JPH06296045A - Side light emitting/receiving semiconductor device and double sided light emission indicator - Google Patents

Abstract

PURPOSE:To provide a compact type side-emitting/receiving semiconductor device with which light can be emitted in two opposite directions. CONSTITUTION:Convex lenses 12a and 12b are provided respectively on the opposing surfaces of a package main body 12, and three lead terminals 13a to 13c are led out from the package main body 12. Two light-emitting diode elements 14a and 14b are die-bonded on the front and the back sides of the common lead terminal 13b inside the package, and the surface electrode of the light-emitting diode elements 14a and 14b are wire-bonded independently to the other two lead terminals 13a and 13b respectively.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a side surface emitting / light receiving semiconductor device for irradiating or receiving light from a surface opposite to a package body in which an optical semiconductor element such as a light emitting diode element or a photodiode is sealed, and the side surface emitting light. The present invention relates to a dual emission display device using a semiconductor device.

[0002]

2. Description of the Related Art As an example of this type of device, the structure of a side-emitting LED lamp will be described with reference to FIG. The same figure (a) is the front view, (b) is a longitudinal cross-sectional view. The side-emitting LED lamp 1 includes a package body 2 made of a transparent resin and having a substantially rectangular parallelepiped shape.
A convex lens portion 2a is integrally formed on one side surface of the. Two lead terminals 3a and 3b from the package body 2
Has been derived. In the package body 2, the light emitting diode element 4 is die-bonded to the end of one lead terminal 3a. Further, the surface electrode of the light emitting diode element 4 and the other lead terminal 3b are wire-bonded with a thin metal wire 5.

In the above-described side surface light emitting type LED lamp 1, light generated by energizing the light emitting diode element 4 is focused by the lens portion 2a of the package body 2 and emitted in one direction.

[0004]

However, the conventional example having such a structure has the following problems. That is, since the conventional side-emitting LED lamp can emit light only in one direction, if light is emitted in two opposite directions, as shown in FIG.
It is necessary to mount the two side surface light emitting type LED lamps 1 on the mounting substrate 6 in directions opposite to each other, which causes a problem that the board occupying area increases and the manufacturing cost of the electric device increases.

The present invention has been made in view of the above circumstances, and emits light in two opposite directions, or receives light from one direction and emits light in the other direction. Another object of the present invention is to provide a side surface light emitting / light receiving semiconductor device that receives light from two directions.

Another object of the present invention is to provide a double-sided light emitting display device in which both surfaces of the mounting substrate can be used as display surfaces.

[0007]

The present invention has the following constitution in order to achieve such an object. Claim 1
The side surface light emitting semiconductor device described in (1) above has light emitting surfaces on the opposite surfaces of the package body, three lead terminals are led out from the package body, and two light emitting diode elements are provided inside the package. It is die-bonded to a common lead terminal so as to face the light emitting surface, and the surface electrode of each light emitting diode element is individually wire bonded to the other two lead terminals.

According to a second aspect of the present invention, there is provided a dual-sided light emitting display device, wherein the side surface light emitting semiconductor device according to the first aspect is formed on the substrate such that the light emitting surfaces are located on the front and back sides of the printed wiring board. It was fitted into the small hole of.

According to a third aspect of the present invention, there is provided a side surface light emitting / receiving semiconductor device having a light emitting surface on one surface of the package body and a light receiving surface on the other surface of the package body, and three lead terminals are led out from the package body. And inside the package,
The light emitting diode element and the light receiving element are die-bonded to a common lead terminal so as to face the light emitting surface and the light receiving surface, respectively, and the surface electrodes of each element are individually wire bonded to the other two lead terminals. It is a thing.

A side surface light receiving semiconductor device according to a fourth aspect is
A light receiving surface is provided on each of the opposing surfaces of the package body, and three lead terminals are led out from the package body. Inside the package, two common light receiving elements are provided so that two light receiving elements face the light receiving surfaces. The terminals are die-bonded, and the surface electrodes of each light-receiving element are individually wire-bonded to the other two lead terminals.

[0011]

The operation of the present invention is as follows. According to the first aspect of the present invention, light is emitted in the opposite direction from the opposite side surfaces of the package body by energizing through the lead terminals.

According to the second aspect of the present invention, the front surface and the back surface of one printed wiring board individually emit surface light.

According to the third aspect of the invention, the light incident on one surface of the same package is detected, and the light is emitted from the other surface.

According to the fourth aspect of the invention, the light incident on each of the opposing surfaces of the package is individually detected.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. 1A and 1B show a side surface light emitting semiconductor device according to an embodiment of the present invention, FIG. 1A is a front view thereof, and FIG.
(C) is a cross-sectional view of the package body.

The side surface light emitting semiconductor device 11 includes a package body 12 formed of a transparent epoxy resin and having a substantially rectangular parallelepiped shape. A convex lens portion 12 serving as a light emitting surface is provided on each of opposite side surfaces of the package body 12.
a and 12b are integrally formed. Package body 1
From the lower side surface of 2, the three lead terminals 13a, 13b,
13c has been derived.

Inside the package body 12, the lead terminal 13 is commonly used by the two light emitting diode elements 14a and 14b.
Die bonding is performed on the front and back surfaces of the tip of b with a conductive paste or the like. Light emitting diode element 1
Both 4a and 14b may emit the same color or different colors. Between the surface electrode of the light emitting diode element 14a and the lead terminal 13c is a thin metal wire 15a such as gold,
Surface electrode of light emitting diode element 14b and lead terminal 13
A thin metal wire 15b is formed between a and a and is wire-bonded.

FIG. 2 shows the side surface emitting semiconductor device 11 described above.
3 shows a state in which is mounted on the mounting board 16. Lead terminal 13
By energizing the light emitting diode element 14a through b and 13c, light is emitted from the lens portion 12a in the left direction of the drawing, and by energizing the light emitting diode element 14b through the lead terminals 13a and 13b, Light is emitted from the lens portion 12b to the right in the drawing.

The side surface light emitting semiconductor device 11 is not only used as a display device, but as shown by a chain line in FIG. 2, the light receiving sensor 1 faces the lens portions 12a and 12b.
By arranging 7a and 17b, it is possible to realize a compact optical detection device that can detect an object passing between the side surface light emitting semiconductor device 11 and each of the light receiving sensors 17a and 17b.

FIG. 3 shows a linear display device constituted by arranging the side surface light emitting semiconductor devices 11 shown in FIG. 1 in parallel. The same figure (a) is the front view, (b) is sectional drawing. This linear display device 20 includes a printed wiring board 2 having an elongated rectangular shape.
1 is formed with small pitches 22 that are slightly larger than the package body 12 at a constant pitch, and the package body 12 is formed in each small hole 22.
Each lead terminal 13a to 13c in which the
Is connected to a printed wiring (not shown).
Note that, in FIG. 3, a casing and the like for covering the printed wiring board 21 are omitted in the drawing.

According to this linear display device 20, each light emitting diode element 14a, 14 of each side surface light emitting semiconductor device 11 is formed.
By selectively turning on b, it is possible to individually perform linear display on both surfaces of the printed wiring board 21.

FIG. 4 is a longitudinal sectional view showing another embodiment of the side surface light emitting semiconductor device. This side surface light emitting semiconductor device 31 is
Among the lead terminals led out from the package body 12, bowl-shaped recesses 33 are formed on the front and back of the tip of the central lead terminal 32, and the light emitting diode elements 14a and 14b are die-bonded in the recesses 33. . Light emitted laterally from the light emitting diode elements 14a and 14b is reflected by the inner surface of the recess 33 and travels forward, so that the directivity of this type of device can be enhanced.

FIG. 5 is a sectional view showing still another embodiment of the side surface light emitting semiconductor device. This side surface emitting semiconductor device 4
In No. 1, the light emitting diode elements 14a and 14b are die-bonded to a substrate 42 having a light shielding property, such as a ceramic substrate or a glass epoxy substrate coated with a light shielding paint. The substrate 42 includes light emitting diode elements 14a and 14b.
A circular step 42a is formed so as to surround the
Lens portions 43a and 43b are formed by potting a transparent epoxy resin inside thereof. Each lead terminal 44 is soldered and connected to a wiring pattern led to the lower end of the substrate 42. According to the present embodiment, the light blocking substrate 42 allows the two lens portions 43 to be formed.
Since a and 43b are optically blocked, there is no sneak of light between the lens parts.

FIG. 6 is a sectional view showing still another embodiment of the side surface light emitting semiconductor device. In each of the above embodiments, 3
Although the lead terminals of the book are led out in the same direction from one side surface of the package body, in the side surface light emitting semiconductor device 51,
The lead terminal 5 to which the light emitting diode elements 14a and 14b are die-bonded from one side surface of the package body 12
2b is led out, and lead terminals 52a and 52c which are wire-bonded to the respective elements are led out from the opposite side surface. Each of the lead terminals 52a to 52c is L
It is formed in a bent shape.

FIG. 7 is a sectional view showing a state in which the side surface light emitting semiconductor device 51 shown in FIG. 6 is mounted. Mounting board 5
The package main body 12 is fitted into the small hole 54 formed in the terminal 3, and the tip portions of the lead terminals 52a to 52c are soldered to the printed wiring formed on the substrate 53.

FIG. 8 shows a double-sided light emitting display device constituted by using the side surface light emitting semiconductor device 51 shown in FIG. As shown in FIG. 7, this double-sided light emitting display device 55 has small holes 54 vertically and horizontally formed at a fixed pitch in a mounting substrate 53, and the side surface light emitting semiconductor device 51 is fitted and connected to each small hole 54. There is. One end of the mounting board 53 is connected to a display control box 56. According to this double-sided light emitting display device 55, by selectively turning on the light emitting diode elements 14a and 14b of each side surface light emitting semiconductor device 51, it is possible to perform surface light emission display on both surfaces of the substrate 53. The double-sided light emitting display device 55 is suitable for, for example, an interior or an advertisement display device in a vehicle.

Although two light emitting diode elements are incorporated in the package body in each of the embodiments described above, the present invention is not limited to this, and a light receiving element may be incorporated. The side surface light emitting / light receiving semiconductor device 61 shown in FIG.
3b is die-bonded to the light emitting diode element 62a, and the other surface is light-receiving element 6 such as a photodiode.
2b is die-bonded. Therefore, here, the lens portion 12a corresponds to the light emitting surface, and the lens portion 12b corresponds to the light receiving surface.

According to the side surface light emitting / light receiving semiconductor device 61, for example, the infrared projector 63 is opposed to the lens portion 12b.
It is also possible to realize a light detection device in which the light emitting diode element 62a emits visible light when the infrared light receiving element 62b detects the infrared ray from the projector 63.

FIG. 10 shows an example of a side light receiving semiconductor device in which two light receiving elements are incorporated in the package body. This side surface light receiving semiconductor device 71 has a lead terminal 13b.
On the front and back surfaces of the light receiving elements 72a, 7 such as photodiodes
2b are each die-bonded. Therefore, here, the lens portions 12a and 12b respectively correspond to light receiving surfaces.

According to the side-light-receiving semiconductor device 71, the projector 73 faces the lens portions 12a and 12b, respectively.
If a and 73b are installed, it is possible to individually optically detect each of the objects T passing between the light projectors 73a and 73b and the lens units 12a and 12b.

As the packages applied to the side surface light emitting / receiving semiconductor device shown in FIG. 9 and the side surface receiving semiconductor device shown in FIG. 10, those shown in FIGS. 4, 5 and 6 are used. Further, a surface mount type package described later can also be used.

FIG. 11 shows an example of a surface-mount side light emitting semiconductor device. FIG. 1A is an external perspective view,
(B) is sectional drawing which shows a mounting state. The side surface light emitting semiconductor device 81 includes lead terminals 13a and 13c led from one side surface of the package body 12, and a lead terminal 13b.
And are bent in opposite directions at substantially right angles to form the mounting board 16
It is configured to stand on its own.

FIG. 12 shows another embodiment of the surface-mount type side surface emitting semiconductor device. FIG. 1A is an external perspective view, and FIG. 1B is a vertical sectional view. The package body 92 of the side surface light emitting semiconductor device 91 has a rectangular parallelepiped shape formed of plastic having heat resistance and light shielding properties, and has concave portions 93a and 93b for incorporating the light emitting diode elements 14a and 14b on opposite side surfaces. Has been formed. The common lead terminal 94b to which the light emitting diode elements 14a and 14b are die-bonded is led out to the lower surface of the package body 12 and is bent and formed on one side. Further, the lead terminals 94a and 94c connected to the surface electrodes of the respective elements 14a and 14b are also led out to the lower surface of the package body 12 and are bent and formed in the opposite direction to the lead terminals 94b. The recesses 93a and 93b are filled with a transparent epoxy resin, and have flat light emitting surfaces 95a and 95b.
Are formed.

The side surface light emitting semiconductor device 91 is surface-mounted on the substrate similarly to the device shown in FIG. The package body 12 described above may be formed of ceramic, and the lead terminals 94a to 94c may be formed of a conductive thick film.

[0035]

As is apparent from the above description, the present invention has the following effects. That is, according to the first aspect of the present invention, since light can be emitted in opposite directions from the opposite side surfaces of one package, two side surface emitting LED lamps can be mounted as in the conventional example. The area occupied by the substrate can be reduced and the manufacturing cost of the electric device can be reduced as compared with the case where light is emitted in the opposite direction.

According to the second aspect of the present invention, both the front surface and the back surface of the printed wiring board can be individually surface-emitted, and therefore, as compared with the conventional example in which individual surface-emission display devices are used, The display device can be realized compactly and inexpensively.

According to the third aspect of the present invention, the light incident on one surface of the package can be detected and the light can be emitted from the other surface. Therefore, the light detection and the light emitting display are related to each other. It is possible to provide an electronic component suitable for the purpose to be performed in a small size and at low cost.

According to the fourth aspect of the present invention, it is possible to detect the lights respectively incident on the opposite side surfaces of the package. Therefore, it is possible to reduce the size of the electronic component suitable for the purpose of simultaneously detecting the lights from the opposite directions. And it can be provided at low cost.

[Brief description of drawings]

FIG. 1A is a front view of a side surface light emitting semiconductor device according to an embodiment of the present invention. (B) is the longitudinal cross-sectional view. (C) is a cross-sectional view of the package body.

FIG. 2 is a diagram showing a usage state.

FIG. 3A is a partial front view of the linear display device.
(B) is the sectional view.

FIG. 4 is another embodiment of the side surface light emitting semiconductor device.

FIG. 5 is still another embodiment of the side surface light emitting semiconductor device.

FIG. 6 is still another embodiment of the lateral light emitting semiconductor device.

7 is a cross-sectional view showing a mounted state of the side surface light emitting semiconductor device shown in FIG.

FIG. 8 is an external perspective view of a double-sided light emitting display device.

FIG. 9 is a cross-sectional view showing an example of a side surface light emitting / light receiving semiconductor device.

FIG. 10 is a cross-sectional view showing an example of a side light receiving semiconductor device.

FIG. 11A is a perspective view showing an example of a surface-mounting side light-receiving semiconductor device. (B) is a sectional view showing a mounting state.

FIG. 12A is a perspective view of another embodiment of the surface-mount side light emitting semiconductor device. (B) is the sectional view.

FIG. 13A is a front view of a conventional side surface emitting semiconductor device. (B) is the longitudinal cross-sectional view.

FIG. 14 is a diagram showing an example of use of a conventional side surface emitting semiconductor device.

[Explanation of symbols]

 Reference numeral 11 ... Side-emitting semiconductor device 12 ... Package body 12a ... Lens portion 13a to 13c ... Lead terminals 14a, 14b ... Light emitting diode element 20 ... Linear display device 31 ... Side emitting semiconductor device 41 ... Side emitting semiconductor device 51 ... Side emitting semiconductor Device 61 ... Side light emitting / light receiving semiconductor device 71 ... Side light receiving semiconductor device 81 ... Surface mount side light emitting semiconductor device 91 ... Surface mount side light emitting semiconductor device

Claims (4)

[Claims] 1. A light emitting surface is provided on each of the opposing surfaces of the package body, and three lead terminals are led out from the package body. Two light emitting diode elements are opposed to each of the light emitting surfaces inside the package. Thus, the side light emitting semiconductor device is characterized in that it is die-bonded to a common lead terminal, and the surface electrode of each light emitting diode element is individually wire-bonded to the other two lead terminals. 2. The side surface light emitting semiconductor device according to claim 1, wherein the light emitting surfaces are fitted into small holes with a constant pitch formed in the board such that the light emitting surfaces are located on the front and back of the printed wiring board. Dual-sided light emitting display device. 3. A package body has a light emitting surface on one surface and a light receiving surface on the other surface, and three lead terminals are led out from the package body. Inside the package, a light emitting diode element and a light receiving surface are provided. The elements are die-bonded to a common lead terminal so as to face the light emitting surface and the light receiving surface, respectively, and the surface electrode of each element is individually wire-bonded to the other two lead terminals. Side emitting / light receiving semiconductor device. 4. A light receiving surface is provided on each of the opposing surfaces of the package body, and three lead terminals are led out from the package body, and two light receiving elements face each of the light receiving surfaces inside the package. Thus, the side surface light receiving semiconductor device is characterized in that it is die-bonded to a common lead terminal, and the surface electrodes of each light-receiving element are individually wire-bonded to the other two lead terminals.