JP2005252082A - Light source, light guiding device and surface light source - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light source that can emit mixed color light or high-intensity monoclinic light through an opening reduced for outgoing light. <P>SOLUTION: A surface light source 1 is made of a light source 2, a light guiding device 8, and a reflector 7 housed in a reflector case 19. The light source 2 is inserted and formed in a way that a number of lead frames with semiconductor light emission elements in the respective lead frames are positioned in parallel, the semiconductor light emission elements are arranged linearly or zigzag and the openings 3a and 3b are provided along the side of at least one of both edges and above the semiconductor light emission elements in a lead frame with the lowest height of the semiconductor light emission element among a plurality of lead frames or a plurality of lead frames arranged in parallel. The light guiding device 8 is formed in a way that the side edge of the rear 9 is cut to form a notch 11 as a light guide, the side edge of the front 10 for light emission is taper-cut to form a taper shape 12 for the notch 11, and a reflector 7 is provided above the taper shape 12. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a light source device used as a light source such as a liquid crystal display device, for example, and a plurality of semiconductor light emitting elements having different light emission colors and a plurality of semiconductor light emitting elements having the same light emission color are combined into one package, and lead frames and lead terminals are provided. The present invention relates to a light source device, a light guide, and a surface light source device that emit light of a mixed color and high-luminance emission light with a small width.

  A light-emitting diode that is a semiconductor light-emitting element is configured to be small in size, and can efficiently obtain a clear emission color without worrying about a broken ball.

  However, when obtaining white light, a conventional light source device is obtained by arranging semiconductor light emitting elements emitting red light, green light and blue light in a direction transverse to the emission surface and mixing light from the semiconductor light emitting elements of the respective colors. It was.

  Further, when obtaining high brightness with monochromatic light, the conventional light source device has obtained a plurality of semiconductor light emitting elements arranged side by side with respect to the emission surface.

Furthermore, as a conventional light source device for obtaining white light, a light source device that obtains pseudo white light by, for example, applying a wavelength conversion material to a blue semiconductor light emitting element is also known.
Japanese Patent Laid-Open No. 10-190066

  Since the conventional light source device obtains white light by arranging semiconductor light emitting elements emitting red light, green light and blue light in the lateral direction with respect to the emission surface, for example, the light emission color of the semiconductor light emitting element is red light emission (R). , Green light emission (G), and blue light emission (B) are arranged in the order of three, light from R and G adjacent to each other and G and B can be mixed, but R and There is a problem that it is difficult to mix the emitted light of the semiconductor light emitting elements of different emission colors, such that different light cannot be mixed with B and different emission colors on both sides stand out.

  Further, in the case of a light source device using a conventional wavelength conversion material, the wavelength conversion material always contains ultraviolet light in the light emitted from the semiconductor light emitting element itself, or is caused by external light (particularly sunlight). For example, there is a problem that the wavelength conversion material is deteriorated by light (wavelength) having a short wavelength such as ultraviolet rays or cosmic rays.

  Furthermore, in the case of using a reaction system for each wavelength of red light emission (R), green light emission (G), and blue light emission (B), a white light source using a wavelength conversion material cannot obtain three wavelengths. There are issues that cannot be used due to lack of things and energy levels.

  The present invention has been made to solve the above-described problems, and a plurality of lead frames in which semiconductor light-emitting elements having different emission colors and semiconductor light-emitting elements having the same emission color are arranged on one lead frame. When semiconductor light emitting elements having different emission colors or semiconductor light emitting elements of the same emission color are arranged in a linear or zigzag manner in the opening direction when arranged in parallel, the semiconductor light emitting elements are arranged in approximately one row in the emission direction. In the case of semiconductor light emitting elements having different emission colors, mixed color light is emitted from the opening, and in the case of semiconductor light emitting elements having the same emission color, high-luminance (strong energy) monochromatic light is emitted from the opening. Another object of the present invention is to provide a light source device, a light guide body, and a surface light source device that are small in size and high in brightness and capable of reducing the size of the opening.

  In order to achieve the above object, a light source device according to a first aspect of the present invention includes a plurality of lead frames each having a plurality of semiconductor light emitting elements having different emission colors or the same emission color mounted in parallel on each lead frame. The semiconductor light-emitting elements having different emission colors or the same emission color are arranged so as to be linear or staggered, and at least one side surface direction of both ends of the plurality of lead frames arranged in parallel and the semiconductor The insert molding part is formed so as to have an opening at the top of the light emitting element.

  The light source device according to claim 1 is provided with a plurality of lead frames each having a plurality of semiconductor light emitting elements having different emission colors or the same emission color mounted in parallel on each lead frame and having different emission colors or the same. The light emitting semiconductor light emitting elements are arranged so as to be linear or zigzag, and have an opening at least on one side of both end sides of the plurality of lead frames arranged in parallel and above the semiconductor light emitting elements. Since the insert molding part is molded in this way, when the emission color is different, the light from the semiconductor light emitting element is emitted from the side of the opening in order from the side of the opening and the upper part of the opening. Light rays of emission color mixed with light rays from semiconductor light emitting elements of different emission colors while being directed in the direction are emitted from the openings. For example, light of a white emission color can be emitted from the opening by light from a semiconductor light emitting element emitting red light (R), green light (G), and blue light (B).

  In addition, in the case of the same emission color, light rays from the semiconductor light emitting element are emitted from the side of the opening in order from the back of the opening and emitted upward from the opening, and are emitted in the same direction while sequentially moving toward the opening. A light beam of emission color mixed with the light beam from the colored semiconductor light emitting element is emitted from the opening. For example, light of green emission (G) color with high luminance can be emitted from the opening by a light beam from a green light emission (G) semiconductor light emitting element.

  In the light source device according to claim 2, a plurality of lead frames in which a plurality of semiconductor light emitting elements having different light emission colors or the same light emission color are mounted on each lead frame are arranged in parallel in the order of the height of the semiconductor light emitting elements. A lead frame in which semiconductor light emitting elements having different emission colors or the same emission color are arranged so as to be linear or staggered and the semiconductor light emitting elements of the plurality of lead frames arranged in parallel are the lowest The insert molding part is formed so as to have an opening on the side and the upper part of the semiconductor light emitting element.

  The light source device according to claim 2 is provided with a plurality of lead frames in which a plurality of semiconductor light emitting elements having different emission colors or the same emission color are mounted on each lead frame in parallel in the order of the height of the semiconductor light emitting elements. In addition, semiconductor light emitting elements having different emission colors or the same emission color are arranged in a linear or staggered manner, and the lead frame side having the lowest height of the semiconductor light emitting elements of the plurality of lead frames arranged in parallel with each other and Since the insert molding part is formed so as to have an opening at the top of the semiconductor light emitting element, when the emission color is different, the light from the semiconductor light emitting element is emitted from the side of the opening in order from the back of the opening and the opening is opened. The light beam emitted in the upper direction of the part and proceeding in the direction of the opening part is not obstructed by the semiconductor light emitting device on the opening part side, A light beam emission color mixed with light from al different emission color of the semiconductor light emitting element emits from the opening. For example, light of a white emission color can be emitted from the opening by light from a semiconductor light emitting element emitting red light (R), green light (G), and blue light (B).

  In addition, in the case of the same emission color, light rays from the semiconductor light emitting element are emitted in the direction of the opening portion in order from the back of the opening portion, and the light rays sequentially proceeding in the direction of the opening portion are not disturbed by the semiconductor light emitting element on the opening portion side, Light rays of emission color mixed with light rays from the semiconductor light emitting elements of the same emission color are emitted from the openings while sequentially facing the opening portion. For example, light of green emission (G) color with high luminance can be emitted from the opening by a light beam from a green light emission (G) semiconductor light emitting element.

  Furthermore, the light source device according to claim 3 is characterized in that a wall having reflectivity is provided in a direction substantially perpendicular to a connecting portion direction in which the insert molding portion is connected to each lead frame of the semiconductor light emitting element.

  In the light source device according to the third aspect, the insert molding portion is provided with a wall having reflectivity in a direction substantially perpendicular to the connecting portion direction in which the lead frames of the semiconductor light emitting elements are connected. Light rays emitted in the direction along the frame can be reflected.

  Further, the light source device according to claim 4 has an arc shape or a linear shape that extends from both ends of the opening portion toward the opposite direction of the opening portion, and becomes narrower at both ends toward the opposite direction of the opening portion. It has a wall.

  The light source device according to claim 4 has an arcuate or straight wall extending from both ends of the opening toward the opposite direction of the opening and having a width at both ends narrowing from the opening toward the opposite direction of the opening. Therefore, the light emitted in the direction along the lead frame of each semiconductor light emitting element can be reflected in the direction of the opening and emitted from the opening, or can be emitted in the direction of the opening while being reflected on the walls facing each other many times. it can.

  Furthermore, the light source device according to claim 5 is characterized in that two light source devices are continuously formed as one unit so that the openings face each other.

  In the light source device according to the fifth aspect, since the two light source devices are continuously formed as one unit so that the openings face each other, a transparent resin is filled in a space above the semiconductor light emitting element of the two light source devices. Sometimes it can be filled at once.

  The light source device according to claim 6 is characterized in that a space is provided above the semiconductor light emitting element in which the insert molding portion is placed on each lead frame, and a transparent resin is filled between the walls.

  The light source device according to the sixth aspect of the present invention provides a space above the semiconductor light emitting element in which the insert molding portion is placed on each lead frame and is filled with a transparent resin between the walls, so that the light emitted from the semiconductor light emitting element is not blocked. The light can be emitted while passing through the transparent resin in the direction of the opening.

  Furthermore, the light source device according to claim 7 mechanically and electrically connects one end side of a plurality of lead frames in which semiconductor light emitting elements having different emission colors or the same emission colors are mounted on each lead frame. It is a structure.

  The light source device according to claim 7 has a structure in which one end side of a plurality of lead frames in which semiconductor light emitting elements having different emission colors or the same emission colors are mounted on each lead frame is mechanically and electrically connected. Therefore, when a plurality of semiconductor light emitting elements are connected in parallel, since no electrical connection is made externally, connection failure and the like can be avoided, and the electrodes of each semiconductor light emitting element and each lead frame are electrically connected by a gold wire or the like. When one of the semiconductor light emitting devices is inspected after wire bonding is performed, the one connected at one end can be used as a common line.

  Further, the light guide according to claim 8 is characterized in that the side surface portion end of the front surface portion is cut out in a tapered shape so that the incident portion cuts out the side surface portion end of the back surface portion and faces the notch portion. And

  In the light guide according to the eighth aspect, the side surface portion end of the front surface portion is cut out in a tapered shape so that the incident portion cuts out the side surface portion end of the back surface portion and faces the notch portion. It is possible to guide light from the back surface portion on the side surface portion side and to guide light from a part of the side surface direction in the back surface portion direction on the side surface portion side of the light guide.

  Further, the light guide according to claim 9 is characterized in that the ends of the pair of side surface portions are connected to each other with the other side surface portion and the inclined portion.

  In the light guide according to the ninth aspect, since the ends of the pair of side surface portions are connected to the other side surface portion and the inclined portion, the light from the back surface portion on the side surface portion side of the light guide is inclined. It can be reflected at the part.

  Further, the light guide according to claim 10 is characterized in that the cutout portion has a rectangular shape or a shape into which the light source device can be inserted.

  The light guide according to the tenth aspect has a rectangular shape or a shape into which the light source device can be inserted, so that the light from the light source device can be guided to the light guide without waste.

Furthermore, the surface light source device according to claim 11 includes a plurality of lead frames each having a plurality of semiconductor light emitting elements having different emission colors or the same emission color mounted in parallel on each lead frame, and each having a light emission color. Semiconductor light emitting elements of different or the same light emission color are arranged so as to be linear or staggered, and the plurality of lead frames arranged side by side have the lowest height of the semiconductor light emitting elements. A light source device that is insert-molded so as to have an opening in at least one side surface direction on both ends of the lead frame and on the top of the semiconductor light emitting element;
The incident part for guiding light is cut off at the side part end of the back part to form a notch part, and the side part end of the surface part from which light is emitted so as to face the notch part is cut out in a tapered shape. A light guide formed with a tapered portion;
A reflector having reflectivity provided on top of the tapered portion;
The light source device, a light guide and a case for housing the reflector are provided,
Place the light source device at the position of the notch in the light guide,
The light beams emitted from the plurality of semiconductor light emitting elements on the lead frame are emitted in the upper direction of the opening and the semiconductor light emitting element while avoiding the semiconductor light emitting elements, and the back surface side of the light guide above the notch The light emitted from the semiconductor light emitting element is guided into the light guide body from the side surface side of the light guide which is the lateral direction of the notch, and the light from the side surface side proceeds in the direction opposite to the side surface, and from the back surface side. The light is reflected by the tapered portion and is emitted from the surface portion while proceeding in the opposite direction.

The surface light source device according to claim 11 is provided with a plurality of lead frames each having a plurality of semiconductor light emitting elements having different light emission colors or the same light emission color mounted in parallel on each lead frame and having different light emission colors. The semiconductor light emitting elements of the same emission color are arranged so as to be linear or staggered, and a plurality of leads arranged side by side in the lead frame side where the height of the semiconductor light emitting elements of the plurality of lead frames arranged side by side is arranged. A light source device that is insert-molded so as to have an opening in at least one side surface direction on both end sides of the frame and in the upper part of the semiconductor light emitting element;
The incident part for guiding light is cut off at the side part end of the back part to form a notch part, and the side part end of the surface part from which light is emitted so as to face the notch part is cut out in a tapered shape. A light guide formed with a tapered portion;
A reflector having reflectivity provided on top of the tapered portion;
The light source device, a light guide and a case for housing the reflector are provided,
Place the light source device at the position of the notch in the light guide,
The light beams emitted from the plurality of semiconductor light emitting elements on the lead frame are emitted in the upper direction of the opening and the semiconductor light emitting element while avoiding the semiconductor light emitting elements, and the back surface side of the light guide above the notch The light emitted from the semiconductor light emitting element is guided into the light guide body from the side surface side of the light guide which is the lateral direction of the notch, and the light from the side surface side proceeds in the direction opposite to the side surface, and from the back surface side. Light is reflected from the tapered portion and is emitted from the surface portion while proceeding in the opposite direction. Therefore, the light source device mixes the light emitted from the plurality of semiconductor light emitting elements to form the back side portion and the cutout portion of the light guide. Guides the light emitted from the side of the light guide in the lateral direction into the light guide, and guides the light emitted upward from the back side of the light guide above the notch to the surface. The light emitted from multiple semiconductor light emitting elements is mixed while reflecting off the tapered part Can emit light mixed from final surface portion.

  Furthermore, a surface light source device according to a twelfth aspect is characterized in that a deflection sheet for deflecting light is provided on the upper portion of the light guide, and the light emitted from the surface portion is made uniform.

  The surface light source device according to claim 12 is provided with a deflecting sheet for deflecting light on the light guide and uniformizing the light emitted from the surface portion, thereby further improving the luminance and eliminating the color spots of the emission color. Can do.

  The light source device according to claim 1 is provided with a plurality of lead frames each having a plurality of semiconductor light emitting elements having different emission colors or the same emission color mounted in parallel on each lead frame and having different emission colors or the same. The light emitting semiconductor light emitting elements are arranged so as to be linear or zigzag, and have an opening at least on one side of both end sides of the plurality of lead frames arranged in parallel and above the semiconductor light emitting elements. Since the insert molding part is molded in this way, when the emission color is different, the light from the semiconductor light emitting element is emitted from the side of the opening in order from the side of the opening and the upper part of the opening. Light rays of emission color mixed with light rays from semiconductor light emitting elements of different emission colors while being directed in the direction are emitted from the openings. For example, light of a white emission color can be emitted from the opening by light from a semiconductor light emitting element emitting red light (R), green light (G), and blue light (B).

  In addition, in the case of the same emission color, light rays from the semiconductor light emitting element are emitted from the side of the opening in order from the back of the opening and emitted upward from the opening, and are emitted in the same direction while sequentially moving toward the opening. A light beam of emission color mixed with the light beam from the colored semiconductor light emitting element is emitted from the opening. For example, light of green emission (G) color with high luminance can be emitted from the opening by a light beam from a green light emission (G) semiconductor light emitting element.

  The light source device according to claim 2 is provided with a plurality of lead frames in which a plurality of semiconductor light emitting elements having different emission colors or the same emission color are mounted on each lead frame in parallel in the order of the height of the semiconductor light emitting elements. In addition, semiconductor light emitting elements having different emission colors or the same emission color are arranged in a linear or staggered manner, and the lead frame side having the lowest height of the semiconductor light emitting elements of the plurality of lead frames arranged in parallel with each other and Since the insert molding part is formed so as to have an opening at the top of the semiconductor light emitting element, when the emission color is different, the light from the semiconductor light emitting element is emitted from the side of the opening in order from the back of the opening and the opening is opened. The light beam emitted in the upper direction of the part and proceeding in the direction of the opening part is not obstructed by the semiconductor light emitting device on the opening part side, A light beam emission color mixed with light from al different emission color of the semiconductor light emitting element emits from the opening. For example, light of a white emission color can be emitted from the opening by light from a semiconductor light emitting element emitting red light (R), green light (G), and blue light (B).

  In addition, in the case of the same emission color, light rays from the semiconductor light emitting element are emitted in the direction of the opening portion in order from the back of the opening portion, and the light rays sequentially proceeding in the direction of the opening portion are not disturbed by the semiconductor light emitting element on the opening portion side, Light rays of emission color mixed with light rays from the semiconductor light emitting elements of the same emission color are emitted from the openings while sequentially facing the opening portion. For example, light of green emission (G) color with high luminance can be emitted from the opening by a light beam from a green light emission (G) semiconductor light emitting element.

  In the light source device according to the third aspect, the insert molding portion is provided with a wall having reflectivity in a direction substantially perpendicular to the connecting portion direction in which the lead frames of the semiconductor light emitting elements are connected. Light rays emitted in the direction along the frame can be reflected. Thereby, the emitted light from each semiconductor light emitting element can be guided to the opening.

  The light source device according to claim 4 has an arcuate or straight wall extending from both ends of the opening toward the opposite direction of the opening and having a width at both ends narrowing from the opening toward the opposite direction of the opening. Therefore, the light emitted in the direction along the lead frame of each semiconductor light emitting element can be reflected in the direction of the opening and emitted from the opening, or can be emitted in the direction of the opening while being reflected on the walls facing each other many times. it can. Thereby, the emitted light from each semiconductor light emitting element can be guided to the opening without leaving any excess.

  In the light source device according to the fifth aspect, since the two light source devices are continuously formed as one unit so that the openings face each other, a transparent resin is filled in a space above the semiconductor light emitting element of the two light source devices. Sometimes it can be filled at once. Thereby, productivity and reliability can be improved.

  The light source device according to the sixth aspect of the present invention provides a space above the semiconductor light emitting element in which the insert molding portion is placed on each lead frame and is filled with a transparent resin between the walls, so that the light emitted from the semiconductor light emitting element is not blocked. The light can be emitted while passing through the transparent resin in the direction of the opening. Thereby, there are few air layers and light can be radiate | emitted, without attenuating.

  The light source device according to claim 7 has a structure in which one end side of a plurality of lead frames in which semiconductor light emitting elements having different emission colors or the same emission colors are mounted on each lead frame is mechanically and electrically connected. Therefore, when a plurality of semiconductor light emitting elements are connected in parallel, since no electrical connection is made externally, connection failure and the like can be avoided, and the electrodes of each semiconductor light emitting element and each lead frame are electrically connected by a gold wire or the like. When one of the semiconductor light emitting devices is inspected after wire bonding is performed, the one connected at one end can be used as a common line. Thereby, reliability and productivity can be improved.

  In the light guide according to the eighth aspect, the side surface portion end of the front surface portion is cut out in a tapered shape so that the incident portion cuts out the side surface portion end of the back surface portion and faces the notch portion. It is possible to guide light from the back surface portion on the side surface portion side and to guide light from a part of the side surface direction in the back surface portion direction on the side surface portion side of the light guide. As a result, it is possible to guide the light emitted from the light source device into the light guide without leaving a large amount, and to make a large incident surface for guiding the light.

  In the light guide according to the ninth aspect, since the ends of the pair of side surface portions are connected to the other side surface portion and the inclined portion, the light from the back surface portion on the side surface portion side of the light guide is inclined. It can be reflected at the part. Thereby, light can be propagated to every corner of the light guide.

  The light guide according to the tenth aspect has a rectangular shape or a shape into which the light source device can be inserted, so that the light from the light source device can be guided to the light guide without waste. Thereby, the emitted light with high brightness can be obtained and the storage can be performed at the same time.

The surface light source device according to claim 11 is provided with a plurality of lead frames each having a plurality of semiconductor light emitting elements having different light emission colors or the same light emission color mounted in parallel on each lead frame and having different light emission colors. The semiconductor light emitting elements of the same emission color are arranged so as to be linear or staggered, and a plurality of leads arranged side by side in the lead frame side where the height of the semiconductor light emitting elements of the plurality of lead frames arranged side by side is arranged. A light source device that is insert-molded so as to have an opening in at least one side surface direction on both end sides of the frame and in the upper part of the semiconductor light emitting element;
The incident part for guiding light is cut off at the side part end of the back part to form a notch part, and the side part end of the surface part from which light is emitted so as to face the notch part is cut out in a tapered shape. A light guide formed with a tapered portion;
A reflector having reflectivity provided on top of the tapered portion;
The light source device, a light guide and a case for housing the reflector are provided,
Place the light source device at the position of the notch in the light guide,
The light beams emitted from the plurality of semiconductor light emitting elements on the lead frame are emitted in the upper direction of the opening and the semiconductor light emitting element while avoiding the semiconductor light emitting elements, and the back surface side of the light guide above the notch The light emitted from the semiconductor light emitting element is guided into the light guide body from the side surface side of the light guide which is the lateral direction of the notch, and the light from the side surface side proceeds in the direction opposite to the side surface, and from the back surface side. Light is reflected from the tapered portion and is emitted from the surface portion while proceeding in the opposite direction. Therefore, the light source device mixes the light emitted from the plurality of semiconductor light emitting elements to form the back side portion and the cutout portion of the light guide. Guides the light emitted from the side of the light guide in the lateral direction into the light guide, and guides the light emitted upward from the back side of the light guide above the notch to the surface. The light emitted from a plurality of semiconductor light emitting elements is mixed while reflecting with a tapered shape, End to be able to emit a mixed light from the surface portion. Thereby, the light from the light source can be converted without waste, and the plane emission light having high brightness and no color spots can be obtained.

  The surface light source device according to claim 12 is provided with a deflecting sheet for deflecting light on the light guide and uniformizing the light emitted from the surface portion, thereby further improving the luminance and eliminating the color spots of the emission color. Can do. Thereby, an elegant surface light source can be obtained.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the present invention, a plurality of patterns arranged in parallel on an insulating substrate or a lead frame are regarded as one unit and placed in two directions or one direction substantially perpendicular to the directions arranged in parallel. In addition, a plurality of semiconductor light emitting elements having different emission colors or a plurality of the same emission colors are formed on the conductive pattern of one unit and the pattern of the lead frame by using a transparent resin or a transparent adhesive. A light source device capable of efficiently emitting light emitted from a plurality of semiconductor light emitting elements from the upper direction and the side direction of the opening, and a back surface portion so as to face the opening From the side of the opening, a rectangular cutout is formed on the side of the side of the opening and a tapered cutout is formed in a position facing the cutout on the side of the side of the surface. Light is incident from the side of the rectangular notch with the back portion cut out, and light from above the opening is incident from the back of the rectangular notch with the back portion cut out, and the light source device The light from the light is guided to the light guide without leaving it, and a reflector is provided on the top of the tapered portion cut out on the surface of the light guide to return leaked light to the light guide again from the surface. A light source device, a light guide, and a surface light source device housed in a case so as to emit light are provided.

  1 is a schematic configuration diagram of a surface light source device according to the present invention, FIG. 2A is a schematic perspective view of an insulating substrate on which a plurality of semiconductor light emitting elements are mounted in the light source device according to the present invention, and FIG. b) is a schematic perspective view of the light source device according to the present invention, FIG. 3 is a perspective plan view of the light source device according to the present invention, and FIG. 4 is a locus diagram of light in the light guide according to the present invention.

  As shown in FIG. 1, the surface light source device 1 includes a light source device 2, a light guide 8, a reflector 17, and a case 19, and receives light mixed by a plurality of semiconductor light emitting elements mounted on a plurality of lead frames. The light source device 2 having the openings 3a and 3b that emit in the side surface direction 3a and the upper side 3b is provided in the cutout portion 11 of the light guide 8 cut out in a rectangular shape on the side surface 16 end side of the back surface portion 9, The light from the opening of the light source device 2 is guided into the light guide 8 from the side incident surface 14b and the upper incident surface 13 of the notch 11, and the light from the upper incident surface 13 of the notch 11 is guided. Light is emitted from the entire surface portion 10 by being reflected in the opposite direction to the light source device 2 by the tapered portion 12 provided on the side surface 16 end side of the surface portion 10 of the light body 8.

  As shown in FIG. 2, the light source device 2 is of an injection or transfer mold type, and includes semiconductor light emitting elements 2a, 2b, 2c, lead frame patterns 3a1, 3a2, 3b1, 3b2, 3c1, 3c2, walls 4, It is roughly constituted by openings 3a (lateral direction) and 3b (upward direction), a mold case 6, lead terminals 7a1, 7a2, 7b1, 7b2, 7c1, 7c2, bonding wires 7, and the like. The pattern in this example includes an electric wiring pattern.

  The light source device 2 includes a plurality of lead frame patterns 3a1, 3a2, 3b1, 3b2, 3c1, and 3c2 arranged in parallel so that the semiconductor light emitting elements 2a, 2b, and 2c are linearly or staggered. Place.

  Although not shown here, the semiconductor light emitting elements 2a, 2b, and 2c may be placed in a linear or staggered order in the height order.

  These lead frames are insert-molded with insulating resin or the like to provide a mold case 6 and lead frame patterns 3a1, 3a2, 3b1, 3b2, 3c1, 3c2 outside the mold case 6. Corresponding lead terminals 7a1, 7a2, 7b1, 7b2, 7c1, 7c2 are provided.

  The light source device 2 mixes a plurality of lead frames by insert molding with a white powder such as barium titanate in an insulating material such as a modified polyamide, a polybutylene terephthalate, or an aromatic polyester. It is formed to be sandwiched between resins.

  In addition, when insert molding is performed using an insulating resin or the like, the opening 3a is provided in at least one end side surface direction at both ends of the lead frame in which the plurality of semiconductor light emitting elements 2a, 2b, and 2c are arranged in parallel. Since the upper portion is filled with the transparent resin, there is nothing at present and the opening 3b remains filled with the transparent resin.

  Further, when insert molding is performed with an insulating resin or the like, the wall 4 having reflectivity is provided in a direction substantially perpendicular to the parallel direction in which the plurality of semiconductor light emitting elements 2a, 2b, and 2c are provided in parallel. The wall 4 is formed in an arc shape or a linear shape that extends from both ends of the opening 3a toward the opposite direction of the opening 3a and becomes narrower at both ends toward the opposite direction of the opening 3a.

  Although not shown here, the wall 4 is reflective in a direction substantially perpendicular to the direction of the connecting portion where the lead frame is connected. Further, the wall 4 extends in an arc shape or a straight line so as to extend from both ends of the opening portion 3a toward the opposite direction of the opening portion 3a and to decrease in width at both ends from the opening portion 3a toward the opposite direction of the opening portion 3a. Molded.

  For example, the anode side (anode) patterns 3a1, 3b1, and 3c1 and the cathode side (cathode) patterns 3a2, 3b2, and 3c2 are electrically used, and the same emission color or emission color is different on the cathode side (cathode). The semiconductor light emitting elements 2a, 2b, and 2c are coated with a transparent adhesive and placed thereon.

  In order to electrically connect a cathode (cathode), an anode (anode), and the like located above the surface of the semiconductor light emitting element (2a, 2b, 2c), they are connected by a bonding wire 7.

  For example, the semiconductor light emitting elements 2 a and 2 b connect the cathode (cathode) and the cathode side (cathode) patterns 3 a 2 and 3 b 2 located above the surfaces of the semiconductor light emitting elements 2 a and 2 b with the cathode side bonding wires 7. Similarly, the anode (anode) and the anode side (anode) patterns 3 a 1 and 3 b 1 are connected by the anode side bonding wire 7. The semiconductor light emitting element 2c connects the anode (anode) and the anode side (anode) pattern 3c1 located above the surface of the semiconductor light emitting element 2c with an anode side bonding wire 7. Then, the cathode side (cathode) whose cathode (cathode) is below the back surface of the semiconductor light emitting element 2c itself is connected to the pattern 3c2 with a conductive adhesive, and each cathode side (cathode) lead terminal 7a2, 7b2, 7c2 and anode side (anode) lead terminals 7a1, 7b1, 7c1.

  Further, after bonding the semiconductor light emitting elements 2a, 2b and 2c to the lead frame patterns 3a2, 3b2 and 3c2 (die bonding) and after wire bonding with the bonding wires 7, the portion surrounded by the wall 4 is made of a transparent filling transparent resin 6b. The filled transparent resin 6b is filled in the mold case 6 so that all of them are immersed, and the emitted light from the semiconductor light emitting elements 2a, 2b, 2c is emitted from the openings 3a, 3b as monochromatic light or mixed color light.

The semiconductor light emitting devices 2a, 2b, and 2c each have a high luminance output composed of a semiconductor chip of an InGaAlP-based, InGaAlN-based, InGaN-based, or GaN-based compound having a double heterostructure centering on an active layer on an n-type layer. It is a light emitting element and is manufactured by metal organic chemical vapor deposition. The substrates of the semiconductor light emitting devices 2a, 2b, 2c themselves are made of a transparent substrate such as Al ₂ O ₃ or InP sapphire, and an active layer is disposed on the substrate, and a transparent electrode is formed on the active layer. The electrodes attached to the semiconductor light emitting elements 2a, 2b, and 2c are formed by sputtering, vacuum deposition, chemical vapor deposition, or the like using a conductive transparent electrode made of In ₂ O ₃ , SnO ₂ , ITO, or the like.

  The bonding wire 7 is made of a conductive wire such as a gold wire, and is bonded between the anode electrode of the semiconductor light emitting elements 2a, 2b, 2c and the patterns 3a1, 3b1, 3c1, and between the cathode electrode and the patterns 3a2, 3b2, 3c2, respectively. Is electrically connected.

  The lead terminals 7a1, 7a2, 7b1, 7b2, 7c1, and 7c2 are made of a conductive alloy material such as phosphor bronze having electrical conductivity and elasticity, and are formed by directly taking out the lead frame from the mold case 6. The lead terminals 7a2, 7b2, and 7c2 are electrically connected to the patterns 3a2, 3b2, and 3c2 and are equal to the cathode electrode side of the semiconductor light emitting elements 2a, 2b, and 2c, and serve as a cathode (−) as the light source device 1 of the present invention. Configured to be used.

  The lead terminals 7a1, 7b1, and 7c1 are electrically connected to the patterns 3a1, 3b1, and 3c1, and are equal to the anode electrode side of the semiconductor light emitting elements 2a, 2b, and 2c. ).

  The openings 3a and 3b are made of a colorless and transparent epoxy resin, silicone resin, or the like, and efficiently emit light from the semiconductor light emitting elements 2a, 2b, and 2c.

  In the case of the semiconductor light emitting elements 2a, 2b, and 2c having the same emission color, it is possible to obtain emitted light with high luminance and efficiently emit light. Further, in the case of the semiconductor light emitting elements 2a, 2b, and 2c having different emission colors, it is possible to obtain emission light of a new emission color mixed with high luminance and to emit it efficiently.

  The mold case 6 is molded by mixing white powder such as barium titanate into an insulating material such as liquid crystal polymer made of modified polyamide, polybutylene terephthalate, aromatic polyester, etc. Patterns 3a1, 3b1, 3c1, 3a2, 3b2, and 3c2 are exposed.

  The mold case 6 efficiently reflects light emitted from the side surfaces of the semiconductor light emitting elements 2a, 2b, and 2c with white powder having the same light reflectivity and light shielding properties, such as barium titanate. The light emitted from the light source device 1 other than the opening 3a emitting in the lateral direction and the opening 3b emitting upward is shielded so as not to leak outside.

  The filled transparent resin 6b is made of a colorless and transparent epoxy resin, silicone resin, or the like. The patterns 3a1, 3a2, 3ba, 3b2, 3c1, 3c2, semiconductor light emitting elements 2a, 2b, 2c, bonding wires 7 and the like are formed in the mold case 6 and the like. In order to guide the light emitted from the semiconductor light emitting elements 2a, 2b, and 2c to the opening 3a, the entire concave portion surrounded by walls or the like is filled.

  Further, when the patterns 3a1, 3a2, 3ba, 3b2, 3c1, 3c2 and the semiconductor light emitting elements 2a, 2b, 2c provided on the lead frame are placed linearly or in a staggered pattern, and the wall 4 and the opening 3a are provided. Two light source devices 1 are formed at a time so as to face each other.

For example, two semiconductor light emitting elements 2a, 2b, and 2c are placed from the front in the left-right direction so that the opening 3a faces each other. When observed from one direction, the semiconductor light emitting elements 2c, 2b, 2a, 2a, 2b, and 2c are placed in this order.
Further, although not shown, the semiconductor light emitting elements 2a, 2b, and 2c may be similarly placed in a linear or staggered order in the height order.

  In addition, the unit of the light source device 1 in which the opening 3a is provided in the side direction of the one end side of the plurality of lead frames arranged in parallel is continuously set with two units as one unit so that the opening 3a faces each other. Productivity can be improved by creating.

  The light guide 8 is formed of a transparent acrylic resin (PMMA) or polycarbonate (PC) having a refractive index of about 1.4 to 1.7, and emits light, and a back surface portion on the opposite side. 9 and the four side parts 16 connected to them are rectangular in shape, and the light source device 2 is provided with a notch 11 on the back part 9.

  The cutout portion 11 is cut out in a rectangular shape on the end side of the side surface portion 16 on the back surface portion 9 side. For example, the cutout portion 11 is a rectangular column with a side portion where the back surface portion 9 and the side surface portion 16 are connected. The side surface which cut into the back surface part 9 of a pair of side surface part 14 direction which opposes, cuts out all the side surface part 14 directions of the back surface part 9, and newly entered the inside of the light guide 8 14b and the light guide 8 are formed to form the upward incident surface 13 in which the thickness is reduced.

  Further, the light guide 8 is provided with a tapered portion 12 on the end side of the side surface portion 16 on the surface portion 10 side so that a portion connected to the side surface portion 16 of the surface portion 10 becomes an inclined surface.

  The tapered portion 12 is cut out in a triangular shape on the end side of the side surface portion 16 on the surface portion 10 side. For example, the tapered shape portion 12 is cut out by a triangular prism with a portion where the surface portion 10 and the side surface portion 16 are connected sideways. Or cut off the surface portion 10 in the direction of the pair of side portions 16 facing each other, or cut out all the side surface portions 16 of the surface portion 10 to newly reduce the thickness of the light guide 8. The side part 14 is formed.

  Although not shown, the notch 11 provided on the back surface 9 and the taper forming part 12 provided on the surface 10 at a position facing the notch 11 are only provided with the light source device 2. The notch 11 and the tapered portion 12 may be provided.

  The light from the light source device 2 is guided into the light guide 8 from the incident surface 14 b in the side surface direction of the notched portion 11 and the incident surface 13 in the upper direction of the notched portion 11 by the notched portion 11.

Further, the light incident on the light guide 8 (from the incident surface 14b and the incident surface 13) is incident from the incident surface 14b and the incident surface 13 because, for example, the refractive index n of acrylic resin is about n = 1.49. The transmitted light travels through the light guide 8 in the range γ = 0 ° to ± 42 ° of the refractive index γ satisfying 0 ≦ | γ | ≦ Sin ⁻¹ (1 / n).

  Further, at the boundary surface between the light guide 8 and the air layer (refractive index n = 1), Sinθ = (1 / n), the critical angle α = 42 °, and the critical angle α = 42 ° or less with respect to the air layer. If it is not incident angle, it cannot go out.

  Here, the locus of light within the light guide 8 will be described. Although not shown here, it is assumed that the reflector 17 and the reflection case 19 are provided above the tapered portion 12.

  The light emitted from the opening 3a of the light source device 2 enters from the incident surface 14b, and proceeds through the light guide 8 in the range γ = 0 ° to ± 42 ° of the refraction angle γ as described above. Is always reflected (by the total reflection and the reflection case 19 at this time) toward the surface portion 10 and is refracted by a groove or unevenness provided on the surface portion 10 although not shown here. 10 is emitted to the outside.

  Further, the upward light emitted from the opening 3b of the light source device 2 enters from the incident surface 13, the light L1 travels straight and reaches the taper forming portion 12, and the light is always reflected by the taper forming portion 12 (at this time). , Due to total reflection and the reflector 17.) The reflected light LR1 proceeds in the direction of the back surface portion 9 in the direction opposite to the taper forming portion 12 at a reflection angle equal to the incident angle with respect to the taper forming portion 12. The light LR1 that has reached the back surface portion 9 is always reflected by the back surface portion 9 (at this time, due to total reflection and the reflection case 19), proceeds as reflected light LR2 in the direction of the surface portion 10, reaches the surface portion 10, and is refracted to the surface. The light L0 is emitted from the unit 10.

  The light L0 emitted from the surface portion 10 here is also light that is refracted by the grooves or unevenness provided in the surface portion 10 and emitted to the outside of the surface portion 10 although not shown here.

  The reflector 17 is formed into a triangular prism shape so as to have reflectivity by mixing white powder such as barium titanate into a material such as liquid crystal polymer made of modified polyamide, polybutylene terephthalate, aromatic polyester or the like. The upward light emitted from the opening 3 b of the light source device 2 is reflected by the tapered portion 12.

  Here, the triangular prism shape is used, but it may be a flat plate shape, may be a reflective sheet or a reflective film having reflectivity, may be affixed to the tapered portion 12, and is a flat plate shape having no reflectivity. It may be attached to an object.

  Although not shown here, the tapered portion 12 may be applied with reflective ink or paint without using the reflector 17.

  The case 19 is made of a material such as liquid crystal polymer made of modified polyamide, polybutylene terephthalate, aromatic polyester or the like and mixed with a white powder such as barium titanate so as to have reflectivity. And the side part 16 and the side part 14 are surrounded, the light from the light guide 8 is reflected, and is guided to the light guide 8 again.

  In this way, a plurality of semiconductor light emitting elements are placed on a plurality of lead frames, etc., the semiconductor light emitting elements are arranged in the depth direction of the light source device, and light mixed with the light emitted from the semiconductor light emitting elements is mixed with the light source device. The light is emitted from the lateral opening, and an opening is also provided in the upper direction of the light source device so that all the emitted light from the semiconductor light emitting element is emitted from the opening. The light emitted from the opening of the light source device and the light emitted from the upward direction are guided by a light guide having a surface that corresponds to the notched position and is tapered. Is emitted from the surface portion, and the emitted light without color spots can be obtained.

1 is a schematic configuration diagram of a surface light source device according to the present invention. (A) It is a schematic perspective view of the insulating board | substrate with which the several semiconductor light emitting element in the light source device which concerns on this invention was mounted. (B) It is a schematic perspective view of the light source device which concerns on this invention. It is a perspective top view of the light source device which concerns on this invention. It is a locus diagram of light in the light guide according to the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Surface light source device 2 Light source device 2a, 2b, 2c Semiconductor light-emitting device 3a Opening part (lateral direction)
3b Opening (upward)
3a1, 3a2, 3ba, 3b2, 3c1, 3c2 Lead frame pattern 4 Wall 6 Mold case 7 Bonding wire 7a1, 7a2, 7b1, 7b2, 7c1, 7c2 Lead terminal 8 Light guide 9 Back surface 10 Surface portion 11 Notched portion 12 Taper-shaped part 13 Upper incident surface 14 Side incident surface 14b Side incident surface 16 Side part 17 Reflector 19 Reflecting case L1, LR1, LR2, L0 Ray

Claims (12)

A plurality of lead frames each having a plurality of semiconductor light emitting elements having different emission colors or the same emission color mounted on each lead frame are arranged side by side, and the semiconductor light emitting elements having different emission colors or the same emission color are linear. The insert molding part was formed so as to have an opening in at least one end side surface direction on both ends of the plurality of lead frames arranged side by side and in the upper part of the semiconductor light emitting element. A light source device characterized by that. A plurality of lead frames in which a plurality of semiconductor light emitting elements having different emission colors or the same emission color are mounted on each lead frame are arranged in parallel in the order of the height of the semiconductor light emitting elements, and the emission colors are different or The semiconductor light emitting elements of the same light emission color are arranged so as to be linear or staggered, and the lead frame side having the lowest height of the semiconductor light emitting elements of the plurality of lead frames arranged in parallel and the upper part of the semiconductor light emitting elements A light source device, wherein an insert molding part is molded so as to have an opening. The said insert molding part provides the wall which has reflectivity in a substantially perpendicular direction with respect to the connection part direction which each lead frame of the said semiconductor light-emitting device has connected, The Claim 1 or Claim 2 characterized by the above-mentioned. Light source device. An arcuate or linear wall extending from both ends of the opening toward the opposite direction of the opening and having a width at the both ends narrowing from the opening toward the opposite direction of the opening is provided. The light source device according to claim 1. The light source device according to claim 1, wherein the two light source devices are continuously formed as one unit so that the openings face each other. 4. The light source device according to claim 3, wherein the insert molding portion provides a space above the semiconductor light emitting element placed on each lead frame and is filled with a transparent resin between the walls. 2. A structure in which one end side of a plurality of lead frames in which semiconductor light emitting elements having different emission colors or the same emission colors are mounted on each of the lead frames is mechanically and electrically connected. The light source device according to claim 1. In a light guide composed of an incident portion that guides light, a surface portion that emits light, a back surface portion that opposes the surface portion, and a side surface portion that intersects the surface portion and the back surface portion at right angles,
The light-guiding member is characterized in that the incident portion cuts out the side surface portion end of the back surface portion and cuts out the side surface portion end of the surface portion in a tapered shape so as to face the cut-out portion. 9. The light guide according to claim 8, wherein ends of the pair of side surface portions are connected to other side surface portions having inclined portions. The light guide according to claim 8, wherein the notch has a rectangular shape or a shape into which a light source device can be inserted. A plurality of lead frames each having a plurality of semiconductor light emitting elements having different emission colors or the same emission color mounted on each lead frame are arranged side by side, and the semiconductor light emitting elements having different emission colors or the same emission color are linear. At least one end on the side of the lead frame having the lowest height of the semiconductor light emitting element of the plurality of lead frames arranged in parallel or in a staggered manner, or arranged in parallel A light source device that is insert-molded so as to have an opening in the side surface direction and the upper part of the semiconductor light emitting element;
The incident part for guiding light is cut out at the side part end of the back part to form a notch part, and the side part end of the surface part emitting light is cut out in a tapered shape so as to face the notch part. And a light guide formed with a tapered portion,
A reflector having reflectivity provided on top of the tapered portion;
The light source device, the light guide, and a case for storing the reflector,
The light source device is disposed at the position of the cutout portion of the light guide,
A light beam emitted from a plurality of semiconductor light emitting elements on the lead frame is emitted in the upper direction of the opening and the semiconductor light emitting element while avoiding the semiconductor light emitting elements, and the light guide body above the notch The light emitted from the semiconductor light emitting element is guided into the light guide from the back surface side and the side surface portion side of the light guide which is the lateral direction of the cutout portion, and the light from the side surface side is the side surface. The surface light source device is characterized in that it travels in the opposite direction of the part, and the light from the back surface part side is reflected by the tapered part and is emitted from the surface part while proceeding in the opposite direction. The surface light source device according to claim 11, wherein a deflection sheet for deflecting light is provided on the light guide body to make light emitted from the surface portion uniform.

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