CN210607326U - LED three-hundred-sixty-degree light-emitting base structure - Google Patents
LED three-hundred-sixty-degree light-emitting base structure Download PDFInfo
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- CN210607326U CN210607326U CN201922049384.7U CN201922049384U CN210607326U CN 210607326 U CN210607326 U CN 210607326U CN 201922049384 U CN201922049384 U CN 201922049384U CN 210607326 U CN210607326 U CN 210607326U
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- electrodeless
- pad
- light
- bonding pad
- emitting
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Abstract
A three hundred sixty-degree light-emitting base structure of an LED is characterized in that a first electrodeless pad placing through hole and a second electrodeless pad placing through hole are formed in an epoxy resin base (1), the first electrodeless pad and the second electrodeless pad are respectively located in the first electrodeless pad placing through hole and the second electrodeless pad placing through hole and are bonded through epoxy resin glue, two sides of the first electrodeless pad and two sides of the second electrodeless pad and two sides of the epoxy resin base (1) are located on the same horizontal plane, a pair of light-emitting chips (2) are respectively arranged on the first electrodeless pad and the second electrodeless pad, a transparent rubber cake is arranged on the epoxy resin base (1), and the pair of light-emitting chips (2) are located in the transparent rubber cake. The utility model has the advantages that: 1. the luminous angle problem of SDMLED has effectively been improved to this scheme, has the advantage more in the aspect of the ornament lamp especially, like christmas tree lamp strip, 360 luminous.
Description
Technical Field
The utility model relates to a LED field, concretely relates to LED three hundred sixty degrees luminous base structure.
Background
At present, 1, the maximum light-emitting angle of a single LED in the current market is 270 ″, 360-color light emission cannot be realized, and a small-sized SMD LED cannot light 2 colors. 2. The common PCB circuit bonding pads are mirror surfaces after being electroplated, and after a customer uses an LED to be welded and heated, due to the internal stress of colloid, the chip bottom glue is very easy to separate from the PCB to cause the lamp to be dead. 3. The existing fluorescent powder glue is generally directly connected on a light-emitting chip, and the glue dispensing effect is not ideal because the fluorescent powder glue flows in a liquid state.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to provide a light emitting base structure of LED with three hundred sixty degrees.
The utility model comprises an epoxy resin base, a pair of luminous chips, a first electrodeless bonding pad and a second electrodeless bonding pad,
a first electrodeless pad placing through hole and a second electrodeless pad placing through hole are formed on the epoxy resin base,
the first electrodeless bonding pad and the second electrodeless bonding pad are respectively positioned in the first electrodeless bonding pad placing through hole and the second electrodeless bonding pad placing through hole and are bonded by epoxy resin glue, two sides of the first electrodeless bonding pad and the second electrodeless bonding pad are positioned on the same horizontal plane with two sides of the epoxy resin base, the pair of light emitting chips are respectively arranged on the first electrodeless bonding pad and the second electrodeless bonding pad,
the epoxy resin base is provided with a transparent rubber cake, and the pair of light-emitting chips are positioned in the transparent rubber cake.
The bonding surfaces of the first and second electrodeless bonding pads and the light-emitting chip are roughened surfaces.
The first electrodeless bonding pad comprises a first electrodeless A bonding pad and a first electrodeless B bonding pad, the first electrodeless A bonding pad and the first electrodeless B bonding pad are integrally cast through a connecting bonding pad, the size of the first electrodeless A bonding pad is larger than that of the first electrodeless B bonding pad, and one of the pair of light-emitting chips is arranged on the first electrodeless B bonding pad.
The second electrodeless bonding pad comprises a second electrodeless A bonding pad and a second electrodeless B bonding pad, the second electrodeless A bonding pad and the second electrodeless B bonding pad are formed by casting a connecting bonding pad body, the size of the second electrodeless A bonding pad is larger than that of the second electrodeless B bonding pad, and the other light-emitting chip of the pair of light-emitting chips is arranged on the second electrodeless B bonding pad.
The fluorescent powder is coated on the light-emitting chip through dispensing.
Grooves are formed in the first electrodeless bonding pad and the second electrodeless bonding pad, the pair of light emitting chips are respectively bonded in the grooves in the first electrodeless bonding pad and the second electrodeless bonding pad, and the depth of each groove is 0.1-0.15 mm.
A groove is arranged on the first electrodeless B bonding pad, one of the pair of light emitting chips is arranged in the groove on the first electrodeless B bonding pad, and the depth of the groove is 0.1-0.15 mm.
The second electrodeless B bonding pad is provided with a groove, the other light-emitting chip of the pair of light-emitting chips is arranged in the groove on the second electrodeless B bonding pad, and the depth of the groove is 0.1-0.15 mm.
The transparent rubber cake is made of epoxy resin and is adhered to the epoxy resin base 1.
The utility model has the advantages that: 1. the scheme effectively improves the problem of the lighting angle of the SDMLED, and has more advantages particularly in the aspect of decorative lamps, such as Christmas tree lamp strips, and 360-degree lighting; 2. through changing the circuit on the panel, realize that 2 kinds of colours are luminous, the saving space more when using the product can reduce cost simultaneously.
Description of the drawings
Fig. 1 is a schematic structural diagram of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the embodiments of the present invention, it should be noted that, if the terms "upper", "lower", "inside", "outside", etc. are used for indicating the orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships that the products of the present invention usually place when using, the present invention is only used for convenience of description and simplification of the description, but does not indicate or imply that the devices or elements indicated must have specific orientations, be constructed in specific orientations, and operate, and thus, the present invention should not be construed as being limited. Furthermore, the appearances of the terms "first," "second," and the like in the description of the present invention are only used for distinguishing between the descriptions and are not intended to indicate or imply relative importance.
In the description of the embodiments of the present invention, it should be further noted that unless otherwise explicitly stated or limited, the terms "disposed" and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1, the present invention comprises an epoxy resin base 1, a pair of light emitting chips 2, a first electrodeless pad and a second electrodeless pad,
a first electrodeless pad placing through hole and a second electrodeless pad placing through hole are formed on the epoxy resin base 1,
the first electrodeless bonding pad and the second electrodeless bonding pad are respectively positioned in the first electrodeless bonding pad placing through hole and the second electrodeless bonding pad placing through hole and are bonded by epoxy resin glue, two sides of the first electrodeless bonding pad and the second electrodeless bonding pad are positioned on the same horizontal plane with two sides of the epoxy resin base 1, the pair of light-emitting chips 2 are respectively arranged on the first electrodeless bonding pad and the second electrodeless bonding pad, the problem of the light-emitting angle of the SDMLED is solved, and the LED decorative lamp has more advantages particularly in the aspect of decorative lamps,
the epoxy resin base 1 is provided with a transparent rubber cake, and the pair of light-emitting chips 2 are positioned in the transparent rubber cake.
The bonding surfaces of the first and second electrodeless bonding pads and the light-emitting chip are roughened surfaces. The scheme can enhance the bonding force between the primer and the PCB pad.
The first electrodeless bonding pad comprises a first electrodeless A bonding pad 31 and a first electrodeless B bonding pad 32, the first electrodeless A bonding pad 31 and the first electrodeless B bonding pad 32 are formed by integrally casting a connecting bonding pad, the size of the first electrodeless A bonding pad 31 is larger than that of the first electrodeless B bonding pad 32, and one of the pair of light-emitting chips 2 is arranged on the first electrodeless B bonding pad 32. The bonding pads are arranged on the small-sized bonding pads, so that the area of the light-emitting chip for blocking a light source is reduced, and the light-emitting area is enlarged.
The second electrodeless pad comprises a second electrodeless A pad 41 and a second electrodeless B pad 42, the second electrodeless A pad 41 and the second electrodeless B pad 42 are formed by casting a connecting pad body, the size of the second electrodeless A pad 41 is larger than that of the second electrodeless B pad 42, and the other light-emitting chip of the pair of light-emitting chips 2 is arranged on the second electrodeless B pad 42. The bonding pads are arranged on the small-sized bonding pads, so that the area of the light-emitting chip for blocking a light source is reduced, and the light-emitting area is enlarged.
The fluorescent powder is coated on the light-emitting chip through dispensing.
The light-emitting chips are bonded with the electrodeless bonding pads in a bonding mode.
By arranging a small-sized bonding pad, two light-emitting chips are arranged on the base 1, and 2 bright colors are arranged
The first non-polar B pad 32 is provided with a groove 101, and one of the pair of light emitting chips 2 is disposed in the groove 101 on the first non-polar B pad 32, and the depth of the groove 101 is 0.1-0.15 mm.
The second electrodeless B bonding pad 42 is provided with a groove 101, the other light-emitting chip of the pair of light-emitting chips 2 is arranged in the groove 101 on the second electrodeless B bonding pad 42, and the depth of the groove 101 is 0.1-0.15 mm.
The transparent rubber cake is made of epoxy resin and is adhered to the epoxy resin base 1.
The fluorescent powder is coated on the light-emitting chip through dispensing. The fluorescent powder is covered on the light-emitting chip to realize the purpose of changing color, such as: the blue light and the fluorescent powder can be changed into other colors, such as white light, pink, ice blue and the like.
Dispensing mode: the fluorescent powder is mixed with the glue in a granular form to form a liquid state, the fluorescent powder and the glue in the liquid state are dotted in the groove 101 on the electrodeless bonding pad, the fluorescent powder and the glue in the liquid state only can flow in the groove 101, and the fluorescent powder and the glue are cured after heating.
Claims (9)
1. An LED three-hundred-sixty-degree light-emitting base structure is characterized by comprising an epoxy resin base (1), a pair of light-emitting chips (2), a first electrodeless bonding pad and a second electrodeless bonding pad,
a first electrodeless pad placing through hole and a second electrodeless pad placing through hole are formed on the epoxy resin base (1),
the first electrodeless bonding pad and the second electrodeless bonding pad are respectively positioned in the first electrodeless bonding pad placing through hole and the second electrodeless bonding pad placing through hole and are bonded through epoxy resin glue, two sides of the first electrodeless bonding pad and the second electrodeless bonding pad are positioned on the same horizontal plane with two sides of the epoxy resin base (1), the pair of light emitting chips (2) are respectively arranged on the first electrodeless bonding pad and the second electrodeless bonding pad,
the epoxy resin base (1) is provided with a transparent rubber cake, and the pair of light-emitting chips (2) are positioned in the transparent rubber cake.
2. The structure of claim 1, wherein the bonding surfaces of the first and second non-polar bonding pads and the light emitting chip are roughened surfaces.
3. The LED three-hundred and sixty-degree light-emitting base structure according to claim 1, wherein the first electrodeless pad comprises a first electrodeless A pad (31) and a first electrodeless B pad (32), the first electrodeless A pad (31) and the first electrodeless B pad (32) are integrally cast through a connecting pad, the size of the first electrodeless A pad (31) is larger than that of the first electrodeless B pad (32), and one of the pair of light-emitting chips (2) is arranged on the first electrodeless B pad (32).
4. The LED three-hundred and sixty-degree light-emitting base structure according to claim 1, wherein the second electrodeless pad comprises a second electrodeless A pad (41) and a second electrodeless B pad (42), the second electrodeless A pad (41) and the second electrodeless B pad (42) are formed by two-body casting of a connecting pad, the size of the second electrodeless A pad (41) is larger than that of the second electrodeless B pad (42), and the other light-emitting chip of the pair of light-emitting chips (2) is arranged on the second electrodeless B pad (42).
5. The structure of claim 1, wherein the phosphor is coated on the light emitting chip by dispensing.
6. The structure of the LED three-hundred-sixty-degree light-emitting base according to claim 1, wherein the first electrodeless bonding pad and the second electrodeless bonding pad are both provided with grooves (101), the pair of light-emitting chips (2) are respectively adhered in the grooves (101) on the first electrodeless bonding pad and the second electrodeless bonding pad, and the depth of the grooves (101) is 0.1-0.15 mm.
7. The structure of the LED three-hundred and sixty-degree light-emitting base according to claim 3, characterized in that the first electrodeless B pad (32) is provided with a groove (101), one of the pair of light-emitting chips (2) is arranged in the groove (101) on the first electrodeless B pad (32), and the depth of the groove (101) is 0.1-0.15 mm.
8. The LED three-hundred and sixty degree light-emitting base structure according to claim 4, characterized in that the second electrodeless B pad (42) is provided with a groove (101), and the other light-emitting chip of the pair of light-emitting chips (2) is arranged in the groove (101) on the second electrodeless B pad (42), and the depth of the groove (101) is 0.1-0.15 mm.
9. The structure of the LED three hundred and sixty degree light-emitting base according to claim 4, wherein the transparent rubber cake is made of epoxy resin and is adhered on the epoxy resin base (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922049384.7U CN210607326U (en) | 2019-11-25 | 2019-11-25 | LED three-hundred-sixty-degree light-emitting base structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922049384.7U CN210607326U (en) | 2019-11-25 | 2019-11-25 | LED three-hundred-sixty-degree light-emitting base structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210607326U true CN210607326U (en) | 2020-05-22 |
Family
ID=70697884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922049384.7U Expired - Fee Related CN210607326U (en) | 2019-11-25 | 2019-11-25 | LED three-hundred-sixty-degree light-emitting base structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210607326U (en) |
-
2019
- 2019-11-25 CN CN201922049384.7U patent/CN210607326U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200522 Termination date: 20201125 |