CN210687930U

CN210687930U - Flip-chip LED lamps and lanterns and cupboard

Info

Publication number: CN210687930U
Application number: CN201922053542.6U
Authority: CN
Inventors: 魏天义; 牛衍方; 张望
Original assignee: Guangdong Dongche Intelligent Technology Co Ltd
Current assignee: Guangdong Dongche Intelligent Technology Co Ltd
Priority date: 2019-11-25
Filing date: 2019-11-25
Publication date: 2020-06-05
Anticipated expiration: 2029-11-25

Abstract

The utility model provides a flip-chip LED lamps and lanterns and cupboard, include: the LED lamp comprises a lamp base, an FPC (flexible printed circuit) board, a reflecting layer, a light-transmitting layer and at least one LED lamp; the FPC circuit board is fixedly arranged on the lamp base and is provided with an installation surface; the LED lamp is packaged on the mounting surface through a flip-chip process and is electrically connected with the FPC circuit board; the light transmitting layer is matched and connected with the lamp base, and the LED lamp is covered by the light transmitting layer; the reflecting layer is coated on the surface of the mounting surface, and the visible light rays emitted by the LED lamp and emitted to the reflecting layer are reflected to the direction far away from the reflecting layer through the reflecting layer. The utility model discloses LED lamps and lanterns are luminous even, and the uniformity is good, and luminous efficiency is high, no light spot and dark space, and the LED lamp area bending nature of adoption is good, and the assembly is simple, and the reliability is high.

Description

Flip-chip LED lamps and lanterns and cupboard

Technical Field

The utility model relates to a soft lamp area field of LED, concretely relates to flip-chip LED lamps and lanterns and cupboard.

Background

The LED lamp strip is characterized in that an LED is assembled on a strip-shaped FPC (flexible printed circuit) board, so that the LED lamp strip is called as an LED soft lamp strip due to the fact that the LED lamp strip is like a strip, is long in service life, energy-saving and environment-friendly, is suitable for being used in irregular places and places with narrow space, can be bent and wound at will, and is suitable for randomly combining various patterns in advertisement decoration.

The LED lamp on traditional lamp area adopts SMD LED encapsulation, and the reuse tin cream welding is on lamp area FPC base plate after independently encapsulating the LED lamp.

The cabinet body lamps installed in the cabinet mostly adopt linear lamps for illumination, the linear lamps adopt lamp strips which are arranged by SMD LEDs, the lamp strips comprise FPC (flexible printed circuit) soft lamp strips and hard lamp strips, the FPC soft lamp strips and the hard lamp strips are arranged at 60/meter and 120/meter, and the lamp strips are assembled in a radiator made of aluminum profiles.

Since lamps use lamp strips with different particle counts/meter, the emitted light has light spots or spots, even forms dark areas. Light mixing is usually performed by using a frosted light-transmitting cover material to reduce faculae or dark areas, but the illumination uniformity and consistency effect is poor or too much light effect is sacrificed.

The FPC soft lamp strip welded by the existing SMD LEDs is not easy to bend by too small radian, so that an LED bonding pad or the FPC soft lamp strip is easy to break to cause failure, and certain failure rate exists in the process of coiling and packaging or assembling lamps in application.

SUMMERY OF THE UTILITY MODEL

The application provides a flip-chip LED lamps and lanterns and cupboard for solve the difficult buckling in FPC lamp area in the lamps and lanterns, and the light that the LED lamp sent distributes away from all sides, causes the problem that luminance is not enough, light is too dispersed.

A flip-chip LED luminaire comprising:

the LED lamp comprises a lamp base, an FPC (flexible printed circuit) board, a reflecting layer, a light-transmitting layer and at least one LED lamp;

the FPC circuit board is fixedly arranged on the lamp base and is provided with an installation surface;

the LED lamp is packaged on the mounting surface through a flip-chip process and is electrically connected with the FPC circuit board;

the light transmitting layer is matched and connected with the lamp base, and the LED lamp is covered by the light transmitting layer;

the reflecting layer is coated on the surface of the mounting surface, and the visible light rays emitted by the LED lamp and emitted to the reflecting layer are reflected to the direction far away from the reflecting layer through the reflecting layer.

Preferably, the visible light emitted by the LED lamp is diffusely reflected, specularly reflected, totally reflected or retro-reflected on the reflective layer.

Preferably, the reflecting layer is made of uniformly coated fluorescent powder.

Preferably, the LED lamp is a dual color temperature LED lamp, and the dual color temperature LED lamp includes a high color temperature LED lamp and a low color temperature LED lamp; the high color temperature LED lamps and the low color temperature LED lamps are arranged in parallel on the FPC board to form two lines.

Preferably, the LED lamps are single color temperature LED lamps, and the single color temperature LED lamps are arranged on the FPC in parallel to form a line.

Preferably, a connecting portion is arranged on a surface, back to the FPC board, of the lamp base, and the connecting portion is configured to attach the lamp to a preset position.

A cabinet comprises a cabinet body and the inverted LED lamp; be equipped with the installed part on the cabinet body, through the installed part is connected flip-chip LED lamps and lanterns.

Compared with the prior art, the beneficial effects of the utility model are that:

the LED lamp has uniform light emission, good consistency, high light emitting efficiency and no light spot or dark space;

the LED lamp strip adopted is good in bending property, simple to assemble and high in reliability.

Drawings

FIG. 1 is a schematic view of a flip-chip LED lamp structure;

FIG. 2 is a schematic structural diagram of a two-color temperature LED lamp strip;

fig. 3 is a schematic structural view of a single color temperature LED strip;

fig. 4 is a schematic structural view of a cabinet lamp according to the present invention.

Reference numerals: 1-lamp, 2-FPC (flexible printed circuit) board, 3-lamp base, 4-euphotic layer, 5-reflecting layer, 6-LED lamp, 7-high color temperature LED lamp, 8-low color temperature LED lamp, 9-sealing cover, 10-power supply pad, 11-current limiting resistor, 12-warm color fluorescent powder coating, 13-cold color fluorescent powder coating, 14-cabinet body and 15-mounting piece.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it should be further noted that unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "connected," and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1

Referring to fig. 1, a flip-chip LED lamp 1 includes: the lamp comprises a lamp base 3, an FPC (flexible printed circuit) board 2 and a light transmission layer 4.

The FPC circuit board 2 is fixedly arranged on the lamp base 3, the FPC circuit board 2 is provided with the mounting surface, the mounting surface is coated with the reflecting layer 5, the light of the LED lamp of the existing lamp is scattered, dark areas, bright spots and the like occur due to the problems of materials, colors and the like of a circuit board for mounting the lamp, and therefore in the embodiment, the light which is emitted to the mounting surface is reflected out through the reflecting layer 5, the dark areas and the light spots of the lamp are reduced, and the illumination brightness of the lamp is improved.

The FPC board 2 is further provided with a power supply pad 10 for electrically connecting with an external power supply. The power supply pad 10 in this example is a cutting position, and when the length of the FPC board 2 needs to be adjusted, cutting is performed on the power supply pad 10.

At least one LED lamp 6 is arranged on the reflecting layer 5. The LED lamp 6 is packaged on the reflecting layer 5 through a flip-chip process and is electrically connected with the FPC circuit board 2.

Further, the LED lamp 6 is packaged on the FPC circuit board 2 by adopting a flip-chip process, and the application of the flip-chip LED packaging technology can enable the area of an LED chip of the LED lamp 6 to be close to 1 in comparison with the packaging area: 1, greatly reduce the area and the volume of lamps and lanterns to make the volume of lamps and lanterns reduce littleer, it is thinner simultaneously, thereby can be applied to the narrow and small space place in position better, and improved ability such as anti-interference.

The conventional LED lamp is referred to as a "flip chip" because the electrical surface of the chip connected to the substrate by gold wire bonding faces upward, and the electrical surface of the flip chip faces downward, which is equivalent to turning the chip upside down, and the corresponding packaging process is referred to as a "flip chip process".

LED flip-chip does not have gold thread chip level encapsulation, based on flip-chip technique, on the basis that traditional chip was just adorned the encapsulation, has reduced gold thread bonding wire technology, only leaves chip and tin cream collocation phosphor powder etc. and uses. Therefore, the flip-chip process has no bonding wire, and the problems of poor lighting, flickering, large light attenuation and the like of the LED lamp caused by insufficient bonding or poor contact of gold wires are completely avoided. The chip and the FPC circuit board 11 are electrically and mechanically interconnected through solder paste welding, the bonding strength is high, the thrust of a common gold wire is only 5 grams, and the strength of solder used in the flip-chip process is over 100 times of that of the solder.

Compared with a normal mounting process which uses silver glue for die bonding, a reverse mounting process which uses tin paste for welding has better heat dissipation; the forward mounting process has longer processing time, and the curing time of more than 2 hours is needed only by silver glue die bonding; the normal mounting process has complex process, the damaged lamp cannot be repaired, the inverted mounting process has simple application process, the damaged lamp can be repaired, the inverted mounting process can shorten the time to 3-5 minutes, and the production efficiency is greatly improved; compared with the normal packaging process, the packaging density of the flip-chip process is increased by 16 times, the packaging volume is reduced by 80%, the light color distribution is more uniform, the cost is lower, and the chip with smaller size has very high technical requirements on the equipment precision and the die bonding solder paste.

The euphotic layer 4 is matched and connected with the lamp base 3, and the euphotic layer 4 covers all the LED lamps 6. In this example, the two ends of the lamp 1 further include sealing covers 9, and the two ends of the euphotic layer 4 and the lamp base 3 are sealed by the sealing covers 9, so that dust, moths and the like are prevented from entering the lamp 1 to affect illumination.

The side of the FPC board 2 opposite to the mounting surface is provided with a connecting part, the connecting part is configured to fix the FPC board 2 at a preset position of the lamp base 3, in this example, an adhesive layer is added at the preset position of the lamp base 3, and the FPC board 2 is adhered to the preset position on the lamp base 3.

Through the setting of the connecting portion of FPC circuit board 2, the connecting portion setting of FPC circuit board 2 is in the one side of installation face dorsad, and the connecting portion setting is installed outside the reflection stratum to the mode of being convenient for FPC circuit board 2 through pasting is installed in using the place, simple to operate easily actually changes the installation pattern simultaneously.

Present LED lamp area during operation, the light that the LED lamp sent can all sides effluvium, cause certain light insufficient, light is too dispersed, the printing opacity cover material that uses the dull polish effect under the many situations mixes the light and alleviates facula or dark space, but illumination homogeneity and uniformity effect are not good or have sacrificed too many light efficiencies, and can cause light pollution to the one side environment that does not need the light, influence normal operational environment and living environment, if the light reflection of the one side that will not need light, reflect it back to the one side that needs light, can solve light pollution's problem, can also increase illumination intensity, improve luminous efficiency, on the other hand, under the requirement of satisfying illumination intensity, electric energy and cost material can be saved.

Therefore, in the present embodiment, the visible light emitted from the LED lamp 6 toward the reflective layer is reflected by the reflective layer in a direction away from the reflective layer. Further, the visible light emitted by the LED lamp 6 in this example may undergo phenomena at the reflective layer including, but not limited to, diffuse reflection, specular reflection, total or retro-reflection, or other reflections.

In this example, the reflective layer is uniformly coated with phosphor. The fluorescent powder is coated on the mounting surface, the processing mode of the reflecting layer is simple and convenient, and the operability is high. The medium covering device can be a reflection layer of other media, different media adopt different processing modes, different covering modes can be adopted for different media, and workers or machines can quickly and efficiently cover the media on the mounting surface in the existing industrial production line.

Therefore, by covering the surface of the flip-chip LED lamp with the reflective layer, the angle of the light-emitting region of the LED lamp 6 is reduced, which is beneficial to improving the overall brightness and light-emitting efficiency.

Example 2

Referring to fig. 2, the LED lamp 6 is a two-color temperature LED lamp including a high color temperature LED lamp 7 and a low color temperature LED lamp 8; the high color temperature LED lamps 7 and the low color temperature LED lamps 8 are arranged in parallel on the FPC board 2 to form two lines, and a current limiting resistor 11 is arranged between each LED lamp 6. Of course, the high color temperature LED lamps 7 and the low color temperature LED lamps 8 may be alternately distributed as needed.

In another embodiment, two LED lamps are arranged in parallel, and the two LED lamps can be LED lamps with the same color temperature or LED lamps with different color temperatures. The LED lamp with the same color temperature can be arranged in two rows, the fluorescent powder coatings with different color temperatures are arranged on the FPC circuit boards electrically connected with the two rows of LED lamps, for example, the warm color fluorescent powder coatings 12 and the cold color fluorescent powder coatings 13 are coated respectively, double-color temperature LED lamp display is realized through the warm color fluorescent powder coatings and the cold color fluorescent powder coatings, the LED lamps with different color temperatures can be arranged certainly, and the warm color fluorescent powder coatings and the cold color fluorescent powder coatings are arranged on the FPC circuit boards connected with the LED lamps with different color temperatures respectively.

In one embodiment, the LED lamps with different color temperatures are adopted, and the working principle is as follows: the FPC circuit board 2 is provided with a plurality of high color temperature LED lamps 7 and low color temperature LED lamps 8 which are distributed at intervals. Wherein, the high color temperature LED lamp 7 and the low color temperature LED lamp 8 are arranged in parallel on the FPC board 2 to form two lines. Further, 4000K is preferable for the high color temperature LED lamp 7, and 2700K is preferable for the low color temperature LED lamp 8. The LED lamps are electrically connected to the color temperature controller in parallel. When a user needs high color temperature illumination, the color temperature controller controls the high color temperature LED lamp 7 to work; when a user needs low color temperature illumination, the color temperature controller controls the low color temperature LED lamp 8 to work; when the color temperature illumination environment needs to be neutralized, the high and low color temperature LED lamps can be simultaneously started to work, and the light is mixed to form 3350K neutralized color temperature illumination, so that the light is uniform and soft, the heat dissipation is facilitated, and the service life of the LED lamp is prolonged. Certainly, the LED lamps with more color temperatures can be integrated on the same lamp 1, so that the same lamp 1 can emit light with different color temperatures for illumination, and different requirements of customers can be met, thereby avoiding the disadvantages of complex installation, high use cost and the like caused by the need of installing lamp strips with various color temperatures by users.

Example 3

Referring to fig. 3, the LED lamps are single color temperature LED lamps, that is, the LED lamps 6 with the same color temperature are adopted, the LED lamps with the single color temperature are arranged in parallel on the FPC board 2 to form a line, and a current limiting resistor 11 is further disposed between the LED lamps 6.

Example 4

Referring to fig. 4, a cabinet comprises a cabinet body 14, a lamp 1 with an LED flip-chip; be equipped with installed part 15 on the cabinet body 14, connect flip-chip LED's lamps and lanterns 1 through installed part 15.

It is right to have used specific individual example above the utility model discloses expound, only be used for helping to understand the utility model discloses, not be used for the restriction the utility model discloses. To the technical field of the utility model technical personnel, the foundation the utility model discloses an idea can also be made a plurality of simple deductions, warp or replacement.

Claims

1. A flip-chip LED lamp, comprising:

2. The flip-chip LED lamp of claim 1, wherein the visible light emitted from the LED lamp is diffusely, specularly, totally or retro-reflected from the reflective layer.

3. The flip-chip LED lamp of claim 1 or 2, wherein the reflective layer is a uniformly coated phosphor.

4. The flip-chip LED light fixture of claim 1 wherein the LED lamp is a dual color temperature LED lamp, the dual color temperature LED lamp comprising a high color temperature LED lamp and a low color temperature LED lamp; the high color temperature LED lamps and the low color temperature LED lamps are arranged in parallel on the FPC board to form two lines.

5. The flip-chip LED lamp of claim 1, wherein the LED lamps are single color temperature LED lamps arranged in parallel in a column on the FPC board.

6. The flip-chip LED lamp of claim 1 further comprising a sealing cap by which the light transmissive layer is sealed to both ends of the lamp base.

7. The flip-chip LED lamp of claim 1, wherein a side of the lamp base facing away from the FPC board is provided with a connection portion configured to fix the lamp in a predetermined position.

8. A cabinet comprising a cabinet body and the flip-chip LED light fixture of any one of claims 1-7; be equipped with the installed part on the cabinet body, through the installed part is connected flip-chip LED lamps and lanterns.