CN113921278A - Novel film capacitor with non-destructive electrode leading-out mode and manufacturing method thereof - Google Patents
Novel film capacitor with non-destructive electrode leading-out mode and manufacturing method thereof Download PDFInfo
- Publication number
- CN113921278A CN113921278A CN202110736429.7A CN202110736429A CN113921278A CN 113921278 A CN113921278 A CN 113921278A CN 202110736429 A CN202110736429 A CN 202110736429A CN 113921278 A CN113921278 A CN 113921278A
- Authority
- CN
- China
- Prior art keywords
- film capacitor
- core
- electrode
- thin
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 144
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 230000001066 destructive effect Effects 0.000 title claims description 13
- 239000010409 thin film Substances 0.000 claims abstract description 59
- 238000005507 spraying Methods 0.000 claims abstract description 43
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000011701 zinc Substances 0.000 claims abstract description 36
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910052802 copper Inorganic materials 0.000 claims abstract description 34
- 239000010949 copper Substances 0.000 claims abstract description 34
- 239000011248 coating agent Substances 0.000 claims abstract description 22
- 238000000576 coating method Methods 0.000 claims abstract description 22
- 239000010408 film Substances 0.000 claims description 49
- 238000000034 method Methods 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 13
- 239000004814 polyurethane Substances 0.000 claims description 10
- 229920002635 polyurethane Polymers 0.000 claims description 10
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 claims description 7
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 6
- 229910000597 tin-copper alloy Inorganic materials 0.000 claims description 6
- 238000004804 winding Methods 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 238000007731 hot pressing Methods 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract 1
- 238000003466 welding Methods 0.000 description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000006378 damage Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 241000282414 Homo sapiens Species 0.000 description 1
- 241000784732 Lycaena phlaeas Species 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000011895 specific detection Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/13—Energy storage using capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Coating By Spraying Or Casting (AREA)
Abstract
The invention discloses a thin film capacitor with a novel nondestructive electrode leading-out mode and a manufacturing method thereof, and the thin film capacitor comprises thin film capacitor bodies, wherein a plurality of thin film capacitor bodies are fixedly connected to form a capacitor bank, a pure zinc layer is arranged at the upper end of the capacitor bank, a coating with good conductivity and a conductive copper net are arranged at the upper end of the pure zinc layer, the conductive copper net and the pure zinc layer are fixedly connected together by the coating with good conductivity, the core is not damaged when an electrode is led out from a capacitor core through a spraying technology, and the influence of the traditional electrode on the stress of the core is reduced.
Description
Technical Field
The invention relates to the technical field of thin film capacitors, in particular to a thin film capacitor with a novel nondestructive electrode leading-out mode and a manufacturing method thereof.
Background
With the increasing requirements of human beings on electronic products, especially in the field of extreme safety, such as thin film capacitors for rocket ignition, thin film capacitors in automobile applications, etc., the electrodes are usually led out by manual welding or machine welding, as shown in fig. 1.
As is well known, the film capacitor is formed by winding a plastic film, the plastic film is very sensitive to temperature, when an electrode is led out, the electrode and a capacitor core are connected together usually by using an electric soldering iron welding or arc welding mode, the film is usually shrunk due to overhigh welding temperature at a welding point, the capacitor core is damaged, irreparable damage exists, and the phenomenon of insecure connection can occur when the electrode is welded conventionally. A new electrode lead-out type thin film capacitor is needed.
Disclosure of Invention
The present invention is directed to a novel non-destructive electrode lead-out type thin film capacitor and a method for manufacturing the same, which solve the problems of the related art.
In order to achieve the purpose, the invention is realized by the following technical scheme:
the utility model provides a novel film capacitor of non-destructive electrode mode of drawing forth, includes the film capacitor body, and a plurality of film capacitor body fixed connection forms the capacitor bank, and the capacitor bank upper end is equipped with pure zinc layer, and pure zinc layer upper end is equipped with the good coating of electric conductive property and electrically conducts the copper net, and the good coating of electric conductive property is in the same place electrically conducts copper net and pure zinc layer fixed connection.
Preferably, the surface area of the conductive copper mesh is larger than the surface area of the upper end of the film capacitor body.
Preferably, the material of the coating with good conductivity includes, but is not limited to, tin-copper alloy and tin-zinc alloy.
A method for manufacturing a novel thin film capacitor with a nondestructive electrode leading-out mode comprises the following steps:
s1, manufacturing a film capacitor core to be sprayed: the thin film capacitor is processed by the processes of winding, hot pressing, shaping and the like in the early stage to form a thin film capacitor core to be sprayed;
s2: forming a preliminary electrode: spraying a pure zinc layer on the end face of the thin film capacitor core, and controlling the temperature of the end face of the thin film capacitor core to be 90-120 degrees in the spraying process;
s3: an energizing step: performing a metal spraying process on the film capacitor on the basis of S2 and performing electric cleaning on a core of the film capacitor on an energizing machine;
s4: fixing an electrode: placing the conductive copper net on the end face of the thin-film capacitor core, and spraying a material with good conductivity to fix the conductive copper net on the end face of the thin-film capacitor core:
s5: and (3) vacuum sealing: the capacitor core with the fixed electrodes is placed in a container (such as an aluminum shell or a plastic shell), and the capacitor core is sealed by injecting epoxy resin or polyurethane under a vacuum condition.
Preferably, the thickness of the pure zinc layer is 0.2mm or more.
Preferably, the temperature when the pure zinc layer is sprayed on the end face of the thin-film capacitor core is 110 ℃.
Preferably, the temperature for spraying the material with good conductivity on the end face of the thin-film capacitor core is not more than 80 degrees.
Preferably, the tension between the conductive copper mesh and the film capacitor core is equal to or greater than 25N.
Preferably, the film capacitor body is adhered by polyurethane glue to form a capacitor bank.
Preferably, a circular protrusion is sprayed on the end face of each film capacitor core in the pure zinc layer spraying process.
Compared with the prior art, the invention has the beneficial effects that:
1. this novel film capacitor of non-destructive electrode mode of drawing forth adopts the technique of spraying electrode, and the one deck couples together film capacitor body spraying, has solved the defect of destroying the condenser core through manual welding or machine welding at present, and the application spraying layer combines electrode and core completely to improve the ability of condenser current resistance and its life greatly.
2. When the novel thin film capacitor with the non-destructive electrode leading-out mode is used for spraying a pure zinc layer, the limited temperature is 90-120 degrees, the thin film on the thin film capacitor can be contracted within the temperature range, the primary electrode is led out, the end face of a core of the thin film capacitor can obtain good adhesive force, the current resistance of the core can be better due to the good adhesive force, and the loss is smaller.
3. The temperature of the manufacturing method of the novel film capacitor adopting the non-destructive electrode leading-out mode is not more than 80 degrees when the coating with good conductivity is sprayed, and the temperature of less than 80 degrees can avoid thermal damage to the end surface of the core, so that the temperature is better when the electrode is in good contact with a copper mesh and the like.
4. The material of the good coating of electric conductive property among this novel non-destructive electrode lead mode's film capacitor adopts tin zinc alloy, tin copper alloy because its corrosion resistance is high, the weldability is good just if place longer time, also do not influence its welding performance, and can not produce the tin palpus, though the tin content is high, nevertheless there is not tin palpus phenomenon that the tin cladding material can produce, thereby can not appear the short circuit trouble because of the tin palpus arouses when using, toughness is good, film capacitor after the plating is even assaulted, crooked, the degree of depth deep-drawing, the cladding material can not drop yet.
5. In the manufacturing method of the novel film capacitor adopting the non-destructive electrode leading-out mode, when the spraying of alloys such as tin zinc, tin copper and the like is carried out, polyurethane glue with good heat dissipation performance is firstly used for fixing and filling, the firm and reliable connection between the capacitor cores is ensured, the filling is complete, the short circuit situation of the capacitor cores is avoided, a circular bulge is sprayed on the end face of each film capacitor, and better adhesive force can be provided when the next spraying is carried out.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic diagram of an arrangement structure of thin film capacitors according to the present invention;
FIG. 3 is a schematic view of a pure zinc layer spray structure according to the present invention;
FIG. 4 is a schematic view of the second and third spraying structures of the present invention;
a film capacitor body 1, a pure zinc layer 2, a coating 3 with good conductivity, a conductive copper net 4 and a capacitor group 5
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1: referring to the schematic illustrations of figures 1-4,
a thin-film capacitor with a novel nondestructive electrode leading-out mode comprises thin-film capacitor bodies 1, wherein a plurality of thin-film capacitor bodies 1 are fixedly connected to form a capacitor bank 5, a pure zinc layer 2 is arranged at the upper end of the capacitor bank 5, a coating 3 with good conductivity and a conductive copper net 4 are arranged at the upper end of the pure zinc layer 2, and the conductive copper net 4 and the pure zinc layer 2 are fixedly connected together through the coating 3 with good conductivity;
the surface area of the conductive copper mesh 4 is larger than that of the upper end of the thin-film capacitor body 1, the conductive copper mesh 4 has certain toughness, the thin-film capacitor body 1 can be connected in a spraying mode better, the size of the conductive copper mesh 4 can be adjusted according to the sizes of thin-film capacitors with different requirements, better conductive performance and adhesion are provided, the heat dissipation effect of the core is better, and the current resistance is stronger;
the material of the coating 3 with good conductivity comprises but is not limited to tin-copper alloy and tin-zinc alloy, the corrosion resistance of the tin-copper alloy and the tin-zinc alloy is high, the weldability is good, the welding performance is not influenced even if the coating is placed for a long time, tin whiskers cannot be generated, and although the tin content is high, the tin whisker phenomenon generated by a tin coating does not exist, so that the short circuit fault caused by the tin whiskers cannot occur during use, the toughness is good, and the coating cannot fall off even if the plated film capacitor is impacted, bent and deeply drawn;
a method for manufacturing a novel thin film capacitor with a nondestructive electrode leading-out mode comprises the following steps:
s1, manufacturing a film capacitor core to be sprayed: the thin film capacitor is processed by the processes of winding, hot pressing, shaping and the like in the early stage to form a thin film capacitor core to be sprayed;
s2: forming a preliminary electrode: spraying a pure zinc layer 2 on the end face of the thin film capacitor core, and controlling the temperature of the end face of the thin film capacitor core at 110 degrees in the spraying process;
s3: an energizing step: performing a metal spraying process on the film capacitor on the basis of S2 and performing electric cleaning on a core of the film capacitor on an energizing machine;
s4: fixing an electrode: placing the conductive copper mesh 4 on the end face of the thin-film capacitor core, and spraying a material with good conductivity to fix the conductive copper mesh 4 on the end face of the thin-film capacitor core:
s5: and (3) vacuum sealing: the capacitor core with the fixed electrodes is placed in a container (such as an aluminum shell or a plastic shell), and the capacitor core is sealed by injecting epoxy resin or polyurethane under vacuum conditions
The thickness of the pure zinc layer 2 is more than 0.2mm, and the adhesive force of the end face of the capacitor core and the subsequent electric cleaning (namely current resistance) and the sealing property inside the core can be met as long as the spraying layer is more than 0.2 mm.
The temperature of the end face of the thin-film capacitor core sprayed with the material with good conductivity does not exceed 80 degrees, and the temperature of the end face of the thin-film capacitor core sprayed with the coating 3 with good conductivity does not exceed 80 degrees so as to avoid damage to the end face of the capacitor core and be beneficial to combination of the conductive copper mesh 4 with good conductivity and heat dissipation performance and the pure zinc layer 2.
The tension between the conductive copper mesh 4 and the thin-film capacitor core is more than or equal to 25N, the using temperature is not more than 80 ℃ when the coating 3 with good conductivity is sprayed, after spraying, the applied conductive copper mesh 4 has obvious advantages in softness compared with a common copper bar and the like, and the generated stress is smaller, so that the tension between the conductive copper mesh 4 and the capacitor core is more than or equal to 25N;
the film capacitor bodies 1 are adhered through polyurethane glue to form a capacitor bank 5, when the capacitor bank 5 is integrally sprayed, each film capacitor body 1 is connected with each other to form a certain gap, the gap is filled with the polyurethane glue on the surface for electrode leading-out spraying, so that each film capacitor can be connected more firmly to form a whole, the polyurethane glue has heat dissipation performance, and the short circuit of the whole capacitor bank 5 can be avoided;
in the pure zinc layer 2 spraying process, a circular bulge is sprayed on each thin film capacitor core end face, in the pure zinc layer 2 spraying process, each core end face can be sprayed with a circular bulge which can be better attached, and then the copper net is attached in the second step and the coating with good conductivity is attached, so that the pure zinc layer 2 spraying is smooth and flat, and certain bulges can not only not damage the conductivity of the pure zinc layer, but also increase the connection firmness of the pure zinc layer.
Example 2: on the basis of example 1, S2: forming a preliminary electrode: spraying a pure zinc layer 2 on the end face of the thin film capacitor core, and controlling the temperature of the end face of the thin film capacitor core at 90 degrees in the spraying process;
example 3: on the basis of example 1, S2: forming a preliminary electrode: spraying a pure zinc layer 2 on the end face of the thin film capacitor core, and controlling the temperature of the end face of the thin film capacitor core at 120 degrees in the spraying process;
the capacitor in the conventional welding mode, the capacitor in the embodiment 1, the capacitor in the embodiment 2 and the capacitor in the embodiment 3 are respectively extracted by 5PCS, and the conductivity of the four capacitors is detected, and the specific detection results are shown in the following table:
note: Δ T represents temperature rise, the conductivity is related to temperature rise, and generally, the smaller the temperature rise is, the better the temperature rise is under the premise of applying the same load;
PCS is a measurement unit, namely the abbreviation of pieces, which means one piece;
s, an abbreviation for sample, means sample.
The working principle is as follows: winding, hot pressing and lamp setting treatment are carried out on a required film capacitor body 1 to form a capacitor core to be sprayed, firstly, a pure zinc layer 2 is sprayed on the processed film capacitor body 1 to form a 0.2mm spraying layer on the end face of the film capacitor core, the use temperature is 110 degrees, the temperature can ensure that a film on a film capacitor can shrink to ensure that the adhesive force of a coating is better, the corrosion resistance and the service life of the 0.2mm spraying layer can be improved, the subsequent electric cleaning and the further spraying of the capacitor core can be facilitated, after the pure zinc layer 2 is sprayed, a certain alternating voltage, a certain direct voltage and the like are applied to the core on the film capacitor body 1 on an energizing machine for electric cleaning, so that the purposes of stable electric properties of the capacity, the loss, the voltage resistance, the insulation resistance and the like of the film capacitor body 1 are achieved, a leading-out electrode is directly contacted with a conductive copper mesh 4, secondly, spraying a coating 3 with good conductivity to fix the electrode, wherein the spraying material comprises but is not limited to tin-copper alloy or tin-zinc alloy, the electrode is a conductive copper net 4, the surface area of the conductive copper net 4 is larger than the surface area of the end face of the thin-film capacitor, in order to better realize the fixation of the electrode and flexibly change the mesh number, the spraying temperature is controlled below 80 degrees at the moment, the damage to the pure zinc layer can be avoided, after the spraying, compared with copper bars and the like, the conductive copper mesh 4 has obvious advantages in softness, less stress, therefore, the tension between the conductive copper mesh 4 and the capacitor core is more than or equal to 25N, and finally the capacitor core with the fixed electrode is placed into a container, by injecting epoxy resin or polyurethane under vacuum condition to seal the capacitor core, the spraying technique has no destructiveness to the core when leading out the electrode, and reduces the influence of traditional electrode on the core stress.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (10)
1. The utility model provides a novel film capacitor of non-destructive electrode mode of drawing forth, a serial communication port, including film capacitor body (1), a plurality of film capacitor body (1) fixed connection forms capacitor bank (5), capacitor bank (5) upper end is equipped with pure zinc layer (2), pure zinc layer (2) upper end is equipped with electric conductive property good coating (3) and electrically conductive copper net (4), electric conductive property good coating (3) will electrically conductive copper net (4) and pure zinc layer (2) fixed connection together.
2. The film capacitor of the novel nondestructive electrode leading mode according to claim 1, wherein the surface area of the conductive copper mesh (4) is larger than the surface area of the upper end of the film capacitor body (1).
3. The novel non-destructive electrode lead-out thin-film capacitor as claimed in claim 1, wherein the material of said coating (3) with good electrical conductivity includes but is not limited to tin-copper alloy and tin-zinc alloy.
4. A method for manufacturing a novel thin film capacitor in a nondestructive electrode leading mode is characterized by comprising the following steps:
s1, manufacturing a film capacitor core to be sprayed: the thin film capacitor is processed by the processes of winding, hot pressing, shaping and the like in the early stage to form a thin film capacitor core to be sprayed;
s2: forming a preliminary electrode: spraying a pure zinc layer (2) on the end face of the thin film capacitor core, and controlling the temperature of the end face of the thin film capacitor core to be 90-120 degrees in the spraying process;
s3: an energizing step: performing a metal spraying process on the film capacitor on the basis of S2 and performing electric cleaning on a core of the film capacitor on an energizing machine;
s4: fixing an electrode: placing the conductive copper net (4) on the end face of the thin-film capacitor core, and spraying a material with good conductivity to fix the conductive copper net (4) on the end face of the thin-film capacitor core:
s5: and (3) vacuum sealing: the capacitor core with the fixed electrodes is placed in a container (such as an aluminum shell or a plastic shell), and the capacitor core is sealed by injecting epoxy resin or polyurethane under a vacuum condition.
5. The method for manufacturing a thin film capacitor of a novel nondestructive electrode lead-out type as defined in claim 4 wherein the thickness of said pure zinc layer (2) is 0.2mm or more.
6. The method for manufacturing the thin film capacitor in the novel nondestructive electrode lead-out mode according to claim 4, wherein the temperature of the thin film capacitor core end face spray coating pure zinc layer (2) is 110 °.
7. The method for manufacturing a novel nondestructive electrode leading-out type thin-film capacitor as claimed in claim 4, wherein the temperature of the end face of the thin-film capacitor core sprayed with the material having excellent conductivity is not more than 80 °.
8. The manufacturing method of the novel non-destructive electrode leading-out type film capacitor as claimed in claim 4, wherein the tensile force between the conductive copper mesh (4) and the film capacitor core is not less than 25N.
9. The method for manufacturing a novel nondestructive electrode leading type film capacitor as claimed in claim 4, wherein the film capacitor body (1) is bonded by polyurethane glue to form the capacitor bank (5).
10. The manufacturing method of the novel non-destructive electrode leading-out type film capacitor as claimed in claim 4, wherein a circular bump is sprayed on the end face of each film capacitor core during the spraying process of the pure zinc layer (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110736429.7A CN113921278B (en) | 2021-06-30 | 2021-06-30 | Film capacitor with nondestructive electrode extraction mode and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110736429.7A CN113921278B (en) | 2021-06-30 | 2021-06-30 | Film capacitor with nondestructive electrode extraction mode and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113921278A true CN113921278A (en) | 2022-01-11 |
| CN113921278B CN113921278B (en) | 2023-05-26 |
Family
ID=79232772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110736429.7A Active CN113921278B (en) | 2021-06-30 | 2021-06-30 | Film capacitor with nondestructive electrode extraction mode and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113921278B (en) |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0334520A (en) * | 1989-06-30 | 1991-02-14 | Matsushita Electric Ind Co Ltd | Manufacture of film capacitor |
| JPH05283281A (en) * | 1992-04-03 | 1993-10-29 | Matsushita Electric Ind Co Ltd | Manufacture of thin-film capacitor |
| JP2004056097A (en) * | 2002-05-27 | 2004-02-19 | Nec Corp | Thin film capacitor, combined passive component including the thin film capacitor, method of manufacturing same, and wiring board including same |
| JP2005317697A (en) * | 2004-04-28 | 2005-11-10 | Mitsubishi Electric Corp | Film capacitor, and method for manufacturing same |
| CN101894669A (en) * | 2010-06-11 | 2010-11-24 | 杨文荣 | Preparation method of supervoltage CBB four-string noninductive capacitor |
| CN203433922U (en) * | 2013-05-16 | 2014-02-12 | 隆科电子(惠阳)有限公司 | Base metal electrode structure of electronic ceramic element |
| CN104465092A (en) * | 2014-12-11 | 2015-03-25 | 铜陵市启动电子制造有限责任公司 | Manufacturing method for anti-electromagnetic interference thin-film capacitor |
| CN105206420A (en) * | 2014-06-11 | 2015-12-30 | 深圳市铜峰电子有限公司 | CBB82S type high current resistant long life polypropylene film capacitor |
| CN204966286U (en) * | 2015-09-08 | 2016-01-13 | 厦门法拉电子股份有限公司 | Can provide condenser that metal spraying face carries out surface mounting |
| CN106601503A (en) * | 2016-12-21 | 2017-04-26 | 南通新江海动力电子有限公司 | Film capacitor metal spraying process |
| CN206163323U (en) * | 2016-09-30 | 2017-05-10 | 广东明路电力电子有限公司 | Film capacitor terminal surface sputters metallic structure |
| CN207250332U (en) * | 2017-12-15 | 2018-04-17 | 深圳市纬迪实业发展有限公司 | A kind of thin-film capacitor core and high frequency voltage descending thin film capacitor |
| CN208507476U (en) * | 2018-07-20 | 2019-02-15 | 亿曼丰科技（深圳）有限公司 | Resistance to high current, the dedicated anti-appearance of long-life polypropylene film igniting decline capacitor |
| CN109741940A (en) * | 2018-12-29 | 2019-05-10 | 铜陵市佳龙飞电容器有限公司 | A kind of technique for reinforcing thin film capacitor gilding layer intensity using conducting wire |
| CN211907255U (en) * | 2020-04-17 | 2020-11-10 | 深圳市纬迪实业发展有限公司 | High-voltage film capacitor |
| CN112289587A (en) * | 2020-12-30 | 2021-01-29 | 宁波市江北九方和荣电气有限公司 | Processing method of metallized film capacitor and metallized film capacitor |
-
2021
- 2021-06-30 CN CN202110736429.7A patent/CN113921278B/en active Active
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0334520A (en) * | 1989-06-30 | 1991-02-14 | Matsushita Electric Ind Co Ltd | Manufacture of film capacitor |
| JPH05283281A (en) * | 1992-04-03 | 1993-10-29 | Matsushita Electric Ind Co Ltd | Manufacture of thin-film capacitor |
| JP2004056097A (en) * | 2002-05-27 | 2004-02-19 | Nec Corp | Thin film capacitor, combined passive component including the thin film capacitor, method of manufacturing same, and wiring board including same |
| JP2005317697A (en) * | 2004-04-28 | 2005-11-10 | Mitsubishi Electric Corp | Film capacitor, and method for manufacturing same |
| CN101894669A (en) * | 2010-06-11 | 2010-11-24 | 杨文荣 | Preparation method of supervoltage CBB four-string noninductive capacitor |
| CN203433922U (en) * | 2013-05-16 | 2014-02-12 | 隆科电子(惠阳)有限公司 | Base metal electrode structure of electronic ceramic element |
| CN105206420A (en) * | 2014-06-11 | 2015-12-30 | 深圳市铜峰电子有限公司 | CBB82S type high current resistant long life polypropylene film capacitor |
| CN104465092A (en) * | 2014-12-11 | 2015-03-25 | 铜陵市启动电子制造有限责任公司 | Manufacturing method for anti-electromagnetic interference thin-film capacitor |
| CN204966286U (en) * | 2015-09-08 | 2016-01-13 | 厦门法拉电子股份有限公司 | Can provide condenser that metal spraying face carries out surface mounting |
| CN206163323U (en) * | 2016-09-30 | 2017-05-10 | 广东明路电力电子有限公司 | Film capacitor terminal surface sputters metallic structure |
| CN106601503A (en) * | 2016-12-21 | 2017-04-26 | 南通新江海动力电子有限公司 | Film capacitor metal spraying process |
| CN207250332U (en) * | 2017-12-15 | 2018-04-17 | 深圳市纬迪实业发展有限公司 | A kind of thin-film capacitor core and high frequency voltage descending thin film capacitor |
| CN208507476U (en) * | 2018-07-20 | 2019-02-15 | 亿曼丰科技（深圳）有限公司 | Resistance to high current, the dedicated anti-appearance of long-life polypropylene film igniting decline capacitor |
| CN109741940A (en) * | 2018-12-29 | 2019-05-10 | 铜陵市佳龙飞电容器有限公司 | A kind of technique for reinforcing thin film capacitor gilding layer intensity using conducting wire |
| CN211907255U (en) * | 2020-04-17 | 2020-11-10 | 深圳市纬迪实业发展有限公司 | High-voltage film capacitor |
| CN112289587A (en) * | 2020-12-30 | 2021-01-29 | 宁波市江北九方和荣电气有限公司 | Processing method of metallized film capacitor and metallized film capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113921278B (en) | 2023-05-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101146343B1 (en) | Electrochemical device | |
| CN104412407B (en) | film-covered battery | |
| KR101297288B1 (en) | Single cell and power battery pack comprising the same | |
| US8760840B2 (en) | Electrochemical device and manufacturing method thereof, circuit board and housing tray | |
| KR101126472B1 (en) | Electronic component, lead wire and their production methods | |
| CN107671414A (en) | Lithium ion cell polar ear ultrasonic welding method and tab welding guard method | |
| CN104241581B (en) | Lead component | |
| CN206558602U (en) | Battery core pole piece and battery core | |
| JP4953090B2 (en) | Solid electrolytic capacitor and manufacturing method thereof | |
| CN113921278A (en) | Novel film capacitor with non-destructive electrode leading-out mode and manufacturing method thereof | |
| CN207602405U (en) | Stacked capacitor | |
| CN103579573B (en) | The method for producing the connection contact of the electrode for electrochemical storage device, manufacture the method and electrochemical storage device of electrochemical storage device | |
| CN103531357B (en) | Power capacitor and manufacture method thereof | |
| JP2003289023A (en) | Solid electrolytic capacitor and method for manufacturing the same | |
| CN114497912B (en) | Tab structure, welding method and battery | |
| CN212783701U (en) | Tab connection structure, battery unit and battery module | |
| CN212967462U (en) | Integrated electronic arc extinguisher | |
| TWI685865B (en) | Manufacturing method of electrolytic capacitor | |
| JP2000058369A (en) | Film capacitor | |
| JP3396902B2 (en) | Solid electrolytic capacitor and method of manufacturing the same | |
| CN215955112U (en) | Ultrahigh-voltage chip tantalum capacitor and lead frame thereof | |
| CN221708479U (en) | Composite core material, ribbon thermistor and mounted thermistor | |
| CN115512966B (en) | Capacitor core, capacitor and manufacturing method | |
| CN213752381U (en) | Composite metallized capacitor | |
| CN206116214U (en) | High novel film capacitor who bears of low decay |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |