JP2008108849A5 - - Google Patents
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- Publication number
- JP2008108849A5 JP2008108849A5 JP2006289149A JP2006289149A JP2008108849A5 JP 2008108849 A5 JP2008108849 A5 JP 2008108849A5 JP 2006289149 A JP2006289149 A JP 2006289149A JP 2006289149 A JP2006289149 A JP 2006289149A JP 2008108849 A5 JP2008108849 A5 JP 2008108849A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006289149A JP2008108849A (ja) | 2006-10-24 | 2006-10-24 | 半導体装置および半導体装置の製造方法 |
US11/870,743 US7786580B2 (en) | 2006-10-24 | 2007-10-11 | Semiconductor device and method for manufacturing the same |
TW096138960A TW200820358A (en) | 2006-10-24 | 2007-10-18 | Semiconductor device and method for manufacturing the same |
KR1020070105325A KR20080036925A (ko) | 2006-10-24 | 2007-10-19 | 반도체 장치 및 그 제조 방법 |
DE602007014000T DE602007014000D1 (de) | 2006-10-24 | 2007-10-24 | Halbleiterbauelement und Herstellungsverfahren dafür |
CN2007101514892A CN101170072B (zh) | 2006-10-24 | 2007-10-24 | 半导体器件及其制造方法 |
EP07020813A EP1933377B1 (en) | 2006-10-24 | 2007-10-24 | Semiconductor device and method for manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006289149A JP2008108849A (ja) | 2006-10-24 | 2006-10-24 | 半導体装置および半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008108849A JP2008108849A (ja) | 2008-05-08 |
JP2008108849A5 true JP2008108849A5 (ja) | 2009-10-22 |
Family
ID=39085281
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006289149A Pending JP2008108849A (ja) | 2006-10-24 | 2006-10-24 | 半導体装置および半導体装置の製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7786580B2 (ja) |
EP (1) | EP1933377B1 (ja) |
JP (1) | JP2008108849A (ja) |
KR (1) | KR20080036925A (ja) |
CN (1) | CN101170072B (ja) |
DE (1) | DE602007014000D1 (ja) |
TW (1) | TW200820358A (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5048420B2 (ja) | 2007-08-17 | 2012-10-17 | 新光電気工業株式会社 | 半導体装置及びその製造方法 |
JP5064158B2 (ja) * | 2007-09-18 | 2012-10-31 | 新光電気工業株式会社 | 半導体装置とその製造方法 |
JP5603191B2 (ja) * | 2010-09-28 | 2014-10-08 | 株式会社テラプローブ | 半導体装置の製造方法 |
CN104599987A (zh) * | 2014-12-19 | 2015-05-06 | 南通富士通微电子股份有限公司 | 半导体圆片级封装工艺 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3313547B2 (ja) | 1995-08-30 | 2002-08-12 | 沖電気工業株式会社 | チップサイズパッケージの製造方法 |
JP3801300B2 (ja) * | 1997-03-21 | 2006-07-26 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
JP3252745B2 (ja) * | 1997-03-31 | 2002-02-04 | 関西日本電気株式会社 | 半導体装置およびその製造方法 |
JP3830125B2 (ja) * | 2000-03-14 | 2006-10-04 | 株式会社東芝 | 半導体装置の製造方法及び半導体装置 |
JP2002050716A (ja) * | 2000-08-02 | 2002-02-15 | Dainippon Printing Co Ltd | 半導体装置及びその作製方法 |
KR100378285B1 (en) * | 2001-06-15 | 2003-03-29 | Dongbu Electronics Co Ltd | Semiconductor package and fabricating method thereof |
US7049528B2 (en) * | 2002-02-06 | 2006-05-23 | Ibiden Co., Ltd. | Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module |
JP2004047725A (ja) * | 2002-07-11 | 2004-02-12 | Sumitomo Bakelite Co Ltd | 半導体装置及び製造方法 |
JP2004193497A (ja) * | 2002-12-13 | 2004-07-08 | Nec Electronics Corp | チップサイズパッケージおよびその製造方法 |
JP2004247530A (ja) * | 2003-02-14 | 2004-09-02 | Renesas Technology Corp | 半導体装置及びその製造方法 |
-
2006
- 2006-10-24 JP JP2006289149A patent/JP2008108849A/ja active Pending
-
2007
- 2007-10-11 US US11/870,743 patent/US7786580B2/en not_active Expired - Fee Related
- 2007-10-18 TW TW096138960A patent/TW200820358A/zh unknown
- 2007-10-19 KR KR1020070105325A patent/KR20080036925A/ko not_active Application Discontinuation
- 2007-10-24 EP EP07020813A patent/EP1933377B1/en not_active Expired - Fee Related
- 2007-10-24 DE DE602007014000T patent/DE602007014000D1/de active Active
- 2007-10-24 CN CN2007101514892A patent/CN101170072B/zh not_active Expired - Fee Related
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