JP2001210546A - Resin-encapsulated capacitor - Google Patents
Resin-encapsulated capacitorInfo
- Publication number
- JP2001210546A JP2001210546A JP2000019110A JP2000019110A JP2001210546A JP 2001210546 A JP2001210546 A JP 2001210546A JP 2000019110 A JP2000019110 A JP 2000019110A JP 2000019110 A JP2000019110 A JP 2000019110A JP 2001210546 A JP2001210546 A JP 2001210546A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- terminal
- terminals
- capacitor
- resin case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、コンデンサ素子に
端子を接合後、樹脂ケースに上記素子を収納し、絶縁性
樹脂を充填、硬化してなる樹脂封口型コンデンサの端子
位置決め精度の改良に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in terminal positioning accuracy of a resin-sealed capacitor obtained by joining terminals to a capacitor element, storing the element in a resin case, filling and curing an insulating resin. It is.
【０００２】[0002]
【従来の技術】従来の樹脂封口型コンデンサは、図１１
に示すように、コンデンサ素子１とそのコンデンサ素子
１を収納する樹脂ケース７にて構成されている。コンデ
ンサ素子１は一対の金属化フィルムを重ね合せて巻回
し、両巻回端面に亜鉛またははんだを溶射して電極引出
部１ａが形成され、各電極引出部には、それぞれ端子８
がはんだ付けまたは溶接にて接合され、これを樹脂ケー
ス７に収納し、熱硬化性樹脂９を充填、硬化している。2. Description of the Related Art A conventional resin-sealed capacitor is shown in FIG.
As shown in the figure, the capacitor element 1 and a resin case 7 for housing the capacitor element 1 are provided. The capacitor element 1 is formed by laminating a pair of metallized films and winding them, and spraying zinc or solder on both winding end surfaces to form electrode lead portions 1a. Each electrode lead portion has a terminal 8a.
Are joined by soldering or welding, housed in a resin case 7, filled with a thermosetting resin 9, and cured.
【０００３】しかし、端子位置決め治具を用いてコンデ
ンサ素子と端子とを接合しても、樹脂ケース内に端子を
固定する機構がなく、スぺーサを挿入してコンデンサ素
子を固定しても、コンデンサ素子の寸法バラツキ等によ
り所定のピッチ寸法精度が出なかったり、また、熱硬化
性樹脂を充填して硬化する際、コンデンサ素子と熱硬化
性樹脂との比重差でコンデンサ素子が浮き上がり、コン
デンサ素子を確実に樹脂ケース内の所定位置に収納でき
ず、端子間ピッチＰの精度が悪くなったり、端子間の平
面的なずれｄが発生したりするという問題があった。However, even if the capacitor element and the terminal are joined using the terminal positioning jig, there is no mechanism for fixing the terminal in the resin case, and even if the capacitor element is fixed by inserting a spacer, The specified pitch dimensional accuracy cannot be obtained due to the dimensional variation of the capacitor element, or when the thermosetting resin is filled and cured, the specific gravity difference between the capacitor element and the thermosetting resin causes the capacitor element to float, Cannot be reliably stored at a predetermined position in the resin case, and the accuracy of the pitch P between the terminals is deteriorated, and a planar displacement d between the terminals is caused.
【０００４】[0004]
【発明が解決しようとする課題】一方、コンデンサを基
板や半導体モジュール等に実装するには、コンデンサの
各部分の寸法精度が要求され、特に端子間の寸法精度の
向上が重要になってきている。そこで、ピッチ精度を向
上させるために、コンデンサ素子を樹脂ケースに収納
後、熱硬化性樹脂の硬化を２回に分けて実施し、１回目
の熱硬化性樹脂の充填、硬化時にピッチ精度を修正する
方法があるが、充填、硬化作業を２回行う必要があるの
で作業リードタイムが長くなり、生産性に劣るという問
題があった。よって、生産性を損なうことなく端子間ピ
ッチの精度を向上させるための平易な手段が要求されて
いた。On the other hand, in order to mount a capacitor on a substrate, a semiconductor module, or the like, dimensional accuracy of each part of the capacitor is required. In particular, it is important to improve dimensional accuracy between terminals. . Therefore, in order to improve the pitch accuracy, after the capacitor element is housed in the resin case, the thermosetting resin is cured twice and the pitch accuracy is corrected during the first filling and curing of the thermosetting resin. However, since the filling and curing operations need to be performed twice, there is a problem that the operation lead time is lengthened and the productivity is poor. Therefore, there has been a demand for a simple means for improving the accuracy of the pitch between terminals without impairing productivity.
【０００５】[0005]
【課題を解決するための手段】本発明は、上記課題を解
決するためになされたもので、コンデンサ素子の樹脂ケ
ースへの位置決めを精度よくでき、端子間のピッチ精度
および端子間の平面的なずれ精度を大幅に向上させ、生
産性の向上が図れる樹脂封口型コンデンサを提供しよう
とするものである。DISCLOSURE OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and can accurately position a capacitor element in a resin case, and can provide a pitch accuracy between terminals and a planar shape between terminals. An object of the present invention is to provide a resin-sealed capacitor capable of significantly improving the displacement accuracy and improving the productivity.
【０００６】すなわち、一対の金属化フィルムを重ね合
せて巻回し、巻回端面に金属を溶射してなる電極引出部
１ａに接合する端子２、３の引出方向が同じコンデンサ
素子１を樹脂ケース４に収納し、絶縁性樹脂５を充填、
硬化してなる樹脂封口型コンデンサにおいて、上記ケー
スの開口部端面に所定の端子間隔を有する端子位置決め
部を設け、該位置決め部に嵌合する嵌合部を上記端子に
設けてなることを特徴としている。That is, a pair of metallized films are superposed and wound, and a capacitor element 1 having the same lead-out direction of terminals 2 and 3 joined to an electrode lead-out portion 1a formed by spraying metal on the winding end face is attached to a resin case 4. And filled with insulating resin 5,
In a resin-sealed capacitor obtained by curing, a terminal positioning portion having a predetermined terminal interval is provided on an end surface of the opening of the case, and a fitting portion fitted to the positioning portion is provided on the terminal. I have.
【０００７】また、上記の端子位置決め部が凹状および
／または凸状であり、嵌合部が切欠き２ａ、３ａである
ことを特徴としている。さらに、上記の端子位置決め部
が凸部を有する凹状、または凸状であり、嵌合部が貫通
穴２ｃ、３ｃであることを特徴としている。そして、上
記の樹脂封口型コンデンサにおいて、樹脂ケース４の嵌
合部を溶融し、端子２、３に固着させたことを特徴とし
ている。Further, the terminal positioning part is concave and / or convex, and the fitting part is notches 2a and 3a. Further, the terminal positioning portion is concave or convex having a convex portion, and the fitting portions are through holes 2c and 3c. In the above-described resin-sealed capacitor, the fitting portion of the resin case 4 is melted and fixed to the terminals 2 and 3.
【０００８】[0008]
【発明の実施の形態】樹脂封口型コンデンサの樹脂ケー
スの開口部端面に所定の端子間隔を有する端子位置決め
部を設け、該位置決め部に嵌合する嵌合部を端子に設け
る。上記の端子位置決め部を凹状および／または凸状と
し、嵌合部を切欠きとして固定するか、または、上記の
端子位置決め部を凸部を有する凹状、または凸状とし、
貫通穴として固定する。上記の構成により、コンデンサ
素子から引出された端子の嵌合部が樹脂ケースの位置決
め部に確実に固定されるので、コンデンサ素子の樹脂ケ
ースへの位置決めを精度よくでき、端子間のピッチ精度
および端子間の平面的なずれ精度の向上が図れ、また、
嵌合部を溶着固定することで絶縁性樹脂の充填、硬化に
際して、コンデンサ素子の浮き上がりが防止でき、より
一層、ピッチ精度の向上を図ることができる。DESCRIPTION OF THE PREFERRED EMBODIMENTS A terminal positioning portion having a predetermined terminal interval is provided on an end face of an opening of a resin case of a resin-sealed capacitor, and a fitting portion fitted to the positioning portion is provided on a terminal. The terminal positioning portion is concave and / or convex, and the fitting portion is fixed as a notch, or the terminal positioning portion is concave or convex having a convex portion,
Fix as a through hole. With the above configuration, the fitting portion of the terminal drawn out of the capacitor element is securely fixed to the positioning portion of the resin case, so that the positioning of the capacitor element to the resin case can be performed with high accuracy, the pitch accuracy between the terminals and the terminal accuracy. The accuracy of the planar deviation between them can be improved,
By fixing the fitting portion by welding, the floating of the capacitor element can be prevented during filling and curing of the insulating resin, and the pitch accuracy can be further improved.
【０００９】[0009]
【実施例】〔実施例１〕図１は、本発明の樹脂封口型コ
ンデンサの一実施例の図面で、（ａ）は平面図、（ｂ）
は正断面図、（ｃ）はＸ−Ｘ’断面図、（ｄ）は要部拡
大斜視図であり、図３は樹脂ケースの一実施例の図面
で、（ａ）は平面図、（ｂ）は正断面図、図４、図５は
端子の一実施例の斜視図である。[Embodiment 1] FIGS. 1A and 1B are drawings of one embodiment of a resin-sealed capacitor according to the present invention, wherein FIG.
FIG. 3C is a front sectional view, FIG. 3C is an XX ′ sectional view, FIG. 3D is an enlarged perspective view of a main part, FIG. 3 is a drawing of an embodiment of a resin case, FIG. 4) is a front sectional view, and FIGS. 4 and 5 are perspective views of an embodiment of the terminal.
【００１０】以下、本発明の一実施例について、図面を
参照しながら説明する。図１において、１はコンデンサ
素子で、アルミニウム、亜鉛などを蒸着した一対の金属
化フィルムを重ね合せて巻回し、その巻回端面に亜鉛ま
たははんだなどの金属を溶射して電極引出部１ａが形成
されている。２、３は黄銅、銅等よりなる金属板を打抜
き加工の一体成形にて形成し、錫鍍金が施された端子
で、２ａ、３ａは樹脂ケース４の開口部端面に設けられ
た凹部４ａに嵌合する切欠き、２ｂ、３ｂは外部接続用
穴である。４はポリブチレンテレフタレート、ポリカー
ボネートなどの絶縁性樹脂からなる樹脂ケース、４ａは
開口部端面に形成された凹部で、５はエポキシ樹脂、ウ
レタン樹脂などの熱硬化性樹脂からなる絶縁性樹脂であ
る。An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, reference numeral 1 denotes a capacitor element, a pair of metallized films on which aluminum, zinc, or the like is vapor-deposited and wound, and a metal such as zinc or solder is sprayed on the wound end surface to form an electrode lead portion 1a. Have been. Reference numerals 2 and 3 denote a metal plate made of brass, copper, or the like, which is formed by integral molding by punching, and tin-plated. Notches 2b and 3b to be fitted are external connection holes. Reference numeral 4 denotes a resin case made of an insulating resin such as polybutylene terephthalate or polycarbonate, 4a denotes a concave portion formed on the end face of the opening, and 5 denotes an insulating resin made of a thermosetting resin such as an epoxy resin or a urethane resin.
【００１１】切欠き２ａ、３ａを有する端子２、３をコ
ンデンサ素子１の電極引出部１ａにそれぞれはんだまた
は溶接にて接合し、該素子を樹脂ケース４に収納し、端
子２、３の切欠き２ａ、３ａを樹脂ケース４の開口部端
面に形成された凹部４ａにそれぞれ嵌合する。次に熱硬
化性樹脂からなる絶縁性樹脂５を充填、硬化して樹脂封
口型コンデンサを得る。The terminals 2 and 3 having the notches 2a and 3a are respectively joined to the electrode lead portions 1a of the capacitor element 1 by soldering or welding, and the elements are housed in a resin case 4 and the terminals 2 and 3 are cut out. 2a and 3a are fitted into recesses 4a formed on the end face of the opening of the resin case 4, respectively. Next, an insulating resin 5 made of a thermosetting resin is filled and cured to obtain a resin-sealed capacitor.
【００１２】上記構成によれば、コンデンサ素子に接合
された端子の切欠きを、樹脂ケースの開口部端面に形成
された凹部にそれぞれ嵌合するので、コンデンサ素子の
樹脂ケースへの位置決めが精度よくでき、端子が樹脂ケ
ースに固定されるので、スペーサの挿入が不要で、コン
デンサ素子の寸法バラツキもコンデンサ素子に接合され
た端子の切欠きを樹脂ケースの凹部にそれぞれ嵌合する
ことにより吸収され、端子間のピッチＰ精度および端子
間の平面的なずれｄ精度の向上を図ることができる。な
お、上記の〔実施例１〕では、樹脂ケースの端子位置決
め部を凹状とし、端子の嵌合部を切欠きとしたが、他
に、樹脂ケースの位置決め部を凸部を有する凹状とする
か、または凸状とし、端子の嵌合部を切欠きとして、端
子を樹脂ケースに固定することもできる。According to the above construction, the notches of the terminals joined to the capacitor element are fitted into the recesses formed on the end face of the opening of the resin case, so that the positioning of the capacitor element to the resin case can be performed with high precision. Since the terminals are fixed to the resin case, it is not necessary to insert a spacer, and the dimensional variation of the capacitor element is absorbed by fitting the notch of the terminal joined to the capacitor element into the concave portion of the resin case, The pitch P accuracy between terminals and the planar deviation d accuracy between terminals can be improved. In the above [Embodiment 1], the terminal positioning portion of the resin case is concave and the fitting portion of the terminal is notched. Alternatively, the positioning portion of the resin case may be concave having a convex portion. Alternatively, the terminal may be fixed to the resin case with a convex shape, and the fitting portion of the terminal is formed as a notch.
【００１３】上記の〔実施例１〕では、端子の切欠き
を、樹脂ケースの開口部端面に形成された凹部にそれぞ
れ嵌合したが、図２に示す要部拡大斜視図のようにはん
だ鏝などの発熱体で、それぞれの嵌合部の樹脂ケース素
材を溶かし溶着固定することにより、強固にそれぞれの
端子を樹脂ケースに固着できるので、絶縁性樹脂の充
填、硬化に際してもコンデンサ素子の浮き上がりがな
く、より一層端子間のピッチＰ精度および端子間の平面
的なずれｄ精度の向上を図ることができる。また、絶縁
性樹脂の充填、硬化を１回で行うことができ、生産性の
向上をも図ることができる。In the above [First Embodiment], the notches of the terminals are respectively fitted into the recesses formed in the end surfaces of the openings of the resin case. However, as shown in FIG. By melting and fixing the resin case material of each fitting part with a heating element such as the above, each terminal can be firmly fixed to the resin case, so that the capacitor element rises even when filling and curing the insulating resin. In addition, it is possible to further improve the accuracy of the pitch P between the terminals and the accuracy of the planar deviation d between the terminals. In addition, the filling and curing of the insulating resin can be performed at one time, and the productivity can be improved.
【００１４】また、上記実施例では、樹脂ケースの長手
方向の片側のみの開口部端面に凹部を形成したが、この
凹部を形成する位置は、これに限定されることなく、ど
の位置に形成しても同様の効果を奏する。Further, in the above embodiment, the concave portion is formed on the end surface of the opening on only one side in the longitudinal direction of the resin case. However, the position where the concave portion is formed is not limited to this, and it may be formed at any position. The same effect can be obtained.
【００１５】〔実施例２〕図６は、本発明の樹脂封口型
コンデンサの他の実施例の図面で、（ａ）は平面図、
（ｂ）は正断面図、（ｃ）はＸ−Ｘ’断面図、（ｄ）は
要部拡大斜視図であり、図８は樹脂ケースの他の実施例
の図面で、（ａ）は平面図、（ｂ）は正断面図、（ｃ）
は右側面図で、図９、図１０は端子の他の実施例の斜視
図である。〔実施例１〕の凹部４ａの代わりに凸部４
ｂ、切欠き２ａ、３ａの代わりに貫通穴２ｃ、３ｃを設
け、〔実施例１〕と同様の方法で組立て、樹脂封口型コ
ンデンサを得る。なお、上記の〔実施例２〕では樹脂ケ
ースの端子位置決め部を凸状とし、端子の嵌合部を貫通
穴としたが、他に樹脂ケースの端子位置決め部を凸部を
有する凹状とし、端子の嵌合部を切欠きおよび貫通穴、
または切欠きとして、端子を樹脂ケースに固定すること
もできる。Embodiment 2 FIG. 6 is a drawing of another embodiment of the resin-sealed capacitor of the present invention, wherein FIG.
(B) is a front sectional view, (c) is an XX ′ sectional view, (d) is an enlarged perspective view of a main part, FIG. 8 is a drawing of another embodiment of the resin case, and (a) is a plane view. Figure, (b) is a front sectional view, (c)
FIG. 9 is a right side view, and FIGS. 9 and 10 are perspective views of another embodiment of the terminal. Instead of the concave portion 4a of the first embodiment, the convex portion 4
(b) Through holes 2c, 3c are provided in place of the notches 2a, 3a, and assembled in the same manner as in [Example 1] to obtain a resin-sealed capacitor. In the above [Embodiment 2], the terminal positioning portion of the resin case has a convex shape and the fitting portion of the terminal has a through hole. However, the terminal positioning portion of the resin case has a concave shape having a convex portion. Notches and through holes in the mating part
Alternatively, the terminal can be fixed to the resin case as a notch.
【００１６】[0016]
【発明の効果】以上のように、本発明の樹脂封口型コン
デンサは、コンデンサ素子に接合された端子の嵌合部
を、樹脂ケースの開口部端面に形成された位置決め部に
それぞれ嵌合させるので、コンデンサ素子の樹脂ケース
への位置決めを精度よく行うことができる。また、端子
が樹脂ケースに固定されるので、スペーサの挿入は不要
で、コンデンサ素子の寸法バラツキも、コンデンサ素子
に接合された端子の嵌合部を、樹脂ケースの位置決め部
にそれぞれ嵌合することにより吸収され、端子間のピッ
チ精度および端子間の平面的なずれ精度の向上を図るこ
とができる。そして、はんだ鏝などの発熱体で、それぞ
れの嵌合部の樹脂ケース素材を溶かし溶着固定すること
により、強固にそれぞれの端子を樹脂ケースに固着でき
るので、絶縁性樹脂の充填、硬化に際してもコンデンサ
素子の浮き上がりがなく、端子間のピッチ精度および端
子間の平面的なずれ精度の向上をより一層図ることがで
きる。さらに、絶縁性樹脂の充填、硬化を１回で行うこ
とができ、生産性の向上を図ることができるなど工業
的、実用的にその価値は極めて大なるものがある。As described above, in the resin-sealed capacitor of the present invention, the fitting portion of the terminal joined to the capacitor element is fitted to the positioning portion formed on the end face of the opening of the resin case. In addition, the positioning of the capacitor element to the resin case can be accurately performed. In addition, since the terminals are fixed to the resin case, it is not necessary to insert a spacer, and the dimensional variation of the capacitor element can be reduced by fitting the fitting part of the terminal joined to the capacitor element to the positioning part of the resin case. Thus, the pitch accuracy between the terminals and the planar deviation accuracy between the terminals can be improved. By melting and welding and fixing the resin case material of each fitting part with a heating element such as a soldering iron, each terminal can be firmly fixed to the resin case. There is no lifting of the element, so that the pitch accuracy between terminals and the planar deviation accuracy between terminals can be further improved. In addition, there is a case where the value of the resin is extremely large industrially and practically, for example, the filling and curing of the insulating resin can be performed once and the productivity can be improved.
【図１】図１は本発明の樹脂封口型コンデンサの一実施
例の図面で、（ａ）は平面図、（ｂ）は正断面図、
（ｃ）はＸ−Ｘ’断面図、（ｄ）は要部拡大斜視図であ
る。FIG. 1 is a drawing of one embodiment of a resin-sealed capacitor of the present invention, wherein (a) is a plan view, (b) is a front sectional view,
(C) is an XX ′ cross-sectional view, and (d) is an enlarged perspective view of a main part.
【図２】図２は本発明の樹脂封口型コンデンサの他の実
施例の要部拡大斜視図である。FIG. 2 is an enlarged perspective view of a main part of another embodiment of the resin-sealed capacitor of the present invention.
【図３】図３は本発明の樹脂ケースの一実施例の図面
で、（ａ）は平面図、（ｂ）は正断面図である。FIGS. 3A and 3B are drawings of an embodiment of the resin case of the present invention, wherein FIG. 3A is a plan view and FIG. 3B is a front sectional view.
【図４】図４は本発明の実施例による一方の端子の斜視
図である。FIG. 4 is a perspective view of one terminal according to the embodiment of the present invention.
【図５】図５は本発明の実施例による他方の端子の斜視
図である。FIG. 5 is a perspective view of the other terminal according to the embodiment of the present invention.
【図６】図６は本発明の樹脂封口型コンデンサの他の実
施例の図面で、（ａ）は平面図、（ｂ）は正断面図、
（ｃ）はＸ−Ｘ’断面図、（ｄ）は要部拡大斜視図であ
る。FIG. 6 is a drawing of another embodiment of the resin-sealed capacitor of the present invention, wherein (a) is a plan view, (b) is a front sectional view,
(C) is an XX ′ cross-sectional view, and (d) is an enlarged perspective view of a main part.
【図７】図７は本発明の樹脂封口型コンデンサの他の実
施例の要部拡大斜視図である。FIG. 7 is an enlarged perspective view of a main part of another embodiment of the resin-sealed capacitor of the present invention.
【図８】図８は樹脂ケースの他の実施例の図面で、
（ａ）は平面図、（ｂ）は正断面図、（ｃ）は右側面図
である。FIG. 8 is a drawing of another embodiment of the resin case,
(A) is a plan view, (b) is a front sectional view, and (c) is a right side view.
【図９】図９は本発明の他の実施例による一方の端子の
斜視図である。FIG. 9 is a perspective view of one terminal according to another embodiment of the present invention.
【図１０】図１０は本発明の他の実施例による他方の端
子の斜視図である。FIG. 10 is a perspective view of another terminal according to another embodiment of the present invention.
【図１１】図１１は従来例の樹脂封口型コンデンサの図
面で、（ａ）は平面図、（ｂ）は正断面図、（ｃ）はＸ
−Ｘ’断面図である。11A and 11B are drawings of a conventional resin-sealed capacitor, in which FIG. 11A is a plan view, FIG. 11B is a front sectional view, and FIG.
It is -X 'sectional drawing.
【符号の説明】 １ コンデンサ素子 １ａ 電極引出部 ２、３ 端子 ２ａ、３ａ 切欠き ２ｂ、３ｂ 外部接続用穴 ２ｃ、３ｃ 貫通穴 ４ 樹脂ケース ４ａ 凹部 ４ｂ 凸部 ５ 絶縁性樹脂 ６ 発熱体 ７ 樹脂ケース ８ 端子 ９ 熱硬化性樹脂 Ｐ 端子間のピッチ ｄ 端子間の平面的なずれ[Description of Signs] 1 Capacitor element 1a Electrode lead-out part 2, 3 Terminal 2a, 3a Notch 2b, 3b External connection hole 2c, 3c Through hole 4 Resin case 4a Depression 4b Convex part 5 Insulating resin 6 Heating element 7 Resin Case 8 Terminal 9 Thermosetting resin P Pitch between terminals d Plane deviation between terminals
フロントページの続き Ｆターム(参考） 5E082 AB04 BC38 EE07 EE24 EE25 EE37 GG08 HH03 HH06 HH30 HH47 JJ04 JJ08 JJ15 JJ21 JJ22 MM21 Continued on front page F-term (reference) 5E082 AB04 BC38 EE07 EE24 EE25 EE37 GG08 HH03 HH06 HH30 HH47 JJ04 JJ08 JJ15 JJ21 JJ22 MM21
Claims (4)
し、巻回端面に金属を溶射してなる電極引出部に接合す
る端子の引出方向が同じコンデンサ素子を樹脂ケースに
収納し、絶縁性樹脂を充填、硬化してなる樹脂封口型コ
ンデンサにおいて、 上記ケースの開口部端面に所定の端子間隔を有する端子
位置決め部を設け、該位置決め部に嵌合する嵌合部を上
記端子に設けてなることを特徴とする樹脂封口型コンデ
ンサ。1. A pair of metallized films are superposed and wound, and a capacitor element having the same lead-out direction of terminals joined to an electrode lead-out portion formed by spraying metal on a wound end surface is housed in a resin case. In a resin-sealed capacitor obtained by filling and curing a resin, a terminal positioning portion having a predetermined terminal interval is provided on an end surface of an opening of the case, and a fitting portion fitted to the positioning portion is provided on the terminal. A resin-sealed capacitor characterized by the above-mentioned.
／または凸状であり、嵌合部が切欠きであることを特徴
とする樹脂封口型コンデンサ。2. A resin-sealed capacitor according to claim 1, wherein said terminal positioning portion is concave and / or convex, and said fitting portion is notched.
る凹状、または凸状であり、嵌合部が貫通穴であること
を特徴とする樹脂封口型コンデンサ。3. The resin-sealed capacitor according to claim 1, wherein the terminal positioning portion is concave or convex having a convex portion, and the fitting portion is a through hole.
おいて、樹脂ケースの嵌合部を溶融し、端子に固着させ
たことを特徴とする樹脂封口型コンデンサ。4. The resin-sealed capacitor according to claim 1, wherein a fitting portion of the resin case is melted and fixed to a terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000019110A JP2001210546A (en) | 2000-01-27 | 2000-01-27 | Resin-encapsulated capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000019110A JP2001210546A (en) | 2000-01-27 | 2000-01-27 | Resin-encapsulated capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001210546A true JP2001210546A (en) | 2001-08-03 |
Family
ID=18545871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000019110A Pending JP2001210546A (en) | 2000-01-27 | 2000-01-27 | Resin-encapsulated capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001210546A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180211782A1 (en) * | 2015-10-09 | 2018-07-26 | Panasonic Intellectual Property Management Co., Ltd. | Film capacitor and method for manufacturing film capacitor |
| JPWO2018016349A1 (en) * | 2016-07-21 | 2019-05-16 | パナソニックＩｐマネジメント株式会社 | Capacitor |
| US10867751B2 (en) | 2016-07-21 | 2020-12-15 | Panasonic Intellectual Property Management Co., Ltd. | Capacitor |
| US11682520B2 (en) * | 2017-10-30 | 2023-06-20 | Resonac Corporation | Film capacitor manufacturing method and case |
-
2000
- 2000-01-27 JP JP2000019110A patent/JP2001210546A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180211782A1 (en) * | 2015-10-09 | 2018-07-26 | Panasonic Intellectual Property Management Co., Ltd. | Film capacitor and method for manufacturing film capacitor |
| US10796852B2 (en) * | 2015-10-09 | 2020-10-06 | Panasonic Intellectual Property Management Co., Ltd. | Film capacitor and method for manufacturing film capacitor |
| JPWO2018016349A1 (en) * | 2016-07-21 | 2019-05-16 | パナソニックＩｐマネジメント株式会社 | Capacitor |
| US10867751B2 (en) | 2016-07-21 | 2020-12-15 | Panasonic Intellectual Property Management Co., Ltd. | Capacitor |
| JP7050229B2 (en) | 2016-07-21 | 2022-04-08 | パナソニックＩｐマネジメント株式会社 | Capacitor |
| US11682520B2 (en) * | 2017-10-30 | 2023-06-20 | Resonac Corporation | Film capacitor manufacturing method and case |
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