CN109741940A - A kind of technique for reinforcing thin film capacitor gilding layer intensity using conducting wire - Google Patents
A kind of technique for reinforcing thin film capacitor gilding layer intensity using conducting wire Download PDFInfo
- Publication number
- CN109741940A CN109741940A CN201811636719.9A CN201811636719A CN109741940A CN 109741940 A CN109741940 A CN 109741940A CN 201811636719 A CN201811636719 A CN 201811636719A CN 109741940 A CN109741940 A CN 109741940A
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- China
- Prior art keywords
- thin film
- capacitor
- core packet
- capacitor core
- technique
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 72
- 238000000034 method Methods 0.000 title claims abstract description 28
- 239000010409 thin film Substances 0.000 title claims abstract description 27
- 230000003014 reinforcing effect Effects 0.000 title claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- 238000005507 spraying Methods 0.000 claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910000679 solder Inorganic materials 0.000 claims abstract description 6
- 239000007921 spray Substances 0.000 claims description 10
- 230000002787 reinforcement Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 3
- 230000001737 promoting effect Effects 0.000 abstract description 2
- 238000012797 qualification Methods 0.000 abstract description 2
- 239000002699 waste material Substances 0.000 abstract description 2
- 230000007812 deficiency Effects 0.000 abstract 1
- 239000004743 Polypropylene Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 125000004494 ethyl ester group Chemical group 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The present invention provides a kind of technique for reinforcing thin film capacitor gilding layer intensity using conducting wire, is related to thin film capacitor metal spraying technical field.The technique for reinforcing thin film capacitor gilding layer intensity using conducting wire predominantly welds single strand of copper wire by solder joint in capacitor core packet end face, single strand of copper wire is fixed on thin film capacitor core packet end face and carries out direct metal spraying processing, copper wire is embedded in gilding layer, it is made to combine together.The present invention overcomes the deficiencies in the prior art, improve the electric conductivity and intensity of basin earth metal layer, while promoting the qualification rate of capacitor packages, and reduce the waste of multiple metal spraying, save human and material resources, and are suitble to promote the use of.
Description
Technical field
The present invention relates to thin film capacitor metal spraying technical fields, and in particular to a kind of to reinforce thin film capacitor spray using conducting wire
The technique of layer gold intensity.
Background technique
Thin film capacitor is to work as electrode with metal foil, by itself and poly- ethyl ester, polypropylene, the modeling such as polystyrene or polycarbonate
Expect film, after the overlapping of both ends, is wound into the capacitor of cylindric construction.And it is hereinafter referred to as according to the type of plastic film
Poly- ethyl ester capacitor (also known as Mylar capacitor), polypropylene capactive (also known as PP capacitor), polystyrene capacitor (also known as PS capacitor) and poly-
Carbonic acid capacitor.
Thin film capacitor metal spraying technique is one of the critical process in metallized capacitor production, is using electric arc or flame
Equal heat sources, all kinds of solder materials that need to be sprayed are melted and in the small atomization of the effect of pressure-air.Smashed metallic is with height
Speed is sprayed in the capacitance core group face film layer gap for having high sensitivity to thermal energy, makes core group end face from interior winding layer to outer winding layer
An equipotential metal electrode face is formed, provides a bridge joint platform for electrode extraction.In the prior art, to thin-film capacitor
After device carries out metal spraying, it being formed by metal spraying face, structure is in cellular, and inside inevitably the gap of micron occurs,
Its lower electric conductivity of continuous impact of heavy current high frequency different degrees of can change again, can be continuous weak in charge and discharge process
Change.
Summary of the invention
In view of the shortcomings of the prior art, the present invention provides a kind of work for reinforcing thin film capacitor gilding layer intensity using conducting wire
Skill, improves the electric conductivity and intensity of basin earth metal layer, while promoting the qualification rate of capacitor packages, and reduce multiple metal spraying
Waste, saves human and material resources, and is suitble to promote the use of.
In order to achieve the above object, technical solution of the present invention is achieved by the following technical programs:
A kind of technique for reinforcing thin film capacitor gilding layer intensity using conducting wire, the reinforcement thin film capacitor gilding layer are strong
The technique of degree the following steps are included:
(1) thin film capacitor core is wrapped in proper alignment in square mold, and clamped；
(2) piece single strand of copper wire of traverse on the end face at every row's capacitor core packet both ends, and it is disconnected in each capacitor core packet
Solder joint is stamped in face midpoint and copper wire junction；
(3) capacitor core packet is moved to below spray gun, and adjust between the end face and spray gun of capacitor core packet away from
From；
(4) metal spraying is carried out to an end face of capacitor core packet, then metal spraying is carried out to another end face；
(5) single strand of copper wire by the capacitor core parlor connection after metal spraying is cut, and obtains the complete capacitor core packet of metal spraying.
Preferably, square die surface edge is equal with the end face of capacitor core packet in the step (1).
Preferably, single strand of copper wire both ends need to be fixed on square mold in the step (2).
Preferably, in the step (3) the distance between the end face of capacitor core packet and spray gun by capacitor core packet
Diameter determines.
Preferably, the diameter of the single strand of copper wire is determined by the diameter of capacitor core packet and the thickness of gilding layer.
The present invention provides a kind of technique for reinforcing thin film capacitor gilding layer intensity using conducting wire, excellent compared with prior art
Point is:
The present invention, which is used, is fixed on the progress metal spraying processing of thin film capacitor core packet end face in single strand of copper wire, and copper wire is embedded in metal spraying
In layer, so that it is combined together, substantially increase the intensity and electric conductivity of gilding layer, effectively reduce product capacitor continuous
The proportion of goods damageds of capacitor in charge and discharge process, reduce the decaying of condenser capacity, and promote the conjunction of capacitor process
Lattice rate enhances its stability, and products obtained therefrom is made to be suitable for the environment of high frequency, high-voltage pulse.
Detailed description of the invention
The top view that core package closes when Fig. 1 is invented technology metal spraying；
The perspective view of Fig. 2 single core packet when being invented technology metal spraying；
In figure, 1 core packet, 2 single strand of copper wire, 3 square molds, 4 solder joints.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below with reference to the embodiment of the present invention pair
Technical solution in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is a part of the invention
Embodiment, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making wound
Every other embodiment obtained under the premise of the property made labour, shall fall within the protection scope of the present invention.
A kind of technique for reinforcing thin film capacitor gilding layer intensity using conducting wire, the reinforcement thin film capacitor gilding layer are strong
The technique of degree the following steps are included:
(1) thin film capacitor core is wrapped in proper alignment in square mold, and clamped；
(2) piece single strand of copper wire of traverse on the end face at every row's capacitor core packet both ends, and it is disconnected in each capacitor core packet
Solder joint is stamped in face midpoint and copper wire junction；
(3) capacitor core packet is moved to below spray gun, and adjust between the end face and spray gun of capacitor core packet away from
From；
(4) metal spraying is carried out to an end face of capacitor core packet, then metal spraying is carried out to another end face；
(5) single strand of copper wire by the capacitor core parlor connection after metal spraying is cut, and obtains the complete capacitor core packet of metal spraying.
Wherein, square die surface edge is equal with the end face of capacitor core packet in the step (1)；The step (2)
Middle single strand of copper wire both ends need to be fixed on square mold；In the step (3) between the end face and spray gun of capacitor core packet
Distance is 3cm；The diameter of the single strand of copper wire is 3mm.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other identical elements in process, method, article or equipment including the element.
The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to the foregoing embodiments
Invention is explained in detail, those skilled in the art should understand that: it still can be to aforementioned each implementation
Technical solution documented by example is modified or equivalent replacement of some of the technical features；And these modification or
Replacement, the spirit and scope for technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution.
Claims (5)
1. a kind of technique for reinforcing thin film capacitor gilding layer intensity using conducting wire, which is characterized in that the reinforcement thin-film capacitor
The technique of device gilding layer intensity the following steps are included:
(1) thin film capacitor core is wrapped in proper alignment in square mold, and clamped；
(2) piece single strand of copper wire of traverse on the end face at every row's capacitor core packet both ends, and in each capacitor core packet section
Point stamps solder joint with copper wire junction；
(3) capacitor core packet is moved to below spray gun, and the distance between end face and the spray gun for adjusting capacitor core packet；
(4) metal spraying is carried out to an end face of capacitor core packet, then metal spraying is carried out to another end face；
(5) single strand of copper wire by the capacitor core parlor connection after metal spraying is cut, and obtains the complete capacitor core packet of metal spraying.
2. a kind of technique for being reinforced thin film capacitor gilding layer intensity using conducting wire according to claim 1, feature are existed
In: square die surface edge is equal with the end face of capacitor core packet in the step (1).
3. a kind of technique for being reinforced thin film capacitor gilding layer intensity using conducting wire according to claim 1, feature are existed
In: single strand of copper wire both ends need to be fixed on square mold in the step (2).
4. a kind of technique for being reinforced thin film capacitor gilding layer intensity using conducting wire according to claim 1, feature are existed
In: the distance between the end face of capacitor core packet and spray gun are determined by the diameter of capacitor core packet in the step (3).
5. a kind of technique for being reinforced thin film capacitor gilding layer intensity using conducting wire according to claim 1, feature are existed
In: the diameter of the single strand of copper wire is determined by the diameter of capacitor core packet and the thickness of gilding layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811636719.9A CN109741940B (en) | 2018-12-29 | 2018-12-29 | Process for enhancing strength of gold spraying layer of thin film capacitor by using conducting wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811636719.9A CN109741940B (en) | 2018-12-29 | 2018-12-29 | Process for enhancing strength of gold spraying layer of thin film capacitor by using conducting wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109741940A true CN109741940A (en) | 2019-05-10 |
| CN109741940B CN109741940B (en) | 2021-02-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811636719.9A Active CN109741940B (en) | 2018-12-29 | 2018-12-29 | Process for enhancing strength of gold spraying layer of thin film capacitor by using conducting wire |
Country Status (1)
| Country | Link |
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| CN (1) | CN109741940B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113921278A (en) * | 2021-06-30 | 2022-01-11 | 湖州新江浩电子有限公司 | Novel film capacitor with non-destructive electrode leading-out mode and manufacturing method thereof |
| CN114050054A (en) * | 2021-09-22 | 2022-02-15 | 铜陵市超越电子有限公司 | Thin film capacitor gold spraying layer strengthening process |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1534686A (en) * | 1975-02-14 | 1978-12-06 | Mfd Capacitors Ltd | Capacitors |
| WO2001057892A1 (en) * | 2000-01-26 | 2001-08-09 | Abb Ab | A capacitor and a process for electrically connecting electrode layers to a point of connection |
| JP2008141032A (en) * | 2006-12-04 | 2008-06-19 | Matsushita Electric Ind Co Ltd | Metalizing film capacitor |
| CN104988354A (en) * | 2015-05-28 | 2015-10-21 | 无锡宏广电容器有限公司 | Metal spray wire for film capacitor, preparation method and spraying process thereof |
-
2018
- 2018-12-29 CN CN201811636719.9A patent/CN109741940B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1534686A (en) * | 1975-02-14 | 1978-12-06 | Mfd Capacitors Ltd | Capacitors |
| WO2001057892A1 (en) * | 2000-01-26 | 2001-08-09 | Abb Ab | A capacitor and a process for electrically connecting electrode layers to a point of connection |
| JP2008141032A (en) * | 2006-12-04 | 2008-06-19 | Matsushita Electric Ind Co Ltd | Metalizing film capacitor |
| CN104988354A (en) * | 2015-05-28 | 2015-10-21 | 无锡宏广电容器有限公司 | Metal spray wire for film capacitor, preparation method and spraying process thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113921278A (en) * | 2021-06-30 | 2022-01-11 | 湖州新江浩电子有限公司 | Novel film capacitor with non-destructive electrode leading-out mode and manufacturing method thereof |
| CN114050054A (en) * | 2021-09-22 | 2022-02-15 | 铜陵市超越电子有限公司 | Thin film capacitor gold spraying layer strengthening process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109741940B (en) | 2021-02-09 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| TR01 | Transfer of patent right |
Effective date of registration: 20210428 Address after: 244000 5th floor, No.3 workshop, building C4, 129 west section of Cuihu 5th Road, Tongling City, Anhui Province Patentee after: TONGLING TONGRONG ELECTRONICS Co.,Ltd. Address before: Tianmen Tianmen town Anhui District village 244100 Ngee Ann City in Tongling Province Patentee before: TONGLING CITY JIALONGFEI CAPACITORS Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| CP03 | Change of name, title or address |
Address after: 244000 floor 5, plant 3, building C4, No. 129, west section of Cuihu fifth road, Tongling City, Anhui Province Patentee after: Anhui Tongrong Electronics Co.,Ltd. Country or region after: China Address before: 244000 floor 5, plant 3, building C4, No. 129, west section of Cuihu fifth road, Tongling City, Anhui Province Patentee before: TONGLING TONGRONG ELECTRONICS Co.,Ltd. Country or region before: China |
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