JP2003195249A - Liquid crystal display element and inspection method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To simply and surely inspect misregistration of an IC chip by an electrical way in a COG type liquid crystal display element. <P>SOLUTION: Misregistration inspection patterns 30L, 30R countered to dummy bumps DB on the IC chip side are arranged on a chip mounting area MS of a terminal part. The misregistration inspection patterns 30L, 30R include respective reference reeds 32L, 32R connected with reference lands 31L, 31R corresponding to the dummy bumps DB, and X- and Y directional misregistration detection reads 33L-35L, 33L-33R arranged at predetermined intervals δ on the three sides of the reference lands 31L, 31R, the misregistration of the IC chip is inspected by applying a predetermined voltage to the reference reeds, and whether or not there is continuity between the reference reeds and each misregistration detection reed. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device and a method for inspecting the same, and more particularly to a technique for inspecting a displacement of an IC chip for driving a liquid crystal mounted on a terminal portion.

[0002]

2. Description of the Related Art An IC for driving a liquid crystal at a terminal portion of a liquid crystal panel
COG (chip on gla) with a chip
In the (ss) type liquid crystal display element, the quality of the IC chip mounted state (presence / absence of positional deviation) is determined by adding an actually used display signal and determining whether or not the appearance is normal.

In this case, although the initial connection state is good, the connection may become unstable in the long term.
The issue is how to determine long-term reliability. This phenomenon tends to occur particularly when an anisotropic conductive adhesive material in which conductive particles are mixed in a thermosetting adhesive resin is used as the connecting means.

That is, when using an anisotropic conductive adhesive,
The electrical connection between the IC chip and the terminal portion is made by conductive particles. However, if the number of the conductive particles connected due to the displacement of the IC chip is small, the connection is made even if the connection is established at the beginning of mounting. Is not perfect, so long-term reliability cannot be obtained.

[0005]

This problem is solved by knowing the amount of displacement of the IC chip. Therefore, an object of the present invention is to provide an inspection means capable of easily and accurately inspecting the displacement amount of an IC chip.

[0006]

In order to solve the above-mentioned problems, the present invention provides a liquid crystal panel having a terminal portion having a chip mounting region in which an electrode group including a lead electrode of a transparent electrode is assembled, and the above electrode. A liquid crystal driving IC chip having a connection electrode group corresponding to the group and at least two dummy bumps arranged on both sides of the connection electrode group, the IC chip being mounted in a chip mounting area of the terminal portion. In the liquid crystal display element, in the chip mounting area,
At least two first and second misregistration detection patterns for detecting misregistration of the IC chip with the dummy bump as a partner are provided, and the depth direction of the terminal portion is defined as the Y direction, and the direction orthogonal thereto is defined as the X direction. The first misregistration detection pattern includes a reference land that corresponds in position to the dummy bump, a reference lead that extends in the + X direction from the reference land and extends toward the edge of the terminal portion at a predetermined portion, and one end of the reference land. From the reference land to the −Y direction, and the other end is located at a position separated from the reference land by a predetermined distance in the −X direction. And a + Y-direction deviation detection lead having the other end directed toward the edge of the terminal portion, and one end arranged at a position separated from the reference land by a predetermined distance in the −Y direction. , The other end of which is directed toward the edge of the terminal portion in the −Y direction, and the second misregistration detection pattern is substantially the same as the first misregistration detection pattern with respect to the center line in the Y direction. In the second misregistration detection pattern, the reference lead is pulled out in the −X direction from the reference land, and the −
It is characterized in that the X-direction deviation detection lead becomes a + X-direction deviation detection lead.

According to this misregistration detection pattern, the reference lead is connected to a predetermined voltage source, and
Each of the X, + X direction deviation detection leads and the -Y, + Y direction deviation detection leads is connected to the voltage detection unit, and when no voltage of the voltage source is detected in any of the detection leads, it is determined as "no deviation", When the voltage of the voltage source is detected by at least one of the detection leads, it can be determined that there is a deviation, and such an inspection method is also included in the present invention.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view schematically showing an inspection scene of a liquid crystal display device in which a liquid crystal driving IC chip 20 is mounted on a terminal portion 11 of a liquid crystal panel 10, and FIG. 2 is an enlarged view of a chip mounting area of the terminal portion 11. FIG. 3 is a plan view showing one of the positional deviation inspection patterns 30L.
FIG.

First, referring to FIG. 2, a chip mounting area MS in which a portion surrounded by a dotted line is provided in the terminal portion 11
In this embodiment, the lead-out electrode groups 12a to 12c of transparent electrodes are gathered on the three sides of the chip mounting area MS, and the IC chip 20 is placed on the remaining one side on the edge 11a side.
A signal input electrode group 12d corresponding to is formed. Both are made of ITO patterns.

Although not shown, on the IC chip 20 side, in addition to the connection electrode group corresponding to each of the electrode groups 12a to 12d, a dummy bump having no electrical role is provided. FIG. 2 shows the positions of the dummy bumps when the IC chip 20 is mounted in the chip mounting area MS, with reference part number DB.
In the following description, for convenience, the dummy pump itself will be referred to as DB.
May be.

Usually, the dummy bump DB is provided on both sides of the connection electrode group. In this embodiment, the IC chip 2 is provided.
It is placed at the four corners of the mounting surface side of. The present invention is provided with two positional deviation detection patterns 30L and 30R for detecting positional deviation of the IC chip 20 with two dummy bump DBs among them as opponents.

In this embodiment, a pair of left and right dummy bumps D on the lower side of the chip mounting area MS in FIG.
With B and DB as the displacement detection targets, the detection pattern 30
L and 30R are provided.

Since the positional displacement of the IC chip 2 is accompanied by directivity, referring to FIG. 1, in the present invention, the depth direction of the terminal portion 11 is the Y direction and the direction orthogonal thereto is the X direction.
Direction, and further in the Y direction, the edge 1 of the terminal portion 11
The direction toward the 1a side is defined as "-" and the opposite direction is defined as "+", and the X direction is defined as "-" in the left direction and "+" in the right direction in FIGS.

Further, in this embodiment, the two misregistration detection patterns 30L and 30R are substantially symmetrical with respect to the center line CL in the Y direction of FIG. With respect to the positional deviation detection pattern 30R on the right side, the symbol L at the end of the reference numeral is replaced with R, and the description thereof will be briefly described.

Referring to FIG. 3, the left side displacement detection pattern 30L includes a reference land 31L that corresponds in position to the dummy bump DB. The reference land 31L preferably has the same shape and size as the dummy bump DB. In this embodiment, since the dummy bump DB is quadrangular, the reference land 31L is also quadrangular.

A reference lead 32L is drawn out in the + X direction from the right side of the reference land 31L, and the reference lead 32L is bent at a predetermined portion at a substantially right angle toward the end edge 11a side of the terminal portion 11. .

A −X direction shift detection lead 33L is provided on the left side of the reference land 31L. One end of the −X direction shift detection lead 33L has a reference land 31L.
Is arranged with a distance δ from the left side of the above, and the other end side is bent at a substantially right angle and wired so as to reach the end edge 11a of the terminal portion 11. The distance (interval) δ is I
This is a limit value of the amount of deviation of the C chip 20 that can be tolerated, and may be set arbitrarily.

A + Y direction shift detection lead 34L is provided on the upper side of the reference land 31L. The + Y direction deviation detection lead 34L also has one end at the reference land 31L.
Is arranged at a distance δ from the upper side, and the other end side is bent at a substantially right angle and wired so as to reach the end edge 11a of the terminal portion 11.

On the lower side of the reference land 31L, a −Y direction shift detection lead 35L is provided. This −Y direction deviation detection lead 35L also has one end at the reference land 31L.
It is arranged with a distance δ with respect to the lower side, and the other end side is wired so as to extend straight and reach the end edge 11a of the terminal portion 11.

Since the right side displacement detection pattern 30R is symmetrical with the left side displacement detection pattern 30L, the reference lead 32R is pulled out from the reference land 31R in the -X direction, and is located on the right side of the reference lead 32R. The + X direction deviation detection lead 33R corresponding to the −X direction deviation detection lead 33L is arranged.

The + Y direction deviation detection lead 34R and the -Y direction deviation detection lead 35R are the same as the + Y direction deviation detection lead 34L and the -Y direction deviation detection lead 3, respectively.
It has a symmetrical relationship with 5L.

After the IC chip 20 is mounted on the terminal portion 11, the displacement inspection is performed by the displacement detection patterns 30L and 30R. An example of this inspection method will be described with reference to FIG. As the inspection device, a measuring device 41 having a predetermined voltage source and a voltage detection circuit, an inspection jig substrate 42, and a connecting flexible substrate 43 are used.

The inspection jig substrate 42 is like a relay substrate interposed between the measuring device 41 and the connecting flexible substrate 43, and is provided with a shift detection display circuit 42a. Although not shown in detail, the connection flexible substrate 43 has a positional deviation detection pattern 30L,
The measurement signal line for 30R is formed.

This measurement signal line has a reference lead 32.
A voltage input line for L (32R), −, + X direction deviation detection lead 33L (33R), + Y direction deviation detection lead 34L (34R) and −Y direction deviation detection lead 3
A voltage detection line connected to each of 5L (35R) is included.

The connecting flexible board 43 is connected to each of the displacement detection patterns 30L and 30R, a predetermined voltage is applied from the voltage source of the measuring instrument 41 to the reference leads 32L and 32R, and each detection lead is detected by the voltage detection circuit. 33L-35L;
Monitor the output of 33R-35R.

When the IC chip 20 is displaced by a distance δ or more, the dummy bump DB connects the reference land and the detection lead. When any of the detection leads 33L to 35L; 33R to 35R is off, the positional deviation is determined to be within the permissible range, with the case where the voltage is detected in the detection lead being turned on and the case where the voltage is not detected being turned off.

In the position shift detection pattern 30L on the left side, when the −X direction shift detection lead 33L is on, it is determined as “position shift in the left direction”. When the + Y-direction deviation detection lead 34L is turned on, “upward (the opposite edge 11a
Side) misalignment ”. When the −Y-direction deviation detection lead 35L is turned on, it is determined as “a positional deviation in the downward direction (on the side of the edge 11a)”. Note that, for example, when both the −X direction deviation detection lead 33L and the −Y direction deviation detection lead 35L are turned on, it is determined as “positional deviation in the diagonally lower left direction” in FIG.

In the position shift detection pattern 30R on the right side, when the + X direction shift detection lead 33R is on, it is determined to be "position shift in the right direction". The determination of the + Y direction deviation detection lead 34R and the −Y direction deviation detection lead 35R is the same as that of the left side deviation detection pattern 30L.

In the above embodiment, the X direction and the Y direction.
Although the allowable deviation amount δ in the direction is the same, the allowable deviation amount in the X direction and the allowable deviation amount in the Y direction may have different values.
For example, in FIG. 2, the electrode group is the electrode group 12a in the Y direction,
In the case of only 12d, the allowable deviation amount in the Y direction may be a rough value. Similarly, when the electrode group is only the electrode groups 12b and 12c in the X direction, the allowable deviation amount in the X direction may be a rough value.

Further, when the dummy bumps of the IC chip are circular, it is preferable that the reference lands are also circular accordingly and one end side of each detection lead is arcuate with the same curvature.

[0031]

As described above, according to the present invention,
In the COG type liquid crystal display element in which the IC chip is mounted on the terminal portion, the displacement inspection of the IC chip can be electrically and simply performed. In particular, when an anisotropic conductive adhesive is used for connecting IC chips, it is possible to determine the long-term reliability of the connected state.

[Brief description of drawings]

FIG. 1 is a perspective view schematically showing an inspection scene of a liquid crystal display element according to the present invention.

FIG. 2 is an enlarged view showing a chip mounting area set in a terminal portion of the liquid crystal display element.

FIG. 3 is an enlarged view of a positional deviation inspection pattern provided in the chip mounting area.

[Explanation of symbols]

10 LCD panel 11 terminal 12a to 12d electrode group 20 IC chip 30L, 30R misalignment inspection pattern 31L, 31R Standard land 32L, 32R Reference lead 33L, 33R −, + X direction deviation detection lead 34L, 34R + Y direction deviation detection lead 35L, 35R-Y direction deviation detection lead DB dummy bump MS chip mounting area

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) G09F 9/30 330 G09F 9/30 330Z 9/35 9/35 F term (reference) 2F063 AA03 AA50 BA26 BB02 FA08 FA16 2H088 FA11 MA20 2H092 GA33 GA40 GA49 GA50 GA52 GA60 NA25 NA30 5C094 AA31 AA47 AA48 BA43 DA09 DB05 EA03 FA01 5G435 AA06 AA14 BB12 EE12 EE34 EE37 EE42

Claims (2)

[Claims] 1. A liquid crystal panel having a terminal portion having a chip mounting area in which an electrode group including a lead electrode of a transparent electrode is assembled, a connection electrode group corresponding to the electrode group, and arranged on both sides of the connection electrode group. And an IC chip for driving a liquid crystal having at least two dummy bumps,
In a liquid crystal display element in which a C chip is mounted in a chip mounting area of the terminal portion, in the chip mounting area, at least a first and a second detecting a positional deviation of the IC chip with the dummy bump as a counterpart. One positional deviation detection pattern is provided, and the first positional deviation detection pattern is a reference land that corresponds in position to the dummy bumps, with the depth direction of the terminal portion as the Y direction and the direction orthogonal thereto as the X direction. From the same standard land +
A reference lead extending in the X direction and directed to the edge side of the terminal portion at a predetermined portion, one end arranged at a position separated from the reference land by a predetermined distance in the −X direction, and the other end facing the edge side of the terminal portion. The −X-direction deviation detection lead, one end of which is arranged at a position separated from the reference land by a predetermined distance in the + Y direction, the other end of which is directed toward the edge of the terminal portion in the + Y direction, and one end of which is the reference land. Is provided at a position separated by a predetermined distance in the -Y direction, and the other end is provided in the -Y direction deviation detection lead directed toward the edge side of the terminal portion, and the second misregistration detection pattern has a center in the Y direction. The line is substantially left-right symmetric with respect to the first misregistration detection pattern, and in the second misregistration detection pattern, the reference lead is pulled out in the -X direction from the reference land, and is displaced in the -X direction. A liquid crystal display element, wherein the detection lead serves as a shift detection lead in the + X direction. 2. A method for inspecting a liquid crystal display device according to claim 1, wherein the reference lead in each of the misregistration detection patterns is connected to a predetermined voltage source, and the misregistration detection leads in the −X and + X directions are provided. Each of the −Y and + Y direction deviation detection leads is connected to a voltage detection unit, and when the voltage of the voltage source is not detected in any of the detection leads, it is determined as “within an allowable deviation”, and at least one of the detection leads is detected. When the voltage of the above voltage source is detected,
A method for inspecting a liquid crystal display element, which comprises: