JP2008108849A5 - - Google Patents

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Publication number
JP2008108849A5
JP2008108849A5 JP2006289149A JP2006289149A JP2008108849A5 JP 2008108849 A5 JP2008108849 A5 JP 2008108849A5 JP 2006289149 A JP2006289149 A JP 2006289149A JP 2006289149 A JP2006289149 A JP 2006289149A JP 2008108849 A5 JP2008108849 A5 JP 2008108849A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006289149A
Other versions
JP2008108849A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006289149A priority Critical patent/JP2008108849A/ja
Priority claimed from JP2006289149A external-priority patent/JP2008108849A/ja
Priority to US11/870,743 priority patent/US7786580B2/en
Priority to TW096138960A priority patent/TW200820358A/zh
Priority to KR1020070105325A priority patent/KR20080036925A/ko
Priority to DE602007014000T priority patent/DE602007014000D1/de
Priority to CN2007101514892A priority patent/CN101170072B/zh
Priority to EP07020813A priority patent/EP1933377B1/en
Publication of JP2008108849A publication Critical patent/JP2008108849A/ja
Publication of JP2008108849A5 publication Critical patent/JP2008108849A5/ja
Pending legal-status Critical Current

Links

JP2006289149A 2006-10-24 2006-10-24 半導体装置および半導体装置の製造方法 Pending JP2008108849A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2006289149A JP2008108849A (ja) 2006-10-24 2006-10-24 半導体装置および半導体装置の製造方法
US11/870,743 US7786580B2 (en) 2006-10-24 2007-10-11 Semiconductor device and method for manufacturing the same
TW096138960A TW200820358A (en) 2006-10-24 2007-10-18 Semiconductor device and method for manufacturing the same
KR1020070105325A KR20080036925A (ko) 2006-10-24 2007-10-19 반도체 장치 및 그 제조 방법
DE602007014000T DE602007014000D1 (de) 2006-10-24 2007-10-24 Halbleiterbauelement und Herstellungsverfahren dafür
CN2007101514892A CN101170072B (zh) 2006-10-24 2007-10-24 半导体器件及其制造方法
EP07020813A EP1933377B1 (en) 2006-10-24 2007-10-24 Semiconductor device and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006289149A JP2008108849A (ja) 2006-10-24 2006-10-24 半導体装置および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2008108849A JP2008108849A (ja) 2008-05-08
JP2008108849A5 true JP2008108849A5 (ja) 2009-10-22

Family

ID=39085281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006289149A Pending JP2008108849A (ja) 2006-10-24 2006-10-24 半導体装置および半導体装置の製造方法

Country Status (7)

Country Link
US (1) US7786580B2 (ja)
EP (1) EP1933377B1 (ja)
JP (1) JP2008108849A (ja)
KR (1) KR20080036925A (ja)
CN (1) CN101170072B (ja)
DE (1) DE602007014000D1 (ja)
TW (1) TW200820358A (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5048420B2 (ja) 2007-08-17 2012-10-17 新光電気工業株式会社 半導体装置及びその製造方法
JP5064158B2 (ja) * 2007-09-18 2012-10-31 新光電気工業株式会社 半導体装置とその製造方法
JP5603191B2 (ja) * 2010-09-28 2014-10-08 株式会社テラプローブ 半導体装置の製造方法
CN104599987A (zh) * 2014-12-19 2015-05-06 南通富士通微电子股份有限公司 半导体圆片级封装工艺

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3313547B2 (ja) 1995-08-30 2002-08-12 沖電気工業株式会社 チップサイズパッケージの製造方法
JP3801300B2 (ja) * 1997-03-21 2006-07-26 セイコーエプソン株式会社 半導体装置の製造方法
JP3252745B2 (ja) * 1997-03-31 2002-02-04 関西日本電気株式会社 半導体装置およびその製造方法
JP3830125B2 (ja) * 2000-03-14 2006-10-04 株式会社東芝 半導体装置の製造方法及び半導体装置
JP2002050716A (ja) * 2000-08-02 2002-02-15 Dainippon Printing Co Ltd 半導体装置及びその作製方法
KR100378285B1 (en) * 2001-06-15 2003-03-29 Dongbu Electronics Co Ltd Semiconductor package and fabricating method thereof
US7049528B2 (en) * 2002-02-06 2006-05-23 Ibiden Co., Ltd. Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module
JP2004047725A (ja) * 2002-07-11 2004-02-12 Sumitomo Bakelite Co Ltd 半導体装置及び製造方法
JP2004193497A (ja) * 2002-12-13 2004-07-08 Nec Electronics Corp チップサイズパッケージおよびその製造方法
JP2004247530A (ja) * 2003-02-14 2004-09-02 Renesas Technology Corp 半導体装置及びその製造方法

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