JP6032914B2 - Semiconductor module fixing structure - Google Patents

Semiconductor module fixing structure Download PDF

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JP6032914B2
JP6032914B2 JP2012076838A JP2012076838A JP6032914B2 JP 6032914 B2 JP6032914 B2 JP 6032914B2 JP 2012076838 A JP2012076838 A JP 2012076838A JP 2012076838 A JP2012076838 A JP 2012076838A JP 6032914 B2 JP6032914 B2 JP 6032914B2
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fitting
semiconductor module
portions
semiconductor
locking piece
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JP2013207199A (en
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俊郎 真弓
俊郎 真弓
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Keihin Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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Description

本発明は、半導体モジュールの固定構造に関する。 The present invention relates to a fixed structure of the semiconductor module.

半導体を用いた半導体制御装置には、ＩＧＢＴ（Insulated Gate Bipolar Transistor）や、ダイオード、ＧＴＯ（Gate Turn Off Thirstier）トランジスタなどの半導体素子を絶縁樹脂によって封止した半導体モジュールが使用されている。半導体モジュールは、動作時の発熱を放出するために、ヒートシンクに熱的に密着させて使用される。   Semiconductor control devices using semiconductors use semiconductor modules in which semiconductor elements such as IGBTs (Insulated Gate Bipolar Transistors), diodes, and GTO (Gate Turn Off Thirstier) transistors are sealed with an insulating resin. A semiconductor module is used in thermal contact with a heat sink in order to release heat generated during operation.

ここで、従来の半導体制御装置では、半導体モジュールをヒートシンクに板バネを用いて押さえ付けた状態でネジ止めしている。半導体モジュールをヒートシンクに密着させることによって、両者の間の熱抵抗が減少するので、半導体モジュールの熱を放出し易くなる。板バネは、中央部分にヒートシンクに固定するときに使うネジ孔が等間隔に複数形成されている。板バネの周縁部は、スリットで複数に分割されることによって複数のアーム部が形成されている。   Here, in the conventional semiconductor control device, the semiconductor module is screwed in a state where the semiconductor module is pressed against the heat sink using a leaf spring. By bringing the semiconductor module into close contact with the heat sink, the thermal resistance between the two decreases, so that the heat of the semiconductor module is easily released. The leaf spring has a plurality of screw holes formed at equal intervals in the central portion for use in fixing to the heat sink. The peripheral portion of the leaf spring is divided into a plurality of portions by slits to form a plurality of arm portions.

板バネを用いて半導体モジュールをヒートシンクに固定するときは、板バネの中央部分に補強梁を添えて、板バネの捩れを防止する。補強梁には、貫通孔が設けられており、補強梁と板バネを重ねた状態でヒートシンクにネジ止めする。これによって、複数のアーム部によって、半導体モジュールがヒートシンクに向けて押さえ付けられる。   When the semiconductor module is fixed to the heat sink using a leaf spring, a reinforcing beam is attached to the central portion of the leaf spring to prevent twisting of the leaf spring. The reinforcing beam is provided with a through hole, and is screwed to the heat sink in a state where the reinforcing beam and the leaf spring are overlapped. Accordingly, the semiconductor module is pressed against the heat sink by the plurality of arm portions.

特開２００１−２２８１９３号公報JP 2001-228193 A

しかしながら、従来の板バネでは、半導体モジュールを固定するときに別体の補強梁を添える必要があるので、部品点数が多かった。また、半導体モジュールの取り付け時には板バネのネジ孔と補強梁の貫通孔を位置合わせする必要があるので、組み立て時の工数を少なくすることが困難であった。
本発明は、このような事情を鑑みてなされたものであり、半導体モジュールを簡単な構成で確実に固定することを目的とする。 However, the conventional leaf spring has a large number of parts because it is necessary to attach a separate reinforcing beam when fixing the semiconductor module. Further, since it is necessary to align the screw hole of the leaf spring and the through hole of the reinforcing beam when mounting the semiconductor module, it is difficult to reduce the number of man-hours during assembly.
The present invention has been made in view of such circumstances, and an object thereof is to reliably fix a semiconductor module with a simple configuration.

本発明によれば、半導体素子が絶縁樹脂で封入された半導体モジュールを載置する冷却部材の載置面に設けられた嵌合溝と、前記嵌合溝の側壁から延びる爪部が形成された第１の嵌合部と、記半導体モジュールを前記冷却部材に押さえ付けるアーム部を備えた押さえバネに弾性変形可能に設けられ、前記爪部によって係止される係止片を有する第２の嵌合部と、を含み、前記第１の嵌合部と前記第２の嵌合部は、前記アーム部と前記半導体モジュールの両側を挟むように複数設けられ、前記第１の嵌合部の高さは、前記押さえバネを組み付けたときの前記アーム部の高さより高く設けられており、前記アーム部及び前記係止片は、前記押さえバネのベース部から湾曲しつつ延びており、前記アーム部の屈曲形状は前記係止片の屈曲形状と一致することを特徴とする半導体モジュールの固定構造が提供される。
According to the present invention, the fitting groove provided on the mounting surface of the cooling member for mounting the semiconductor module in which the semiconductor element is sealed with the insulating resin, and the claw portion extending from the side wall of the fitting groove are formed. A second fitting having a first fitting part and a retaining spring provided with an arm part for pressing the semiconductor module against the cooling member so as to be elastically deformable and latched by the claw part. And a plurality of the first fitting portion and the second fitting portion are provided so as to sandwich both sides of the arm portion and the semiconductor module, and the height of the first fitting portion is high. The arm portion and the locking piece extend while curving from the base portion of the pressing spring, and are provided higher than the height of the arm portion when the pressing spring is assembled. The bent shape of this is the same as the bent shape of the locking piece Fixing structure of the semiconductor module is provided, characterized in that that.

また、本発明の別の観点によれば、前記爪部には、前記第１の嵌合部に前記第２の嵌合部を嵌合させる方向において、前記係止片の幅を減少させる傾斜面を有することを特徴と
する請求項１に記載の半導体モジュールの固定構造が提供される。 Further, according to another aspect of the present invention, the claw portion is inclined to reduce the width of the locking piece in the direction in which the second fitting portion is fitted to the first fitting portion. The semiconductor module fixing structure according to claim 1, further comprising a surface.

本発明によれば、第１の嵌合部に第２の嵌合部を嵌合させるだけで半導体モジュールを冷却部材に固定できる。補強梁やネジが不要になるので、部品点数を低減できる。   According to the present invention, the semiconductor module can be fixed to the cooling member only by fitting the second fitting portion to the first fitting portion. Since no reinforcing beams or screws are required, the number of parts can be reduced.

図１は、本発明の実施の形態に係る半導体モジュールの固定構造を含む半導体制御装置の概略構成を示す斜視図である。FIG. 1 is a perspective view showing a schematic configuration of a semiconductor control device including a semiconductor module fixing structure according to an embodiment of the present invention. 図２は、本発明の実施の形態に係る半導体モジュールの固定構造の一部を拡大して示す斜視図である。FIG. 2 is an enlarged perspective view showing a part of the semiconductor module fixing structure according to the embodiment of the present invention. 図３は、本発明の実施の形態に係る半導体モジュールの固定構造を含む半導体制御装置の概略構成を示す側面図である。FIG. 3 is a side view showing a schematic configuration of the semiconductor control device including the semiconductor module fixing structure according to the embodiment of the present invention. 図４は、本発明の実施の形態に係る押さえバネを示し、（ａ）は斜視図であり、（ｂ）は（ａ）のＩ―Ｉ線に沿った断面図である。4A and 4B show a holding spring according to an embodiment of the present invention, in which FIG. 4A is a perspective view, and FIG. 4B is a cross-sectional view taken along line II in FIG.

本発明を実施するための形態について以下に詳細に説明する。
半導体制御装置１は、冷却部材であるヒートシンク２を有する。ヒートシンク２の下面には、放熱フィン２Ａが多数配列されている。ヒートシンク２の上面は、３つの半導体モジュール５，６，７を載置する載置面２Ｂになっている。載置面２Ｂは、平面からなり、半導体モジュールの固定構造のヒートシンク２側の嵌合部となる複数の第１の嵌合部１１Ａ，１１Ｂ，１１Ｃ，１１Ｄが所定の間隔で突設されている。さらに、３つの半導体モジュール５〜７は、押さえバネ１０によってヒートシンク２に押し付けられ、固定されている。 The form for implementing this invention is demonstrated in detail below.
The semiconductor control device 1 includes a heat sink 2 that is a cooling member. A large number of heat radiation fins 2 </ b> A are arranged on the lower surface of the heat sink 2. The upper surface of the heat sink 2 is a mounting surface 2B on which the three semiconductor modules 5, 6, and 7 are mounted. The mounting surface 2B is a flat surface, and a plurality of first fitting portions 11A, 11B, 11C, and 11D that serve as fitting portions on the heat sink 2 side of the semiconductor module fixing structure are projected at a predetermined interval. . Further, the three semiconductor modules 5 to 7 are pressed against the heat sink 2 by the pressing spring 10 and fixed.

半導体モジュール５〜７は、不図示の半導体素子や半導体回路が絶縁樹脂でパッケージされている。各半導体モジュール５〜７には、電流を入出力するための端子５Ａ，６Ａ，７Ａが複数設けられている。また、半導体モジュール５〜７に信号を入出力する不図示の端子が設けられている。不図示の端子は、制御基板に電気的に接続される。この実施の形態において、半導体モジュール５〜７は、３相モータのスイッチング素子として使用可能であり、モータの３相のそれぞれに対応して３つ設けられている。なお、半導体モジュール５〜７の形状や数は、図１に限定されない。   As for the semiconductor modules 5-7, the semiconductor element and semiconductor circuit which are not illustrated are packaged with the insulating resin. Each of the semiconductor modules 5 to 7 is provided with a plurality of terminals 5A, 6A, and 7A for inputting and outputting current. In addition, terminals (not shown) for inputting and outputting signals to the semiconductor modules 5 to 7 are provided. A terminal (not shown) is electrically connected to the control board. In this embodiment, the semiconductor modules 5 to 7 can be used as switching elements of a three-phase motor, and three semiconductor modules are provided corresponding to each of the three phases of the motor. In addition, the shape and number of the semiconductor modules 5-7 are not limited to FIG.

図１と、図２の拡大図、図３の側面図に示すように、ヒートシンク２の載置面２Ｂには、４つの第１の嵌合部１１Ａ〜１１Ｄが平行に形成されている。各第１の嵌合部１１Ａ〜１１Ｄの上部の中央には、押さえバネ１０を嵌合させる溝１２が１つずつ形成されている
。溝１２は、略Ｕ字形の底部１２Ａと、底部１２Ａから段差を形成しつつ幅を拡張させることによって形成された一対の側壁１２Ｂとを有する。また、溝１２の側壁１２Ｂのそれぞれの上端部分には、爪部１３が１つずつ設けられている。爪部１３は、内側に向かって突出すると共に、上面が先端に向かって下方に傾斜するテーパ面１３Ａ（傾斜面）になっている。 As shown in FIG. 1, an enlarged view of FIG. 2, and a side view of FIG. 3, four first fitting portions 11 </ b> A to 11 </ b> D are formed in parallel on the mounting surface 2 </ b> B of the heat sink 2. One groove 12 into which the presser spring 10 is fitted is formed in the center of the upper portion of each of the first fitting portions 11A to 11D. The groove 12 has a substantially U-shaped bottom portion 12A and a pair of side walls 12B formed by expanding the width while forming a step from the bottom portion 12A. One claw portion 13 is provided at each upper end portion of the side wall 12B of the groove 12. The claw portion 13 protrudes inward and has a tapered surface 13A (inclined surface) whose upper surface is inclined downward toward the tip.

第１の嵌合部１１Ａ〜１１Ｄの配置間隔は、半導体モジュール５〜７のサイズに一致させてあり、隣り合う２つの第１の嵌合部１１Ａ〜１１Ｄによって半導体モジュール５〜７が１つずつ位置決めされる。   The arrangement interval of the first fitting portions 11A to 11D is made to coincide with the size of the semiconductor modules 5 to 7, and the semiconductor modules 5 to 7 are arranged one by one by two adjacent first fitting portions 11A to 11D. Positioned.

図１から図４に示すように、押さえバネ１０は、細長の基部２１を有する。基部２１の長さは、ヒートシンク２に形成されている最も離れた２つの第１の嵌合部１１Ａ，１１Ｄの間の距離以上である。基部２１からは、半導体モジュールの固定構造のバネ部材１０側の嵌合部となる４つの第２の嵌合部２２Ａ，２２Ｂ，２２Ｃ，２２Ｄと、３対のアーム部２３，２４，２５とが交互に延びている。具体的には、基部２１の長手方向の一方の端部から順番に、第２の嵌合部２２Ａ、アーム部２３、第２の嵌合部２２Ｂ、アーム部２４、バネ嵌合部２２Ｃ、アーム部２５、第２の嵌合部２２Ｄが形成されている。基部２１を挟んで延びる３対のアーム部２３〜２５は、基部２１の中心線に対して対称に配置されている。なお、押さえバネ１０は、弾性変形可能な材料を例えばプレス加工して製造される。   As shown in FIGS. 1 to 4, the holding spring 10 has an elongated base 21. The length of the base portion 21 is equal to or longer than the distance between the two most distant first fitting portions 11 </ b> A and 11 </ b> D formed on the heat sink 2. From the base portion 21, there are four second fitting portions 22A, 22B, 22C, and 22D that are fitting portions on the spring member 10 side of the semiconductor module fixing structure, and three pairs of arm portions 23, 24, and 25. It extends alternately. Specifically, in order from one end in the longitudinal direction of the base portion 21, the second fitting portion 22A, the arm portion 23, the second fitting portion 22B, the arm portion 24, the spring fitting portion 22C, and the arm A portion 25 and a second fitting portion 22D are formed. The three pairs of arm portions 23 to 25 extending across the base portion 21 are disposed symmetrically with respect to the center line of the base portion 21. The holding spring 10 is manufactured, for example, by pressing an elastically deformable material.

各第２の嵌合部２２Ａ〜２２Ｄは、基部２１の両側から一体に延びる一対の係止片３１を有する。図２及び図３に示すように、係止片３１は、基部２１から上側にカーブを描きつつ曲げられることで曲部３１Ａが形成され、垂直上向きに延びた後、先端部３１Ｂが外側に向けて折り返されており、全体として弾性変形可能に形成されている。基部２１及び係止片３１の曲部３１Ａの形状は、第１の嵌合部１１Ａ〜１１Ｄの底部１２Ａの形状に略一致している。また、外力が作用していない状態における係止片３１の先端部３１Ｂの外端面間の距離Ｗ１は、第１の嵌合部１１Ａ〜１１Ｄの一対の側壁１２Ｂ間の距離に略等しい。さらに、係止片３１の外端面間の距離Ｗ１は、第１の嵌合部１１Ａ〜１１Ｄの爪部１３の内端間の距離Ｗ２より長い。   Each of the second fitting portions 22 </ b> A to 22 </ b> D has a pair of locking pieces 31 extending integrally from both sides of the base portion 21. As shown in FIGS. 2 and 3, the locking piece 31 is bent while curving upward from the base portion 21 to form a curved portion 31 </ b> A. After extending vertically upward, the distal end portion 31 </ b> B faces outward. And is formed so as to be elastically deformable as a whole. The shape of the curved portion 31A of the base 21 and the locking piece 31 substantially matches the shape of the bottom 12A of the first fitting portions 11A to 11D. In addition, the distance W1 between the outer end surfaces of the distal end portion 31B of the locking piece 31 when no external force is acting is substantially equal to the distance between the pair of side walls 12B of the first fitting portions 11A to 11D. Furthermore, the distance W1 between the outer end surfaces of the locking piece 31 is longer than the distance W2 between the inner ends of the claw portions 13 of the first fitting portions 11A to 11D.

また、図４（ａ）及び図４（ｂ）に示すように、各アーム部２３〜２５は、基部２１の両側を滑らかなカーブを形成しつつ上方に曲げることによって曲部２６，２７，２８を形成し、垂直上向きに延びた後、外側、かつ基部２１と略平行に折り返されている。さらに、アーム部２３の両端部は、下側に折り返されており、これによって半導体モジュール５，６，７に面接触する押圧部２３Ａ，２４Ａ，２５Ａが形成されている。ここで、各アーム部２３〜２５の形状は等しく、基部２１の長手方向に平行な方向からみたときの各曲部２６〜２８の形状は、第２の嵌合部２２Ａ〜２２Ｄの曲部３１Ａの形状と同一になっている。   Further, as shown in FIGS. 4A and 4B, the arm portions 23 to 25 are bent portions 26, 27, and 28 by bending both sides of the base portion 21 upward while forming a smooth curve. , And extending vertically upward, and then folded back substantially outside the base 21. Further, both end portions of the arm portion 23 are folded downward, thereby forming pressing portions 23A, 24A, and 25A that are in surface contact with the semiconductor modules 5, 6, and 7, respectively. Here, the shape of each arm part 23-25 is equal, and the shape of each curved part 26-28 when it sees from the direction parallel to the longitudinal direction of the base 21 is the curved part 31A of 2nd fitting part 22A-22D. The shape is the same.

次に、半導体制御装置１の製造工程の一部を構成する半導体モジュール５〜７をヒートシンク２に対して固定する工程について説明する。
まず、ヒートシンク２に３つの半導体モジュール５〜７を固定するときは、最初にヒートシンク２の載置面２Ｂの所定位置に半導体モジュール５〜７を１つずつ配置する。各半導体モジュール５〜７は、隣り合う２つの第１の嵌合部１１Ａ〜１１Ｄの間に１つずつ配置される。続いて、図２に示すように、上方から押さえバネ１０を半導体モジュール５〜７の上に重ねてから、押さえバネ１０を矢印ＡＲ１に示す下方向に押し込んで、ヒートシンク２に設けられた第１の嵌合部１１Ａ〜１１Ｄと、押さえバネ１０に設けられた第２の嵌合部２２Ａ〜２２Ｄとを嵌合させる。 Next, a process of fixing the semiconductor modules 5 to 7 constituting a part of the manufacturing process of the semiconductor control device 1 to the heat sink 2 will be described.
First, when fixing the three semiconductor modules 5 to 7 to the heat sink 2, first, the semiconductor modules 5 to 7 are arranged one by one at predetermined positions on the mounting surface 2 </ b> B of the heat sink 2. Each semiconductor module 5-7 is arrange | positioned 1 each between two adjacent 1st fitting parts 11A-11D. Subsequently, as shown in FIG. 2, the pressing spring 10 is overlaid on the semiconductor modules 5 to 7 from above, and then the pressing spring 10 is pressed in the downward direction indicated by the arrow AR <b> 1 to be provided in the heat sink 2. The fitting portions 11A to 11D and the second fitting portions 22A to 22D provided on the holding spring 10 are fitted.

具体的には、第１の嵌合部１１Ａ〜１１Ｄに第２の嵌合部２２Ａ〜２２Ｄを押し込んで
両者を嵌合させる。ここで、第２の嵌合部２２Ａ〜２２Ｄの係止片３１の外端面間の距離Ｗ１は、第１の嵌合部１１Ａ〜１１Ｄの爪部１３の先端間の距離Ｗ２より長い。しかしながら、爪部１３の上面には、テーパ面１３Ａが係止片３１を内側にガイドするように傾斜しているので、押さえバネ１０を矢印ＡＲ１に示す嵌合方向に押し込むと、係止片３１がテーパ面１３Ａにガイドされながら、一対の先端部３１Ｂの外端面間の距離を減少させるように弾性変形する。係止片３１の先端部３１Ｂの外端面間の距離が爪部１３の先端間の距離Ｗ２よりも近くなると、係止片３１が爪部１３を越えて下方に移動する。これによって、押さえバネ１０の基部２１が溝１２の底部１２Ａに向かって移動する。 Specifically, the second fitting portions 22A to 22D are pushed into the first fitting portions 11A to 11D to fit them together. Here, the distance W1 between the outer end surfaces of the locking pieces 31 of the second fitting portions 22A to 22D is longer than the distance W2 between the tips of the claw portions 13 of the first fitting portions 11A to 11D. However, since the tapered surface 13A is inclined on the upper surface of the claw portion 13 so as to guide the locking piece 31 inward, when the pressing spring 10 is pushed in the fitting direction indicated by the arrow AR1, the locking piece 31 is pressed. Is elastically deformed so as to reduce the distance between the outer end surfaces of the pair of tip portions 31B while being guided by the tapered surface 13A. When the distance between the outer end surfaces of the distal end portion 31 </ b> B of the locking piece 31 becomes closer than the distance W <b> 2 between the distal ends of the claw portions 13, the locking piece 31 moves downward beyond the claw portions 13. As a result, the base 21 of the holding spring 10 moves toward the bottom 12 </ b> A of the groove 12.

これに伴い、係止片３１は、爪部１３の間を通り抜けて、爪部１３の下方に移動する。その結果、爪部１３によって係止片３１に与えられていた外力がなくなるので、係止片３１が弾性力によって元の形状に戻る。その結果、嵌合部１１Ａ〜１１Ｄ，２２Ａ〜２２Ｄの嵌合を解消させる方向にバネ部材１０を移動させるようとすると、第２の嵌合部２２Ａ〜２２Ｄの係止片３１Ａの先端部３１Ｂの上面が溝１２の爪部１３の下面に密着して係止される。従って、バネ部材１０がヒートシンク２から簡単に外れることはない。また、一対の係止片３１のそれぞれの先端部３１Ｂの外端面間の距離Ｗ１は、溝１２の一対の側壁１２Ｂ間の距離に略等しいので、係止片３１の先端部３１Ｂがそれぞれ対向する側壁１２に当接する。これによって、押さえバネ１０の上下方向の移動と、左右方向の移動が規制される。   Accordingly, the locking piece 31 passes between the claw portions 13 and moves below the claw portions 13. As a result, the external force applied to the locking piece 31 by the claw portion 13 disappears, and the locking piece 31 returns to its original shape by the elastic force. As a result, when the spring member 10 is moved in the direction to cancel the fitting of the fitting portions 11A to 11D and 22A to 22D, the distal end portion 31B of the locking piece 31A of the second fitting portions 22A to 22D The upper surface is brought into close contact with the lower surface of the claw portion 13 of the groove 12 and is locked. Therefore, the spring member 10 is not easily detached from the heat sink 2. In addition, since the distance W1 between the outer end surfaces of the tip portions 31B of the pair of locking pieces 31 is substantially equal to the distance between the pair of side walls 12B of the groove 12, the tip portions 31B of the locking pieces 31 face each other. It contacts the side wall 12. As a result, the vertical movement and the horizontal movement of the presser spring 10 are restricted.

さらに、第１の嵌合部１１Ａ〜１１Ｄの高さは、押さえバネ１０を組み付けたときのアーム部２３〜２５の高さより高い。このために、押さえバネ１０の基部２１の長手方向の移動は、第１の嵌合部１１Ａ〜１１Ｄによって規制される。これらのことから、押さえバネ１０が全体として、位置決めしてヒートシンク２に固定される。   Furthermore, the height of the first fitting portions 11A to 11D is higher than the height of the arm portions 23 to 25 when the pressing spring 10 is assembled. For this reason, the longitudinal movement of the base portion 21 of the presser spring 10 is restricted by the first fitting portions 11A to 11D. Therefore, the holding spring 10 is positioned and fixed to the heat sink 2 as a whole.

第１の嵌合部１１Ａ〜１１Ｄに第２の嵌合部２２Ａ〜２２Ｄを嵌合させたときの押さえバネ１０の基部２１の高さは、半導体モジュール５〜７の高さに略等しくなる。このために、半導体モジュール５〜７は、押さえバネ１０の基部２１によってヒートシンク２に押さえ付けられる。嵌合部１１Ａ〜１１Ｄ，２２Ａ〜２２Ｄは、各半導体モジュール５〜７を挟むように複数配置されているので、基部２１は撓むことなく、各半導体モジュール５〜７をヒートシンク２に押さえ付ける。   The height of the base portion 21 of the pressing spring 10 when the second fitting portions 22A to 22D are fitted to the first fitting portions 11A to 11D is substantially equal to the height of the semiconductor modules 5 to 7. For this reason, the semiconductor modules 5 to 7 are pressed against the heat sink 2 by the base 21 of the pressing spring 10. Since multiple fitting parts 11A-11D and 22A-22D are arrange | positioned so that each semiconductor module 5-7 may be pinched | interposed, the base 21 presses each semiconductor module 5-7 against the heat sink 2 without bending.

なお、バネ部材１０をヒートシンク２に固定した状態では、バネ部材１０の基部２１は、第１の嵌合部１１Ａ〜１１Ｄの溝１２からわずかに浮いている。溝１２は、バネ部材１０の押し込み過ぎを防止するためのリミッターとして機能している。従って、溝１２にバネ部材１０の底部２１を密着させても良いし、図１及び図３に示すように隙間４１を形成しても良い。   In the state where the spring member 10 is fixed to the heat sink 2, the base portion 21 of the spring member 10 slightly floats from the groove 12 of the first fitting portions 11 </ b> A to 11 </ b> D. The groove 12 functions as a limiter for preventing the spring member 10 from being pushed too much. Therefore, the bottom portion 21 of the spring member 10 may be brought into close contact with the groove 12, or the gap 41 may be formed as shown in FIGS.

さらに、押さえバネ１０の基部２１からは複数のアーム部２３〜２５が延びており、これらアーム部２３〜２５によっても各半導体モジュール５〜７がヒートシンク２に押さえ付けられる。例えば、一対のアーム部２３は、基部２１を介して２組の嵌合部１１Ａ，２２Ａ，１１Ｂ，２２Ｂによって支持され、それぞれの押圧部２３Ａによって半導体モジュール５をヒートシンク２に押さえ付ける。同様に、一対のアーム部２４のそれぞれの押圧部２４Ａは、基部２１を介して２組の嵌合部１１Ｂ，２２Ｂ，１１Ｃ，２２Ｃによって支持され、半導体モジュール６をヒートシンク２に押さえ付ける。さらに、一対のアーム部２５のそれぞれの押圧部２５Ａは、基部２１を介して２組の嵌合部１１Ｃ，２２Ｃ，１１Ｄ，２２Ｄによって支持され、半導体モジュール７をヒートシンク２に押さえ付ける。   Further, a plurality of arm portions 23 to 25 extend from the base portion 21 of the pressing spring 10, and the semiconductor modules 5 to 7 are pressed against the heat sink 2 by the arm portions 23 to 25. For example, the pair of arm portions 23 are supported by two sets of fitting portions 11A, 22A, 11B, and 22B via the base portion 21, and press the semiconductor module 5 against the heat sink 2 by the respective pressing portions 23A. Similarly, each pressing portion 24 </ b> A of the pair of arm portions 24 is supported by two sets of fitting portions 11 </ b> B, 22 </ b> B, 11 </ b> C, and 22 </ b> C via the base portion 21 and presses the semiconductor module 6 against the heat sink 2. Further, each pressing portion 25 </ b> A of the pair of arm portions 25 is supported by two sets of fitting portions 11 </ b> C, 22 </ b> C, 11 </ b> D, and 22 </ b> D via the base portion 21 and presses the semiconductor module 7 against the heat sink 2.

この実施の形態では、基部２１を挟む一対のアーム部２３〜２５によって、１つの半導体モジュール５〜７をヒートシンク２に押し付けるので、押さえバネ１０の押さ付け力を
各半導体モジュール５〜７に均等に作用させ易い。なお、アーム部２３〜２５の数や配置は、図１に限定されない In this embodiment, since one semiconductor module 5-7 is pressed against the heat sink 2 by the pair of arm portions 23-25 sandwiching the base 21, the pressing force of the holding spring 10 is evenly applied to each semiconductor module 5-7. Easy to act. In addition, the number and arrangement | positioning of the arm parts 23-25 are not limited to FIG.

また、一対のアーム部２３〜２５は、１つの半導体モジュール５〜７のみに当接している。このために、各半導体モジュール５〜７は、押さえバネ１０によって、他の半導体モジュール５〜７の影響を受けずにヒートシンク２に押さえ付けられる。また、一対のアーム部２３〜２５で半導体モジュール５〜７を１つずつ押圧するので、半導体モジュール５〜７の製品ごとのばらつきを吸収できる。   Further, the pair of arm portions 23 to 25 is in contact with only one semiconductor module 5 to 7. For this reason, the semiconductor modules 5 to 7 are pressed against the heat sink 2 by the pressing spring 10 without being affected by the other semiconductor modules 5 to 7. In addition, since the semiconductor modules 5 to 7 are pressed one by one with the pair of arm portions 23 to 25, variations in the products of the semiconductor modules 5 to 7 can be absorbed.

さらに、アーム部２３〜２５は、半導体モジュール５〜７の両端部の近傍に一箇所ずつ当接する。従って、１つの半導体モジュール５〜７に対して押さえバネ１０からの押し付け力が均等に作用する。このために、半導体モジュール５〜７で発生した熱をヒートシンク２に確実に伝達できる。従って、半導体モジュール４を効率良く冷却できる。
さらに、各アーム部２３〜２５の押圧部２３Ａ〜２５Ａは、半導体モジュール５〜７に面接触するので、半導体モジュール５〜７の表面を傷付けることはない。 Furthermore, the arm parts 23-25 contact | abut one place near the both ends of the semiconductor modules 5-7 one by one. Therefore, the pressing force from the holding spring 10 acts equally on one semiconductor module 5-7. For this reason, the heat generated in the semiconductor modules 5 to 7 can be reliably transmitted to the heat sink 2. Therefore, the semiconductor module 4 can be efficiently cooled.
Furthermore, since the pressing portions 23A to 25A of the arm portions 23 to 25 are in surface contact with the semiconductor modules 5 to 7, the surfaces of the semiconductor modules 5 to 7 are not damaged.

以上、説明したように、この実施の形態ではヒートシンク２に第１の嵌合部１１Ａ〜１１Ｄを複数設け、押さえバネ１０に第２の嵌合部２２Ａ〜２２Ｄを複数設け、これら嵌合部１１Ａ〜１１Ｄ，２２Ａ〜２２Ｄを用いて複数個所で押さえバネ１０をヒートシンク２に固定するようにしたので、ねじを用いることなく、半導体モジュール５〜７をヒートシンク２に押さえ付けられる。嵌合部１１Ａ〜１１Ｄ，２２Ａ〜２２Ｄは、半導体モジュール５〜７を挟むように配置したので、半導体モジュール５〜７の移動を規制できる。これに伴って、基部２１の浮き上がりや捩れを防止できるので、補強梁が不要になると共に、一対のアーム部２３〜２５ごとの押圧力を均一にできる。   As described above, in this embodiment, the heat sink 2 is provided with a plurality of first fitting portions 11A to 11D, the holding spring 10 is provided with a plurality of second fitting portions 22A to 22D, and these fitting portions 11A. Since the pressing springs 10 are fixed to the heat sink 2 at a plurality of locations using ˜11D and 22A to 22D, the semiconductor modules 5 to 7 can be pressed against the heat sink 2 without using screws. Since the fitting parts 11A to 11D and 22A to 22D are arranged so as to sandwich the semiconductor modules 5 to 7, the movement of the semiconductor modules 5 to 7 can be restricted. Along with this, the base 21 can be prevented from being lifted or twisted, so that no reinforcing beam is required and the pressing force for each of the pair of arm portions 23 to 25 can be made uniform.

また、第１の嵌合部１１Ａ〜１１Ｄに溝１２と爪部１３を設け、第２の嵌合部２２Ａ〜２２Ｄに弾性変形可能な係止片３１を設けたスナップフィット構造としたので、押さえバネ１０を押し込むだけで、押さえバネ１０で半導体モジュール５〜７をヒートシンク２に押し付けながら固定できる。爪部１３にテーパ面１３Ａを形成することによって、押さえバネ１０を押し付けるときに係止片３１を変形させ易くなるので、組み付け作業が容易になる。   In addition, since the groove 12 and the claw portion 13 are provided in the first fitting portions 11A to 11D, and the locking pieces 31 that are elastically deformable are provided in the second fitting portions 22A to 22D, the snap fitting structure is provided. The semiconductor modules 5 to 7 can be fixed by pressing the spring 10 while pressing the semiconductor modules 5 to 7 against the heat sink 2. By forming the tapered surface 13 </ b> A on the claw portion 13, the engaging piece 31 can be easily deformed when the pressing spring 10 is pressed, and the assembling work is facilitated.

第２の嵌合部２２Ａ〜２２Ｄの係止片３１の曲部３１Ａの形状と、アーム部２３〜２５の曲部２６〜２８の形状を同形状にしたので、一回の成型工程で曲部３１Ａ，２６〜２８を同時に形成することができ、作業効率が向上する。   Since the shape of the bent portion 31A of the locking piece 31 of the second fitting portions 22A to 22D and the shape of the bent portions 26 to 28 of the arm portions 23 to 25 are the same shape, the bent portion is formed in a single molding process. 31A and 26-28 can be formed simultaneously, and work efficiency improves.

なお、本発明は、実施の形態に限定されずに広く応用できる。
例えば、実施形態における上下方向を反対にしても良い。半導体制御装置１は、ヒートシンク２に押さえバネ１０で固定した半導体モジュール５〜７を上下に対向して配置しても良い。 Note that the present invention can be widely applied without being limited to the embodiments.
For example, the vertical direction in the embodiment may be reversed. In the semiconductor control device 1, the semiconductor modules 5 to 7 fixed to the heat sink 2 with the holding spring 10 may be arranged to face each other up and down.

２ ヒートシンク
２Ｂ 載置面
５，６，７ 半導体モジュール
１０ 押さえバネ
１１Ａ，１１Ｂ，１１Ｃ，１１Ｄ 第１の嵌合部
１２ 溝（嵌合溝）
１２Ｂ 側壁
１３ 爪部
１３Ａ テーパ面（傾斜面）
２２Ａ，２２Ｂ，２２Ｃ，２２Ｄ 第２の嵌合部
２３，２４，２５ アーム部
２６，２７，２８ 曲部
３１ 係止片
３１Ａ 曲部 2 heat sink 2B mounting surface 5, 6, 7 semiconductor module 10 holding spring 11A, 11B, 11C, 11D first fitting portion 12 groove (fitting groove)
12B side wall 13 claw part 13A taper surface (inclined surface)
22A, 22B, 22C, 22D 2nd fitting part 23, 24, 25 Arm part 26, 27, 28 Bending part 31 Locking piece 31A Bending part

Claims (2)

半導体素子が絶縁樹脂で封入された半導体モジュールを載置する冷却部材の載置面に設けられた嵌合溝と、前記嵌合溝の側壁から延びる爪部が形成された第１の嵌合部と、
前記半導体モジュールを前記冷却部材に押さえ付けるアーム部を備えた押さえバネに弾性変形可能に設けられ、前記爪部によって係止される係止片を有する第２の嵌合部と、を含み、
前記第１の嵌合部と前記第２の嵌合部は、前記アーム部と前記半導体モジュールの両側を挟むように複数設けられ、前記第１の嵌合部の高さは、前記押さえバネを組み付けたときの前記アーム部の高さより高く設けられており、
前記アーム部及び前記係止片は、前記押さえバネのベース部から湾曲しつつ延びており、前記アーム部の屈曲形状は前記係止片の屈曲形状と一致することを特徴とする半導体モジュールの固定構造。 1st fitting part in which the fitting groove | channel provided in the mounting surface of the cooling member which mounts the semiconductor module with which the semiconductor element was enclosed with the insulating resin and the claw part extended from the side wall of the said fitting groove were formed When,
A second fitting portion having a locking piece that is elastically deformable to a holding spring having an arm portion that presses the semiconductor module against the cooling member, and has a locking piece locked by the claw portion,
A plurality of the first fitting portion and the second fitting portion are provided so as to sandwich both sides of the arm portion and the semiconductor module, and the height of the first fitting portion is determined by the holding spring. It is provided higher than the height of the arm when assembled ,
The arm portion and the locking piece extend while curving from the base portion of the holding spring, and the bent shape of the arm portion matches the bent shape of the locking piece. Construction. 前記爪部には、前記第１の嵌合部に前記第２の嵌合部を嵌合させる方向において、前記係止片の幅を減少させる傾斜面を有することを特徴とする請求項１に記載の半導体モジュールの固定構造。
The said claw part has the inclined surface which reduces the width | variety of the said locking piece in the direction which fits the said 2nd fitting part to the said 1st fitting part. The fixing structure of the semiconductor module as described.
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