JP2002344025A - Multicolor lateral emission surface-mounted led - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multicolor lateral emission surface-mounted LED, which is reduced in mounted height and improved in light utilization efficiency and color mixing property, using a simple constitution. SOLUTION: This multicolor lateral emission surface-mounted LED 10 is provided with a chip substrate 12, which has terminal sections 17a-17d for surface mounting on its rear surface formed as a mounting surface, a plurality of LED chips 13r, 13g, and 13b which are mounted on the substrate 12 located close to each other and emit different colors of light, a lens section 15 which is formed on the substrate 12 to cover the chips 13r, 13g, and 13b and is made of transparent or translucent resin. This LED 10 is also provided with a reflection frame 16, which is formed of an opaque resin so as to surround the lens section 15, except for one side face that is formed as a light-emitting surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a multicolor lateral light emitting surface mount LED which emits light in a lateral direction.

[0002]

2. Description of the Related Art Conventionally, such a multicolor lateral light emitting type surface mount LED is configured as a so-called side view type, for example, as shown in FIG. That is, in FIG. 3, the chip LED 1 includes three color LED chips 3r, 3g, 3b mounted on the surface (front surface) of the chip substrate 2 standing upright with respect to the mounting surface, and the respective LED chips 3r, 3g, 3b.
And a lens portion 4 formed so as to cover the entire front surface of the chip substrate 2.

[0003] The chip substrate 2 is configured as a flat copper-clad wiring substrate, and is mounted in an upright state with respect to a mounting substrate when used. And
The chip substrate 2 has red LED chips 3r, green LED chips 3g and blue LEDs L on three chip mounting lands (not shown) provided in the longitudinal direction in this order.
The ED chips 3b are respectively bonded,
The connection lands (not shown) adjacent to the chip mounting lands are respectively connected by gold wires 3a (or gold bumps).

Further, the chip substrate 2 is provided on both sides thereof with electrode portions 2a, 2b, 2c, 2d connected to the chip mounting lands and the connection lands, respectively. Here, the electrode portion 2a is on the chip mounting land of the LED chip 3g, the electrode portion 2b is on the chip mounting land of the LED chip 3r, and the electrode portion 2c is on the LED chip 3g.
b, and the electrode portion 2d is connected to a common connection land. Thus, the chip LED 1 forms a circuit illustrated in FIG. In the case of the drawing, in the chip LED1, LE
The electrostatic protection diodes 5g and 5b are connected to the D chips 3g and 3b, respectively.

The lens section 4 is made of a transparent or translucent material, for example, a thermosetting epoxy resin.

According to the chip LED 1 having such a configuration, the chip substrate 2 is mounted on the mounting substrate 6 (FIGS. 3B and 3C).
(Indicated by a dashed line in FIG. 3). When a drive voltage is appropriately applied to the LED chips 3r, 3g, 3b from the electrode portions 2a to 2d provided on the chip substrate 2, respectively, the LED chips 3r, 3b
g and 3b emit light, respectively, and these lights are emitted to the outside through the lens unit 4. In this manner, the LED chips 3r, 3g, 3b are appropriately driven and controlled to emit light, so that the entire chip LED 1 can emit full-color light.

[0007]

However, the chip LED 1 having such a configuration has the following problems. That is, in the chip LED 1, the LED of each color
Since the chips 3r, 3g, and 3b are arranged in a direction perpendicular to the mounting surface, the mounting height H (see FIG. 3C) increases. In addition, since there is light that leaks from the lens unit 4 in the vertical direction, the efficiency of use of light from each of the LED chips 3r, 3g, and 3b decreases. Further, the front surface of the lens unit 4 as a light emitting surface is provided with the LED chips 3r, 3r.
Since the LED chips 3r, 3g, and 3b emit light at the same time, the color mixing is low because they are relatively far from the LED chips 3g and 3b.

In view of the above, the present invention provides a multicolor lateral light emitting type surface mount LED which has a simple structure, reduces mounting height, and improves light use efficiency and color mixing. It is intended to provide.

[0009]

According to the structure of the present invention, the object is to provide a chip substrate having a mounting surface on the back surface and having surface mounting terminals, and a chip substrate which is close to each other on the chip substrate. A plurality of LED chips of each emission color to be mounted;
A lens portion made of a transparent or translucent resin so as to cover each LED chip on the chip substrate, and a reflection frame made of an opaque resin so as to surround except one side as a light emitting surface of the lens portion. This is achieved by a multi-color lateral light emitting surface mount LED, characterized in that:

[0010] Multicolor lateral light emitting surface mount L according to the present invention
In the ED, preferably, the LED chips are LED chips of three colors.

[0011] Multicolor lateral light emitting surface mount L according to the present invention
The ED is preferably arranged such that the LED chip forms a vertex of a triangle on the surface of the chip substrate.

A multi-color lateral light emitting surface mount L according to the present invention.
In the ED, preferably, the LED chips are linearly arranged on the surface of the chip substrate.

Multicolor lateral light emitting surface mount L according to the present invention
In the ED, preferably, the reflection frame is made of a material having a high reflectance.

According to the above configuration, the driving voltage is applied from the surface mounting terminal section to the LED chips of each luminescent color on the chip substrate, so that the LED chips of each luminescent color emit light. Then, the light from the LED chips of each emission color passes through the lens part after part of the light is directly reflected and another part of the light is reflected by the inner surface of the reflection frame, and then from one side of the lens part to the outside. Emit.

In this case, since the LED chips of each emission color are arranged on the surface of the chip substrate parallel to the mounting surface,
The overall mounting height can be configured to be low. Also,
The LED chips of each emission color are arranged close to each other on the surface of the chip substrate, and the distance from the light from the LED chips of each emission color is reflected by the reflection frame to exit from the lens unit to the outside. Because of the length, the light from the LED chips of each emission color is mixed well.

Further, since the lens portion is surrounded by the reflection frame except for the light emitting surface, light from the LED chips of each emission color is reflected by the reflection frame and emitted to the outside from the light emitting surface. As a result, the efficiency of using light from the LED chips of each emission color is improved. As described above, according to the present invention, the mounting height is reduced, the thickness is easily reduced, and the light use efficiency and color mixing by the reflective frame are improved.

[0017] The above-mentioned LED chip is an LED having three luminescent colors.
In the case of a D chip, for example, full-color light is emitted by appropriately mixing the light from each LED chip by using LED chips of the three primary colors of light of red, green and blue. be able to.

When the LED chips are arranged so as to form the vertices of a triangle on the surface of the chip substrate,
Since the distance between the LED chips is the shortest, the color mixing is further improved.

When the LED chips are arranged in a straight line on the surface of the chip substrate, the distance between the LED chips is relatively short, and the color mixing is improved.
The shape of the chip mounting land for mounting each LED chip on the chip substrate becomes simple, and the cost can be reduced.

When the reflection frame is made of a material having a high reflectance, the amount of light when the light from each LED chip is incident on the inner surface of the reflection frame and reflected is increased. Is improved, and the brightness is further increased.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to FIGS. still,
Since the embodiments described below are preferred specific examples of the present invention, various technically preferred limitations are added.
The scope of the present invention is not limited to these embodiments unless otherwise specified in the following description.

FIG. 1 shows the configuration of a first embodiment of a multicolor lateral light emitting surface mount LED according to the present invention. In FIG. 1, a multi-color lateral light emitting type surface mount LED (hereinafter, referred to as a “multi-color lateral light emitting type surface mount LED”) is used.
LED) 10 is a side view type chip L
It is configured as an ED, and the mounting substrate 11 (shown by a dashed line)
A chip substrate 12 to be mounted thereon, and a chip substrate 12
Three color LED chips 13r, 13g, 1 mounted on
3b, the electrostatic protection diodes 14g, 14b, and each LE
The lens unit 15 formed so as to cover the entire surface of the D chip 13r, 13g, 13b, the electrostatic protection diode 14g, 14b and the chip substrate 12, and the side surface (the front surface in FIG. 1) of the lens unit 15 And a reflection frame 16 formed so as to surround it.

The chip substrate 12 is configured as a flat copper-clad wiring substrate as shown in FIG.
The chip mounting land 12a and the connection land 12
b, 12c and 12d. Here, the chip mounting lands 12a, the connection lands 12b, 12c, 12
Each of the terminals d extends through the side surface of the chip substrate 12 to the back surface, thereby forming the terminal portions 17a and 17a for surface mounting.
17b, 17c, and 17d.

The LED chips 13r, 13g and 13
b denotes LED chips of red, green and blue emission colors, respectively.
a, and is die-bonded to a position forming a vertex of a triangle as close as possible to the chip mounting land 12.
A connection land 12b adjacent to a is connected by wire bonding 18 such as a gold wire or a gold bump.

Further, the LED chips 13g and 13b are
Each of the connection lands 12c and 12d is grounded by wire bonding 19. In the case of the drawing, the electrostatic protection diode 14 is provided on the connection land 12b.
g and 14b are insulated and attached to the connection land 12b.
4b is connected to the connection lands 12c and 12d by wire bonding 20, respectively. Thus, the LED 10 forms a circuit similar to that illustrated in FIG.

The lens portion 15 is made of a transparent or translucent material, for example, a thermosetting resin, for example, a transparent or milky epoxy resin. This lens unit 15
The light from the LED chips 13r, 13g, and 13b is emitted from the front surface serving as a light emitting surface, thereby acting as a light emitting unit.

The reflection frame 16 is made of an opaque material having a high reflectivity, for example, a white thermosetting epoxy resin, and the inner surface thereof has LED chips 13r, 13g, and 13b.
To reflect light.

The lateral light emitting type surface mount LED 10 according to the embodiment of the present invention is configured as described above, and the chip substrate 12 is placed and mounted in parallel with the mounting substrate 11. The terminal portion 17 provided on the chip substrate 12
When a drive voltage is appropriately applied from a, 17b, 17c, and 17d to the LED chips 13r, 13g, and 13b of the respective emission colors, the LED chips 13r, 13 of the respective emission colors are applied.
g and 13b emit light.

Then, these LED chips 13r, 1
After the light from 3g and 13b passes through the lens portion 15 and is partially reflected directly and the other portion is reflected by the inner surface of the reflection frame 16, the light emission not covered by the reflection frame 16 of the lens portion 15 is emitted. The light is emitted from one side surface to the outside. In this way, the LED chips 13r of each emission color,
By appropriately driving and controlling 13g and 13b to emit light, the entire LED 10 can emit full-color light in the lateral direction.

In this case, the LED chips 13 of each emission color
r, 13g, and 13b are disposed on the surface of the chip substrate 12 parallel to the surface of the mounting substrate 11, respectively.
Each LED chip 13r, 13g, 13b is located at the same height. Therefore, the mounting height of the entire LED 10 can be reduced, and the thickness can be easily reduced.

Further, the LED chips 13r, 1
3g and 13b are arranged as close as possible to each other on the surface of the chip substrate 12, and each LED chip 1
The distance from the light from 3r, 163g, and 13b until the light is reflected by the reflection frame 16 and exits from the light emitting surface of the lens unit 15 to the outside becomes longer. Therefore, the LED chip 13 of each emission color
The light from r, 13g, and 13b is sufficiently mixed before the light reaches the light emitting surface of the lens unit 15.

Further, since the lens section 15 is surrounded by the reflection frame 16 except for the light emitting surface, the LED of each emission color
The light from the chips 13r, 13g, 13b is
Then, the light is emitted from the light emitting surface to the outside, and the efficiency of using the light from the LED chips 13r, 13g, and 13b of each emission color is improved, and the brightness can be easily increased.

FIG. 2 shows the configuration of a second embodiment of a multicolor lateral light emitting surface mount LED according to the present invention. In FIG. 2, a multicolor lateral light emitting type surface mount LED (hereinafter, referred to as a “multi-color lateral light emitting type surface mount LED”) is used.
LED) 20 is a side view type chip L
Since it is configured as an ED and has substantially the same configuration as the LED 10 shown in FIG. 1, the same components as those of the LED 10 are denoted by the same reference numerals and description thereof will be omitted.

The LED 20 is different from the LED 10 shown in FIG. 1 in that the electrostatic protection diodes 14 g and 14 b are omitted and the LED 20 is provided on the back side of the chip substrate 12 in FIG.
As shown in (C), adjacent to the common terminal portion 17a,
The configuration is different in that a cathode mark 21 indicating a cathode is provided.

According to the LED 20 having such a configuration, the light from each of the LED chips 13r, 13g, and 13b operates in the same manner as the LED 10 shown in FIG. The light is emitted to the outside from the light emitting surface. Here, the LED 20 is connected to the terminal 1
Since the cathode mark 21 is provided adjacent to the LED 7a, the LED 20 can be mounted on the mounting substrate 11 by confirming the cathode mark 21 and mounting.
Can be prevented from being mounted in the wrong direction.

As described above, according to the present invention, a thin, high-profile light source suitable for a backlight light source of a portable device such as a mobile phone, a vehicle-mounted display including a backlight, for example, and various indicators. A multi-color lateral light emitting surface mount LED having high luminance and high color mixture can be configured.

In the above embodiment, any LE
Also in D10 and D20, LED chips 13r and 13r
g and 13b are chip mounting lands 12a of the chip substrate 12.
In the above, they are arranged at positions forming the vertices of a triangle, but are not limited to this, and may be arranged on a straight line. In this case, the chip mounting land 1 on the chip substrate 12
Since the shape of 2a is simplified, the cost of the chip substrate 12 can be reduced.

In the above-described embodiment, each of the LEDs 10 and 20 is provided with the red, green and blue LED chips 13r, 13g and 13b, but is not limited thereto. L having three emission colors
An ED chip may be mounted, or four or more LED chips of different emission colors, or four or more LED chips of partially different emission colors may be mounted.

[0039]

As described above, according to the present invention, since the LED chips of each emission color are arranged on the surface of the chip substrate parallel to the mounting surface, the overall mounting height is low. Can be done. In addition, the LED chips of each emission color are arranged close to each other on the surface of the chip substrate, and the light from the LED chips of each emission color is reflected by the reflection frame and emitted from the lens unit to the outside. Since the distance is long, the light from the LED chips of each emission color is mixed well. Further, since the lens portion is surrounded by the reflection frame except for the light emitting surface, light from the LED chips of each emission color is reflected by the reflection frame and emitted to the outside from the light emitting surface. As a result, the efficiency of using light from the LED chips of each emission color is improved. In this way,
ADVANTAGE OF THE INVENTION According to this invention, while mounting height becomes low and it becomes thin easily, the light use efficiency and color mixing by a reflective frame improve. Thus, according to the present invention, there is provided a multicolor lateral-emission type surface-mounting LED that has a simple structure, which reduces the mounting height and improves light use efficiency and color mixing. Can be done.

[Brief description of the drawings]

FIG. 1 shows a multicolor lateral light emitting surface mount LED according to the present invention.
(A) is a front view, (B) is a right side view, and (C) is a plan view showing a first embodiment without a lens portion and a reflection frame.

FIG. 2 shows a multicolor lateral light emitting surface mount LED according to the present invention.
(A) plan view, (B) front view,
(C) is a bottom view, (D) is a right side view, and (E) is an equivalent circuit diagram.

3A is a plan view, FIG. 3B is a front view, FIG. 3C is a right side view, and FIG. 3D is an equivalent circuit diagram showing an example of a configuration of a conventional multicolor lateral light emitting surface mount LED.

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 multicolor lateral light emitting surface mounting LED 11 mounting substrate 12 chip substrate 12 a chip mounting land 12 b, 12 c, 12 d connection land 13, r, 13 g, 13 b LED chip 14 g, 14 b electrostatic protection diode 15 lens unit 16 reflection frame 20 Multicolor lateral emission type surface mount LED 21 Cathode mark

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5F041 AA03 AA11 AA47 BB25 CB31 DA07 DA14 DA17 DA26 DA44 DA57 DA58 DA74 DA76 DA81 FF04 FF11

Claims (5)

[Claims] 1. A chip substrate having a mounting surface on a back surface and having a surface mounting terminal portion; a plurality of LED chips of respective luminescent colors mounted close to each other on the chip substrate; A lens portion made of a transparent or translucent resin so as to cover each LED chip on the substrate; and a reflection frame made of an opaque resin so as to surround except for one side as a light emitting surface of the lens portion. A multi-color lateral light emitting surface mount LED, characterized in that: 2. The method according to claim 1, wherein the LED chip has three light emitting colors of L.
The multicolor lateral light emitting surface mount LED according to claim 1, wherein the LED is an ED chip. 3. The multicolor lateral light emitting surface mount LED according to claim 2, wherein the LED chips are arranged so as to form triangular vertices on the surface of the chip substrate. 4. The multicolor lateral light emitting surface mount LED according to claim 1, wherein the LED chips are arranged linearly on a surface of the chip substrate. 5. The multicolor lateral light emitting surface mount LED according to claim 1, wherein the reflection frame is made of a material having a high reflectance.