JP2008141426A - Electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily adjust the inductive coupling strength between resonators in an electronic component provided with a plurality of resonators. <P>SOLUTION: The electronic component 1 is provided with a multilayer substrate 20 and a first or a third resonator set in the multilayer substrate 20. The first resonator has conductive layers 111 to 113 for the resonator, a second resonator has conductive layers 121 to 123 for the resonator, and the third resonator has conductive layers 131 to 133 for the resonator. The conductive layers 111 to 113 and the conductive layers 121 to 123 are coupled inductively, and the conductive layers 131 to 133 and the conductive layers 121 to 123 are coupled inductively, too. Lengths of the conductive layers 121 to 123 are shorter than the lengths of the conductive layers 111 to 113 and the lengths of the conductive layers 131 to 133. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component having a plurality of resonators.

  Bluetooth communication devices and wireless LAN (local area network) communication devices are strongly demanded to be smaller and thinner, and therefore, electronic components used therefor are required to be smaller and thinner. One of the electronic components in the communication apparatus is a band-pass filter that filters a received signal. This band pass filter is also required to be small and thin. Therefore, as a band-pass filter that can correspond to the frequency band used in the communication device and can be reduced in size and thickness, for example, as shown in Patent Documents 1 to 3, it is configured using a conductor layer in a multilayer substrate. A multilayer filter including a plurality of resonators has been proposed. Hereinafter, the conductor layer constituting the resonator is referred to as a resonator conductor layer.

  The filter described in Patent Document 1 includes three resonator electrodes arranged side by side on the same dielectric layer. In this filter, adjacent resonator electrodes are electromagnetically coupled.

  The filter described in Patent Document 2 includes three inductor electrodes that constitute a resonator. In this filter, the three inductor electrodes are arranged side by side on the same dielectric layer and connected to each other.

  The filter described in Patent Document 3 includes first to third striplines that constitute resonators. In this filter, the arrangement position of the second strip line is different from the arrangement positions of the first and third strip lines in the stacking direction of the dielectric layers. In this filter, the first strip line and the second strip line are electromagnetically coupled, and the second strip line and the third strip line are electromagnetically coupled.

JP 2005-159512 A JP 2002-217668 A JP-A-9-307389

  In general, in a band-pass filter including a plurality of resonators, when the number of resonators is increased, the passband width is widened and the attenuation pole is steep.

  By the way, in the conventional multilayer bandpass filter provided with a plurality of resonators, the distance between adjacent resonators must be shortened when the size and thickness of the filter are reduced. Then, the inductive coupling between adjacent resonators becomes too strong, and there arises a problem that it becomes difficult to realize a desired bandpass filter characteristic. Specifically, if the inductive coupling between adjacent resonators becomes too strong, the slope in the portion near the attenuation pole in the curve indicating the pass / attenuation characteristics of the bandpass filter becomes small. Then, it becomes difficult to clearly distinguish between the pass / attenuation characteristics in the pass band and the pass / attenuation characteristics outside the pass band.

  In Patent Document 3, the arrangement position of adjacent strip lines is made different with respect to the stacking direction of the dielectric layers, thereby increasing the interval between adjacent strip lines and suppressing electromagnetic interference between adjacent strip lines. The technology is described. However, if the bandpass filter is reduced in size and thickness, it is difficult to sufficiently increase the distance between adjacent resonators even if the technique described in Patent Document 3 is used.

  Patent Document 3 describes that electromagnetic coupling between adjacent strip lines can be adjusted by changing the thickness of a dielectric between adjacent strip lines. However, as the bandpass filter is reduced in size and thickness, it becomes difficult to greatly change the distance between adjacent resonators even if the technique described in Patent Document 3 is used. The characteristic cannot be adjusted greatly.

  The present invention has been made in view of such problems, and an object of the present invention is to provide an electronic component including a plurality of resonators that can easily adjust the size of inductive coupling between the resonators. It is to provide.

  The electronic component of the present invention includes a laminated substrate including a plurality of laminated dielectric layers, and a plurality of resonators provided in the laminated substrate. In the electronic component of the present invention, the plurality of resonators include first and second resonators. The first resonator has a first resonator conductor layer provided in the multilayer substrate. The second resonator has a second resonator conductor layer provided in the multilayer substrate. The first resonator conductor layer and the second resonator conductor layer are inductively coupled and have different lengths in the traveling direction of the electromagnetic wave.

  In the electronic component of the present invention, the lengths of the electromagnetic wave traveling directions in the first and second resonator conductor layers that are inductively coupled are different from each other. Therefore, in the present invention, the magnitude of inductive coupling between the first resonator and the second resonator can be adjusted by the difference in length between the first and second resonator conductor layers.

  In the electronic component of the present invention, the first resonator further includes a first capacitor provided between one end of the first resonator conductor layer and the ground, and the second resonator includes: In addition, a second capacitor is provided between one end of the second resonator conductor layer and the ground, and each other end of the first and second resonator conductor layers is connected to the ground. May be. In this case, the length of the second resonator conductor layer in the traveling direction of the electromagnetic wave is smaller than the length of the first resonator conductor layer in the traveling direction of the electromagnetic wave, and the capacitance of the second capacitor is It may be larger than the capacitance of the capacitor.

  In the electronic component of the present invention, the plurality of resonators may further include a third resonator. In this case, the third resonator has a third resonator conductor layer provided in the multilayer substrate. The second resonator conductor layer is disposed between the first resonator conductor layer and the third resonator conductor layer. The third resonator conductor layer and the second resonator conductor layer are inductively coupled. The length of the third resonator conductor layer in the traveling direction of the electromagnetic wave is equal to the length of the first resonator conductor layer in the traveling direction of the electromagnetic wave. The length of the second resonator conductor layer in the traveling direction of the electromagnetic wave is the length of the first resonator conductor layer in the traveling direction of the electromagnetic wave and the length of the third resonator conductor layer in the traveling direction of the electromagnetic wave. Is different.

  The length of the second resonator conductor layer in the traveling direction of the electromagnetic wave is the length of the first resonator conductor layer in the traveling direction of the electromagnetic wave and the length of the third resonator conductor layer in the traveling direction of the electromagnetic wave. It may be smaller than this.

  The first resonator conductor layer and the third resonator conductor layer pass through the second resonator conductor layer and are centered on an imaginary straight line parallel to the traveling direction of the electromagnetic wave of the second resonator conductor layer. You may have a symmetrical shape.

  The first resonator further includes a first capacitor provided between one end of the first resonator conductor layer and the ground, and the second resonator further includes a second capacitor A second capacitor is provided between one end of the resonator conductor layer and the ground, and the third resonator is further provided between one end of the third resonator conductor layer and the ground. And the other end of each of the first to third resonator conductor layers may be connected to the ground. In this case, the length of the second resonator conductor layer in the traveling direction of the electromagnetic wave is equal to the length of the first resonator conductor layer in the traveling direction of the electromagnetic wave and the traveling direction of the electromagnetic wave in the third resonator conductor layer. The capacitance of the second capacitor may be greater than the capacitance of the first capacitor and the capacitance of the third capacitor.

  In the electronic component of the present invention, the length of the second resonator conductor layer in the traveling direction of the electromagnetic wave is 25% or more and less than 100% of the length of the first resonator conductor layer in the traveling direction of the electromagnetic wave. It may be. Alternatively, the length of the second resonator conductor layer in the traveling direction of the electromagnetic wave may be 25% or more and 75% or less of the length of the first resonator conductor layer in the traveling direction of the electromagnetic wave.

  In the electronic component of the present invention, each of the plurality of resonators may be a quarter wavelength resonator in which one end is opened and the other end is short-circuited.

  In addition, the electronic component of the present invention further includes an input terminal and an output terminal arranged on the outer peripheral portion of the multilayer substrate, and the plurality of resonators are provided between the input terminal and the output terminal on the circuit configuration, A band-pass filter function may be realized.

  In the electronic component of the present invention, the lengths of the electromagnetic wave traveling directions in the first and second resonator conductor layers that are inductively coupled are different from each other. Therefore, in the present invention, the magnitude of inductive coupling between the first resonator and the second resonator can be adjusted by the difference in length between the first and second resonator conductor layers. Therefore, according to the present invention, there is an effect that the size of the inductive coupling between the resonators can be easily adjusted.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. First, a circuit configuration of an electronic component according to an embodiment of the present invention will be described with reference to FIG. The electronic component 1 according to the present embodiment has a function of a band pass filter. As shown in FIG. 4, the electronic component 1 includes an input terminal 2, an output terminal 3, three resonators 4, 5 and 6, and capacitors 17 to 19.

  The resonator 4 includes an inductor 11 and a capacitor 14. The resonator 5 includes an inductor 12 and a capacitor 15. The resonator 6 includes an inductor 13 and a capacitor 16. The resonator 5 is disposed between the resonator 4 and the resonator 6. Further, the inductor 12 is disposed between the inductor 11 and the inductor 13. Inductors 11 and 12 are adjacent and inductively coupled. Inductors 12 and 13 are also adjacent and inductively coupled. In FIG. 4, the inductive coupling between the inductors 11 and 12 and the inductive coupling between the inductors 12 and 13 are represented by curves with a symbol M, respectively.

  One end of the inductor 11 and one end of each of the capacitors 14, 17, and 19 are connected to the input terminal 2. The other end of the inductor 11 and the other end of the capacitor 14 are connected to the ground. One end of the inductor 12 and one end of each of the capacitors 15 and 18 are connected to the other end of the capacitor 17. The other end of the inductor 12 and the other end of the capacitor 15 are connected to the ground. One end of the inductor 13, one end of the capacitor 16, the other end of the capacitor 19 and the output terminal 3 are connected to the other end of the capacitor 18. The other end of the inductor 13 and the other end of the capacitor 16 are connected to the ground.

  The resonators 4, 5, and 6 are provided between the input terminal 2 and the output terminal 3 in terms of circuit configuration, and realize the function of a bandpass filter. Each of the resonators 4, 5, and 6 is a quarter wavelength resonator in which one end is opened and the other end is short-circuited. Adjacent resonators 4 and 5 are inductively coupled, and adjacent resonators 6 and 5 are also inductively coupled. The resonators 4, 5, and 6 correspond to the first resonator, the second resonator, and the third resonator in the present invention, respectively. The capacitors 14, 15, and 16 correspond to the first capacitor, the second capacitor, and the third capacitor, respectively, in the present invention.

  In the electronic component 1 according to the present embodiment, when a signal is input to the input terminal 2, a signal having a frequency within a predetermined frequency band is selectively configured using the resonators 4, 5, and 6. The signal passes through the bandpass filter and is output from the output terminal 3.

  Next, an outline of the structure of the electronic component 1 will be described with reference to FIGS. 1 and 2. FIG. 1 is a perspective view showing the main part of the electronic component 1. FIG. 2 is a perspective view showing an external appearance of the electronic component 1.

  The electronic component 1 includes a laminated substrate 20 for integrating the components of the electronic component 1. As will be described in detail later, the laminated substrate 20 includes a plurality of laminated dielectric layers and a plurality of conductor layers. Each of the inductors 11 to 13 is configured using one or more conductor layers in the multilayer substrate 20. The capacitors 14 to 19 are configured using a conductor layer and a dielectric layer in the multilayer substrate 20.

  As shown in FIG. 2, the laminated substrate 20 has a rectangular parallelepiped shape having an upper surface, a bottom surface, and four side surfaces as an outer peripheral portion. An input terminal 22 and two ground terminals 24 and 25 arranged on both sides thereof are provided on one side surface of the multilayer substrate 20. In the laminated substrate 20, an output terminal 23 and two ground terminals 26 and 27 disposed on both sides thereof are provided on the side surface opposite to the side surface on which the input terminal 22 is provided. The input terminal 22 corresponds to the input terminal 2 in FIG. 4, and the output terminal 23 corresponds to the output terminal 3 in FIG. The ground terminals 24, 25, 26, and 27 are connected to the ground.

  Next, with reference to FIGS. 5 to 7, the dielectric layer and the conductor layer in the multilayer substrate 20 will be described in detail. 5A to 5C respectively show the top surfaces of the first to third dielectric layers from the top. 6A to 6C respectively show the top surfaces of the fourth to sixth dielectric layers from the top. 7A to 7C show the top surfaces of the seventh to ninth dielectric layers from the top, respectively.

  No conductor layer is formed on the top surface of the first dielectric layer 31 shown in FIG. A ground conductor layer 321 connected to the ground is formed on the upper surface of the second dielectric layer 32 shown in FIG. 5B. The conductor layer 321 is connected to the ground terminals 24-27. In addition, a through hole 322 connected to the conductor layer 321 is formed in the dielectric layer 32.

  Resonator conductor layers 111, 121, and 131 are formed on the top surface of the third dielectric layer 33 shown in FIG. The conductor layers 111, 121, and 131 all have a shape that is long in one direction. The conductor layers 111, 121, and 131 are arranged side by side so that their longitudinal directions are parallel to each other and the conductor layer 121 is disposed between the conductor layer 111 and the conductor layer 131. The lengths of the conductor layers 111 and 131 in the longitudinal direction are equal, and the length of the conductor layer 121 in the longitudinal direction is smaller than the length of the conductor layers 111 and 131 in the longitudinal direction. The conductor layers 111 and 121 are adjacent and inductively coupled. The conductor layers 121 and 131 are also adjacent and inductively coupled. One end of the conductor layer 111 in the longitudinal direction is connected to the ground terminal 25. One end of the conductor layer 131 in the longitudinal direction is connected to the ground terminal 27.

  The dielectric layer 33 has through holes 331 connected to the other end of the conductor layer 111, through holes 332 and 333 connected to both ends of the conductor layer 121 in the longitudinal direction, and others in the conductor layer 131. A through hole 334 connected to the end is formed. The through hole 332 is connected to the through hole 322.

  Resonator conductor layers 112, 122, and 132 are formed on the top surface of the fourth dielectric layer 34 shown in FIG. The shape, arrangement, and mutual relationship of the conductor layers 112, 122, and 132 are the same as those of the conductor layers 111, 121, and 131. One end of the conductor layer 112 in the longitudinal direction is connected to the ground terminal 25. One end of the conductor layer 132 in the longitudinal direction is connected to the ground terminal 27.

  The dielectric layer 34 has through holes 341 connected to the other end of the conductor layer 112, through holes 342 and 343 connected to both ends in the longitudinal direction of the conductor layer 122, and others in the conductor layer 132. A through hole 344 connected to the end is formed. The through holes 341, 342, 343, and 344 are connected to the through holes 331, 332, 333, and 334, respectively.

  Resonator conductor layers 113, 123, and 133 are formed on the top surface of the fifth dielectric layer 35 shown in FIG. 6B. The shape, arrangement, and mutual relationship of the conductor layers 113, 123, and 133 are the same as those of the conductor layers 111, 121, and 131. One end of the conductor layer 113 in the longitudinal direction is connected to the ground terminal 25. One end of the conductor layer 133 in the longitudinal direction is connected to the ground terminal 27.

  The dielectric layer 35 includes a through hole 351 connected to the other end of the conductor layer 113, a through hole 353 connected to one end of the conductor layer 123 in the longitudinal direction, and the other end of the conductor layer 133. And through-holes 354 connected to each other. The through holes 351, 353, and 354 are connected to the through holes 341, 343, and 344, respectively. Further, the through hole 342 is connected to the other end of the conductor layer 123 in the longitudinal direction.

  The conductor layers 111, 112, and 113 are connected to each other through the through holes 331 and 341 and the ground terminal 25. The conductor layers 111, 112, and 113 constitute the inductor 11 in FIG. The conductor layers 111, 112, and 113 correspond to the first resonator conductor layer in the present invention.

  The conductor layers 121, 122, 123 are connected to each other through through holes 332, 333, 342, 343. The conductor layers 121, 122, 123 constitute the inductor 12 in FIG. The conductor layers 121, 122, and 123 correspond to the second resonator conductor layer in the present invention.

  The conductor layers 131, 132, and 133 are connected to each other through the through holes 334 and 344 and the ground terminal 27. The conductor layers 131, 132, 133 constitute the inductor 13 in FIG. The conductor layers 131, 132, and 133 correspond to the third resonator conductor layer in the present invention.

  Capacitor conductor layers 361 and 362 are formed on the top surface of the sixth dielectric layer 36 shown in FIG. 6C. The dielectric layer 36 includes a through hole 363 connected to the conductor layer 361 and the through hole 351, a through hole 364 connected to the conductor layer 362 and the through hole 354, and a through hole connected to the through hole 353. 365 is formed.

  Capacitor conductor layers 371 and 372 are formed on the top surface of the seventh dielectric layer 37 shown in FIG. The dielectric layer 37 has a through hole 373 connected to the through hole 363, a through hole 374 connected to the through hole 364, and a through hole 375 connected to the through hole 365.

  Capacitor conductor layers 381, 382, and 383 are formed on the top surface of the eighth dielectric layer 38 shown in FIG. 7B. The conductor layer 381 is connected to the input terminal 22. The conductor layer 382 is connected to the output terminal 23. Further, through holes 373, 374, and 375 are connected to the conductor layers 381, 382, and 383, respectively.

  A ground conductor layer 391 connected to the ground is formed on the top surface of the ninth dielectric layer 39 shown in FIG. 7C. The conductor layer 391 is connected to the ground terminals 24 to 27.

  The conductor layer 381 shown in FIG. 7B is connected to the conductor layers 111, 112, 113, and 361 through a plurality of through holes. The conductor layer 382 is connected to the conductor layers 131, 132, 133, and 362 through a plurality of through holes. The conductor layer 383 is connected to the conductor layers 121, 122, and 123 through a plurality of through holes. The conductor layers 381, 382, and 383 are opposed to the conductor layer 391 with the dielectric layer 38 in between. The conductor layers 381, 391 and the dielectric layer 38 constitute the capacitor 14 in FIG. The conductor layers 382 and 391 and the dielectric layer 38 constitute the capacitor 16 in FIG. The conductor layers 383 and 391 and the dielectric layer 38 constitute the capacitor 15 in FIG.

  The conductor layer 371 shown in FIG. 7A is opposed to the conductor layers 381, 382 and 383 with the dielectric layer 37 interposed therebetween. The conductor layers 371, 381, 383 and the dielectric layer 37 constitute the capacitor 17 in FIG. The conductor layers 371, 382, and 383 and the dielectric layer 37 constitute the capacitor 18 in FIG.

  The conductor layer 372 shown in FIG. 7A is opposed to the conductor layers 381 and 382 with the dielectric layer 37 interposed therebetween. The conductor layers 372, 381, 382 and the dielectric layer 37 constitute the capacitor 19 in FIG.

  The above-mentioned first to ninth dielectric layers 31 to 39 and the conductor layer are laminated to form the laminated substrate 20 shown in FIGS. The terminals 22 to 27 shown in FIG. 2 are formed on the outer peripheral portion of the laminated substrate 20.

  In the present embodiment, as the laminated substrate 20, various materials such as a material using a resin, ceramic, or a composite material of both can be used as the material of the dielectric layer. However, as the laminated substrate 20, it is particularly preferable to use a low-temperature co-fired ceramic multilayer substrate having excellent high-frequency characteristics.

  In the present embodiment, the resonator 4 includes resonator conductor layers 111 to 113 constituting the inductor 11 and a capacitor 14. The resonator 5 includes resonator conductor layers 121 to 123 that constitute the inductor 12, and a capacitor 15. The resonator 6 includes resonator conductor layers 131 to 133 constituting the inductor 13 and a capacitor 16.

  Here, with reference to FIG. 3, the shape, arrangement | positioning, and mutual relationship of the conductor layers 111-113 for resonators, the conductor layers 121-123 for resonators, and the conductor layers 131-133 for resonators are demonstrated in detail. FIG. 3 is a plan view showing these resonator conductor layers. Hereinafter, the conductor layers 111, 121, and 131 will be described, but the following description also applies to the conductor layers 112, 122, and 132 and the conductor layers 113, 123, and 133.

  As described above, the conductor layers 111, 121, and 131 are arranged side by side so that their longitudinal directions are parallel to each other and the conductor layer 121 is disposed between the conductor layer 111 and the conductor layer 131. . The length L1 in the longitudinal direction of the conductor layer 111 is equal to the length L3 in the longitudinal direction of the conductor layer 131, and the length L2 in the longitudinal direction of the conductor layer 121 is equal to the length L1 in the longitudinal direction of the conductor layer 111 and the conductor layer 131. Is smaller than the length L3 in the longitudinal direction. The conductor layers 111 and 121 are adjacent and inductively coupled. The conductor layers 121 and 131 are also adjacent and inductively coupled.

  In the conductor layers 111, 121, 131, the traveling direction of the electromagnetic waves is the longitudinal direction of each conductor layer 111, 121, 131. Therefore, the length of the conductor layers 111, 121, 131 in the longitudinal direction is equal to the length of the conductor layers 111, 121, 131 in the traveling direction of the electromagnetic waves. Accordingly, in the present embodiment, the lengths L1 and L2 in the traveling direction of the electromagnetic waves in the conductor layers 111 and 121 that are inductively coupled are different from each other. Similarly, the lengths L3 and L2 in the traveling direction of the electromagnetic waves in the conductor layers 131 and 121 that are inductively coupled are also different from each other.

  In the present embodiment, the length L3 of the conductor layer 113 is equal to the length L1 of the conductor layer 111, and the length L2 of the conductor layer 121 is the length L1 of the conductor layer 111 and the length of the conductor layer 131. Different from L3. In the present embodiment, in particular, the length L2 of the conductor layer 121 is smaller than the length L1 of the conductor layer 111 and the length L3 of the conductor layer 131.

  In the present embodiment, as shown in FIG. 3, the conductor layer 111 and the conductor layer 131 are symmetrical with respect to a virtual straight line CL passing through the conductor layer 121 and parallel to the traveling direction of the electromagnetic wave of the conductor layer 121. It has the shape which becomes.

  In the present embodiment, the conductor layers 111 to 113 and the conductor layers 121 to 123 are inductively coupled, and the conductor layers 131 to 133 and the conductor layers 121 to 123 are inductively coupled. In the present embodiment, the resonator 4 includes a capacitor 14 provided between one end of the conductor layers 111 to 113 and the ground. The resonator 5 includes a capacitor 15 provided between one end of the conductor layers 121 to 123 and the ground. The resonator 6 has a capacitor 16 provided between one end of the conductor layers 131 to 133 and the ground. The other end portions of the conductor layers 111 to 113, 121 to 123, and 131 to 133 are connected to the ground.

  In the present embodiment, the capacitance of the capacitor 16 is equal to the capacitance of the capacitor 14, and the capacitance of the capacitor 15 is larger than the capacitance of the capacitor 14 and the capacitance of the capacitor 16. Hereinafter, this meaning will be described. Like the resonators 4 to 6, the resonator frequency of the resonator having the resonator conductor layer and the capacitor increases as the length of the resonator conductor layer in the traveling direction of the electromagnetic wave decreases, and the capacitance of the capacitor increases. It gets lower. In the present embodiment, since the length L2 of the conductor layers 121 to 123 is smaller than the length L1 of the conductor layers 111 to 113 and the length L3 of the conductor layers 131 to 133, the capacitance of the capacitor 15 is set to the capacitors 14, 16 It is possible to match the resonance frequency of the resonator 5 to the resonance frequency of the resonators 4 and 6 by making it larger than the capacitance of the resonators 4 and 6.

  In the present embodiment, since the length L1 of the conductor layers 111 to 113 and the length L2 of the conductor layers 121 to 123 are different from each other, the difference between the lengths L1 and L2 causes the conductor layers 111 to 113 and the conductor layers to be different. The size of the inductive coupling with the layers 121 to 123 can be adjusted. Similarly, in the present embodiment, the length L3 of the conductor layers 131 to 133 and the length L2 of the conductor layers 121 to 123 are different from each other. The magnitude of inductive coupling between 133 and the conductor layers 121 to 123 can be adjusted. Therefore, according to the present embodiment, the size of the inductive coupling between the adjacent resonators 4 and 5 and the size of the inductive coupling between the adjacent resonators 6 and 5 can be easily adjusted. As a result, according to the present embodiment, it is possible to easily adjust the characteristics of the bandpass filter.

  In particular, according to the present embodiment, inductive coupling between the resonators 4 and 5 and inductive coupling between the resonators 6 and 5 are compared with the case where the length L2 is equal to the lengths L1 and L3. Can be reduced in size. As a result, according to the present embodiment, compared to the case where the length L2 is equal to the lengths L1 and L3, the slope in the vicinity of the attenuation pole in the curve indicating the pass / attenuation characteristics of the bandpass filter is reduced. Can be bigger. Therefore, according to the present embodiment, it is possible to clearly distinguish between the pass / attenuation characteristics in the pass band and the pass / attenuation characteristics outside the pass band.

  The electronic component 1 according to the present embodiment is effective, for example, when it is desired to reduce the attenuation in the frequency band of 2.4 to 2.5 GHz and increase the attenuation in the frequency band near 2.17 GHz. The frequency band of 2.4 to 2.5 GHz is a pass band of a band-pass filter used in a Bluetooth standard communication device or a wireless LAN communication device. The frequency band in the vicinity of 2.17 GHz is a frequency band used in a wideband code division multiple access (W-CDMA) mobile phone.

  Further, according to the present embodiment, even when the distance between the adjacent resonators must be shortened as the electronic component 1 is reduced in size and thickness, the inductivity between the adjacent resonators is reduced. Since the size of the coupling can be reduced, the electronic component 1 can be easily reduced in size and thickness.

  Of the conductor layers 111 to 113, 121 to 123, and 131 to 133, the length L2 of the central conductor layers 121 to 123 is set to the length L1 of the conductor layers 111 to 113 and the length L3 of the conductor layers 131 to 133. By making it smaller than this, it becomes possible to arrange the conductor layers 111 to 113, 121 to 123, and 131 to 133 by efficiently using the limited space in the multilayer substrate 20.

  If the length L2 is too small compared to the lengths L1 and L3, the size of the inductive coupling between the resonators 4 and 5 and the size of the inductive coupling between the resonators 6 and 5 are too small. Therefore, the length L2 is preferably 25% or more of the lengths L1 and L3. Therefore, the length L2 is preferably 25% or more and less than 100% of the lengths L1 and L3. Moreover, in order to show the effect of the electronic component 1 which concerns on this Embodiment notably, it is more preferable that it is 25 to 75% of length L1, L3. Note that the ratio of the length L2 to the lengths L1 and L3 may be changed according to the required characteristics of the bandpass filter.

  Next, a simulation result showing the effect of the electronic component 1 according to the present embodiment will be described. In this simulation, the first to fourth models of the electronic component 1 designed so that the passband of the bandpass filter is approximately 2.4 to 2.5 GHz and an attenuation pole is formed in the vicinity of 2.17 GHz. It was used. (A)-(d) in FIG. 8 represents the shape of the conductor layer for resonators in the 1st thru | or 4th model, respectively. As shown in FIG. 8, the first to fourth models have first to third resonator conductor layers 115, 125, and 135. The conductor layers 115, 125, and 135 all have a shape that is long in one direction. The conductor layers 115, 125, and 135 are arranged side by side so that their longitudinal directions are parallel to each other and the conductor layer 125 is disposed between the conductor layer 115 and the conductor layer 135. The conductor layers 115, 125, and 135 are disposed on a rectangular dielectric layer having a length of 1200 μm and a width of 2000 μm. The conductor layer 115 corresponds to the conductor layers 111 to 113 in this embodiment, the conductor layer 125 corresponds to the conductor layers 121 to 123 in this embodiment, and the conductor layer 135 corresponds to the conductor layers 131 to 133 in this embodiment. It corresponds to. The circuit configurations of the first to fourth models are as shown in FIG.

  In the first to fourth models, the length of the conductor layer 115 and the length of the conductor layer 135 are both 1600 μm. In the first model shown in FIG. 8A, the length of the conductor layer 125 is equal to the length of the conductor layers 115 and 135, and is 1600 μm. The first model is a comparative example for the present embodiment because the conductor layers 115, 125, and 135 have the same length.

  In the second to fourth models, the length of the conductor layer 125 is smaller than the length of the conductor layers 115 and 135. Therefore, the second to fourth models are models corresponding to the present embodiment. In the second model shown in FIG. 8B, the length of the conductor layer 125 is 1200 μm, which is 75% of the length of the conductor layers 115 and 135. In the third model shown in FIG. 8C, the length of the conductor layer 125 is 800 μm, which is 50% of the length of the conductor layers 115 and 135. In the fourth model shown in FIG. 8D, the length of the conductor layer 125 is 400 μm, which is 25% of the length of the conductor layers 115 and 135. In FIG. 8, an ellipse with a two-dot chain line conceptually represents the magnitude of inductive coupling between adjacent conductor layers.

  FIG. 9 shows the pass / attenuation characteristics of the first to fourth models. In FIG. 9, the characteristic of the first model in which the length of the conductor layer 125 is 1600 μm is represented by a dotted line, and the characteristic of the second model in which the length of the conductor layer 125 is 1200 μm is represented by a solid line. The characteristic of the third model whose length is 800 μm is represented by a broken line, and the characteristic of the fourth model whose length of the conductor layer 125 is 400 μm is represented by a dashed line.

  As can be seen from FIG. 9, the smaller the length of the conductor layer 125, the greater the slope in the vicinity of the attenuation pole in the curve showing the pass / attenuation characteristics. In the example shown in FIG. 9, the attenuation at 2.17 GHz is the largest in the second model.

  From the results shown in FIG. 9, by changing the ratio of the length of the conductor layer 125 to the length of the conductor layers 115 and 135, the curve of the bandpass filter characteristics, particularly the pass / attenuation characteristics of the bandpass filter is shown. It can be seen that the inclination in the vicinity of the attenuation pole can be easily adjusted.

  In addition, this invention is not limited to the said embodiment, A various change is possible. For example, in the embodiment, each of the inductors 11 to 13 is configured by three resonator conductor layers, but each of the inductors 11 to 13 may be configured by one or two resonator conductor layers. You may comprise by the conductor layer for two or more resonators.

  Further, the electronic component of the present invention is not limited to the band-pass filter, and can be applied to all electronic components including a plurality of resonators. The electronic component of the present invention only needs to include at least a first resonator and a second resonator, and the electronic component may include two resonators or four or more resonators.

  The electronic component of the present invention is useful as a filter, particularly a band-pass filter, used in a Bluetooth standard communication device or a wireless LAN communication device.

It is a perspective view which shows the principal part of the electronic component which concerns on one embodiment of this invention. It is a perspective view which shows the external appearance of the electronic component which concerns on one embodiment of this invention. It is a top view which shows the conductor layer for resonators in one embodiment of this invention. It is a circuit diagram which shows the circuit structure of the electronic component which concerns on one embodiment of this invention. It is explanatory drawing which shows the upper surface of the 1st layer thru | or the 3rd dielectric layer of the laminated substrate in one embodiment of this invention. It is explanatory drawing which shows the upper surface of the 4th layer thru | or 6th dielectric layer of the laminated substrate in one embodiment of this invention. It is explanatory drawing which shows the upper surface of the 7th thru | or 9th dielectric layer of the laminated substrate in one embodiment of this invention. It is explanatory drawing which shows the 1st thru | or 4th model used in the simulation which shows the effect of the electronic component which concerns on one embodiment of this invention. FIG. 9 is a characteristic diagram showing pass / attenuation characteristics of the first to fourth models shown in FIG. 8.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Electronic component, 2 ... Input terminal, 3 ... Output terminal, 4-6 ... Resonator, 11-13 ... Inductor, 14-19 ... Capacitor, 20 ... Multilayer substrate, 111-113, 121-123, 131-133 ... conductor layer for resonators.

Claims (12)

An electronic component comprising a laminated substrate including a plurality of laminated dielectric layers, and a plurality of resonators provided in the laminated substrate,
The plurality of resonators include first and second resonators;
The first resonator has a first resonator conductor layer provided in the multilayer substrate,
The second resonator has a second resonator conductor layer provided in the multilayer substrate,
The electronic component according to claim 1, wherein the first resonator conductor layer and the second resonator conductor layer are inductively coupled and have different lengths in the traveling direction of electromagnetic waves. The first resonator further includes a first capacitor provided between one end of the first resonator conductor layer and the ground,
The second resonator further includes a second capacitor provided between one end of the second resonator conductor layer and the ground,
2. The electronic component according to claim 1, wherein each of the other end portions of the first and second resonator conductor layers is connected to a ground. The length of the second resonator conductor layer in the traveling direction of electromagnetic waves is smaller than the length of the first resonator conductor layer in the traveling direction of electromagnetic waves,
The electronic component according to claim 2, wherein a capacitance of the second capacitor is larger than a capacitance of the first capacitor. The plurality of resonators further includes a third resonator,
The third resonator has a third resonator conductor layer provided in the multilayer substrate,
The second resonator conductor layer is disposed between the first resonator conductor layer and the third resonator conductor layer;
The third resonator conductor layer and the second resonator conductor layer are inductively coupled,
The length of the third resonator conductor layer in the traveling direction of the electromagnetic wave is equal to the length of the first resonator conductor layer in the traveling direction of the electromagnetic wave,
The length of the second resonator conductor layer in the traveling direction of electromagnetic waves is the length of the first resonator conductor layer in the traveling direction of electromagnetic waves and the traveling direction of the electromagnetic waves in the third resonator conductor layer. The electronic component according to claim 1, wherein the electronic component has a length different from that of the electronic component.   The length of the second resonator conductor layer in the traveling direction of electromagnetic waves is the length of the first resonator conductor layer in the traveling direction of electromagnetic waves and the traveling direction of the electromagnetic waves in the third resonator conductor layer. The electronic component according to claim 4, wherein the electronic component is smaller than the length of.   The first resonator conductor layer and the third resonator conductor layer pass through the second resonator conductor layer and are centered on an imaginary straight line parallel to the traveling direction of the electromagnetic wave of the second resonator conductor layer. 6. The electronic component according to claim 4, wherein the electronic component has a symmetrical shape. The first resonator further includes a first capacitor provided between one end of the first resonator conductor layer and the ground,
The second resonator further includes a second capacitor provided between one end of the second resonator conductor layer and the ground,
The third resonator further includes a third capacitor provided between one end of the third resonator conductor layer and the ground.
5. The electronic component according to claim 4, wherein each of the other end portions of the first to third resonator conductor layers is connected to a ground. The length of the second resonator conductor layer in the traveling direction of electromagnetic waves is the length of the first resonator conductor layer in the traveling direction of electromagnetic waves and the traveling direction of the electromagnetic waves in the third resonator conductor layer. Smaller than the length about
The electronic component according to claim 7, wherein a capacitance of the second capacitor is larger than a capacitance of the first capacitor and a capacitance of the third capacitor.   The length of the second resonator conductor layer in the traveling direction of the electromagnetic wave is 25% or more and less than 100% of the length of the first resonator conductor layer in the traveling direction of the electromagnetic wave. The electronic component according to claim 1.   The length of the second resonator conductor layer in the traveling direction of the electromagnetic wave is 25% or more and 75% or less of the length of the first resonator conductor layer in the traveling direction of the electromagnetic wave. The electronic component according to claim 1.   11. The electronic component according to claim 1, wherein each of the plurality of resonators is a quarter wavelength resonator having one end opened and the other end short-circuited. Furthermore, an input terminal and an output terminal disposed on the outer peripheral portion of the multilayer substrate are provided,
The electronic component according to claim 1, wherein the plurality of resonators are provided between the input terminal and the output terminal in a circuit configuration to realize a function of a band-pass filter. .

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