or more, 0.1 mm or more, 0.8 mm or less, 0.7 mm or less, 0.6 mm or less, for example, it can be set. For those who are 0.3 mm), each case is explained because the regulations are different.

A schematic diagram of Bt and Bb in the case where the width of the mark 16 is made larger (set to about 1.3 mm) is shown in FIG. The "mark" in Fig. 3 is indicated by using the above CCD The linear mark 16 (width about 1.3 mm) of the printed matter observed by the image obtained by the photography of the camera. The curve drawn in such a manner as to overlap the mark 16 indicates the brightness curve generated from the end of the mark 16 to the portion without the mark 16 in the above-mentioned observation place-brightness chart. As shown in Fig. 3, the "highest average value Bt of the luminance curve" indicates the average value of the luminance when the 5 portions (the total of 10 portions on both sides) are measured at intervals of 30 μm from the position where the end portions on both sides of the mark 16 are separated by 100 μm. . The "lowest average value Bb of the luminance curve" indicates the average value of the luminance when the 11 portions are measured at intervals of 100 μm from the position where the end portion of the mark 16 is inside to the inside of 100 μm. Further, the interval of the observation point for measuring the average value of the brightness may be appropriately employed in the range of 1 μm to 500 μm in accordance with the shape of the luminance curve. In order to avoid deviations in the observation sites, the intervals of the observation sites are preferably substantially equally spaced or equally spaced. Furthermore, the intervals of the observation points may not be substantially equal intervals or may be equal intervals. Further, it is considered that the wider the measurement interval, the more the influence of the specific observation point can be excluded and the error due to the observation place can be reduced.

4(a) and 4(b), there are shown schematic diagrams for defining Bt and Bb in the case where the width of the mark 16 is set to about 0.3 mm. When the width of the mark 16 is set to about 0.3 mm, there is a case where the V-shaped brightness curve is as shown in Fig. 4 (a), and as in the case of about 1.3 mm as shown in Fig. 4 (b). Become the case with the brightness curve at the bottom. In either case, the "highest average value Bt of the luminance curve" means that the position of the end portion on both sides of the mark 16 is separated from the position of 50 μm, and the width of the mark 16 is set to be about 1.3 mm, and the interval is 30 μm. The average value of the brightness at the time of the 5 parts (the total of 10 parts on both sides) was measured. On the other hand, the "minimum average value Bb of the luminance curve" is the lowest value of the luminance of the front end portion of the V-shaped valley when the luminance curve is V-shaped as shown in Fig. 4(a). In the case of the bottom of (b), the value of the center portion of about 0.3 mm is indicated. Furthermore, the observation of the average value of the brightness is used. The interval between the places can be suitably employed in the range of 1 μm to 500 μm depending on the shape of the brightness curve. In order to avoid deviations in the observation sites, the intervals of the observation sites are preferably substantially equally spaced or equally spaced. Furthermore, the intervals of the observation points may not be substantially equal intervals or may be equal intervals. Further, it is considered that the wider the measurement interval, the more the influence of the specific observation point can be excluded and the error caused by the observation place can be reduced.

A schematic diagram defining k1 and k2 is shown in FIG. "The slope k1 of the brightness curve indicated by the angle" means that Bt is the reference 0.4△B~0.6△B[△B is the difference between the highest average value Bt of the brightness curve and the lowest average value Bb (△B=Bt-Bb The slope of the luminance curve in the depth range is (k1 (°) = tan ^-1 (b (gray scale) / a (pixel)))). Furthermore, one pixel on the horizontal axis corresponds to a length of 10 μm. Moreover, the ratio of the length of one pixel to the length of one gray scale in the graph of the luminance curve is set to 3.5:5 (the length of one pixel in the graph of the luminance curve: the length of one gray scale in the graph of the luminance curve = 3.5) The value of k1 (°) is calculated in the graph of the brightness curve of :5). Further, k1 is a measure of the both sides of the mark 16 and uses a smaller value of the slope indicated by the angle. The slope k2 expressed by the angle of the luminance curve indicates the slope of the luminance curve in the depth range from the intersection of the luminance curve and Bt to the depth range of 0.1 ΔB from Bt (k2 (°) = Tan ^-1 (d (gray scale) / c (pixel))). Further, one pixel of the horizontal axis corresponds to a length of 10 μm. Moreover, the ratio of the length of one pixel to the length of one gray scale in the graph of the luminance curve is set to 3.5:5 (the length of one pixel in the graph of the luminance curve: the length of one gray scale in the graph of the luminance curve = 3.5) The value of k1 (°) is calculated in the graph of the brightness curve of :5). Further, the k2 system measures the both sides of the mark 16 and adopts a value smaller than the slope indicated by the angle. Further, when the shape of the luminance curve is unstable and there are a plurality of "the intersection of the luminance curve and the Bt", the intersection of the closest marker 16 is used.

ΔB (PI) is a difference between the highest average value Bt and the lowest average value Bb of the luminance curve of the polyimide obtained before bonding to a metal foil such as a copper foil.

In the above-described image photographed by the CCD camera, the portion where the mark 16 is not attached has a higher brightness, but the brightness of the end portion of the mark 16 is lowered. If the visibility of the polyimide substrate is good, such a decrease in brightness can be clearly observed. On the other hand, if the visibility of the polyimide substrate is poor, the brightness does not fall sharply from "high" to "low" at the end of the mark 16, and the state of the lowering becomes gentle and the brightness is lowered. It became unclear.

The present invention is based on such a finding, and comprehensively evaluates a polyimide substrate to which a metal foil such as a surface-treated copper foil is attached and removed, and a printed matter with a mark 16 is placed underneath, and passes through a CCD camera. The observation point obtained by capturing the image of the above-mentioned marked portion on the amine substrate - the slope of the brightness curve near the end of the mark 16 drawn in the brightness chart; in more detail, the highest average value of the brightness curve Bt The difference between the lowest average value Bb ΔB (ΔB=Bt-Bb), the ratio of ΔB/ΔB(PI), and the brightness range of 0.4△B~0.6△B based on Bt The slope k1 is represented by an angle; thereby, the visibility of the accurate transparent substrate can be evaluated. K1 is preferably 65 or more, and more preferably 87 or less. Further, the upper limit of k1 is preferably 87 or less, more preferably 85 or less, still more preferably 83 or less. If k1 exceeds 87°, the peel strength becomes small. The upper limit of ΔB/ΔB (PI) is not particularly limited, and is, for example, 1.70 or less, or 1.50 or less, or 1.40 or less.

Further, it is also possible to evaluate the case where the visibility is good, that is, the observation point of the computer 12 - the brightness chart creation means based on the image obtained by the image capturing means 11 - the brightness chart, the brightness The slope k2 of the luminance curve in the depth range from the intersection of the curve and Bt to the depth range of 0.1 ΔB based on Bt is 30° or more. According to this With this configuration, the boundary between the mark 16 and the portion without the mark 16 becomes clearer, the positioning accuracy is improved, and the error caused by the mark image recognition is reduced, and the positional alignment can be performed more accurately. More preferably, k2 is 35° or more, and more preferably 40° or more. The upper limit of k2 is not particularly limited and is, for example, 87° or less, or 82° or less, or 77° or less, or 72. the following.

In the present invention, the roughening treatment refers to, for example, physical polishing or treatment (mechanical polishing, polishing, sandblasting, etc.) or chemical polishing or treatment (pickling, roughening) of the surface of the metal foil. Plating (plating of electroplated roughened particles), etc., to increase the unevenness of the surface of the metal foil. Moreover, in the present invention, the surface treatment refers to the surface of the metal foil, such as a roughening treatment, a wet plating treatment, a dry plating treatment (including a sputtering treatment or a vapor deposition treatment), a chemical polishing treatment, and a mechanical polishing treatment. Physical and chemical treatment.

Further, the processing procedure as described above is executed as a program for the computer, whereby the visibility of the transparent substrate can be evaluated efficiently and accurately.

Further, the program computer is readable and recordable for use on a recording medium such as a compact disc or a magnetic disc, whereby the other computer can also implement the program, and the same effect as the processing sequence described above can be obtained.

(Positioning device of laminated body, positioning method of laminated body, positioning program of laminated body, and recording medium)

Fig. 6 is a schematic view showing a positioning device 20 of a laminated body according to an embodiment of the present invention. The positioning device 20 of the laminated body according to the embodiment of the present invention includes means for photographing the mark 26 existing in the metal and resin laminated body 27 provided on the stage 25 through the resin; the computer 22, It performs various processes based on the image signal from the imaging means 21; the display means 23 displays a specific image based on various signals from the computer 22, and the like; 24, which illuminates the laminated body 27 on the platform.

The layered body 27 of the metal and the resin is not particularly limited as long as it is formed by bonding a metal to the resin. Specific examples of the layered body 27 of the metal and the resin in the present invention are formed by at least one surface of a main substrate, an attached circuit board, and a resin for electrically connecting the same to a resin such as polyimide. In an electronic device having a flexible printed circuit board having a metal wiring such as copper, the flexible printed circuit board is pressed against the wiring end portion of the main circuit board and the attached circuit board by accurately positioning the flexible printed circuit board. In other words, in this case, the laminated body 27 is a laminated body in which the wiring end portions of the flexible printed circuit board and the main substrate are bonded by pressure bonding, or the flexible printed circuit board is bonded by pressure bonding. A laminated body to which the wiring end portions of the circuit board are bonded. The laminate 27 has indicia formed of a portion of the metal wiring or other material. The position of the mark is not particularly limited as long as it can be photographed by the photographing means 21 such as a CCD camera through the resin constituting the layered body 27.

The imaging device 21 includes an imaging device, an image processing unit including an image processing circuit that receives an output of the imaging device, a control unit configured by a control circuit such as a control image processing unit, and the like, and an optical unit including a lens or the like. System, etc. As the photographing means 21, for example, a CCD camera or the like can be used. The photographing means 21 photographs the mark 26 existing in the laminated body 27 provided on the stage 25 through the resin of the laminated body and acquires an image.

The computer 22 performs various processes based on the image signal from the imaging means 21. The computer 22 has means for observing the location-brightness chart creating means for measuring the brightness of each observation point in the direction intersecting the direction in which the observed mark 26 extends in the image signal from the imaging means 21, and creating an observation point. a brightness map; and a positioning means by means of a brightness curve generated from the end of the mark 26 to the portion without the mark 26 in the observation point-brightness chart The slope determines the position of the laminate 27. The observation point-brightness chart making means can also measure the brightness of each observation point in a direction perpendicular to the direction in which the observed mark 26 extends, and create an observation point-brightness chart.

Further, the computer 22 further includes a smoothing processing means for alleviating the unevenness of the brightness of the image obtained by the photographing by the photographing means 21, and the observation point-brightness chart creating means can also use the brightness after the smoothing processing to create an observation point - the brightness graph .

The computer 22 has a memory as a means of memory. In the memory, the computer readable record (so-called storage) includes an image from the digitized imaging means 21, an observation point-brightness chart creation formula, a positioning type, an evaluation value in each stage, and the like.

The display means 23 displays a specific image or numerical value such as an observation point-brightness chart, a position evaluation result, and the like based on various signals from the computer 22.

Next, a positioning method using the positioning device 20 having the laminated body of the above embodiment will be described with reference to a flowchart shown in FIG. Further, the flowchart shown in FIG. 7 is an embodiment in which the positioning device 20 of the laminated body of the present invention is used, and the evaluation method that can be realized by the positioning device 20 of the present invention is not limited to FIG. The one shown in the flowchart. In particular, the smoothing process in FIG. 7 is performed before the observation point-brightness chart is formed on the image obtained by photographing, but is not limited thereto, and may be performed, for example, after the observation point-brightness chart is created. .

The positioning method using the positioning device 20 having the laminated body photographs the mark 26 existing in the laminated body 27 of the metal and the resin provided on the stage 25 through the resin by the photographing means 21. The signal of the image photographed by the photographing means 21 is transmitted to the computer 22. The observation point of the computer 22 - the brightness chart making means is for the image signal from the imaging means 21, along and observed The brightness of each observation point is measured in the direction perpendicular to the direction in which the mark 26 extends and the observation point-brightness chart is created. The positioning means of the computer 22 evaluates the position of the laminated body 27 by the slope of the luminance curve generated from the end of the mark 26 to the portion without the mark 26 in the observation point-luminance chart.

The positioning means of the computer 22 can be positioned by using the following three methods: after attaching the surface-treated metal foil to the surface side of the surface treatment such as roughening treatment to at least one surface of the polyimide substrate, The difference between the highest average value Bt and the lowest average value Bb of the luminance curve generated from the end portion of the polyimide 26 substrate obtained by etching to remove the metal foil from the end portion of the label 26 to the portion having no mark 26 (ΔB = Bt-Bb); a ratio composed of ΔB/ΔB (PI); and a slope k1 represented by an angle of the above-described luminance curve within a specific depth range based on Bt. Further, the visibility evaluation means of the computer 22 may further use the slope k2 indicated by the angle of the luminance curve from the intersection of the luminance curve and Bt to the depth range of 0.1 ΔB based on Bt for evaluation. The position of the mark 26 can be detected by such a configuration, and the position of the metal and resin laminated body 27 can be positioned based on the position of the detected mark 26.

The definitions of Bt, Bb, k1, and k2 are as described in the above-described evaluation of the visibility of the transparent substrate. According to this positioning method, the boundary between the mark 26 and the portion without the mark 26 becomes clearer, and the positioning accuracy is improved. Moreover, the error caused by the recognition of the mark image is reduced, and the positional alignment can be performed more accurately. For example, when the value of ΔB(PI), ΔB/ΔB(PI), k1 or k2 is a specific range, the device for detecting the position can make the determination that the mark 26 exists at the position. Specifically, for example, ΔB (PI) is 20 or more and 33 or less, the ratio of ΔB/ΔB (PI) is 0.7 or more, k1 is 65° or more, and further 87° or less, or k2 is 30. In the case of ° or more, the determination that the mark 26 exists at the position can be performed by the device for detecting the position.

Preferably, the computer 22 further includes a smoothing processing means for alleviating the unevenness of the brightness of the image obtained by the imaging by the photographing means 21, and the observation point-luminance chart creating means creates the observation point using the brightness after the smoothing process. - Brightness chart. The smoothing processing by the smoothing processing means is performed on the data (original waveform) of the noise including the luminance obtained by the image obtained by the photographing by the photographing means 21, whereby the unevenness of the brightness is moderated. Therefore, the position of the laminated body 27 can be more accurately evaluated. The smoothing processing by the smoothing processing means can be performed by various smoothing programs, for example, smoothing processing using a 2nd and 3rd order polynomial fitting method, smoothing processing using Fourier transform, or moving average method Smoothing processing, etc.

Further, regarding the image obtained by the photographing by the photographing means 21, the observation point-luminance graph of the data (original waveform) including the noise of the luminance may be performed in advance before the smoothing processing of the luminance is performed. Production.

Further, the positioning device 20 of the laminated body may further include a positioning means for aligning (not shown) the laminated body (including a laminate of copper and resin or a printed wiring board) having a determined position. As the position aligning means, for example, a moving device or a moving means for moving the laminated body can be cited. As the moving device or the moving means, for example, a conveyor such as a belt conveyor or a chain conveyor; a moving device or a moving means provided with an arm mechanism; and a moving device or moving means for moving the laminated body by using a gas may be used. a moving device or moving means (including a roller or a bearing) that rotates an object such as a substantially cylindrical shape to move the laminated body; a moving device or a moving means that uses oil pressure as a power source; and a moving device that uses air pressure as a power source Or moving means; moving device or moving means with motor as power source; and gantry mobile linear guiding platform, bracket moving air guiding platform, stacked linear guiding platform and linear motor A mobile device or a moving means of a platform such as a driving platform. Further, a known mobile device or moving means can be used as the mobile device or the moving means.

Furthermore, the positioning device 20 according to the embodiment of the present invention may have a surface mounter, and the positioning device according to the embodiment of the present invention may be provided on the surface mounter.

Further, in the positioning device 20 according to the embodiment of the present invention, the laminated body of the metal and the resin positioned by the positioning device may be a printed wiring board having a circuit provided on the resin plate and the resin plate. Moreover, in this case, the above-mentioned mark may be the above circuit.

Further, by performing the processing procedure as described above as a program and executing the computer, the positioning of the laminated body can be efficiently and accurately evaluated.

Further, the program computer is readable and recordable for use on a recording medium such as a compact disc or a magnetic disc, whereby the other computer can also implement the program, and the same effect as the processing sequence described above can be obtained.

In the present invention, "positioning" includes "the case of detecting the position of a mark or an object". Further, in the present invention, the "positional alignment" includes a case where the mark or the object is moved to a specific position based on the detected position after detecting the position of the mark or the object.

The printed wiring board can also be manufactured by positioning the printed wiring board using the positioning device of the printed wiring board of the present invention, and mounting the component on the positioned printed wiring board. Further, the printed wiring board can be manufactured by the positioning operation of the printed wiring board of the present invention, and the positioning of the positioned printed wiring board is performed, and the position is aligned. Printed wiring board mounting parts. Thereby, components such as electronic components can be mounted at the exact position of the printed wiring board.

Further, the printed wiring board can be manufactured by positioning the printed wiring board by the positioning device of the printed wiring board of the present invention and connecting the other printed wiring board to the positioned printed wiring board. Further, the printed wiring board can be manufactured by positioning the printed wiring board by the positioning device of the printed wiring board of the present invention, and positioning the positioned printed wiring board, and printing another one. The wiring board is connected to the positionally aligned printed wiring board. Thereby, other printed wiring boards can be connected to an accurate position on the printed wiring board to be connected. Here, the "connection" may be an electrical connection (for example, soldering or the like), or may be a connection using a bonding material or the like instead of an electrical connection.

Furthermore, in the present invention, the "printed wiring board" also includes a printed wiring board on which components are mounted and a printed circuit board.

When the positioning of the printed wiring board is performed using the program or the positioning device according to the embodiment of the present invention, the positioning of the printed wiring board can be performed more accurately. Therefore, it is considered that when one printed wiring board is connected to another printed wiring board or when a component is mounted on one printed wiring board, connection failure is reduced and the yield is improved. Furthermore, the operation of positioning the printed wiring board using the program can also be applied to soldering or connection via an anisotropic conductive film (ACF) via an anisotropic conductive paste (ACP). When a printed wiring board is connected to another printed wiring board or a printed wiring board is mounted on a printed wiring board by a known connection method such as connection by a conductive adhesive.

(Evaluation device for surface condition of copper foil, method for evaluating surface state of copper foil, evaluation program for surface state of copper foil, and recording medium)

Fig. 10 is a schematic view showing an apparatus 10' for evaluating the surface state of a copper foil according to an embodiment of the present invention. The apparatus for evaluating the surface state of the copper foil according to the embodiment of the present invention includes: a photographing means 11' which passes through The transparent substrate 17' photographs the mark 16' present under the transparent substrate 17' disposed on the platform 15'; the computer 12' performs various processes based on the image signal from the image pickup means 11'; Means 13', which display a specific image or the like based on various signals from the computer 12', and illumination means 14' that illuminate the transparent substrate 17' and the mark 16' on the platform. The transparent substrate 17' to be evaluated in the present invention is not particularly limited, and may be a resin substrate such as glass or polyimide. Further, in the present invention, the term "transparent" also includes the case of having light transmittance. Further, the mark in the present invention may be a mark printed on a printed matter such as paper, or may be a copper wire, and may be in any form as long as it is a target mark. Further, the mark may be a printed matter, may be a metal, may be an inorganic substance, or may be an organic substance, as long as it is intended to be a target. If the mark is linear, it is easy to measure the brightness of each observation point in the direction of the observed mark across the observed mark and make the observation point-brightness chart easier.

The flexible printed wiring board (FPC) performs processing such as bonding of a liquid crystal substrate or mounting of an IC chip, but the positional alignment at this time is resin insulation remaining after being etched through the copper foil which has passed through the copper clad laminate. The layer is visually recognized by the positioning pattern, so the visibility of the resin insulating layer becomes important. Moreover, evaluation of the surface state of the copper foil which affects the visibility of the resin insulating layer is required. In the present invention, the transparent substrate is a surface-treated metal foil obtained by subjecting at least one surface to a surface treatment such as roughening treatment for accurate visibility evaluation of the resin insulating layer and evaluation of the surface state of the copper foil. After the surface side of the surface treatment such as the roughening treatment is bonded to at least one surface of the transparent substrate, the metal foil is removed by etching. The metal foil is not particularly limited, and copper foil, aluminum foil, nickel foil, copper alloy foil, nickel alloy foil, aluminum alloy foil, stainless steel foil, iron foil, and iron alloy foil can be used.

The imaging means 11' includes an imaging element and an image of the output of the input imaging element An image processing unit configured by a processing circuit or the like, a control unit including a control circuit such as a control image processing unit, and an optical system including a lens or the like. As the photographing means 11', for example, a CCD camera or the like can be used. The photographing means 11' photographs and takes an image of the mark 16' existing under the transparent substrate 17' provided on the stage 15' through the transparent substrate 17'.

The computer 12' performs various processes based on the image signal from the imaging means 11'. The computer 12' has means for observing the location-brightness chart creation means for measuring the brightness of each observation point in the direction intersecting the direction in which the observed mark 16' extends, for the image signal from the imaging means 11'. An observation point-brightness chart; and a visibility evaluation means for evaluating the transparent substrate 17' by the slope of the brightness curve generated from the end of the mark-up 16' to the portion of the mark-free portion 16' Visibility. The observation point-brightness chart making means can also measure the brightness of each observation point in a direction perpendicular to the direction in which the observed mark 16' extends, and make an observation point-brightness chart.

Further, the computer 12' further includes a smoothing processing means for alleviating the unevenness of the brightness of the image obtained by the photographing means 11', and the observation point-brightness chart creating means can also use the brightness after the smoothing processing to form the observation point. - Brightness chart.

Further, the mark 16' existing under the transparent substrate 17' is a linear mark 16' printed on a printed matter laid under the transparent substrate 17', and the observation point-brightness chart creating means can also be obtained by photography. For the image, the brightness of each observation point is measured in a direction perpendicular to the direction in which the observed mark 16' extends, and an observation point-brightness chart is created.

The computer 12' has a memory as a means of memory. In the memory, the computer readable record (so-called storage) has an image from the digital imaging means 11', an observation point-brightness chart production formula, a visibility evaluation formula, and a copper foil surface state evaluation formula. And in each stage Evaluation value, etc.

The display means 13' displays a specific image or numerical value such as an observation point-brightness chart, a visibility evaluation result, and a copper foil surface state evaluation result based on various signals from the computer 12'.

Next, a method of evaluating the surface state of the copper foil using the evaluation apparatus 10' having the surface state of the copper foil of the above-described embodiment will be described with reference to a flowchart shown in FIG. Further, the flow chart shown in FIG. 11 is an embodiment in which the surface condition of the copper foil of the evaluation apparatus 10' of the surface condition of the copper foil of the present invention is evaluated, and the evaluation apparatus for the surface state of the copper foil of the present invention can be utilized. The evaluation method realized by 10' is not limited to the one shown in the flowchart of FIG. In particular, in FIG. 11, the smoothing process is performed before the image obtained by photographing is made into an observation point-brightness chart, but the present invention is not limited thereto, and may be performed, for example, after the observation point-brightness chart is created.

In the evaluation method of the surface state of the copper foil using the evaluation device 10' having the surface condition of the copper foil, first, a transparent substrate 17' is prepared which is subjected to a surface such as roughening at least one surface. The surface-treated metal foil to be processed is produced by adhering the surface of the surface of the transparent substrate to at least one surface of the surface of the transparent substrate, and then removing the metal foil by etching. Next, the mark 16' existing under the transparent substrate 17 is photographed through the transparent substrate 17' by the photographing means 11'. The signal of the image captured by the photographing means 11' is transmitted to the computer 12'. The observation point of the computer 12'-brightness chart creation means measures the brightness of each observation point in the direction perpendicular to the direction in which the observed mark 16' extends, and creates an observation point for the image signal from the image pickup means 11'. Brightness chart. The copper foil surface state evaluation means of the computer 12' evaluates the visibility of the transparent substrate 17' by the slope of the brightness curve generated from the end of the mark 16' to the portion without the mark 16 in the observation point-brightness chart. Based on the evaluation result of the visibility, the posted The surface condition of the surface treated metal foil of the transparent substrate 17' was evaluated. In the past, if it was not actually produced in the production line, it was impossible to determine whether or not the mark which can be disposed through the transparent substrate as being aligned or the like was provided, and there was a problem in terms of manufacturing cost. However, according to the evaluation apparatus 10' for the surface condition of the copper foil of the present invention, the visibility of the transparent substrate 17' can be easily and efficiently evaluated in the laboratory only by using the above configuration. The surface state of the copper foil was evaluated efficiently and accurately. For example, the evaluation result of the visibility of the transparent substrate 17' can be directly evaluated as a good surface condition of the copper foil.

In the case where a polyimide substrate is used as the transparent substrate 17' to be evaluated in the present invention, the polyimide substrate may also have a thickness of 50 μm and a polyimine which is attached to the metal foil. The difference between the highest average value Bt and the lowest average value Bb of the brightness curve of the substrate from the end of the mark 16' to the portion without the mark 16' is ΔB(PI) [ΔB(PI)=Bt-Bb] is 20 Above and below 33. Further, in the case where a polyimide substrate is used as the transparent substrate 17' to be evaluated in the present invention, the polyimide substrate may have a thickness of 50 μm and a polycondensation before bonding to the metal foil. The difference between the highest average Bt and the lowest average Bb of the brightness curve of the imine substrate from the end of the mark 16' to the portion without the mark 16' is ΔB(PI) [ΔB(PI)=Bt-Bb] It is 50 or more and 65 or less.

The copper foil surface state evaluation means of the computer 12' can be evaluated for visibility by using the following three aspects: the surface of the surface-treated metal foil subjected to surface treatment such as roughening treatment is attached to the surface of the surface. After at least one surface of the imide substrate, the highest average value Bt of the brightness curve generated from the end of the label 16' to the portion without the mark 16' of the polyimide substrate obtained by etching the metal foil by etching The difference between the lowest average value Bb ΔB (ΔB=Bt-Bb); the ratio of ΔB/ΔB(PI); and the above-mentioned brightness in a specific depth range based on Bt The slope of the degree curve is expressed by the angle k1.

Further, the copper foil surface state evaluation means of the computer 12' can be judged to be good, that is, the highest average Bt and the lowest average value of the luminance curves generated from the end portion of the mark 16' to the portion without the mark 16'. The difference ΔB (ΔB=Bt-Bb) of Bb is 20 or more and 33 or less, the ratio of ΔB/ΔB (PI) is 0.7 or more, and the depth of 0.4 ΔB to 0.6 ΔB is based on Bt. The slope k1 of the luminance curve in the range is 65° or more, and the slope k1 of the luminance curve may be determined to be 87° or less, and the visibility may be evaluated as good. In the case, it was judged that the surface condition of the copper foil was good.

Moreover, the copper foil surface state evaluation means of the computer 12' may further use the slope k2 expressed by the angle of the brightness curve from the intersection of the brightness curve and Bt to the depth range of 0.1 ΔB based on Bt for evaluation. . Further, it is also possible to determine that k2 is 30 or more, and it is possible to determine that the surface of the copper foil is good in the case where the visibility is evaluated as good.

According to such an evaluation apparatus, the surface state of the copper foil can be evaluated efficiently and more accurately.

Preferably, the computer 12' further includes a smoothing processing means for reducing the unevenness of the brightness of the image obtained by the photographing means 11', and the observation point-brightness graph creating means is made by using the brightness after the smoothing processing. Observe the location - brightness chart. The smoothing processing by the smoothing processing means is performed on the data (original waveform) of the noise including the luminance obtained by the image obtained by the photographing by the photographing means 11', whereby the unevenness of the brightness is alleviated Therefore, the visibility of the transparent substrate 17' can be evaluated more accurately, whereby the surface state of the copper foil can be more accurately evaluated. The smoothing processing by the smoothing processing means can be performed by various smoothing programs, for example, smoothing processing using a 2nd and 3rd order polynomial fitting method, smoothing processing using Fourier transform, or moving average method Smoothing processing, etc. Furthermore, the smoothing process can also use the public Know the various smoothing programs. Moreover, the smoothing process of the brightness data may be performed on both the portion having the mark 16' and the portion having no mark 16', and may be performed on the portion having the mark 16', and may be performed on the portion having no mark 16'. Performed locally.

Further, regarding the image obtained by the photographing by the photographing means 11', the observation point-brightness of the data (original waveform) including the noise of the brightness may be performed before the smoothing of the brightness is performed. Chart production.

Here, the "highest average value Bt of the brightness curve", "the lowest average value Bb of the brightness curve", "the slope k1 of the brightness curve by the angle", and "the slope k2 of the brightness curve by the angle", The definitions of "△B" and "△B(PI)" are the same as those shown in the visibility evaluation device and the visibility evaluation method for the transparent substrate described above.

In the present invention, the printed matter to which the mark 16' is attached is placed below the polyimide substrate to which the metal foil such as the surface-treated copper foil is attached and removed, and the polyimide is passed through the polyimide according to the use of the CCD camera. The observation point obtained by capturing the image of the above-mentioned marked portion of the substrate - the slope of the brightness curve near the end of the mark 16' drawn in the brightness chart is represented by an angle; more specifically, the highest average value of the brightness curve Bt The difference between the lowest average value Bb ΔB (ΔB=Bt-Bb), the ratio of ΔB/ΔB(PI), and the brightness range of 0.4△B~0.6△B based on Bt The slope k1 is represented by an angle; thereby, the visibility of the transparent substrate can be accurately evaluated, whereby the surface state of the copper foil can be accurately evaluated. K1 is preferably 65 or more, and more preferably 87 or less. Further, the upper limit of k1 is preferably 87 or less, more preferably 85 or less, still more preferably 83 or less. If k1 exceeds 87°, the peel strength becomes small. The upper limit of ΔB/ΔB (PI) is not particularly limited, and is, for example, 1.70 or less, or 1.50 or less, or 1.40 or less. When the value of k1, ΔB/ΔB(PI) is within the above range, it is ensured that the layer is laminated on the copper foil. From the viewpoint of the visibility of the resin, it is also possible to judge that the surface state of the copper foil is good.

Further, it is possible to evaluate the case where the visibility is good, that is, in the observation point-brightness chart created by the observation point of the computer 12' and the brightness chart creation means based on the image obtained by the imaging means 11'. The slope k2 of the luminance curve in the depth range from the intersection of the luminance curve and Bt to the depth range of 0.1 ΔB from Bt is 30° or more, whereby the surface state of the copper foil can be evaluated to be good. According to this configuration, the boundary between the portion of the mark 16' and the mark-free portion 16' becomes clearer, the positioning accuracy is improved, and the error caused by the mark image recognition is reduced, and the positional alignment can be performed more accurately. More preferably, k2 is 35° or more, and more preferably 40° or more. The upper limit of k2 is not particularly limited, and is, for example, 87° or less, or 82° or less, or 77° or less, or 72° or less. When the value of k2 is within the above range, the surface state of the copper foil can be judged to be good from the viewpoint of ensuring the visibility of the resin laminated on the copper foil.

Further, in the present embodiment, the evaluation of the surface state of the copper foil has been described. However, the present invention is not limited thereto, and the surface state of the metal foil can be similarly evaluated in a similar manner. The metal foil is not particularly limited, and copper foil, aluminum foil, nickel foil, copper alloy foil, nickel alloy foil, aluminum alloy foil, stainless steel foil, iron foil, and iron alloy foil can be used.

Further, the processing procedure as described above is executed as a program for the computer, whereby the visibility of the transparent substrate can be evaluated efficiently and accurately.

Further, the program computer is readable and recorded on a recording medium such as a compact disc or a magnetic disc, and the other computer can also implement the program, and the same effects as those described above can be obtained.

(Method for evaluating visibility of transparent substrate)

The method for evaluating the visibility of the transparent substrate of the present invention is prepared by marking and setting on the mark. The substrate is photographed by a CCD camera through the transparent substrate, and the image obtained by photographing is measured for the brightness of each observation point in a direction crossing the observed mark and is made into an observation point-brightness chart A method of evaluating the visibility of a transparent substrate based on the slope of the brightness curve generated from the end of the mark to the unmarked portion in the observation point-brightness chart.

In the past, if it was not actually produced in the production line, it was impossible to determine whether or not the mark which can be disposed through the transparent substrate as being aligned or the like was provided, and there was a problem in terms of manufacturing cost. However, in the present invention, with such a configuration, the visibility of the transparent substrate can be easily and accurately evaluated only in the laboratory. Further, if the inclination of the luminance curve generated from the end portion of the mark to the unmarked portion in the observation point-luminance chart is expressed by an angle, and the visibility of the transparent substrate is evaluated by the angle, the efficiency can be more efficiently It is preferred to accurately evaluate the visibility of the transparent substrate.

The shape of the mark is not particularly limited, but if it is a linear mark, the image obtained by photographing is measured for the brightness of each observation point in the direction crossing the observed mark and is made into an operation position-brightness chart operation change. It's easy and better.

The flexible printed wiring board (FPC) performs processing such as bonding of a liquid crystal substrate or mounting of an IC chip, but the positional alignment at this time is resin insulation remaining after being etched through the copper foil which has passed through the copper clad laminate. The layer is visually recognized by the positioning pattern, so the visibility of the resin insulating layer becomes important. For the accurate visibility evaluation of the efficiency of the resin insulating layer, in the present invention, the transparent substrate may be self-roughened by surface-treating the metal foil which has been subjected to roughening treatment on at least one surface before being disposed on the mark. After the surface of the treatment surface is bonded to at least one surface of the transparent substrate, the metal foil is removed by etching. Further, the transparent substrate can also be produced by subjecting the surface-treated metal foil to the both sides of the transparent substrate from the roughened surface side. Etching, removing the metal foil on both sides.

The metal foil used in the present invention is not particularly limited, and copper foil, aluminum foil, nickel foil, copper alloy foil, nickel alloy foil, aluminum alloy foil, stainless steel foil, iron foil, and iron alloy foil can be used.

The transparent substrate to be evaluated in the present invention is not particularly limited, and may be a glass substrate or a resin substrate as long as it is transparent. Further, in the present invention, the term "transparent" also includes the case of having light transmittance. Here, as a transparent substrate, a polyimine substrate will be described.

In the case where a polyimide substrate is used as the transparent substrate to be evaluated in the present invention, it is preferred that the polyimide substrate has a thickness of 50 μm and is attached to the polyethylene foil before bonding to the metal foil. The difference between the highest average value Bt and the lowest average value Bb of the brightness curve of the amine substrate from the end of the mark to the portion without the mark is ΔB(PI)[ΔB(PI)=Bt-Bb] is 20 or more And 33 or less. Further, the surface-treated copper foil on which at least one surface is formed with roughened particles by roughening treatment is bonded to both sides of the polyimide substrate from the roughened surface side, and the copper foil on both sides is etched by etching. Remove. Next, regarding the linear mark and the above-mentioned polyimide substrate disposed on the mark, the mark is photographed through the polyimide substrate by a CCD camera, and the image obtained by photographing is observed along the line observed. The direction in which the direction of the mark extends is perpendicular to the direction of each observation point and is made into an observation point-brightness chart. In the observation point-brightness chart, the angle of the brightness curve generated from the end portion of the mark to the unmarked portion can be used. The slope of the representation is used to evaluate the visibility of the polyimine.

The method for evaluating the visibility of polyimine by the slope expressed by the angle of the above brightness curve may also use the highest average Bt and the lowest average Bb of the brightness curve generated from the end of the mark to the unmarked portion. The difference △ B (△ B = Bt - Bb), constructed by △ B / △ B (PI) The ratio and the slope of the brightness curve in a specific depth range based on Bt are expressed by the angle k1.

Moreover, the method of evaluating the visibility of the polyimide by the slope of the brightness curve can also determine that the situation is as good as the highest average of the brightness curves from the end of the mark to the unmarked portion. The difference ΔB (ΔB=Bt-Bb) between the value Bt and the lowest average value Bb is 20 or more and 33 or less, the ratio of ΔB/ΔB (PI) is 0.7 or more, and Bt is the reference 0.4 ΔB. The slope k1 of the above luminance curve in the depth range of ~0.6 ΔB becomes 65° or more. Further, it is also possible to determine that the slope k1 of the luminance curve is 87 or less.

Moreover, the brightness curve in the depth range from the intersection of the brightness curve and Bt to the Bt as the reference 0.1 ΔB in the observation point-luminance chart made based on the image obtained by photography may be further used. The slope k2 expressed by the angle is used for evaluation.

Further, it is also possible to determine that k2 is 30 or more.

According to this evaluation method, the visibility of the transparent substrate can be evaluated efficiently and more accurately.

Here, the "highest average value Bt of the brightness curve", "the lowest average value Bb of the brightness curve", "the slope k1 of the brightness curve by the angle", and "the slope k2 of the brightness curve by the angle", The definitions of "△B" and "△B(PI)" are the same as those shown in the visibility evaluation device and the visibility evaluation method for the transparent substrate described above.

It is preferable that the image obtained by the above-described photographing is further subjected to a smoothing process for alleviating the unevenness of the brightness, and the brightness of the smoothing process is used to form an observation point-luminance chart. The smoothing process is performed on the data (original waveform) of the noise including the brightness obtained from the image obtained by the photographing, whereby the unevenness of the brightness is alleviated, so that the visibility of the transparent substrate can be accurately evaluated. As the smoothing process, it can be performed by various smoothing programs, for example, using 2 The smoothing process of the third-order polynomial adaptation method, the smoothing process by the Fourier transform, or the smoothing process by the moving average method.

Further, the image obtained by photographing may be prepared by performing an observation point-brightness chart of data (original waveform) including the noise of the luminance before performing the smoothing of the luminance.

(Locating method of laminated body of metal and resin)

A method of positioning the laminate of the metal and the resin of the present invention will be described. First, a laminate of metal and resin is prepared. The laminate of the metal and the resin is not particularly limited as long as it is formed by bonding a metal to the resin. Specific examples of the laminate of the metal and the resin of the present invention include copper formed on at least one surface of a main substrate, an attached circuit substrate, and a resin for electrically connecting the same to a polyimine. In an electronic device in which a flexible printed circuit board having a metal wiring is formed, a flexible printed circuit board is press-contacted to a wiring end portion of the main circuit board and the attached circuit board to form a laminated body. In other words, in this case, the laminated body is a laminated body in which the wiring end portions of the flexible printed circuit board and the main substrate are bonded by pressure bonding, or the flexible printed circuit board and the circuit board are bonded by pressure bonding. The laminated body to which the wiring ends are attached. The laminate has indicia formed by portions of the metal wiring or other materials. The position of the mark is not particularly limited as long as it can be photographed by a CCD camera through the resin constituting the laminate.

In the laminate thus prepared, the mark is photographed by a resin passing through the laminated body by a CCD camera, and the image obtained by the photographing is measured for the brightness of each observation point in a direction crossing the observed mark. a viewing point-brightness graph, based on the slope of the brightness curve generated from the end of the mark to the portion without the mark The positioning of the laminate. Further, if the slope of the luminance curve is expressed by an angle, and the laminated body of the metal and the resin is positioned by the angle, the positioning of the laminated body can be performed more accurately. The angle indicating the slope of the luminance curve used here is the same as the visibility evaluation method of the transparent substrate described above, and the difference ΔB (PI) between the highest average value Bt of the luminance curve and the lowest average value Bb can be used. The ratio of ΔB/ΔB(PI), the slope k1 of the brightness curve in the specific depth range based on Bt, the intersection of the self-luminance curve and Bt, and the Bt as the reference 0.1△ The slope of the brightness curve in the depth range up to B is expressed by the angle k2. According to this positioning method, the boundary between the mark and the unmarked portion becomes clearer, the positioning accuracy is improved, and the error caused by the mark image recognition is reduced, and the positional alignment can be performed more accurately. For example, when the value of ΔB(PI) is a specific range, the device for detecting the position can make a determination that the mark exists at the position. Specifically, for example, when the resin constituting the laminate is a polyimide substrate having a thickness of 50 μm, the brightness of the portion from the end of the mark to the unmarked portion of the polyimide substrate before the metal foil is bonded. When the difference between the highest average value Bt of the curve and the lowest average value Bb ΔB(PI) [ΔB(PI)=Bt-Bb] is 20 or more and 33 or less, the device for detecting the position may have the mark present at the position. The judgment. As described above, in the case of the apparatus and method for determining whether or not the mark is present at the position, the apparatus and method are considered to be devices and methods for determining whether or not the mark has a mark. Moreover, if it is an apparatus and method for performing the stage of detecting the position of the mark, the apparatus and method are considered to be an apparatus and method for detecting the position of the mark of the laminated body.

It is preferable that the image obtained by the above-described photographing is further subjected to a smoothing process for alleviating the unevenness of the brightness, and the brightness of the smoothing process is used to form an observation point-luminance chart. The smoothing of the data (original waveform) including the luminance obtained by the image obtained by the photographing is performed, whereby the unevenness of the luminance is alleviated, so that the positioning of the laminated body can be accurately evaluated. The smoothing processing can be performed by various smoothing programs, and for example, smoothing processing using a 2nd and 3rd order polynomial fitting method, smoothing processing by Fourier transform, smoothing processing by a moving average method, or the like can be used.

Further, the image obtained by the photographing may be prepared by performing an observation point-luminance graph of the data (original waveform) including the noise of the luminance before performing the smoothing of the luminance.

When the positioning of the printed wiring board is performed by using the positioning method according to the embodiment of the present invention, the positioning of the printed wiring board can be performed more accurately. Therefore, when a printed wiring board is connected to another printed wiring board or a component is mounted on one printed wiring board, it is considered that the connection failure is reduced and the yield is improved. Furthermore, the operation of positioning the printed wiring board can also be applied to soldering or connection via an anisotropic conductive film (ACF) via an anisotropic conductive paste (ACP). Or when a printed wiring board is connected to another printed wiring board or a component is mounted on one printed wiring board by a known connection method such as connection of a conductive adhesive.

Further, in the method of locating the laminated body according to the embodiment of the present invention, the laminated body (including the laminated body of copper and resin or the printed wiring board) having the determined position may be moved to position the laminated body. As the position aligning means, for example, a conveyor such as a belt conveyor or a chain conveyor can be used, and a moving device or a moving means having an arm mechanism can be used, and a moving device that moves the laminated body by using a gas can be used. Or a moving means, a moving device or a moving means (including a roller or a bearing) for rotating an object such as a substantially cylindrical shape to move the laminated body; a moving device or a moving means using the hydraulic pressure as a power source; Mobile device or moving means for power source; mobile device or moving means with motor as power source; and linear motion with bracket Mobile devices or moving means such as guiding platform, bracket moving air guiding platform, stacked linear guiding platform and linear motor driving platform. Further, a known moving means can also be used.

Furthermore, the positioning method of the embodiment of the present invention can also be applied to a surface mounter or a chip mounter.

Moreover, the positioning method according to the embodiment of the present invention may be a printed wiring board having a transparent substrate plate and a circuit provided above the transparent substrate plate in the laminate of the metal and the transparent substrate. Moreover, in this case, the above-mentioned mark may be the above circuit.

The printed wiring board can also be manufactured by the following method: positioning of the printed wiring board according to the positioning method of the present invention, and mounting of the component on the positioned printed wiring board. Further, the printed wiring board can be manufactured by the following method, that is, the positioning of the printed wiring board is performed according to the positioning method of the printed wiring board of the present invention, and the positional alignment of the positioned printed wiring board is performed, and the position is aligned Install parts on the printed wiring board. Thereby, components such as electronic components can be mounted at the exact position of the printed wiring board.

Further, the printed wiring board can be manufactured by performing the positioning method of the printed wiring board according to the positioning method of the present invention and connecting the other printed wiring board to the positioned printed wiring board. Further, the printed wiring board can be manufactured by the following method, that is, the positioning of the printed wiring board is performed according to the positioning method of the printed wiring board of the present invention, and the positional alignment of the positioned printed wiring board is performed, and the other printing is performed. The wiring board is connected to the positionally aligned printed wiring board. Thereby, other printed wiring boards can be connected to the accurate position of the printed wiring board to be connected. Here, the "connection" may be an electrical connection (for example, soldering or the like), or may be a connection using a bonding material or the like instead of an electrical connection.

Furthermore, in the present invention, the "printed wiring board" also includes a printing package in which components are mounted. Wire board and printed circuit board.

Further, the laminated body of the metal and the transparent substrate which is positionally positioned in the present invention may be a printed wiring board having a transparent substrate plate and a circuit provided on the transparent substrate plate. Moreover, in this case, the above-mentioned mark may be the above circuit. Moreover, the circuit also includes wiring.

[Examples]

As Examples A1 to A23, Examples B1 to B13, Examples a1 to A23, and Examples b1 to b13, various copper foils were prepared, and plating treatment was performed on one surface under the conditions described in Table 1 as roughening treatment. .

After performing the above roughening plating treatment, the examples A1 to A13, the examples A15 to A20, the examples A22 to A23, the examples B2, the examples B4, the examples B7 to B10, the examples a1 to a13, and the examples a15 ~Example a20, Example a22~ Example a23, Example b2, Example b4 and Example b7~ Example b10 are subsequently subjected to a plating treatment for forming a heat-resistant layer and a rust-proof layer.

The formation conditions of the heat-resistant layer 1 are shown below.

Liquid composition: nickel 5~20g/L, cobalt 1~8g/L

pH: 2~3

Liquid temperature: 40~60°C

Current density: 5~20A/dm ²

Coulomb amount: 10~20As/dm ²

A heat-resistant layer 2 is formed on the copper foil to which the heat-resistant layer 1 is applied. In Example B3, Example B5, Example B6, Example b3, Example b5, and Example b6, the heat-resistant layer 2 was directly formed on the prepared copper foil without performing a rough plating treatment. The formation conditions of the heat-resistant layer 2 are shown below.

Liquid composition: nickel 2~30g/L, zinc 2~30g/L

pH: 3~4

Liquid temperature: 30~50°C

Current density: 1~2A/dm ²

Coulomb amount: 1~2As/dm ²

Further, a rustproof layer is formed on the copper foil to which the heat-resistant layers 1 and 2 are applied. The conditions for forming the rustproof layer are shown below.

Liquid composition: potassium dichromate 1~10g/L, zinc 0~5g/L

pH: 3~4

Liquid temperature: 50~60°C

Current density: 0~2A/dm ² (for impregnation of chromate)

Coulomb amount: 0~2As/dm ² (for impregnation of chromate treatment)

A weather resistant layer is further formed on the copper foil to which the heat-resistant layers 1 and 2 and the rust-preventing layer are applied. The formation conditions are shown below.

As a decane coupling agent having an amine group, by N-2-(aminoethyl)-3-aminopropyltrimethoxydecane (Example A17, Example a17), N-2-(Aminoethyl) 3-aminopropyltriethoxydecane (Examples A1 to A13, Example A15, Example A16, Example a1 to Example a13, Example a15, Example a16), N-2-(Aminoethyl)-3 -Aminopropylmethyldimethoxydecane (Example A18, Example a18), 3-aminopropyltrimethoxydecane (Example A19, Example a19), 3-aminopropyltriethoxydecane ( Example A20, Example a20), 3-triethoxyindolyl-N-(1,3-dimethyl-butylene)propylamine (Example A22, Example a22), N-phenyl-3-amino group Propyltrimethoxydecane (Example A23, Example a23) was coated and dried to form a weather-resistant layer. These decane coupling agents can also be used in combination of two or more kinds.

Further, the rolled copper foil was produced in the following manner. As shown in Manufacturing Table 2 or 6 After the copper ingot is composed of the ingot, and after the overheat rolling, the continuous annealing line of 300 to 800 ° C is repeated and cold rolled to obtain a rolled sheet of 1 to 2 mm thick. The rolled sheet was annealed in a continuous annealing line at 300 to 800 ° C and recrystallized, and finally cold rolled until the thickness of Table 2 or 6 was obtained to obtain a copper foil. The "fine copper" in the column of "Type" in Table 2 or 6 indicates the refined copper specified in JIS H3100 C1100, and the "oxygen-free copper" indicates the oxygen-free copper specified in JIS H3100 C1020. Further, "fine copper + Ag: 100 ppm" means that 100 ppm by mass of Ag is added to the refined copper.

As the electrolytic copper foil, an electrolytic copper foil HLP foil manufactured by JX Nippon Mining & Metal Co., Ltd. was used. In the case of electrolytic polishing or chemical polishing, the thickness of the plate after electrolytic polishing or chemical polishing is described.

In Table 2 or 6, "high gloss rolling" means final cold rolling (cold rolling after final recrystallization annealing) at the value of the oil film equivalent described. "Normal calendering" means final cold rolling (cold rolling after final recrystallization annealing) at the value of the oil film equivalent described. "Chemical polishing" and "electrolytic polishing" mean that the following conditions are used.

In the "chemical polishing", 1 to 3% by mass of H ₂ SO ₄ , 0.05 to 0.15% by mass of H ₂ O ₂ , and an etching liquid of the remaining portion of water were used, and the polishing time was set to 1 hour.

"Electrolytic polishing" is based on the conditions of phosphoric acid 67% + sulfuric acid 10% + water 23%, and the voltage is 10 V/cm ² and the time described in Table 2 or 6. (If the electrolytic polishing is performed for 10 seconds, the polishing amount becomes 1 ~2μm).

Each of the samples of the examples produced as described above was subjected to various evaluations as described below using the visibility evaluation device having the same configuration as that shown in Fig. 1 .

(1) the slope of the brightness curve

Bonding a copper foil to a polyimide film with a thermosetting adhesive for lamination (Examples A1 to A23) And Example B1 to Example B13: Both sides of the UPILEX thickness of 50 μm, such as a1 to a23 and b1 to b13: 50 μm of KANEKA, were used to remove the copper foil by etching (aqueous solution of ferric chloride). And make a sample film. Then, the print having the printed black mark is laid under the sample film, and the printed matter is photographed through the sample film by a CCD camera. The width of the mark used here is 0.1 to 0.4 mm. Next, using a computer to measure the brightness of each observation point in the direction perpendicular to the direction in which the observed linear mark extends perpendicularly by the computer, the observation point-brightness chart is determined from the end of the mark. The slope (angle) of the brightness curve produced by the part to the unmarked part. A schematic diagram showing a method of measuring the configuration of the imaging device used at this time and the slope of the luminance curve is shown in FIG. Further, ΔB and slopes k1 and k2 were measured as shown in Fig. 5 . Furthermore, one pixel on the horizontal axis corresponds to a length of 10 μm. Moreover, the ratio of the length of one pixel to the length of one gray scale in the graph of the luminance curve is set to 3.5:5 (the length of one pixel in the graph of the luminance curve: the length of one gray scale in the graph of the luminance curve = 3.5) The value of k1 and k2 (°) is calculated in the graph of the brightness curve of (mm): 5 (mm).

The photographing means includes: a CCD camera; a platform (white) on which a polyimine substrate having a marked paper placed thereon; a lighting power source that emits light to a photographing portion of the polyimide substrate; and transport The machine (not shown) transports the evaluation polyimide substrate on which the paper with the mark of the photographic subject is placed, to the stage. The main specifications of the photographing means are shown below: Photographic means: NIREKO sheet inspection device Mujiken

CCD camera: 8192 pixels (160MHz), 1024 grayscale digits (10 digits)

Lighting power supply: high frequency lighting power supply (power supply unit × 2)

Lighting: Fluorescent (30W)

Furthermore, regarding the brightness shown in FIG. 8, the 0 system means "black", the brightness 255 means "white", and the degree of gray from "black" to "white" (white and black, grayscale, grayscale) ) is divided into 256 grayscale representations.

Furthermore, since the width of the mark used is as small as 0.1 to 0.4 mm, the brightness curve produced is a V-shape as shown in Fig. 4(a) or has a bottom as shown in Fig. 4(b). V type.

(2) Visibility (resin transparency) and evaluation of the surface state of copper foil

The copper foil is bonded to a polyimide film having a thermosetting adhesive for lamination (Examples A1 to A23 and Examples B1 to B13: UPILEX thickness 50 μm, examples a1 to a23 and examples b1 to B13: Both sides of a thickness of 50 μm by KANEKA, the copper foil was removed by etching (aqueous solution of ferric chloride) to prepare a sample film. A printed matter (a black circle having a diameter of 6 cm) was adhered to one side of the obtained resin layer, and the visibility of the printed matter was judged from the opposite side through the resin layer.

The outline of the black circle of the printed matter is evaluated as "◎" in the case of a length of 90% or more of the circumference, and the outline of the black circle is evaluated in the length of 80% or more of the circumference and less than 90% of the circumference. When it is "○" (the above is acceptable), the outline of the black circle is evaluated as "X" (failed) for those who are less than 0% to 80% of the circumference. Moreover, the evaluation of the visibility can be directly evaluated as the surface state of the copper foil.

(3) Yield

The copper foil is bonded to a polyimide film having a thermosetting adhesive for lamination (Examples A1 to A23 and Examples B1 to B13: UPILEX thickness 50 μm, examples a1 to a23 and examples b1 to B13: Both sides of a thickness of 50 μm by KANEKA, the copper foil was etched (aqueous solution of ferric chloride) to prepare an FPC having a circuit width of L/S of 30 μm/30 μm. Thereafter, an attempt was made to detect a 20 μm × 20 μm square mark by a CCD camera through polyimine.

It is set to "◎" when 9 or more times can be detected in 10 times, "○" when 7 to 8 times can be detected, and "△" when 6 times can be detected. When it is detected 5 times or less, it is set to "X".

The conditions and evaluation of each test described above are shown in Tables 1 to 9.

(Evaluation results)

The polyimine substrates of the examples A1 to A23 and the examples B1 to B13, the examples a1 to a23, and the examples b1 to b13 are not actually produced on the production line, but can be easily and accurately performed at the laboratory level. The visibility is evaluated.

Further, instead of the above example, the same test as in the above embodiment was carried out using a larger mark having a width of 1.0 to 2.0 mm, and a graph having a bottom as shown in Fig. 3 was obtained as a luminance curve. Fig. 9 is a schematic view showing a configuration of a photographing means and a method of measuring the slope of a luminance curve in the case of evaluating the slope of the luminance curve in the case where the width of the mark is 1.0 to 2.0 mm. In this case as well, the same results as in the above embodiment can be obtained, and similarly to the above-described embodiment, the polyimide substrate can be easily and accurately evaluated at a laboratory level without being actually manufactured in a production line. Visibility. The surface state of the copper foil is evaluated by "◎", "○" (above the above), and "x" (unqualified) in the evaluation of the visibility in the direct application table, whereby the surface state of the copper foil may be Easily and accurately evaluate.

Further, instead of the above example, the same test as in the above embodiment was carried out using a large mark having a width of 1.0 to 2.0 mm, and a graph having a bottom as shown in Fig. 3 was obtained as a luminance curve. Fig. 7 is a schematic view showing a method of measuring the configuration of the photographing means and the method of measuring the slope of the luminance curve in the case of evaluating the slope of the luminance curve in the case where the width of the mark is 1.0 to 2.0 mm. In this case as well, the same results as in the above embodiment can be obtained, and as in the above-described embodiment, the visible visibility of the polyimide substrate can be easily and accurately evaluated at the laboratory level without actually being manufactured in the production line. Sex, and can be used to evaluate the surface state of the copper foil.

Claims (93)

A visibility evaluation device for a transparent substrate, comprising: a photographing means for photographing a mark existing under the transparent substrate through the transparent substrate; and an observation point-brightness chart creating means obtained by the photographing An image, the brightness of each observation point is measured in a direction intersecting the direction in which the above-mentioned mark is extended, and an observation point-brightness chart is produced; and a visibility evaluation means based on the above-mentioned observation point-luminance chart The visibility of the transparent substrate was evaluated by the slope of the brightness curve produced by the end of the mark to the portion without the mark. The visibility evaluation device for a transparent substrate according to claim 1, wherein the observation point-luminance chart producing means measures the brightness of each observation point in a direction perpendicular to a direction in which the observed mark extends. Make an observation point - brightness chart. The visibility evaluation device for a transparent substrate according to claim 1, wherein the visibility evaluation means is represented by an angle in the observation point-luminance chart from the end of the mark to the portion without the mark The slope of the brightness curve, and the visibility of the transparent substrate was evaluated by the above angle. A visibility evaluation device for a transparent substrate according to the first aspect of the invention, further comprising a smoothing processing means for alleviating unevenness of image brightness obtained by imaging by the imaging means, wherein the observation point-brightness chart is produced The method creates an observation point-brightness chart using the brightness after the smoothing process described above. The visibility evaluation device for a transparent substrate according to the first aspect of the invention, wherein the mark present under the transparent substrate is a linear mark printed on a printed matter laid under the transparent substrate, and the observation point is The brightness graph creating means measures the brightness of each observation point in a direction perpendicular to the direction in which the observed linear mark extends in the image obtained by the above-described photographing, and creates an observation point-luminance chart. The visibility evaluation device for a transparent substrate according to the first aspect of the invention, wherein the transparent substrate is such that at least one surface-treated surface-treated metal foil is adhered to the transparent substrate from the surface-treated surface side. After at least one surface, the metal foil is removed by etching. The visibility evaluation device for a transparent substrate according to claim 1, wherein the transparent substrate is a polyimide substrate. The visibility evaluation device for a transparent substrate according to claim 7, wherein the polyimide substrate has a thickness of 50 μm and is attached to the end of the label from the polyimide substrate before bonding to the metal foil. The difference ΔB(PI) [ΔB(PI)=Bt-Bb] between the highest average value Bt and the lowest average value Bb of the luminance curve generated by the portion to the portion without the above-described mark is 20 or more and 33 or less. The visibility evaluation device for a transparent substrate according to claim 7, wherein the polyimide substrate has a thickness of 50 μm and is attached to the end of the label from the polyimide substrate before bonding to the metal foil. The difference ΔB(PI) [ΔB(PI)=Bt-Bb] between the highest average value Bt and the lowest average value Bb of the luminance curve generated by the portion to the portion without the above-described mark is 50 or more and 65 or less. The visibility evaluation device for a transparent substrate according to the seventh aspect of the invention, wherein the evaluation of the visibility of the polyimine by the inclination of the brightness curve is performed using the following three methods. The above-mentioned three are referred to as the above-mentioned polyimine substrate obtained by removing the surface of the surface-treated metal foil from the surface of the surface of the transparent substrate and etching the metal foil by etching. The difference between the highest average value Bt and the lowest average value Bb of the luminance curve generated from the end portion of the mark to the portion without the mark; ΔB=Bt-Bb; by ΔB/ΔB(PI) The ratio of the composition; and the slope of the brightness curve in the specific depth range based on Bt. The visibility evaluation device for a transparent substrate according to claim 10, wherein the slope of the brightness curve in a specific depth range based on the Bt is expressed by an angle of 0.4 ΔB to 0.6. The slope k1 expressed by the angle of the above brightness curve in the depth range of ΔB. The visibility evaluation device for a transparent substrate according to the eleventh aspect of the invention, wherein the evaluation of the visibility of the polyimine by the inclination of the brightness curve is determined as follows: That is, the difference ΔB (ΔB=Bt-Bb) between the highest average value Bt and the lowest average value Bb of the luminance curve generated from the end portion of the above-mentioned mark to the portion without the above-mentioned mark is 20 or more and 33 or less, or 50 or more and 65 or less, the ratio of ΔB/ΔB (PI) is 0.7 or more, and the brightness curve in the depth range of 0.4 ΔB to 0.6 ΔB based on Bt Angle of view The slope k1 is expressed as 65° or more. The visibility evaluation device for a transparent substrate according to claim 12 of the patent application, which is determined to be more favorable, that is, the brightness curve in the depth range of 0.4 ΔB to 0.6 ΔB based on the above Bt The slope k1 expressed by the angle is 87 or less. The visibility evaluation device for a transparent substrate according to claim 11 further comprising an angle from the intersection of the brightness curve and Bt to the brightness curve within a depth range of 0.1 ΔB based on Bt. The slope k2 is used for evaluation. The visibility evaluation device for a transparent substrate according to claim 14 of the patent application is characterized in that the above k2 is 30 or more. A program for causing a computer to function as a visibility evaluation device for a transparent substrate according to any one of claims 1 to 15. A recording medium recording a program of claim 16 and being readable by a computer. A positioning device for a laminated body for positioning a laminated body of a metal and a resin, and comprising: a photographing means for performing the marking on the laminated body of the metal and the resin having the mark through the resin Photography; observation point-brightness chart creation means for measuring the brightness of each observation point in a direction intersecting the direction in which the observed mark extends in the above-mentioned photographing, and creating an observation point-brightness chart; and positioning The means determines the position of the laminated body by the slope of the brightness curve generated from the end of the mark to the portion without the mark in the observation point-luminance chart. The positioning device of the laminated body according to claim 18, wherein the observation point-brightness chart creating means measures the brightness of each observation point in a direction perpendicular to the direction in which the observed mark extends, and creates an observation place. - Brightness chart. The positioning device of the laminated body according to claim 19, further comprising positioning means for performing alignment of the laminated body in which the position is determined. The positioning device of the laminated body according to claim 18, wherein the laminated body of the metal and the resin is a printed wiring board having a resin plate and a circuit provided on the resin plate. A positioning device for a laminated body according to claim 21, wherein the above-mentioned mark is the above circuit. A program for causing a computer to function as a positioning device for a layered body of claim 18 of the patent application. A recording medium recording a program of claim 23 and being readable by a computer. A method of manufacturing a printed wiring board, comprising the steps of: positioning a printed wiring board using a positioning device of claim 21 or 22, and mounting the component on the printed wiring board positioned. A manufacturing method of a printed wiring board, comprising the steps of: positioning a printed wiring board using a positioning device of claim 21 or 22, and performing positioning of the positioned printed wiring board, and at a position Align the above printed wiring board mounting parts. A method of manufacturing a printed wiring board, comprising the steps of: positioning a printed wiring board using a positioning device of claim 21 or 22, and connecting another printed wiring board to the positioned printed wiring board. A method of manufacturing a printed wiring board, comprising the steps of: positioning a printed wiring board using a positioning device of claim 21 or 22, and performing positioning of the positioned printed wiring board, and placing another The printed wiring board is connected to the above-described printed wiring board which is aligned. An apparatus for evaluating a surface state of a metal foil, comprising: a photographing means for photographing a mark through the transparent substrate, the mark being formed by etching the metal foil on at least one side of the transparent substrate The foil is removed and exists under the transparent substrate after the metal foil is removed by etching; the observation point-brightness chart creating means intersects the image obtained by the photographing along the direction in which the observed mark extends. Directionally measuring the brightness of each observation point and creating an observation point-brightness chart; and a metal foil surface state evaluation means based on the brightness curve generated from the end of the mark to the portion without the mark in the observation point-luminance chart The visibility of the transparent substrate was evaluated by the slope, and the surface state of the metal foil was evaluated based on the evaluation results of the above visibility. The apparatus for evaluating the surface state of a metal foil according to claim 29, wherein the observation point-brightness chart producing means determines the image obtained by the photographing in a direction perpendicular to a direction in which the observed mark extends. The brightness of each observation location and the observation location-brightness chart. The apparatus for evaluating the surface state of a metal foil according to claim 29, wherein the metal foil is a copper foil. An apparatus for evaluating the surface state of a metal foil, comprising: a photographing means for photographing a mark through the transparent substrate, the mark being formed by etching the surface-treated metal foil after bonding the surface-treated surface side of the surface-treated metal foil to at least one side of the transparent substrate Removing and presenting under the transparent substrate after removing the surface-treated metal foil by etching; observing the location-brightness chart forming means, the image obtained by the above-mentioned photography is perpendicular to the direction in which the observed mark is extended The direction is measured for the brightness of each observation point and the observation point-brightness chart is produced; and the metal foil surface state evaluation means is based on the brightness generated from the end portion of the mark to the portion without the mark in the observation point-luminance chart The visibility of the transparent substrate was evaluated by the slope of the curve, and the surface state of the metal foil was evaluated based on the evaluation results of the above visibility. The apparatus for evaluating the surface state of a metal foil according to claim 32, wherein the metal foil surface state evaluation means is expressed by an angle in the observation point-luminance chart from the end of the mark to the portion without the mark The slope of the luminance curve was evaluated, and the visibility of the transparent substrate was evaluated by the above angle, and the surface state of the metal foil was evaluated based on the evaluation results of the visibility described above. The apparatus for evaluating the surface state of the metal foil according to the 32nd aspect of the patent application further includes a smoothing processing means for alleviating the unevenness of the brightness of the image obtained by the photographing by the photographing means, and the observation point-brightness chart is produced. The method uses the above-described brightness after the smoothing process to create an observation point-luminance chart. An apparatus for evaluating the surface state of a metal foil according to item 32 of the patent application, wherein The mark below the transparent substrate is a linear mark printed on a printed matter laid under the transparent substrate, and the observation point-brightness chart creating means is the image obtained by the above-mentioned photographing and the observed above The direction in which the linear marks extend is perpendicular to the direction of each observation point and the observation point-brightness chart is created. An apparatus for evaluating the surface state of a metal foil according to claim 32, wherein the transparent substrate is a polyimide substrate. The apparatus for evaluating the surface state of a metal foil according to claim 36, wherein the polyimide substrate has a thickness of 50 μm and is attached to the end of the label of the polyimide substrate before bonding to the metal foil. The difference ΔB(PI) [ΔB(PI)=Bt-Bb] between the highest average value Bt and the lowest average value Bb of the luminance curve generated by the portion having no such mark is 20 or more and 33 or less. The apparatus for evaluating the surface state of a metal foil according to claim 36, wherein the polyimide substrate has a thickness of 50 μm and is attached to the end of the label of the polyimide substrate before bonding to the metal foil. The difference ΔB(PI) [ΔB(PI)=Bt-Bb] between the highest average value Bt and the lowest average value Bb of the luminance curve generated by the portion having no such mark is 50 or more and 65 or less. An apparatus for evaluating the surface state of a metal foil according to claim 36, wherein the evaluation of the visibility of the polyimine by the inclination of the brightness curve is performed using the following three methods, The third method refers to: the above-mentioned surface-treated metal foil is obtained by adhering the surface of the surface of the transparent substrate to at least one surface of the transparent substrate, and then removing the metal foil by etching. The difference ΔB (ΔB=Bt-Bb) between the highest average Bt and the lowest average Bb of the brightness curve of the imine substrate from the end of the mark to the portion without the mark; by ΔB/ΔB ( The ratio of the PI; and the slope of the brightness curve in the specific depth range based on Bt. The apparatus for evaluating the surface state of a metal foil according to claim 39, wherein the slope of the brightness curve in a specific depth range based on Bt is expressed by an angle of 0.4 ΔB to 0.6 ΔB. The slope k1 of the above brightness curve in the depth range is represented by an angle. An apparatus for evaluating the surface state of a metal foil according to claim 40, wherein the evaluation of the visibility of the polyimine by the inclination of the brightness curve is determined as follows: That is, the difference ΔB (ΔB=Bt-Bb) between the highest average value Bt and the lowest average value Bb of the luminance curve generated from the end portion of the above-mentioned mark to the portion without the above-mentioned mark is 20 The above ratio is 33 or less, or 50 or more and 65 or less, and the ratio of ΔB/ΔB (PI) is 0.7 or more, and the brightness curve in the depth range of 0.4 ΔB to 0.6 ΔB is based on Bt. The slope k1 expressed by the angle is 65 or more. An apparatus for evaluating the surface state of a metal foil according to claim 41 of the patent application, which is determined to be more favorable, that is, the above-mentioned brightness curve in the depth range of 0.4 ΔB to 0.6 ΔB based on the above Bt The angle indicated by the angle k1 is 87 or less. An apparatus for evaluating the surface state of a metal foil according to claim 40, which further comprises the above-mentioned brightness in a depth range from the intersection of the brightness curve and Bt to 0.1 ΔB on the basis of Bt. The slope k2 expressed by the angle of the degree curve is used for evaluation. The apparatus for evaluating the surface state of the metal foil according to Item 43 of the patent application is determined to be more excellent in the case where the above k2 is 30 or more. An apparatus for evaluating the surface state of a metal foil according to claim 32, wherein the metal foil is a copper foil. A program for causing a computer to function as an evaluation device for the surface state of a metal foil according to any one of claims 32 to 45. A recording medium that records a program of claim 46 and is readable by a computer. A method for evaluating the surface state of a metal foil by photographing a mark through the transparent substrate, the mark being attached to the surface side of the surface-treated metal foil to be adhered to at least one side of the transparent substrate Etching removes the surface-treated metal foil and exists under the transparent substrate after the surface-treated metal foil is removed by etching, and the image obtained by the above-mentioned photographing is perpendicular to the direction in which the observed mark is extended. The direction is measured for the brightness of each observation point and an observation point-brightness chart is created, and the transparency is evaluated based on the slope of the brightness curve generated from the end of the mark to the portion without the mark in the above-mentioned observation place-brightness chart The visibility of the substrate was evaluated, and the surface state of the metal foil was evaluated based on the evaluation results of the above visibility. The method for evaluating the surface state of a metal foil according to claim 48, wherein the surface-treated metal foil is a surface-treated copper foil. The method for evaluating the surface state of a metal foil according to claim 48 of the patent application, wherein the image obtained by the above photographing is measured perpendicular to the direction in which the observed mark extends. The brightness of each observation point and the above observation point-brightness chart. The method for evaluating the surface state of the metal foil according to the 48th article of the patent application, which is an angle indicating the slope of the brightness curve generated from the end portion of the mark to the portion without the mark in the observation point-luminance chart, and borrowing The visibility of the transparent substrate was evaluated from the above viewpoint, and the surface state of the metal was evaluated based on the evaluation results of the visibility described above. An evaluation method for preparing a mark and a transparent substrate disposed on the mark, and photographing the mark by using a CCD camera through the transparent substrate, and observing the image obtained by the photographing along the cross The direction of the above-mentioned mark is used to measure the brightness of each observation point and to make an observation point-brightness chart, and based on the slope of the brightness curve generated from the end of the mark to the portion without the mark in the above-mentioned observation place-brightness chart. The visibility of the above transparent substrate was evaluated. The evaluation method of claim 52, which is an angle indicating the slope of the brightness curve generated from the end of the mark to the portion without the mark in the observation point-luminance chart, and is evaluated by the above angle The visibility of the above transparent substrate. According to the evaluation method of the 52nd item of the patent application, the image obtained by the above-mentioned photographing is smoothed by the smoothing process, and the brightness is used to make the observation point using the smoothing process. Brightness chart. The evaluation method of claim 52, wherein the mark is a line mark, and the observation point-brightness chart is perpendicular to a direction in which the observed line mark extends in the image obtained by the photographing. The direction is determined by measuring the brightness of each observation point. The evaluation method of claim 52, wherein the transparent substrate is disposed at Before the marking, at least one surface-treated metal foil having a roughened surface is bonded to at least one surface of the transparent substrate from the roughened surface side, and then the metal foil is removed by etching. The evaluation method of claim 56, wherein the transparent substrate is attached to the transparent surface of the roughened surface before the surface is disposed on the mark, and the surface of the roughened surface is bonded to the transparent surface. After the two sides of the substrate are formed, the metal foils on both surfaces are removed by etching. The evaluation method of claim 56, wherein the roughening treatment is a treatment of forming roughened particles on the surface of the metal foil. The evaluation method of claim 55, wherein the metal foil is a copper foil. The evaluation method of claim 52, wherein the transparent substrate is a polyimide substrate. The evaluation method of claim 60, wherein the polyimide substrate has a thickness of 50 μm and is attached to the end of the polyimine substrate before bonding to the metal foil from the end of the mark to the absence of the mark The difference ΔB(PI) [ΔB(PI)=Bt-Bb] between the highest average value Bt and the lowest average value Bb of the partially generated luminance curve is 20 or more and 33 or less. The evaluation method of claim 61, wherein the method for evaluating the visibility of the polyimine is carried out by using the following three methods: the surface of the surface-treated metal foil is self-roughened. The highest brightness curve of the polyimine substrate from the end of the mark to the portion without the mark is obtained by affixing at least one surface of the transparent substrate and then removing the metal foil by etching. The difference between the average value Bt and the lowest average value Bb ΔB (ΔB=Bt-Bb); The ratio of ΔB/ΔB(PI); and the slope of the brightness curve in the specific depth range based on Bt. The evaluation method of claim 62, wherein the slope of the brightness curve in the specific depth range based on the Bt is a depth range of 0.4 ΔB~0.6 ΔB based on Bt. The slope of the above brightness curve is represented by the angle k1. The evaluation method of claim 63, wherein the method for evaluating the visibility of the polyimine is determined to be good as follows: brightness from the end of the mark to the portion without the mark The difference ΔB (ΔB=Bt-Bb) between the highest average value Bt of the curve and the lowest average value Bb is 20 or more and 33 or less, and the ratio of ΔB/ΔB (PI) is 0.7 or more, and Bt is The slope k1 of the brightness curve in the depth range of the reference 0.4 ΔB to 0.6 ΔB is 65° or more. As for the evaluation method of the 64th patent application, it is judged that the above k1 is 87 or less. For example, in the evaluation method of claim 61, the observation point-brightness chart prepared based on the image obtained by the above-mentioned photographing is from the intersection of the brightness curve and Bt to the Bt-based 0.1ΔB. The slope k2 expressed by the angle of the above luminance curve in the depth range is used for evaluation. As for the evaluation method of the 66th patent application, it is judged that the above k2 is 30 or more. A positioning method for performing positioning of a layered body of metal and resin, and The laminated body of the metal and the resin has a mark, and the mark is photographed by the CCD camera through the resin, and the image obtained by the photographing is measured for the brightness of each observation point in a direction crossing the observed mark. The observation point-brightness graph is used to position the laminated body of metal and resin based on the slope of the luminance curve generated from the end portion of the mark to the portion without the mark in the observation point-luminance chart. The positioning method of claim 68, wherein the angle of the brightness curve generated from the end of the mark to the portion without the mark is expressed by an angle in the observation point-luminance chart, and the angle is specified. When the value is more than or equal to the above, the positioning of the laminated body of the metal and the resin is performed based on the position at which the above angle is measured. A method of manufacturing a printed wiring board, comprising the steps of: positioning a printed wiring board using a positioning method of claim 68 or 69, and mounting the component on the printed wiring board positioned. A method of manufacturing a printed wiring board, comprising the steps of: positioning a printed wiring board using a positioning method of claim 68 or 69, and performing positioning of the positioned printed wiring board, and at a position Align the above printed wiring board mounting parts. A method of manufacturing a printed wiring board, comprising the steps of: positioning a printed wiring board using a positioning method of claim 68 or 69, and connecting another printed wiring board to the positioned printed wiring board. A method of manufacturing a printed wiring board, comprising the steps of: positioning a printed wiring board using a positioning method of claim 68 or 69, and performing positioning of the positioned printed wiring board, and placing another The printed wiring board is connected to the above aligned Printed wiring board. A method for determining whether or not a mark is present, which is a method for determining whether or not there is a mark of a laminate of a metal and a transparent substrate, and is for a laminate having the above-mentioned metal and a transparent substrate having a mark, passing through the transparent base The material is photographed, and the image obtained by the photographing is measured in the direction intersecting the direction in which the mark is extended, and the brightness of each observation point is measured to form an observation point-brightness chart based on the observation point at the above-mentioned observation point- In the luminance graph, the slope of the luminance curve generated from the end portion of the mark to the portion without the mark is used to determine whether or not the mark of the layered body exists. A method for determining whether or not a mark is present in claim 74 of the patent application, wherein the image obtained by the photographing is measured for the brightness of each observation point in a direction perpendicular to the direction in which the observed mark extends, and the observation point is made. - Brightness chart. a method for determining whether or not there is a mark in the 74th item of the patent application, which is an angle indicating a slope of a brightness curve generated from an end portion of the mark to a portion without the mark in the observation point-luminance chart, and When the angle is equal to or greater than a specific value, it is determined whether or not the mark included in the laminated body exists based on the position at which the angle is measured. A method for determining whether or not a mark is present in the 74th item of the patent application, wherein the mark is the transparent substrate plate and a circuit provided on the transparent substrate plate. A device for determining whether or not there is a mark on a laminate of a metal and a transparent substrate, which is a device for determining whether or not a layer of a metal and a transparent substrate has a mark, and which has: a photographing means for photographing the mark on the laminated body of the metal and the transparent substrate having the mark; and observing the position-brightness chart creating means for the image obtained by the photographing, Observing the brightness of each observation point in the direction in which the directions in which the marks extend intersect, and making an observation point-brightness chart; and positioning means in the above-mentioned observation point-brightness chart, based on the end from the above mark to none The slope of the brightness curve generated by the portion of the mark determines the position of the laminate. A device for determining whether or not there is a mark of a laminate of a metal and a transparent substrate, as in the case of claim 78, wherein the observation point-brightness chart creation means is an image obtained by the above-mentioned photography and observed The direction in which the above-mentioned mark extends is perpendicular to the direction of each observation point and the observation point-brightness chart is made. A device for determining whether or not there is a mark of a laminate of a metal and a transparent substrate, as described in claim 78, wherein the positioning means is represented by an angle in the observation point-luminance chart from the end of the mark to When there is no slope of the luminance curve generated by the portion of the mark, and when the angle is equal to or greater than a specific value, it is determined whether or not the mark of the layered body exists based on the position at which the angle is measured. The apparatus for determining whether or not there is a mark of a laminate of a metal and a transparent substrate, as defined in claim 78, wherein the mark is the transparent substrate plate and a circuit provided on the transparent substrate plate. A program for causing a computer to function as a determining device of any one of claims 78 to 81. A recording medium that records a program of claim 82 and is readable by a computer. A method for detecting the position of a mark, which is a method for detecting a position of a mark of a layered body of a metal and a transparent substrate, and is for a laminate having the mark of the metal and the transparent substrate, The transparent substrate is used to photograph the mark, and the image obtained by the photographing is measured in the direction intersecting the direction in which the observed mark extends, and the brightness of each observation point is measured to prepare an observation point-brightness chart based on the above observation. The position of the laminate is determined by the slope of the brightness curve generated from the end of the mark to the portion without the mark in the brightness map. A method of detecting the position of a mark according to item 84 of the patent application, wherein the image obtained by the photographing is measured in a direction perpendicular to a direction in which the observed mark extends, and the brightness of each observation point is measured and made into an observation point. - Brightness chart. A method for detecting the position of a mark in the 84th item of the patent application, wherein the slope of the brightness curve generated from the end of the mark to the portion without the mark in the observation point-luminance chart is expressed by an angle, and When the angle is equal to or greater than a specific value, the position of the mark is detected based on the position at which the angle is measured. A method of applying the position of the detection mark of claim 84, wherein the mark is the transparent substrate plate and a circuit provided on the transparent substrate plate. A device for detecting a position of a mark of a laminate of a metal and a transparent substrate, which is a device for detecting a position of a mark of a laminate of a metal and a transparent substrate, and comprising: a photographing means for photographing the mark on the laminated body of the metal and the transparent substrate having the mark; and observing the position-brightness chart creating means for the image obtained by the photographing Observing the brightness of each observation point in the direction in which the directions in which the marks extend intersect, and making an observation point-brightness chart; and positioning means based on the end of the mark from the observation point-brightness chart to the absence of the above mark The slope of the brightness curve generated by the portion determines the position of the above laminated body. The apparatus for detecting the position of a mark on a laminated body of a metal and a transparent substrate according to the application of claim 88, wherein the observation point-brightness chart producing means is an image obtained by the above-mentioned photography. The brightness of each observation point was measured in the direction perpendicular to the direction in which the above-mentioned marks were extended, and an observation point-brightness chart was prepared. A device for detecting the position of a mark on a laminated body of a metal and a transparent substrate as disclosed in claim 88, which is angularly represented in the above-mentioned observation point-brightness chart from the end of the mark to the absence of the above mark The slope of the brightness curve generated by the portion is detected, and when the angle is equal to or greater than a specific value, the position of the mark is detected based on the position at which the angle is measured. A device for detecting a position of a mark of a laminate of a metal and a transparent substrate, as described in claim 88, wherein the mark is the transparent substrate plate and a circuit disposed on the transparent substrate plate . A program for causing a computer to function as a detecting device of any one of claims 88 to 91. A recording medium recording a program of claim 92 and being readable by a computer.