JP3843776B2

JP3843776B2 - Metallized film capacitors

Info

Publication number: JP3843776B2
Application number: JP2001244346A
Authority: JP
Inventors: 和夫室賀; 孝雄吉原; 秀樹小平
Original assignee: Hitachi AIC Inc
Current assignee: Hitachi AIC Inc
Priority date: 2001-08-10
Filing date: 2001-08-10
Publication date: 2006-11-08
Anticipated expiration: 2021-08-10
Also published as: JP2003059752A

Description

【０００１】
【発明の属する技術分野】
本発明は、金属化フィルムコンデンサに関し、特に外装体としての樹脂ケース内に樹脂封止されて配設される電極はみ出し型の金属化フィルムコンデンサ等において、放熱および遮熱効果に優れた金属化フィルムコンデンサに関するものである。
【０００２】
【従来の技術】
通電によるコンデンサ素子の発熱を効率よく放熱させるようにした金属化フィルムコンデンサとしては、例えば特開平２０００−２７７３７７号公報に開示された乾式金属化フィルムコンデンサが知られている。この金属化フィルムコンデンサは、２枚の金属化フィルムを重ね合わせて巻回し、その巻回端面に金属を溶射して電極部（メタリコン電極）としたコンデンサ素子を複数個並列に接続するとともに各コンデンサ素子間に放熱板を介挿してコンデンサ素体とし、このコンデンサ素体を金属ケースに収納して絶縁性樹脂で封止し、外部引出用端子と放熱板の一端部をケース外部に突出させたものである。
【０００３】
また、実開平５−４３５３３号公報に記載された乾式高圧進相コンデンサは、絶縁樹脂ポッティングコンデンサを２列に配列し、これらのコンデンサ群の間に金属板または熱伝導率の高い絶縁板からなる放熱板を介挿し、この放熱板の一部を外装金属ケースの内面に熱伝導可能に接触させたものである。
【０００４】
この他、コンデンサ素子に接続される接続板に放熱板を兼用させたり、コンデンサ素子に接続されるリード端子と放熱板とを一体化させることにより放熱効果を向上させるようにした電解コンデンサ（特開平６−１０６３６１号公報、特開平１１−２１９８５４号公報等）も知られている。
【０００５】
【発明が解決しようとする課題】
上記したように、従来の金属化フィルムコンデンサは、コンデンサ素子の発熱を効率よく放熱し熱による特性の劣化や寿命を改善するための手段として放熱板を用いている。しかしながら、特に、絶縁ゲートバイポーラトランジスタ（ＩＧＢＴ）等の他の発熱部品の付近に配置して使用されるコンデンサの場合は、放熱効果に優れているだけでは不十分であり、外部からの熱を遮断しコンデンサ素子に伝わらないようにする必要がある。
【０００６】
また、コンデンサ素子の特性（ｔａｎδ、絶縁抵抗等）の劣化の要因の一つとして、コンデンサ素子内への水分の浸入がある。すなわち、コンデンサ素子は、幅方向の一側縁部が非蒸着部分（マージン部）となるように金属箔を蒸着によって形成してなる金属化フィルムを、マージン部が交互に左右反対になるようにずらして２枚重ね合わせて巻回し、その各巻回端面に金属の溶射によって形成したメタリコン電極と前記金属箔を電気的に接続しているため、一方のメタリコン電極に接続された金属化フィルムのマージン部側の端と、他方のメタリコン電極との間に、断面が金属化フィルムの厚さ×金属化フィルムのずらし幅の寸法の空隙が形成されている。そして、コンデンサ素子は外周面に金属箔を形成しないフィルムのみを巻回し、幅方向に所定の隙間でヒートシールして巻き止めしている。このため、空気中の水分がケース等の外装を透過し、巻回端部のヒートシールされていない部分を通って前記空隙に浸入する。また、水分はコンデンサ素子の周面のフィルムを直接透過することによって浸入する。そして、これらの浸入した水分により金属箔が腐食する。
【０００７】
本発明は上記した従来の問題を解決するためになされたもので、その目的とするところは、コンデンサ素子の発熱を効率よく放熱するとともに、外部からのコンデンサ素子への熱を良好に遮断することができ、また水分の浸入を防止しコンデンサの特性および寿命を改善し得るようにした金属化フィルムコンデンサを提供することにある。
【０００８】
【課題を解決するための手段】
上記目的を達成するために第１の発明は、金属化フィルムを巻回してその巻回端面にメタリコン電極をそれぞれ形成したコンデンサ素子と、このコンデンサ素子の各メタリコン電極にそれぞれ接合された２つの外部引出用端子板とを備え、これらの外部引出用端子板と前記コンデンサ素子を一方のみが開放するケース内に収納し、絶縁性を有する樹脂によって封止した金属化フィルムコンデンサにおいて、前記２つの外部引出用端子板のうち一方の外部引出用端子板を、前記コンデンサ素子の外周を取り囲み一端部が重ね合わせ部を形成するＵ字状板部と、このＵ字状板部の一端部側に折り曲げ形成された外部端子部と、前記Ｕ字状板部の他端部側に折り曲げ形成され前記コンデンサ素子の一方のメタリコン電極に接合された内部端子部とで構成したことにより、前記Ｕ字状板部が前記コンデンサ素子を収納する収納空間を形成し、前記Ｕ字状板部の開放部が前記コンデンサ素子を前記収納空間に挿入するための開放部を形成し、他方の外部引出用端子板を、側面視形状が略「Ｚ」字型に形成することにより、重ね合わせ部と、この重ね合わせ部の一側縁に折り曲げ形成された外部端子部および前記重ね合わせ部の他側縁に折り曲げ形成された内部端子部とで構成し、前記重ね合わせ部を前記外部引出用端子板のＵ字状板部の前記重ね合わせ部内面側に電気絶縁材入りの接着剤により接合し、前記内部端子部を前記コンデンサ素子の他方のメタリコン電極に接合し、前記外部引出用端子板の外部端子部を前記ケースの開口部から外部に突出させたものである。
この発明においては、外部引出用端子板の表面積が大きく、コンデンサ素子の発熱を効率よく放熱する。また、外部からの熱を遮断し、遮熱板としての機能をも有する。すなわち、外部引出用端子板は外部からの熱を受けるとこの熱を放熱するため、コンデンサ素子への熱的影響を軽減する。
２つの外部引出用端子板の重ね合わせ部を接合する接着剤は加熱によって溶けると厚さが減少するが、電気絶縁材の厚さは変化しない。したがって、２つの外部引出用端子板の重ね合わせ部は、電気絶縁材によって所定値以上の絶縁抵抗を維持する。
【０００９】
第２の発明は、上記第１の発明において、接着剤にポリエステル不織布プリプレグを用いたものである。
この発明において、外部引出用端子板の重ね合わせ部は、ポリエステル不織布の厚さによって所定値以上の絶縁抵抗を維持する。
【００１０】
第３の発明は、上記第１または第２の発明において、各外部引出用端子板の内部端子部を、幅の広い基部と、この基部に連設された端子片とで構成し、前記端子片をメタリコン電極に接合し、前記基部によって前記メタリコン電極の一部を覆ったものである。
この発明において、基部によりメタリコン電極の一部を覆い、水分がコンデンサ素子の周面のフィルムを透過して浸入したり、巻回端部から浸入したりする経路を長くする。したがって、水分が浸入し難く、水分によるコンデンサ素子のｔａｎδ（誘電正接）などの劣化が軽減され、コンデンサ素子の特性、寿命を改善することができる。また、基部は端子片の強度を高める。
【００１１】
【発明の実施の形態】
以下、本発明を図面に示す実施の形態に基づいて詳細に説明する。
図１は本発明に係る金属化フィルムコンデンサの一実施の形態を示す分解斜視図、図２は同コンデンサの断面図、図３は図２のIII −III 線断面図、図４は接着剤の断面図である。これらの図において、全体を符号１で示す金属化フィルムコンデンサは、コンデンサ素子２と、このコンデンサ素子２を内包する２つの端子板、すなわちプラス側およびマイナス側の外部引出用端子板３，４とを備え、樹脂製のケース５（以下、樹脂ケースという）に収納され、絶縁性を有する充填樹脂６によって封止されている。
【００１２】
前記コンデンサ素子２は、金属化フィルム、すなわち片面にアルミニウム等の蒸着によって金属箔（図１の斜線部分）１０が形成されたきわめて薄い帯状の絶縁フイルム（通常、ポリエステルフィルム）１１を幅方向にずらして２枚重ね合わせて所定の回数巻回することにより形成されたコンデンサ本体１２と、このコンデンサ本体１２の軸線方向の両端面（巻回端面）に金属の溶射によって形成した２つのメタリコン電極１３，１４とからなる所謂蒸着電極型コンデンサ素子が用いられる。
【００１３】
前記金属箔１０は、絶縁フィルム１１の幅方向の一側縁に沿って蒸着され、当該フィルム１１より狭い幅を有している。このため、絶縁フィルム１１の他側縁側は、金属箔１０が蒸着されず、非蒸着部分（マージン部）１５を形成している。このような絶縁フィルム１１はマージン部１５が交互に左右反対になるように２枚重ね合わされて巻回されることにより、各メタリコン電極１３，１４と金属箔１０との電気的接続を可能にしている。絶縁フィルム１１の巻き終わり端付近は、バーンオフ処理によって金属箔１０が除去され、かつヒートシールされる。そして、絶縁フィルム１１は、コンデンサ本体１２を長さＬ（長軸方向の寸法）、幅Ｗ（短軸方向の寸法）、高さＨ（メタリコン電極１３，１４間の寸法）の長円形の柱状体に扁平化して前記メタリコン電極１３，１４を設けた後、静電容量を安定化させる加熱工程で所定温度（１００〜１５０℃）で一定時間（３〜１０時間程度）熱処理されることにより収縮される。前記各メタリコン電極１３，１４は、銅、亜鉛、錫、半田等の金属または合金を溶射することによって形成される。
【００１４】
前記プラス側外部引出用端子板３は、銅板（Ｃ１１００１／４Ｈ）製で、前記コンデンサ素子２を内包する形状、すなわちコンデンサ素子２の周囲（本実施の形態においては、周面と一方のメタリコン電極１３の一部）を覆う形状に形成されることにより、端子板本来の機能に加えて放熱機能と遮熱機能を有している。このため、プラス側外部引出用端子板３は、コンデンサ素子２の外周を取り囲むＵ字状の板部３Ａと、このＵ字状板部３Ａの一端部側に折り曲げによって形成した矩形板状の外部端子部３Ｂと、Ｕ字状板部３Ａの他端部側に同じく折り曲げによって形成した内部端子部３Ｃとで構成されている。
【００１５】
前記Ｕ字状板部３Ａは、前記コンデンサ素子２を収納するに十分な収納空間１７を有し、長手方向の両端側開放部１８ａ側からコンデンサ素子２が挿入されることにより、コンデンサ素子２の周面のうちの幅方向において対向する２つの平板部１２ａ，１２ｂと、長軸方向において対向する２つの曲面部１２ｃ，１２ｄのうちのいずれか一方、例えば曲面部１２ｃを覆う。Ｕ字状板部３Ａの前記外部端子部３Ｂが設けられている長手方向の一端部側は、前記マイナス側外部引出用端子板４との重ね合わせ部２０を形成している。Ｕ字状板部３Ａの幅は、コンデンサ素子２の高さＨと略等しい。
【００１６】
前記外部端子部３Ｂは、Ｕ字状板部３Ａの一側縁１９ａの一端部側にＵ字状板部３Ａと略直交するように表面側に折り曲げ形成されており、２つのねじ取付孔２１を有している。また、外部端子部３Ｂは、図２に示すように前記樹脂ケース５の開口部５Ａから外部に突出し、板状の接続端子（またはリード線）２２を介して所要の電流（例えば、５０Ａ、１００ＫZ ）が供給されるようになっている。なお、外部端子２２は、外部端子部３Ｂに止めねじ２３とナット２４によって固定される。
【００１７】
前記内部端子部３Ｃは、Ｕ字状板部３Ａの他側縁１９ｂの他端部側にＵ字状板部３Ａと略直交するように裏面側に折り曲げ形成されることにより、前記収納空間１７の他側縁１９ｂ側の開放部１８ｃを覆っている。また、内部端子部３Ｃは、櫛歯状に形成されることにより細長い５本の端子片２６と、これらの端子片２６の基部を連結する細長い基部２７とで構成されている。各端子片２６の先端部は、前記メタリコン電極１３の表面に溶接、半田付け、スポット溶接等によってそれぞれ接続される。端子片２６の数は５本に限らず１本以上あればよく適宜増減し得ることはいうまでもない。このように、内部端子部３Ｃを細長い複数本の端子片２６で構成すると、各端子片２６の熱容量を小さくすることができるため、接合時の熱衝撃による絶縁フィルム１１とメタリコン電極１３の接合状態を損傷する度合が少なく、またコンデンサの負荷電流容量が大きい場合に電流が平均的に分散して流れ局部的な過熱を防止することができる。前記基部２７は、コンデンサ素子２の一方のメタリコン電極１３の一部を覆い、水分がコンデンサ本体１２内に浸入するのを防止する。
【００１８】
前記マイナス側外部引出用端子板４は、前記プラス側外部引出用端子板３と同様に銅板（Ｃ１１００１／４Ｈ）製で、側面視形状が略「Ｚ」字型に形成されることにより、矩形板状の重ね合わせ部４Ａと、外部端子部４Ｂおよび内部端子部４Ｃとからなり、端子板本来の機能に加えて放熱機能と遮熱機能を有している。
【００１９】
前記重ね合わせ部４Ａは、前記プラス側外部引出用端子板３のＵ字状板部３Ａの幅より大きな幅を有し、前記重ね合わせ部２０の内面側に接着剤３０によって接合される。
【００２０】
前記外部端子部４Ｂと前記内部端子部４Ｃは、前記プラス側外部引出用端子板３の外部端子部３Ｂ、内部端子部３Ｃとそれぞれ対向するように、前記重ね合わせ部４Ａの幅方向両側縁にそれぞれ設けられている。この場合、外部端子部４Ｂは、前記重ね合わせ部４Ａの一方の側縁に重ね合わせ部４Ａと略直交するように表面側に折り曲げ形成されている。また、外部端子部４Ｂは、分岐した２つの端子部４Ｂ-1，４Ｂ-2とで構成されている。各端子部４Ｂ-1，４Ｂ-2は、ねじ取付孔３３を有している。そして、これらの端子部４Ｂ-1，４Ｂ-2は、図２に示すように前記樹脂ケース５の開口部５Ａから外部に突出して前記外部端子３Ｂと対向し、板状の接続端子３４が止めねじ３５とナット３６によって接続固定されている。
【００２１】
前記内部端子部４Ｃは、前記重ね合わせ部４Ａの前記外部端子部４Ｂ側とは反対側の側縁に重ね合わせ部４Ａと略直交するように裏面側に折り曲げ形成されることにより、プラス側とマイナス側外部引出用端子板３，４が一体的に接合された状態において前記Ｕ字状板部３Ａの他側縁１９ｂ側の開放部１８ｂを覆う。また、内部端子部４Ｃは、プラス側外部引出用端子板３の内部端子部３Ｃと同様に、櫛歯状に形成されることにより細長い６本の端子片３７と、これらの端子片３７の基部を連結する細長い基部３８とで構成されている。各端子片３７の先端部は、前記メタリコン電極１４の表面に溶接、半田付け、スポット溶接等によってそれぞれ接続固定される。端子片３７の数は６本に限らず１本以上であればよく適宜増減し得ることはいうまでもない。前記基部３８は、前記メタリコン電極１４の一部を覆い、水分がコンデンサ本体１２内に浸入するのを防止する。
【００２２】
前記プラス側外部引出用端子板３の重ね合わせ部２０とマイナス側外部引出用端子板４の重ね合わせ部４Ａを接合する前記接着剤３０としては、電気絶縁材入りの接着剤、例えば図４に示すポリエステル不織布ポリプレグ（日東シンコー株式会社製）が用いられる。この接着剤３０は、粘着層４１の両面にセパレーター４２と、ポリエステル不織布４３の入った熱硬化性の特殊配合エポキシ樹脂（フィルム）４４を貼着したもので、ポリエステル不織布４３を電気絶縁材として用いている。このような接着剤３０を用いると前記重ね合わせ部２０，４Ａを加熱加圧して接着したとき、エポキシ樹脂４４が溶けて厚さが減少してもポリエステル不織布４３の厚さは殆ど変化しないので、両接合部２０，４Ａの間隔がポリエステル不織布４３の厚さ以下に狭まることがないので、所定値以上の絶縁抵抗を維持できる。接着剤３０によって重ね合わせ部４Ａ，２０を接合するときは、セパレーター４２を剥離して粘着層４１を例えば重ね合わせ部４Ａの表面に接着し、その上に重ね合わせ部２０を重ね合わせた後、これら重ね合わせ部４Ａ，２０を所定温度に加熱するとともに加圧して粘着層４１と特殊配合エポキシ樹脂フィルム４４を溶かし、硬化した後冷却固化させる。
【００２３】
前記樹脂ケース５は、エポキシ樹脂等によって前方に開放する矩形箱型に形成されて、前記コンデンサ素子２等を収納し得る大きさを有し、また内底面にはプラス側外部引出用端子板３のＵ字状板部３Ａを受け止めコンデンサ素子２等の挿入量を規定する２つの突状体４５が一体に突設されている。樹脂ケース５に収納されたコンデンサ素子２を封止する前記絶縁樹脂６としては、エポキシ樹脂、ポリウレタン樹脂等の熱硬化性樹脂が用いられる。このコンデンサ素子２を樹脂封止した状態において、プラス、マイナス側外部引出用端子板３，４の外部端子部３Ｂ，４Ｂは、ケース外部に突出しており、前記接続端子２２，３４が接続される。
【００２４】
前記プラス、マイナス側外部引出用端子板３，４の製作方法の一例を図５および図６に基づいて説明する。
先ず、所要の板厚を有する銅板をプレス加工によって打ち抜き、平板状のプラス側外部引出用端子板３’（図５（ａ））と、同じく平板状のマイナス側外部引出用端子板４’を製作する（図５（ｂ））。
【００２５】
平板状のプラス側外部引出用端子板３’は、前記プラス側外部引出用端子板３を展開した形状である。このため、Ｕ字状に折り曲げられる前の板部３Ａ’と、外部端子部３Ｂおよび内部端子部３Ｃを有している。外部端子部３Ｂと内部端子部３Ｃは、前記板部３Ａ’と同一平面を形成している。また、外部端子部３Ｂはねじ取付孔２１を有し、内部端子部３Ｃは櫛歯状に形成されている。
【００２６】
平板状のマイナス側外部引出用端子板４’は、前記マイナス側外部引出用端子板４を展開した形状である。このため、重ね合わせ部４Ａ、外部端子部４Ｂおよび内部端子部４Ｃを有し、これらは同一平面を形成している。また、外部端子部４Ｂはねじ取付孔３３を有し、内部端子部４Ｃは櫛歯状に形成されている。
【００２７】
次に、前記プラス側外部引出用端子板３’の重ね合わせ部２０とマイナス側外部引出用端子板４’の重ね合わせ部４Ａを前記電気絶縁材入りの接着剤３０（セパレータ４２は剥離されている）を介して重ね合わせ、これら重ね合わせ部４Ａ，２０を互いに接合する。図６はこの状態を示す。
【００２８】
次に、プラス側外部引出用端子板３’の板部３Ａ’、外部端子部３Ｂ、内部端子部３Ｃおよびマイナス側外部引出用端子板４’の外部端子部４Ｂ、内部端子部４Ｃを図５に２点鎖線で示すようにそれぞれ矢印方向に折り曲げると、一体的に接合されたプラス側外部引出用端子板３とマイナス側外部引出用端子板４を製作することができる。折り曲げる際の順序は、折り曲げによっては干渉しないため、特に制約されるものでない。例えば、先ず始めにプラス側外部引出用端子板３’の板部３Ａ’をＵ字状に折り曲げて内部端子部４Ｃをマイナス側外部引出用端子板４’の外部端子部４Ｂと対向させ、しかる後外部端子部３Ｂ、内部端子部３Ｃ、外部端子部４Ｂ、内部端子部４Ｃを順次折り曲げるようにすればよい。
【００２９】
このように、プラス側外部引出用端子板３’の重ね合わせ部２０とマイナス側外部引出用端子板４’の重ね合わせ部４Ａを重ね合わせて接着剤３０で接合した後、外部端子部３Ｂ、内部端子部３Ｃ、外部端子部４Ｂ、内部端子部４Ｃを順次折り曲げると、予めプラス側外部引出用端子板３とマイナス側外部引出用端子板４の位置関係を決めることができるので、その後のコンデンサ素子２の取付け作業が容易である。
【００３０】
このような構造からなる金属化フィルムコンデンサ１においては、プラス側とマイナス側の外部引出用端子板３，４によって放熱と遮熱を効率よく行うことができる以下、その理由を説明する。
【００３１】
プラス側とマイナス側の外部引出用端子板３，４は大きな表面積を有し、しかもコンデンサ素子２を内包することで、プラス側外部引出用端子板３のＵ字状板部３Ａとマイナス側外部引出用端子板４の重ね合わせ部４Ａとでコンデンサ素子２の外周の互いに対向する２つの平面部１２ａ，１２ｂと一方の曲面部１２ｃを覆い、内側端子部３Ｃ，４Ｃによってメタリコン電極１３，１４の表面の一部を覆っているので、コンデンサ素子２からの熱の伝導が良好で、効率よく放熱し、ヒートシンクとして機能する。また、プラス側とマイナス側の外部引出用端子板３，４は、コンデンサ素子２からの熱を絶縁樹脂６を介して樹脂ケース５に逃がし、放熱効果を高める。
【００３２】
また、外部の熱が樹脂ケース５を通って内部に伝わっても、プラス側とマイナス側の外部引出用端子板３，４はその熱を受けて放熱することで、外部からの熱がコンデンサ素子２に伝わるのを遮断し、遮熱板として機能する。したがって、放熱効果と遮熱効果に優れ、コンデンサ素子２への熱的影響が少なく、高周波、大電流、大電圧が要求される金属化フィルムコンデンサに用いて好適である。
【００３３】
また、プラス側とマイナス側の外部引出用端子板３，４の内部端子部３Ｃ，４Ｃは、それぞれ櫛歯状に形成され、その基部２７，３８でメタリコン電極１３，１４の一部をそれぞれ覆っているので、コンデンサ素子２の周面のフィルム表面や巻回端部からの水分の浸入を軽減防止することができる。すなわち、空気中の水分は、樹脂ケース５に充填された絶縁樹脂６やこの樹脂６とプラス側、マイナス側外部引出用端子板３，４との隙間を通ってコンデンサ素子２の内部に浸入しようとするが、基部２７，３８が存在すると、コンデンサ素子２の周面のフィルムまでの経路や巻回端部までの経路が長くなるため、その分、水分の浸入が減少するかまた遅れ、水分によるコンデンサ素子の劣化を遅らせる。したがって、より長くコンデンサとしての正常な動作を維持でき、長寿命化を図ることができる。
【００３４】
また、プラス側とマイナス側の外部引出用端子板３，４を電気絶縁材入りの接着剤３０によって一体的に接合しているので、機械的強度が大きく、これら端子板３，４に外力が加わったとき、内部端子部３Ｃ，４Ｃとメタリコン電極１３，１４との接合部が剥離したり、端子板自体または内部端子部３Ｃ，４Ｃが変形したりすることが少なく、外部端子部３Ｂ，４Ｂを外部装置に対して確実に接続することができる。
【００３５】
なお、上記した実施の形態は、接着剤３０としてポリエステル不織布プリプレグを用いたが、本発明はこれに何ら限定されるものではなく、接着剤としてフェノール系、不飽和ポリエステル系等の他の熱硬化性樹脂を用いたり、電気絶縁材としてガラス繊維、多数の貫通孔を有する薄板状のポリアミド樹脂、ＰＰＳ樹脂等を用いてもよい。
また、コンデンサ素子２を外装被覆する構造としては、樹脂ケース５を用いた例を示したが、樹脂モールド法や樹脂ディップ法によって形成した外装体を用いてもよい。
【００３６】
【発明の効果】
以上説明したように本発明に係る金属化フィルムコンデンサによれば、放熱、遮熱効果に優れ、コンデンサの熱劣化を改善するととも、長寿命化を図ることができ、特に高周波、大電流、大電圧が要求される回路に用いて好適である。また、端子板に放熱機能と遮熱機能を併せもたせているため、別部材からなる放熱板と遮熱板を設ける必要がなく、部品点数を削減することができる。
【００３７】
また、本発明によれば、２つの端子板を電気絶縁材入りの接着剤によって接合しているので、機械的強度を増大させるとともに、両端子板間の絶縁抵抗を所定値以上に維持することができる。
【００３８】
さらに、本発明によれば、コンデンサ素子の周面のフィルム等からの水分の浸入を軽減防止するように構成したので、コンデンサの特性を安定に維持することができ、長寿命化を図ることことができる。さらに、内部端子部の基部は端子片の強度を高め、振動等による端子片の剥離を防止することができる。
【図面の簡単な説明】
【図１】本発明に係る金属化フィルムコンデンサの一実施の形態を示す分解斜視図である。
【図２】同コンデンサの断面図である。
【図３】図２のIII −III 線断面図である。
【図４】電気絶縁材入りの接着剤の断面図である。
【図５】（ａ）はプラス側外部引出用端子板を展開した図、（ｂ）はマイナス側外部引出用端子板を展開した図である。
【図６】プラス側外部引出用端子板とマイナス側外部引出用端子板を電気絶縁材入りの接着剤によって接合した状態を示す図である。
【符号の説明】
１…金属化フィルムコンデンサ、２…コンデンサ素子、３…プラス側外部引出用端子板、３Ａ…Ｕ字状板部、３Ｂ…外部端子部、３Ｃ…内部端子部、４…マイナス側外部引出用端子板、４Ａ…重ね合わせ部、４Ｂ…外部端子部、４Ｃ…内部端子部、５…樹脂ケース、６…絶縁樹脂、１０…金属箔、１２…コンデンサ本体、１３，１４…メタリコン電極、２０…重ね合わせ部、２７…基部、２８…接合部、３０…接着剤、３８…基部、３９…接合部、４３…ポリエステル不織布、４４…特殊配合エポキシ樹脂。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a metallized film capacitor, and more particularly, a metallized film excellent in heat dissipation and heat shielding effects in an electrode-extrusion type metallized film capacitor and the like disposed in a resin case as an exterior body. It relates to capacitors.
[0002]
[Prior art]
As a metallized film capacitor that efficiently dissipates heat generated by a capacitor element due to energization, for example, a dry metallized film capacitor disclosed in Japanese Unexamined Patent Publication No. 2000-277377 is known. In this metallized film capacitor, two metallized films are overlapped and wound, and a plurality of capacitor elements each having an electrode part (metallicone electrode) are sprayed on the wound end face and connected in parallel. A heat sink is inserted between the elements to form a capacitor body. This capacitor body is housed in a metal case and sealed with an insulating resin, and the external lead-out terminal and one end of the heat sink protrude outside the case. Is.
[0003]
Moreover, the dry type high voltage phase advance capacitor described in Japanese Utility Model Laid-Open No. 5-43533 has two rows of insulating resin potting capacitors, and is composed of a metal plate or an insulating plate having high thermal conductivity between these capacitor groups. A heat radiating plate is inserted, and a part of the heat radiating plate is brought into contact with the inner surface of the outer metal case so as to allow heat conduction.
[0004]
In addition to this, an electrolytic capacitor that improves the heat dissipation effect by making the connecting plate connected to the capacitor element also serve as a heat sink, or by integrating the lead terminal connected to the capacitor element and the heat sink (JP-A-HEI 6-106361, JP-A-11-219854, etc.) are also known.
[0005]
[Problems to be solved by the invention]
As described above, the conventional metalized film capacitor uses a heat dissipation plate as a means for efficiently radiating the heat generated by the capacitor element and improving the deterioration of characteristics and the life due to heat. However, especially in the case of capacitors used in the vicinity of other heat-generating components such as insulated gate bipolar transistors (IGBT), it is not sufficient to have a good heat dissipation effect, and heat from the outside is cut off. However, it is necessary not to be transmitted to the capacitor element.
[0006]
Further, as one of the causes of deterioration of the characteristics (tan δ, insulation resistance, etc.) of the capacitor element, there is moisture intrusion into the capacitor element. That is, the capacitor element is a metallized film formed by vapor deposition of a metal foil so that one side edge in the width direction becomes a non-deposition portion (margin portion), and the margin portions are alternately reversed left and right. Since the metal foil is formed by spraying metal on the winding end faces and the metal foil is electrically connected to each other, the margin of the metallized film connected to one metallicon electrode Between the part-side end and the other metallicon electrode, a gap having a cross-sectional dimension of the thickness of the metallized film × the shift width of the metallized film is formed. And the capacitor | condenser element winds only the film which does not form metal foil in an outer peripheral surface, and heat-seals it by the predetermined clearance gap in the width direction, and is preventing winding. For this reason, moisture in the air permeates through the exterior of the case or the like, and enters the gap through a portion of the winding end that is not heat-sealed. Moisture permeates through the film directly on the peripheral surface of the capacitor element. And metal foil corrodes with these infiltrated water | moisture contents.
[0007]
The present invention has been made to solve the above-described conventional problems, and its object is to efficiently dissipate the heat generated by the capacitor element and to effectively block heat from the outside to the capacitor element. It is another object of the present invention to provide a metallized film capacitor capable of preventing moisture from entering and improving capacitor characteristics and life.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, the first invention comprises a capacitor element in which a metallized film is wound and a metallicon electrode is formed on the winding end surface thereof, and two external parts joined to the respective metallicon electrodes of the capacitor element. A metallized film capacitor having a lead terminal plate, wherein the external lead terminal plate and the capacitor element are housed in a case where only one of them is opened and sealed with an insulating resin. One of the lead- out terminal plates is bent to a U-shaped plate portion that surrounds the outer periphery of the capacitor element and one end portion forms an overlapping portion, and one end portion side of the U-shaped plate portion. An external terminal portion formed and an internal terminal portion formed by bending to the other end portion side of the U-shaped plate portion and joined to one metallicon electrode of the capacitor element. As a result, the U-shaped plate portion forms a storage space for storing the capacitor element, and the open portion of the U-shaped plate portion forms an open portion for inserting the capacitor element into the storage space. The other external lead terminal plate is formed in a substantially “Z” shape in a side view so that the overlapped portion, the external terminal portion formed by being bent at one side edge of the overlapped portion, and the aforementioned And an internal terminal portion formed by bending the other side edge of the overlapping portion, and the overlapping portion is filled with an electrical insulating material on the inner surface side of the overlapping portion of the U-shaped plate portion of the external lead terminal plate. Bonding is performed using an adhesive, the internal terminal portion is bonded to the other metallicon electrode of the capacitor element, and the external terminal portion of the external lead terminal plate is projected outward from the opening of the case .
In this invention, the surface area of the external lead terminal plate is large, and the heat generated by the capacitor element is efficiently dissipated. Moreover, the heat from the outside is interrupted and it also has a function as a heat shield. That is, when the external lead terminal plate receives heat from the outside, it dissipates this heat, thus reducing the thermal influence on the capacitor element.
The thickness of the electrical insulating material does not change, although the thickness of the adhesive that joins the overlapping portions of the two external lead terminal boards is reduced when it is melted by heating. Therefore, the overlapping portion of the two external lead terminal boards maintains an insulation resistance of a predetermined value or more by the electrical insulating material.
[0009]
2nd invention uses the polyester nonwoven fabric prepreg for the adhesive agent in the said 1st invention.
In this invention, the overlapping portion of the external lead terminal plate maintains an insulation resistance of a predetermined value or more depending on the thickness of the polyester nonwoven fabric.
[0010]
According to a third aspect of the present invention, in the first or second aspect of the invention, the internal terminal portion of each external lead terminal plate includes a wide base portion and a terminal piece connected to the base portion, and the terminal A piece is joined to a metallicon electrode and a part of the metallicon electrode is covered by the base.
In the present invention, a part of the metallicon electrode is covered by the base, and the path through which moisture permeates through the film on the peripheral surface of the capacitor element and enters from the winding end is lengthened. Accordingly, it is difficult for moisture to enter, and deterioration of the capacitor element such as tan δ (dielectric loss tangent) due to moisture is reduced, and the characteristics and life of the capacitor element can be improved. Further, the base part increases the strength of the terminal piece.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings.
1 is an exploded perspective view showing an embodiment of a metalized film capacitor according to the present invention, FIG. 2 is a sectional view of the capacitor, FIG. 3 is a sectional view taken along line III-III in FIG. 2, and FIG. It is sectional drawing. In these drawings, a metallized film capacitor denoted by reference numeral 1 as a whole is composed of a capacitor element 2 and two terminal plates containing the capacitor element 2, that is, positive and negative external lead terminal plates 3 and 4; And is housed in a resin case 5 (hereinafter referred to as a resin case) and sealed with a filling resin 6 having insulating properties.
[0012]
The capacitor element 2 includes a metallized film, that is, an extremely thin strip-like insulating film (usually a polyester film) 11 having a metal foil (shaded portion in FIG. 1) 10 formed on one side by vapor deposition of aluminum or the like is shifted in the width direction. A capacitor body 12 formed by overlapping two sheets and winding a predetermined number of times, and two metallicon electrodes 13 formed by metal spraying on both end faces (winding end faces) in the axial direction of the capacitor body 12; A so-called vapor deposition electrode type capacitor element consisting of 14 is used.
[0013]
The metal foil 10 is vapor-deposited along one side edge of the insulating film 11 in the width direction and has a narrower width than the film 11. For this reason, the metal foil 10 is not deposited on the other side edge side of the insulating film 11, and a non-deposition portion (margin portion) 15 is formed. Two such insulating films 11 are wound with the margin portions 15 being alternately overlapped so that the left and right sides are opposite to each other, thereby enabling electrical connection between the metallicon electrodes 13 and 14 and the metal foil 10. Yes. In the vicinity of the winding end of the insulating film 11, the metal foil 10 is removed by heat-off treatment by a burn-off process. The insulating film 11 has an elliptical columnar shape in which the capacitor body 12 has a length L (dimension in the major axis direction), a width W (dimension in the minor axis direction), and a height H (dimension between the metallicon electrodes 13 and 14). After the body is flattened and the metallicon electrodes 13 and 14 are provided, it is contracted by heat treatment at a predetermined temperature (100 to 150 ° C.) for a certain time (about 3 to 10 hours) in a heating process for stabilizing the capacitance. Is done. Each of the metallicon electrodes 13 and 14 is formed by spraying a metal or alloy such as copper, zinc, tin, or solder.
[0014]
The positive-side external lead terminal plate 3 is made of a copper plate (C1100 1 / 4H) and has a shape including the capacitor element 2, that is, the periphery of the capacitor element 2 (in this embodiment, the peripheral surface and one metallicon In addition to the original function of the terminal board, it has a heat dissipation function and a heat shielding function. Therefore, the plus-side external lead terminal plate 3 includes a U-shaped plate portion 3A surrounding the outer periphery of the capacitor element 2, and a rectangular plate-shaped external portion formed by bending one end portion side of the U-shaped plate portion 3A. The terminal portion 3B and an internal terminal portion 3C formed by bending on the other end side of the U-shaped plate portion 3A.
[0015]
The U-shaped plate portion 3A has a storage space 17 sufficient to store the capacitor element 2, and the capacitor element 2 is inserted from both ends open side 18a in the longitudinal direction. One of the two flat plate portions 12a and 12b facing each other in the width direction and the two curved surface portions 12c and 12d facing each other in the major axis direction, for example, the curved surface portion 12c is covered. One end of the U-shaped plate portion 3 A in the longitudinal direction where the external terminal portion 3 B is provided forms an overlapping portion 20 with the minus-side external lead terminal plate 4. The width of the U-shaped plate portion 3 A is substantially equal to the height H of the capacitor element 2.
[0016]
The external terminal portion 3B is formed on the surface side so as to be substantially orthogonal to the U-shaped plate portion 3A on one end side of the one side edge 19a of the U-shaped plate portion 3A. have. Further, as shown in FIG. 2, the external terminal portion 3B projects to the outside from the opening 5A of the resin case 5, and a required current (for example, 50A, 100KZ) via the plate-like connection terminal (or lead wire) 22. ) Is supplied. The external terminal 22 is fixed to the external terminal portion 3B by a set screw 23 and a nut 24.
[0017]
The internal terminal portion 3C is bent and formed on the back surface side so as to be substantially orthogonal to the U-shaped plate portion 3A on the other end side of the other side edge 19b of the U-shaped plate portion 3A. The opening 18c on the other side edge 19b side is covered. The internal terminal portion 3 C is composed of five elongated terminal pieces 26 and an elongated base portion 27 that connects the base portions of the terminal pieces 26 by being formed in a comb shape. The tip of each terminal piece 26 is connected to the surface of the metallicon electrode 13 by welding, soldering, spot welding or the like. Needless to say, the number of the terminal pieces 26 is not limited to five, but may be one or more and may be increased or decreased as appropriate. In this way, when the internal terminal portion 3C is constituted by a plurality of elongated terminal pieces 26, the heat capacity of each terminal piece 26 can be reduced, so that the bonding state of the insulating film 11 and the metallicon electrode 13 due to the thermal shock at the time of bonding. When the load current capacity of the capacitor is large, the current is dispersed on an average, and local overheating can be prevented. The base 27 covers a part of the one metallicon electrode 13 of the capacitor element 2 and prevents moisture from entering the capacitor body 12.
[0018]
The minus side external lead terminal plate 4 is made of a copper plate (C1100 1 / 4H) like the plus side external lead terminal plate 3, and the side view shape is formed in a substantially “Z” shape. It consists of a rectangular plate-shaped overlapping portion 4A, an external terminal portion 4B, and an internal terminal portion 4C, and has a heat radiation function and a heat shielding function in addition to the original functions of the terminal plate.
[0019]
The overlapping portion 4 A has a width larger than the width of the U-shaped plate portion 3 A of the plus side external lead terminal plate 3, and is joined to the inner surface side of the overlapping portion 20 by an adhesive 30.
[0020]
The external terminal portion 4B and the internal terminal portion 4C are arranged on both side edges in the width direction of the overlapping portion 4A so as to face the external terminal portion 3B and the internal terminal portion 3C of the plus-side external lead terminal plate 3, respectively. Each is provided. In this case, the external terminal portion 4B is formed on the surface side so as to be substantially orthogonal to the overlapping portion 4A at one side edge of the overlapping portion 4A. The external terminal portion 4B includes two branched terminal portions 4B-1 and 4B-2. Each of the terminal portions 4B-1 and 4B-2 has a screw mounting hole 33. As shown in FIG. 2, these terminal portions 4B-1 and 4B-2 project outward from the opening 5A of the resin case 5 so as to face the external terminal 3B, and the plate-like connection terminals 34 are stopped. The screws 35 and nuts 36 are connected and fixed.
[0021]
The internal terminal portion 4C is bent on the back surface side so as to be substantially orthogonal to the overlapping portion 4A on the side edge of the overlapping portion 4A opposite to the external terminal portion 4B side, thereby forming a plus side. In the state where the minus-side external lead terminal plates 3 and 4 are integrally joined, the open portion 18b on the other side edge 19b side of the U-shaped plate portion 3A is covered. Similarly to the internal terminal portion 3C of the plus-side external lead terminal plate 3, the internal terminal portion 4C is formed in a comb-teeth shape to form six elongated terminal pieces 37 and the base portions of these terminal pieces 37. And an elongated base 38 that connects the two. The tip of each terminal piece 37 is connected and fixed to the surface of the metallicon electrode 14 by welding, soldering, spot welding or the like. Needless to say, the number of the terminal pieces 37 is not limited to six and may be one or more, and may be increased or decreased as appropriate. The base 38 covers a portion of the metallicon electrode 14 and prevents moisture from entering the capacitor body 12.
[0022]
As the adhesive 30 for joining the overlapping portion 20 of the plus-side external lead terminal plate 3 and the overlapping portion 4A of the minus-side external lead terminal plate 4, an adhesive containing an electrical insulating material, for example, as shown in FIG. A polyester nonwoven fabric polypreg (manufactured by Nitto Shinko Co., Ltd.) is used. This adhesive 30 is obtained by sticking a separator 42 and a thermosetting special compounded epoxy resin (film) 44 containing a polyester nonwoven fabric 43 on both sides of an adhesive layer 41, and using the polyester nonwoven fabric 43 as an electrical insulating material. ing. When such an adhesive 30 is used, the thickness of the polyester nonwoven fabric 43 hardly changes even when the overlapping portions 20 and 4A are bonded by heating and pressurizing and the epoxy resin 44 melts and the thickness decreases. Since the distance between the joint portions 20 and 4A does not narrow below the thickness of the polyester nonwoven fabric 43, an insulation resistance of a predetermined value or more can be maintained. When joining the overlapping portions 4A and 20 with the adhesive 30, after separating the separator 42 and adhering the adhesive layer 41 to the surface of the overlapping portion 4A, for example, and overlapping the overlapping portion 20 thereon, The overlapping portions 4A and 20 are heated to a predetermined temperature and pressurized to melt the adhesive layer 41 and the special blended epoxy resin film 44, and after curing, solidify by cooling.
[0023]
The resin case 5 is formed in a rectangular box shape that is opened forward by epoxy resin or the like, and has a size that can accommodate the capacitor element 2 and the like. Two projecting bodies 45 that receive the U-shaped plate portion 3A and define the insertion amount of the capacitor element 2 and the like are integrally projected. As the insulating resin 6 for sealing the capacitor element 2 accommodated in the resin case 5, a thermosetting resin such as an epoxy resin or a polyurethane resin is used. In a state where the capacitor element 2 is resin-sealed, the external terminal portions 3B and 4B of the positive and negative side external lead terminal plates 3 and 4 protrude to the outside of the case, and the connection terminals 22 and 34 are connected. .
[0024]
An example of a method of manufacturing the plus and minus side external lead terminal plates 3 and 4 will be described with reference to FIGS.
First, a copper plate having a required thickness is punched out by pressing, and a flat plate-like positive external lead terminal plate 3 ′ (FIG. 5A) and a flat plate-like negative external lead terminal plate 4 ′ are formed. Produced (FIG. 5B).
[0025]
The flat plus-side external lead terminal plate 3 ′ has a shape in which the plus-side external lead terminal plate 3 is developed. For this reason, it has plate part 3A 'before bending in U shape, the external terminal part 3B, and the internal terminal part 3C. The external terminal portion 3B and the internal terminal portion 3C form the same plane as the plate portion 3A ′. The external terminal portion 3B has a screw mounting hole 21, and the internal terminal portion 3C is formed in a comb shape.
[0026]
The flat negative-side external lead terminal plate 4 ′ has a shape in which the negative-side external lead terminal plate 4 is developed. For this reason, it has the overlap part 4A, the external terminal part 4B, and the internal terminal part 4C, and these form the same plane. The external terminal portion 4B has a screw mounting hole 33, and the internal terminal portion 4C is formed in a comb shape.
[0027]
Next, the overlapping portion 20 of the plus side external lead terminal plate 3 ′ and the overlap portion 4A of the minus side external lead terminal plate 4 ′ are bonded to the adhesive 30 containing the electrical insulating material (the separator 42 is peeled off). The overlapping portions 4A and 20 are joined to each other. FIG. 6 shows this state.
[0028]
Next, the plate portion 3A ′, the external terminal portion 3B, the internal terminal portion 3C of the plus side external lead terminal plate 3 ′, and the external terminal portion 4B and the internal terminal portion 4C of the minus side external lead terminal plate 4 ′ are shown in FIG. As shown by the two-dot chain line, the plus-side external lead terminal plate 3 and the minus-side external lead terminal plate 4 which are integrally joined can be manufactured. The order of folding is not particularly limited because there is no interference depending on the folding. For example, first, the plate portion 3A ′ of the plus-side external lead terminal plate 3 ′ is bent in a U shape so that the internal terminal portion 4C faces the external terminal portion 4B of the minus-side external lead terminal plate 4 ′. The rear external terminal portion 3B, the internal terminal portion 3C, the external terminal portion 4B, and the internal terminal portion 4C may be bent sequentially.
[0029]
Thus, after overlapping the overlapping portion 20 of the plus-side external lead terminal plate 3 ′ and the overlapping portion 4A of the minus-side external lead terminal plate 4 ′ and joining them with the adhesive 30, the external terminal portion 3B, If the internal terminal portion 3C, the external terminal portion 4B, and the internal terminal portion 4C are sequentially bent, the positional relationship between the positive-side external lead terminal plate 3 and the negative-side external lead terminal plate 4 can be determined in advance. The mounting operation of the element 2 is easy.
[0030]
In the metallized film capacitor 1 having such a structure, heat radiation and heat insulation can be efficiently performed by the external lead terminal plates 3 and 4 on the plus side and the minus side. The reason will be described below.
[0031]
The positive and negative external lead terminal plates 3 and 4 have a large surface area and contain the capacitor element 2 so that the U-shaped plate portion 3A of the positive external lead terminal plate 3 and the negative external portion The overlapping portion 4A of the lead terminal plate 4 covers the two flat portions 12a, 12b and one curved surface portion 12c on the outer periphery of the capacitor element 2, and the inner terminal portions 3C, 4C of the metallicon electrodes 13, 14 are covered. Since part of the surface is covered, heat conduction from the capacitor element 2 is good, and heat is efficiently radiated and functions as a heat sink. Further, the external lead terminal plates 3 and 4 on the positive side and the negative side release heat from the capacitor element 2 to the resin case 5 through the insulating resin 6 to enhance the heat radiation effect.
[0032]
Even if external heat is transmitted to the inside through the resin case 5, the external lead terminal plates 3 and 4 on the positive side and the negative side receive the heat and dissipate the heat, so that the heat from the outside is a capacitor element. 2 is blocked and functions as a heat shield. Therefore, it is excellent in a heat dissipation effect and a heat shielding effect, has little thermal influence on the capacitor element 2, and is suitable for use in a metalized film capacitor that requires high frequency, large current, and large voltage.
[0033]
The internal terminal portions 3C and 4C of the positive and negative external lead terminal plates 3 and 4 are each formed in a comb-like shape, and the base portions 27 and 38 respectively cover part of the metallicon electrodes 13 and 14. Therefore, it is possible to prevent the moisture from entering from the film surface and the winding end portion of the peripheral surface of the capacitor element 2. That is, moisture in the air will enter the inside of the capacitor element 2 through the insulating resin 6 filled in the resin case 5 and the gap between the resin 6 and the positive and negative external lead terminal plates 3 and 4. However, if the bases 27 and 38 are present, the path to the film on the peripheral surface of the capacitor element 2 and the path to the winding end become longer, so that the infiltration of moisture is reduced or delayed accordingly. Delays deterioration of capacitor elements due to Accordingly, normal operation as a capacitor can be maintained for a longer time, and the life can be extended.
[0034]
Further, since the positive and negative external lead terminal plates 3 and 4 are integrally joined by the adhesive 30 containing an electrical insulating material, the mechanical strength is large, and external force is applied to these terminal plates 3 and 4. When added, the joints between the internal terminal portions 3C, 4C and the metallicon electrodes 13, 14 are less likely to peel off, and the terminal plate itself or the internal terminal portions 3C, 4C are less likely to be deformed, so that the external terminal portions 3B, 4B Can be securely connected to an external device.
[0035]
In the above-described embodiment, the polyester nonwoven fabric prepreg is used as the adhesive 30. However, the present invention is not limited to this, and other thermosettings such as phenol and unsaturated polyester are used as the adhesive. Alternatively, a glass resin, a thin plate-like polyamide resin having a large number of through holes, a PPS resin, or the like may be used.
Further, as an example of the structure in which the capacitor element 2 is externally covered, an example in which the resin case 5 is used has been shown, but an external body formed by a resin mold method or a resin dip method may be used.
[0036]
【The invention's effect】
As described above, the metalized film capacitor according to the present invention has excellent heat dissipation and heat shielding effects, can improve the thermal deterioration of the capacitor, and can prolong the service life, particularly high frequency, large current, large It is suitable for use in a circuit that requires voltage. In addition, since the terminal board is provided with both a heat radiation function and a heat shielding function, it is not necessary to provide a heat radiation board and a heat shielding board made of different members, and the number of parts can be reduced.
[0037]
Further, according to the present invention, since the two terminal plates are joined by the adhesive containing the electrical insulating material, the mechanical strength is increased and the insulation resistance between the two terminal plates is maintained at a predetermined value or more. Can do.
[0038]
Furthermore, according to the present invention, since it is configured to prevent the intrusion of moisture from the film or the like on the peripheral surface of the capacitor element, the characteristics of the capacitor can be stably maintained and the life can be extended. Can do. Furthermore, the base portion of the internal terminal portion can increase the strength of the terminal piece and prevent the terminal piece from peeling off due to vibration or the like.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing an embodiment of a metallized film capacitor according to the present invention.
FIG. 2 is a sectional view of the capacitor.
3 is a cross-sectional view taken along line III-III in FIG.
FIG. 4 is a cross-sectional view of an adhesive containing an electrical insulating material.
5A is a developed view of a positive-side external lead terminal board, and FIG. 5B is a developed view of a negative-side external lead terminal board.
FIG. 6 is a view showing a state in which a plus-side external lead-out terminal plate and a minus-side external lead-out terminal plate are joined with an adhesive containing an electrical insulating material.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Metallized film capacitor, 2 ... Capacitor element, 3 ... Positive side external lead terminal board, 3A ... U-shaped board part, 3B ... External terminal part, 3C ... Internal terminal part, 4 ... Negative side external lead terminal Plate, 4A ... Overlapping part, 4B ... External terminal part, 4C ... Internal terminal part, 5 ... Resin case, 6 ... Insulating resin, 10 ... Metal foil, 12 ... Capacitor body, 13, 14 ... Metallicon electrode, 20 ... Overlapping Matching part, 27 ... base part, 28 ... joining part, 30 ... adhesive, 38 ... base part, 39 ... joining part, 43 ... polyester nonwoven fabric, 44 ... special blended epoxy resin.

Claims

A metallized film (11) wound Rotate capacitor element formed thereof in the winding end faces metallikon electrode (12, 13), respectively (2), the respective metallikon electrodes of the capacitor element (2) (12, 13) Two external lead terminal plates (3, 4) joined to each other, and the external lead terminal plate (3, 4 ) and the capacitor element (2) are opened in a case (5) in which only one is opened. In a metallized film capacitor that is housed and sealed with an insulating resin (6) ,
One of the two external lead terminal plates (3, 4), one of the external lead terminal plates (3) surrounding the outer periphery of the capacitor element (2) and one end forming an overlapping portion (20) A U-shaped plate portion (3A) that is open, an external terminal portion (3B) that is bent at one end of the U-shaped plate portion (3A), and the U-shaped plate portion (3A). The U-shaped plate portion (3A ) is formed of the internal terminal portion (3C) which is bent on the end side and joined to one metallicon electrode (13) of the capacitor element (2). A storage space (17) for storing the element (2) is formed, and an open portion (18a) of the U-shaped plate portion (3A) is used for inserting the capacitor element (2) into the storage space (17). Forming an opening,
By forming the other external lead terminal plate (4) into a substantially “Z” shape in a side view, it is bent and formed at one side edge of the overlapping portion (4A) and the overlapping portion (4A). The external terminal portion (4B) and the internal terminal portion (4C) formed to be bent at the other side edge of the overlap portion (4A), and the overlap portion (4A) is the external lead terminal plate The U-shaped plate part (3A) of (3) is joined to the inner surface side of the overlapping part (20) with an adhesive (30) containing an electrical insulating material (43), and the internal terminal part (4C) is connected to the capacitor The external terminal portion (3B, 4B) of the external lead terminal plate (3, 4) is externally connected to the other metallicon electrode (14) of the element (2) from the opening (5A) of the case (5). A metallized film capacitor characterized by being protruded into

The metallized film capacitor according to claim 1, wherein the adhesive (30) is a polyester nonwoven fabric prepreg.

The metallized film capacitor according to claim 1 or 2,
The internal terminal portions (3C, 4C) of each external lead terminal plate (3 , 4) are connected to a wide base portion (27, 38) and terminal pieces (26, 26 ) connected to the base portion (27, 38) . 37) , the terminal piece (26 , 37) is joined to the metallicon electrode (12, 13), and the base (27, 38) covers a part of the metallicon electrode (12, 13). Metallized film capacitor characterized by