CN211088310U

CN211088310U - COB lamp strip

Info

Publication number: CN211088310U
Application number: CN201922293933.5U
Authority: CN
Inventors: 郑瑛
Original assignee: Chongqing Huiku Technology Co ltd
Current assignee: Chongqing Huiku Technology Co ltd
Priority date: 2019-12-18
Filing date: 2019-12-18
Publication date: 2020-07-24
Anticipated expiration: 2029-12-18

Abstract

The utility model provides a COB lamp strip, including flexible circuit board, set up in the functional area on flexible circuit board surface, positive and negative electrode region, reflector layer, at least two linear distribution's L ED chip, resistance and at least along the extending direction of each L ED chip, cover in the encapsulated layer on L ED chip surface in succession, the reflector layer is equipped with at least one breach, and the breach runs through the upper and lower surface of reflector layer, coats in the encapsulated layer on L ED chip surface still covers in the upper surface of reflector layer, and the encapsulated layer sees through breach and flexible circuit board direct bonding, the utility model provides a COB lamp strip, through set up the breach on the reflector layer for the encapsulated layer can be directly and flexible circuit board between contact, thereby strengthened being connected between encapsulated layer and the flexible circuit board, promoted the encapsulation intensity of COB lamp strip, prolonged the life of product.

Description

COB lamp strip

Technical Field

The utility model relates to an L ED (L light Emitting Diode) technical field especially relates to a COB lamp strip.

Background

L ED plays an important role in the display field by virtue of its unique advantages of low price, low consumption, high brightness, long service life and the like, and there is a considerable development space in a long period of time in the future, in the conventional L ED application, lamps are widely used, such as various light bars, household lamps, table lamps and the like, wherein in the packaging process of COB (Chip On Board) light bars, L ED chips are directly and inversely mounted On a circuit Board, and a linear coating packaging layer is directly formed On the L ED chips to form the light bars, and in this case, in order to improve the luminous effect of L ED chips, a reflective layer is required to be covered around L ED chips, and the reflective layer is arranged between the circuit Board and the coated packaging layer, namely, the object of direct contact of the packaging layer is the reflective layer rather than the circuit Board, so that in the future use process, the packaging layer and the circuit Board are in short service life.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a COB lamp strip mainly solves the technical problem that the contact is not inseparable between the packaging layer of current L ED lamp strip and the circuit board, and the packaging layer is easily come unstuck, product life hangs down.

In order to solve the technical problem, the embodiment of the utility model provides a COB lamp strip, including flexible circuit board, set up in functional area, positive and negative electrode zone, the reflector layer on flexible circuit board surface, at least two L ED chips of linear distribution, resistance and at least along each L ED chip's extending direction, cover in succession in the encapsulation layer on L ED chip surface, L ED chip directly is fixed in the relevant position on the functional area through the flip-chip mode, and through pad on the functional area with positive and negative electrode electric connection in the positive and negative electrode zone, resistance with L ED chip electric connection, the reflector layer is laid in flexible circuit board upper surface, and the reflector layer is not laid at least in the top of functional area and L ED chip, the reflector layer is equipped with at least one breach, the breach runs through the upper and lower surface of reflector layer, L ED chip surface's encapsulation layer still covers the upper surface of reflector layer, and the encapsulation layer sees through breach and flexible circuit board direct bonding.

Optionally, the position of the notch of the reflective layer is close to the edge of the coating range of the encapsulation layer.

Optionally, the light reflecting layer is a light layer or a mirror layer.

Optionally, the reflective layer is a white oil layer or a white glue layer.

Optionally, the flexible circuit board is in a long strip shape, and the notch formed in the reflective layer extends along the length direction of the flexible circuit board.

Optionally, the notches of the light reflecting layer include at least two notches, and the notches are symmetrical to each other along an axis of the flexible circuit board in the length direction.

Optionally, the upper and lower sizes of the notch arranged on the light reflecting layer are consistent.

Optionally, the size of the notch formed in the reflective layer on the upper surface of the reflective layer is smaller than the size of the notch formed in the lower surface of the reflective layer.

Optionally, the cross-sectional shape of the notch formed in the light reflecting layer is trapezoidal.

Optionally, the light reflecting layer is further coated on the surface of the resistor.

The utility model has the advantages that:

according to the embodiment of the utility model provides a COB lamp strip, including the flexible circuit board, set up in the functional area on the flexible circuit board surface, positive and negative electrode zone, the reflector layer, at least two linear distribution's L ED chips, resistance and at least along the extending direction of each L ED chip, cover the encapsulation layer on L ED chip surface in succession, L ED chip is through the relevant position on the mode direct fixation of flip-chip on the functional area, and positive and negative electrode electric connection in pad and the positive and negative electrode zone on the functional area, resistance and L ED chip electric connection, the reflector layer is laid on the flexible circuit board upper surface, and the reflector layer does not lay the top of locating functional area and L ED chip at least, the reflector layer is equipped with at least one breach, the breach runs through the upper and lower surface of reflector layer, coat in the encapsulation layer on L ED chip surface still, and the encapsulation layer sees through the breach and directly bonds with the flexible circuit board.

Drawings

Fig. 1 is a schematic view of a COB light bar structure provided by an embodiment of the present invention;

fig. 2 is a schematic cross-sectional view of a COB light bar provided in an embodiment of the present invention;

fig. 3 is the embodiment of the utility model provides a COB lamp strip cross-sectional view.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the embodiments of the present invention are described in further detail below with reference to the accompanying drawings by way of specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The first embodiment is as follows:

aiming at the problems that in the prior art, the contact between the packaging layer of the COB light bar and the circuit board is not tight, the packaging layer is easy to degum, and the service life of a product is short, please refer to fig. 1, the utility model provides a COB light bar, which comprises a flexible circuit board 1, a functional region 11 arranged on the surface of the flexible circuit board 1, positive and negative electrode regions 12, a reflecting layer 3, at least two linearly distributed L ED chips 2, a resistor 4, and a packaging layer 5 continuously covering the surface of a L ED chip 2 along the extending direction of each L ED chip 2, wherein the L ED chip 2 is directly fixed at the corresponding position on the functional region 11 in an inverted mode and is electrically connected with the positive and negative electrodes in the positive and negative electrode regions 12 through a bonding pad on the functional region 11, the resistor 4 is electrically connected with the L ED chip 2, the reflecting layer 3 is laid on the upper surface of the flexible circuit board 1, the reflecting layer 3 is at least not laid on the functional region 11, the positive and negative electrode regions 12 and L ED chips 2, the reflecting layer 3 is directly covered on the flexible circuit board 1, the upper surface of the flexible circuit board 31, and the chip 5 is directly covered on the flexible circuit board.

The utility model discloses L ED luminescent device in each embodiment includes COB lamp strip, wherein, COB's meaning is, Chip on board Chip, and the characteristics lie in directly adorning L ED Chip 2 upside down on flexible circuit board 1, then cover encapsulated layer 5, and the notion of L ED support has been removed to this scheme, electroless, no reflow soldering, and its process is compared in the L ED technology of SMT surface mounting and has been saved process flow greatly, has promoted product efficiency.

The COB light bar structure in this embodiment includes a flexible circuit board 1, where the flexible circuit board 1 may be a single-sided flexible circuit board 1, or may be a double-sided flexible circuit board 1; if the single-sided flexible circuit board 1 is provided, the back side of the single-sided flexible circuit board does not have a circuit, but the single-sided flexible circuit board may include a heat dissipation metal region and back side pins for electrically connecting with the circuit on the front side, and then the light bar may be powered on through the back side of the light bar. Whereas if the flexible circuit board 1 is double-sided, both sides of the double-sided flexible circuit board 1 may have the same structure.

L ED chip 2 itself, directly on the flexible circuit board 1 to achieve the fixed and the flexible circuit board 1 on the positive and negative electrodes between the electrical connection, representing L ED chip 2 not through other medium to connect with the flexible circuit board 1, such as the support, such as the direct connection way compared with other ways to save the manufacturing process, and resistance 4 and chip between the electrical connection, it at least plays the role of protection circuit, resistance 4 usually with some unit in L ED chip 2 between the series, and unit in L ED chip 2 between can be arbitrary series-parallel relation, but any L ED chip 2 current will certainly through at least one resistance 4, avoid the short circuit, resistance 4 can also play the role of presetting the circuit power, that is to set up COB lamp strip light brightness.

L ED chip 2 is fixed on flexible circuit board 1 in flip-chip mode, flip-chip is a pin-free structure, directly connects the positive and negative electrodes on L ED chip 2 to functional region 11 on flexible circuit board 1 by welding or gluing, and functional region 11 forms corresponding electric connection with positive and negative electrode regions 12 through corresponding circuit.

The light reflecting layer 3 is arranged on the upper surface of the flexible circuit board 1, wherein the upper surface is a surface provided with a L ED chip 2, and can be considered as the upper surface as long as the surface provided with an L ED chip 2 is provided, the light reflecting layer 3 is used for reflecting light emitted by the L ED chip 2, so that the light emitting effect of the light bar is enhanced, the arrangement position of the light reflecting layer 3 is limited to the surface of the flexible circuit board 1, and the L ED chip 2 is prevented from being covered, so that the position of the light reflecting layer 3 is not at least arranged above the functional areas 11 and L ED chips 2, the position of the light reflecting layer 3 is not arranged above the functional areas 11 so as not to influence the electrical connection between the functional areas 11 and the L ED chip 2, and the position of the light reflecting layer 3 is not arranged above the L ED chip 2 so as not to shield the light emitted by the L ED chip 2.

The packaging structure of the light bar further comprises a colloid packaging layer 5 covering the L ED chips 2, the packaging layer 5 continuously covers along the extending direction of the L ED chips 2 in the light bar, and as long as the distance between the L ED chips 2 is smaller than or equal to a set value and the input power meets the requirement, the display effect of the light bar is a continuous linear light source, the integrity is good, and the application scene is wider.

The reflecting layer 3 is arranged on the flexible circuit board 1 before the packaging layer 5 due to the function of the reflecting layer; in this case, the encapsulation layer 5 should be in direct contact with the light-reflecting layer 3. In order to enhance the integrity of the light bar and enhance the connection effect between the packaging layer 5 and the flexible circuit board 1, a notch 31 is arranged on the reflective layer 3, and the notch 31 penetrates through the upper surface and the lower surface of the reflective layer 3, namely a through groove; when setting up encapsulating layer 5, the encapsulation in encapsulating layer 5 is glued and can be seen through breach 31, sees through reflection of light layer 3 direct and flexible circuit board 1 contact, forms the bonding based on the viscidity of encapsulation glue. So, just realized direct connection between encapsulated layer 5 and the flexible circuit board 1, promoted the uniformity of lamp strip. Accordingly, in order to make the packaging layer 5 connectable to the flexible circuit board 1 through the notch 31, the notch 31 should be located within a range covered by the packaging layer 5.

The utility model provides an among the COB lamp strip, through set up breach 31 on reflector layer 3 for encapsulated layer 5 can be direct and flexible circuit board 1 between contact, thereby strengthened the connection between encapsulated layer 5 and the flexible circuit board 1, promoted the encapsulation intensity of COB lamp strip, prolonged the life of product.

Example two:

according to the COB light bar in the embodiment, the notch arranged on the reflective layer is arranged close to the edge of the coating range of the packaging layer, the reflective layer is arranged for reflecting light emitted by L ED chips to improve the display effect, and after the notch is arranged, in order to enable the notch to have the lowest influence on the reflective layer, the notch is arranged close to the edge of the packaging layer as much as possible, the edge area of the packaging layer is far away from L ED chips, and the display effect of the notch has the lowest influence on the overall display effect of the light bar.

Since the reflective layer is used for reflecting light, the reflective layer is a light layer or a mirror layer in order to achieve a good reflective effect. The light layers such as white, yellow and the like are colors with high reflectivity, and light can be well reflected; and the mirror reflection effect of the mirror layer is more visual.

Specifically, the light reflecting layer can be a white oil layer or a white glue layer. According to the specific scene requirements and process differences, the light reflecting layer can be realized by adopting white oil or white glue.

In some embodiments, the flexible circuit board is in a long strip shape, and the notch arranged on the light reflecting layer extends along the length direction of the flexible circuit board. For the connection effect between encapsulated layer and the flexible circuit board, the breach that sets up on the reflector layer should let more encapsulation glue permeate through as far as, and the breach that closes on the position should not too big again, consequently can extend the reflector layer along flexible circuit board's length direction, can make the display effect of lamp strip not influenced basically like this.

In some embodiments, the light reflecting layer may include at least two notches, and the notches are symmetrical to each other along an axis of the flexible circuit board in the length direction. In order to further enhance the connection strength between the encapsulation layer and the flexible circuit board, a plurality of notches may be provided on the reflection layer, and the notches are mirror-symmetrical based on the length direction of the flexible circuit board. When a plurality of gaps are arranged, a plurality of connections can be formed between the packaging layer and the circuit board through the plurality of gaps.

In some embodiments, the indentations in the light-reflecting layer are of uniform top and bottom dimensions for ease of manufacture. After the initial reflective layer is covered, a notch can be formed in the initial reflective layer by a simple process, and the encapsulation layer can be coated after the notch is formed, please refer to fig. 2.

In some embodiments, in order to further enhance the connection strength between the encapsulation layer and the flexible circuit board and influence the light reflection effect of the light reflection layer as little as possible, the size of the notch arranged on the upper surface of the light reflection layer is smaller than that of the notch arranged on the lower surface of the light reflection layer. The arrangement mode can increase the contact area of the packaging adhesive in the packaging layer directly contacted with the flexible circuit board, thereby increasing the adhesion degree; and the size of the upper surface of the notch is small, so that the influence on the display effect is small.

In some embodiments, the indentations in the light-reflecting layer are trapezoidal in cross-sectional shape. Referring to fig. 3, in order to achieve the effect of the size of the notch being large at the bottom and small at the top, the cross-sectional shape of the notch may be directly set to be trapezoidal; of course, other shapes are possible, such as a semi-circle with an upward arc.

In some embodiments, a light-reflective layer is also applied to the surface of the resistor. Because the resistor does not emit light, in order to further improve the display effect, the reflecting layer is coated on the surface of the resistor, so that the surface of the resistor can reflect light.

The embodiment of the utility model provides an in COB lamp strip can provide the light source for lighting device, light signal indicating device, light filling device or backlight unit etc. When the lighting device is used, the lighting device can be specifically applied to various fields, such as a table lamp, a fluorescent lamp, a ceiling lamp, a down lamp, a street lamp, a projection lamp and the like in daily life, a high beam lamp, a dipped beam lamp, an atmosphere lamp and the like in an automobile, an operation lamp, a low electromagnetic lighting lamp and a lighting lamp of various medical instruments in medical use, and various colored lamps, landscape lighting lamps, advertisement lamps and the like in the field of decoration; when the optical signal indicating device is used, the optical signal indicating device can be applied to various fields, such as signal indicating lamps in the traffic field and various signal state indicating lamps on communication equipment in the communication field; when the device is a light supplement device, the device can be a light supplement lamp in the photographic field, such as a flash lamp and a light supplement lamp, and can also be a plant light supplement lamp for supplementing light to plants in the agricultural field; in the case of the backlight device, the backlight device may be applied to various backlight fields, for example, a display, a television, a mobile terminal such as a mobile phone, and an advertisement machine.

It should be understood that the above applications are only a few of the applications exemplified by the present embodiment, and that the application of the L ED light emitting device is not limited to the above exemplified fields.

The foregoing is a more detailed description of embodiments of the present invention, and the specific embodiments are not to be considered in a limiting sense. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.

Claims

1. A COB light bar is characterized by comprising a flexible circuit board, a functional area, positive and negative electrode areas, a light reflecting layer, at least two L ED chips, resistors and a packaging layer, wherein the functional area, the positive and negative electrode areas, the light reflecting layer, the at least two L ED chips, the resistors and the packaging layer continuously cover the surface of the L ED chip along the extending direction of each L ED chip, the L ED chip is directly fixed at a corresponding position on the functional area in an inverted mode and is electrically connected with positive and negative electrodes in the positive and negative electrode areas through a pad on the functional area, the resistors are electrically connected with the L ED chip, the light reflecting layer is laid on the upper surface of the flexible circuit board, the light reflecting layer is not laid above the functional area and the L ED chip, the light reflecting layer is provided with at least one notch, the notch penetrates through the upper and lower surfaces of the light reflecting layer, the packaging layer coated on the surface of the L ED chip is also covered on the upper surface of the light reflecting layer, and the packaging layer is directly.

2. The COB light bar of claim 1, wherein the notch of the reflective layer is located near the edge of the coated area of the encapsulation layer.

3. The COB light bar of claim 1, wherein the reflective layer is a light layer or a mirror layer.

4. The COB light bar of claim 3, wherein the reflective layer is a white oil layer or a white glue layer.

5. The COB light bar of any one of claims 1-4, wherein the flexible circuit board is an elongated strip, and the notch provided in the reflective layer extends along the length of the flexible circuit board.

6. The COB light bar of claim 5, wherein the notches of the reflective layer are at least two, and the notches are symmetrical to each other along an axis of the flexible circuit board in the length direction.

7. The COB light bar of any one of claims 1-4, wherein the notches in the light reflecting layer are of uniform size.

8. The COB light bar of any one of claims 1-4, wherein the notch provided in the light-reflecting layer is smaller in size on the upper surface of the light-reflecting layer than on the lower surface of the light-reflecting layer.

9. The COB light bar of claim 8, wherein the notch formed in the reflective layer is trapezoidal in cross-sectional shape.

10. The COB light bar of any one of claims 1-4, wherein the reflective layer is also applied to the surface of the resistor.