CN111430528B - Light-emitting device and display device thereof - Google Patents
Light-emitting device and display device thereof Download PDFInfo
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- CN111430528B CN111430528B CN201910024270.9A CN201910024270A CN111430528B CN 111430528 B CN111430528 B CN 111430528B CN 201910024270 A CN201910024270 A CN 201910024270A CN 111430528 B CN111430528 B CN 111430528B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The embodiment of the invention provides a light-emitting device and a display device thereof, wherein the light-emitting device comprises a substrate, a pair of positive and negative connecting terminals and at least one LED chip arranged between the positive and negative connecting terminals, wherein the positive and negative connecting terminals are arranged on a light-emitting surface of the substrate and extend to the back surface of the substrate from the light-emitting surface of the substrate along the mounting surface of the substrate.
Description
Technical Field
The invention relates to the technical field of LEDs, in particular to a light-emitting device and a display device thereof.
Background
With the progress of the termination technology, in particular, in a light emitting device which is required to be more compact and thinner, particularly, a side view type light emitting device, various studies have been made on the planarization and downsizing of a substrate and the connection method of a light emitting element and a substrate in order to minimize the occupied space of a chip-scale package itself. For example, a metal member used as a terminal is transferred from a plate-like lead electrode to a metal film directly formed on a base body in an extremely thin film form. Further, flip-chip mounting of the light emitting element on the substrate is gradually being realized, and since most of the metal pins of the mounting method of the die bonding are provided on both end surfaces of the light emitting element, a large amount of soldering space is required for soldering on a board having the same length, and the method of soldering both ends has a problem that stability in secondary mounting on the mounting substrate by solder or accuracy of mounting position is poor.
Disclosure of Invention
The embodiment of the invention provides a light-emitting device and a display device thereof, which mainly solve the technical problems that: the conventional method of soldering both ends has a problem that the stability and the accuracy of the mounting position are poor when the secondary mounting to the mounting substrate by the solder is performed.
To solve the above technical problem, an embodiment of the present invention provides a light emitting device, including: the LED light source comprises a substrate, positive and negative connecting terminals arranged on a light emitting surface of the substrate and at least one LED chip arranged between the positive and negative connecting terminals;
the positive and negative connecting terminals comprise welding surfaces and connecting pins vertically connected with the welding surfaces, the welding surfaces are arranged on the light emitting surface, and the connecting pins at least extend to the back of the substrate from the light emitting surface of the substrate along the mounting surface of the substrate; the mounting surface is a side surface which is perpendicular to the light emergent surface and the back surface of the substrate respectively and is overlapped and contacted with the circuit board when being mounted.
In other embodiments of the present invention, the positive and negative connection terminals are disposed at two ends of the light emitting surface of the substrate.
In other embodiments of the present invention, the bonding surface and the connecting pins form an L-shaped structure, and the connecting pins extend from the light-emitting surface of the substrate to a boundary line between the light-emitting surface and the back surface.
In other embodiments of the present invention, the bonding surface and the connection pins form a structure with a shape of a Chinese character 'ao', and the connection pins extend from the light emitting surface of the substrate and penetrate through the mounting surface of the substrate to be wrapped on the back surface of the substrate.
In other embodiments of the present invention, a groove is provided on the mounting surface at the position of the connection pin, and the connection pin extends along the inner wall of the groove and wraps the back surface of the substrate.
In other embodiments of the present invention, the groove is a corner notch disposed at an adjacent corner position where the light emitting surface of the substrate intersects with the mounting surface of the substrate and/or an adjacent corner position where the back surface of the substrate intersects with the mounting surface of the substrate;
or the groove is a long-strip-shaped U-shaped groove extending from the light emergent surface of the substrate to the back surface of the substrate. .
In other embodiments of the present invention, at least one through hole is disposed at a position of the substrate corresponding to the disposition position of the positive and negative connection terminals, the through hole penetrates from the light emitting surface to the back surface of the substrate, and the positive and negative connection terminals penetrate through the through hole from the light emitting surface of the substrate and wrap the back surface of the substrate.
In other embodiments of the present invention, the light emitting device further includes a sealing member disposed on the light emitting surface of the substrate and covering the at least one LED chip.
In other embodiments of the present invention, the light emitting device further includes a fluorescent layer disposed on the sealing member.
In order to solve the above technical problem, an embodiment of the present invention provides a display device, including a circuit board and at least one light emitting device as described above, where a pad matched with the light emitting device is disposed on the circuit board; when the substrate is installed, the installation surface of the substrate of the light-emitting device is in contact with the bonding pad, and the electrical connection is realized through the connecting pin on the installation surface.
The invention has the beneficial effects that:
according to an embodiment of the present invention, there is provided a light emitting device and a display device thereof, the light emitting device including a substrate, a pair of positive and negative connection terminals, and at least one LED chip disposed between the positive and negative connection terminals, wherein the positive and negative connection terminals are arranged on the light-emitting surface of the substrate and extend from the light-emitting surface of the substrate to the back surface of the substrate along the mounting surface of the substrate, because the positive and negative connecting terminals are arranged to extend to the back along the mounting surface, when workers mount the welding machine, the whole pin welding surface of the positive and negative connecting terminals is in direct contact with the mounting substrate, the surface contact is easier for mounting and welding, and the stability after mounting is also compared with the prior welding mode, its stability is better, and the mode of face contact is also easier, more accurate to the position location simultaneously.
Drawings
Fig. 1 is a schematic structural diagram of a light emitting device according to a first embodiment of the present invention;
fig. 2 is a schematic view of a second structure of a light emitting device according to an embodiment of the invention;
fig. 3 is a schematic view of a third structure of a light emitting device according to an embodiment of the invention;
fig. 4 is a schematic diagram illustrating a fourth structure of a light emitting device according to an embodiment of the invention;
fig. 5 is a schematic structural diagram of a fifth light-emitting device according to an embodiment of the invention;
fig. 6 is a schematic view of a first structure of a substrate according to an embodiment of the invention;
fig. 7 is a schematic diagram illustrating a sixth structure of a light emitting device according to an embodiment of the invention;
fig. 8 is a schematic diagram illustrating a seventh structure of a light emitting device according to an embodiment of the invention;
fig. 9 is a schematic diagram illustrating an eighth structure of a light-emitting device according to an embodiment of the present invention;
fig. 10 is a schematic view of a ninth structure of a light emitting device according to an embodiment of the present invention.
In the drawings, 1 is a light emitting device, 11 is a substrate, 12 is positive and negative connection terminals, 13 is an LED chip, 14 is a sealing member, 15 is a fluorescent layer, 11a is a light emitting surface of the substrate, 11b is a mounting surface of the substrate, 11c is a back surface of the substrate, 12a is a bonding surface, 12b is a connection pin, 111 is a groove, and 112 is a through hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention are described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The first embodiment is as follows:
aiming at the problem that the connection pins of the light emitting device in the prior art are arranged in a manner that the user has low stability and inaccurate positioning during soldering and positioning, the invention provides a novel light emitting device structure, referring to fig. 1, the light emitting device 1 comprises a substrate 11, a pair of positive and negative connection terminals 12 and at least one LED chip 13, wherein the positive and negative connection terminals 12 are arranged on a light emitting surface 11a of the substrate 11 and extend from the light emitting surface 11a of the substrate 11 to a back surface 11c of the substrate 11 along a mounting surface 11b of the substrate 11, and the at least one LED13 is arranged between the positive and negative connection terminals 12.
The positive and negative connection terminals 12 include soldering surfaces 12a and connection pins 12b perpendicularly connected to the soldering surfaces 12a, the soldering surfaces 12a are disposed on the light emitting surface 11a, and the connection pins 12b extend from the light emitting surface 11a of the substrate 11 along the mounting surface 11b of the substrate 11 to at least the back surface 11c of the substrate 11.
Here, the mounting surface 11b refers to a side surface of the substrate 11 perpendicular to the light emitting surface 11a and the back surface 11c, respectively, and overlapping with the circuit board when mounted.
In this embodiment, the mounting surface 11b of the substrate 11 actually refers to a surface between the light emitting surface 11a and the back surface 11c, wherein one of the two mounting surfaces 11b in mounting contact with the mounting substrate is sometimes defined as the mounting surface, and preferably, the positive and negative connection terminals 12 are disposed on the light emitting surface 11a of the substrate 11 and extend from the light emitting surface 11a of the substrate 11 to the back surface 11c of the substrate 11 along the mounting surface 11b of the substrate 11, and specifically, the conductive layers on the positive and negative connection terminals 12 extend from the light emitting surface 11a of the substrate 11 to sequentially pass through the mounting surface 11b and the back surface 11c, and extend in a direction sequentially passing through an intersection line of the light emitting surface 11a and the mounting surface 11b, and an intersection line of the mounting surface 11b and the back surface 11c, and here, as shown in fig. 2, the positive and negative connection terminals 12 may simultaneously extend from the two mounting surfaces 11b to the back surface 11c, the light-emitting device 1 with the arrangement mode of the positive and negative connection terminals 12 does not need to distinguish the installation surface from the positive and negative electrodes, and can realize conductive communication when in contact welding with an installation substrate on any installation surface, so the arrangement mode is more convenient for welding installation of a user; as shown in fig. 3, it may extend only from the mounting surface 11b to the back surface 11c, and in this way, the positive and negative connection terminals 12 only wrap around one mounting surface, which is relatively simple in production process and low in cost. That is, the soldering surface 12a and the connecting pin 12b form an L-shaped structure, and the connecting pin 12b extends from the light emitting surface 11a of the substrate to the boundary line between the light emitting surface 11a and the back surface 11 c.
In this embodiment, the positive and negative connection terminals 12 may be specifically disposed at two ends of the light emitting surface 11a of the substrate 11, the LED chip 13 is disposed between the two connection pins 13, and the positive and negative connection terminals 12 may be concave, as shown in fig. 3, or may even be in a shape of a "hui", as shown in fig. 2. The positive and negative connection terminals 12 are disposed at two end portions, and the extending portions of the connection pins 12 extend from the end portion of the light emitting surface 11a to the end portion of the back surface 11c along the end portion of the mounting surface 11b, preferably, the extending portions extend to the back surface 11c, one of the extending portions extends to the intersecting line of the mounting surface 11b and the back surface 11c, and the other extends to the back surface 11c, that is, the conductive layer on the positive and negative connection terminals 12 is wrapped on the back surface 11c, specifically, at least one half of the back surface 11c may be wrapped, as shown in fig. 4 and 5.
In the present embodiment, as shown in fig. 6, in order to realize that the light emitting device 1 is flat and in close contact with the mounting substrate when being mounted on the mounting substrate, at least one groove 111 is further provided on the substrate, the groove 111 is specifically provided at the position of the positive and negative connection terminals 12 and is formed by recessing along the surface of the substrate 11, and the depth of the groove 11 is greater than or equal to the thickness of the positive and negative connection terminals 12.
In practical applications, the groove 111 may be configured as an elongated U-shaped groove, the elongated U-shaped groove is formed by using a side surface as a reference surface and being recessed into the substrate 11 along a vertical direction of the side surface, the elongated U-shaped groove further penetrates from the light emitting surface 11a of the substrate 11 to the back surface 11c of the substrate 11, as shown in fig. 7 in detail, at this time, the positive and negative connection terminals 12 extend along an inner wall of the elongated U-shaped groove and wrap the back surface 11c of the substrate 11, and the inner wall along the elongated U-shaped groove may specifically extend only along the bottom surface of the U-shaped groove or along the bottom surface and two side surfaces of the U-shaped groove.
In this embodiment, the groove 111 may also be in the shape of a corner notch, and the groove 111 is specifically disposed at an adjacent corner position where the light-emitting surface 11a of the substrate 11 intersects with the mounting surface 11b of the substrate 11 and/or an adjacent corner position where the back surface 11c of the substrate 11 intersects with the mounting surface 11b of the substrate.
In practical application, as shown in fig. 8, the corner notch is specifically disposed on an intersection line between the light emitting surface 11a of the substrate 11 and the mounting surface 11b of the substrate 11, and is recessed toward the substrate 11 with reference to the intersection line, so that a small notch is formed at a position of the intersection line, the position of the small notch is located at a position of the positive and negative connection terminals 12, and the positive and negative connection terminals 12 extend from the light emitting surface 11a, the corner notch, the mounting surface 11b, and the corner notch of the substrate 11 and wrap the back surface 11 c.
In practical applications, the corner notch and the elongated U-shaped groove may also be disposed on one light emitting device 1 at the same time, for example, a U-shaped groove is disposed on each of the two end portions of the substrate 11, and then a corner notch is disposed on the U-shaped groove near the light emitting surface 11a and the back surface 11b, so that a soldering space is reserved for soldering during soldering, and the contact area of the entire soldering surface of the light emitting device 1 is increased, thereby improving the soldering stability of the light emitting device 1.
In this embodiment, when the positive and negative connection terminals 12 are extended to wrap the back surface 11c of the substrate 11, the conductive layer of the positive and negative connection terminals 12 may be extended to the back surface of the substrate 11 by providing through holes on the substrate 11, specifically, as shown in fig. 9, the through holes 112 are provided at the positions of the positive and negative connection terminals 12, the through holes 112 penetrate from the light emitting surface 11a of the substrate 11 to the back surface 11c of the substrate 11, and the positive and negative connection terminals 12 wrap the back surface 11c through the through holes 112, so that the positive and negative connection terminals 12 form a shape similar to an "i", and then the bonding surface of the light emitting device 1 only has the light emitting surface and the back surface of the substrate 11.
Meanwhile, on the basis of the structure shown in fig. 9, a corner notch is formed at the intersection position of the light-emitting surface and the side surface, and the conductive layers of the positive and negative connection terminals 12 are also arranged in the corner notch, so that the welding contact area is increased.
In this embodiment, the light emitting device 1 further includes a sealing member 14, where the sealing member 14 is disposed on the light emitting surface 11a of the substrate 11, and covers the at least one LED chip 13, and is mainly used for sealing the LED chip 13, so as to achieve a moisture-proof effect on the LED chip, and improve the service life of the light emitting device 1.
In this embodiment, the light emitting device 1 further includes a fluorescent layer 15, the fluorescent layer 15 is disposed on the sealing member 14, the light emitted from the LED chip 13 is refracted through the fluorescent layer 15, and the light emitted from the LED chip 13 can change the color of the light through the fluorescent layer 15.
In the invention, a display device is also provided, which comprises at least one light-emitting device provided by the above embodiment and a circuit board, wherein the circuit board is provided with a pad matched with the light-emitting device, and when the display device is installed, the positive and negative connecting terminals of the installation surface of the substrate of the light-emitting device are contacted with the pad.
In summary, the light emitting device and the display device thereof provided by the embodiments of the present invention include a substrate, a pair of positive and negative connection terminals, and at least one LED chip disposed between the positive and negative connection terminals, wherein the positive and negative connection terminals are disposed on the light emitting surface of the substrate and extend from the light emitting surface of the substrate to the back surface of the substrate along the mounting surface of the substrate.
Furthermore, the groove is formed in the substrate, and the welding space of soldering tin is reserved for welding the light-emitting device through the groove, so that the welding area of the light-emitting device is greatly increased, and the stability of the light-emitting device in installation is further improved.
The LED provided in the foregoing embodiments can be applied to various light emitting fields, for example, it can be manufactured into a backlight module applied to a display backlight field (which can be a backlight module of a terminal such as a television, a display, a mobile phone, etc.). It can be applied to a backlight module at this time. The display backlight module can be applied to the fields of display backlight, key backlight, shooting, household lighting, medical lighting, decoration, automobiles, traffic and the like. When the LED backlight source is applied to the key backlight field, the LED backlight source can be used as a key backlight light source of mobile phones, calculators, keyboards and other devices with keys; when the camera is applied to the field of shooting, a flash lamp of a camera can be manufactured; when the lamp is applied to the field of household illumination, the lamp can be made into a floor lamp, a table lamp, an illuminating lamp, a ceiling lamp, a down lamp, a projection lamp and the like; when the lamp is applied to the field of medical illumination, the lamp can be made into an operating lamp, a low-electromagnetic illuminating lamp and the like; when the decorative material is applied to the decorative field, the decorative material can be made into various decorative lamps, such as various colored lamps, landscape illuminating lamps and advertising lamps; when the material is applied to the field of automobiles, the material can be made into automobile lamps, automobile indicating lamps and the like; when the lamp is applied to the traffic field, various traffic lights and various street lamps can be manufactured. The above applications are only a few applications exemplified by the present embodiment, and it should be understood that the application of the LED in the present embodiment is not limited to the above exemplified fields.
The foregoing is a more detailed description of embodiments of the present invention, and the present invention is not to be considered limited to such descriptions. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (8)
1. A light-emitting device, comprising: the LED light source comprises a substrate, a pair of positive and negative connecting terminals arranged on a light emitting surface of the substrate and at least one LED chip arranged between the pair of positive and negative connecting terminals; the pair of positive and negative connecting terminals comprise welding surfaces and connecting pins vertically connected with the welding surfaces, the welding surfaces are arranged on the light emitting surface, and the connecting pins at least extend to the back surface of the substrate from the light emitting surface of the substrate along the mounting surface of the substrate; the mounting surface is a side surface which is perpendicular to the light emitting surface and the back surface in the substrate and is overlapped and contacted with the circuit board when being mounted; a groove is formed in the mounting surface at the position of the connecting pin, and the connecting pin extends along the inner wall of the groove and wraps the back surface of the substrate; the groove extends from the light-emitting surface of the substrate to the back surface of the substrate, and comprises a corner notch arranged at the adjacent corner position where the light-emitting surface of the substrate is intersected with the mounting surface of the substrate and/or the adjacent corner position where the back surface of the substrate is intersected with the mounting surface of the substrate.
2. The light-emitting device according to claim 1, wherein the pair of positive and negative connection terminals are provided at both end positions of a light-emitting surface of the substrate.
3. The light-emitting device according to claim 2, wherein the bonding surface and the connecting pins form an L-shaped structure, and the connecting pins extend from a light-emitting surface of the substrate to a boundary line between the light-emitting surface and the back surface.
4. The light-emitting device according to claim 2, wherein the bonding surface and the connecting pins form a concave-shaped structure, and the connecting pins extend from the light-emitting surface of the substrate and penetrate through the mounting surface of the substrate to be wrapped on the back surface of the substrate.
5. The light-emitting device according to claim 1, wherein at least one through hole is formed in a position of the substrate corresponding to a position where the pair of positive and negative connection terminals are disposed, the through hole penetrates from the light-emitting surface to the back surface of the substrate, and the pair of positive and negative connection terminals penetrate through the through hole from the light-emitting surface of the substrate and wrap around the back surface of the substrate.
6. The light-emitting device according to any one of claims 1 to 5, further comprising a sealing member disposed on the light-emitting surface of the substrate and covering the at least one LED chip.
7. The light-emitting device according to claim 6, further comprising a phosphor layer provided on the sealing member.
8. A display device comprising a circuit board and at least one light emitting device according to any one of claims 1 to 7, wherein a pad is provided on the circuit board for mating with the light emitting device; when the LED packaging structure is installed, the installation surface of the substrate of the light-emitting device is in contact with the bonding pad, and the electric connection is realized through the connecting pin on the installation surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910024270.9A CN111430528B (en) | 2019-01-10 | 2019-01-10 | Light-emitting device and display device thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910024270.9A CN111430528B (en) | 2019-01-10 | 2019-01-10 | Light-emitting device and display device thereof |
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| CN111430528A CN111430528A (en) | 2020-07-17 |
| CN111430528B true CN111430528B (en) | 2021-11-05 |
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| CN201910024270.9A Active CN111430528B (en) | 2019-01-10 | 2019-01-10 | Light-emitting device and display device thereof |
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| CN108963047A (en) * | 2017-05-18 | 2018-12-07 | 奥斯兰姆奥普托半导体有限责任公司 | Opto-electronic device and method for manufacturing opto-electronic device |
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2019
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| CN101278416A (en) * | 2005-09-30 | 2008-10-01 | 日亚化学工业株式会社 | Light emitting device and backlight unit using the same |
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| CN201877460U (en) * | 2010-10-20 | 2011-06-22 | 东莞市佳乐电子有限公司 | Led bracket |
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| CN111430528A (en) | 2020-07-17 |
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