JP6368746B2 - Thermal head - Google Patents

Thermal head Download PDF

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Publication number
JP6368746B2
JP6368746B2 JP2016155706A JP2016155706A JP6368746B2 JP 6368746 B2 JP6368746 B2 JP 6368746B2 JP 2016155706 A JP2016155706 A JP 2016155706A JP 2016155706 A JP2016155706 A JP 2016155706A JP 6368746 B2 JP6368746 B2 JP 6368746B2
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wiring
thermal head
substrate
thickness
layer
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JP2017001396A (en
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真澄 奥村
真澄 奥村
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ローム株式会社
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Description

  The present invention relates to a thermal head.
  FIG. 22 shows an example of a conventional thermal head (see, for example, Patent Document 1). A thermal head 90 shown in the figure includes a substrate 91, a glaze layer 92, a heating resistor layer 93, an electrode layer 94, a drive IC 95, a wire 96, and a protective resin 97. The thermal head 90 is for printing on a print medium 98 supplied between the thermal head 90 and a platen roller (not shown) disposed opposite thereto. For the print medium 98, for example, thermal paper is used. The electrode layer 94 is connected to an external power supply device so that a part of the heating resistor layer 93 generates heat. The drive IC 95 and the electrode layer 94 are connected by a wire 96. The protective resin 97 covers and protects the driving IC 95 and the wire 96.
  In such a thermal head 90, the print medium 98 is pressed against the heating resistor layer 93 by a platen roller (not shown). When the printing medium 98 moved by the platen roller comes into contact with the protective resin 97, the printing medium 98 may be damaged. In order to prevent such a situation, it is required to form the protective resin 97 thinner. However, in the thermal head 90, it is necessary to cover the wire 96 with the protective resin 97 in order to ensure the reliability of the apparatus, and it is difficult to reduce the thickness of the protective resin 97.
JP 2009-154359 A
  The present invention has been conceived under the circumstances described above, and an object thereof is to provide a thermal head that can be thinned.
  The thermal head provided by the first aspect of the present invention is provided with a substrate, a heating resistor provided on one side in the thickness direction of the substrate, provided on one side in the thickness direction of the substrate, and A thermal head comprising: an electrode layer electrically connected to the heating resistor; and a control means provided on one side in the thickness direction of the substrate, wherein the electrode layer includes a common electrode wiring and the common electrode A plurality of individual electrode wirings that are separated from each other and separated from each other, and each of the individual electrode wirings has a connection portion that overlaps the control means when viewed in the thickness direction of the substrate.
  In a preferred embodiment of the present invention, the control means includes a bottom surface opposed to one surface of the substrate in the thickness direction, and a plurality of pads provided on the bottom surface. One of the pads is electrically connected to one of the plurality of connection portions.
  In a preferred embodiment of the present invention, the plurality of connecting portions are arranged along a first direction orthogonal to the thickness direction, and the plurality of pads are arranged along the first direction. A plurality of first pads, and any one of the plurality of first pads is electrically connected to any one of the plurality of connection portions.
In a preferred embodiment of the present invention, the plurality of first pads are arranged so as to overlap each other in the first direction view.
  In a preferred embodiment of the present invention, each connection portion overlaps one of the plurality of first pads in the thickness direction view.
  In a preferred embodiment of the present invention, there are provided a plurality of conductive members sandwiched between the control means and the substrate in the thickness direction and spaced apart from each other in the thickness direction view. The conductive member includes a first conductive member that contacts both one of the plurality of first pads and one of the plurality of connection portions.
  The thermal head provided by the second aspect of the present invention is provided with a substrate, a heating resistor provided on one side in the thickness direction of the substrate, and provided on one side in the thickness direction of the substrate, and A thermal head comprising: an electrode layer electrically connected to the heating resistor; and a control means provided on one side in the thickness direction of the substrate, wherein the electrode layer includes a common electrode wiring and the common electrode A plurality of individual electrode wirings separated from each other and separated from each other, and the control means is provided on the bottom surface facing the one side surface in the thickness direction of the substrate, and on the bottom surface A plurality of pads, and each of the plurality of pads includes a plurality of first pads arranged along a first direction orthogonal to the thickness direction. At least Either it is conducted to any of the plurality of individual electrode wires.
  In a preferred embodiment of the present invention, each of the individual electrode wirings has a connection portion that overlaps one of the plurality of first pads when viewed in the thickness direction.
  In a preferred embodiment of the present invention, there are provided a plurality of conductive members sandwiched between the control means and the substrate in the thickness direction and spaced apart from each other in the thickness direction view. The member includes a first conductive member connected to at least one of the plurality of first pads when viewed in the thickness direction, and the first conductive member is the first conductive member when viewed in the thickness direction. The conductive member is in contact with the connecting portion overlapping the first pad to which the conductive member is connected.
  In a preferred embodiment of the present invention, the plurality of first pads are arranged so as to overlap each other in the first direction view.
  In a preferred embodiment of the present invention, as viewed in the thickness direction, the first conductive member is entirely formed so as to overlap the first pad to which the first conductive member is connected. .
  In a preferred embodiment of the present invention, the electrode layer includes a wiring group spaced from the common electrode wiring and the plurality of individual electrode wirings.
  In a preferred embodiment of the present invention, the wiring group is formed so as to overlap the control means in the thickness direction view.
  In a preferred embodiment of the present invention, the plurality of individual electrode wirings are arranged along the first direction, and the heating resistor is formed in a strip shape extending long along the first direction. The plurality of pads are formed at positions farther from the heating resistor in the thickness direction and in a second direction orthogonal to the first direction than any of the plurality of first pads. The wiring group includes a plurality of second pads, and the wiring group includes a first wiring pattern that is electrically connected to any of the plurality of second pads.
  In a preferred embodiment of the present invention, the plurality of conductive members include a second conductive member in contact with both of the plurality of second pads and the first wiring pattern.
  In a preferred embodiment of the present invention, the plurality of second pads are arranged along the first direction.
  In a preferred embodiment of the present invention, the plurality of second pads are arranged so as to overlap each other when viewed in the first direction.
In a preferred embodiment of the present invention, the plurality of pads include a plurality of third pads provided at positions that do not overlap the first pad in the second direction view,
The wiring group includes a second wiring pattern that is electrically connected to any of the plurality of third pads and that is separated from the first wiring pattern.
  In a preferred embodiment of the present invention, the plurality of conductive members include a third conductive member in contact with both of the plurality of third pads and the second wiring pattern.
  In a preferred embodiment of the present invention, the electrode layer has an isolated portion separated from any of the common electrode wiring, the plurality of individual electrode wirings, and the wiring group in the thickness direction view. The plurality of pads include a fourth pad connected to the isolated portion.
  In a preferred embodiment of the present invention, the plurality of conductive members include a fourth conductive member in contact with both the isolated portion and the fourth pad.
  In a preferred embodiment of the present invention, the plurality of conductive members are gold bumps.
  In a preferred embodiment of the present invention, the electrode layer is a gold layer.
  In a preferred embodiment of the present invention, the connection portion is a first layer, a first layer that is laminated on the opposite side of the substrate from the first layer, and has a rougher surface than the first layer. It consists of two layers.
  In a preferred embodiment of the present invention, the second layer contains gold and glass.
  In a preferred embodiment of the present invention, the first layer contains an organic gold compound.
  In a preferred embodiment of the present invention, the second layer is thicker than the first layer.
  In a preferred embodiment of the present invention, each individual electrode wiring includes a normal width portion having a first width in a first direction orthogonal to the thickness direction, and a first width in the first direction. A wide portion having a long second width, and each of the wide portions is formed at a position that does not overlap with the control means when viewed in the thickness direction of the substrate.
  In a preferred embodiment of the present invention, the plurality of individual electrode wirings include a first individual electrode wiring and a second portion in which the position of the wide portion is different from the first individual electrode wiring in the first direction view. Individual electrode wiring.
  In a preferred embodiment of the present invention, at least a part is provided with a sealing resin sandwiched between the substrate and the control means in the thickness direction of the substrate.
  In a preferred embodiment of the present invention, the sealing resin is formed so as to expose a part of the control means.
  In a preferred embodiment of the present invention, the control means has a side surface standing in the thickness direction of the substrate, the sealing resin covers the substrate side portion of the side surface, and the side surface Of these, the opposite side of the substrate is exposed.
  In a preferred embodiment of the present invention, at least a part is provided with a sealing resin sandwiched between the substrate and the control means in the thickness direction of the substrate. The part further penetrates between the second layer of the connection part and the pad.
  In a preferred embodiment of the present invention, the control means has a plurality of drive ICs separated from each other.
  The thermal head manufacturing method provided by the third aspect of the present invention includes a step of forming a heating resistor on one side in the thickness direction of the substrate, and a conduction with the heating resistor on one side in the thickness direction of the substrate. A method of manufacturing a thermal head comprising: a step of forming an electrode layer to be formed; and a step of fixing a control means on one side in the thickness direction of the substrate, wherein a plurality of conductive members are connected to the control means. And the step of forming the electrode layer includes forming a common electrode wiring and a plurality of individual electrode wirings separated from the common electrode wiring and separated from each other, and fixing the control means The step includes contacting a first conductive member that is one of the plurality of conductive members with a first individual electrode wiring that is one of the plurality of individual electrode wirings, and the first A step of bonding the conductive member and the first individual electrode wires are provided.
In a preferred embodiment of the present invention, the control means includes a plurality of pads,
The step of connecting the plurality of conductive members to the control means includes a step of forming gold plating so as to cover the plurality of pads.
  In a preferred embodiment of the present invention, in the step of joining the first conductive member and the first individual electrode wiring, ultrasonic vibration is applied to the control means.
  In a preferred embodiment of the present invention, the substrate has an elongated shape, the control means has an elongated shape whose longitudinal direction coincides with the longitudinal direction of the substrate, and the plurality of individual electrode wirings include a plurality of individual electrodes. A connecting portion to be joined to the conductive member, wherein the connecting portions of the plurality of individual electrode wirings are arranged in a line along a longitudinal direction of the substrate, and the first conductive member and the first conductive member In the step of joining one individual electrode wiring, ultrasonic vibration whose longitudinal direction is the vibration direction is applied to the control means.
  In a preferred embodiment of the present invention, the dimension of the first conductive member in the longitudinal direction of the substrate is smaller than the dimension of the connecting portion in the longitudinal direction of the substrate.
  In a preferred embodiment of the present invention, the connection portion is a first layer, a first layer that is laminated on the opposite side of the substrate from the first layer, and has a rougher surface than the first layer. It consists of two layers.
  In a preferred embodiment of the present invention, the second layer contains gold and glass.
  In a preferred embodiment of the present invention, the first layer contains an organic gold compound.
  In a preferred embodiment of the present invention, the second layer is thicker than the first layer.
  In a preferred embodiment of the present invention, the method further includes a step of forming a sealing resin between the substrate and the control means.
  In a preferred embodiment of the present invention, in the step of forming the sealing resin, a liquid resin material is placed on an edge far from the heating resistor in a direction orthogonal to the thickness direction of the control means. Process.
  According to such a configuration, the control unit and the plurality of individual electrode wirings are connected at a position overlapping the control unit in the thickness direction view. In this case, the connection method is not based on wires. Therefore, in the thermal head according to the present invention, there is no wire between the control means and the individual electrode wiring, and the protective resin is formed thin when forming the protective resin to protect the control means. Is possible. Therefore, according to the thermal head based on this invention, thickness reduction of a protective resin can be achieved and the contact malfunction of a platen roller and a printing medium as described in the conventional description can be eliminated.
  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.
It is a top view which shows the thermal head based on 1st Embodiment of this invention. It is sectional drawing which follows the II-II line | wire of FIG. It is a principal part enlarged plan view of the thermal head shown in FIG. It is a bottom view which shows an example of the drive IC shown in FIG. It is a figure which expands and shows the partial area | region of FIG. It is sectional drawing which follows the VI-VI line of FIG. It is a figure which expands and shows the partial area | region of FIG. It is sectional drawing which follows the VIII-VIII line of FIG. It is a principal part enlarged view of FIG. It is a figure for demonstrating the planar view shape of the electrically-conductive member shown in FIG. It is a figure for demonstrating an example of the manufacturing method of the thermal head shown in FIG. FIG. 3 is a diagram showing a process of forming a plurality of conductive members on a drive IC in the manufacturing process of the thermal head shown in FIG. 1. It is a figure which shows the state which installed drive IC in the manufacture process of the thermal head shown in FIG. It is a figure which shows the process of forming sealing resin in the manufacture process of the thermal head shown in FIG. It is a figure which shows the state in which sealing resin was formed in the manufacture process of the thermal head shown in FIG. It is a principal part expanded sectional view which shows the thermal head based on 2nd Embodiment of this invention. It is a principal part enlarged plan view which shows the individual electrode wiring of the thermal head shown in FIG. FIG. 17 is an essential part enlarged cross-sectional view showing an example of a method for manufacturing the thermal head shown in FIG. 16. FIG. 17 is an enlarged cross-sectional view of a main part showing a step of joining a conductive member and individual electrode wiring in an example of the manufacturing method of the thermal head shown in FIG. It is a principal part expanded sectional view which shows the thermal head based on 3rd Embodiment of this invention. It is a principal part expanded sectional view of the thermal head shown in FIG. It is sectional drawing which shows an example of the conventional thermal head.
  Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.
  1 to 10 show a thermal head according to the present invention. FIG. 1 is a plan view of a thermal head according to the present embodiment, and FIG. 2 is a sectional view thereof. 3 to 10 show further details of the thermal head A1. A thermal head A1 shown in FIGS. 1 and 2 includes a substrate 1, a glaze layer 2, an electrode layer 3, a heating resistor 4, a control means 5, a protective resin 6, and a protective layer 7. As shown in FIG. 2, the thermal head A <b> 1 is for performing printing on a printing medium 8 that is supplied between the thermal head A <b> 1 and a platen roller (not shown) arranged to face the thermal head A <b> 1. For the print medium 8, for example, thermal paper is used. In FIG. 1, the protective layer 7 is omitted.
  The control means 5 has three drive ICs 51, 52, 53 arranged along the x direction. In FIG. 1, these drive ICs 51, 52, and 53 are indicated by broken lines.
  The substrate 1 is a flat plate having a rectangular shape in plan view, and is made of, for example, alumina ceramic. The x direction shown in FIG. 1 is the longitudinal direction of the substrate 1, and the y direction is the short direction. Further, the z direction shown in FIG. 2 is the thickness direction of the substrate 1. The thickness of the substrate 1 is, for example, 1 mm. In the following description, the upper surface of the substrate 1 in FIG. A glaze layer 2 is formed on the surface of the substrate 1. The x direction corresponds to the first direction in the claims of the present invention, and the y direction corresponds to the second direction in the claims of the present invention.
  The glaze layer 2 is made of glass and is formed so as to cover the surface of the substrate 1. The glaze layer 2 is for supplying a smooth surface suitable for installing the electrode layer 3, the heating resistor 4, and the control means 5. The thickness of the glaze layer 2 is, for example, 110 μm. However, as shown in FIG. 2, a part of the surface of the glaze layer 2 bulges in the z direction. This bulging portion is referred to as a bulging portion 21.
  An electrode layer 3 is formed on the glaze layer 2. The electrode layer 3 is for energizing the heating resistor 4, and includes a common electrode wiring 31, a plurality of individual electrode wirings 32, a wiring group 33, and an external connection terminal group 34. The electrode layer 3 has a thickness of 1.7 μm, for example, and is made of an organic gold compound.
  FIG. 3 is an enlarged view of a portion of the thermal head A1 that overlaps the bulging portion 21 when viewed in the z direction. In FIG. 3, the protective layer 7 is omitted. As shown in FIG. 3, the common electrode wiring 31 includes a plurality of strip portions 311 extending in the y direction. The plurality of strip portions 311 are arranged along the x direction. These strips 311 are connected at the base. In the example shown in FIGS. 2 and 3, the auxiliary electrode layer 35 is provided so as to cover the root portions of the plurality of strip-shaped portions 311. The auxiliary electrode layer 35 is made of, for example, silver, and is provided to reduce electrical resistance.
  The plurality of individual electrode wirings 32 are separated from the common electrode wiring 31 and the auxiliary electrode layer 35 and arranged along the x direction so as to be separated from each other. Each individual electrode wiring 32 is formed in a strip shape extending along the y direction. Hereinafter, the upper end portion in FIG. 1 in the y direction of each individual electrode wiring 32 is referred to as a tip end portion 321, and the lower end portion in FIG. As shown in FIG. 3, the distal end portions 321 and the strip-shaped portions 311 of the plurality of individual electrode wirings 32 are arranged alternately. Further, the end portion 322 of each individual electrode wiring 32 is connected to the control means 5.
  The wiring group 33 is formed so as to be separated from the common electrode wiring 31 and each individual electrode wiring 32. The wiring group 33 mainly connects the control means 5 and the external connection terminal group 34. The external connection terminal group 34 is a part used to connect the thermal head A1 to an external power supply means or the like. In the example illustrated in FIG. 1, the external connection terminal group 34 includes a plurality of external connection terminals formed in a rectangular shape as viewed in the z direction.
  FIG. 5 is an enlarged view of the electrode layer 3 in the hatched portion Sa shown in FIG. FIG. 7 is an enlarged view of the electrode layer 3 in the hatched portion Sb shown in FIG. 5 and 7, the protective resin 6 is omitted for the sake of explanation. 5 and 7, the driving IC 52 arranged so as to overlap the electrode layer 3 is indicated by a two-dot chain line.
  As shown in FIG. 5, each individual electrode wiring 32 includes a normal width portion 32 a and a wide portion 32 b that is wider in the x direction than the normal width portion 32 a. Most of each individual electrode wiring 32 is normally constituted by a width portion 32a. The wide portion 32b is provided in a portion of the end portion 322 that does not overlap the control means 5 when viewed in the z direction. In the example shown in FIG. 5, the positions of the wide portions 32b are arranged so as to be shifted in the y direction in the adjacent individual electrode wirings 32A and 32B. The wide portion 32b of the individual electrode wiring 32B is located on the tip side in the y direction (upward in FIG. 5) than the wide portion 32b of the individual electrode wiring 32A. The wide portion 32b of the individual electrode wiring 32A and the wide portion 32b of the individual electrode wiring 32B are not overlapped when viewed in the x direction. According to such an arrangement, the distance between the individual electrode wirings 32A and 32B in the x direction can be made narrower and the wiring density can be improved than when the wide portions 32b overlap when viewed in the x direction.
  Further, as shown in FIGS. 5 and 7, the most distal region of the end portion 322 of each individual electrode wiring 32 extends to a portion overlapping the drive IC 52 as viewed in the z direction. A region that overlaps the drive IC 52 in the z-direction view of each individual electrode wiring 32 is defined as a connection portion 325. The connection between the drive IC 52 and each individual electrode wiring 32 is made at the connection portion 325.
  As shown in FIGS. 5 and 7, the wiring group 33 includes a plurality of wiring patterns 331, 332, 333, 334, 335, and 336 that are separated from each individual electrode wiring 32. The wiring group 33 is also separated from the common electrode wiring 31 and the auxiliary electrode layer 35. In the example shown in FIGS. 5 and 7, each of the wiring patterns 331, 332, 333, 334, 335, and 336 has a region that overlaps with the drive IC 52 when viewed in the z direction. The wiring patterns 331, 332, 333, and 336 are connected to the external connection terminal group 34 outside the regions shown in FIGS.
  The wiring pattern 331 is for supplying a ground voltage to the driving IC 52, for example. The drive IC 52 is formed so as to overlap with the lower end edge in FIG. 5 in the y direction when viewed in the z direction.
  The wiring patterns 332, 333, 334, and 335 are for supplying a control signal to the control means 5, for example. The wiring pattern 332 extends to a position that overlaps the driving IC 53 in the z-direction view outside the range shown in FIG. As shown in FIG. 7, the wiring pattern 333 extends to the right end of the drive IC 52 in the x direction in the figure when viewed in the z direction. As shown in FIG. 5, the wiring pattern 334 has a portion that overlaps the left end of the drive IC 52 in the x direction in the z direction when viewed in the z direction. The wiring pattern 334 extends to a position that overlaps the driving IC 51 in the z-direction view outside the range shown in FIG. As shown in FIG. 7, the wiring pattern 335 has a portion that overlaps the right end of the drive IC 52 in the x direction when viewed in the z direction. The wiring pattern 335 extends to a position that overlaps with the driving IC 53 in the z-direction view outside the range shown in FIG.
  The wiring pattern 336 is for supplying a drive voltage to the control means 5, for example. This drive voltage is supplied to the individual electrode wiring 32 through the control means 5. The wiring pattern 336 is formed wider in the y direction than the wiring patterns 332, 333, 334, and 335. As shown in FIG. 5, the wiring pattern 336 extends from the left side of the driving IC 52 in the x direction in the drawing. The wiring pattern 336 passes through the lower side of the drive IC 52 in the z direction and passes to the right in FIG. 7 in the x direction. The wiring pattern 336 extends to a position that overlaps with the driving ICs 51 and 52 in the z-direction view outside the range shown in FIGS.
  Furthermore, in the present embodiment, the electrode layer 3 includes an isolated portion 337 that is separated from each individual electrode wiring 32 and the wiring group 33 as shown in FIGS. 5 and 7. The isolated portion 337 is also separated from the common electrode wiring 31 and the auxiliary electrode layer 35.
  The heating resistor 4 is a heat source of the thermal head A1. The heating resistor 4 has a strip shape extending in the x direction, and is formed on the bulging portion 21. When the common electrode wiring 31 and any one of the individual electrode wirings 32 are energized, a region between the belt-like portion 311 and the tip portion 321 of the heating resistor 4 partially generates heat. The driving voltage supplied by the wiring pattern 336 described above is a voltage applied from the outside in order to generate a potential difference between the individual electrode wiring 32 and the common electrode wiring 31.
  The control means 5 performs drive control for partially heating the heating resistor 4 by energizing the heating resistor 4 through the common electrode wiring 31 and the plurality of individual electrode wirings 32. For this reason, each drive IC 51, 52, 53 contains a plurality of semiconductor elements.
  In the present embodiment, the drive ICs 51, 52, and 53 are the same components with only different installation positions. The drive IC 52 will be described, and the description of the drive ICs 51 and 53 will be omitted.
  The drive IC 52 has, for example, an x-direction dimension of 9.37 mm, a y-direction dimension of 0.53 mm, and a z-direction dimension of 0.30 mm, and is formed in an elongated rectangular parallelepiped shape having the x direction as a longitudinal direction.
  4 shows the bottom surface 52a of the drive IC 52. As shown in FIG. The bottom surface 52a of the driving IC 52 is a surface facing the surface of the substrate 1, and is an end surface close to the substrate 1 in the z direction of the driving IC 52. As shown in FIG. 4, a plurality of first pads 501 arranged along the x direction are provided on the bottom surface 52a of the drive IC 52. The plurality of first pads 501 are arranged in a line so as to overlap each other when viewed in the x direction. The row | line | column which the some 1st pad 501 comprises is arrange | positioned so that the edge of one (downward in FIG. 4) in the y direction of the drive IC52 may be followed. The plurality of first pads 501 are provided, for example, every 60 μm. For example, the first pad 501 has an x-direction dimension of 42.0 μm and a y-direction dimension of 67.0 μm. A region where a plurality of first pads 501 are arranged is referred to as a connection region 501A. A connection region 501A can also be defined for the drive ICs 51 and 53. The plurality of individual electrode wirings 32 are formed so that all the end portions 322 are accommodated in any one of the three connection regions 501A.
  As shown in FIG. 5, each first pad 501 overlaps with the connection portion 325 of the individual electrode wiring 32 in the z direction view. For this reason, the electrode layer 3 is formed in advance so that the connecting portions 325 are arranged every 60 μm along the x direction. In the present embodiment, the connecting portion 325 has a width in the y direction of, for example, 35 μm.
  9 and 10 show the first pad 501 in an enlarged manner. For simplification, the glaze layer 2 and the protective resin 6 are omitted in FIG.
  As shown in FIG. 9, the first pad 501 has a layer structure. In the example illustrated in FIG. 9, the first pad 501 includes a first layer 511, a second layer 512, a third layer 513, and a fourth layer 514, which are stacked along the z direction. The first layer 511 is made of, for example, titanium and has a thickness of about 40 nm. The first layer 511 is bonded to, for example, a semiconductor element built in the drive IC 52. The second layer 512 is in contact with the first layer 511 and is made of, for example, titanium nickel and has a thickness of about 100 nm. The third layer 513 is in contact with the second layer 512, and is mainly composed of, for example, aluminum and has a thickness of about 400 nm. The fourth layer 514 is in contact with the third layer 513 and is made of, for example, titanium and has a thickness of about 40 nm.
  Each first pad 501 is connected to a semiconductor element built in the driving IC 52. As shown in FIG. 4, when the first pads 501 are arranged in a line along the x direction, the semiconductor elements can be arranged more efficiently in the drive IC 52.
  As shown in FIG. 4, a plurality of second pads 502 arranged along the x direction are provided on the bottom surface 52 a of the driving IC 52 so as to be parallel to the row of the plurality of first pads 501. The plurality of second pads 502 are arranged in a line so as to overlap each other when viewed in the x direction. The row formed by the plurality of second pads 502 is at a position near the other edge (upper side in FIG. 4) of the drive IC 52 in the y direction. The interval between the adjacent second pads 502 is longer than the interval between the adjacent first pads 501. Since the distance in the x direction is longer, the dimension in the x direction of each second pad 502 is longer than the dimension in the x direction of the first pad 501.
  As shown in FIGS. 5 and 7, each second pad 502 overlaps the wiring pattern 331 when viewed in the z direction. Therefore, each second pad 502 is for supplying a ground voltage to the semiconductor element in the drive IC 52.
  Each second pad 502 is connected to a semiconductor element incorporated in the drive IC 52. As shown in FIG. 4, when the second pads 502 are arranged in a line along the x direction, the semiconductor elements can be arranged more efficiently in the drive IC 52.
  Further, a plurality of third pads 503a and 503b are provided at both end portions of the bottom surface 52a of the drive IC 52 in the x direction. In the example shown in FIG. 4, the plurality of third pads 503a and 503b are arranged in a region that does not overlap with the connection region 501A in the y-direction view. For this reason, the plurality of third pads 503a and 503b do not overlap the plurality of first pads 501 when viewed in the y direction.
  Each of the third pads 503a and 503b is connected to a semiconductor element built in the driving IC 52. In one example, the semiconductor element connected to the third pad 503a is different from the semiconductor element connected to the first pad 501. When a semiconductor element connected to the first pad 501 is installed at the center of the drive IC 52 in the x direction, the other semiconductor elements are arranged at both ends of the drive IC 52 in the x direction. In this case, it is desirable to provide the third pads 503a at both ends in the x direction of the bottom surface 52a in order to simplify the connection structure in the driving IC 52.
  As shown in FIGS. 5 and 7, each third pad 503 a overlaps any one of the wiring patterns 333, 334, and 335 in the wiring group 33 when viewed in the z direction. Each third pad 503 a is for transmitting a control signal to a semiconductor element in the driving IC 52.
  As shown in FIG. 5, each third pad 503 b overlaps with the wiring pattern 336. Each third pad 503b is for supplying a control voltage to the semiconductor element in the drive IC 52.
  As shown in FIG. 4, a plurality of fourth pads 504 are provided on the bottom surface 52 a of the drive IC 52. The fourth pad 504 is provided, for example, for checking whether the drive IC 52 operates normally. For this reason, the drive IC 52 operates normally without connecting the fourth pad 504 to the electrode layer 3.
  In the present embodiment, as shown in FIGS. 5 and 7, the fourth pad 504 and the isolated portion 337 are arranged so as to overlap each other when viewed in the z direction.
  As shown in FIGS. 6 and 8, the thermal head A <b> 1 includes a plurality of conductive members 521, 522, 523, and 524 that are separated from each other when viewed in the z direction between the control unit 5 and the substrate 1. The plurality of conductive members 521, 522, 523, and 524 are gold bumps. The thickness in the z direction of the plurality of conductive members 521, 522, 523, 524 is, for example, 15 μm. The plurality of conductive members 521 are connected to each of the plurality of first pads 501. Further, each conductive member 521 is in contact with the connection portion 325. Thus, each of the plurality of conductive members 521 connects the first pad 501 and the connection portion 325 facing the first pad 501. As shown in FIG. 9, the portion of the conductive member 521 that contacts the first pad 501 is formed shorter in the y direction than the other portions. The conductive member 521 has a rectangular shape when viewed in the z direction, and is formed so as to be entirely contained inside the first pad 501 as shown in FIG. The shape of the conductive member 521 viewed in the z direction is smaller than that of the first pad 501, the x direction dimension is 35 μm, and the y direction dimension is 60 μm. The dimension in the y direction of the conductive member 521 is the same as the width in the y direction of the connection portion 325, and the connection portion 325 and the conductive member 521 overlap with each other without deviation in the y direction.
  The plurality of conductive members 522 are each connected to one of the plurality of second pads 502. Each conductive member 522 is disposed so as to be located inside each second pad 502 when viewed in the z direction. As described above, the wiring pattern 331 is formed so as to overlap with the second pad 502. The plurality of conductive members 522 are all in contact with the wiring pattern 331, and the second pad 502 is electrically connected to the wiring pattern 331 through the plurality of conductive members 522. The shape of the conductive member 522 viewed in the z direction is, for example, a square having a side of 70 μm.
  The plurality of conductive members 523 are connected to one of the plurality of third pads 503a and 503b, respectively. Each conductive member 523 is disposed so as to be located inside each of the third pads 503a and 503b when viewed in the z direction. As described above, the wiring patterns 333, 334, and 335 are formed so as to overlap each third pad 503a, and the wiring pattern 336 is formed so as to overlap each third pad 503b. Through the conductive member 523, the third pad 503 a is electrically connected to the wiring patterns 333, 334, and 335, and the third pad 503 b is electrically connected to the wiring pattern 336. The shape of the conductive member 523 viewed in the z direction is a long rectangular shape having a long side of 80 μm and a short side of 70 μm, and the dimensions in the x direction and the plan view are larger than those of the conductive member 521.
  Furthermore, in this embodiment, a conductive member 524 is connected to the fourth pad 504. The conductive member 524 is disposed so as to be located inside the fourth pad 504 when viewed in the z direction. As described above, since the fourth pad 504 overlaps the isolated portion 337 when viewed in the z direction, the conductive member 524 connected to the fourth pad 504 is in contact with the isolated portion 337.
  In the present embodiment, the plurality of conductive members 521 are joined to the connecting portions 325 that are in contact with each other by the method described in the manufacturing method described later. Similarly, the plurality of conductive members 522 are bonded to the wiring pattern 331, and the plurality of conductive members 523 are bonded to the wiring patterns 333, 334, 335, and 336 that are in contact with each other. The conductive member 524 connected to the fourth pad 504 is also joined to the isolated portion 337.
  The protective resin 6 includes protective resins 61, 62 and 63. The drive IC 51 is covered with a protective resin 61. The drive IC 52 is covered with a protective resin 62. The drive IC 53 is covered with a protective resin 63. The protective resins 61, 62, and 63 are, for example, black resins, and prevent malfunctions due to damage to the drive ICs 51, 52, and 53 and reception of ultraviolet rays or the like.
  As shown in FIG. 6, the protective resin 6 further includes a sealing resin 60. The sealing resin 60 is mainly composed of an epoxy resin, and is formed so as to fill between the drive IC 52 and the glaze layer 2. As shown in FIG. 6, the sealing resin 60 has inclined portions 60 a on both sides of the drive IC 52 in the y direction so that the closer to the substrate 1 in the z direction, the farther away from the drive IC 52 in the y direction. The same material as the sealing resin 60 is also formed between the drive ICs 51 and 52 and the glaze layer 2.
  The protective layer 7 is for protecting the portion that comes into contact with the print medium 8 and is easily worn. As shown in FIG. 2, the protective layer 7 is formed so as to expose a part of the plurality of individual electrode wirings 32. An exposed portion of the plurality of individual electrode wirings 32 is connected to one of the drive ICs 51, 52, and 53. The protective layer 7 is formed of a suitable material selected from, for example, glass, sialon, tantalum nitride, and silicon carbide.
  Next, a method for manufacturing the thermal head A1 will be described with reference to FIGS.
  When manufacturing the thermal head A1, first, a step of forming the glaze layer 2 on the substrate 1 is performed. The step of forming the glaze layer 2 can be performed, for example, by printing and applying a glass paste material to the substrate 1 and baking it.
  Next, the process of forming the electrode layer 3 on the glaze layer 2 is performed. The step of forming the electrode layer 3 is performed, for example, by printing and baking a paste material containing an organic gold compound on the glaze layer 2. Note that the present invention is not limited to this method, and a desired wiring pattern can be obtained by, for example, a plating process.
  Further, after the electrode layer 3 is formed, the auxiliary electrode layer 35 is formed. This step is performed by printing and baking a silver paste in a desired region.
  In addition, it is desirable to check whether the plurality of individual electrode wirings 32 are insulated from each other after the electrode layer 3 is formed. This check operation is performed, for example, by bringing a needle-like inspection instrument into contact with each individual electrode wiring 32. At this time, the checking operation can be performed relatively easily by bringing the inspection instrument into contact with the wide portion 32 b provided in each individual electrode wiring 32. Subsequent processing is performed on a product for which no defect is detected in this check operation.
  FIG. 11 shows a state in which the electrode layer 3 is formed on the glaze layer 2. The area shown in FIG. 12 is an area where the drive IC 52 is to be installed.
  Further, a step of connecting a plurality of conductive members 521, 522, 523, 524 to the control means 5 is performed. In addition, since the process performed with respect to each drive IC51,52,53 is the same, the process performed with respect to the drive IC52 is demonstrated hereafter. The process performed for the drive IC 52 is also performed for the drive ICs 51 and 53.
  First, a process of forming a covering member 500 that covers the bottom surface 52a of the drive IC 52 is performed. The covering member 500 is formed with an opening 500 a that exposes all of the first to fourth pads 501, 502, 503, and 504 provided in the driving IC 52. In FIG. 12, an opening 500a exposing the first pad 501 is shown as an example. As shown in FIG. 12, a step is provided at the bottom (upper side in the drawing) of the opening 500a.
  Next, a process of performing gold plating on the bottom surface 52a of the drive IC 52 is performed. Since the bottom surface 52a is covered with the covering member 500 as described above, gold plating is formed on the portion exposed by the opening 500a. That is, bumps made of gold plating are formed on the first to fourth pads 501, 502, 503 and 504. The bumps formed at this time are a plurality of conductive members 521, 522, 523, and 524. According to such a manufacturing method, the plurality of conductive members 521, 522, 523, and 524 are formed in a state of being connected to the first to fourth pads 501, 502, 503, and 504, respectively. The correspondence between the conductive members 521, 522, 523, 524 and the first to fourth pads 501, 502, 503, 504 is as shown in the description of the configuration, and the description thereof is omitted.
  After the plurality of conductive members 521, 522, 523, and 524 are formed on the drive IC 52, a step of fixing the drive IC 52 to the substrate 1 is performed. In this step, first, as shown in FIG. 13, the drive IC 52 is installed so that the plurality of conductive members 521 come into contact with the plurality of connection portions 325. As described above, the plurality of first pads 501 and the plurality of connection portions 325 are installed at the same interval along the x direction. Since each conductive member 521 is connected to one of the plurality of first pads 501, it comes into contact with each conductive member 521 and each connection portion 325. In this step, the plurality of conductive members 522 are in contact with the wiring pattern 331 at the same time. The plurality of conductive members 523 are in contact with the wiring patterns 333, 334, 335 and 336. The plurality of conductive members 524 are in contact with the isolated portion 337.
  Then, the process of joining the some electroconductive member 521,522,523,524 and the electrode layer 3 contact | abutted to it is performed. This step is performed by, for example, ultrasonic bonding. In the state shown in FIG. 13, the weight of the drive IC 52 is applied to each part of the electrode layer 3 through the plurality of conductive members 521, 522, 523, and 524. In this state, when ultrasonic vibration is further applied to the drive IC 52, the vibration is transmitted to the plurality of conductive members 521, 522, 523, and 524, and by adding vibration energy, the plurality of conductive members 521, 522, and 523 are transmitted. , 524 and each part of the electrode layer 3 are joined. The drive IC 52 is fixed to the substrate 1 by bonding the plurality of conductive members 521, 522, 523, and 524 to each part of the electrode layer 3.
  In a state where the drive IC 52 is fixed to the substrate 1, a step of checking whether the drive IC 52 and the electrode layer 3 are electrically connected as planned is performed. This check operation is performed, for example, by bringing a needle-like inspection instrument into contact with each individual electrode wiring 32. At this time, the checking operation can be performed relatively easily by bringing the inspection instrument into contact with the wide portion 32 b provided in each individual electrode wiring 32. Subsequent processing is performed on a product for which no defect is detected in this check operation. The reason why the wide portion 32b is provided at a position that does not overlap the control means 5 when viewed in the z direction is to perform this check process more easily.
  Next, a step of forming the sealing resin 60 is performed. In this step, the substrate 1 obtained in the above step is placed in a vacuum environment. Then, as shown in FIG. 14, a liquid resin material 60A is installed on the drive IC 52 side. The resin material 60 </ b> A is installed along the edge (the left edge in FIG. 14) farther from the heating resistor 4 in the y direction of the drive IC 52. In this way, the resin material 60A penetrates between the drive IC 52 and the glaze layer 2 and reaches the edge (the right edge in FIG. 14) closer to the heating resistor 4 in the y direction of the drive IC 52. To reach. The resin material 60A is obtained by adding a filler such as a phenol resin-based curing agent, an acid anhydride-based curing agent, a curing accelerator, a silicone resin-based modifier, diethylene glycol diethyl ether, and silica to a bisphenol type epoxy resin. is there. Such a resin material 60 </ b> A is cured over time. FIG. 15 shows a state where the resin material 60A is cured. The cured resin material 60 </ b> A becomes the sealing resin 60.
  When the manufacturing method as described above is performed, inclined portions 60a are formed on both side edges of the sealing resin 60 in the y direction.
  Thereafter, the protective IC 62 is formed by further covering the drive IC 52 with an epoxy resin, and the thermal head A1 as shown in FIG. 6 is manufactured.
  Next, the operation of the thermal head A1 will be described.
  In the above-described thermal head A1, the connection portion 325 of each individual electrode wiring 32 extends to a position where it overlaps with the drive IC 52 when viewed in the z direction. The connection between the driving IC 52 and each individual electrode wiring 32 in the thermal head A1 is made through a connection portion 325. In order to realize such a connection, the plurality of first pads 501 are provided on the bottom surface 52 a of the drive IC 52. Since each 1st pad 501 exists in the position which overlaps with each connection part 325 in z direction view, it is low necessity to use a wire in connecting both. As shown in the above embodiment, it is reasonable to connect by a plurality of conductive members 521 made of gold plating. Thus, unlike the conventional case, in the thermal head A1, the drive IC 52 and each individual electrode wiring 32 can be connected without using a wire. By not using a wire, the protective resin 6 may cover the surface of the drive IC 52. Therefore, the thermal head A1 has a configuration capable of suppressing the thickness of the protective resin 6 in the z direction. By suppressing the thickness of the protective resin 6, the thermal head A1 can eliminate the contact failure between the platen roller and the printing medium 8 as described in the conventional description.
  As shown in the conventional description, when connecting a driving IC and an individual electrode wiring using a wire, it is assumed that the wire is pushed and spread when the wire is connected to the metal layer. For this reason, it is necessary to provide a margin for the interval between the individual electrode wirings. However, if the wire is not used like the thermal head A1, it is not necessary to provide such a margin. For this reason, in the thermal head A1, it is possible to make the space | interval of individual electrode wiring narrower than before. When the interval between the individual electrode wirings is narrowed, for example, a large number of individual electrode wirings can be formed in the same substrate. By increasing the number of individual electrode wirings, for example, the resolution can be improved.
  Further, in the thermal head A1, conduction between the plurality of second pads 502 and the wiring pattern 331 is performed by a plurality of conductive members 522 made of gold plating. Further, conduction between the plurality of third pads 503a and the wiring patterns 333, 334, and 335 and conduction between the plurality of third pads 503b and the wiring pattern 336 are performed by the plurality of conductive members 523 made of gold plating. . For this reason, the thermal head A <b> 1 has a configuration in which no wire is required for connection with the electrode layer 3. This configuration is desirable for suppressing the thickness of the protective resin 6.
  Furthermore, according to the manufacturing method described above, in the thermal head A1, the plurality of conductive members 521, 522, 523, and 524 are bonded to the electrode layers 3 that are in contact with each other. For this reason, it is possible to prevent the drive IC 52 from being displaced in the manufacturing process. When the drive IC 52 is installed at a position different from the planned position, for example, the first pad 501 may be electrically connected to the individual electrode wiring 32 different from the planned position. However, according to the manufacturing method described above, it is possible to prevent such a problem.
  The drive IC 52 in the thermal head A1 is long in the x direction as shown in FIG. The plurality of first pads 501 and the plurality of second pads 502 are arranged in a row along the x direction which is the longitudinal direction of the driving IC 52. Further, the row formed by the plurality of first pads 501 and the row formed by the plurality of second pads 502 are arranged so as to be separated from each other in the y direction. Such a structure is suitable for preventing the drive IC 52 from being inclined when the drive IC 52 is installed on the substrate 1 in the manufacturing method described above.
  Further, in the present embodiment, the fourth pad 504 and the isolated portion 337 are connected by the conductive member 524. For this reason, the number of joints is increased, and the drive IC 52 is joined to the electrode layer 3 more firmly.
  In the thermal head A <b> 1, the size in the z direction of the conductive members 522 and 523 connected to the second pad 502 and the third pad 503 having a size in the z direction larger than that of the first pad 501 is larger than that in the conductive member 521. It is formed to be large. In the case of a plurality of conductive members 521, it is necessary to prevent conduction between adjacent individual electrode wirings 32, and therefore it is desirable to avoid an unnecessarily large shape. On the other hand, since there is no such situation in the conductive members 522 and 523, the dimension in the z-direction view can be made relatively large. As described above, the plurality of conductive members 521, 522, 523, and 524 serve not only to conduct the drive IC 52 and the electrode layer 3 but also to fix the drive IC 52. For this reason, increasing the z-direction viewing area of the conductive members 522 and 523 can be expected to have an advantageous effect on fixing the drive IC 52.
  Further, in the thermal head A1, the wiring pattern 336 having a relatively wide width in the y direction is arranged so as to overlap the driving IC 52 when viewed in the z direction. The wiring pattern 336 is for supplying a drive voltage to the control means 5 and cannot be omitted. It is desirable that the wiring pattern 336 be formed wide. If the wiring pattern 336 is to be arranged at a position that does not overlap with the driving IC 52 when viewed in the z direction, the width of the substrate 1 in the y direction must be increased. In other words, the configuration described above is a configuration in which the width of the substrate 1 in the y direction can be easily reduced, and is a configuration suitable for reducing the size of the thermal head A1.
  Furthermore, according to the manufacturing method described above, the sealing resin 60 is formed between the drive IC 52 and the glaze layer 2. The sealing resin 60 prevents foreign matter from entering between the driving IC 52 and the glaze layer 2 and more firmly fixes the driving IC 52.
  In the present embodiment, the control means 5 is composed of three drive ICs 51, 52, and 53 that are separated in the x direction. Although it is possible to form the control means 5 with a single driving IC, in this case, the number of the plurality of first pads 501 arranged along the x direction is greatly increased. At this time, it may be difficult to precisely join all of the first pads 501 to the connection portion 325. In order to reduce such a risk, in this embodiment, the control means 5 is constituted by three drive ICs 51, 52, 53.
  In the conventional thermal head, even when the driving IC and the individual electrode wiring are connected by a wire, a part of the wiring pattern may be formed under the driving IC. In such a case, it has been common to form a flat glass layer on the wiring and fix the bottom surface of the driving IC on the glass layer. In the thermal head A1, as described above, the plurality of conductive members 521, 522, 523, and 524 are connected to the first to fourth pads 501, 502, 503, and 504 provided on the bottom surface 52a of the drive IC 52. These conductive members 521, 522, 523, 524 are fixed to the electrode layer 3. According to this structure, it is not necessary to form a glass layer on the glaze layer 2 in order to support the driving IC 52. This can be expected to reduce the number of parts of the thermal head A1. Furthermore, it is desirable for suppressing the thickness of the protective resin 6 in the z direction.
  16 to 21 show another embodiment of the present invention. In these drawings, the same or similar elements as those in the above embodiment are denoted by the same reference numerals as those in the above embodiment.
  FIG. 16 shows a thermal head according to the second embodiment of the present invention. The thermal head A2 of this embodiment is mainly different from the above-described embodiment in the configuration of the individual electrode wiring 32. In the present embodiment, the connection portion 325 of the individual electrode wiring 32 includes a first layer 325a and a second layer 325b. The thickness of the connection part 325 is approximately 2 μm or less. In the present embodiment, the connection portion 325 of the individual electrode wiring 32 includes the first layer 325a and the second layer 325b, and the portion of the individual electrode wiring 32 other than the connection portion 325 is configured only by the first layer 325a. Has been. However, the entire individual electrode wiring 32 may be composed of the first layer 325a and the second layer 325b. When the connection portion 325 has a two-layer structure in which the first layer 325a is a base layer, patterning for forming the connection portion 325 can be performed more accurately. The dimensions of the connecting portion 325 and the conductive member 521 in the x direction are both about 35 μm.
  The first layer 325a is formed on the glaze layer 2 and has a relatively smooth cross-sectional shape. Examples of the main component of the first layer 325a include an organic gold compound. The thickness of the first layer 325a is, for example, about 0.6 μm. The first layer 325a is formed, for example, by printing a paste containing an organic gold compound on the glaze layer 2 and then firing the paste. FIG. 16 shows a configuration in which the first layer 325a is settled with respect to the glaze layer 2 in this firing process, but this is an example. The first layer 325a may not settle with respect to the glaze layer 2. In addition, the first layer 325a and the second layer 325b may form a clear interface as shown in FIG. 16, but such a clear interface may not be formed. In such a case, the first layer 325a and the second layer 325b can be recognized as one layer as an appearance when the cut surface is observed, for example.
  The second layer 325b is stacked on the first layer 325a and has a rough surface at least as compared with the first layer 325a. FIG. 17 shows the connection portion 325 before being joined to the conductive member 521. As clearly shown in FIGS. 16 and 17, the surface of the second layer 325 b has a remarkable uneven shape. This uneven surface is realized by, for example, fixing fine gold particles irregularly distributed and partially standing upright. The second layer 325b includes gold as a main component and glass in addition to this. The thickness of the second layer 325b is thicker than the first layer 325a, for example, about 1.1 μm.
  For the formation of the second layer 325b, for example, a paste containing fine gold particles and glass and a resin as a solvent is used. After forming a gold layer containing organic gold as a base of the first layer 325a, a paste containing fine gold particles and glass is printed on the gold layer. When this paste is fired, the resin as a solvent present between the fine gold particles disappears, and the interposed glass moves downward. As a result, a gold layer can be obtained in which fine gold particles are irregularly distributed and a part thereof is fixed in a standing state. Thereafter, the individual electrode wiring 32 is obtained by performing patterning, for example, by etching on the gold layer containing organic gold and the gold layer containing fine gold particles.
  FIG. 18 shows a state immediately before the driving IC 52 and the substrate 1 (not shown in the figure) are joined. As shown in the figure, in the present embodiment, the x-direction dimension W2 of the conductive member 521 before joining is smaller than the x-direction dimension W1 of the connection portion 325, for example, about 25 μm.
  Next, as shown in FIG. 19, the drive IC 52 is lowered to bring the conductive member 521 into contact with the connection portion 325. Further, ultrasonic vibration is applied while applying a downward force in the z direction to the drive IC 52. In the present embodiment, the vibration direction of the ultrasonic vibration is the x direction. Through this ultrasonic bonding process, the conductive member 521 and the connecting portion 325 are ultrasonically bonded. When the conductive member 521 is pressed while receiving ultrasonic vibration whose vibration direction is the x direction, the dimension in the x direction is slightly larger than that before bonding. In the present embodiment, the dimension in the x direction of the conductive member 521 after bonding is about 35 μm, which is substantially the same as the connection portion 325.
  In addition, since the second layer 325 b of the connection portion 325 has an uneven shape, the upper end portion of the second layer 325 b has bitten into the lower end portion of the conductive member 521 after bonding. Further, depending on the degree of unevenness of the second layer 325b and the bonding conditions of ultrasonic bonding, a fine gap may be generated between the second layer 325b after bonding and the conductive member 521. For this reason, as shown in FIG. 16, a part of the sealing resin 60 may be slightly interposed between the second layer 325b and the conductive member 521. Since the interposed sealing resin 60 is not interposed over the entire area of the second layer 325b and the conductive member 521, it does not hinder the conduction between the second layer 325b and the conductive member 521. Depending on the degree of unevenness of the second layer 325b and the bonding conditions of ultrasonic bonding, it may be avoided that a gap is formed between the second layer 325b and the conductive member 521 or the sealing resin 60 is interposed. Is possible.
  According to the present embodiment, ultrasonic vibration in which the vibration direction is the x direction is applied to the drive IC 52 whose longitudinal direction is the x direction in ultrasonic bonding. By adopting such a vibration direction, there is an advantage that the drive IC 52 can be vibrated stably. For example, unlike the present embodiment, when ultrasonic vibration whose vibration direction is the y direction is applied to the drive IC 52, the drive IC 52 is likely to swing around an axis extending in the x direction. When the conductive member 521 rubs against the connecting portion 325 according to this swing, the lower surface of the conductive member 521 becomes a convex surface that slightly bulges downward in the z direction. The conductive member 521 having such a convex surface cannot be expected to be appropriately joined to the connection portion 325. According to this embodiment, since the vibration direction is the longitudinal direction of the drive IC 52, the drive IC 52 is less likely to swing. Therefore, it is possible to prevent the conductive member 521 from becoming an inappropriate shape due to the friction caused by the swinging, and the conductive member 521 can be appropriately joined to the connection portion 325.
  Although the vibration direction of the ultrasonic vibration is the x direction, the plurality of connection portions 325 are arranged in a line along the x direction. Such a configuration is suitable for reducing the number of wiring layers to be stacked inside the driving IC 52. The reduction in the number of wirings contributes to the cost reduction of the drive IC 52.
  When the connection portion 325 includes the uneven second layer 325b, a joining mode in which the connection portion 325 bites into the conductive member 521 can be realized. Such a joining mode is suitable for increasing the joining strength between the connecting portion 325 and the conductive member 521.
  In the state before joining, by setting the x-direction dimension W2 of the conductive member 521 to be smaller than the x-direction dimension W1 of the connecting portion 325, even if ultrasonic vibration whose vibration direction is the x direction is applied to the drive IC 52, It can be suppressed that the conductive member 521 protrudes greatly from the connection portion 325. This is preferable for avoiding short circuit between adjacent individual electrode wirings 32. In addition, the fact that the dimensions in the x direction of the conductive member 521 and the connecting portion 325 are substantially the same after joining is suitable for reliably conducting each other.
  20 and 21 show a third embodiment of the present invention. In the thermal head A3 of the present embodiment, the shape of the sealing resin 60 is different from that of the first embodiment described above. The thermal head A3 can employ any of the configurations of the first and second embodiments described above as the connecting portion 325 and the conductive member 521. Further, the thermal head A2 of the second embodiment described above can employ any of the configurations of the first embodiment and the present embodiment described above as the sealing resin 60.
  In the present embodiment, the sealing resin 60 covers the lower portions of the side surface 52b facing the y direction and the side surface 52b facing the x direction of the drive IC 52, and exposes the upper portions thereof. As described in the first embodiment, the sealing resin 60 is formed in such a manner that the liquid resin material 60A that is the material of the sealing resin 60 is placed along the side surface 52b facing the y direction, for example. And between the substrate 1 and the substrate 1.
  According to such an embodiment, the bonding strength between the driving IC 52 and the substrate 1 can be further increased. In particular, since the drive IC 52 has a shape that extends long in the x direction, when the thermal head A3 is used, thermal deformation such that both ends of the drive IC 52 in the x direction are separated from the substrate 1 is likely to occur. A portion of the sealing resin 60 that covers the side surface 52b facing in the x direction is suitable for preventing the drive IC 52 from being detached from the substrate 1 due to such thermal deformation of the drive IC 52.
  The scope of the present invention is not limited to the embodiment described above. The specific configuration of the thermal head and the method of manufacturing the thermal head according to the present invention can be varied in design in various ways. For example, the electrode layer 3 can be substituted with metal wiring such as aluminum wiring or silver wiring. Moreover, in the said embodiment, although the drive IC 52 is being fixed to the board | substrate 1 by ultrasonic bonding, this is only a preferable example. When the driving IC 52 is fixed to the substrate 1, other flip chip mounting methods can be used.
A1 Thermal head x (first) direction y (second) direction z (thickness) direction 1 substrate 2 glaze layer 21 bulging portion 3 electrode layer 31 common electrode wiring 32 individual electrode wiring 325 connection portion 33 wiring group 331 , 332, 333, 334, 335, 336 Wiring pattern 337 Isolated portion 34 External connection terminal group 35 Auxiliary electrode layer 4 Heating resistor 5 Control means 51, 52, 53 Drive IC
52a bottom surface 501 first pad 501A connection region 502 second pad 503 third pad 504 fourth pad 511 first layer 512 second layer 513 third layer 514 fourth layer 521, 522, 523, 524 conductive member 6, 61, 62, 63 Protective resin 60 Sealing resin 60a Inclined portion 7 Protective layer

Claims (15)

  1. A substrate,
    A heating resistor provided on one side in the thickness direction of the substrate;
    An electrode layer provided on one side in the thickness direction of the substrate and electrically connected to the heating resistor;
    Control means having a plurality of drive ICs provided on one side in the thickness direction of the substrate and arranged spaced apart from each other in a first direction orthogonal to the thickness direction of the substrate;
    A thermal head comprising
    The electrode layer includes a common electrode wiring, a plurality of individual electrode wirings spaced apart from the common electrode wiring, and one or more controls separated from the common electrode wiring and the plurality of individual electrode wirings. With wiring,
    Each of the individual electrode wirings has a connection portion that overlaps the driving IC in the thickness direction of the substrate.
    The control wiring has a plurality of second connection portions that overlap and conduct with each of the adjacent drive ICs in the thickness direction of the substrate, thereby connecting the adjacent drive ICs to each other.
    The driving IC includes a first side that overlaps the individual electrode wiring in the thickness direction of the substrate, a second side and a third side that are orthogonal to the first side and are opposed to each other, and shorter than the first side. A bottom surface facing the one side surface in the thickness direction of the substrate, and a plurality of pads provided on the bottom surface,
    The electrode layer further includes a specific wiring that overlaps the second side and the third side in the thickness direction view of the substrate and crosses the drive IC,
    The plurality of pads include a control pad connected to the second connection portion of the control wiring, and a specific pad connected to the specific wiring,
    Said one or more control wires, including those that overlap the first side and overlaps those and the second side and in the thickness direction as viewed in the substrate, the thermal head.
  2. The control wiring overlapping the first side is connected to the first part extending from the first side in the thickness direction and a second direction orthogonal to the first direction, and the second part and the second part. 2. The thermal head according to claim 1, further comprising a second portion extending in the first direction at a position on the side of the heating resistor with respect to the driving IC in the direction.
  3. 3. The thermal head according to claim 2, wherein the control wiring overlapping the first side has a third portion that is connected to the second portion and extends toward the drive IC in the second direction.
  4. 4. The thermal head according to claim 3, wherein the control wiring overlapping the first side has a fourth part that is connected to the third part and extends in the first direction. 5.
  5. 5. The thermal head according to claim 4, wherein the fourth part is located closer to the heating resistor than the driving IC in the second direction.
  6. The specific wiring is a power supply wiring for supplying a driving voltage to the driving IC,
    The thermal head according to claim 1, wherein the specific pad is a power supply pad connected to the power supply wiring.
  7. The thermal head according to claim 6 , wherein the control pad is disposed on the side of the driving IC adjacent to the power supply pad in the first direction.
  8. The drive IC includes a bottom surface facing one surface in the thickness direction of the substrate, and a plurality of pads provided on the bottom surface.
    The plurality of pads, including the second connected control pad connecting portion of the control wire, the thermal head according to any one of claims 1 to 7.
  9. Said one or more control wires include those overlapping the first side in the thickness direction as viewed in the substrate, the thermal head according to any one of claims 1 to 8.
  10. The specific wiring on the substrate are formed adjacent to the control wiring, the thermal head according to any one of claims 1 to 9.
  11. The thermal head according to claim 10 , wherein the specific wiring has a portion sandwiching the control wiring.
  12. The plurality of connecting portions are arranged along a first direction orthogonal to the thickness direction,
    The plurality of pads includes a plurality of first pads arranged along the first direction,
    The thermal head according to claim 1 or 8 , wherein any one of the plurality of first pads is electrically connected to any one of the plurality of connection portions.
  13. The thermal head according to claim 12 , wherein the plurality of first pads are arranged so as to overlap each other when viewed in the first direction.
  14. In the thickness direction when viewed, each connection portion overlaps with any of the plurality of first pads, the thermal head according to claim 12 or 13.
  15. A plurality of conductive members sandwiched between the driving IC and the substrate in the thickness direction and spaced apart from each other in the thickness direction view;
    The thermal head according to claim 14 , wherein the plurality of conductive members include a first conductive member in contact with both of the plurality of first pads and the plurality of connection portions.
JP2016155706A 2011-04-13 2016-08-08 Thermal head Active JP6368746B2 (en)

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JP6208561B2 (en) * 2013-11-26 2017-10-04 京セラ株式会社 Thermal head and thermal printer
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CN104859312A (en) * 2015-06-08 2015-08-26 武汉今域通半导体有限公司 Thermosensitive printing head and manufacturing method therefor
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JP2503898Y2 (en) * 1988-05-31 1996-07-03 京セラ株式会社 Thermal head
JP2814175B2 (en) * 1992-02-14 1998-10-22 ローム株式会社 Printhead and driving IC mounted thereon
JPH0796620A (en) * 1993-09-30 1995-04-11 Kyocera Corp Thermal head
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