JP2003100959A - Resin-sealed electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem that electronic component elements of a conventional electronic component housed in a case are sealed with a seal resin, but the resin flowing between the case and a lead board put into the case creeps up and overflows the case due to a capillary effect, resulting in a poor appearance or connection failures, etc., due to deposition of the seal resin to the lead board, and, to reduce such failures, the seal resin needs to be injected in a plurality of steps little by little for the resin injection, resulting in a large reduction in working efficiency. SOLUTION: Considering that a seal resin to be applied may creep up due to the capillary effect, a lead board having a recess for checking such creep up is used.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-sealed electronic component such as a film capacitor, a ceramic varistor, or a coil in which an electronic component element is housed in a case and a void in the case is filled with a sealing resin. Regarding

[0002]

2. Description of the Related Art Electronic components mounted on an electronic circuit board include, for example, a film capacitor, a ceramic varistor or a coil. In order to cope with the external environment such as vibration, humidity or corrosive atmosphere, these electronic parts have a structure in which one or more electronic part elements are housed in a case and the void space in the case is filled with a sealing resin. Has become.

FIGS. 6 and 7 show such conventional resin-sealed electronic parts. FIG. 6 is a perspective view of a conventional resin-sealed electronic component, and FIG. 7 is a side sectional view of the conventional resin-sealed electronic component. The lead wire 12 of the electronic component element 11 is connected to the lead plate 13 by a method such as welding or soldering, the electronic component element 11 is housed in the case 14, and the fixed portion of the lead plate 13 is sandwiched between the end faces of the case 14, The case 14 has a structure in which the sealing resin 15 is filled in the void portion.

In such a conventional electronic component, as shown in FIG.
As shown in FIG. 3, if there is a slight gap in the case fixing portion of the lead plate 13, the sealing resin 15 enters into the gap, and the sealing resin 15 crawls up due to the capillary phenomenon, and the raised sealing resin 15 is removed. It will overflow from the case 14. As a result, as shown in FIG.
4 not only oozes out to the outside to cause a defective appearance, but also the surface connecting the lead plate 13 and the screw hole 16 are filled with resin, which causes a defective connection.

In order to reduce such defects, when the sealing resin is filled, the sealing resin does not overflow from the case due to a capillary phenomenon so that a part of the lead plate is soaked in the sealing resin. It is necessary to inject resin for semi-solidification, and then inject it several times in small portions to inject encapsulating resin little by little to make it semi-solid, and such a manufacturing method has the problem of significantly reducing workability. Was there.

[0006]

As described above, in the conventional electronic component, the electronic component element housed in the case is sealed with the sealing resin. The encapsulating resin that has entered into the case crawls up due to the capillary phenomenon and overflows from the case, resulting in poor appearance and poor connection due to adhesion of the encapsulating resin to the lead plate. In addition, in order to reduce such defects, when injecting the encapsulating resin, it is necessary to inject a small amount in a plurality of times, which causes a problem that workability is extremely deteriorated.

The present invention is to solve the above-mentioned problems, and in an electronic component in which an electronic component element is housed in a case and a sealing resin is filled, a lead wire pulled out from the electronic component element is connected to the case. The sealing resin does not overflow to the outside of the case even if it creeps up due to the capillary phenomenon between the lead plate that is sandwiched between and fixed to the case, and the sealing resin can be injected once. It is an object to provide a resin-encapsulated electronic component with high productivity.

[0008]

In order to solve the above-mentioned problems, the invention according to claim 1 is an electronic component element comprising one or a plurality of components, and a case for accommodating the electronic component element. A lead plate which is connected to a lead wire drawn from the electronic component element and which is sandwiched and fixed in the case; and an electronic component made of a sealing resin which fills the space in the case, wherein the case of the lead plate The electronic component is characterized in that a concave portion is provided on a surface in contact with the inner side surface to prevent the sealing resin that has entered the gap between the lead plate and the case from overflowing from the case due to the creeping up.

According to the electronic component of the first aspect, even if the sealing resin to be filled up crawls through the gap between the lead plate and the case due to the capillary phenomenon, the inner surface of the case of the lead plate. By providing the concave portion with respect to the case, the creeping-up of the sealing resin is suppressed and the resin does not overflow to the outside of the case.

Furthermore, since the sealing resin does not overflow to the outside of the case even if the resin crawls through the gap between the lead plate and the case due to the capillary phenomenon, the sealing resin is filled once. This makes it possible to significantly increase productivity.

According to a second aspect of the present invention, there is provided an electronic component in which a plurality of recesses are provided on the inner surface of the case of the lead plate, and the sealing resin to be filled in the gap between the lead plate and the case. Even if the sealing resin crawls up due to capillary action when entering, the multiple recesses prevent the sealing resin from creeping up, producing an electronic component that does not overflow the sealing resin outside the case. It can be manufactured with good properties.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention is connected to an electronic component element composed of one or a plurality of components, a case for accommodating the electronic component element, a lead wire pulled out from the electronic component element, and sandwiched between the case. In the electronic component that consists of the lead plate fixed with, and the sealing resin that fills the space inside the case, the sealing resin that has entered the gap between the lead plate and the case is on the surface of the lead plate that contacts the inside surface of the case. The electronic component is characterized in that a concave portion is provided to prevent it from overflowing from the case due to crawling.

Here, the recess provided in the lead plate may be of a size sufficient to suppress the creeping-up of the sealing resin, which is made of the sealing resin and the material of the lead plate, and the size of the lead plate. It can be appropriately selected according to the above.

The shape of the recess provided in the lead plate can be appropriately selected from various shapes such as triangle, rectangle, circle and ellipse.

A plurality of recesses may be provided on the lead plate. For example, by making the surface of the lead plate in contact with the case wavy or uneven, it is possible to prevent the sealing resin from creeping up due to a capillary phenomenon even when the filled sealing resin enters the gap between the lead plate and the case. It is possible to manufacture with high productivity an electronic component which is suppressed by the plurality of recesses and in which the sealing resin does not overflow to the outside of the case.

[0016]

Embodiments of the present invention will be described with reference to the drawings.

The lead wire of the electronic component element is connected to the lead plate by welding or soldering, the electronic component element is housed in the case, the fixed portion of the lead plate is sandwiched between the end faces of the case, and the void in the case is further provided. The part is filled with a sealing resin to produce an electronic component.

Here, as shown in FIG. 1, the lead plate 1
Is provided with a triangular concave portion 2 on a surface to be installed on the inner surface of the case in advance. At this time, in the triangular concave portion 2, the sealing resin 4 that creeps up between the lead plate 1 and the case 3 is formed by the case 3
Make it large enough so that it does not overflow outside.

Similarly, as shown in FIGS. 2 and 3, the same effect can be obtained by providing a rectangular recess 5 or an elliptical recess 6 on the surface of the lead plate to be installed on the inner surface of the case.

Further, as shown in FIGS. 4 and 5, even if the entire surface of the lead plate in contact with the inner surface of the case is formed into the corrugated portion 7 or the uneven portion 8, the creeping of the sealing resin is suppressed over the entire surface. It is possible to manufacture a resin-sealed type electronic component in which the sealing resin does not overflow outside the case.

[0021]

As described above, according to the present invention, in consideration of the fact that the sealing resin to be filled up creeps up due to the capillary phenomenon, the lead plate having the concave portion for suppressing the creeping up By using, even if the filled sealing resin comes into contact with the case and crawls due to the capillary phenomenon, the recess suppresses the creeping up of the sealing resin,
It does not overflow outside the case. In addition, since the resin does not overflow due to the use of the lead plate having the concave portion, it is not necessary to inject and cure the sealing resin plural times,
Since it can be completed once, the productivity can be greatly improved.

The present invention relates to improvement of a lead plate which is an electrode lead-out portion in a resin-sealed electronic component, and the shape and size of the resin-sealed electronic component, a manufacturing method of the electronic component itself, etc. are appropriately selected. It is possible to select, and the electronic parts, the case, the material of the sealing resin, and the like can be appropriately selected.

[Brief description of drawings]

FIG. 1 is a side sectional view showing an electronic component according to an embodiment of the present invention.

FIG. 2 is a side sectional view showing an electronic component according to another embodiment of the present invention.

FIG. 3 is a side sectional view showing an electronic component according to another embodiment of the present invention.

FIG. 4 is a perspective view showing another lead plate of the present invention.

FIG. 5 is a perspective view showing another lead plate of the present invention.

FIG. 6 is a perspective view showing a conventional resin-sealed electronic component.

FIG. 7 is a side sectional view showing a conventional resin-sealed electronic component.

FIG. 8 is a side sectional view showing a conventional resin-sealed electronic component.

FIG. 9 is a perspective view showing a conventional resin-sealed electronic component.

[Explanation of symbols]

1 lead plate 2 Triangular recess 3 cases 4 Sealing resin 5 Rectangular recess 6 Elliptical recess 7 Wavy section 8 uneven parts

Claims (2)

[Claims] 1. An electronic component element composed of one or a plurality of elements, a case for accommodating the electronic component element, and a lead wire pulled out from the electronic component element, which is sandwiched and fixed in the case. A lead plate and an electronic component made of a sealing resin that fills the space inside the case,
An electronic component, characterized in that a concave portion is provided on a surface of the lead plate, which is in contact with an inner side surface of the case, for preventing the sealing resin that has entered the gap between the lead plate and the case from overflowing from the case by creeping up. . 2. The electronic component according to claim 1, wherein a plurality of recesses are provided on a surface of the lead plate which is in contact with the inner surface of the case.