JP2015061007A - Capacitor module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a capacitor module used for hybrid vehicle etc. capable of efficiently releasing heat from a capacitor element.SOLUTION: A capacitor module 1 includes: a capacitor element 2; a core 5 disposed on a winding shaft part of the capacitor element 2, in which at least one end of the core 5 protrudes from a metallicon electrode 4a or a metallicon electrode 4b of the capacitor element 2; a heat release member 7 which is in contact with one flat face 3b of the capacitor element 2 and is connected with one end of the core 5; and a metal cover member 11 which covers the other flat face 3a of the capacitor element 2 and a part of which is connected with the heat release member 7. With this arrangement, the heat residing in the vicinity of the inner and outer surfaces of the capacitor element 2 can be released to the outside via the heat release member 7 and the cover member 11. Thus, the heat can be efficiently released from entire of the capacitor element 2.

Description

  The present invention relates to a capacitor module mounted on an automobile or the like.

  In recent years, from the viewpoint of environmental protection, all electric devices are controlled by inverter circuits, and energy saving and high efficiency are being promoted. In particular, in the automobile industry, hybrid vehicles (hereinafter referred to as HEVs) that run on electric motors and engines have been introduced into the market, and the development of technologies relating to energy saving and high efficiency has been activated, which is friendly to the global environment.

  Since an electric motor for HEV has a high operating voltage range of several hundred volts, a metallized film capacitor having high withstand voltage and low loss electric characteristics has attracted attention as a capacitor used in connection with such an electric motor. In addition, the trend of adopting metalized film capacitors with a very long life is also conspicuous due to the demand for maintenance-free in the market.

  In general, a capacitor module using such a metallized film capacitor as a capacitor element is often mounted in an HEV engine room or the like. In the engine room, however, many devices serving as a power source for driving the HEV are simultaneously used. It is installed, and these devices become heat sources during HEV driving, and the temperature in the engine room becomes extremely high. When the temperature of the capacitor element becomes high due to the thermal influence of the external environment, the capacitor element may exhibit an unexpected operation and may not be able to exhibit the conventional performance.

  Further, when a large ripple current flows through the capacitor element, the capacitor element itself also generates heat. Even in this case, the capacitor element may not be able to exhibit the conventional performance in the same manner as described above.

  Patent Document 1 discloses a capacitor module for suppressing the rise in the temperature of the capacitor element caused by such heat received from the external environment or the heat generated by the capacitor element itself, and maintaining stable performance of the capacitor element. Have been described.

  The capacitor module described in Patent Document 1 will be described with reference to FIG.

  As shown in FIG. 5, the capacitor module described in Patent Document 1 includes a capacitor element 101 and a winding core 102 inserted into a winding shaft portion of the capacitor element 101. The winding core 102 includes a winding core body 102 a inserted into the capacitor element 101 and a joint portion 102 b that is joined to the circuit board 103 on which the capacitor element 101 is mounted.

  In this way, by joining the joint 102b of the winding core 102 to the circuit board 103, the heat of the capacitor element 101 is conducted to the circuit board 103, and the heat of the capacitor element 101 can be dissipated to the outside.

  In particular, the heat generated from the capacitor element 101 itself is likely to be trapped near the center of the capacitor element 101, and the capacitor module described in Patent Document 1 has a more effective configuration with respect to the heat generation of the capacitor element 101 itself.

JP 2008-311253 A

  As described above, the capacitor module described in Patent Document 1 can efficiently dissipate the heat of the capacitor element 101 to the outside, and is particularly useful as a countermeasure against heat generation of the capacitor element 101 itself.

  However, according to the configuration of Patent Document 1, the heat in the vicinity of the center portion of the capacitor element 101 is surely dissipated to the outside, but the heat dissipation in the vicinity of the outer surface of the capacitor element 101 is not considered.

  Therefore, the present invention improves the conventional heat dissipation structure, dissipates heat inside the capacitor element to the outside, and at the same time dissipates heat near the outer surface of the capacitor element to the outside, thereby more efficiently dissipating the heat of the entire capacitor element. For the purpose.

  In order to solve the above problems, a capacitor module of the present invention is formed by winding a pair of metallized films, and has a flat capacitor element with metallicon electrodes provided on both end faces, and a winding of the capacitor element. A core member disposed at the shaft portion and projecting from at least one end of the capacitor element from the metallicon electrode; and in contact with one flat surface of the capacitor element; and the one end of the core member is The heat dissipating member is connected, and the other flat surface of the capacitor element is covered, and a metal covering member partly connected to the heat dissipating member.

  According to the capacitor module of the present invention, it is possible to efficiently dissipate heat of the entire capacitor element.

  This is because the capacitor module of the present invention includes a core member disposed on the winding shaft portion of the capacitor element, one flat surface of the capacitor element is in contact with the heat dissipation member, and the other flat surface is made of metal. This is because the structure is covered with a covering member.

  That is, the heat inside the capacitor element is conducted to the outside through the core material, and the heat near the outer surface of the capacitor element is dissipated by the heat dissipating member and the covering member, so that the heat of the entire capacitor element is efficiently obtained. It can be dissipated outside.

The perspective view which shows the structure of the capacitor | condenser element 2 used for the capacitor | condenser module 1,21,31 of Embodiment 1,2,3. 1 is a perspective view showing a configuration of a capacitor module 1 according to a first embodiment. The perspective view which shows the structure of the capacitor | condenser module 21 of Embodiment 2. FIG. The perspective view which shows the structure of the capacitor | condenser module 31 of Embodiment 3. FIG. A longitudinal sectional view showing the configuration of a conventional capacitor module

(Embodiment 1)
Hereinafter, the configuration of the capacitor element 2 used in the capacitor module 1 of the present embodiment will be described with reference to FIG. FIG. 1 is a perspective view showing the configuration of the capacitor element 2. The overall configuration of the capacitor module 1 will be described later with reference to FIG. The capacitor module 21 of the second embodiment and the capacitor module 31 of the third embodiment, which will be described later, also use the capacitor element 2 similar to that of the present embodiment.

  Capacitor element 2 used in the present embodiment has a pair of metallized films in which aluminum is deposited on one or both sides of a dielectric film made of polypropylene film to form a metal deposited electrode, and the metal deposited electrode is a dielectric film. It is formed by winding in a state of being opposed to each other. In this example, a polypropylene film having a thickness of 3.0 μm was used as the dielectric of the film, but other than this, polyethylene terephthalate, polyethylene naphthalate, polyphenyl sulfide, polystyrene, or the like having an appropriate thickness may be used. Further, the capacitor element 2 is pressed to be processed from a cylindrical shape to a flat shape as shown in FIG. In the present specification, two opposing flat surfaces formed by this pressing are defined as flat surfaces 3a and 3b, respectively. Further, the metallicon electrode 4a and the metallicon electrode 4b sprayed with zinc are respectively provided on both end faces of the capacitor element 2, and the metallicon electrode 4a and the metallicon electrode 4b serve as a pair of extraction electrodes of P and N poles. Yes. In this embodiment, the metallicon electrode 4a and the metallicon electrode 4b are formed by thermal spraying, but may be formed using a metal other than zinc or an alloy.

  As shown in FIG. 1, the capacitor element 2 is provided with a core material 5 formed by insulating a metal at a winding shaft portion. The metal used for the core material 5 may be a metal having high thermal conductivity, such as aluminum or copper, but aluminum is particularly preferable from the viewpoint of weight reduction of the entire module. As the insulating treatment, an insulating thermosetting resin may be applied. As the insulating thermosetting resin, an epoxy resin to which a filler having high thermal conductivity is added may be used. Moreover, when an electrostatic coating method is used as a coating method, it can suppress that a pinhole generate | occur | produces in resin after hardening, and can improve insulation. Alternatively, it is possible to perform insulation treatment by winding an insulating tape or using an insulating heat-shrinkable tube.

  Further, the core member 5 is inserted in advance into the central hollow portion (winding shaft portion) of the cylindrical capacitor element 2 and pressed together with the capacitor element 2 when the capacitor element 2 is pressed. 1 is inserted into the winding shaft portion of the flat capacitor element 2 as shown in FIG. In this pressing operation, if an adhesive is applied in advance to the insulating core material 5, there is no gap between the core material 5 and the winding shaft portion of the capacitor element 2 in the state shown in FIG. . As will be described later, since the core material 5 functions as a heat conductive member that dissipates the heat of the capacitor element 2 to the outside, as the adhesive, heat conduction such as magnesium oxide, aluminum oxide, aluminum nitride, or the like is performed on a resin such as an epoxy resin. It is preferable to use a material to which a highly filler is added. Excess adhesive is discharged to the outside of the winding shaft portion during the pressing operation.

  Further, in the present embodiment, the core material 5 has a plate shape as shown in FIG. 1, and both ends thereof are externally provided along the winding axis direction of the capacitor element 2 from the metallicon electrode 4a and the metallicon electrode 4b. Protruding.

  A bus bar 6a and a bus bar 6b for electrically connecting the capacitor element 2 to an external device are connected to the metallicon electrode 4a and the metallicon electrode 4b. As shown in FIG. 1, the bus bar 6 a and the bus bar 6 b are divided into bifurcated ends on the metallicon electrode 4 a and metallicon electrode 4 b sides, and the respective ends of the bifurcated portions are solder-welded. As a method for connecting the bus bar 6a, the bus bar 6b, the metallicon electrode 4a, and the metallicon electrode 4b, resistance welding, ultrasonic bonding, or the like may be used in addition to solder welding.

  Next, the capacitor module 1 of the present embodiment will be described with reference to FIG. FIG. 2 is a perspective view showing the configuration of the capacitor module 1.

  As shown in FIG. 2, in the capacitor module 1, the capacitor element 2 of FIG. 1 is placed on the heat radiating member 7 in a state where the core member 5, the bus bar 6 a, and the bus bar 6 b are connected.

  The heat dissipation member 7 is made of aluminum. The heat radiating member 7 is provided with a flat base portion 8, two core material connection portions 9 a and core material connection portions 9 b that are provided to protrude from the base portion 8 toward the capacitor element 2 and are connected to both ends of the core material 5. And a pair of covering member connecting portions 10a and covering member connecting portions 10b (the covering member connecting portions 10b are not shown) provided to protrude from the base portion 8 to the capacitor element 2 side and connected to a covering member 11 described later. ing. In the capacitor module 1 of the present embodiment, the core material connecting portion 9a, the core material connecting portion 9b, the covering member connecting portion 10a, and the covering member connecting portion 10b protruding from the flat base 8 are provided as described above. However, the core material connecting portion 9a, the core material connecting portion 9b, the covering member connecting portion 10a, and the covering member connecting portion 10b are not necessarily provided. That is, the heat radiating member 7 may be configured by only the flat base 8 and both ends of the core material 5 may be bent and connected to the base 8 or the covering member 11 may be directly connected to the base 8.

  The capacitor element 2 is placed on the base 8 so as to be fitted between the two covering member connection portions 10a and the covering member connection portion 10b, and one flat surface (flat surface 3b) is insulated from the surface of the base portion 8. It is in contact with the state secured. Therefore, the surface of the base 8 and the capacitor element 2 side of the covering member connecting portion 10 a and the covering member connecting portion 10 b are shaped so as to follow the outer peripheral surface of the capacitor element 2. In order to insulate the heat radiating member 7 and the capacitor element 2 in a state where the capacitor element 2 is placed on the base 8 of the heat radiating member 7, the height between the base 8 of the heat radiating member 7 and the flat surface 3 b of the capacitor element 2 is high. An insulating sheet (not shown) having thermal conductivity is interposed. As this insulating sheet, an acrylic sheet to which a filler such as aluminum oxide or aluminum nitride is added, or a silicon rubber sheet to which a similar filler is added may be used. Or you may ensure the insulation of the heat radiating member 7 and the capacitor | condenser element 2 by apply | coating the epoxy resin containing the said filler before mounting the capacitor | condenser element 2 in the heat radiating member 7. FIG.

  As shown in FIG. 2, both ends of the core material 5 projecting from the metallicon electrodes 4a and 4b of the capacitor element 2 are placed on and connected to the upper surfaces of the core material connection portion 9a and the core material connection portion 9b. In this way, by connecting the core member 5 disposed on the winding shaft portion of the capacitor element 2 to the heat radiating member 7, the heat trapped inside the capacitor element 2 can be efficiently dissipated to the outside. In the capacitor module 1 of this embodiment, ultrasonic bonding is used to connect the core material 5 to the core material connecting portion 9a and the core material connecting portion 9b.

  Further, as shown in FIG. 2, the other surface (flat surface 3 a) of the capacitor element 2 is covered with a metallic covering member 11 in a state where insulation is ensured. The covering member 11 is not particularly limited as long as it is a metal having high thermal conductivity, but is preferably formed of aluminum in view of reducing the weight of the entire module. The covering member 11 is a member for radiating the heat in the vicinity of the flat surface 3a of the capacitor element 2 to the outside, and is preferably in close contact with the capacitor element 2 as much as possible. Therefore, the covering member 11 is processed into a shape along the outer surface of the capacitor element 2. That is, the covering member 11 includes a plate-like portion 12 that contacts the flat surface 3 a of the capacitor element 2, and a pair of curved surface portions 13 a and curved surface portions 13 b that contact the side portions of the capacitor element 2. The covering member 11 has a pair of curved surface portions 13a, a pair of connecting portions 14a extending from the curved surface portion 13b, and a connecting portion 14b (the connecting portion 14b is not shown). The connecting portion 14a and the connecting portion 14b are plate-like and are in contact with the upper surfaces of the covering member connecting portion 10a and the covering member connecting portion 10b of the heat dissipation member 7. Note that ultrasonic bonding is used to connect the connecting portion 14a and the connecting portion 14b to the covering member connecting portion 10a and the covering member connecting portion 10b.

  Insulation between the flat surface 3a of the capacitor element 2 and the covering member 11 is performed by electrostatically coating the covering member 11 with an insulating resin. In this embodiment, an epoxy resin to which a filler having high thermal conductivity such as magnesium oxide, aluminum oxide, and aluminum nitride is added is used as the insulating resin.

  With such a configuration, the heat in the vicinity of the flat surface 3 a of the capacitor element 2 is conducted through the covering member 11 and is dissipated to the heat radiating member 7.

  Hereinafter, effects of the capacitor module 1 of the present embodiment will be described.

  According to the capacitor module 1, it is possible to efficiently dissipate the heat of the entire capacitor element 2 to the outside. This is because the capacitor module 1 has the core material 5, the heat radiating member 7, and the covering member 11, and dissipates the heat of the capacitor element 2 through these.

  First, the heat generated by the heat generated by the capacitor element 2 is likely to be trapped in the vicinity of the center of the capacitor element 2, and this heat is dissipated through the core member 5 disposed at the winding shaft portion of the capacitor element 2. 7, and further from the heat dissipation member 7 to the outside of the capacitor module 1. On the other hand, regarding the heat near the outer surface of the capacitor element 2, the heat near the flat surface 3 b is dissipated to the outside of the capacitor module 1 through the heat radiating member 7, and the heat near the flat surface 3 a is transferred to the heat radiating member 7 by the covering member 11. After being conducted, it is dissipated outside the capacitor module 1.

  Thus, according to the capacitor module 1, it is possible to dissipate heat inside and outside the capacitor element 2 to the outside at the same time, and heat of the entire capacitor element 2 can be dissipated efficiently. In the capacitor module 1, both ends of the core material 5 are connected to the core material connection portion 9 a and the core material connection portion 9 b in order to dissipate heat more efficiently. It is good also as a structure which makes an edge part protrude from the metallicon electrode 4a or the metallicon electrode 4b, and connects this with the core material connection part 9a or the core material connection part 9b.

  In the capacitor module 1, the insulation between the covering member 11 and the flat surface 3 a of the capacitor element 2 is performed by electrostatically coating the covering member 11 with an insulating resin. By using the electrostatic coating method, it is possible to suppress the occurrence of a pinhole or the like that short-circuits the flat surface 3a and the covering member 11, and the flat surface 3a and the covering member 11 can be insulated with high accuracy. Further, according to the electrostatic coating method, it is possible to form an insulating layer on the surface of the covering member 11 with no problem even on a complicatedly shaped portion, such as a curved portion such as a curved surface portion 13a or a curved surface portion 13b. In this case, a uniform insulating layer can be formed without any gap. Therefore, in the capacitor module 1, it is particularly suitable to use an electrostatic coating method in order to ensure insulation between the flat surface 3 a and the covering member 11.

  As described above, in the capacitor module 1, the insulating resin is applied to the covering member 11 by the electrostatic coating method. However, the insulating resin is applied to the outer surface of the capacitor element 2 instead of the covering member 11. May be painted. Also by performing electrostatic coating on the outer surface of the capacitor element 2, sufficient insulation between the flat surface 3a and the covering member 11 can be ensured. However, the insulation between the flat surface 3b of the capacitor element 2 and the base portion 8 of the heat dissipation member 7 is preferably performed by an insulating sheet. This is because the insulating sheet has flexibility, can contact the flat surface 3b and the surface of the base 8 with a sufficient adhesion area, and can efficiently dissipate the heat of the capacitor element 2. .

  In the capacitor module 1, the connecting portions 14 a and 14 b of the covering member 11 are connected to the covering member connecting portion 10 a and the covering member connecting portion 10 b of the heat radiating member 7 using ultrasonic bonding. That is, the connecting part 14a and the connecting part 14b are pressed against the covering member connecting part 10a and the covering member connecting part 10b to be joined, respectively, and further melted instantaneously by being vibrated by ultrasonic waves to solidify this. It is connected by letting. In this way, by vibrating with ultrasonic waves, the surfaces of the connecting portion 14a and the connecting portion 14b, and the oxide film on the surfaces of the covering member connecting portion 10a and the covering member connecting portion 10b can be scraped off and connected as a result. The heat of the capacitor element 2 can be efficiently conducted to the heat radiating member 7.

  For the same reason, in the capacitor module 1, both end portions of the core material 5 are connected to the core material connection portion 9a and the core material connection portion 9b by ultrasonic bonding.

(Embodiment 2)
Hereinafter, the capacitor module 21 of the present embodiment will be described with reference to FIG. FIG. 3 is a perspective view showing the configuration of the capacitor module 21. In addition, about the capacitor | condenser module 21 of this Embodiment, description is abbreviate | omitted about the structure similar to the capacitor | condenser module 1 of Embodiment 1, and attaches | subjects the same number in FIG.

  As shown in FIG. 3, the capacitor module 21 of the present embodiment is different from the capacitor module 1 of the first embodiment in the configuration of the covering member 22.

  That is, the covering member 22 has a plate-like portion 23, a pair of curved surface portions 24a, a curved surface portion 24b, a pair of connecting portions 25a, and a connecting portion 25b (the connecting portion 25b is not shown). The covering member 22 is similar to the covering member 11 of the module 1, but the covering member 22 further includes an extended portion 26a, an extended portion 26b, and an extended portion 26c that are integrally extended with the covering member 22 in the vicinity of the curved surface portion 24a and the curved surface portion 24b. , And has an extended portion 26d.

  These extension part 26a, extension part 26b, extension part 26c, and extension part 26d have a fan shape as shown in FIG. 3, and cover a part of the metallicon electrode 4a and the metallicon electrode 4b. .

  As described above, in the capacitor module 21, the extending portion 26 a, the extending portion 26 b, the extending portion 26 c, and the extending portion 26 d are extended on the covering member 22, so that heat near the metallicon electrode 4 a and the metallicon electrode 4 b is obtained. Is also diffused to the heat radiating member 7.

  Further, the extension part 26a, the extension part 26b, the extension part 26c, and the extension part 26d are respectively opposed to each other in a pair of extension part 26a and extension part 26b, and extension part 26c and extension part 26d. The capacitor element 2 is sandwiched between the extension part 26a and the extension part 26b, and between the extension part 26c and the extension part 26d. That is, the distance between the opposing surfaces of the extension part 26a (extension part 26c) and the extension part 26b (extension part 26d) is the same or slightly longer than the length between both end faces of the capacitor element 2. 26a (extension part 26c) and the extension part 26b (extension part 26d) are designed so that the distance between the opposing surfaces is short, and when the capacitor element 2 is fitted into the covering member 22, the capacitor element 2 Is held by receiving the elastic force of the extending portion 26a, the extending portion 26b, the extending portion 26c, and the extending portion 26d. Therefore, with this configuration, the contact between the metallicon electrode 4a, the metallicon electrode 4b and the flat surface 3a, and the inner surface of the covering member 22 is firmly maintained, and the heat of the capacitor element 2 is more stably dissipated in the heat dissipation member. 7 will be dissipated.

(Embodiment 3)
Hereinafter, the capacitor module 31 of the present embodiment will be described with reference to FIGS. 4 (a), 4 (b), and 4 (c). FIG. 4A is a diagram showing the configuration of the capacitor element 2 and the heat radiating member 32 used in the capacitor module 31, and FIG. FIG. 4C is a perspective view showing the configuration of the capacitor module 31.

  As shown in FIG. 4A, the capacitor element 2 and the heat radiating member 32 used in the capacitor module 31 are in a state where the capacitor element 2 is placed on the heat radiating member 32, and further the capacitor element 2 and the heat radiating member. An insulating sheet (not shown) having a high thermal conductivity is disposed between 32. Further, both end portions of the core material 5 are connected to the core material connection portion 33a and the core material connection portion 33b. The heat radiating member 32 is slightly different in shape from the heat radiating member 7 used in the capacitor module 1 of the first embodiment, and does not include the covering member connecting portion 10a and the covering member connecting portion 10b.

  Then, after the insulating treatment is performed on the capacitor element 2 and the bus bar 6a and the bus bar 6b in this state, the capacitor module 31 shown in FIG. 4C is completed by further performing metal spraying on the entire surface.

  As shown in FIG. 4B, an insulating layer 34 is provided on the capacitor element 2, the bus bar 6a, and the bus bar 6b to perform an insulation process.

  The insulating layer 34 is formed by coating an insulating resin such as an epoxy resin to which a filler having high thermal conductivity such as magnesium oxide, aluminum oxide, and aluminum nitride is added by electrostatic coating. The insulating layer 34 is for preventing the sprayed metal layer 35, the capacitor element 2, the bus bar 6a, and the bus bar 6b shown in FIG. 4C from being short-circuited. Therefore, as shown in FIG. 4B, it is necessary to provide an insulating layer 34 at least on the entire portion of the capacitor element 2 and the bus bar 6a and the end of the bus bar 6b on the external connection side. Note that the insulating resin is prevented from adhering to the external connection side ends of the heat radiation member 32, the core member 5, the bus bar 6a, and the bus bar 6b by masking.

  Further, as shown in FIG. 4A, since the insulating resin is electrostatically coated on the capacitor element 2 placed on the heat radiating member 32, an insulating property is provided on the flat surface 3b side of the capacitor element 2. Resin does not adhere. This is because the heat of the capacitor element 2 can be more efficiently dissipated when the flat surface 3b is insulated by the above-described insulating sheet. That is, when the flat surface 3b is insulated by coating with an insulating resin, the cured insulating resin has irregularities on the surface, so that the cured insulating resin and the heat dissipation member 32 have a poor contact area. The heat of the capacitor element 2 cannot be dissipated efficiently. On the other hand, since the insulating sheet has flexibility, it can contact the heat radiating member 32 and the capacitor element 2 in a sufficient area, and can efficiently dissipate the heat of the capacitor element 2. For this reason, the flat surface 3b is insulated by an insulating sheet.

  And the capacitor | condenser module 31 shown in FIG.4 (c) is completed by providing the thermal spray metal layer 35 by metal spraying further. The capacitor module 31 uses aluminum for metal spraying.

  As shown in FIG. 4C, the sprayed metal layer 35 continuously covers the entire capacitor element 2, the core material 5, and the heat dissipation member 32. From the sprayed metal layer 35, the outside of the bus bar 6a and the bus bar 6b. The end on the connection side and a part of the insulating layer 34 in the vicinity of this end are exposed. The sprayed metal layer 35 also covers the surface of the heat radiating member 32 on which the capacitor element 2 is placed and the outer periphery of the heat radiating member 32. The thermal spray metal layer 35 is not provided on the back surface (the surface not shown in FIG. 4C) of the surface of the heat radiating member 32 on which the capacitor element 2 is placed. Alternatively, the thermal spray metal layer 35 may be coated.

  Thus, in the capacitor module 31, by covering the capacitor element 2 with the sprayed metal layer 35, the heat of the capacitor element 2 can be dissipated to the heat radiating member 32 through the sprayed metal layer 35. In particular, since the entire capacitor element 2 is covered with the capacitor module 31, the heat of the entire capacitor element 2 can be dissipated to the heat radiating member 32 without remaining.

  Further, due to the contact resistance with the metallicon electrode 4a and the metallicon electrode 4b, the end of the bus bar 6a and the bus bar 6b on the capacitor element 2 side is one of the portions where heat is likely to be generated. Here, in the capacitor module 31, the ends of the bus bar 6 a and the bus bar 6 b on the capacitor element 2 side are also covered with the sprayed metal layer 35, so that the heat generated by the contact resistance is also dissipated to the heat radiating member 32. be able to.

  Further, in the capacitor module 31, the sprayed metal layer 35 covers the surface of the heat radiating member 32 on which the capacitor element 2 is placed and the outer periphery of the heat radiating member 32. Since the area is very large, the heat of the capacitor element 2 can be efficiently dissipated to the heat radiating member.

  As described above, the capacitor module of the present invention can efficiently dissipate the heat of the entire capacitor element to the outside.

  In addition, when mounting the capacitor module 1, the capacitor module 21, and the capacitor module 31, in order to prevent a short circuit with other peripheral devices and a thermal effect from other peripheral devices, the insulating and heat insulating properties are excellent. Additional layers may be provided.

  Further, the present invention is not limited to the aspect of the capacitor module of each of the embodiments described so far, and can be implemented with various modifications within the scope of the invention.

  The capacitor according to the present invention can efficiently dissipate heat of the entire capacitor element to the outside. Therefore, it can be suitably employed as a metalized film capacitor application for a hybrid vehicle that requires high heat dissipation against heat received from the external environment and heat generated by the capacitor element itself.

DESCRIPTION OF SYMBOLS 1 Capacitor module 2 Capacitor element 3a, 3b Flat surface 4a, 4b Metallicon electrode 5 Core material 6a, 6b Bus bar 7 Heat radiation member 8 Base part 9a, 9b Core material connection part 10a, 10b Cover member connection part 11 Cover member 12 Plate-like part 13a , 13b Curved part 14a, 14b Connection part 21 Capacitor module 22 Cover member 23 Plate-like part 24a, 24b Curved part 25a, 25b Connection part 26a, 26b, 26c, 26d Extension part 31 Capacitor module 32 Heat radiation member 33a, 33b Core material Connection part 34 Insulating layer 35 Thermal spray metal layer

Claims (9)

A flat capacitor element formed by winding a pair of metallized films and provided with metallicon electrodes on both end faces;
A core member disposed on a winding shaft portion of the capacitor element, and having at least one end projecting from the metallicon electrode of the capacitor element; and
A heat dissipating member that is in contact with one flat surface of the capacitor element and to which one end of the core member is connected,
A capacitor module comprising a metal covering member that covers the other flat surface of the capacitor element and a part of which is connected to the heat dissipation member. The capacitor module according to claim 1, wherein insulation of the other flat surface of the capacitor element and the covering member is ensured by applying an insulating resin to the covering member by an electrostatic coating method. The capacitor module according to claim 1, wherein insulation between the capacitor element, the heat radiating member, and the covering member is secured by applying an insulating resin to the capacitor element by an electrostatic coating method. The capacitor module according to claim 1, wherein the covering member and the heat dissipation member are connected by ultrasonic bonding. The capacitor module according to claim 1, wherein one end of the core member and the heat dissipation member are connected by ultrasonic bonding. The covering member has an extending portion that covers a part of the metallicon electrode of the capacitor element,
The capacitor module according to claim 1, wherein the covering member and the extending portion are integrally formed. At least a pair of the extending portions are provided at positions facing each other of the covering member,
The capacitor module according to claim 6, wherein the capacitor element is sandwiched between the pair of the extending portions. A flat capacitor element formed by winding a pair of metallized films and provided with metallicon electrodes on both end faces;
A core member disposed on a winding shaft portion of the capacitor element, and having at least one end projecting from the metallicon electrode of the capacitor element; and
A heat dissipating member in contact with one flat surface of the capacitor element and connected to the one end of the core member;
A capacitor module in which the other flat surface of the capacitor element and a part of the heat radiating member are continuously covered with a sprayed metal layer formed by metal spraying. The other flat surface of the capacitor element and the sprayed metal layer are insulated by an insulating layer interposed between the other flat surface of the capacitor element and the sprayed metal layer,
The capacitor module according to claim 8, wherein the insulating layer is formed by electrostatically coating an insulating resin on at least the other flat surface of the capacitor element.

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