JP2008141032A - Metalizing film capacitor - Google Patents

Metalizing film capacitor Download PDF

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Publication number
JP2008141032A
JP2008141032A JP2006326619A JP2006326619A JP2008141032A JP 2008141032 A JP2008141032 A JP 2008141032A JP 2006326619 A JP2006326619 A JP 2006326619A JP 2006326619 A JP2006326619 A JP 2006326619A JP 2008141032 A JP2008141032 A JP 2008141032A
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Prior art keywords
film capacitor
electrode
soldering
thickness
metalizing
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JP2006326619A
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Japanese (ja)
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Kazuhiko Kurosawa
一彦 黒澤
Hiroyasu Murayama
浩康 村山
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Priority to JP2006326619A priority Critical patent/JP2008141032A/en
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/13—Energy storage using capacitors

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Abstract

<P>PROBLEM TO BE SOLVED: To simultaneously achieve the low cost and the light weight of a metalizing film capacitor for use in a hybrid car and the like. <P>SOLUTION: A metalizing film capacitor comprises an element 1 in which a pair of metalizing films in which a metal deposition electrode is formed on a dielectric film is wound in such a manner that the metal deposition electrode is in opposition via the dielectric film, and a pair of metalized contact electrodes 2 formed on both end surfaces of the element 1 by metal spray. A material for use as the metalized contact electrode 2 can be reduced by use of a structure in which the thickness of a non soldering portion 2b except the soldering portion 2a of the metalized contact electrode 2 is thinner than that of the soldering portion 2a. Thus, cost and weight can be simultaneously reduced at the metalized contact portion by about 30 to 50% lower than those of a conventional product. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は各種電子機器、電気機器、産業機器、自動車等に使用され、特に、ハイブリッド自動車のモータ駆動用インバータ回路の平滑用、フィルタ用、スナバ用として最適な金属化フィルムコンデンサに関するものである。   The present invention relates to a metallized film capacitor which is used in various electronic devices, electrical devices, industrial devices, automobiles, etc., and is particularly suitable for smoothing, filtering, and snubbing of motor drive inverter circuits of hybrid vehicles.

近年、環境保護の観点から、あらゆる電気機器がインバータ回路で制御され、省エネルギー化、高効率化が進められている。中でも自動車業界においては、電気モータとエンジンで走行するハイブリッド車（以下、ＨＥＶという）が市場導入される等、地球環境に優しく、省エネルギー化、高効率化に関する技術の開発が活発化している。   In recent years, from the viewpoint of environmental protection, all electric devices are controlled by inverter circuits, and energy saving and high efficiency are being promoted. In particular, in the automobile industry, hybrid vehicles (hereinafter referred to as HEVs) that run on electric motors and engines have been introduced into the market, and the development of technologies relating to energy saving and high efficiency has been activated.

このようなＨＥＶ用の電気モータは使用電圧領域が数百ボルトと高いため、このような電気モータに関連して使用されるコンデンサとして、高耐電圧で低損失の電気特性を有する金属化フィルムコンデンサが注目されており、更に市場におけるメンテナンスフリー化の要望からも極めて寿命が長い金属化フィルムコンデンサを採用する傾向が目立っている。   Since such a HEV electric motor has a high operating voltage range of several hundred volts, a metallized film capacitor having high withstand voltage and low loss electric characteristics as a capacitor used in connection with such an electric motor. In addition, the trend of adopting metalized film capacitors with a very long life is conspicuous due to the demand for maintenance-free in the market.

図２はこの種の従来の金属化フィルムコンデンサの構成を示した斜視図であり、図２において、１１は金属化フィルムコンデンサの素子、１２はメタリコン電極、１３は金属バー、１３−２は金属バー１３に設けた凸部、１３−３は半田接続を行う範囲を示すものであり、上記金属バー１３の凸部１３−２に半田接続範囲１３−３で半田付けを行い、金属バー１３により回路上必要な電流を流すようにしたものである。   FIG. 2 is a perspective view showing the structure of a conventional metalized film capacitor of this type. In FIG. 2, 11 is an element of the metalized film capacitor, 12 is a metallicon electrode, 13 is a metal bar, and 13-2 is a metal. Protrusions 13-3 provided on the bar 13 indicate a range in which solder connection is performed, and soldering is performed on the protrusions 13-2 of the metal bar 13 in the solder connection range 13-3. A current necessary for the circuit is made to flow.

このように構成された従来の金属化フィルムコンデンサは、大電流を流すための金属バー１３に設けた凸部１３−２のみを加熱することにより半田接続が可能となり、金属バー１３に凸部１３−２が無い場合と比較して、コンデンサ素子１１への熱影響が少なくなるというものであり、上記金属バー１３に設ける凸部１３−２は、半田接続時の熱影響に問題がなければ、複数箇所設けることにより、接続強度をさらに確保することが可能となるというものであった。   The conventional metallized film capacitor configured as described above can be soldered by heating only the convex portion 13-2 provided on the metal bar 13 for flowing a large current. -2 is less than that in the case where there is no -2 and the convexity 13-2 provided on the metal bar 13 has no problem with the thermal effect during solder connection. By providing a plurality of locations, it is possible to further secure the connection strength.

なお、この出願の発明に関連する先行技術文献情報としては、例えば、特許文献１が知られている。
特開２００４−３４９４４７号公報 As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP 2004-349447 A

しかしながら上記従来の金属化フィルムコンデンサでは、金属バー１３に設けた凸部１３−２のみを加熱してメタリコン電極１２に半田付け接続することにより、コンデンサ素子１１への熱影響が少ない状態で半田接続を行うことができるという長所は有するものの、加速する低価格化の要望に対する対応に加え、特にこのような金属化フィルムコンデンサを自動車用に使用する場合には、更なる軽量化が高いレベルで求められ、このような要求に応えることが急務であるという課題があった。   However, in the conventional metallized film capacitor described above, only the convex portion 13-2 provided on the metal bar 13 is heated and soldered to the metallicon electrode 12, so that the thermal influence on the capacitor element 11 is reduced. In addition to responding to the demand for accelerating price reduction, especially when using such metalized film capacitors for automobiles, further weight reduction is required at a high level. Therefore, there is a problem that there is an urgent need to meet such a demand.

本発明はこのような従来の課題を解決し、低価格化と軽量化を同時に達成することが可能な金属化フィルムコンデンサを提供することを目的とするものである。   An object of the present invention is to solve such a conventional problem and to provide a metallized film capacitor capable of simultaneously achieving a reduction in price and weight.

上記課題を解決するために本発明は、誘電体フィルム上に金属蒸着電極を形成した一対の金属化フィルムを上記金属蒸着電極が誘電体フィルムを介して対向するように巻回した素子と、この素子の両端面に金属溶射によって形成されたメタリコン電極からなり、上記メタリコン電極の半田付け部を除く部分を半田付け部の厚みよりも薄くした構成にしたものである。   In order to solve the above-described problems, the present invention provides an element in which a pair of metallized films in which a metal vapor-deposited electrode is formed on a dielectric film are wound so that the metal vapor-deposited electrode is opposed to the dielectric film. The metallized electrode is formed by metal spraying on both end faces of the element, and the part of the metallicon electrode excluding the soldered part is made thinner than the thickness of the soldered part.

以上のように本発明による金属化フィルムコンデンサは、メタリコン電極の半田付け部を除く部分を半田付け部の厚みよりも薄くした構成により、メタリコン電極として使用する材料を削減することができるため、従来品と比較して、メタリコン電極部で、約３０〜５０％のコストダウンと軽量化を図ることができるという効果が得られるものである。   As described above, the metallized film capacitor according to the present invention has a configuration in which the portion excluding the soldered portion of the metallicon electrode is made thinner than the thickness of the soldered portion, so that the material used as the metallicon electrode can be reduced. Compared with the product, the metallicon electrode part can achieve an effect that the cost can be reduced by about 30 to 50% and the weight can be reduced.

（実施の形態）
以下、実施の形態を用いて、本発明の特に全請求項に記載の発明について説明する。 (Embodiment)
Hereinafter, the invention described in the entire claims of the present invention will be described by using embodiments.

図１は本発明の一実施の形態による金属化フィルムコンデンサの構成を示した斜視図であり、図１において、１はコンデンサ素子であり、このコンデンサ素子１は誘電体フィルム上に金属蒸着電極を形成した一対の金属化フィルムを上記金属蒸着電極が誘電体フィルムを介して対向するように巻回（全て図示せず）することにより構成されたものであり、本実施の形態においては、このコンデンサ素子１は上記巻回後、更に偏平にプレス加工することによって小判形に形成されているものである。   FIG. 1 is a perspective view showing a configuration of a metallized film capacitor according to an embodiment of the present invention. In FIG. 1, reference numeral 1 denotes a capacitor element. The capacitor element 1 has a metal vapor-deposited electrode on a dielectric film. The pair of formed metallized films is formed by winding (all not shown) such that the metal vapor deposition electrodes face each other with a dielectric film interposed therebetween. In the present embodiment, this capacitor The element 1 is formed into an oval shape by further flat pressing after the winding.

２はこのコンデンサ素子１の両端面に亜鉛を溶射することによって形成された一対のメタリコン電極であり、このメタリコン電極２は半田付け部２ａと、この半田付け部２ａ以外の非半田付け部２ｂにより形成されているものであり、上記半田付け部２ａは幅１０ｍｍ、厚みが０．６ｍｍとなるように形成し、この半田付け部２ａを除く非半田付け部２ｂは厚みが０．３ｍｍとなるように形成したものである。   Reference numeral 2 denotes a pair of metallicon electrodes formed by spraying zinc on both end faces of the capacitor element 1. The metallicon electrode 2 is formed by a soldering portion 2a and a non-soldering portion 2b other than the soldering portion 2a. The soldering part 2a is formed to have a width of 10 mm and a thickness of 0.6 mm, and the non-soldering part 2b excluding the soldering part 2a has a thickness of 0.3 mm. Is formed.

また、このような半田付け部２ａと非半田付け部２ｂからなるメタリコン電極２は、特殊な細いノズルを用いて亜鉛を溶射することによって形成するようにしているものであるため、上記ノズルによる吹き付け回数や時間を制御することにより、厚みが厚い半田付け部２ａと、厚みが薄い非半田付け部２ｂを夫々形成することが可能になるものである。   Further, since the metallicon electrode 2 composed of the soldering part 2a and the non-soldering part 2b is formed by spraying zinc using a special thin nozzle, it is sprayed by the nozzle. By controlling the number of times and time, it is possible to form a thick soldered portion 2a and a thin non-soldered portion 2b.

このように構成された本実施の形態による金属化フィルムコンデンサは、半田付け作業性と半田付け強度を確保した状態で、半田付け部２ａ以外のメタリコン電極２部となる非半田付け部２ｂの厚みを薄くした構成により、メタリコン電極２として使用する亜鉛の使用量を半減することができるため、従来品と比較して、メタリコン電極部で、３０〜５０％のコストダウンと軽量化を同時に実現することができるようになるものである。   In the metallized film capacitor according to the present embodiment configured as described above, the thickness of the non-soldering portion 2b that becomes the metallicon electrode 2 portion other than the soldering portion 2a in a state where the soldering workability and the soldering strength are ensured. Because the amount of zinc used as the metallicon electrode 2 can be halved by the thinned structure, the metallicon electrode portion can realize a cost reduction and weight reduction of 30-50% at the same time compared with the conventional product. It will be able to.

なお、本実施の形態においては、上記半田付け部２ａとして、幅１０ｍｍ、厚みが０．６ｍｍの半田付け部２ａを２箇所に設けた例を用いて説明したが、本発明はこれに限定されるものではなく、半田付け部２ａは１箇所でも良く、その厚みも０．６〜０．７ｍｍ程度あれば良好な半田付け接続を行うことができるものである。   In the present embodiment, the soldering part 2a has been described using an example in which the soldering part 2a having a width of 10 mm and a thickness of 0.6 mm is provided in two places. However, the present invention is not limited to this. Instead, the soldering portion 2a may be provided at one place, and if the thickness is about 0.6 to 0.7 mm, good soldering connection can be performed.

また、上記非半田付け部２ｂとして、厚みが０．３ｍｍとなるように形成した例を用いて説明したが、厚みが薄くなりすぎるとクラックや剥離等が発生するため、薄くても０．２ｍｍは必要である。   Further, the non-soldering portion 2b has been described by using an example in which the thickness is 0.3 mm. However, if the thickness is too thin, cracks, peeling, etc. occur. Is necessary.

本発明による金属化フィルムコンデンサは、低価格化と軽量化を同時に実現できるという効果を有し、特に自動車用のコンデンサ等として有用である。   The metallized film capacitor according to the present invention has an effect that it is possible to simultaneously realize a reduction in cost and weight, and is particularly useful as a capacitor for automobiles.

本発明の一実施の形態による金属化フィルムコンデンサの構成を示した斜視図The perspective view which showed the structure of the metallized film capacitor by one embodiment of this invention 従来の金属化フィルムコンデンサの構成を示した斜視図A perspective view showing the configuration of a conventional metallized film capacitor

符号の説明Explanation of symbols

１ コンデンサ素子
２ メタリコン電極
２ａ 半田付け部
２ｂ 非半田付け部 1 Capacitor element 2 Metallicon electrode 2a Soldering part 2b Non-soldering part

Claims (2)

誘電体フィルム上に金属蒸着電極を形成した一対の金属化フィルムを上記金属蒸着電極が誘電体フィルムを介して対向するように巻回した素子と、この素子の両端面に金属溶射によって形成されたメタリコン電極からなり、上記メタリコン電極の半田付け部を除く部分を半田付け部の厚みよりも薄くした金属化フィルムコンデンサ。 An element in which a pair of metallized films having a metal vapor deposition electrode formed on a dielectric film is wound so that the metal vapor deposition electrode faces through the dielectric film, and both ends of the element are formed by metal spraying. A metallized film capacitor comprising a metallicon electrode, wherein a portion excluding the soldered portion of the metallicon electrode is made thinner than the thickness of the soldered portion. メタリコン電極の半田付け部以外の厚みを０．２ｍｍ以上とした請求項１に記載の金属化フィルムコンデンサ。 The metallized film capacitor according to claim 1, wherein the thickness of the metallicon electrode other than the soldered portion is 0.2 mm or more.
JP2006326619A 2006-12-04 2006-12-04 Metalizing film capacitor Pending JP2008141032A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012131754A1 (en) * 2011-03-28 2012-10-04 三菱電機株式会社 Snubber device
CN109741940A (en) * 2018-12-29 2019-05-10 铜陵市佳龙飞电容器有限公司 A kind of technique for reinforcing thin film capacitor gilding layer intensity using conducting wire

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5749217A (en) * 1980-09-09 1982-03-23 Matsushita Electric Ind Co Ltd Method of producing condenser
JPH02155215A (en) * 1988-12-08 1990-06-14 Nitsuko Corp Manufacture of low height type film capacitor
JPH09260188A (en) * 1996-03-19 1997-10-03 Nitsuko Corp Metallized film capacitor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5749217A (en) * 1980-09-09 1982-03-23 Matsushita Electric Ind Co Ltd Method of producing condenser
JPH02155215A (en) * 1988-12-08 1990-06-14 Nitsuko Corp Manufacture of low height type film capacitor
JPH09260188A (en) * 1996-03-19 1997-10-03 Nitsuko Corp Metallized film capacitor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012131754A1 (en) * 2011-03-28 2012-10-04 三菱電機株式会社 Snubber device
CN103460317A (en) * 2011-03-28 2013-12-18 三菱电机株式会社 Snubber device
CN109741940A (en) * 2018-12-29 2019-05-10 铜陵市佳龙飞电容器有限公司 A kind of technique for reinforcing thin film capacitor gilding layer intensity using conducting wire
CN109741940B (en) * 2018-12-29 2021-02-09 铜陵市佳龙飞电容器有限公司 Process for enhancing strength of gold spraying layer of thin film capacitor by using conducting wire

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