JP2008098429A - Light-emitting device, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device that prevents the occurrence of an electrode short-circuit and contamination on a light-emitting face due to wrapping-around of solder during mounting, and to provide its manufacturing method. <P>SOLUTION: The light-emitting device 10 is provided with a light-emitting element 18, a substrate 15 for mounting the light-emitting element 18, a pair of upper-face electrodes 16a, 16b formed on the upper face of the substrate 15 while being connected with the light-emitting element 18, a pair of lower-face electrodes 27a, 27b formed on the lower face of the substrate 15, and connection parts 22a, 22b for making the upper-face electrodes 16a, 16b conductive with the lower-face electrodes 27a, 27b. The substrate 15 is provided with a pair of protrusion parts 40 protruding from a pair of side faces of the substrate 15. The lower-face electrodes 27a, 27b are respectively extended to each protrusion part 40. In the light-emitting device 10, the lower-face electrodes 27a, 27b are respectively formed at each protrusion part 40. Therefore, if only the protrusion parts 40 are respectively made into contact with solder 28 when mounting the light-emitting element to a mounting substrate 30, it is possible to make the light-emitting device 10 conductive with the mounting substrate 30. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a light emitting device, and more particularly, to a thin light emitting device suitable for a liquid crystal backlight.

  2. Description of the Related Art A light emitting device incorporating one or a plurality of light emitting diodes is often used as a light emitting device for a backlight of a liquid crystal screen such as a cellular phone. In a light emitting device for a backlight, there is a case in which a small size, particularly a thin shape, is mounted and the light emitting device is mounted on a mounting board while being laid down. The light-emitting device mounted in this way emits light from the side surface of the light-emitting device when observed from the upper surface side of the mounting substrate, and light spreads in a direction parallel to the mounting surface of the mounting substrate. By arranging the light guide plate on the side surface (light emitting surface) of the light emitting device, a backlight that uniformly illuminates a wide surface can be obtained.

As a light emitting device suitable for a backlight, a device in which 1 to 3 light emitting diodes are mounted on a submount and the light emitting diodes are covered with a convex lens made of a semi-cylindrical epoxy resin is known (for example, Patent Document 1 and 2). Since such a light emitting device with a convex lens does not include a reflection frame, it is particularly suitable for downsizing and thinning.
JP 2001-177156 A JP 2003-234507 A

  When a light emitting device or the like is mounted on a mounting substrate, soldering is performed by solder reflow. In this method, first, solder paste is applied to a predetermined position of the mounting substrate 30, and then the light emitting device 10 is positioned on the solder paste. In this method, the light emitting device 10 is mounted by placing them together and then melting the solder. In light emitting devices such as Patent Documents 1 and 2, with the miniaturization of the light emitting device, a slight spread of molten solder at the time of reflow is a region where the solder should not contact, for example, contact with an adjacent electrode, There is a risk of spreading from the substrate body to the light emitting surface and making contact. This causes problems such as a short circuit between the electrodes and contamination of the light emitting surface. Even if the light emitting device 10 is slightly displaced from the predetermined position when the light emitting device 10 is placed, the solder easily goes around to an undesired portion such as the light emitting surface of the light emitting device at the time of reflow. It was also a cause of increasing the incidence of good products.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a light emitting device and a method for manufacturing the same that can prevent electrode short-circuiting and contamination of the light emitting surface due to solder wrapping during mounting.

  The light emitting device of the present invention includes a light emitting element, a substrate for mounting the light emitting element, a pair of upper surface electrodes formed on the upper surface of the substrate and connected to the light emitting element, and formed on the lower surface of the substrate. A light-emitting device including a pair of lower surface electrodes and a connection portion that conducts between the upper surface electrode and the lower surface electrode, wherein the substrate includes a pair of projecting portions projecting from a pair of side surfaces of the substrate. The lower surface electrode is extended to the projecting portion.

In the light emitting device of the present invention, the lower surface electrode is formed on the protruding portion that protrudes in the longitudinal direction of the substrate. Therefore, when mounting on the mounting substrate, the light emitting device and the mounting substrate can be obtained by contacting only the protruding portion with the solder. Can be conducted. Thereby, the solder does not come into contact with the substrate body, and therefore it is possible to effectively prevent the solder from reaching the light emitting surface of the transparent resin layer.
Further, in the mounting by solder reflow, even if the positioning accuracy of the light emitting device with respect to the solder paste is somewhat lowered, the solder is less likely to turn around as long as the protruding portion protrudes from the main body of the substrate, and the defective product generation rate can be reduced.

  The method for manufacturing a light emitting device of the present invention includes a step of stacking a first substrate on a lower surface side of a second substrate having a plurality of slots formed substantially in parallel to form a stacked substrate, and an upper surface of the stacked substrate. Forming a plurality of through holes penetrating from the bottom surface to the bottom surface, plating the inside of the through holes, placing a filling material and forming a connection portion, and forming the connection on the top surface of the multilayer substrate Forming a top electrode in contact with the upper end of the portion, forming a bottom electrode in contact with the lower end of the connection portion on the lower surface of the multilayer substrate, and mounting a light emitting element on the upper surface of the multilayer substrate; And a step of cutting the substrate in a direction substantially perpendicular to the slot and separating the substrate into individual light emitting devices.

  In the manufacturing method of the present invention, a light emitting device including a substrate having a protruding portion is formed by stacking two substrates after forming a slot on a second substrate and finally cutting only in a direction perpendicular to the slot. It can be formed relatively easily and at the same time.

  The light-emitting device of the present invention can prevent electrode short-circuiting and contamination of the light-emitting surface due to solder wrapping during mounting. In addition, the method for manufacturing a light emitting device of the present invention is suitable for manufacturing the above light emitting device, and has an effect of simultaneously manufacturing a large number of light emitting devices.

<Embodiment 1>
The light emitting device 10 of the present embodiment includes a first substrate 12 and a second substrate 14 that have a long dimension in the X direction and a short dimension in the Y direction, as shown in FIGS. 1 and 2A to 2D. Yes. These substrates are bonded with an adhesive member 36 interposed between the upper surface 12a of the first substrate 12 and the lower surface 14b of the second substrate 14 to form a stacked substrate 15 stacked in the Z direction.
Since the dimension 12X in the X direction of the first substrate 12 is longer than the dimension 14X in the X direction of the second substrate 14, when the first substrate 12 and the second substrate 14 are stacked, the protruding portion 40 of the first substrate 12 is The protrusion amount 40X protrudes from the second substrate 14.
The dimension 12Y in the Y direction of the first substrate 12 is substantially equal to the dimension 14Y in the Y direction of the second substrate 14, and the first substrate 12 and the second substrate 14 are stacked substantially flush with each other in the Y direction. can do.

A pair of upper surface electrodes 16a and 16b are formed on the upper surface 14a of the second substrate 14, and a light emitting element 18 (for example, a light emitting element) is formed on a mounting portion (die pad) of the light emitting element 18 as a part of the upper surface electrode 16a. Diode) is fixed. The light emitting element 18 is electrically connected to the upper surface electrodes 16a and 16b by the conductive wires 38a and 38b.
The upper surface 14a of the second substrate 14 is covered with a transparent resin layer 20 made of a transparent resin, and protects the light emitting element 18 from the external environment. In the present embodiment, by forming the light emitting surface 42 of the transparent resin layer 20 into a cylindrical lens protruding in the Z direction, light spreading in the YZ plane from the light emitting element 18 can be efficiently extracted in the Z direction. .

  A through hole 34 penetrating from the lower surface 12b of the first substrate 12 to the upper surface 14a of the second substrate 14 is formed immediately below the upper surface electrodes 16a and 16b. The through holes 34 are plated on the inner surface and then filled with a filling material to form the connecting portions 22a and 22b. The connecting portions 22a and 22b are sealed by the upper surface electrodes 16a and 16b and the lower surface electrodes 27a and 27b.

  Two lower surface electrodes 27a and 27b are formed from the upper surface 12a of the first substrate 12 through the side surface 12c to the lower surface 12b. The lower surface electrodes 27 a and 27 b are in contact with the connection portions 22 a and 22 b at two locations between the first substrate 12 and the second substrate 14 and the lower surface 12 b side of the first substrate 12. The two lower surface electrodes 27 a and 27 b are separated by the upper surface 12 a and the lower surface 12 b of the first substrate 12. Further, an insulating adhesive material is used for the adhesive member 36 in order to avoid a short circuit between the lower surface electrodes 27a and 27b.

As shown in FIG. 1, in the light emitting device 10 of the present invention, the protrusion 40 in the longitudinal direction (X direction) of the first substrate 12 protrudes from the second substrate 14. Only the protruding portion 40 can be brought into contact with the solder 28 to establish electrical connection between the light emitting device 10 and the mounting substrate 30. Thereby, the solder 28 does not come into direct contact with the second substrate 14, and therefore it is possible to prevent the solder 28 from reaching the light emitting surface 42 of the resin layer 20.
In addition, in the mounting by solder reflow, even if the positioning accuracy of the light emitting device 10 with respect to the solder paste is somewhat lowered, the solder 28 is less likely to turn around as much as the protruding portion 40 of the first substrate 12 protrudes from the second substrate 14. The rate of non-defective products can be reduced.

  The spread of the solder 28 in the Z direction is such that it reaches the middle of the second substrate 14 around the first substrate 12. This is because when the light emitting device 10 of the present invention is combined with a light guide plate, the entire transparent resin layer 20 can be fitted into the light guide plate, so that light from the light emitting element 18 enters the light guide plate without leakage. This is advantageous in that it can be easily aligned with the light guide plate.

  Since the lower surface electrodes 27a and 27b are in contact with the connection portions 22a and 22b between the first substrate 12 and the second substrate 14, they serve as heat dissipation paths for releasing heat that tends to be trapped inside the connection portions 22a and 22b to the outside. It is valid. Thereby, the bad influence by heat, such as the multilayer substrate 15 of the semiconductor light-emitting device 10, warping can be suppressed.

Next, a method for manufacturing the light emitting device according to this embodiment will be described.
(1. Production of laminated substrate 15)
FIG. 3 shows a stage before the first substrate 12 and the second substrate 14 are stacked. The illustrated first substrate 12 and second substrate 14 can form a plurality of light emitting devices 10 simultaneously.
On the first substrate 12, a plurality of (two in this example) slots 120 that are long in the Y direction are formed in parallel. On the upper surface 12a and the lower surface 12b of the first substrate 12 and the inner wall of the slot 120, a lower surface electrode 27 (which is later separated into lower surface electrodes 27a and 27b) made of a continuous metal film is formed. The lower surface electrode 27 is separated between adjacent slots 120 on the upper surface 12a side by a gap extending in the Y direction. The first substrate 12 is exposed from this separated portion.

  Also on the second substrate 14, a plurality (two in this example) of slots 140 that are long in the Y direction are formed in parallel. The slot 140 has the same dimension in the Y direction and is larger in the X direction than the slot 120 of the first substrate 12. In addition, an upper surface electrode 16 made of a continuous metal film (later separated into upper surface electrodes 16a and 16b) is also formed on the upper surface 14a of the first substrate 14. Note that a metal film is not formed on the lower surface 14 b of the first substrate 14 and the inner wall of the slot 140.

The first substrate 12 and the second substrate 14 of FIG. 3 are stacked with the adhesive layer 36 interposed therebetween to form a stacked substrate 15 as shown in FIG. 4A. At this time, as viewed from the Z direction, the center line in the longitudinal direction (Y direction) of the slot 120 of the first substrate 12 and the center line in the longitudinal direction (Y direction) of the slot 140 of the second substrate 14 coincide. As described above, the first substrate 12 and the second substrate 14 are aligned and stacked. If this alignment is shifted, the left and right protruding amounts 40X of the protruding portion 40 of the multilayer substrate 15 become non-uniform.
When the light emitting device 10 is mounted, the mounting is performed with the center of the first substrate 12 as a reference. However, if the left and right protrusion amounts 40X are different, the center of the first substrate 12 and the center of the second substrate 14 are shifted. Become. Therefore, no matter how accurate the mounting is, there arises a problem that the centers of the light emitting element 18 and the allied resin layer 20 on the second substrate 14 are displaced from the positions at the time of design. Therefore, in stacking the first substrate 12 and the second substrate 14, it is preferable to align the center of the slot as accurately as possible.

(2. Processing of laminated substrate 15)
Through holes 34 penetrating from the lower surface of the first substrate 12 to the upper surface of the second substrate 14 are formed in the laminated substrate 15 laminated as shown in FIG. 4A (see FIG. 4B). Two through holes 34 are formed side by side in the X direction between the slot 140 and the slot 140 of the second substrate 14. In particular, the position is determined so that each through hole 34 penetrates the lower surface electrode 27 formed on the upper surface 12 a side of the first substrate 12. When a plurality of light emitting devices 10 are formed at the same time, a pair of through holes arranged in the X direction are arranged in parallel in the Y direction. Since a pair of through holes are distributed to one light emitting device 10, a necessary number of through holes are formed according to the number of light emitting devices 10 to be formed.

  The formed through hole 34 is provided with a plating layer (not shown) on the inner surface of the through hole 34, and then filled with a filling material (metal paste or epoxy resin) inside the through hole 34. Both ends of the connecting portions 22a and 22b made of the plating layer and the hole filling material are covered with a metal film. The metal film is electrically connected to the plating layer, and further integrated with the upper surface electrode 16 (reference numerals 16a and 16b in the figure) and the lower surface electrode 27 (reference numerals 27a and 27b in the figure). Thereby, the upper surface electrode 16 and the lower surface electrode 27 are electrically connected via the connection parts 22a and 22b (refer FIG. 4C).

  The lower surface electrode 27 formed on the lower surface 12b of the first substrate 12 is partially removed and separated into two lower surface electrodes 27a and 27b as shown in FIG. 2D. Further, the upper surface electrode 16 formed on the upper surface 14a of the second substrate 14 is also partially removed and separated into two upper surface electrodes 27a and 27b, and is formed into a shape as shown in FIG. 2A. In particular, one upper surface electrode 16a is formed to have a rectangular die pad.

(3. Mounting of light emitting element 18)
Next, the light emitting element 18 is mounted on the obtained multilayer substrate 15. The light emitting element 18 is die-bonded to the die pad of the upper surface electrode 16a. And the electrode (not shown) of the light emitting element 18 and the upper surface electrodes 16a and 16 of the laminated substrate 15 are wire-bonded by the conductive wires 38a and 38b (see FIG. 4D). When a plurality of light emitting devices 10 are manufactured simultaneously, a plurality of die pads for the upper surface electrode 16a can be formed along the Y direction, and the light emitting element 18 can be mounted on each die pad (see FIG. 5).

(4. Formation of transparent resin layer 20)
A transparent resin layer 20 for sealing the light emitting element 18, the upper surface electrodes 16a and 16b, and the conductive wires 38a and 38b is formed on the upper surface of the multilayer substrate 15 (see FIGS. 4E and 5). As shown in FIG. 5, according to the method of the present invention, a transparent resin layer can be provided simultaneously on a plurality (two in this example) of light emitting elements 18.
The transparent resin layer 20 can be formed by a method such as transfer molding, compression molding, injection molding, or the like, using a lens-shaped mold. The transparent resin layer 20 may contain a phosphor for converting the wavelength of light emitted from the light emitting element 18 or may contain a light diffusing material. Furthermore, it is also possible to apply a resin layer including a phosphor and a wavelength conversion member around the light emitting element 18 and make a lens with a transparent resin so as to cover the resin layer. The lens effect can be enhanced by using a two-layer structure.

(5. Division into light-emitting device 10)
Finally, the laminated substrate 15 is cut along the cutting line C in FIG. The cutting line C is set so that each light emitting device 10 after cutting includes one light emitting element 18 and a pair of connection portions 22a and 22b. After cutting, the light emitting device 10 is obtained as shown in FIG. 4F.

  In the manufacturing method of the present embodiment, two substrates having slots with different widths are stacked, and finally, the protruding portion 40 of the first substrate 12 is removed from the second substrate 14 by cutting in a direction perpendicular to the slots. In addition, a large number of light emitting devices each including the laminated substrate 15 that is protruded can be formed. Further, the laminated substrate 15 including the first substrate 12 and the second substrate 14 having different lengths can be easily manufactured by laminating substrates having slots having different widths. Furthermore, even if the light emitting device 10 is manufactured in a small size, it can be easily manufactured by manufacturing it with a substrate having a dimension and shape that is relatively easy to handle and finally cutting in parallel.

  Hereinafter, each configuration of the light emitting device 10 will be described in detail.

(First substrate 12, second substrate 14 / upper surface electrodes 16a and 16b, lower surface electrodes 27a and 27b)
The first substrate 12 and the second substrate 14 are not particularly limited as long as the materials have appropriate mechanical strength and insulating properties. For example, BT resin, glass epoxy, or the like can be used. Moreover, what laminated | stacked the multilayered epoxy resin sheet may be used. Moreover, it is preferable that the upper surface electrodes 16a and 16b and the lower surface electrodes 27a and 27b formed on the first substrate 12 and the second substrate 14 are metal layers mainly composed of Cu, for example, constituted by Cu / Ni / Ag. can do.

(Connection 22a, 22b)
The connecting portions 22a and 22b are composed of a plating layer formed on the inner surface and a hole filling material filled inside. The plating layer is formed from a metal plating film formed by electroless plating. The through hole 34 can be formed by filling a conductive material such as copper paste or silver paste, which is a filling material, or an insulating member such as epoxy resin. The metal paste is sealed in the through hole by the upper surface electrodes 16a and 16b and the lower surface electrodes 27a and 27b.
Note that the plated layer may be formed thick to fill the entire through hole 34. In this case, the plated layer also serves as a filling material.

(Adhesive member 36)
The adhesive member 36 is formed of an insulating adhesive or adhesive sheet that has good adhesion to the first substrate 12 and the second substrate 14 and can insulate between the lower surface electrodes 27a and 27b and the connection portions 22a and 22b. be able to.

(Light emitting element 18)
A semiconductor light emitting element is preferably used for the light emitting element 18. In particular, when a white light emitting device for a backlight is manufactured, a method of converting a part of emitted light into another color by a phosphor using a light emitting diode that emits a short wavelength to the light emitting element can be adopted. Below, the combination of the light emitting diode which can be utilized for a white light-emitting device and fluorescent substance is demonstrated.

As a light-emitting diode suitable for constituting a white light-emitting device, used after using nitride semiconductor _{(In X Al Y Ga 1-} X-Y N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) that the be able to. This light emitting diode has In _x Ga _1-x N (0 <x <1) as a light emitting layer, and the light emission wavelength can be arbitrarily changed from about 365 nm to 650 nm depending on the degree of mixed crystal.
In the case of emitting white light, considering the complementary color relationship with the light emitted from the phosphor, the emission wavelength of the light emitting diode 8 is preferably set to 400 nm or more and 530 nm or less, and set to 420 nm or more and 490 nm or less. It is more preferable. An LED chip that emits light having a wavelength in the ultraviolet region shorter than 400 nm can also be applied by selecting the type of phosphor.

The phosphor may be any material that absorbs light from the semiconductor light-emitting diode 8 having a nitride-based semiconductor as a light-emitting layer and converts the light into light having a different wavelength. For example, it is mainly activated by nitride-based phosphors / oxynitride-based phosphors mainly activated by lanthanoid elements such as Eu and Ce, lanthanoid-based phosphors such as Eu, and transition metal elements such as Mn. Alkaline earth halogen apatite phosphor, alkaline earth metal borate phosphor, alkaline earth metal aluminate phosphor, alkaline earth silicate, alkaline earth sulfide, alkaline earth thiogallate, alkaline earth nitriding Selected from rare earth aluminates mainly activated by lanthanoid elements such as silicon, germanate, or Ce, and organic and organic complexes mainly activated by lanthanoid elements such as rare earth silicate or Eu It is preferable that it is at least any one or more.
Nitride-based phosphors mainly activated with lanthanoid elements such as Eu and Ce are M ₂ Si ₅ N ₈ : Eu, MAlSiN ₃ : Eu, MAl _1-X B _X SiN ₃ : Eu (M is Sr , Ca, Ba, Mg, and Zn. 0 <X <1). In addition to M ₂ Si ₅ N ₈ : Eu, MSi ₇ N ₁₀ : Eu, M _1.8 Si ₅ O _0.2 N ₈ : Eu, M _0.9 Si ₇ O _0.1 N ₁₀ : Eu (M Is at least one selected from Sr, Ca, Ba, Mg, and Zn.
An oxynitride phosphor mainly activated by a lanthanoid element such as Eu or Ce is MSi ₂ O ₂ N ₂ : Eu (M is at least one selected from Sr, Ca, Ba, Mg, Zn) Etc.).
Eu, sialon phosphors activated mainly with lanthanoid elements such as Ce _{is, M p / 2 Si 12-} p-q Al p + q O q N 16-p: Ce, M-Al-Si-O-N (M is at least one selected from Sr, Ca, Ba, Mg, and Zn. Q is 0 to 2.5, and p is 1.5 to 3).
Alkaline earth halogen apatite phosphors mainly activated by lanthanoid compounds such as Eu and transition metal elements such as Mn include M ₅ (PO ₄ ) ₃ X: R (M is Sr, Ca, Ba). X is at least one selected from F, Cl, Br and I. R is any one of Eu, Mn, Eu and Mn. Etc.).
The alkaline earth metal borate phosphor has M ₂ B ₅ O ₉ X: R (M is at least one selected from Sr, Ca, Ba, Mg, Zn. X is F, Cl , Br, or I. R is Eu, Mn, or any one of Eu and Mn.).
Alkaline earth metal aluminate phosphors include SrAl ₂ O ₄ : R, Sr ₄ Al ₁₄ O ₂₅ : R, CaAl ₂ O ₄ : R, BaMg ₂ Al ₁₆ O ₂₇ : R, BaMg ₂ Al ₁₆ O ₁₂ : R, BaMgAl ₁₀ O ₁₇ : R (R is Eu, Mn, or any one of Eu and Mn).
Examples of the alkaline earth sulfide phosphor include La ₂ O ₂ S: Eu, Y ₂ O ₂ S: Eu, and Gd ₂ O ₂ S: Eu.
Examples of rare earth aluminate phosphors mainly activated with lanthanoid elements such as Ce include Y ₃ Al ₅ O ₁₂ : Ce, (Y _0.8 Gd _0.2 ) ₃ Al ₅ O ₁₂ : Ce, Y _{3 (Al 0.8 Ga 0.2) 5 O} 12: Ce, and the like (Y, Gd) 3 (Al , Ga) YAG -based phosphor represented by the composition formula of _{5 O 12.} Further, there are Tb ₃ Al ₅ O ₁₂ : Ce, Lu ₃ Al ₅ O ₁₂ : Ce, etc. in which a part or all of Y is substituted with Tb, Lu or the like.
Other phosphors include ZnS: Eu, Zn ₂ GeO ₄ : Mn, MGa ₂ S ₄ : Eu (M is at least one selected from Sr, Ca, Ba, Mg, Zn. X is At least one selected from F, Cl, Br, and I).
The phosphor described above contains at least one selected from Tb, Cu, Ag, Au, Cr, Nd, Dy, Co, Ni, and Ti instead of Eu or in addition to Eu as desired. You can also.
Moreover, it is fluorescent substance other than the said fluorescent substance, Comprising: The fluorescent substance which has the same performance and effect can also be used.
These phosphors can use phosphors having emission spectra in yellow, red, green, and blue by the excitation light of the light-emitting element, and emission spectra in yellow, blue-green, orange, etc., which are intermediate colors between them. A phosphor having the following can also be used. By using these phosphors in various combinations, it is possible to manufacture surface-mounted light-emitting devices having various emission colors.
For example, using a GaN-based compound semiconductor that emits blue light, a Y ₃ Al ₅ O ₁₂ : Ce or (Y _0.8 Gd _0.2 ) ₃ Al ₅ O ₁₂ : Ce fluorescent material is irradiated to convert the wavelength. Do. A surface-mount light-emitting device that emits white light with a mixed color of light from a light-emitting element and light from a phosphor can be provided.
For example, CaSi ₂ O ₂ N ₂ : Eu or SrSi ₂ O ₂ N ₂ : Eu that emits light from green to yellow, and (Sr, Ca) ₅ (PO ₄ ) ₃ Cl: Eu that emits blue light as a phosphor. By using a phosphor 60 composed of Ca ₂ Si ₅ N ₈ : Eu or CaAlSiN ₃ : Eu that emits red light, a surface-mounted light-emitting device that emits white light with good color rendering can be provided. . This uses the three primary colors of red, blue, and green, so the desired white light can be achieved simply by changing the blend ratio of the first phosphor and the second phosphor. Can do.

(Transparent resin layer 20)
The material of the transparent resin layer 20 is not particularly limited as long as it is a material that transmits the light emitted from the light emitting element 18 and hardly changes its quality during use. For example, resins such as epoxy, silicone, modified silicone, urethane resin, oxetane resin, acrylic, polycarbonate, and polyimide can be used. Furthermore, glass can be used in addition to the resin. A filler or a diffusing material may be dispersed in the first transparent resin layer 12. In addition, since the transparent resin layer 20 is easy to receive the heat | fever of the light emitting element 18, it is preferable that it is resin with favorable heat resistance. For example, it is preferable to use an epoxy, a silicone resin, a modified silicone resin, or an oxetane resin. The viscosity of the transparent resin layer 20 is preferably 100 to 2000 mPa · s before curing. Here, “viscosity” refers to a value measured at room temperature using a conical plate type rotational viscometer. In addition, the transparent resin layer 20 is desirably a resin having a hardness that can maintain the shape under curing conditions of 80 ° C. to 180 ° C. and several minutes to several hours.

In the present embodiment, a cylindrical lens is formed on the transparent resin layer 20, but this lens preferably has a large lens diameter in a direction parallel to the mounting surface. This is because the direction parallel to the mounting surface needs to control the light distribution characteristics higher than the direction perpendicular to the mounting surface.
Moreover, when forming a white light emitting device using a phosphor, it is preferable to mix the phosphor into the transparent resin layer 20. The phosphor may be uniformly dispersed in the transparent resin layer, but in particular, a two-layer structure that is unevenly distributed in the vicinity of the light emitting element 18 is preferable because color unevenness due to the viewing direction can be suppressed.

<Embodiment 2>
As shown in FIGS. 6A to 6D, the light emitting device 10 according to the present embodiment is the same as the embodiment except that the upper surface 12a and the side surface 12c of the first substrate 12 are not covered with the lower surface electrodes 27a and 27b. Same as 1.
Such a difference is due to the difference between “1. Production of laminated substrate 15” and “5. Division into light-emitting device 10” in the manufacturing method of the first embodiment. Below, these two processes in this Embodiment are demonstrated.

1. Production of Multilayer Substrate 15 As shown in FIGS. 7A and 7B, the second substrate 14 is formed with a plurality of (in this example, two) slots 140 that are long in the Y direction. There are no slots formed. And the lower surface electrode 27 is formed in the 1st board | substrate 12 only in the lower surface 12b side.
The first substrate 12 and the second substrate 14 are stacked with the adhesive layer 36 interposed therebetween to form the stacked substrate 15. Since the first substrate 12 has no slots, it is not necessary to align the slots. Therefore, it is preferable in that there is no possibility that the center of the first substrate 12 and the center of the second substrate 14 of the light emitting device 10 are shifted.

5. To split the split individual light emitting device 10 to the light emitting device 10 includes a cut line C ₁ as shown in Figure 8, along the cutting line C _2, which is orthogonal to the C _1, cutting the laminated substrate 15 in two directions To do. For the first substrate 12 is not provided with slots, it is necessary to cut at the cutting line C _2. Cutting line C ₂ is by matching with the center line in the longitudinal direction (Y direction) of the slot 140 of the second substrate 14, the left and right projection amount 40X of the protrusion 40 of the multilayer substrate 15 are equal.

  In the manufacturing method of the present embodiment, the substrate on which the slot is formed is stacked on the substrate without the slot, and finally, the slot is cut in the center line in the longitudinal direction of the slot and in the direction perpendicular to the center line. A large number of light emitting devices including the laminated substrate 15 in which the protruding portions 40 of the one substrate 12 are protruded from the second substrate 14 can be formed at the same time. Further, the laminated substrate 15 composed of the first substrate 12 and the second substrate 14 having different lengths can be easily manufactured by using a substrate having slots. Furthermore, even if the light emitting device 10 is manufactured in a small size, it can be easily manufactured by manufacturing it with a substrate having a dimension and shape that is relatively easy to handle and finally cutting in parallel. In addition, it is possible to obtain a light emitting device in which the centers of the first substrate 12 and the second substrate 14 are not easily displaced and the mounting accuracy can be improved.

<Embodiment 3>
In the light emitting device 10 according to the present embodiment, as shown in FIGS. 9A to 9D, the first substrate 12 and the second substrate 14 are integrally formed. Therefore, unlike the first embodiment, the upper surface 12a and the side surface 12c of the first substrate 12 are not covered with the lower surface electrodes 27a and 27b. In the present embodiment, the adhesive member 36 as in the first and second embodiments is not provided. Except for these configurations, the second embodiment is the same as the first and second embodiments.
Due to such differences, in the manufacturing methods of the first and second embodiments, a single-layer substrate is processed to form a similar shape instead of the laminated substrate 15 in which two substrates are laminated.

Fabrication of Single-layer Substrate FIG. 10 shows a single-layer substrate 150 made of a single material. Instead of the slot 140 of the second substrate 14 in FIGS. 7A and 7B, a spot facing that is dug in the middle of the thickness of the substrate. Hole 44 is formed. The counterbore hole 44 has a long and narrow shape extending in the Y direction. Thereby, a single layer substrate 150 having a cross section similar to that of FIG. 7B is obtained. In the present specification, a continuous portion of the single-layer substrate 150 that does not reach the spot facing holes 44 is referred to as a first substrate, and an island-like portion separated by the spot facing holes 44 is referred to as a second substrate 14.

The single-layer substrate 150 formed in this way is transparent after the connection portions 22a and 22b, the upper surface electrodes 16a and 16b, the lower surface electrodes 27a and 27b are formed and the light emitting element 18 is mounted, as in the first embodiment. The resin layer 20 is formed.
The division into the light emitting device 10 is completely the same as the second embodiment, the cutting line C ₁ in FIG. 8, along the cutting line C _2, cutting the laminated substrate 15 in two directions. Cutting line C ₂ is by matching with the center line in the longitudinal direction (Y direction) of the counterbore holes 44, left and right projection amount 40X of the protrusion 40 of the multilayer substrate 15 are equal.

  In the manufacturing method of the present embodiment, the elongated counterbore hole 44 is formed in the substrate, and finally the first substrate is cut by cutting the longitudinal centerline of the counterbore hole in a direction perpendicular to the centerline. A large number of light emitting devices including the laminated substrate 15 in which the twelve protruding portions 40 are protruded from the second substrate 14 can be formed simultaneously. Further, even if the light emitting device 10 is manufactured in a small size, it can be easily manufactured by manufacturing it with a substrate having a dimension and shape that is relatively easy to handle, and finally cutting in parallel. And since the center of the 1st board | substrate 12 and the 2nd board | substrate 14 does not shift | deviate, the light-emitting device which can improve a mounting precision can be obtained.

  Embodiments 1 to 3 above show examples of the light emitting device of the present invention, and do not limit the present invention. For example, in the first to third embodiments, the lower surface side of the protruding portion 40 is flush with the lower surface 12b of the first substrate 12, but this is not flush with the protruding portion 40 but the lower surface 12b of the first substrate 12. It may be located on the upper surface side. In the first to third embodiments, the thickness of the protrusion 40 in the Y direction is the same as the thickness of the first substrate 12 in the Y direction, but may be different.

FIG. 3 is a perspective view showing a mounted state of the light emitting device according to the first embodiment. 1 is a schematic top view of a light emitting device according to a first embodiment. 1 is a schematic front view of a light emitting device according to a first embodiment. 1 is a schematic side view of a light emitting device according to a first embodiment. 1 is a schematic bottom view of a light emitting device according to a first embodiment. FIG. 3 is a schematic perspective view illustrating a method for manufacturing a substrate of the light emitting device according to the first embodiment. FIG. 5 is a schematic cross-sectional view illustrating the method for manufacturing the light emitting device according to the first embodiment. FIG. 5 is a schematic cross-sectional view illustrating the method for manufacturing the light emitting device according to the first embodiment. FIG. 5 is a schematic cross-sectional view illustrating the method for manufacturing the light emitting device according to the first embodiment. FIG. 5 is a schematic cross-sectional view illustrating the method for manufacturing the light emitting device according to the first embodiment. FIG. 5 is a schematic cross-sectional view illustrating the method for manufacturing the light emitting device according to the first embodiment. FIG. 5 is a schematic cross-sectional view illustrating the method for manufacturing the light emitting device according to the first embodiment. FIG. 3 is a schematic perspective view illustrating a method for dividing the light emitting device according to the first embodiment. FIG. 6 is a schematic top view of a light emitting device according to a second embodiment. FIG. 3 is a schematic front view of a light emitting device according to a second embodiment. FIG. 3 is a schematic side view of a light emitting device according to a second embodiment. It is a schematic bottom view of the light-emitting device concerning Embodiment 2. FIG. 10 is a schematic perspective view illustrating a method for manufacturing a substrate of a light emitting device according to Embodiment 2. FIG. 10 is a schematic cross-sectional view illustrating a method for manufacturing a substrate of a light emitting device according to Embodiment 2. FIG. FIG. 6 is a schematic perspective view illustrating a method for dividing a light emitting device according to a second embodiment. FIG. 6 is a schematic top view of a light emitting device according to a third embodiment. FIG. 6 is a schematic front view of a light emitting device according to a third embodiment. FIG. 6 is a schematic side view of a light emitting device according to a third embodiment. FIG. 6 is a schematic bottom view of a light emitting device according to a third embodiment. 6 is a schematic cross-sectional view illustrating a method for manufacturing a substrate of a light emitting device according to Embodiment 3. FIG.

Explanation of symbols

  10 light emitting device, 12 first substrate, 12a upper surface of first substrate, 12b lower surface of first substrate, 14 second substrate, 14a upper surface of first substrate, 14b lower surface of first substrate, 15 laminated substrate, 16 before separation Upper electrode, 16a, 16b Upper electrode, 18 Light emitting diode, 20 Transparent resin layer, 22a, 22b Connection part, 27 Lower electrode before separation, 27a, 27b Lower electrode, 28 Solder, 34 Through hole, 36 Adhesive member, 38 Conductive 40 projecting part, 42 light emitting surface, 44 spot facing, 150 single layer substrate, 120 slot of the first substrate, 140 slot of the second substrate,

Claims (7)

A light emitting element;
A substrate for mounting the light emitting element;
A pair of upper surface electrodes formed on the upper surface of the substrate and connected to the light emitting element;
A pair of lower surface electrodes formed on the lower surface of the substrate;
A light-emitting device comprising: a connecting portion for conducting the upper surface electrode and the lower surface electrode;
The substrate includes a pair of protrusions protruding from a pair of side surfaces of the substrate,
The light emitting device, wherein the lower surface electrode extends to the protruding portion. The substrate comprises a first substrate having a substantially long rectangular shape, and a second substrate having a substantially long rectangular shape disposed on the upper surface of the first substrate,
The first substrate has a longer dimension in the longitudinal direction than the second substrate,
2. Thus, both end portions in the longitudinal direction of the first substrate protrude in the longitudinal direction from both end portions in the longitudinal direction of the second substrate to constitute the projecting portion. Light-emitting device.   The light emitting device according to claim 2, wherein the first substrate and the second substrate are formed separately and are laminated by an adhesive member. The connection part includes a conductive material formed in a through hole penetrating from the upper surface of the first substrate to the lower surface of the second substrate;
4. The light emitting device according to claim 3, wherein the lower surface electrode extends between the first substrate and the second substrate through the periphery of the protruding portion and contacts the connection portion. .   The light emitting device according to claim 2, wherein the first substrate and the second substrate are integrally formed. Forming a laminated substrate by laminating the first substrate on the lower surface side of the second substrate having a plurality of slots formed substantially in parallel;
Forming a plurality of through holes penetrating from the upper surface to the lower surface of the multilayer substrate;
Forming a connection portion containing a conductive material inside the through hole; and forming an upper surface electrode in contact with an upper end of the connection portion on the upper surface of the multilayer substrate;
Forming a lower surface electrode in contact with the lower end of the connection portion on the lower surface of the multilayer substrate;
Mounting a light emitting element on the top surface of the multilayer substrate;
A step of cutting the substrate in a direction substantially perpendicular to the slot and separating the substrate into individual light-emitting devices. A substrate for a light emitting device for mounting a light emitting element,
A pair of upper surface electrodes formed on the upper surface of the substrate and connected to the light emitting element;
A pair of lower surface electrodes formed on the lower surface of the substrate;
A connection portion for conducting the upper surface electrode and the lower surface electrode,
The substrate includes a pair of protrusions protruding from a pair of side surfaces of the substrate,
The substrate for a light emitting device, wherein the lower surface electrode extends to the protruding portion.

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