WO2012131754A1 - Snubber device - Google Patents

Snubber device Download PDF

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Publication number
WO2012131754A1
WO2012131754A1 PCT/JP2011/001807 JP2011001807W WO2012131754A1 WO 2012131754 A1 WO2012131754 A1 WO 2012131754A1 JP 2011001807 W JP2011001807 W JP 2011001807W WO 2012131754 A1 WO2012131754 A1 WO 2012131754A1
Authority
WO
WIPO (PCT)
Prior art keywords
capacitor
resin case
shaped
switching element
resin
Prior art date
Application number
PCT/JP2011/001807
Other languages
French (fr)
Japanese (ja)
Inventor
善則 神田
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP2013506819A priority Critical patent/JP5652543B2/en
Priority to PCT/JP2011/001807 priority patent/WO2012131754A1/en
Priority to CN201180069704.9A priority patent/CN103460317B/en
Priority to TW100112435A priority patent/TWI423570B/en
Publication of WO2012131754A1 publication Critical patent/WO2012131754A1/en

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    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02Mountings
    • H01G2/04Mountings specially adapted for mounting on a chassis
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00Details of apparatus for conversion
    • H02M1/32Means for protecting converters other than automatic disconnection
    • H02M1/34Snubber circuits
    • H02M1/346Passive non-dissipative snubbers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B70/00Technologies for an efficient end-user side electric power management and consumption
    • Y02B70/10Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes

Definitions

  • the present invention relates to a snubber device that protects a DC-side capacitor and a power converter from an overvoltage caused by a generated surge by absorbing a surge voltage generated by a switching element that is a semiconductor element used in the power conversion device.
  • a switching element which is a semiconductor element, is used to convert direct current to alternating current with a power converter, such as a servo amplifier or inverter, or to change the output voltage with a switching converter. Switching). In this switching, the current is turned on and off, so a large surge voltage is generated in the transitional state of the switching, the DC bus voltage rises instantaneously and exceeds the breakdown voltage limit of the switching element itself and the DC side capacitor, There is a possibility of destroying the converter and capacitor. Therefore, in order to absorb the surge voltage in the vicinity of the switching element, a snubber device in which a capacitor alone or a combination of a capacitor and a resistor is arranged to absorb the generated surge voltage.
  • a capacitor is used as a snubber element for absorbing the surge voltage generated by the switching element.
  • the reactance between the terminal of the switching element and the snubber element is minimized. Therefore, it is necessary to attach the snubber device in the immediate vicinity of the switching element.
  • the insulation tube was attached to secure the insulation between the snubber element capacitor and the circuit around it, and the crimp terminal to attach to the switching element.
  • a snubber element was fixed with a bond to prevent vibrations.
  • the resin mold product has a problem that its weight is very large and the cost is very high. Furthermore, since the cross section of the capacitor used as a component constituting the snubber circuit is a unique shape such as an ellipse or a circle, it is difficult to fix or the conductor part is a thin lead wire, making connection difficult. Conventionally, they are connected by soldering or welding, and there is a problem that workability is poor.
  • the present invention has been made to solve the above-described problems, and by using the stress generated along with the deformation of the molded portion formed in the connection conductor, the crimp terminal is attached to the capacitor lead.
  • the object is to eliminate the need for soldering or the like to be attached to the connection portion and to easily fix the capacitor leads.
  • a snubber device includes a lead wire, a capacitor that absorbs a surge voltage generated by a switching element via the lead wire, a resin case that fits and fixes the capacitor, and a conductor, and one piece is a resin case.
  • Connecting conductors that are fixed to each other and whose other pieces are respectively connected to different terminals of the switching element, and the lead wire is a connecting conductor that excludes the molding part by deformation of the molding part formed by processing one piece of the connection conductor Between the plate-shaped part of one piece and the molding part and fixed to the connection conductor.
  • the crimping terminal is attached to the capacitor lead or attached to the connection portion by soldering or the like. There is an effect that the capacitor lead can be easily connected without using it.
  • FIG. 1 It is an exploded view of the snubber apparatus by Embodiment 1 of this invention. It is a connection completion figure in the snubber apparatus by Embodiment 1 of this invention. It is a top view before and behind inserting a capacitor
  • FIG. 3 is an oblique projection view of a connection conductor provided with one Z-shaped molded part for connecting a capacitor lead wire according to Embodiment 1 of the present invention; It is sectional drawing before and behind connecting the lead wire of a capacitor
  • FIG. 5 is an oblique projection view of a connection conductor having two Z-shaped molded portions that connect the lead wires of the capacitor according to Embodiment 1 of the present invention.
  • FIG. 6 is an oblique projection view of another connection conductor provided with one Z-shaped molded portion for connecting a capacitor lead wire according to Embodiment 1 of the present invention; It is a perspective view which shows the state which attaches the snubber apparatus by Embodiment 1 of this invention to a switching element. It is an exploded view of the snubber apparatus by Embodiment 2 of this invention. It is a connection completion figure in the snubber apparatus by Embodiment 2 of this invention. It is sectional drawing which shows the staircase-shaped or taper-shaped process provided in the resin case by Embodiment 2 of this invention.
  • FIG. 1 is an exploded view showing a snubber device according to Embodiment 1 of the present invention
  • FIG. 2 is a completed connection diagram of the snubber device.
  • the snubber device efficiently absorbs a surge voltage generated during operation of the switching element to prevent overvoltage breakdown of the switching element.
  • the snubber device includes a resin molded lid 1, a capacitor 2 a, a resin case 3, and a connection conductor 4.
  • Two lead wires 9 for connecting to the switching element extend from the capacitor 2 a, and the capacitor 2 a absorbs a surge voltage generated by the switching element through the lead wire 9.
  • the resin case 3 is for fixing and fixing the capacitor 2a.
  • the resin-molded lid 1 covers and fixes the capacitor 2a fitted in the resin case 3 from above, and the end of the capacitor 2a in the longitudinal direction is processed as described later, and is attached to the resin case 3. It is done. Further, the connection conductor 4 is fixed by sandwiching and fixing the two lead wires 9 of the capacitor 2a in cooperation with the resin case 3, and is attached to the switching element with one touch.
  • the resin case 3 showed the example which has a wall only in 2 directions in FIG. 1, 3 directions may be a wall and 4 directions may be a wall like a box shape. In the case of a box-shaped resin case whose walls are in four directions, holes or gaps are provided for leading out the capacitor leads.
  • FIG. 3A is a plan view before the capacitor 2 a is inserted into the resin case 3
  • FIG. 3B is a plan view after the capacitor 2 a is inserted into the resin case 3.
  • each of the walls of the resin case 3 covering the capacitor 2 a that is, the opposing inner walls of the resin case 3, for example, has a substantially U-shaped cross section. It has.
  • the capacitor 2a is fixed to the fixed end of the U-shaped resin molded portion 5 (the U-shaped resin molded portion 5 and the resin case 3 against the stationary state of the U-shaped resin molded portion 5).
  • the capacitor 2a can be attached with one touch by inserting it so that it slides in the direction from the free end (free end that is not fixed anywhere) to the free end.
  • the capacitor 2a is sandwiched and fixed by the stress of the resin at the time of deformation.
  • the lid connection holes 7 and 8 for attaching the resin-molded lid 1 are vacant at several locations, and the resin-molded lid 1 can be fitted and attached to the lid connection holes 7 and 8 even when capacitors having different thicknesses are attached. Is provided.
  • the lid connection holes 7 and 8 are holes having different shapes. For example, after the convex portion formed at one end in the longitudinal direction of the resin molded lid 1 is fitted into the lid connection hole 8, the length of the resin molded lid 1 is increased.
  • a plurality of lid connection holes 7 are attached to the resin case 3 at appropriate positions among the plurality of lid connection holes 7 while pressing the inverted triangular projections formed at the other end in the direction downward. But the convex part formed in the longitudinal direction both ends of the resin molding lid
  • FIGS. 4B and 5A are sectional views of the resin molded lid 1 in a steady state
  • FIGS. 4B and 5B are views of the resin molded lid 1 of the resin molded lid 1.
  • the resin-molded lid 1 has a substantially S-shaped cross section, and the lower part has a shape that matches the shape of the upper part of the capacitor 2a.
  • stress can be obtained by contracting the S-shaped portion from above by applying force to the lower side where the capacitor 2a is stored.
  • the capacitor 2a and the resin molding can be performed by the resin stress of the S-shaped molding portion 6 simply by attaching the resin molding lid 1 after the capacitor 2a is attached to the resin case 3.
  • the capacitor 2a can be pressed and fixed without generating a gap with the lid 1.
  • the S-shaped molded part 6 since the S-shaped molded part 6 has resin stress, it is not necessary to design the intervals between the plurality of lid connection holes 7 and 8 for accommodating capacitors of various sizes.
  • FIG. 6 is a development view showing the structure of the connection conductor 4 shown in the first embodiment.
  • FIG. 11 is an oblique projection showing a state in which the snubber device shown in the first embodiment is attached to the switching element. 6 and 11, a connection conductor 4 is a conductor to which the lead wire 9 of the capacitor 2a is attached and connected to the terminal of the switching element 14a.
  • a metal such as copper is used.
  • the terminal of the switching element 14a has a first terminal, a second terminal, and a third terminal in the case of a 2-in-1 type switching element in which two IGBTs shown in FIG. 11 are set, and the snubber device includes, for example, the first terminal and the first terminal. Connected to two terminals.
  • the first terminal is connected to the collector of one IGBT, and the second terminal is connected to the emitter of the other IGBT.
  • the third terminal is connected to the emitter of one IGBT and the collector of the other IGBT.
  • the snubber device is connected to the first terminal and the second terminal of the switching element 14 a together with the connection conductor 4.
  • the switching element 14a is an element that turns on / off a part of an electric circuit in order to convert power in a power conversion device that obtains desired output power from input power, for example, IGBT, MOS FET, GTO, A thyristor or the like is used.
  • the snubber device is provided in the vicinity of the switching element 14a.
  • connection conductor 4 is a conductor having a substantially L-shaped cross section, and has a cross-sectional Z-shaped molded portion 13 in one L-shaped piece, and the free end of the other L-shaped piece (connecting portion with the switching element). Is bent into a U-shaped cross section.
  • the cross-section Z-shaped molding portion 13 provided in the L-shaped piece is formed by bending the sheet metal portion between the pair of slits 12 provided in the L-shaped piece into the Z-shaped cross section, and forming the Z-shaped lead.
  • the stress due to the deformation of the cross-sectional Z-shaped molding portion 13 is molded so as to act on the L-shaped piece of the cross-sectional Z-shaped molding portion 13.
  • an unprocessed plate-like portion (not shown) excluding the processed cross-sectional Z-shaped molding portion 13 of the L-shaped piece, that is, the plate-like portions at both ends of the pair of slits 12, Stress is generated in the direction in which the lead wire 9 is present during insertion.
  • the cross-sectional Z-shaped molding part 13 has an insertion guide part 16 for guiding the insertion of the lead wire 9 and a drawer guide part 19 for guiding the lead wire 9 to be drawn. It can be done easily.
  • FIG. 7 is an oblique projection view of the connection conductor 4 having one cross-section Z-shaped molded portion 13 for connecting the lead wire 9 of the capacitor 2a.
  • FIGS. 8 (a) and 8 (b) show the connection conductor 4 and the capacitor 2a. It is sectional drawing before and behind connecting the lead wire 9.
  • FIG. 8A As a method for fixing the lead wire 9 of the capacitor 2a, first, as shown in FIG. 7 and FIG. 8A, the lead wire 9 of the capacitor 2a is in the direction indicated by the arrow (from the cross-sectional Z-shaped molded portion). 13 and the plate-like portion of the connection conductor 4), that is, along the insertion guide portion 16.
  • the lead wire 9 is pushed from the end of the cross-sectional Z-shaped molded part 13 to the intermediate part along the cross-sectional Z-shaped molded part 13 against the elastic force generated by the deformation of the cross-sectional Z-shaped molded part 13.
  • the lead wire 9 of the capacitor 2a is connected so as to be sandwiched between the intermediate portion of the cross-sectional Z-shaped molded portion 13 and the plate-like portion of the connecting conductor 4, and the capacitor shown in FIG. It is sandwiched and fixed by the stress caused by the deformation from the cross-section Z-shaped molded portion 13 indicated by the arrow toward the plate-like portion of the connection conductor 4 and the stress of the unprocessed plate-like portion.
  • the lead wire 9 of the capacitor can be easily inserted by the cross-sectional Z-shaped molded part 13, and after the insertion, the intermediate part of the cross-sectional Z-shaped molded part 13 plays a role of preventing the disconnection.
  • the insertion guide portion 16 is provided and the cross-sectional Z-shaped molding portion 13 having elasticity is molded into one piece of the connection conductor 4, it takes time and labor to solder a capacitor lead wire or attach a crimp terminal. Instead, the capacitor leads can be connected and fixed with a single touch. Further, since the cross-sectional Z-shaped molding portion 13 is also provided with the drawer guide portion 19, the lead wire can be easily removed. 1, 2, 6, 7, and 10 show an example in which one cross-sectional Z-shaped molded portion 13 is provided on one piece of the connection conductor 4. As shown, it is also possible to provide two or more cross-sectional Z-shaped molded parts 13. In the above description, the cross-sectional Z-shaped molding portion 13 has been described.
  • the insertion guide portion 16 that slides the lead wire 9 to guide between the plate-like portion of the connection conductor 4 and the cross-sectional Z-shaped molding portion 13 (molded portion).
  • connection conductor 4 that is, the connection part with the switching element is formed in a U-shape, and the U-shaped sheet metal molding part 11 in which the holes are formed on both the upper and lower sides of the U-shape.
  • the resin case 3 is also provided with a conductor fitting portion 10 which is a protruding portion for fixing to the switching element 14a, and has a hole for passing a screw.
  • connection conductor 4 that is, the front and back of the conductor fitting part 10 whose section is formed in an I shape is sandwiched between the U-shaped sheet metal molding parts 11 of the conductor. Since the screws are tightened, it is possible to prevent deformation and breakage of the resin due to the screw tightening rotational torque when the resin case 3 is directly fixed to the switching element 14a with the screws 15.
  • FIG. 2, FIG. 6, FIG. 7 and FIG. 9 are obtained by molding the U-shaped sheet metal molding part 11 on the upper side, but it is also possible to mold it on the lower side as shown in FIG.
  • the connecting conductor 4 is provided with the cross-sectional Z-shaped molded portion 13, and the cross-sectional Z-shaped molded portion 13 is generated between the plate-shaped portions of the connecting conductor 4 that are not processed.
  • This makes it easy to insert the lead wire 9 of the capacitor 2a between the plate-like portion of the connecting conductor 4 and the cross-section Z-shaped molded portion 13 with a single touch, and prevents the lead wire 9 from coming off after the insertion. It is possible to save the trouble of soldering or attaching the crimp terminal to the switching element, and at the same time, there is an effect that the connectivity between the lead wire 9 of the capacitor 2a and the switching element 14a is improved.
  • the lead wire 9 is pushed into the Z-shaped molded section 13 in a direction perpendicular to the longitudinal direction of the lead wire 9, the lead wire 9 is fixed to the connecting conductor 4 on the surface, heat generation is reduced, and surge voltage is reduced. There is an effect of improving the absorbability of.
  • a special capacitor such as a resin molded product for insulation is not required, and an inexpensive snubber device can be provided.
  • FIG. 12 is an exploded view showing the snubber device according to Embodiment 2 of the present invention
  • FIG. 13 is a connection completion diagram of the snubber device. 12 and 13, the snubber device includes a resin case 16, a capacitor 2 a, and a connection conductor 19.
  • the pair of resin cases 16 are molded products in which holes are formed according to various sizes of capacitors including the size of the capacitor 2a so that the resin case 16 can be inserted (fixed and fixed) into the capacitor 2a from both longitudinal sides of the capacitor 2a. . And the hole provided in the resin case 16 does not penetrate the resin case 16, and the insulation of the capacitor 2a is maintained. Further, when the resin case 16 is inserted into the capacitor 2 a, a lead drawing slit 18 for taking out the lead wire 9 of the capacitor 2 a from the resin case 16 so that the lead wire 9 of the capacitor 2 a is not caught by the resin case 16 is provided on the side surface of the resin case 16. It is provided so as to extend in the insertion direction.
  • the resin case 16 is provided with a step-shaped molded portion 22 having a stepped shape as shown in FIG. 14A or a taper-shaped portion 23 having a tapered shape as shown in FIG. 14B.
  • Capacitors 2a and 2b having different sizes can be inserted as shown in FIGS. 17 (a1) and (b1) and FIGS. 17 (a2) and (b2), and different sizes can be inserted as shown in FIGS. 18 (a) and 18 (b).
  • a snubber device can be realized.
  • FIG. 15 is a side view showing the relationship between the screw holes of the resin case 16 and the screw holes of the connection conductor 19, and FIG. 16 is a development view showing the structure of the connection conductor 19. 12 and 15, the resin case 16 is provided with a plurality of screw holes 17 for connecting conductors at equal intervals in the direction in which the capacitor 2 a is inserted into the resin case 16 above and below the lead wire drawing slit 18. Then, the connection conductor 19 is screwed in any hole provided in the upper part or the lower part of the lead wire drawing slit 18. On the other hand, case connection holes 20 are formed in the connection conductor 19 at intervals equal to the intervals of the conductor connection screw holes 17, and the connection conductor 19 is fixed to the resin case 16 with screws 29. That is, basically, the conductor connection screw hole 17 provided at a position farther from the capacitor 2a inserted into the resin case 16 is selected as the interval between the terminals of the switching element becomes wider.
  • one piece of the L-shaped connecting conductor 19 is provided with a Z-shaped molded portion 13 in cross section, and the other piece is provided with a device attachment hole 21 (elongate hole) for attachment to the switching element 14a.
  • the device mounting hole 21 is a long hole having substantially the same length as the gap between the conductor connecting screw holes 17 described above and extending in the insertion direction of the resin case 16. Fine adjustments can be made within the range.
  • a piece of plate-like portion (not shown) of the connection conductor 19 is screwed to the terminal of the switching element 14a through the device attachment hole 21.
  • connection conductor 19 since the configuration can be adjusted at the device mounting hole 21 and the position of the connecting conductor 19 at the plurality of conductor connecting screw holes 17, the adjustment of only the device mounting hole 21 and the plurality of conductor connecting screws are possible. It is possible to finely adjust the position of the connection conductor 19 as compared with the adjustment of only the hole 17. In addition, since a plurality of conductor connection screw holes 17 are provided, it is not necessary to increase the length of the device mounting hole 21 in the longitudinal direction, and the component size of the connection conductor 19 can be reduced.
  • FIG. 19A is an oblique projection showing the connection state of the snubber device when the distance between the connection terminals of the switching element is small
  • FIG. 19B is the case where the distance between the connection terminals of the switching element is large. It is an oblique projection figure which shows the connection state of this snubber apparatus.
  • the switching element 14b composed of one IGBT as shown in FIG. 19A
  • the size of the capacitor 2a and the like are also affected.
  • the screws 15 are formed inside the conductor connection screw holes 17 of the pair of connection conductors 19. It is fixed by.
  • the size of the capacitor 2b and the like are also affected, but for example, conductor connection screws of the pair of connection conductors 19 The outer sides of the holes 17 are fixed by screws 15.
  • the connecting portion of the connecting conductor 19 for connecting the lead wire 9 of the capacitor 2a is provided in one piece of the L-shaped cross section Z-shaped molding portion 13 provided in one piece of the L-shaped connecting conductor 19 as in the first embodiment.
  • the sheet metal part between the pair of slits 12 is provided with a Z-shaped molded part formed by bending the section into a Z-shaped cross section, and the connection of the capacitor lead wires is the same as in the first embodiment.
  • connection conductor 19 to the resin case 16 can be changed by a plurality of screw holes of the conductor connection screw holes 17 spaced at equal intervals in the resin case 16, and a device mounting hole 21 that can be finely adjusted. With this long hole, it is possible to attach the snubber device to the switching elements having different attachment positions.
  • the resin case 16 since the conductor connection screw holes 17 of the resin case 16 are formed above and below the slit, the resin case 16 has no left-right direction and can be configured by only one component.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Conversion In General (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Inverter Devices (AREA)

Abstract

In order to eliminate the need for attachment to a connecting part by attaching a crimping terminal to the lead of a capacitor or by soldering, and to connect the lead of a capacitor easily, provided is a snubber device equipped with: a capacitor that has lead wires, and that absorbs the surge voltage generated by a switching element by means of the lead wires; a resin case in which the capacitor is inserted and anchored; and connecting conductors that are formed with conductors, one piece of which is affixed to the resin case and the other piece of which is connected to a different terminal of the switching element. The lead wires are affixed to the connecting conductors by deforming a molded part, which is formed by processing one of the pieces of the connecting conductor, and by inserting the lead wires between the molded part and a plate-like part of the piece of the connecting conductor which excludes the molded part.

Description

スナバ装置Snubber equipment
 本発明は、電力変換装置に使用する半導体素子であるスイッチング素子の発生するサージ電圧を吸収することにより、発生したサージによる過電圧から直流側のコンデンサや電力変換器を保護するスナバ装置に関する。 The present invention relates to a snubber device that protects a DC-side capacitor and a power converter from an overvoltage caused by a generated surge by absorbing a surge voltage generated by a switching element that is a semiconductor element used in the power conversion device.
 サーボアンプやインバータのように電力変換器により直流を交流に変換したり、スイッチングコンバータで出力電圧を変化させる場合に、半導体素子であるスイッチング素子が使われ、そのスイッチング素子を高速でON、OFF(スイッチング)する。このスイッチングでは電流をON、OFFするため、その切り替わりの過渡状態で大きなサージ電圧が発生し、瞬時的に直流母線電圧が上昇してスイッチング素子自体や直流側のコンデンサの耐圧限界を超えて、電力変換器やコンデンサを破壊する可能性がある。そのため、スイッチング素子の近傍にサージ電圧を吸収するため、コンデンサ単体やコンデンサと抵抗を組み合わせたスナバ装置を配置し、発生したサージ電圧を吸収する。 A switching element, which is a semiconductor element, is used to convert direct current to alternating current with a power converter, such as a servo amplifier or inverter, or to change the output voltage with a switching converter. Switching). In this switching, the current is turned on and off, so a large surge voltage is generated in the transitional state of the switching, the DC bus voltage rises instantaneously and exceeds the breakdown voltage limit of the switching element itself and the DC side capacitor, There is a possibility of destroying the converter and capacitor. Therefore, in order to absorb the surge voltage in the vicinity of the switching element, a snubber device in which a capacitor alone or a combination of a capacitor and a resistor is arranged to absorb the generated surge voltage.
 スイッチング素子の発生するサージ電圧吸収のためのスナバ素子としてコンデンサを使用するが、スイッチング素子が発生するサージ電圧を吸収するためには、スイッチング素子の端子とスナバ素子との間のリアクタンスを最小限とするため、スナバ装置をスイッチング素子の直近に取り付ける必要があり、以前はスナバ素子であるコンデンサとその周りの回路との絶縁を確保するために絶縁チューブを取り付けたり、スイッチング素子へ取り付けるために圧着端子を取り付けたり、振動対策のためにスナバ素子をボンドで固定していた。しかしながら手作業が多く、工数が掛かるため、近年では樹脂ケースに入れモールドしたものが主流となっており、スナバ回路を構成する部品を導体板に貼付け、半導体素子に取り付ける引き出し端子とともに樹脂でモールドすることにより、スナバ装置を構成している(例えば、特許文献1参照)。 A capacitor is used as a snubber element for absorbing the surge voltage generated by the switching element. To absorb the surge voltage generated by the switching element, the reactance between the terminal of the switching element and the snubber element is minimized. Therefore, it is necessary to attach the snubber device in the immediate vicinity of the switching element. Previously, the insulation tube was attached to secure the insulation between the snubber element capacitor and the circuit around it, and the crimp terminal to attach to the switching element. A snubber element was fixed with a bond to prevent vibrations. However, since it requires a lot of manual work and man-hours, in recent years, what has been molded in a resin case has become the mainstream, and the components that make up the snubber circuit are affixed to a conductor plate and molded with resin together with the lead terminals attached to the semiconductor elements. Thus, a snubber device is configured (see, for example, Patent Document 1).
特開2000-102241号公報(第4頁0020欄及び図2)Japanese Patent Laid-Open No. 2000-102241 (page 4, column 0020 and FIG. 2)
 しかしながら、その樹脂モールド品は重量が非常に大きく、また、コストも非常に高くなることが問題であった。更に、スナバ回路を構成する部品として使用するコンデンサの断面が楕円形や円形といった独特な形状であるため、固定が困難であることや、導体部が細いリード線であるため、接続が困難であり、従来は半田付けや溶接により接続しており、作業性が悪いといった問題があった。 However, the resin mold product has a problem that its weight is very large and the cost is very high. Furthermore, since the cross section of the capacitor used as a component constituting the snubber circuit is a unique shape such as an ellipse or a circle, it is difficult to fix or the conductor part is a thin lead wire, making connection difficult. Conventionally, they are connected by soldering or welding, and there is a problem that workability is poor.
 この発明は、上述のような課題を解決するためになされたものであり、接続導体に成型された成型部の変形に伴い発生する応力を利用することで、コンデンサのリードに圧着端子の取付けや半田付け等による接続部への貼付けを不要にし、容易にコンデンサのリードを固定できることを目的とする。 The present invention has been made to solve the above-described problems, and by using the stress generated along with the deformation of the molded portion formed in the connection conductor, the crimp terminal is attached to the capacitor lead. The object is to eliminate the need for soldering or the like to be attached to the connection portion and to easily fix the capacitor leads.
 この発明に係るスナバ装置は、リード線を有し、スイッチング素子が発生するサージ電圧をリード線を介して吸収するコンデンサと、コンデンサを嵌め込み固定する樹脂ケースと、導体で形成され、一片が樹脂ケースにそれぞれ固定されるとともに、他片がスイッチング素子の異なる端子にそれぞれ接続される接続導体と、を備え、リード線は接続導体の一片を加工して成る成型部の変形により成型部を除く接続導体の一片の板状部と成型部との間に挟み込まれて接続導体に固定されるものである。 A snubber device according to the present invention includes a lead wire, a capacitor that absorbs a surge voltage generated by a switching element via the lead wire, a resin case that fits and fixes the capacitor, and a conductor, and one piece is a resin case. Connecting conductors that are fixed to each other and whose other pieces are respectively connected to different terminals of the switching element, and the lead wire is a connecting conductor that excludes the molding part by deformation of the molding part formed by processing one piece of the connection conductor Between the plate-shaped part of one piece and the molding part and fixed to the connection conductor.
この発明に係るスナバ装置によれば、接続導体に成型された成型部の変形に伴い発生する応力を利用することで、コンデンサのリードに圧着端子の取付けや半田付け等による接続部への貼付けを不要にし、容易にコンデンサのリードを接続できるという効果を有する。 According to the snubber device according to the present invention, by using the stress generated with the deformation of the molded portion formed in the connection conductor, the crimping terminal is attached to the capacitor lead or attached to the connection portion by soldering or the like. There is an effect that the capacitor lead can be easily connected without using it.
この発明の実施の形態1によるスナバ装置の分解図である。It is an exploded view of the snubber apparatus by Embodiment 1 of this invention. この発明の実施の形態1によるスナバ装置における接続完成図である。It is a connection completion figure in the snubber apparatus by Embodiment 1 of this invention. この発明の実施の形態1による樹脂ケースにコンデンサを挿入する前後の平面図である。It is a top view before and behind inserting a capacitor | condenser in the resin case by Embodiment 1 of this invention. この発明の実施の形態1による樹脂成型蓋の変形前後の断面図である。It is sectional drawing before and behind a deformation | transformation of the resin molding lid by Embodiment 1 of this invention. この発明の実施の形態1によるコンデンサが挿入された樹脂ケースに樹脂成型蓋が取り付けられる前後を示した断面図である。It is sectional drawing which showed before and after the resin molding lid | cover is attached to the resin case in which the capacitor | condenser by Embodiment 1 of this invention was inserted. この発明の実施の形態1による接続導体の構造を示す展開図である。It is an expanded view which shows the structure of the connection conductor by Embodiment 1 of this invention. この発明の実施の形態1によるコンデンサのリード線を接続するZ型成型部を1つ備えた接続導体の斜投影図である。FIG. 3 is an oblique projection view of a connection conductor provided with one Z-shaped molded part for connecting a capacitor lead wire according to Embodiment 1 of the present invention; この発明の実施の形態1による接続導体にコンデンサのリード線を接続する前後の断面図である。It is sectional drawing before and behind connecting the lead wire of a capacitor | condenser to the connection conductor by Embodiment 1 of this invention. この発明の実施の形態1によるコンデンサのリード線を接続するZ型成型部を2つ備えた接続導体の斜投影図である。FIG. 5 is an oblique projection view of a connection conductor having two Z-shaped molded portions that connect the lead wires of the capacitor according to Embodiment 1 of the present invention. この発明の実施の形態1によるコンデンサのリード線を接続するZ型成型部を1つ備えた別の接続導体の斜投影図である。FIG. 6 is an oblique projection view of another connection conductor provided with one Z-shaped molded portion for connecting a capacitor lead wire according to Embodiment 1 of the present invention; この発明の実施の形態1によるスナバ装置をスイッチング素子へ取り付ける状態を示す斜投影図である。It is a perspective view which shows the state which attaches the snubber apparatus by Embodiment 1 of this invention to a switching element. この発明の実施の形態2によるスナバ装置の分解図である。It is an exploded view of the snubber apparatus by Embodiment 2 of this invention. この発明の実施の形態2によるスナバ装置における接続完成図である。It is a connection completion figure in the snubber apparatus by Embodiment 2 of this invention. この発明の実施の形態2による樹脂ケースに設けられた階段状あるいはテーパ状の加工を示す断面図である。It is sectional drawing which shows the staircase-shaped or taper-shaped process provided in the resin case by Embodiment 2 of this invention. この発明の実施の形態2による樹脂ケースのネジ穴と接続導体のネジ穴の関係を示す側面図である。It is a side view which shows the relationship between the screw hole of the resin case by Embodiment 2 of this invention, and the screw hole of a connection conductor. この発明の実施の形態2による接続導体の構造を示す展開図である。It is an expanded view which shows the structure of the connection conductor by Embodiment 2 of this invention. この発明の実施の形態2によるサイズの異なるコンデンサを樹脂ケースへ挿入する前後の断面図である。It is sectional drawing before and behind inserting the capacitor | condenser from which size differs by Embodiment 2 of this invention in a resin case. この発明の実施の形態2によるサイズの異なるコンデンサを樹脂ケースへ挿入する前後のスナバ装置における接続完成図である。It is a connection completion figure in the snubber apparatus before and behind inserting the capacitor in which size differs by Embodiment 2 of this invention in a resin case. この発明の実施の形態2によるサイズの異なるスナバ装置の接続状態を示す斜投影図である。It is an oblique projection which shows the connection state of the snubber apparatus from which size differs by Embodiment 2 of this invention.
実施の形態1.
 以下、この発明を実施するための形態について、図面を参照して説明する。
Embodiment 1 FIG.
Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.
 図1は、本発明の実施の形態1におけるスナバ装置を示す分解図であり、図2は、スナバ装置の接続完成図である。スナバ装置とは、スイッチング素子の動作時に発生するサージ電圧を効率良く吸収してスイッチング素子の過電圧破壊を防止するものである。図1、2において、スナバ装置は樹脂成型蓋1、コンデンサ2a、樹脂ケース3及び接続導体4から構成される。コンデンサ2aからはスイッチング素子と接続するための2本のリード線9が延びて出ており、このリード線9を介してスイッチング素子が発生するサージ電圧をコンデンサ2aが吸収する。また、樹脂ケース3は、コンデンサ2aを嵌め込むとともに固定するものである。また、樹脂成型蓋1は、樹脂ケース3に嵌め込まれたコンデンサ2aを上方から覆い固定するものであり、コンデンサ2aの長手方向端部には後述の加工が施されており、樹脂ケース3に取り付けられる。さらに、接続導体4は樹脂ケース3と協働してコンデンサ2aの有する2本のリード線9を挟み込んで固定し、スイッチング素子にワンタッチで取り付けられるものである。 FIG. 1 is an exploded view showing a snubber device according to Embodiment 1 of the present invention, and FIG. 2 is a completed connection diagram of the snubber device. The snubber device efficiently absorbs a surge voltage generated during operation of the switching element to prevent overvoltage breakdown of the switching element. 1 and 2, the snubber device includes a resin molded lid 1, a capacitor 2 a, a resin case 3, and a connection conductor 4. Two lead wires 9 for connecting to the switching element extend from the capacitor 2 a, and the capacitor 2 a absorbs a surge voltage generated by the switching element through the lead wire 9. The resin case 3 is for fixing and fixing the capacitor 2a. The resin-molded lid 1 covers and fixes the capacitor 2a fitted in the resin case 3 from above, and the end of the capacitor 2a in the longitudinal direction is processed as described later, and is attached to the resin case 3. It is done. Further, the connection conductor 4 is fixed by sandwiching and fixing the two lead wires 9 of the capacitor 2a in cooperation with the resin case 3, and is attached to the switching element with one touch.
 なお、図1では樹脂ケース3は2方向にのみ壁がある例を示したが、3方向が壁であっても良いし、箱状のように4方向が壁であっても良い。そして、4方向が壁である箱状の樹脂ケースの場合には、コンデンサのリードを出すための穴または、隙間を設ける。 In addition, although the resin case 3 showed the example which has a wall only in 2 directions in FIG. 1, 3 directions may be a wall and 4 directions may be a wall like a box shape. In the case of a box-shaped resin case whose walls are in four directions, holes or gaps are provided for leading out the capacitor leads.
 図3(a)は、コンデンサ2aを樹脂ケース3に挿入する前の平面図であり、図3(b)は、コンデンサ2aを樹脂ケース3に挿入した後の平面図である。
 図1、図3に示すとおり、コンデンサ2aを覆う樹脂ケース3の両壁、つまり樹脂ケース3の対向する内壁にはそれぞれ例えば断面が略ノの字に成型されたノの字型樹脂成型部5を備えている。そして図3(b)に示すとおり、ノの字型樹脂成型部5の静止に逆らってコンデンサ2aをノの字型樹脂成型部5の固定端(ノの字型樹脂成型部5と樹脂ケース3が固定される端部)から自由端(どこにも固定されない自由な端部)の方向へ滑らせるよう差し込むと、コンデンサ2aをワンタッチで取り付けることが可能であり、ノの字型樹脂成型部5が変形する際の樹脂の応力によりコンデンサ2aを挟み込み固定する。
FIG. 3A is a plan view before the capacitor 2 a is inserted into the resin case 3, and FIG. 3B is a plan view after the capacitor 2 a is inserted into the resin case 3.
As shown in FIG. 1 and FIG. 3, each of the walls of the resin case 3 covering the capacitor 2 a, that is, the opposing inner walls of the resin case 3, for example, has a substantially U-shaped cross section. It has. Then, as shown in FIG. 3 (b), the capacitor 2a is fixed to the fixed end of the U-shaped resin molded portion 5 (the U-shaped resin molded portion 5 and the resin case 3 against the stationary state of the U-shaped resin molded portion 5). The capacitor 2a can be attached with one touch by inserting it so that it slides in the direction from the free end (free end that is not fixed anywhere) to the free end. The capacitor 2a is sandwiched and fixed by the stress of the resin at the time of deformation.
 なお、ノの字型樹脂成型部5は、必ずしも樹脂ケース3の両壁に一対設ける必要はなく、一方の壁に1つ設けるだけでもかまわない。また、例えば、コンデンサ2aを囲む樹脂ケース3の壁が4方向の場合には、上方からコンデンサ2aを差し込むことが考えられ、図1に示すノの字型樹脂成型部5を略90度回動させ、コンデンサ2aをノの字型樹脂成型部5の固定端から自由端に滑らせるような構造を採用しても良い。さらに、ノの字型樹脂成型部5は複数設けても良い。また、必ずしも断面を略ノの字に成型する必要はなく、一端を樹脂ケース3の内に壁に固定し、応力が発生するような弾性部材であれば他の形状であっても良いし、樹脂でなくても良い。 In addition, it is not always necessary to provide a pair of the U-shaped resin molded portions 5 on both walls of the resin case 3, and only one may be provided on one wall. Further, for example, when the wall of the resin case 3 surrounding the capacitor 2a is in four directions, it is conceivable that the capacitor 2a is inserted from above, and the U-shaped resin molded portion 5 shown in FIG. A structure in which the capacitor 2a is slid from the fixed end to the free end of the U-shaped resin molding portion 5 may be employed. Further, a plurality of the U-shaped resin molded portions 5 may be provided. Moreover, it is not always necessary to mold the cross section into a substantially square shape, and one end may be fixed to the wall inside the resin case 3 and may be another shape as long as it is an elastic member that generates stress. It may not be resin.
 また、樹脂成型蓋1を取り付ける蓋接続穴7、8は数箇所空いており、異なる厚みのコンデンサを取り付けた場合においても樹脂成型蓋1が蓋接続穴7、8と嵌合して取り付けられる構造を備える。ここで、蓋接続穴7、8は異なる形状の穴であり、例えば樹脂成型蓋1の長手方向一端部に形成された凸部を蓋接続穴8に嵌め込んだ後、樹脂成型蓋1の長手方向他端部に形成された逆三角形状の凸部を下方に押圧しながら複数設けられた蓋接続穴7のうち適切な穴の位置で樹脂ケース3に取り付ける。もっとも、樹脂成型蓋1の長手方向両端部に形成された凸部及び蓋接続穴7、8は同形状であっても良い。 The lid connection holes 7 and 8 for attaching the resin-molded lid 1 are vacant at several locations, and the resin-molded lid 1 can be fitted and attached to the lid connection holes 7 and 8 even when capacitors having different thicknesses are attached. Is provided. Here, the lid connection holes 7 and 8 are holes having different shapes. For example, after the convex portion formed at one end in the longitudinal direction of the resin molded lid 1 is fitted into the lid connection hole 8, the length of the resin molded lid 1 is increased. A plurality of lid connection holes 7 are attached to the resin case 3 at appropriate positions among the plurality of lid connection holes 7 while pressing the inverted triangular projections formed at the other end in the direction downward. But the convex part formed in the longitudinal direction both ends of the resin molding lid | cover 1 and the lid | cover connection holes 7 and 8 may be the same shape.
 図4(a)及び図5(a)は、樹脂成型蓋1の定常時の状態の断面図であり、図4(b)及び図5(b)は、樹脂成型蓋1の樹脂成型蓋のS字成型部を変化させたときの樹脂応力を示す断面図である。
 図4(a)に示すとおり、前記の樹脂成型蓋1は断面略S字型に成型されており、下部はコンデンサ2aの上部の形状に合わせた形状を有している。そして、図4(b)のようにS字部分を上方からコンデンサ2aが収納されている下方に力を加えて収縮させることにより、応力を得ることが可能である。これを利用することにより、図5(b)に示すとおり、樹脂ケース3にコンデンサ2aを取り付けた後に樹脂成型蓋1を取り付けるだけで、S字型成型部6の樹脂応力によりコンデンサ2aと樹脂成型蓋1との間に隙間を生じることなくコンデンサ2aを押さえ込み固定することを可能とする。また、S字型成型部6が樹脂応力を有するため、様々なサイズのコンデンサに対応するための複数有する蓋接続穴7、8の間隔を細かく設計する必要がなくなる。
4A and 5A are sectional views of the resin molded lid 1 in a steady state, and FIGS. 4B and 5B are views of the resin molded lid 1 of the resin molded lid 1. It is sectional drawing which shows the resin stress when changing an S-shaped molded part.
As shown in FIG. 4A, the resin-molded lid 1 has a substantially S-shaped cross section, and the lower part has a shape that matches the shape of the upper part of the capacitor 2a. Then, as shown in FIG. 4B, stress can be obtained by contracting the S-shaped portion from above by applying force to the lower side where the capacitor 2a is stored. By using this, as shown in FIG. 5 (b), the capacitor 2a and the resin molding can be performed by the resin stress of the S-shaped molding portion 6 simply by attaching the resin molding lid 1 after the capacitor 2a is attached to the resin case 3. The capacitor 2a can be pressed and fixed without generating a gap with the lid 1. In addition, since the S-shaped molded part 6 has resin stress, it is not necessary to design the intervals between the plurality of lid connection holes 7 and 8 for accommodating capacitors of various sizes.
 図6は、実施の形態1に示す接続導体4の構造を示す展開図である。また、図11は、実施の形態1に示すスナバ装置をスイッチング素子に取り付けた状態を示す斜投影図である。
 図6及び図11において、接続導体4はコンデンサ2aのリード線9を取り付けるとともにスイッチング素子14aの端子に接続する導体であり、例えば銅等の金属が用いられる。スイッチング素子14aの端子は図11に示すIGBT2つが1セットとなった2in1のタイプのスイッチング素子の場合、第1端子、第2端子及び第3端子を有し、スナバ装置は例えば第1端子及び第2端子に接続される。また、2in1タイプのスイッチング素子は、第1端子が一方のIGBTのコレクタと接続され、第2端子が他方のIGBTのエミッタと接続されている。また、第3端子は、一方のIGBTのエミッタ及び他方のIGBTのコレクタと接続されている。そして、スナバ装置は接続導体4とともにスイッチング素子14aの第1端子及び第2端子に接続されている。ここで、スイッチング素子14aとは、入力電力から希望の出力電力を得る電力変換装置において、電力を変換するために電気回路の一部をON/OFFする素子であり例えばIGBT、MOS FET、GTO、サイリスタ等が使用される。
FIG. 6 is a development view showing the structure of the connection conductor 4 shown in the first embodiment. FIG. 11 is an oblique projection showing a state in which the snubber device shown in the first embodiment is attached to the switching element.
6 and 11, a connection conductor 4 is a conductor to which the lead wire 9 of the capacitor 2a is attached and connected to the terminal of the switching element 14a. For example, a metal such as copper is used. The terminal of the switching element 14a has a first terminal, a second terminal, and a third terminal in the case of a 2-in-1 type switching element in which two IGBTs shown in FIG. 11 are set, and the snubber device includes, for example, the first terminal and the first terminal. Connected to two terminals. In the 2-in-1 type switching element, the first terminal is connected to the collector of one IGBT, and the second terminal is connected to the emitter of the other IGBT. The third terminal is connected to the emitter of one IGBT and the collector of the other IGBT. The snubber device is connected to the first terminal and the second terminal of the switching element 14 a together with the connection conductor 4. Here, the switching element 14a is an element that turns on / off a part of an electric circuit in order to convert power in a power conversion device that obtains desired output power from input power, for example, IGBT, MOS FET, GTO, A thyristor or the like is used.
 また、スイッチング素子14aから遠ざけるとスイッチング素子14aとスナバ装置との間のリアクタンスが増大し、コンデンサ2aの吸収するサージ電圧が減少するので、スナバ装置をスイッチング素子14aの近傍に設けている。 Further, since the reactance between the switching element 14a and the snubber device increases as the distance from the switching element 14a increases and the surge voltage absorbed by the capacitor 2a decreases, the snubber device is provided in the vicinity of the switching element 14a.
 図6において、接続導体4は断面略L型の導体であり、L型の一片に断面Z型成型部13を有しており、L型の他片の自由端(スイッチング素子との接続部)は折れ曲がり断面コの字に成型されている。
 L型の一片に設けられた断面Z型成型部13は、L型の一片に設けられた一対のスリット12間の板金部分を断面Z型に折り曲げて成型され、Z型に成型したことからリード線9を断面Z型成型部13の挿入案内部16に挿入する時に断面Z型成型部13が圧縮する方向と反対方向に応力が生まれる。そして、断面Z型成型部13の変形による応力が、断面Z型成型部13のL型の一片に働くよう成型している。同様に、L型の一片のうち加工された断面Z型成型部13を除いた加工されていない板状部(図示略)つまり一対のスリット12の両端にある板状部は、リード線9の挿入時にリード線9のある方向に応力を生じる。また、断面Z型成型部13は、リード線9の挿入を案内する挿入案内部16、及びリード線9の引き出しを案内する引き出し案内部19を有するので、リード線9の挿入及び引き出しがワンタッチで容易に行うことが可能である。
In FIG. 6, the connection conductor 4 is a conductor having a substantially L-shaped cross section, and has a cross-sectional Z-shaped molded portion 13 in one L-shaped piece, and the free end of the other L-shaped piece (connecting portion with the switching element). Is bent into a U-shaped cross section.
The cross-section Z-shaped molding portion 13 provided in the L-shaped piece is formed by bending the sheet metal portion between the pair of slits 12 provided in the L-shaped piece into the Z-shaped cross section, and forming the Z-shaped lead. When the wire 9 is inserted into the insertion guide part 16 of the cross-sectional Z-shaped molding part 13, a stress is generated in a direction opposite to the direction in which the cross-sectional Z-shaped molding part 13 is compressed. Then, the stress due to the deformation of the cross-sectional Z-shaped molding portion 13 is molded so as to act on the L-shaped piece of the cross-sectional Z-shaped molding portion 13. Similarly, an unprocessed plate-like portion (not shown) excluding the processed cross-sectional Z-shaped molding portion 13 of the L-shaped piece, that is, the plate-like portions at both ends of the pair of slits 12, Stress is generated in the direction in which the lead wire 9 is present during insertion. Further, the cross-sectional Z-shaped molding part 13 has an insertion guide part 16 for guiding the insertion of the lead wire 9 and a drawer guide part 19 for guiding the lead wire 9 to be drawn. It can be done easily.
 図7はコンデンサ2aのリード線9を接続する断面Z型成型部13を1つ備えた接続導体4の斜投影図であり、図8(a)、(b)は接続導体4にコンデンサ2aのリード線9を接続する前後の断面図である。
 コンデンサ2aのリード線9の固定方法としては、先ず図7及び図8(a)に示すとおり、コンデンサ2aのリード線9は断面Z型成型部13の上方より矢印の方向(断面Z型成型部13と接続導体4の板状部の間)つまり挿入案内部16に沿って押し込む。このとき、リード線9を断面Z型成型部13の変形により発生する弾性力に逆らって断面Z型成型部13に沿って断面Z型成型部13の端部から中間部まで押し込む。
FIG. 7 is an oblique projection view of the connection conductor 4 having one cross-section Z-shaped molded portion 13 for connecting the lead wire 9 of the capacitor 2a. FIGS. 8 (a) and 8 (b) show the connection conductor 4 and the capacitor 2a. It is sectional drawing before and behind connecting the lead wire 9. FIG.
As a method for fixing the lead wire 9 of the capacitor 2a, first, as shown in FIG. 7 and FIG. 8A, the lead wire 9 of the capacitor 2a is in the direction indicated by the arrow (from the cross-sectional Z-shaped molded portion). 13 and the plate-like portion of the connection conductor 4), that is, along the insertion guide portion 16. At this time, the lead wire 9 is pushed from the end of the cross-sectional Z-shaped molded part 13 to the intermediate part along the cross-sectional Z-shaped molded part 13 against the elastic force generated by the deformation of the cross-sectional Z-shaped molded part 13.
 そして、図8(b)に示すとおり、コンデンサ2aのリード線9は、断面Z型成型部13の中間部と接続導体4の板状部に挟まれるように接続され、図8(b)の矢印で示す断面Z型成型部13から接続導体4の板状部に向かう変形による応力と加工されていない板状部の応力で挟まれ固定される。また、断面Z型成型部13によりコンデンサのリード線9を挿入し易くし、挿入後は断面Z型成型部13の中間部が抜け防止の役割を果たす。 8B, the lead wire 9 of the capacitor 2a is connected so as to be sandwiched between the intermediate portion of the cross-sectional Z-shaped molded portion 13 and the plate-like portion of the connecting conductor 4, and the capacitor shown in FIG. It is sandwiched and fixed by the stress caused by the deformation from the cross-section Z-shaped molded portion 13 indicated by the arrow toward the plate-like portion of the connection conductor 4 and the stress of the unprocessed plate-like portion. Also, the lead wire 9 of the capacitor can be easily inserted by the cross-sectional Z-shaped molded part 13, and after the insertion, the intermediate part of the cross-sectional Z-shaped molded part 13 plays a role of preventing the disconnection.
 挿入案内部16を設けるとともに弾性力を有する断面Z型成型部13を接続導体4の一片に成型したので、コンデンサのリード線を半田付けしたり、圧着端子を取り付けつけたりする手間の掛かる作業を必要とせずワンタッチでコンデンサのリードの接続、固定を可能にする。また、断面Z型成型部13には、引き出し案内部19も設けられているため、容易にリード線の取り外しが可能となる。また、図1、図2、図6、図7及び図10は断面Z型成型部13を接続導体4の一片に1つ設けた例を示したが、接続性の向上のため、図9に示すとおり、断面Z型成型部13を2つまたはそれ以上に設けることも可能である。なお、上記では断面Z型成型部13として説明してきたが、リード線9を滑らせて接続導体4の板状部と断面Z型成型部13(成型部)の間に案内する挿入案内部16及びリード線9を引き出すための引き出し案内部19が設けられており、且つ成型部及び板状部の応力でリード線9を挟み込んで固定する形状であれば必ずしも断面Z型に成型する必要はない。 Since the insertion guide portion 16 is provided and the cross-sectional Z-shaped molding portion 13 having elasticity is molded into one piece of the connection conductor 4, it takes time and labor to solder a capacitor lead wire or attach a crimp terminal. Instead, the capacitor leads can be connected and fixed with a single touch. Further, since the cross-sectional Z-shaped molding portion 13 is also provided with the drawer guide portion 19, the lead wire can be easily removed. 1, 2, 6, 7, and 10 show an example in which one cross-sectional Z-shaped molded portion 13 is provided on one piece of the connection conductor 4. As shown, it is also possible to provide two or more cross-sectional Z-shaped molded parts 13. In the above description, the cross-sectional Z-shaped molding portion 13 has been described. However, the insertion guide portion 16 that slides the lead wire 9 to guide between the plate-like portion of the connection conductor 4 and the cross-sectional Z-shaped molding portion 13 (molded portion). In addition, it is not always necessary to mold the lead wire 9 into a Z-shaped cross section as long as the lead guide portion 19 for pulling out the lead wire 9 is provided and the lead wire 9 is sandwiched and fixed by the stress of the molding portion and the plate-like portion. .
 また、リード線9の長手方向と直交する方向にリード線9を断面Z型成型部13に押し込んでいるので、リード線9と接続導体4との接触面積が増加し、発熱性が低くなり、サージ電圧の吸収性が向上するといった効果がある。 In addition, since the lead wire 9 is pushed into the cross-sectional Z-shaped molded part 13 in a direction perpendicular to the longitudinal direction of the lead wire 9, the contact area between the lead wire 9 and the connecting conductor 4 increases, and the heat generation becomes low, There is an effect that the surge voltage absorbability is improved.
 一方、図6~図8において、接続導体4の他片つまりスイッチング素子との接続部はコの字に成型され、穴がコの字型の上下ともに空けられたコの字板金成型部11を有している。また、図1のとおり、樹脂ケース3にもスイッチング素子14aへ固定するための出っ張った部分である導体嵌合部10を備え、ネジを通すための穴を備えてある。 On the other hand, in FIG. 6 to FIG. 8, the other part of the connection conductor 4, that is, the connection part with the switching element is formed in a U-shape, and the U-shaped sheet metal molding part 11 in which the holes are formed on both the upper and lower sides of the U-shape. Have. Further, as shown in FIG. 1, the resin case 3 is also provided with a conductor fitting portion 10 which is a protruding portion for fixing to the switching element 14a, and has a hole for passing a screw.
 図1及び図11で、樹脂ケース3と接続導体4をスイッチング素子14aへ接続する時は接続導体4のコの字板金成型部11のコの字の空間に樹脂ケース3の導体嵌合部10を挟みこみ、樹脂ケース3及び接続導体4を一括でスイッチング素子14aにネジ15でネジ締めして固定を行うことが可能である。 1 and 11, when the resin case 3 and the connection conductor 4 are connected to the switching element 14a, the conductor fitting portion 10 of the resin case 3 is inserted into the U-shaped space of the U-shaped sheet metal molding portion 11 of the connection conductor 4. It is possible to fix the resin case 3 and the connection conductor 4 by screwing them to the switching element 14a with screws 15 in a lump.
ここで接続導体4にコの字板金成型部11を設けてあるため、つまり、断面がI字状に形成された導体嵌合部10の表裏を導体のコの字板金成型部11で挟み込んでネジ締めするので、樹脂ケース3をスイッチング素子14aに直接ネジ15で固定する場合のネジ締めの回転トルクによる樹脂の変形や破損を防止することができる。また、図1、図2、図6、図7及び図9はコの字板金成型部11を上側に成型したものであるが、図10のように下側に成型することも可能である。 Here, since the U-shaped sheet metal molding part 11 is provided in the connection conductor 4, that is, the front and back of the conductor fitting part 10 whose section is formed in an I shape is sandwiched between the U-shaped sheet metal molding parts 11 of the conductor. Since the screws are tightened, it is possible to prevent deformation and breakage of the resin due to the screw tightening rotational torque when the resin case 3 is directly fixed to the switching element 14a with the screws 15. 1, FIG. 2, FIG. 6, FIG. 7 and FIG. 9 are obtained by molding the U-shaped sheet metal molding part 11 on the upper side, but it is also possible to mold it on the lower side as shown in FIG.
 上記のような実施の形態1のスナバ装置によれば、接続導体4に断面Z型成型部13を設け、断面Z型成型部13が接続導体4の加工されていない板状部相互に生じる応力によりコンデンサ2aのリード線9を接続導体4の板状部と断面Z型成型部13との間にワンタッチで挿入し易くし、挿入後は抜け防止の役割を果たすので、コンデンサ2aのリード線をはんだ付けしたり、圧着端子をスイッチング素子に取り付けたりする手間を省くことができるとともにコンデンサ2aのリード線9とスイッチング素子14aとの接続性が向上するという効果を奏する。 According to the snubber device of the first embodiment as described above, the connecting conductor 4 is provided with the cross-sectional Z-shaped molded portion 13, and the cross-sectional Z-shaped molded portion 13 is generated between the plate-shaped portions of the connecting conductor 4 that are not processed. This makes it easy to insert the lead wire 9 of the capacitor 2a between the plate-like portion of the connecting conductor 4 and the cross-section Z-shaped molded portion 13 with a single touch, and prevents the lead wire 9 from coming off after the insertion. It is possible to save the trouble of soldering or attaching the crimp terminal to the switching element, and at the same time, there is an effect that the connectivity between the lead wire 9 of the capacitor 2a and the switching element 14a is improved.
 また、一般的なリードタイプのコンデンサ使用時に必要であった絶縁チューブ装着や圧着端子の取り付けが不要であり、また振動対策用のボンド固定といった手作業や樹脂モールド化が不要であるため、工数削減と品質の安定性を向上することが可能である。 In addition, it is not necessary to install insulation tubes and crimp terminals, which are necessary when using general lead-type capacitors, and because there is no need for manual work such as bond fixing for vibration countermeasures or resin molding, reducing man-hours. And it is possible to improve the quality stability.
 また、リード線9の長手方向と直交する方向にリード線9を断面Z型成型部13に押し込んでいるので、リード線9は面で接続導体4と固定され、発熱性が低くなり、サージ電圧の吸収性が向上するといった効果がある。 Further, since the lead wire 9 is pushed into the Z-shaped molded section 13 in a direction perpendicular to the longitudinal direction of the lead wire 9, the lead wire 9 is fixed to the connecting conductor 4 on the surface, heat generation is reduced, and surge voltage is reduced. There is an effect of improving the absorbability of.
また、樹脂ケース3の導体嵌合部10の表裏を導体で挟み込んでネジ締めするので、樹脂ケース3をスイッチング素子14aに直接ネジ15で固定する場合のネジ締めの回転トルクによる樹脂の変形や破損を防止することができる。 Moreover, since the front and back of the conductor fitting portion 10 of the resin case 3 are sandwiched between the conductors and tightened with screws, the resin case 3 is deformed or damaged due to the rotational torque of the screw tightening when the resin case 3 is directly fixed to the switching element 14a with the screws 15. Can be prevented.
また、コンデンサ2aの異なる高さサイズへ対応可能であり、型費が削減できるとともに工数を削減することが可能である。 Moreover, it is possible to cope with different height sizes of the capacitor 2a, so that the mold cost can be reduced and the man-hours can be reduced.
また、絶縁のための樹脂モールド品等の特殊コンデンサが不要となり、安価なスナバ装置を提供することが可能である。 In addition, a special capacitor such as a resin molded product for insulation is not required, and an inexpensive snubber device can be provided.
実施の形態2.
 実施の形態2の構成を説明する。なお、実施の形態1と同様の構成は適宜省略する。
 図12は、本発明の実施の形態2におけるスナバ装置を示す分解図であり、図13は、スナバ装置における接続完成図である。図12及び図13において、スナバ装置は、樹脂ケース16、コンデンサ2a、接続導体19から構成される。
Embodiment 2. FIG.
The configuration of the second embodiment will be described. Note that the same configurations as those in Embodiment 1 are omitted as appropriate.
FIG. 12 is an exploded view showing the snubber device according to Embodiment 2 of the present invention, and FIG. 13 is a connection completion diagram of the snubber device. 12 and 13, the snubber device includes a resin case 16, a capacitor 2 a, and a connection conductor 19.
 コンデンサ2aからは2本のリード線9が素子の端より延びて出ている。また、一対の樹脂ケース16はコンデンサ2aの長手方向両側からコンデンサ2aに挿入(嵌め込みして固定)できるようコンデンサ2aのサイズを含む様々なサイズのコンデンサに合わせた穴が形成された成型品である。そして、樹脂ケース16に設けられた穴は樹脂ケース16を貫通しておらず、コンデンサ2aの絶縁性を保っている。また、樹脂ケース16をコンデンサ2aに挿入する際に、コンデンサ2aのリード線9が樹脂ケース16に引っ掛からないように樹脂ケース16から出すためのリード引き出し用スリット18が、樹脂ケース16の側面のコンデンサ挿入方向に延びるよう設けられている。 From the capacitor 2a, two lead wires 9 are extended from the end of the element. Further, the pair of resin cases 16 are molded products in which holes are formed according to various sizes of capacitors including the size of the capacitor 2a so that the resin case 16 can be inserted (fixed and fixed) into the capacitor 2a from both longitudinal sides of the capacitor 2a. . And the hole provided in the resin case 16 does not penetrate the resin case 16, and the insulation of the capacitor 2a is maintained. Further, when the resin case 16 is inserted into the capacitor 2 a, a lead drawing slit 18 for taking out the lead wire 9 of the capacitor 2 a from the resin case 16 so that the lead wire 9 of the capacitor 2 a is not caught by the resin case 16 is provided on the side surface of the resin case 16. It is provided so as to extend in the insertion direction.
 また、樹脂ケース16の内部には図14(a)のように階段状の形状である階段状成型部22または図14(b)に示すとおりテーパの形状であるテーパ成型部23が設けられている。図17(a1)、(b1)及び図17(a2)、(b2)に示すとおり異なるサイズのコンデンサ2a、2bを挿入でき、図18(a)、図18(b)に示すとおり異なるサイズのスナバ装置を実現することが可能である。 Further, the resin case 16 is provided with a step-shaped molded portion 22 having a stepped shape as shown in FIG. 14A or a taper-shaped portion 23 having a tapered shape as shown in FIG. 14B. Yes. Capacitors 2a and 2b having different sizes can be inserted as shown in FIGS. 17 (a1) and (b1) and FIGS. 17 (a2) and (b2), and different sizes can be inserted as shown in FIGS. 18 (a) and 18 (b). A snubber device can be realized.
 図15は樹脂ケース16のネジ穴と接続導体19のネジ穴の関係を示す側面図であり、図16は接続導体19の構造を示す展開図である。
 図12、図15において、樹脂ケース16にはリード線引き出し用スリット18の上下でありコンデンサ2aを樹脂ケース16に挿入する方向に等間隔で複数の導体接続用ネジ穴17が設けられている。そして、接続導体19は、リード線引き出し用スリット18の上部又は下部に設けられたいずれかの穴でネジ締めされる。一方、接続導体19には導体接続用ネジ穴17の間隔と等しい間隔でケース接続穴20が空けられており、接続導体19は樹脂ケース16にネジ29で固定される。つまり、基本的には、スイッチング素子の端子間の間隔が広くなるほど、樹脂ケース16に挿入されるコンデンサ2aに対してより遠い位置に設けられた導体接続用ネジ穴17を選択する。
FIG. 15 is a side view showing the relationship between the screw holes of the resin case 16 and the screw holes of the connection conductor 19, and FIG. 16 is a development view showing the structure of the connection conductor 19.
12 and 15, the resin case 16 is provided with a plurality of screw holes 17 for connecting conductors at equal intervals in the direction in which the capacitor 2 a is inserted into the resin case 16 above and below the lead wire drawing slit 18. Then, the connection conductor 19 is screwed in any hole provided in the upper part or the lower part of the lead wire drawing slit 18. On the other hand, case connection holes 20 are formed in the connection conductor 19 at intervals equal to the intervals of the conductor connection screw holes 17, and the connection conductor 19 is fixed to the resin case 16 with screws 29. That is, basically, the conductor connection screw hole 17 provided at a position farther from the capacitor 2a inserted into the resin case 16 is selected as the interval between the terminals of the switching element becomes wider.
 また、L型の接続導体19の一片には断面Z型成型部13が設けられ、他片にはスイッチング素子14aへの取り付けるための装置取付穴21(長尺穴)が設けられている。装置取付穴21は、前記に示した導体接続用ネジ穴17の間隔と略同一の長さであるとともに樹脂ケース16の挿入方向に延びた長尺状の穴であり、取り付け時に長尺穴の範囲内で微調整を行うことが可能である。そして、接続導体19の一片の板状部(図示略)は装置取付穴21を介してスイッチング素子14aの端子にネジ締めされる。ここで、装置取付穴21での調整と、複数の導体接続用ネジ穴17での接続導体19の位置調整が可能な構成であるため、装置取付穴21のみの調整や複数の導体接続用ネジ穴17のみの調整に比べてより細かい接続導体19の位置調整を行うことが可能である。また、導体接続用ネジ穴17が複数設けられているので、装置取付穴21の長手方向の長さを長くする必要がなくなり、接続導体19の部品サイズを減少することができる。 Also, one piece of the L-shaped connecting conductor 19 is provided with a Z-shaped molded portion 13 in cross section, and the other piece is provided with a device attachment hole 21 (elongate hole) for attachment to the switching element 14a. The device mounting hole 21 is a long hole having substantially the same length as the gap between the conductor connecting screw holes 17 described above and extending in the insertion direction of the resin case 16. Fine adjustments can be made within the range. A piece of plate-like portion (not shown) of the connection conductor 19 is screwed to the terminal of the switching element 14a through the device attachment hole 21. Here, since the configuration can be adjusted at the device mounting hole 21 and the position of the connecting conductor 19 at the plurality of conductor connecting screw holes 17, the adjustment of only the device mounting hole 21 and the plurality of conductor connecting screws are possible. It is possible to finely adjust the position of the connection conductor 19 as compared with the adjustment of only the hole 17. In addition, since a plurality of conductor connection screw holes 17 are provided, it is not necessary to increase the length of the device mounting hole 21 in the longitudinal direction, and the component size of the connection conductor 19 can be reduced.
 図19(a)は、スイッチング素子の接続端子間の距離が小さい場合のスナバ装置の接続状態を示す斜投影図であり、図19(b)は、スイッチング素子の接続端子間の距離が大きい場合のスナバ装置の接続状態を示す斜投影図である。
 図19(a)のような1つのIGBTから構成されるスイッチング素子14bの場合、コンデンサ2aのサイズ等も影響するが、例えば、一対の接続導体19の導体接続用ネジ穴17内側同士でネジ15により固定される。また、図19(b)のような6つのIGBTが1セットになった6in1タイプのスイッチング素子14cの場合、コンデンサ2bのサイズ等も影響するが、例えば、一対の接続導体19の導体接続用ネジ穴17外側同士でネジ15により固定される。
FIG. 19A is an oblique projection showing the connection state of the snubber device when the distance between the connection terminals of the switching element is small, and FIG. 19B is the case where the distance between the connection terminals of the switching element is large. It is an oblique projection figure which shows the connection state of this snubber apparatus.
In the case of the switching element 14b composed of one IGBT as shown in FIG. 19A, the size of the capacitor 2a and the like are also affected. For example, the screws 15 are formed inside the conductor connection screw holes 17 of the pair of connection conductors 19. It is fixed by. In addition, in the case of the 6in1 type switching element 14c in which six IGBTs are set as one set as shown in FIG. 19B, the size of the capacitor 2b and the like are also affected, but for example, conductor connection screws of the pair of connection conductors 19 The outer sides of the holes 17 are fixed by screws 15.
 コンデンサ2aのリード線9を接続する接続導体19の接続部は実施の形態1と同様にL型の接続導体19の一片に設けられた断面Z型成型部13は、L型の一片に設けられた一対のスリット12間の板金部分を断面Z型に折り曲げて成型されたZ型の成型部を備えており、コンデンサのリード線の接続は実施の形態1と同一である。 The connecting portion of the connecting conductor 19 for connecting the lead wire 9 of the capacitor 2a is provided in one piece of the L-shaped cross section Z-shaped molding portion 13 provided in one piece of the L-shaped connecting conductor 19 as in the first embodiment. The sheet metal part between the pair of slits 12 is provided with a Z-shaped molded part formed by bending the section into a Z-shaped cross section, and the connection of the capacitor lead wires is the same as in the first embodiment.
 上記のような実施の形態2のスナバ装置によれば、樹脂ケース16の内部に階段状またはテーパ状の構造を設けたので、異なるサイズのコンデンサを挿入でき、異なるサイズのスナバ装置を実現することが可能である。 According to the snubber device of the second embodiment as described above, since a stepped or tapered structure is provided inside the resin case 16, capacitors of different sizes can be inserted, and a snubber device of different sizes can be realized. Is possible.
 また、樹脂ケース16に等間隔に空けられた導体接続用ネジ穴17の複数のネジ穴により接続導体19の樹脂ケース16への取り付けの位置を変更できることと、微調整が可能な装置取付穴21の長穴により、取り付け位置の異なるスイッチング素子へのスナバ装置の取り付けが可能となる。 Further, the mounting position of the connection conductor 19 to the resin case 16 can be changed by a plurality of screw holes of the conductor connection screw holes 17 spaced at equal intervals in the resin case 16, and a device mounting hole 21 that can be finely adjusted. With this long hole, it is possible to attach the snubber device to the switching elements having different attachment positions.
 また、前記樹脂ケース16の導体接続用ネジ穴17がスリットの上下に空けてあることにより樹脂ケース16は左右の方向性がなく、1つの部品のみで構成することが可能である。 In addition, since the conductor connection screw holes 17 of the resin case 16 are formed above and below the slit, the resin case 16 has no left-right direction and can be configured by only one component.
 1  樹脂成型蓋
 2a、2b  コンデンサ
 3、16  樹脂ケース
 4、19  接続導体
 5  ノの字型樹脂成型部
 6  S字型成型部
 7、8  蓋接続穴
 9  リード線
 10  導体嵌合部
 11  コの字板金成型部
 12  スリット
 13  断面Z型成型部
 14a、14b、14c  スイッチング素子
 15、29  ネジ
 16  挿入案内部
 17  導体接続用ネジ穴
 18  リード引き出し用スリット
 19  引き出し案内部
 20  ケース接続穴
 21  装置取付穴
 22  階段状成型部
 23  テーパ成型部
DESCRIPTION OF SYMBOLS 1 Resin molding lid 2a, 2b Capacitor 3, 16 Resin case 4, 19 Connection conductor 5 S-shaped resin molding part 6 S-shaped molding part 7, 8 Lid connection hole 9 Lead wire 10 Conductor fitting part 11 U-shape Sheet metal molding part 12 Slit 13 Cross section Z-shaped molding part 14a, 14b, 14c Switching element 15, 29 Screw 16 Insertion guide part 17 Conductor connection screw hole 18 Lead extraction slit 19 Drawer guide part 20 Case connection hole 21 Device mounting hole 22 Stepped molding part 23 Tapered molding part

Claims (7)

  1.  リード線を有し、スイッチング素子が発生するサージ電圧を前記リード線を介して吸収するコンデンサと、
     前記コンデンサを嵌め込み固定する樹脂ケースと、
     導体で形成され、一片が前記樹脂ケースにそれぞれ固定されるとともに、他片が前記スイッチング素子の異なる端子にそれぞれ接続される接続導体と、を備え、
    前記リード線は前記接続導体の一片を加工して成る成型部の変形により前記成型部を除く前記接続導体の一片の板状部と前記成型部との間に挟み込まれて前記接続導体に固定されることを特徴とするスナバ装置。
    A capacitor having a lead wire and absorbing the surge voltage generated by the switching element through the lead wire;
    A resin case for fitting and fixing the capacitor;
    A connection conductor formed of a conductor, one piece is fixed to the resin case, and the other piece is connected to a different terminal of the switching element, and
    The lead wire is sandwiched between the plate-shaped portion of the piece of the connection conductor excluding the molded portion and the molded portion by the deformation of the molded portion formed by processing one piece of the connection conductor, and is fixed to the connection conductor. Snubber device characterized by that.
  2.  前記接続導体の他片に成型されたコの字型成型部及び前記樹脂ケースの一部に、前記スイッチング素子の端子にネジで接続されるネジ穴が設けられ、前記樹脂ケースの一部を前記コの字型成型部の間に挟み込み、前記接続導体と前記樹脂ケースを一括で前記端子にネジ締めされることを特徴とする請求項1に記載のスナバ装置。 The U-shaped molded part molded on the other piece of the connection conductor and a part of the resin case are provided with screw holes connected to the terminals of the switching element by screws, and a part of the resin case is 2. The snubber device according to claim 1, wherein the snubber device is sandwiched between U-shaped molded portions, and the connection conductor and the resin case are collectively screwed to the terminals.
  3.  前記樹脂ケースと嵌合し、前記樹脂ケースに挿入された前記コンデンサを固定する樹脂性の成型蓋を有することを特徴とする請求項1又は2に記載のスナバ装置。 The snubber device according to claim 1 or 2, further comprising a resin-molded lid that fits the resin case and fixes the capacitor inserted into the resin case.
  4.  前記樹脂ケースの対向する内壁には弾性部材が設けられ、前記弾性部材を変形させて前記コンデンサを挟み込むことを特徴とする請求項1又は2に記載のスナバ装置。 3. The snubber device according to claim 1 or 2, wherein an elastic member is provided on the opposing inner wall of the resin case, and the elastic member is deformed to sandwich the capacitor.
  5.  一対の前記樹脂ケースの内部を階段状又はテーパー状に成型したことを特徴とする請求項1に記載のスナバ装置。 The snubber device according to claim 1, wherein the inside of the pair of resin cases is molded into a stepped shape or a tapered shape.
  6.  前記コンデンサの前記リード線を前記樹脂ケースの外部に出すためのスリットを前記樹脂ケースに設けたことを特徴とする請求項5に記載のスナバ装置。 6. The snubber device according to claim 5, wherein a slit for providing the lead wire of the capacitor to the outside of the resin case is provided in the resin case.
  7.  前記接続導体の一片の板状部は、前記樹脂ケースの前記コンデンサを前記樹脂ケースに挿入する方向に設けられた複数のネジ穴のいずれかに固定され、前記接続導体の他片は、前記複数のネジ穴が並ぶ方向と平行に延びた長尺穴を介して前記スイッチング素子の端子にネジ締めされることを特徴とする請求項5又は6に記載のスナバ装置。 The plate portion of one piece of the connection conductor is fixed to any one of a plurality of screw holes provided in the direction in which the capacitor of the resin case is inserted into the resin case, and the other piece of the connection conductor is the plurality of pieces. 7. The snubber device according to claim 5, wherein the snubber device is screwed to a terminal of the switching element through an elongated hole extending in parallel with a direction in which the screw holes are arranged.
PCT/JP2011/001807 2011-03-28 2011-03-28 Snubber device WO2012131754A1 (en)

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CN201180069704.9A CN103460317B (en) 2011-03-28 2011-03-28 Buffer unit
TW100112435A TWI423570B (en) 2011-03-28 2011-04-11 Snubber device

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