JP2008141022A - Connection structure of electronic component and connection inspecting method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connection structure of electronic components in which the displacement of the electronic components on a wiring board can be accurately detected inexpensively with a small number of parts by providing a displacement detection bump. <P>SOLUTION: The connection structure includes a displacement detecting bump 5C for detecting the positional deviation between an electrode terminal portion 12A of a wiring 12 and a connection terminal 5B of a driver IC 5 in a region of the wiring board 4 where the driver IC 5 is mounted. In a specific electrode terminal portion 11Aba formed on the wiring 11A, a distance between the electrode terminal portion 11Aba and the displacement detecting bump 5C is smaller than a distance between the other adjacent electrode terminal portions 12A. Each of the specific electrode terminal portions 11Aba includes a branching portion 11Abb protruding from the wiring 11A, a narrow width portion 11Abc connected to the branching portion 11Abb and extending in the above direction, and an extending portion 11Abd connected to the tip of the narrow width portion 11Abc and extending in a direction perpendicular to the direction where the electrode terminal portions 12A are juxtaposed. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component connection structure and a connection inspection method thereof.

For example, in a so-called electronic apparatus such as an ink jet printer, a drive circuit unit for supplying a drive signal and a drive voltage, for example, as shown in FIG. 201 (electronic component) is mounted on the wiring board 202. In this case, as shown in FIG. 8B, each connection terminal 201 a is formed on the surface of the drive unit 201 that is connected to the wiring board 202, and each connection terminal 201 a is formed on the wiring board 202. In addition, it corresponds to a plurality of electrode terminal portions 203 a of the plurality of wirings 203. And each electrode terminal part 203a and the connection terminal 201a are electrically connected by overlapping and joining. When such a connection is made, there is a risk that the connection terminals 201a and the electrode terminal portions 203a may be misaligned as shown in FIG. 8C. In particular, the arrangement pitch of the terminals 201a and 203a is small. Sometimes, even a slight misalignment with respect to the arrangement direction may contact the adjacent terminal 201a or 203a to cause a short circuit. Such misalignment is difficult to detect by visual inspection, takes time, and is not productive. For this reason, it is known that when wiring or electronic components on a board are connected, a function inspection is performed to detect the continuity by separately providing inspection wiring or terminals in order to confirm the positional deviation between the objects to be connected. (For example, see Patent Documents 1, 2, and 3).
JP 2000-235191 A (paragraphs 0022 to 0028 and FIG. 3) JP 2002-232105 A (paragraphs 0025 to 0036 and FIGS. 1 to 4) JP 2003-195249 A (paragraphs 0011 to 0030 and FIGS. 2 and 3)

However, in the thing of the said patent documents 1-3, since it is necessary to provide the wiring and terminal for a test | inspection in addition to the connection wiring and terminal which play an electrical role in the drive of each electronic component, it is essential originally In addition to connection wiring and terminals, connection wiring and terminals need to be specially provided, leading to an increase in cost. In addition, a space for providing inspection wiring and terminals is required, which is not preferable in terms of space saving.
Further, with the recent increase in the density of wiring, the positional deviation amount at the time of connection between the connection terminal 201a on the drive circuit unit 201 side and the terminal portion 203a on the wiring board 202 side is within a tolerance range, and the function at the time of mounting Even if there is no problem in the inspection, there is a possibility that a short circuit may occur while the electronic component is driven by migration or the like due to a change over time, and a positional shift that causes such a potential short circuit is There was also a problem that it could not be detected by a conventional function test.

  Therefore, the present invention can detect a positional shift that causes such a potential short circuit, and also provides a bump for detecting a positional shift on an electronic component, and inspects the positional shift on a terminal that the wiring board originally has. It is an object of the present invention to provide an electronic component connection structure and a connection inspection method thereof that can inspect a positional shift at a low cost with a small number of component configurations by providing a function (that is, sharing).

  The invention according to claim 1 is directed to a connection structure for an electronic component, and the wiring board has a configuration in which a plurality of wirings are formed, and each of the wirings is installed with a plurality of electrode terminal portions arranged side by side. It is assumed that each electrode terminal portion and each connection terminal of the electronic component are electrically connected correspondingly. According to a first aspect of the present invention, in the mounting region of the electronic component, a displacement detection bump for inspecting a displacement between the electrode terminal portion and the connection terminal is provided, and a specific electrode terminal among the electrode terminal portions is provided. The inspection unit for inspecting the positional deviation between the electrode terminal part and the connection terminal, wherein the gap between the bumps for detecting the positional deviation is smaller than the distance between the other adjacent electrode terminal parts. It is characterized by that.

  In this way, it is possible to easily inspect the connection state, that is, the positional deviation between the electrode terminal portion and the connection terminal, depending on the presence / absence of conduction between the inspection portion of the specific electrode terminal portion and the bump for detecting the positional deviation. Further, the inspection of the specific electrode terminal portion of the electrode terminal portions originally provided on the wiring board with a gap smaller than the gap between the other adjacent electrode terminal portions in the gap for detecting the misalignment. Since the portion is provided, when a positional shift that causes a potential short-circuit occurs, the specific terminal portion and the inspection portion are short-circuited even if the other adjacent electrode terminal portions are not short-circuited. Therefore, it is possible to easily inspect the positional deviation as described above. In addition, since the electrode terminal portion and the inspection portion that are originally provided on the wiring board are only provided, the structure is simple and inexpensive.

  According to a second aspect of the present invention, in the electronic component connection structure according to the first aspect, the inspection unit includes a first portion extending in a direction orthogonal to a direction in which the plurality of electrode terminal portions are arranged. can do.

  According to this configuration, in addition to the effect of the first aspect, the position of the electronic component in the direction orthogonal to the direction in which the plurality of electrode terminal portions are arranged by the first portion, that is, the electrode terminal portion and the connection terminal Can be inspected.

  According to a third aspect of the present invention, in the electronic component connection structure according to the second aspect, it is desirable that the first portion is provided on both sides of the bump for detecting displacement.

  In this way, in addition to the effect of claim 2, it is possible to inspect whether the electronic component is misaligned on either side in the direction orthogonal to the direction in which the plurality of electrode terminal portions are arranged. it can.

  The electronic component connection structure according to any one of claims 1 to 3, wherein the inspection portion has a second portion extending in a direction in which the plurality of electrode terminal portions are arranged. Is desirable.

  In this case, in addition to the effect of any one of claims 1 to 3, not only the direction orthogonal to the direction in which the plurality of electrode terminal portions are arranged, but also the direction in which the plurality of electrode terminal portions are arranged. Also, the positional deviation of the electronic component can be inspected.

According to a fifth aspect of the present invention, in the electronic component connection structure according to the fourth aspect, the second part may be provided on both sides with the bump for detecting the displacement. It is.

  In this manner, in addition to the effect of the fourth aspect, even in the direction in which the plurality of electrode terminal portions are arranged, it is possible to inspect whether the electronic component is misaligned on either side.

  The electronic component connection structure according to any one of claims 1 to 5, wherein the electronic component is a drive circuit unit that generates a drive signal to be supplied to the inkjet head. In addition, an individual electrode and a piezoelectric layer are provided corresponding to the plurality of pressure chambers, while a common internal electrode is provided for the plurality of pressure chambers with the piezoelectric layer interposed therebetween. The drive signal is supplied through the wiring of the wiring board, and the wiring of the specific electrode terminal portion is a wiring that is connected to the driving circuit unit and supplies an inspection signal. In the mounting area of the drive circuit unit, the displacement detection bar is set so that the distance from the specific electrode terminal portion is smaller than the distance from other adjacent electrode terminal portions. It may be configured to flop is provided.

  According to this configuration, in addition to the effect of any one of claims 1 to 5, a specific electrode terminal portion is used as an electrode terminal portion of a wiring that is connected to the drive circuit unit and supplies a test signal. Therefore, it is not necessary to provide a space for providing inspection wiring and terminals. Therefore, it is possible to save space and cope with higher wiring density. In addition, the cost is low. Furthermore, since the wiring of the specific electrode terminal portion is a wiring for supplying an inspection signal, no current flows through the inspection wiring or terminal when the inkjet head is normally used. Therefore, even if a short circuit occurs due to a change over time during use, the short circuit does not affect the driving operation.

  The electronic component connection structure according to any one of claims 1 to 5, wherein the electronic component is a drive circuit unit that generates a drive signal to be supplied to the inkjet head. In addition, an individual electrode and a piezoelectric layer are provided corresponding to the plurality of pressure chambers, while a common internal electrode is provided for the plurality of pressure chambers with the piezoelectric layer interposed therebetween. The drive signal is supplied through the wiring of the wiring board, and the wiring of the specific electrode terminal portion is connected to the internal electrode. In the mounting region of the drive circuit unit, the specific signal The position deviation detection bump is provided so that the distance between the electrode terminal portion and the wiring is smaller than the distance between other electrode terminal portions, and the position deviation detection The bump can be used as a connection terminal of an electronic component that is connected to the wiring used when the piezoelectric layer is polarized by applying a predetermined voltage between the bump and the internal electrode in the manufacturing process. .

  In this case, in addition to the effect of any one of claims 1 to 5, the specific electrode terminal portion uses a connection terminal of an electronic component connected corresponding to the wiring used when the piezoelectric layer is polarized. Therefore, a space for providing inspection wiring and terminals is not necessary, and the space can be saved. In addition, the cost is low. Further, when the ink jet head is normally used, the inspection wiring and terminals are at the same potential and are grounded. Therefore, even if a short circuit occurs due to aging, the short circuit does not affect the operation.

  As described in claim 8, in the electronic component connection structure according to any one of claims 1 to 7, the specific electrode terminal portion is arranged near an end in a direction in which the connection terminals are arranged. Is desirable.

  In this way, in addition to the effect of any one of claims 1 to 7, the specific electrode terminal portion is disposed near the end in the direction in which the connection terminals of the electronic components are arranged, so that the other electrode terminals The effect on parts and connection terminals is small.

  The invention of claim 9 is directed to an electronic component connection inspection method, wherein the wiring board is formed with a plurality of wires, and each of the wires has a plurality of electrode terminal portions arranged side by side, It is assumed that when each connection terminal of an electronic component is connected to each electrode terminal portion of the wiring board, the connection state is inspected. According to a ninth aspect of the present invention, in the mounting region of the electronic component, a bump for detecting a displacement is provided for inspecting a displacement between the electrode terminal portion and the connection terminal, and a specific electrode terminal portion among the electrode terminal portions. Are arranged adjacent to the positional deviation detection bumps, and when the connection terminals of the electronic component are connected to the electrode terminal portions of the wiring board, the positional deviation detection bumps, The connection state is inspected based on the presence or absence of a conduction state between a specific electrode terminal portion and an adjacent electrode terminal portion.

  In this way, each electrode terminal portion of the wiring board and each of the electronic components is determined depending on whether or not there is a conduction state between the inspection portion of the specific electrode terminal portion and the adjacent electrode terminal portion through the bump for detecting the displacement. The connection state with the connection terminal can be easily inspected.

  The invention of claim 10 is directed to an electronic component connection inspection method, wherein a wiring board is formed with a plurality of wirings, and each of the wirings is configured with a plurality of electrode terminal portions arranged side by side, It is assumed that when each connection terminal of an electronic component is connected to each electrode terminal portion of the wiring board, the connection state is inspected. According to a tenth aspect of the present invention, in the mounting region of the electronic component, a bump for detecting a displacement is provided for inspecting a displacement between the electrode terminal portion and the connection terminal, and a specific electrode terminal portion among the electrode terminal portions. Is arranged next to the bump for detecting the displacement, and when the connection terminals of the electronic component are connected to the electrode terminal portions of the wiring board, the position is determined by a predetermined signal input to the electronic component. The connection state is inspected based on the presence / absence of a setting signal output from the specific electrode terminal portion via a deviation detection bump.

  In this case, the connection state is determined by inputting a predetermined signal to the electronic component and checking whether or not the setting signal is output from the specific electrode terminal portion via the bump for detecting the displacement. Can be easily inspected.

  The electronic component connection inspection method according to claim 9 or 10, wherein the electronic component is a drive circuit unit that generates a drive signal to be supplied to an inkjet head, and the inkjet head is An individual electrode and a piezoelectric layer are provided corresponding to the plurality of pressure chambers, and a common internal electrode is provided for the plurality of pressure chambers across the piezoelectric layer, and the wiring is connected to the individual electrode and the internal electrode. The drive signal is supplied through a wiring of a substrate, and the wiring of the specific electrode terminal portion is a wiring that is connected to the driving circuit unit and supplies an inspection signal, In the mounting region of the drive circuit unit, the positional deviation detection is performed so that the distance from the specific electrode terminal portion is smaller than the distance from other adjacent electrode terminal portions. It may be configured to pump is provided. Here, the wiring for supplying the inspection signal means a wiring for supplying an inspection signal for inspecting whether or not it can be normally driven, not the wiring used for driving the inkjet head.

  In this way, in addition to the effect of the ninth or tenth aspect, since the electrode terminal portion of the wiring that supplies the inspection signal is used as the specific electrode terminal portion, in the manufacturing process of the ink jet head, the appearance inspection is performed. In addition, the positional deviation can be easily inspected with high accuracy, and the productivity is good. Further, during normal use for driving the ink jet head, no current flows, and even if a short circuit occurs due to changes over time, the short circuit does not affect the operation.

  The electronic component connection inspection method according to claim 9 or 10, wherein the electronic component is a drive circuit unit that generates a drive signal to be supplied to the inkjet head. An individual electrode and a piezoelectric layer are provided corresponding to the plurality of pressure chambers, and a common internal electrode is provided for the plurality of pressure chambers across the piezoelectric layer, and the wiring is connected to the individual electrode and the internal electrode. The drive signal is supplied through the wiring of the substrate, the wiring of the specific electrode terminal portion is connected to the internal electrode, and the specific electrode terminal in the mounting area of the drive circuit unit The position deviation detection bump is provided so that the distance between the wiring and the wiring is smaller than the distance between the adjacent electrode terminal parts, and the position deviation detection bump. In addition, when polarization is applied in the manufacturing process, a predetermined voltage is applied between the internal electrodes, and the structure is a connection terminal of an electronic component that is connected corresponding to the wiring used when the piezoelectric layer is polarized. Good.

  In this case, in addition to the effect of claim 9 or 10, since the inspection is performed using the connection terminals of the electronic components connected corresponding to the wiring used when the piezoelectric layer is polarized, the inkjet head manufacturing process Therefore, the positional deviation can be easily inspected with higher accuracy than the conventional appearance inspection, and the productivity is also good. In addition, when using a normal ink jet head, since they are at the same potential, even if a short circuit occurs due to changes over time, the short circuit does not affect the operation.

  The present invention has a possibility of causing a potential short circuit by providing a bump for detecting a positional deviation in an electronic component and having a function of inspecting a positional deviation in a terminal that is originally provided on a wiring board (that is, by making it also serve as a combined use). In addition to being able to easily inspect misalignment, it is possible to inexpensively inspect misalignment with a small number of components.

  The present invention relates to a connection structure such as mounting and processing of an electronic component on a substrate such as an electronic device, and a connection inspection method thereof. For example, the present invention is applied to an inkjet head. FIG. 1 is a perspective view showing a state in which a flexible wiring board is bonded to the upper surface of an inkjet head to which the present invention is applied.

As shown in FIG. 1, the inkjet head 1 is formed by laminating an actuator unit 3 and a flexible wiring member 4 on a flow path unit 2 in the same manner as the known one described in JP-A-2006-198903. Has a configuration. The ink jet head 1 is used in an ink jet recording apparatus, and although not specifically illustrated, the ink jet head 1 is a direction X (main scanning direction) orthogonal to the recording paper transport direction Y (sub scanning direction). It is mounted on a carriage that reciprocates.
The flow path unit 2 of the inkjet head 1 is a laminated body in which a plurality of plates are laminated, and a plurality of arranged pressure chambers 2a, a plurality of nozzles (not shown) communicating with the pressure chambers 2a, and not shown. An ink flow path (not shown) that communicates ink from an ink supply source to each pressure chamber 2a and nozzles is provided. The actuator unit 3 is a laminate in which a plurality of piezoelectric layers 23 (for example, PZT) are laminated, a plurality of individual electrodes (not shown) formed corresponding to the plurality of pressure chambers 2a, and a plurality of An internal electrode (not shown) common to the pressure chamber 2 a is configured with the piezoelectric layers 23 interposed therebetween. The common internal electrode is connected to the ground, and by selectively applying a voltage to the individual electrode, a portion of the piezoelectric layer 23 sandwiched between the individual electrode and the internal electrode has a plurality of corresponding pressure chambers or nozzles. By being selectively driven as a piezoelectric deformation portion, the piezoelectric deformation portion is deformed, pressure is applied to the ink in the corresponding pressure chamber, and the ink is selectively ejected from a plurality of nozzles to the recording paper (recording medium). Make a record.

  Further, on the uppermost surface of the actuator unit 3, the surface individual electrode 22 and the surface internal electrode 24 are screen-printed and formed by a silver-palladium conductive member, and the surface individual electrode 22 and the surface internal electrode 24 are disclosed in JP-A-2003- Similarly to the known configuration described in Japanese Patent No. 80709, individual electrodes in the piezoelectric layer 23 are formed through a conductive material filled in through holes (not shown) penetrating in the stacking direction of the stacked piezoelectric layers 23. And are connected to a common internal electrode.

  A flexible wiring material 4 is laminated on the upper surface of the actuator 3. The flexible wiring material 4 has a plurality of wirings 11A to 11D, 12 such as copper, which will be described later, on one side of a strip-like base material made of a flexible rigid resin material (for example, polyimide resin) having electrical insulation. These surfaces are formed of a resist or the like, and these surfaces are covered with a cover lay made of a flexible synthetic resin (for example, polyimide resin) having electrical insulation.

  The flexible wiring material 4 is provided with individual electrode bumps 12 </ b> B and surface electrode bumps 11 </ b> AA formed on the back surface on one end side in the longitudinal direction (X direction) corresponding to each surface individual electrode 22 and the surface internal electrode 23. In addition, on the other end side (side where the driver IC 5 is provided), electrode terminal portions 11Aa, 11Ba, 11Ca, 11Da (to be referred to as the electrode terminal portion 11 in a general case) described later have a constant pitch. It is installed side by side. The individual electrode bumps 12B and the surface electrode bumps 11AA have holes formed in corresponding portions of the base material to expose a part of the wiring 12, and a conductive brazing material such as solder is melted thereon to fix the bump electrodes. Yes. Further, the electrode terminal portion is formed by exposing the upper surface side (the side opposite to the actuator 3) of the cover lay.

  A driver IC 5 (electronic component) that is a drive circuit unit extending in the width direction (Y direction) of the wiring board 4 is mounted on the wiring board 4. The driver IC 5 transmits a drive signal such as print data from the main body side and a drive voltage to the actuator unit 3 to selectively drive the actuator unit 3. Also, the wiring board 4 outputs a plurality of input-side wirings 11B (VSS2), 11C (VDD2), 11D and the driver IC 5 to the piezoelectric deformation portion for inputting the driving signal, the driving voltage, and the like to the driver IC 5. A plurality of output-side wirings 12 and wirings 11 </ b> A (COM) connected to the front surface internal electrodes 24 are formed extending in the longitudinal direction (X direction) of the wiring board 4. The individual electrode bumps 12B are connected to the output wirings 12 extending from the driver IC 5 in the longitudinal direction.

  The electrode terminal portions 11Ba, 11Ca, 11Da,... Are connected to the input side connection terminals of the driver IC 5 formed corresponding to them (only the input side connection terminals 5Aa and 5Ab corresponding to the wirings 11B and 11C are shown). Are electrically connected via wirings 11B, 11C, 11D,. Further, the driver IC 5 is provided with a plurality of output side connection terminals 5B,. These output side connection terminals 5B,... Are electrically connected to the respective electrode terminal portions 12A of the output side wiring 12 of the wiring board 4 in order to supply drive signals to the individual electrodes corresponding to the respective pressure chambers 2a. As a result, the driver IC 5 is mounted on the wiring board 4. The input side connection terminal and the output side connection terminal are formed as connection electrodes by melting gold in the driver IC 5.

  And electrode terminal part 11Aa, 11Ba, and 11Ca are arrange | positioned along with this order substantially symmetrically near the both ends of the direction (Y direction) where the several electrode terminal part 11 is arranged. In the central portion in the direction (Y direction) in which the plurality of electrode terminal portions 11 are arranged, a plurality of other electrode terminal portions 11Da,. That is, two end portions 11Aa, 11Ba, and 11Ca are provided approximately symmetrically in this order at both ends in the width direction (Y direction) of the wiring board 4, and a plurality of terminal portions 11Da are arranged inside. Has been placed.

  At the outermost end edges of the wiring board 4, wirings 11A extending from the electrode terminals 11Aa and 11Aa extend in parallel along the side edges in the longitudinal direction of the wiring board 4 and are connected to the front surface internal electrodes 24. It is a potential.

  The wiring 11B extending from the electrode terminal portions 11Ba and 11Ba arranged substantially symmetrically next to the electrode terminal portions 11Aa and 11Aa extends to the vicinity of the driver IC 5 inside the wiring 11A. Are connected to each other so as to form a loop connecting the electrode terminal portions 11Ba and 11Ba. And the connection terminals 5Aa,... Are connected under the driver IC 5 at the wiring portion near the loop. As will be described later, the wiring 11B is a wiring VSS2 used when a predetermined voltage is applied between the internal electrode and the ground potential in the manufacturing process to polarize the actuators.

  The wiring 11C extending from the electrode terminal portions 11Ca and 11Ca arranged substantially symmetrically next to and inside the electrode terminal portions 11Ba and 11Ba also extends to the vicinity of the driver IC 5 inside the wirings 11A and 11B. Are connected to each other so as to form a loop connecting the electrode terminal portions 11Ca and 11Ca. The connection portion 5Ab of the driver IC 5 is connected at the wiring portion near the loop. This wiring 11C is a conductive wire VDD2 for supplying a drive voltage (here, 30V).

  And wiring 11D of several electrode terminal part 11Da ... between the electrode terminal parts 11Ca of both sides is extended and connected to driver IC5, and functions as a signal line which supplies an input signal.

  The input signal input to the electrode terminal portion 11Da is controlled through the driver IC 5 in the same manner as the drive control known in Japanese Patent Laid-Open No. 2002-160372, thereby deforming the piezoelectric deformation portion (PZT in FIG. 3). Let Referring to FIG. 3, the driver IC 5 includes a shift register 111, a D flip-flop 112, a driver 105, and the like. A plurality of shift registers 111 and D flip-flops 112 are provided corresponding to the number of nozzles, and conducting wires for supplying these driving voltages are conducting wires VDD1 and VSS1. Also, a plurality of piezoelectric deformation portions of the driver 105 and the reference C (PZT) are prepared according to the number of nozzles, and the conductive wires for supplying these drive voltages (30V in this case) are the conductive wires VDD2 and VSS2. These are the wiring 11B and the wiring 11C of the wiring board 4 that has been prepared. VSS2 is commonly connected to the common potential portion of the driver 105, and is normally grounded. In addition, the conducting wire COM that commonly connects the electrodes on the opposite side of the driver IC 5 of the piezoelectric deformation portion PZT is the wiring 11A described above, and is grounded. The conducting wire COM and the conducting wire VSS2 are connected by a conducting wire 65.

  An input signal is serially input to the driver IC 5 and converted into a parallel signal, and also converted into a drive signal having a voltage corresponding to the drive voltage input from the wiring 11C (VDD2). The drive signal is supplied from the output side connection terminal 5B of the driver IC 5 to the individual electrode in the actuator 3 through the wiring 12 and the individual electrode bump 12B, and the piezoelectric deformation portion (PZT) of each actuator is driven. A driver 105 that generates a drive signal to be supplied to each piezoelectric deformation portion (PZT) is provided independently for each piezoelectric deformation portion (PZT) (see FIG. 3), and supplies a drive voltage from the wiring 11C (VDD2). Then, a drive signal is output through each wiring 12. The internal electrode is grounded through the wiring 11A (COM).

  Further, the driver IC 5 is provided with a positional deviation detection bump 5C for inspecting the positional deviation between the electrode terminal portion 12A and the connection terminal 5B in the mounting region. As will be described later, this positional deviation detection bump 5C is used when a predetermined voltage is applied between each individual electrode and the internal electrode to polarize the piezoelectric layer 23 during polarization in the manufacturing process. This is the connection terminal itself of the driver IC 5 connected corresponding to the wiring 11B (VSS2). That is, the bump 5C is a connection terminal connected to the wiring 11B (VSS2) used when polarizing the piezoelectric layer 23 via a circuit in the driver IC 5.

  The wiring 11A (COM) is formed by branching an electrode terminal portion 11Aba (specific electrode terminal portion) as an inspection portion at a position aligned with the plurality of electrode terminal portions 12A in the mounting region of the driver IC 5 (electronic component). Has been.

  The inspection portion 11Aba includes a branch portion 11Abb that protrudes and branches from the wiring 11A in the direction in which the electrode terminal portions 12A are arranged, and a narrow portion 11Abc that is connected to the branch portion 11Abb and extends in the direction in which the electrode terminal portions 12A are arranged. (Second portion) and an extension portion 11Abd (first portion) connected to the tip of the narrow portion 11Abc and extending in a direction perpendicular to the direction in which the electrode terminal portions 12A are arranged. Therefore, the branch portion 11Abb and the extension portion 11Abd are provided on both sides of the bump 5C for detecting the positional deviation. Further, three portions obtained by adding a narrow portion 11Abc to these portions 11Abb and 11Abd surround the bump 5C for detecting the positional deviation. Further, the distance between the branch portion 11Abb and the extension portion 11Abd is smaller than the distance (arrangement pitch) between the other adjacent electrode terminal portions 12A and 12A.

  This inspection part 11Aba is used for inspecting a positional shift that induces a potential short circuit between the electrode terminal part 12A of each wiring 12 and each output side connection terminal 5B of the driver IC 5. That is, whether or not the bump 5C is in contact with the inspection portion 11Aba can be determined based on whether or not the electrode terminal portion 11Aa (wiring 11A) and the electrode terminal portion 11Ba (wiring 11B) are electrically connected. And since the space | interval of test | inspection part 11Aba and bump 5C is a space | interval smaller than the space | interval of other adjacent electrode terminal parts 12A and 12A, the precision of position shift detection becomes high and bump 5C and test | inspection part 11Aba If they are in contact, it can be seen that the driver IC 5 is mounted on the wiring board 4 in a misaligned state that induces a potential short circuit.

  Further, the bump 5C is connected to the wiring VSS2, and the inspection unit 11Aba is connected to the wiring COM. However, these wirings VSS2 and COM are supplied with a voltage when the piezoelectric layer 23 is polarized. It is at a potential and is grounded. Therefore, during normal use, the bump 5C and the inspection unit 11Aab are at the same potential, and even if the bump 5C and the inspection unit 11Aab are short-circuited due to changes over time, the short-circuit does not affect the operation of the inkjet head 1.

  By using a connection inspection method using such a configuration, it is possible to detect a positional shift that induces a potential short circuit that was difficult to detect by conventional visual inspection, and therefore, it is possible to detect a positional shift with higher accuracy, and Since it is only necessary to detect the conduction state using the original wiring and terminals, it is simple and has good productivity.

  Next, the polarization process related to the bump 5C will be described with reference to FIG.

  In the manufacturing process of the inkjet head 1, first, the actuator unit 3 in which a plurality of piezoelectric layers 23 (PZT) are laminated and fired on the flow path unit 2 in which a plurality of plates are laminated and bonded together is separately prepared in advance. After the bonding or bonding, the top surface individual electrode 22 and the surface internal electrode 24 of the actuator unit 3 and the individual electrode bump 12B and the internal electrode bump 11AA of the flexible wiring board 4 are electrically connected using a conductive brazing material. Connect to.

  Then, each piezoelectric deformation part (PZT) of the actuator unit 3 is polarized.

  The polarization device 101 used in this polarization step includes a circuit 102 that generates a part of the polarization voltage, a power supply 103 that is equivalent to the power supply that performs the above-described discharge operation to generate the remaining part of the polarization voltage, and an enable signal. And a signal circuit 104 for generating a signal such as a reset signal. The power supply 103 and the signal generation circuit 104 are the same as those known, for example, disclosed in Japanese Patent Application Laid-Open No. 2002-160372, which are provided in the main body of the recording apparatus for performing the ejection operation, and will not be described in detail.

  The circuits 104 and 102 and the power source 103 are connected to the terminal portions of the wirings 11A to 11D formed on the flexible wiring board 4. The circuit 102 includes a wiring COM (wiring 11A) connected to the common electrode (ground potential) below the piezoelectric layer 23 and a wiring connected to each driver 105 of the driver IC 5 connected to each individual electrode 22 above the piezoelectric layer 23. This is a circuit for applying a polarization voltage to VSS2 (wiring 11B). Therefore, the circuit 102 includes a negative power supply −VCC2, switches SW1 and SW2, and a resistor R2. A power supply 103 equivalent to the power supply for performing the above-described ejection operation is connected between the wiring VDD1 and the wiring VSS1 and between the wiring VDD2 (wiring 11C) and the wiring VSS2. In addition, in the state where the wiring COM and the wiring VSS2 are not connected by the wiring 65, the polarization of each piezoelectric deformation portion is performed.

  Next, detailed processing of this polarization will be described with reference to FIGS. When polarization is performed, the switch SW1 is set to the G side and the switch SW2 is set to the G side (ground side). In other words, the negative voltage −VCC2 is not connected to the conductor COM, and in this state, the reset signal of the shift register 111 and the D flip-flop 112 is set to the H level, and all the data of the shift register 111 and the D flip-flop 112 are set. Is set to 0 with discharge. When the enable signal is raised from the L level to the H level, the output of the OR gate becomes the H level, and all the drivers 105 start energizing the piezoelectric deformation portion PZT. At this time, since the switches SW1 and SW2 are still on the G side, the voltage Vpzt applied to the piezoelectric deformation portion PZT is 30 V (the voltage drop due to the resistor R2 is ignored here). Since this is the same as the voltage applied to the piezoelectric deformation portion PZT during ejection, no polarization is performed.

  Slightly from this state, the switches SW1 and SW2 are set to the N side. Then, the voltage of the power source VCC2 (here, −20V) is applied, and the voltage across the piezoelectric deformation portion PZT becomes 50V in addition to the previous 30V. This voltage starts polarization. When the polarization is completed, the enable signal is set to L level. Since the output of the D flip-flop 112 is set to L level by the reset signal, when the enable signal becomes L level, the output of the OR gate also becomes L level. As a result, the driver 105 stops energization of the piezoelectric deformation portion PZT, and only the voltage 40V from the power supply VCC2 is applied to the piezoelectric deformation portion PZT. Then, after a predetermined time has elapsed from here, the switch SW2 is returned to the G side, and the voltage Vpzt of the piezoelectric deformation portion PZT becomes zero. When the polarization is completed in this way, the polarization device 101 is removed from the flexible wiring board 4, the wiring VSS2 and the wiring COM are connected by the wiring 65, and the inkjet head 1 is attached to the recording apparatus.

  According to such a manufacturing method, since the polarization is performed after the flexible wiring substrate 4 of the inkjet head 1 is joined, the polarization does not deteriorate. In addition, since the voltage used for the polarization is performed by lowering the potential of the electrode opposite to the driver IC 5 with respect to the power supply voltage for ejection, a high voltage is not applied to the driver IC 5, and therefore the driver IC 5 is polarized. It is prevented from breaking inside.

  When the polarization voltage -VDD2 is applied, since the output voltage V0 of the driver IC5 is the VDD2 voltage (30V), the current flows in the direction from the driver IC5 to the piezoelectric deformation portion PZT, and the polarization voltage -VDD2 Since the output voltage V0 of the driver IC5 is zero (0V) at the time of discharging, the current is directed so as to flow from the piezoelectric deformation portion PZT to the driver IC7.

  Therefore, since only the voltage in the range of 0 to VDD2 is applied to the output voltage V0 of the driver IC5, the possibility that the driver IC7 breaks down during polarization is further reduced.

  By the way, in the present invention, the above-described embodiment can be modified as follows.

  (i) As shown in FIG. 5, it is also possible to form the two first portions so as to be adjacent to the bump 5C for detecting displacement. That is, it can be set as the test | inspection part 13 which has 1st part 13A, 13A extended in the direction orthogonal to the direction where the several electrode terminal part 12a is located in a line. These first portions 13A and 13A are both connected to the wiring 11B by a wiring (not shown). In this case, the first portions 13A and 13A are provided on both sides of the position deviation detection bump 5C, but it is also possible to provide the first portions 13A and 13A only on one side where the position deviation is likely to occur.

  Further, as shown in FIG. 6, in addition to the first portions 13A and 13A, a second portion extending in the direction in which the plurality of electrode terminal portions are arranged and connecting the end portions of the first portions 13A and 13A. It can also be set as inspection part 13 'which has two 13B and 13B and surrounds the circumference of bump 5C. Note that, as in the case shown in FIG. 2, only one second portion 13B may be provided on the side where misalignment is likely to occur.

  (ii) As shown in FIG. 7, bumps 5C and 5C for detecting misalignment are provided near the ends in the direction in which the plurality of electrode terminal portions 12a are arranged, on both the left and right sides, and the wiring 11A is provided outside them. The inspection parts 14A and 14B having a rectangular shape in plan view connected to may be provided. In this way, it is possible to obtain the same effect as that provided on both sides of the position deviation detection bump 5C. The intervals between the bumps 5C and 5C and the inspection portions 14A and 14B are smaller than the intervals between the other adjacent electrode terminal portions 12A and 12A.

  (iii) For example, when an inspection signal (predetermined signal) is input from the electrode terminal portion 11Ba, the positional deviation is inspected by checking whether the setting signal is output from the electrode terminal portion 11Aa via the bump 5C. It is also possible. In this case, the input of the inspection signal may use other electrode terminal portions 11Ca and 11Da instead of the electrode terminal portion 11Ba.

  (iv) Each electrode terminal portion 11Aa. When the input side connection terminals of the driver IC 5 are connected to 11Ba, 11Ca, and 11Da, the inspection can be performed by inputting a predetermined signal to the driver IC 5 from the electrode terminal portions 11Ba, 11Ca, and 11Da. That is, the positional deviation can be inspected by checking whether or not the setting signal is output from the electrode terminal portion 11Aa via the bump 5C for detecting the positional deviation by inputting the predetermined signal.

(v) In the case of the above-described embodiments (iii) and (iv), the electrode terminal portion 11B for inputting the inspection signal.
It is preferable that a and the electrode terminal portion 11Aa are configured so that no current flows to the inspection terminal portion by, for example, setting them to high impedance or the same potential state when driving the electronic component. With such a configuration, even if a short circuit occurs due to changes over time, the driving operation of the electronic component is not affected.

  (vi) The electronic component is not limited to the driver IC (driving circuit unit) of the inkjet head, and the present invention can be applied to any electronic component that is mounted on a wiring board.

It is a perspective view which shows the state by which the flexible wiring board was joined to the upper surface of the inkjet head to which this invention is applied. It is explanatory drawing of the connection state of a wiring board and driver IC (electronic component). It is a circuit explaining a polarization process. It is explanatory drawing of a polarization process. It is a figure which shows another embodiment about the relationship between the bump for position shift detection, and a test | inspection part. It is a figure which shows another embodiment about the said relationship. It is a figure which shows other embodiment about the said relationship. (A)-(c) is explanatory drawing of a prior art example, respectively.

Explanation of symbols

1 Inkjet head 4 Wiring board 5 Driver IC (Drive circuit unit)
5Aa, 5Ab, 5B Connection terminal 5C Bump for detecting misalignment 11A, 11B, 11C, 11D Wiring 11Aa, 11Ba, 11Ca, 11Da Electrode terminal 11Aba, 13, 13 ′ Inspection part 12 Wiring 12A, 12B Electrode terminal 13A First 1 part 13B 2nd part 14A, 14B Inspection part

Claims (12)

The wiring board has a structure in which a plurality of wirings are formed and each of the wirings is installed with a plurality of electrode terminal portions arranged side by side, and each electrode terminal portion and each connection terminal of an electronic component correspond to each other electrically. A connection structure for electronic components connected to
In the mounting region, the electronic component is provided with a positional deviation detection bump for inspecting the positional deviation between the electrode terminal portion and the connection terminal,
Among the electrode terminal portions, a specific electrode terminal portion is located at a position where the distance from the bump for detecting displacement is smaller than the distance between other adjacent electrode terminal portions. An electronic component connection structure comprising an inspection section for inspecting misalignment.   The electronic component connection structure according to claim 1, wherein the inspection unit includes a first portion extending in a direction orthogonal to a direction in which the plurality of electrode terminal portions are arranged.   3. The electronic component connection structure according to claim 2, wherein the first part is provided on both sides of the bump for detecting misalignment.   The electronic component connection structure according to claim 1, wherein the inspection unit includes a second portion extending in a direction in which the plurality of electrode terminal portions are arranged.   The electronic component connection structure according to claim 4, wherein the second portion is provided on both sides of the bump for detecting the displacement. The electronic component is a drive circuit unit that generates a drive signal to be supplied to the inkjet head,
The inkjet head is provided with individual electrodes and piezoelectric layers corresponding to the plurality of pressure chambers, while a common internal electrode is provided for the plurality of pressure chambers with the piezoelectric layer interposed therebetween. The drive signal is supplied to the internal electrode through the wiring of the wiring board,
The wiring of the specific electrode terminal portion is a wiring connected to the drive circuit unit, and a wiring for supplying a test signal,
In the mounting region of the drive circuit unit, the positional deviation detection bump is provided so that the distance from the specific electrode terminal part is smaller than the distance from other adjacent electrode terminal parts. The connection structure for an electronic component according to any one of claims 1 to 5. The electronic component is a drive circuit unit that generates a drive signal to be supplied to the inkjet head,
The inkjet head is provided with individual electrodes and piezoelectric layers corresponding to the plurality of pressure chambers, while a common internal electrode is provided for the plurality of pressure chambers with the piezoelectric layer interposed therebetween. The drive signal is supplied to the internal electrode through the wiring of the wiring board,
The wiring of the specific electrode terminal portion is connected to the internal electrode,
In the mounting region of the drive circuit unit, the position deviation detection bumps are provided so that the interval between the wiring of the specific electrode terminal portion is smaller than the interval between other adjacent electrode terminal portions,
The bump for detecting misalignment is a connection terminal of an electronic component that is connected in correspondence with the wiring used when a predetermined voltage is applied between the internal electrode and the piezoelectric layer is polarized in the manufacturing process. The electronic component connection structure according to claim 1, wherein the electronic component connection structure is provided.   The electronic component connection structure according to claim 1, wherein the specific electrode terminal portion is arranged near an end in a direction in which the connection terminals are arranged. A plurality of wirings are formed on the wiring board, and each wiring has a configuration in which a plurality of electrode terminal portions are arranged side by side. When each connection terminal of an electronic component is connected to each electrode terminal portion of the wiring board, An electronic component connection inspection method for inspecting their connection state,
In the mounting region, the electronic component is provided with a positional deviation detection bump for inspecting the positional deviation between the electrode terminal portion and the connection terminal,
Among the electrode terminal portions, a specific electrode terminal portion is arranged next to the bump for detecting the displacement,
When each connection terminal of the electronic component is connected to each electrode terminal portion of the wiring board, the conductive state between the specific electrode terminal portion and the adjacent electrode terminal portion through the bump for detecting misalignment A connection inspection method for electronic parts, wherein the connection state is inspected based on the presence or absence of the electronic component. The wiring board has a configuration in which a plurality of wirings are formed, and each wiring is arranged side by side with a plurality of electrode terminal portions, and when each connection terminal of an electronic component is connected to each electrode terminal portion of the wiring board. In addition, there is an electronic component connection inspection method for inspecting their connection state,
In the mounting region, the electronic component is provided with a positional deviation detection bump for inspecting the positional deviation between the electrode terminal portion and the connection terminal,
Among the electrode terminal portions, a specific electrode terminal portion is arranged next to the bump for detecting the displacement,
When each connection terminal of the electronic component is connected to each electrode terminal portion of the wiring board, the specific electrode terminal via the position deviation detection bump by a predetermined signal input to the electronic component A connection inspection method for an electronic component, wherein the connection state is inspected based on whether or not a setting signal is output from the unit. The electronic component is a drive circuit unit that generates a drive signal to be supplied to the inkjet head,
The inkjet head is provided with individual electrodes and piezoelectric layers corresponding to the plurality of pressure chambers, while a common internal electrode is provided for the plurality of pressure chambers with the piezoelectric layer interposed therebetween. The drive signal is supplied to the internal electrode through the wiring of the wiring board,
The wiring of the specific electrode terminal portion is a wiring connected to the drive circuit unit, and a wiring for supplying a test signal,
In the mounting region of the drive circuit unit, the positional deviation detection bump is provided so that the distance from the specific electrode terminal part is smaller than the distance from other adjacent electrode terminal parts. The connection inspection method for electronic parts according to claim 9 or 10. The electronic component is a drive circuit unit that generates a drive signal to be supplied to the inkjet head,
The inkjet head is provided with individual electrodes and piezoelectric layers corresponding to the plurality of pressure chambers, while a common internal electrode is provided for the plurality of pressure chambers with the piezoelectric layer interposed therebetween. The drive signal is supplied to the internal electrode through the wiring of the wiring board,
The wiring of the specific electrode terminal portion is connected to the internal electrode, and in the mounting region of the drive circuit unit, the distance between the wiring of the specific electrode terminal portion and another adjacent electrode terminal portion The position deviation detection bump is provided so as to be smaller than the interval of
The positional deviation detection bump is an electronic component that is connected in accordance with the wiring used when the piezoelectric layer is polarized by applying a predetermined voltage between the internal electrode and the internal electrode during polarization in the manufacturing process. The connection inspection method for electronic parts according to claim 9, wherein the connection terminals are themselves.

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