CN109741940B - Process for enhancing strength of gold spraying layer of thin film capacitor by using conducting wire - Google Patents
Process for enhancing strength of gold spraying layer of thin film capacitor by using conducting wire Download PDFInfo
- Publication number
- CN109741940B CN109741940B CN201811636719.9A CN201811636719A CN109741940B CN 109741940 B CN109741940 B CN 109741940B CN 201811636719 A CN201811636719 A CN 201811636719A CN 109741940 B CN109741940 B CN 109741940B
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- Prior art keywords
- capacitor
- capacitor core
- gold
- strength
- film capacitor
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- 239000003990 capacitor Substances 0.000 title claims abstract description 68
- 238000005507 spraying Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 27
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 25
- 239000010931 gold Substances 0.000 title claims abstract description 25
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 25
- 239000010409 thin film Substances 0.000 title claims description 12
- 230000002708 enhancing effect Effects 0.000 title abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 238000003466 welding Methods 0.000 claims abstract description 6
- 239000007921 spray Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 239000010408 film Substances 0.000 claims description 7
- 238000005728 strengthening Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 abstract description 14
- 229910052751 metal Inorganic materials 0.000 abstract description 14
- 239000000463 material Substances 0.000 abstract description 3
- 238000012797 qualification Methods 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 2
- 239000002699 waste material Substances 0.000 abstract description 2
- 239000004743 Polypropylene Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 229920006255 plastic film Polymers 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 238000007599 discharging Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention provides a process for enhancing the strength of a gold spraying layer of a film capacitor by using a lead, and relates to the technical field of gold spraying of film capacitors. The process for enhancing the strength of the gold spraying layer of the film capacitor by using the lead mainly comprises the steps of welding a single-stranded copper wire on the end face of a capacitor core package through a welding spot, fixing the single-stranded copper wire on the end face of the film capacitor core package to carry out direct gold spraying treatment, and burying the copper wire in the gold spraying layer to integrate the copper wire and the gold spraying layer. The invention overcomes the defects of the prior art, improves the conductivity and the strength of the sprayed metal layer, improves the qualification rate of the capacitor product, reduces the waste of multiple metal spraying, saves manpower and material resources, and is suitable for popularization and use.
Description
Technical Field
The invention relates to the technical field of metal spraying of film capacitors, in particular to a process for enhancing the strength of a metal spraying layer of a film capacitor by using a lead.
Background
The film capacitor is a capacitor having a structure in which a metal foil is used as an electrode, and the metal foil is laminated with a plastic film such as polyethylene, polypropylene, polystyrene, or polycarbonate from both ends thereof, and then wound into a cylindrical shape. The plastic film is also called a poly (ethyl ester) capacitor (also called a Mylar) capacitor, a polypropylene capacitor (also called a PP capacitor), a polystyrene capacitor (also called a PS capacitor) and a polycarbonate capacitor, respectively, depending on the type of the plastic film.
The metal spraying process for film capacitor is one of the key steps in metallized capacitor production, and is characterized by that it adopts heat sources of electric arc or flame, etc. to melt various solder materials to be sprayed and make them implement small atomization under the action of high-pressure air. The crushed metal particles are sprayed in the gap of the thin film layer of the capacitor core group surface with extremely high sensitivity to heat energy at high speed, so that the end surface of the core group forms an equipotential metal electrode surface from the inner winding layer to the outer winding layer, and a bridging platform is provided for electrode extraction. In the prior art, after the thin-film capacitor is sprayed with gold, the formed gold spraying surface is honeycomb-shaped, micron gaps are inevitably formed inside the gold spraying surface, the conductivity of the gold spraying surface can be changed in different degrees under the continuous impact of high current and high frequency, and the gold spraying surface can be weakened continuously in the charging and discharging process.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the process for enhancing the strength of the gold spraying layer of the thin film capacitor by using the conducting wire, so that the conductivity and the strength of the sprayed metal layer are improved, the qualification rate of a capacitor product is improved, the waste of multiple gold spraying is reduced, the manpower and the material resources are saved, and the process is suitable for popularization and use.
In order to achieve the above purpose, the technical scheme of the invention is realized by the following technical scheme:
a process for strengthening the strength of a gold spraying layer of a thin film capacitor by using a lead comprises the following steps:
(1) the thin film capacitor core packages are orderly arranged in a square mould and clamped;
(2) a single-stranded copper wire is transversely placed on the end faces of two ends of each row of capacitor core packages, and welding spots are arranged at the connection positions of the copper wires and the midpoint of the cross section of each capacitor core package;
(3) moving the capacitor core package to the lower part of the spray gun, and adjusting the distance between the end face of the capacitor core package and the spray gun;
(4) spraying gold on one end face of the capacitor core bag, and then spraying gold on the other end face;
(5) and cutting off single-stranded copper wires connected between the metal-sprayed capacitor core packages to obtain the metal-sprayed complete capacitor core package.
Preferably, in the step (1), the edge of the surface of the square die is flush with the end face of the capacitor core package.
Preferably, in the step (2), two ends of the single copper wire are fixed on the square mold.
Preferably, the distance between the end face of the capacitor core package and the spray gun in the step (3) is determined by the diameter of the capacitor core package.
Preferably, the diameter of the single-strand copper wire is determined by the diameter of the capacitor core package and the thickness of the gold-sprayed layer.
The invention provides a process for strengthening the strength of a gold spraying layer of a film capacitor by using a lead, which has the advantages compared with the prior art that:
the invention adopts the single-stranded copper wire fixed on the end face of the core bag of the film capacitor to carry out the metal spraying treatment, and the copper wire is embedded in the metal spraying layer to be integrated, thereby greatly improving the strength and the conductivity of the metal spraying layer, effectively reducing the loss rate of the capacitor in the continuous charging and discharging process of the product capacitor, reducing the attenuation of the capacitor capacity, improving the qualification rate of the capacitor in the processing process, enhancing the stability of the capacitor and enabling the obtained product to be suitable for the environment of high-frequency and high-voltage pulse.
Drawings
FIG. 1 is a top view of a core package assembly during metal spraying according to the process of the present invention;
FIG. 2 is a perspective view of a single core package during metal spraying according to the inventive process;
in the figure, 1 core cladding, 2 single strand copper wires, 3 square molds and 4 welding spots.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are clearly and completely described below in conjunction with the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
A process for strengthening the strength of a gold spraying layer of a thin film capacitor by using a lead comprises the following steps:
(1) the thin film capacitor core packages are orderly arranged in a square mould and clamped;
(2) a single-stranded copper wire is transversely placed on the end faces of two ends of each row of capacitor core packages, and welding spots are arranged at the connection positions of the copper wires and the midpoint of the cross section of each capacitor core package;
(3) moving the capacitor core package to the lower part of the spray gun, and adjusting the distance between the end face of the capacitor core package and the spray gun;
(4) spraying gold on one end face of the capacitor core bag, and then spraying gold on the other end face;
(5) and cutting off single-stranded copper wires connected between the metal-sprayed capacitor core packages to obtain the metal-sprayed complete capacitor core package.
Wherein, the surface edge of the square mould in the step (1) is level with the end surface of the capacitor core package; two ends of the single-strand copper wire in the step (2) need to be fixed on the square die; in the step (3), the distance between the end face of the capacitor core package and the spray gun is 3 cm; the diameter of the single-stranded copper wire is 3 mm.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (3)
1. A process for strengthening the strength of a gold spraying layer of a film capacitor by using a lead is characterized by comprising the following steps of:
(1) the thin film capacitor core packages are orderly arranged in a square mould and clamped;
(2) a single-stranded copper wire is transversely placed on the end faces of the two ends of each row of capacitor core packages, and welding spots are arranged at the connection positions of the middle points of the end faces of the capacitor core packages and the copper wires;
(3) moving the capacitor core package to the lower part of the spray gun, and adjusting the distance between the end face of the capacitor core package and the spray gun;
(4) spraying gold on one end face of the capacitor core bag, and then spraying gold on the other end face;
(5) and cutting off single-stranded copper wires connected between the metal-sprayed capacitor core packages to obtain the metal-sprayed complete capacitor core package.
2. The process for strengthening the strength of the gold-sprayed layer of the thin film capacitor by using the conducting wire as claimed in claim 1, wherein the process comprises the following steps: and (2) in the step (1), the surface edge of the square die is flush with the end face of the capacitor core package.
3. The process for strengthening the strength of the gold-sprayed layer of the thin film capacitor by using the conducting wire as claimed in claim 1, wherein the process comprises the following steps: and (3) fixing two ends of the single copper wire on the square mould in the step (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811636719.9A CN109741940B (en) | 2018-12-29 | 2018-12-29 | Process for enhancing strength of gold spraying layer of thin film capacitor by using conducting wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811636719.9A CN109741940B (en) | 2018-12-29 | 2018-12-29 | Process for enhancing strength of gold spraying layer of thin film capacitor by using conducting wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109741940A CN109741940A (en) | 2019-05-10 |
| CN109741940B true CN109741940B (en) | 2021-02-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811636719.9A Active CN109741940B (en) | 2018-12-29 | 2018-12-29 | Process for enhancing strength of gold spraying layer of thin film capacitor by using conducting wire |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113921278B (en) * | 2021-06-30 | 2023-05-26 | 湖州新江浩电子有限公司 | Film capacitor with nondestructive electrode extraction mode and manufacturing method thereof |
| CN114050054A (en) * | 2021-09-22 | 2022-02-15 | 铜陵市超越电子有限公司 | Thin film capacitor gold spraying layer strengthening process |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1534686A (en) * | 1975-02-14 | 1978-12-06 | Mfd Capacitors Ltd | Capacitors |
| WO2001057892A1 (en) * | 2000-01-26 | 2001-08-09 | Abb Ab | A capacitor and a process for electrically connecting electrode layers to a point of connection |
| JP2008141032A (en) * | 2006-12-04 | 2008-06-19 | Matsushita Electric Ind Co Ltd | Metalizing film capacitor |
| CN104988354A (en) * | 2015-05-28 | 2015-10-21 | 无锡宏广电容器有限公司 | Metal spray wire for film capacitor, preparation method and spraying process thereof |
-
2018
- 2018-12-29 CN CN201811636719.9A patent/CN109741940B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1534686A (en) * | 1975-02-14 | 1978-12-06 | Mfd Capacitors Ltd | Capacitors |
| WO2001057892A1 (en) * | 2000-01-26 | 2001-08-09 | Abb Ab | A capacitor and a process for electrically connecting electrode layers to a point of connection |
| JP2008141032A (en) * | 2006-12-04 | 2008-06-19 | Matsushita Electric Ind Co Ltd | Metalizing film capacitor |
| CN104988354A (en) * | 2015-05-28 | 2015-10-21 | 无锡宏广电容器有限公司 | Metal spray wire for film capacitor, preparation method and spraying process thereof |
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| Publication number | Publication date |
|---|---|
| CN109741940A (en) | 2019-05-10 |
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Effective date of registration: 20210428 Address after: 244000 5th floor, No.3 workshop, building C4, 129 west section of Cuihu 5th Road, Tongling City, Anhui Province Patentee after: TONGLING TONGRONG ELECTRONICS Co.,Ltd. Address before: Tianmen Tianmen town Anhui District village 244100 Ngee Ann City in Tongling Province Patentee before: TONGLING CITY JIALONGFEI CAPACITORS Co.,Ltd. |
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Address after: 244000 floor 5, plant 3, building C4, No. 129, west section of Cuihu fifth road, Tongling City, Anhui Province Patentee after: Anhui Tongrong Electronics Co.,Ltd. Country or region after: China Address before: 244000 floor 5, plant 3, building C4, No. 129, west section of Cuihu fifth road, Tongling City, Anhui Province Patentee before: TONGLING TONGRONG ELECTRONICS Co.,Ltd. Country or region before: China |