JP4690563B2 - Light emitting diode - Google Patents

Light emitting diode Download PDF

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Publication number
JP4690563B2
JP4690563B2 JP2001058533A JP2001058533A JP4690563B2 JP 4690563 B2 JP4690563 B2 JP 4690563B2 JP 2001058533 A JP2001058533 A JP 2001058533A JP 2001058533 A JP2001058533 A JP 2001058533A JP 4690563 B2 JP4690563 B2 JP 4690563B2
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Japan
Prior art keywords
light emitting
emitting diode
light
main body
back side
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Expired - Fee Related
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JP2001058533A
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Japanese (ja)
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JP2002261332A (en
Inventor
栄元 植草
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Citizen Electronics Co Ltd
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Citizen Electronics Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding

Description

【0001】
【発明の属する技術分野】
本発明は、発光ダイオードに係り、特にT字状に形成された側面発光タイプの発光ダイオードに関するものである。
【0002】
【従来の技術】
従来、携帯電話に代表される小型電子機器の液晶表示において、バックライト用の光源としてチップ型の発光ダイオードが利用されている。このチップ型発光ダイオード1は、例えば図10に示したように、ガラスエポキシ基板2(以下、ガラエポ基板という)の上面に一対の電極3,4をパターン形成し、一方の電極3の上に導電性接着剤(図示せず)を用いて発光ダイオード素子6を固着すると共に、発光ダイオード素子6の上面電極と前記他方の電極4とをボンディングワイヤ7で接続し、このボンディングワイヤ7及び発光ダイオード素子6を透明樹脂体8によって封止する構造であり、プリント配線基板(以下PCBという)に表面実装されるタイプである。
【0003】
上記のチップ型発光ダイオード1を液晶表示のバックライト用の光源として利用する場合には、ガラエポ基板2をPCBの上面に固定し、発光ダイオード素子6から発した光を液晶表示板の裏面側に配設した導光板(図示せず)の端部から導き入れることで導光板を発光させ、液晶表示板を裏面側から照らす構成である。
【0004】
【発明が解決しようとする課題】
しかしながら、上記のようなチップ型発光ダイオード1を大型の液晶表示画面の光源として利用する場合は、複数個を実装しなければ画面の明るさを確保することができないため、その分工数が掛かると共に光源部分が大型化してしまう。また、上記のチップ型発光ダイオード1によって液晶を多色表示させる場合には、発光色の異なるチップ型発光ダイオード1を各々実装しなければならない他、隣り合うチップ型発光ダイオード1との距離も離れてしまうために、混色発光させた時に色ムラが出易くなるといった問題があった。
【0005】
そこで、本発明の目的は、発光ダイオードを大型の液晶表示画面の光源として利用する場合に、少ない個数の発光ダイオードによっても明るさを十分に確保できるようにして工数の削減を図ると共に光源部分のコンパクト化を達成し、また液晶をカラーの多色表示させる場合でも1個の発光ダイオードで2色発光を可能とし、且つ混色発光させた時にも色ムラが出にくいような発光ダイオードを提供するものである。
【0006】
【課題を解決するための手段】
上記課題を解決するために、本発明の請求項1に係る発光ダイオードは、外部接続用電極が設けられたベース部と、このベース部の略中央部から立ち上がる本体部とで略T字状に形成され、前記本体部がプリント配線基板に開設された孔に裏面側から挿入され、前記ベース部がプリント配線基板の裏面電極に実装された発光ダイオードであって、前記外部接続用電極がベース部の前面側と背面側にそれぞれ独立して設けられると共に、本体部の前面側および背面側には前記それぞれの外部接続用電極と電気的に接続する発光部がそれぞれ設けられ、それぞれの発光部が透光性を有する樹脂封止体によってそれぞれ保護されていることを特徴とする。
【0007】
この発明によれば、発光ダイオードを略T字状に形成し、本体部の前面側及び背面側の両方に発光部を設けているので、1個の発光ダイオードを実装した場合でも従来の発光ダイオードの2倍の発光輝度が得られる。それ故、発光ダイオードの実装個数を減らせることができるので、その分工数が削減されると共に、発光ダイオードの配設個所のコンパクト化が図られる。
また、この発明によれば、前面側と背面側の発光部の外部接続用電極が独立していることから、一方側の発光部のみを発光させることや、両方の発光部に供給する電力量を変えることで混色発光に変化を持たせることができる。
【0008】
請求項2の発明は、請求項1に記載の発光ダイオードにおいて、前記本体部の前面側および背面側に設けられた発光部は、その発光色が互いに異なっていることを特徴とする。
【0009】
この発明によれば、本体部の前面側及び背面側の発光部の発光色を異ならせることによって、1個の発光ダイオードで2色発光が可能になると共に、発光部の距離も近いので混色発光させた時にも色ムラが出にくい。
【0012】
請求項の発明は、請求項1に記載の発光ダイオードにおいて、前記樹脂封止体の外周面の一部に遮光面が形成されていることを特徴とする。
【0013】
この発明によれば、樹脂封止体の外周面の一部を遮光することで、発光部から発光する光の集光性を向上させることができる。
【0014】
【発明の実施の形態】
以下、添付図面に基づいて本発明に係る発光ダイオードの実施形態を詳細に説明する。図1乃至図5は本発明に係る発光ダイオードの第1実施形態を示したものであり、図1は発光ダイオードの外観図、図2は発光ダイオードの背面図、図3は発光ダイオードの側面側を示す前記図1のA−A線断面図、図4は発光ダイオードを液晶表示のバックライト用の光源として使用する場合の配置関係を示す斜視図、図5はその平面図である。
【0015】
図1乃至図3に示されるように、この実施形態に係るチップ型の発光ダイオード11は、ガラエポ基板やBTレジン(Bismaleimide Triazine Resin)基板などで作られており、左右に延びるベース部12a,12bと、このベース部12a,12bの略中央部分から立ち上がる本体部13とで略T字状(Tの字を上下逆にした形で使用)に形成されている。ベース部12a,12bの前面側には外部接続用電極14a,14bが、またベース部12a,12bの背面側にも同様の外部接続用電極15a,15bが形成されている。さらに、本体部13の前面側の中央部にはカソード電極16aとアノード電極16bが形成され、背面側の中央部にも同様のカソード電極17aとアノード電極17bが形成されている。そして、これらカソード電極16a,17a及びアノード電極16b,17bと前記外部接続用電極14a,14b,15a,15bとがそれぞれつながっている。
【0016】
前記本体部13は縦長の直方体形状をしており、前面側及び背面側のそれぞれに発光部が形成されている。この発光部は、前記カソード電極16a,17aの上面に固定された発光ダイオード素子19a,19bによって構成されており、発光ダイオード素子19a,19bの上面電極と前記アノード電極16b,17bとがボンディングワイヤ20a,20bによって接続されている。各発光部18a,18bにはカソード電極16a,17a及びアノード電極16b,17bを介して外部接続用電極14a,14b,15a,15bから電力が供給されることで、発光ダイオード素子19a,19bが前面側と背面側とで発光する。なお、上記の発光ダイオード11を多色発光に利用する場合には異なる発光色の発光ダイオード素子19a,19b用い、単色発光に利用する場合には両方とも同じ発光色のものを用いる。
【0017】
この実施形態に係る発光ダイオード11では、上記発光ダイオード素子19a,19b及びボンディングワイヤ20a,20bが、本体部13の前面側及び背面側に突出させた直方体形状の樹脂封止体21a,21bによって保護されている。樹脂封止体21a,21bの樹脂材料には透光性を有するエポキシ系樹脂が用いられ、発光ダイオード素子19a,19bからの発光を妨げないようにしている。
【0018】
このようにして構成された発光ダイオード11は、図1乃至図3に示したように、PCB22に開設された円孔23に本体部13が裏面側から挿入される。そして、円孔23の周縁部にベース部12a,12bの上面を当接したのち、PCB22の裏面にプリント配線されている裏面電極(図示せず)にベース部12a,12bの外部接続用電極14a,14b,15a,15bの上縁部が半田24で固定されることによって、PCB22との電気的導通が図られる。なお、上記発光ダイオード11のベース部12aの前面側及び背面側には、発光ダイオード11の極性を示すカソードマーク25a,25bがそれぞれ印刷されている。
【0019】
次に、上記の発光ダイオードを液晶表示のバックライト用の光源として利用する場合の一実施形態を図4及び図5に基づいて説明する。先ず、PCB22の表面側に配設される導光板30の側端面にV字溝31を設け、このV字溝31に前記発光ダイオード11の本体部13を入れる。発光ダイオード11をPCB22に固定する際、ベース部12a,12bの方向をV字溝31のVの字と直交する方向に位置合わせする。発光ダイオード11をこのような位置に設定することで、本体部13の発光ダイオード素子19a,19bからはV字溝31の左右反対方向にそれぞれ発光する。発光した光33a,33bは、V字溝31の傾斜面32a,32bから入射する際にその多くが導光板30の前方側に屈折し、そのまま導光板30の中に導かれて真っ直ぐに進む。
【0020】
このように、この実施形態では1個の発光ダイオード11を実装するだけで従来の2倍の発光輝度を得ることができるので、大型の液晶表示画面を単色発光させる場合には1個のみの実装でも十分に明るさを確保できる。また、多色発光させる場合でも発光ダイオード素子19a,19bを異なる発光色で構成すれば、上記の発光ダイオード11を1個実装するだけで済み、また、発光ダイオード素子19a,19bが互いに近い距離にあるために、混色発光させた時に色ムラが出にくく,きれいなカラー色が得られる。なお、この実施形態では外部接続用電極14a,14b,15a,15bを本体部13の前面側と背面側とに分離して設けたので、発光ダイオード素子19a,19bのうち一方のみを発光させることも可能であり、また、それぞれの発光ダイオード素子19a,19bに与える電力量を変えることも可能である。
【0021】
上記図4及び図5に示した実施形態では、1個の発光ダイオード11を実装した場合について説明したが、必要に応じて上記の発光ダイオード11を2個又は3個以上実装することも可能である。また、上記の実施形態では本発明の発光ダイオード11を液晶表示のバックライト用の光源として利用した場合について説明したが、光通信や各種センサ用の光源として、また各種表示装置などにも利用できることは勿論である。
【0022】
図6及び図7は本発明に係る発光ダイオードの第2実施形態を示したものである。この実施形態に係る発光ダイオード11aは、本体部13の前面側及び背面側に突出する樹脂封止体21a,21bにおいて、その外周面の一部を遮光し、発光ダイオード素子19a,19bから発光する光の集光性を向上させたものである。即ち、樹脂封止体21a,21bは、透光性を有するエポキシ系樹脂によって直方体形状に形成されているが、樹脂封止体21a,21bの左右両側面及び上下面に遮光性の塗装膜やメッキあるいは遮光性シートを施すことによって遮光面26a,26bを形成し、発光ダイオード素子19a,19bから発した光が樹脂封止体21a,21bの透光前面27a,27bからのみ発光するように構成したものである。なお、前記樹脂封止体21a,21bの構成以外は、先の発光ダイオード11の構成と同様であるので、同一の符号を付すことで詳細な説明は省略する。
【0023】
図7は、前記の発光ダイオード11aを液晶表示のバックライト用の光源として利用する場合の実施形態を示したものである。この場合、発光ダイオード素子19a,19bから発光した光33a,33bは、樹脂封止体21a,21bの遮光面26a,26bによって遮られるために周囲には拡散せず、樹脂封止体21a,21bの透光前面27a,27bからのみ発光する。このことは光33a,33bの集光性を高める結果となり、V字溝31の傾斜面32a,32bに入射する領域が狭くなることから導光板30の中に強い光が導かれることになる。なお、発光ダイオード11aと導光板30との位置関係は、図5に示した先の実施形態と同様であるので、同一の符号を付すことで詳細な説明は省略する。
【0024】
図8及び図9は本発明に係る発光ダイオードの第3実施形態を示したものである。この実施形態に係る発光ダイオード11bも、先の実施形態と同様、本体部13の前面側及び背面側に突出する樹脂封止体21a,21bの外周面の一部を遮光し、発光ダイオード素子19a,19bから発光する光の集光性を向上させたものである。即ち、樹脂封止体21a,21bは、透光性を有するエポキシ系樹脂によって直方体形状に形成されているが、この実施形態では樹脂封止体21a,21bの一方の側面、上下面及び前面に遮光性の塗装膜やメッキあるいは遮光性シートを施すことによって遮光面26a,26bを形成し、発光ダイオード素子19a,19bから発した光が樹脂封止体21a,21bの他方の透光側面28a,28bからのみ発光するように構成したものである。なお、前記樹脂封止体21a,21bの構成以外は、先の発光ダイオード11の構成と同様であるので、同一の符号を付すことで詳細な説明は省略する。
【0025】
図9は、前記の発光ダイオード11aを液晶表示のバックライト用の光源として利用する場合の実施形態を示したものである。この場合、発光ダイオード素子19a,19bから発光した光33a,33bは、樹脂封止体21a,21bの遮光面26a,26bによって遮られるために周囲には拡散せず、V字溝31の各傾斜面32a,32bと対向する樹脂封止体21a,21bの透光側面28a,28bからのみ発光する。このことは光33a,33bの集光性を高めると共に、導光板30の中に導かれる光33a,33bが互いに接近する結果となり、発光ダイオード素子19a,19bの発光色を変えて2色発光させる場合には、導光板30内での2色混合がより一層スムーズになされることになる。なお、発光ダイオード11bと導光板30との位置関係は、図5に示した先の実施形態と同様であるので、同一の符号を付すことで詳細な説明は省略する。
【0026】
【発明の効果】
以上説明したように、本発明に係る発光ダイオードによれば、発光ダイオードを略T字状に形成したことで、本体部の前面側及び背面側の両方に発光部を設けることができ、従来の発光ダイオードの2個分の発光輝度が得られる。そのため、例えば液晶表示のバックライト用の光源として利用した場合には、発光ダイオードの実装個数が少なくても、大型の液晶表示画面の明るさを十分に確保することができるので、従来に比べて発光ダイオードの実装工数の削減が図られると共に光源部分のコンパクト化が達成される。
【0027】
また、本発明に係る発光ダイオードによれば、本体部の前面側および背面側に設けた発光部の発光色を異ならせるだけで多色発光が可能になると共に、発光部の距離も近いので混色発光させた時にも色ムラが出にくくなり、品質の向上が図られる。
【0028】
さらに、本発明に係る発光ダイオードによれば、樹脂封止体の外周面の一部に遮光面を形成したので、発光部から発光する光の集光性が向上することになり、特定の個所を効果的に照射することができる。
【図面の簡単な説明】
【図1】本発明の第1実施形態に係る発光ダイオードの外観図である。
【図2】前記発光ダイオードの背面図である。
【図3】前記発光ダイオードの側面側を示す図1のA−A線断面図である。
【図4】前記発光ダイオードを液晶表示のバックライト用の光源として使用する場合の配置関係を示す斜視図である。
【図5】前記図4における平面図である。
【図6】本発明の第2実施形態に係る発光ダイオードの外観図である。
【図7】前記発光ダイオードを液晶表示のバックライト用の光源として使用する場合の配置関係を示す平面図である。
【図8】本発明の第3実施形態に係る発光ダイオードの外観図である。
【図9】前記発光ダイオードを液晶表示のバックライト用の光源として使用する場合の配置関係を示す平面図である。
【図10】従来における発光ダイードの一例を示す斜視図である。
【符号の説明】
11 発光ダイオード
12a,12b ベース部
13 本体部
14a,14b 外部接続用電極
15a,15b 外部接続用電極
19a,19b 発光ダイオード素子(発光部)
21a,21b 樹脂封止体
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a light emitting diode, and more particularly to a side light emitting type light emitting diode formed in a T shape.
[0002]
[Prior art]
Conventionally, in a liquid crystal display of a small electronic device typified by a mobile phone, a chip-type light emitting diode is used as a light source for a backlight. For example, as shown in FIG. 10, the chip-type light emitting diode 1 has a pair of electrodes 3 and 4 formed on the upper surface of a glass epoxy substrate 2 (hereinafter referred to as a glass-epoxy substrate) and is electrically conductive on one electrode 3. The light emitting diode element 6 is fixed using a bonding adhesive (not shown), and the upper electrode of the light emitting diode element 6 and the other electrode 4 are connected by a bonding wire 7, and the bonding wire 7 and the light emitting diode element are connected. 6 is sealed with a transparent resin body 8, and is a type that is surface-mounted on a printed wiring board (hereinafter referred to as PCB).
[0003]
When the chip-type light emitting diode 1 is used as a light source for a backlight of a liquid crystal display, the glass-epoxy substrate 2 is fixed to the upper surface of the PCB, and the light emitted from the light emitting diode element 6 is transmitted to the back surface side of the liquid crystal display plate. The light guide plate emits light by being introduced from the end of a light guide plate (not shown) provided, and the liquid crystal display plate is illuminated from the back side.
[0004]
[Problems to be solved by the invention]
However, when the chip-type light emitting diode 1 as described above is used as a light source for a large liquid crystal display screen, the brightness of the screen cannot be secured unless a plurality of light emitting diodes are mounted. A light source part will enlarge. Further, in the case where liquid crystals are displayed in multicolor using the above-described chip type light emitting diode 1, the chip type light emitting diodes 1 having different emission colors must be mounted, and the distance between adjacent chip type light emitting diodes 1 is also increased. Therefore, there is a problem that color unevenness is likely to occur when mixed color light emission is performed.
[0005]
Accordingly, an object of the present invention is to reduce the number of man-hours and reduce the number of light sources by using a light emitting diode as a light source for a large liquid crystal display screen so that sufficient brightness can be secured even with a small number of light emitting diodes. A light-emitting diode that achieves compactness, enables two-color light emission with a single light-emitting diode even when displaying liquid crystal in multiple colors, and provides a light-emitting diode that is less likely to cause color unevenness even when mixed-color light is emitted. It is.
[0006]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, a light-emitting diode according to claim 1 of the present invention is substantially T-shaped with a base portion provided with an external connection electrode and a main body portion rising from a substantially central portion of the base portion. The light emitting diode is formed and inserted from the back side into the hole formed in the printed wiring board, and the base part is mounted on the back electrode of the printed wiring board, and the external connection electrode is the base part Are provided independently on the front side and the back side of the main body, and on the front side and the back side of the main body, there are provided light-emitting parts that are electrically connected to the respective external connection electrodes. characterized in that it is protected respectively by a resin sealing body having a light-transmitting property.
[0007]
According to the present invention, since the light emitting diode is formed in a substantially T shape and the light emitting portion is provided on both the front side and the back side of the main body, the conventional light emitting diode is provided even when one light emitting diode is mounted. Is obtained. Therefore, the number of light emitting diodes mounted can be reduced, so that the number of man-hours can be reduced and the light emitting diodes can be made compact.
In addition, according to the present invention, since the external connection electrodes of the light emitting units on the front side and the back side are independent, only the light emitting unit on one side emits light, or the amount of power supplied to both light emitting units By changing, it is possible to change the mixed color emission.
[0008]
According to a second aspect of the present invention, in the light-emitting diode according to the first aspect, the light emitting portions provided on the front side and the back side of the main body are different in emission color.
[0009]
According to the present invention, by changing the light emission colors of the light emitting parts on the front side and the back side of the main body part, it is possible to emit two colors with one light emitting diode, and the distance between the light emitting parts is short, so mixed color light emission. Color unevenness is difficult to occur even when letting go.
[0012]
According to a third aspect of the present invention, in the light emitting diode according to the first aspect, a light shielding surface is formed on a part of the outer peripheral surface of the resin sealing body.
[0013]
According to this invention, the condensing property of the light emitted from the light emitting part can be improved by shielding a part of the outer peripheral surface of the resin sealing body.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of a light emitting diode according to the present invention will be described in detail with reference to the accompanying drawings. 1 to 5 show a first embodiment of a light emitting diode according to the present invention. FIG. 1 is an external view of the light emitting diode, FIG. 2 is a rear view of the light emitting diode, and FIG. 3 is a side view of the light emitting diode. 1 is a cross-sectional view taken along the line AA in FIG. 1, FIG. 4 is a perspective view showing a positional relationship when a light emitting diode is used as a light source for a backlight of a liquid crystal display, and FIG. 5 is a plan view thereof.
[0015]
As shown in FIGS. 1 to 3, a chip-type light emitting diode 11 according to this embodiment is made of a glass epoxy substrate, a BT resin (Bismaleimide Triazine Resin) substrate, or the like, and has base portions 12a and 12b extending in the left and right directions. And the main body portion 13 rising from the substantially central portion of the base portions 12a and 12b are formed in a substantially T-shape (used in a shape in which the T-shape is turned upside down). External connection electrodes 14a and 14b are formed on the front surfaces of the base portions 12a and 12b, and similar external connection electrodes 15a and 15b are formed on the back surfaces of the base portions 12a and 12b. Further, a cathode electrode 16a and an anode electrode 16b are formed at the center on the front side of the main body 13, and a similar cathode electrode 17a and anode electrode 17b are formed at the center on the back side. The cathode electrodes 16a, 17a and anode electrodes 16b, 17b are connected to the external connection electrodes 14a, 14b, 15a, 15b, respectively.
[0016]
The main body portion 13 has a vertically long rectangular parallelepiped shape, and a light emitting portion is formed on each of the front side and the back side. The light emitting section is constituted by light emitting diode elements 19a and 19b fixed to the upper surfaces of the cathode electrodes 16a and 17a. The upper surface electrodes of the light emitting diode elements 19a and 19b and the anode electrodes 16b and 17b are bonded to the bonding wires 20a. , 20b. Power is supplied from the external connection electrodes 14a, 14b, 15a, and 15b to the light emitting units 18a and 18b via the cathode electrodes 16a and 17a and the anode electrodes 16b and 17b, so that the light emitting diode elements 19a and 19b are in front. Light is emitted from the side and back side. In addition, when using said light emitting diode 11 for multicolor light emission, the light emitting diode elements 19a and 19b of different light emission color are used, and when using for single color light emission, the thing of the same light emission color is used for both.
[0017]
In the light emitting diode 11 according to this embodiment, the light emitting diode elements 19a and 19b and the bonding wires 20a and 20b are protected by the rectangular parallelepiped-shaped resin sealing bodies 21a and 21b protruding from the front side and the back side of the main body portion 13. Has been. An epoxy resin having translucency is used for the resin material of the resin sealing bodies 21a and 21b so as not to prevent light emission from the light emitting diode elements 19a and 19b.
[0018]
As shown in FIGS. 1 to 3, the light emitting diode 11 configured as described above has the main body 13 inserted into the circular hole 23 formed in the PCB 22 from the back side. Then, after the upper surfaces of the base portions 12a and 12b are brought into contact with the peripheral edge of the circular hole 23, the external connection electrodes 14a of the base portions 12a and 12b are connected to the back electrodes (not shown) printed on the back surface of the PCB 22. , 14b, 15a, and 15b are fixed with solder 24 so that electrical continuity with the PCB 22 is achieved. Cathode marks 25a and 25b indicating the polarity of the light emitting diode 11 are printed on the front side and the back side of the base portion 12a of the light emitting diode 11, respectively.
[0019]
Next, an embodiment in which the light emitting diode is used as a light source for a backlight of a liquid crystal display will be described with reference to FIGS. First, a V-shaped groove 31 is provided on the side end surface of the light guide plate 30 disposed on the front surface side of the PCB 22, and the main body 13 of the light emitting diode 11 is inserted into the V-shaped groove 31. When the light emitting diode 11 is fixed to the PCB 22, the direction of the base portions 12 a and 12 b is aligned with the direction orthogonal to the V shape of the V-shaped groove 31. By setting the light emitting diode 11 to such a position, light is emitted from the light emitting diode elements 19a and 19b of the main body 13 in opposite directions of the V-shaped groove 31. Most of the emitted light 33a and 33b is refracted to the front side of the light guide plate 30 when entering from the inclined surfaces 32a and 32b of the V-shaped groove 31, and is directly guided into the light guide plate 30 and proceeds straight.
[0020]
As described above, in this embodiment, it is possible to obtain the light emission luminance twice as high as that of the conventional light emitting device simply by mounting one light emitting diode 11. Therefore, when a large liquid crystal display screen emits monochromatic light, only one light emitting diode 11 is mounted. But enough brightness can be secured. Further, even in the case of multicolor light emission, if the light emitting diode elements 19a and 19b are configured with different light emission colors, it is only necessary to mount one light emitting diode 11, and the light emitting diode elements 19a and 19b are close to each other. For this reason, color unevenness hardly occurs when mixed color light is emitted, and a beautiful color can be obtained. In this embodiment, since the external connection electrodes 14a, 14b, 15a, 15b are provided separately on the front side and the back side of the main body 13, only one of the light emitting diode elements 19a, 19b emits light. It is also possible to change the amount of electric power applied to the respective light emitting diode elements 19a and 19b.
[0021]
In the embodiment shown in FIGS. 4 and 5, the case where one light emitting diode 11 is mounted has been described. However, two or three or more light emitting diodes 11 may be mounted as necessary. is there. In the above embodiment, the case where the light emitting diode 11 of the present invention is used as a light source for a backlight of a liquid crystal display has been described. However, it can be used as a light source for optical communication and various sensors, and also for various display devices. Of course.
[0022]
6 and 7 show a second embodiment of a light emitting diode according to the present invention. In the light emitting diode 11a according to this embodiment, the resin sealing bodies 21a and 21b projecting to the front side and the back side of the main body 13 shield light from part of the outer peripheral surface and emit light from the light emitting diode elements 19a and 19b. The light condensing property is improved. That is, the resin sealing bodies 21a and 21b are formed in a rectangular parallelepiped shape with a light-transmitting epoxy resin, but a light-shielding coating film is formed on the left and right side surfaces and the upper and lower surfaces of the resin sealing bodies 21a and 21b. The light shielding surfaces 26a and 26b are formed by applying plating or a light shielding sheet, and the light emitted from the light emitting diode elements 19a and 19b is emitted only from the light transmitting front surfaces 27a and 27b of the resin sealing bodies 21a and 21b. It is a thing. In addition, since it is the same as that of the structure of the previous light emitting diode 11 except the structure of the said resin sealing bodies 21a and 21b, detailed description is abbreviate | omitted by attaching | subjecting the same code | symbol.
[0023]
FIG. 7 shows an embodiment in which the light emitting diode 11a is used as a light source for a backlight of a liquid crystal display. In this case, the lights 33a and 33b emitted from the light emitting diode elements 19a and 19b are blocked by the light shielding surfaces 26a and 26b of the resin sealing bodies 21a and 21b, so that they do not diffuse around the resin sealing bodies 21a and 21b. Light is emitted only from the translucent front surfaces 27a and 27b. This results in enhancing the light condensing properties of the light 33 a and 33 b, and since the region incident on the inclined surfaces 32 a and 32 b of the V-shaped groove 31 becomes narrow, strong light is guided into the light guide plate 30. Since the positional relationship between the light emitting diode 11a and the light guide plate 30 is the same as that of the previous embodiment shown in FIG. 5, detailed description is omitted by attaching the same reference numerals.
[0024]
8 and 9 show a third embodiment of the light emitting diode according to the present invention. Similarly to the previous embodiment, the light emitting diode 11b according to this embodiment also shields a part of the outer peripheral surface of the resin sealing bodies 21a and 21b protruding from the front side and the back side of the main body 13, and the light emitting diode element 19a. , 19b to improve the light condensing property of the light emitted. That is, the resin sealing bodies 21a and 21b are formed in a rectangular parallelepiped shape with a translucent epoxy resin. In this embodiment, the resin sealing bodies 21a and 21b are formed on one side surface, upper and lower surfaces, and the front surface of the resin sealing bodies 21a and 21b. The light shielding surfaces 26a and 26b are formed by applying a light shielding coating film, plating or a light shielding sheet, and light emitted from the light emitting diode elements 19a and 19b is transmitted through the other light transmitting side surfaces 28a and 21b of the resin sealing bodies 21a and 21b. It is configured to emit light only from 28b. In addition, since it is the same as that of the structure of the previous light emitting diode 11 except the structure of the said resin sealing bodies 21a and 21b, detailed description is abbreviate | omitted by attaching | subjecting the same code | symbol.
[0025]
FIG. 9 shows an embodiment in which the light emitting diode 11a is used as a light source for a backlight of a liquid crystal display. In this case, the light 33a and 33b emitted from the light emitting diode elements 19a and 19b are blocked by the light shielding surfaces 26a and 26b of the resin sealing bodies 21a and 21b, so that they do not diffuse to the surroundings, and each inclination of the V-shaped groove 31 Light is emitted only from the light transmitting side surfaces 28a and 28b of the resin sealing bodies 21a and 21b facing the surfaces 32a and 32b. This enhances the light-collecting properties of the light 33a and 33b and also results in the light 33a and 33b guided into the light guide plate 30 approaching each other, changing the light emission color of the light-emitting diode elements 19a and 19b to emit two colors. In this case, the mixing of the two colors in the light guide plate 30 is made even smoother. Note that the positional relationship between the light emitting diode 11b and the light guide plate 30 is the same as that of the previous embodiment shown in FIG.
[0026]
【The invention's effect】
As described above, according to the light emitting diode according to the present invention, the light emitting diode is formed in a substantially T shape, so that the light emitting portion can be provided on both the front side and the back side of the main body. Luminance of two light emitting diodes can be obtained. For this reason, for example, when used as a light source for a backlight of a liquid crystal display, the brightness of a large liquid crystal display screen can be sufficiently ensured even if the number of mounted light emitting diodes is small. The number of light-emitting diode mounting steps can be reduced, and the light source portion can be made compact.
[0027]
In addition, according to the light emitting diode of the present invention, multicolor light emission is possible only by changing the light emission colors of the light emitting parts provided on the front side and the back side of the main body part, and the distance between the light emitting parts is also close, so that color mixing is possible. Even when light is emitted, color unevenness is less likely to occur and quality can be improved.
[0028]
Furthermore, according to the light emitting diode according to the present invention, since the light shielding surface is formed on a part of the outer peripheral surface of the resin sealing body, the light condensing property of the light emitted from the light emitting portion is improved, and a specific location is determined. Can be effectively irradiated.
[Brief description of the drawings]
FIG. 1 is an external view of a light emitting diode according to a first embodiment of the present invention.
FIG. 2 is a rear view of the light emitting diode.
3 is a cross-sectional view taken along line AA of FIG. 1 showing a side surface side of the light emitting diode.
FIG. 4 is a perspective view showing an arrangement relationship when the light emitting diode is used as a light source for a backlight of a liquid crystal display.
FIG. 5 is a plan view of FIG. 4;
FIG. 6 is an external view of a light emitting diode according to a second embodiment of the present invention.
FIG. 7 is a plan view showing an arrangement relationship when the light-emitting diode is used as a light source for a backlight of a liquid crystal display.
FIG. 8 is an external view of a light emitting diode according to a third embodiment of the present invention.
FIG. 9 is a plan view showing an arrangement relationship when the light emitting diode is used as a light source for a backlight of a liquid crystal display.
FIG. 10 is a perspective view showing an example of a conventional light emitting diode.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 11 Light emitting diode 12a, 12b Base part 13 Main-body part 14a, 14b External connection electrode 15a, 15b External connection electrode 19a, 19b Light emitting diode element (light emission part)
21a, 21b Resin sealing body

Claims (3)

外部接続用電極が設けられたベース部と、このベース部の略中央部から立ち上がる本体部とで略T字状に形成され、前記本体部がプリント配線基板に開設された孔に裏面側から挿入され、前記ベース部がプリント配線基板の裏面電極に実装された発光ダイオードであって、
前記外部接続用電極がベース部の前面側と背面側にそれぞれ独立して設けられると共に、本体部の前面側および背面側には前記それぞれの外部接続用電極と電気的に接続する発光部がそれぞれ設けられ、それぞれの発光部が透光性を有する樹脂封止体によってそれぞれ保護されていることを特徴とする発光ダイオード。
A base part provided with an external connection electrode and a main body part rising from a substantially central part of the base part are formed in a substantially T shape, and the main body part is inserted from the back side into a hole formed in a printed wiring board. The base part is a light emitting diode mounted on the back electrode of the printed wiring board,
The external connection electrodes are provided independently on the front side and the back side of the base part, respectively, and light emitting parts that are electrically connected to the external connection electrodes are respectively provided on the front side and the back side of the main body part. provided, light emitting diodes each emitting unit is characterized in that it is protected respectively by a resin sealing body having a light transmitting property.
前記本体部の前面側および背面側に設けられた発光部は、その発光色が互いに異なっていることを特徴とする請求項1記載の発光ダイオード。  The light emitting diode according to claim 1, wherein the light emitting parts provided on the front side and the back side of the main body part have different emission colors. 前記樹脂封止体の外周面の一部に遮光面が形成されていることを特徴とする請求項1記載の発光ダイオード。  The light-emitting diode according to claim 1, wherein a light shielding surface is formed on a part of the outer peripheral surface of the resin sealing body.
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JP5104793B2 (en) * 2009-03-25 2012-12-19 株式会社デンソー LED light source unit
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US10090436B2 (en) * 2014-01-06 2018-10-02 Lumileds Llc Semiconductor light emitting device with shaped substrate and method of manufacturing the same
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JPH06296045A (en) * 1993-04-08 1994-10-21 Rohm Co Ltd Side light emitting/receiving semiconductor device and double sided light emission indicator
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