JP2008098498A5 - - Google Patents

Download PDF

Info

Publication number
JP2008098498A5
JP2008098498A5 JP2006280113A JP2006280113A JP2008098498A5 JP 2008098498 A5 JP2008098498 A5 JP 2008098498A5 JP 2006280113 A JP2006280113 A JP 2006280113A JP 2006280113 A JP2006280113 A JP 2006280113A JP 2008098498 A5 JP2008098498 A5 JP 2008098498A5
Authority
JP
Japan
Prior art keywords
substrate
electrode pad
insulating film
hole
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006280113A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008098498A (ja
JP5103861B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006280113A priority Critical patent/JP5103861B2/ja
Priority claimed from JP2006280113A external-priority patent/JP5103861B2/ja
Publication of JP2008098498A publication Critical patent/JP2008098498A/ja
Publication of JP2008098498A5 publication Critical patent/JP2008098498A5/ja
Application granted granted Critical
Publication of JP5103861B2 publication Critical patent/JP5103861B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2006280113A 2006-10-13 2006-10-13 半導体装置、半導体装置の製造方法、回路基板および電子機器 Active JP5103861B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006280113A JP5103861B2 (ja) 2006-10-13 2006-10-13 半導体装置、半導体装置の製造方法、回路基板および電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006280113A JP5103861B2 (ja) 2006-10-13 2006-10-13 半導体装置、半導体装置の製造方法、回路基板および電子機器

Publications (3)

Publication Number Publication Date
JP2008098498A JP2008098498A (ja) 2008-04-24
JP2008098498A5 true JP2008098498A5 (enrdf_load_stackoverflow) 2009-11-19
JP5103861B2 JP5103861B2 (ja) 2012-12-19

Family

ID=39381010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006280113A Active JP5103861B2 (ja) 2006-10-13 2006-10-13 半導体装置、半導体装置の製造方法、回路基板および電子機器

Country Status (1)

Country Link
JP (1) JP5103861B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5539624B2 (ja) * 2008-04-28 2014-07-02 ラピスセミコンダクタ株式会社 薄膜抵抗素子、及び薄膜抵抗素子の製造方法
US7786600B2 (en) * 2008-06-30 2010-08-31 Hynix Semiconductor Inc. Circuit substrate having circuit wire formed of conductive polarization particles, method of manufacturing the circuit substrate and semiconductor package having the circuit wire
EP2463896B1 (en) * 2010-12-07 2020-04-15 IMEC vzw Method for forming through-substrate vias surrounded by isolation trenches with an airgap and corresponding device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3983996B2 (ja) * 2001-04-23 2007-09-26 株式会社ルネサステクノロジ 半導体集積回路装置
JP2004095849A (ja) * 2002-08-30 2004-03-25 Fujikura Ltd 貫通電極付き半導体基板の製造方法、貫通電極付き半導体デバイスの製造方法
JP2005093486A (ja) * 2003-09-12 2005-04-07 Seiko Epson Corp 半導体装置の製造方法及び半導体装置
JP3821125B2 (ja) * 2003-12-18 2006-09-13 セイコーエプソン株式会社 半導体装置の製造方法、半導体装置、回路基板、電子機器
JP4873517B2 (ja) * 2004-10-28 2012-02-08 オンセミコンダクター・トレーディング・リミテッド 半導体装置及びその製造方法

Similar Documents

Publication Publication Date Title
TWI227923B (en) Semiconductor device and its manufacturing method, circuit substrate and electronic machine
JP2010171377A5 (enrdf_load_stackoverflow)
JP2009194322A5 (enrdf_load_stackoverflow)
JP2016192568A5 (enrdf_load_stackoverflow)
JP2007013092A5 (enrdf_load_stackoverflow)
JP2014239186A5 (enrdf_load_stackoverflow)
TW200629490A (en) Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same
JP2010519780A5 (enrdf_load_stackoverflow)
JP2009105393A5 (enrdf_load_stackoverflow)
JP2017108019A5 (enrdf_load_stackoverflow)
TW200740317A (en) Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method
JP2008160160A5 (enrdf_load_stackoverflow)
JP2008544551A5 (enrdf_load_stackoverflow)
JP2011515862A5 (enrdf_load_stackoverflow)
TW200731898A (en) Circuit board structure and method for fabricating the same
JP2006303360A5 (enrdf_load_stackoverflow)
JP2009105311A5 (enrdf_load_stackoverflow)
TW200944072A (en) Method for manufacturing a substrate having embedded component therein
JP2010232333A5 (enrdf_load_stackoverflow)
JP2014239187A5 (enrdf_load_stackoverflow)
JP2009182272A5 (enrdf_load_stackoverflow)
JP2008124077A5 (enrdf_load_stackoverflow)
JP2013033894A5 (enrdf_load_stackoverflow)
TW201720250A (zh) 電路板及其製作方法
JP2012004505A5 (enrdf_load_stackoverflow)