JP2008085217A - Method of aligning printed circuit board and apparatus thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To accurately and highly efficiently align two printed circuit boards. <P>SOLUTION: First and second printed circuit boards 1, 3 are each configured such that a wiring pattern of a conductive material 9 is printed on a base material 7 and a plurality of terminals 5 with the conductive material 9 exposed on an end are provided. In superimposing the terminals 5, the terminals 5 are imaged in a state where the first and second printed boards 1, 3 to be superimposed are intentionally deviated to avoid superimposition of the corresponding terminals 5, and the terminals 5 respectively corresponding to the first and second printed boards 1, 3 are aligned on the basis of positional deviation of the imaged terminals 5. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board alignment method and apparatus, and in particular, when the terminals of two printed circuit boards are overlapped, the position of the terminal of the overlapping portion is imaged by an image processing means such as a CCD camera The present invention relates to a printed circuit board alignment method and apparatus for aligning terminals of two printed circuit boards.

  Conventionally, as a printed circuit board, as shown in FIGS. 7A and 7B, there is a flexible printed circuit board 101 (hereinafter, simply referred to as “FPC”). This FPC 101 forms a wiring pattern by printing a foil-like conductive material 105 made of, for example, copper on an insulating film 103 as a base material made of, for example, polyimide or polyethylene terephthalate (PET). The over resist 107 is laminated on the wiring pattern. Further, the over resist 107 is not formed on the terminal 109, and the conductive material 105 is exposed.

  In order to join the two FPCs 101 with the terminal 109, for example, as shown in FIG. 8, the above-mentioned FPC 101 is connected to the terminals 109 of the two first and second FPCs 101A and 101B with a CCD camera 111 or the like. It is important to accurately align the first and second FPCs 101A and 101B at predetermined positions by observing with the imaging means.

  Conventionally, as an observation method for aligning a printed circuit board, as shown in Patent Document 1 and FIG. 8, the FPC 101 irradiates light to the terminals 109 of the two first and second FPCs 101A and 101B. The observation is performed by the observation device 113 having an observation unit such as a CCD camera 111 or a microscope. For example, there is one in which irradiation light is irradiated from the oblique direction to the surface of the FPC 101 by the LED illumination 115 of the illuminating device, and the wiring pattern of the FPC 101 is observed by reflected light above the FPC 101.

When the terminals 109 of the two first and second FPCs 101A and 101B are overlapped, the conductive material 105 of the terminal 109 of each FPC 101 is set by the observation method of the FPC 101 before the terminals 109 are overlapped. The exposed surface is observed from above by a CCD camera 111 as an observation unit. At this time, the position coordinates in the X axis, Y axis direction, and θ axis direction orthogonal to each other on the horizontal plane of each terminal 109 are measured, and the first FPC 101A, for example, is fixed to the fixing base 117 based on the data of the position coordinates. Then, the second FPC 101B moves in the up and down Z-axis direction and the four axis directions of the X-axis, Y-axis direction, and θ-axis direction, and the conductive material 105 of each terminal 109 of the first and second FPCs 101A and 101B. Are positioned so as to overlap each other.
JP-A-8-222832

  By the way, in the conventional alignment method of the FPC 101, it is necessary to perform alignment so that the centers of the widths of the terminals 109 of the first and second FPCs 101A and 101B overlap. However, as shown in FIG. 7C, when the terminals 109 of the first and second FPCs 101A and 101B are overlapped, the terminal 109 of the first FPC 101A is connected to the terminal 109 of the second FPC 101B. There is a problem that it is difficult to recognize the amount of displacement of the terminal 109 because it is difficult to observe because it is hidden behind a shadow or cannot be observed.

In order to achieve the problem to be solved by the above invention, a printed circuit board alignment method according to the present invention includes a terminal on which a wiring pattern of a conductive material is printed on a base material and the conductive material is exposed at an end. When the terminals of the first and second printed circuit boards are overlapped with each other,
The first and second printed circuit boards to be overlapped with each other are imaged in a state where the corresponding terminals are intentionally shifted so that the corresponding terminals do not overlap each other, and the first and second printed circuit boards are imaged based on the positional deviation of the captured terminals. The corresponding terminals of the second printed circuit board are aligned.

In the printed circuit board alignment apparatus of the present invention, the wiring pattern of the conductive material is printed on the base material, and the first and second printed circuit boards having terminals that expose the conductive material at the ends. In a printed circuit board alignment device that aligns each terminal to overlap each other,
A drive unit that moves at least one printed circuit board of the first and second printed circuit boards in at least one direction on the overlapping plane;
An imaging unit that captures an image from one side of the terminals of the first and second printed circuit boards that overlap each other;
Image processing means for judging a positional shift of each terminal in a state where the first and second printed circuit boards are intentionally shifted so that the corresponding terminals do not overlap each other from the image captured by the imaging unit;
A computing device for calculating the positional deviation of each terminal of the first and second printed circuit boards, and a correspondence between the first and second printed circuit boards based on the positional deviation of each terminal calculated by the computing device A control unit that provides a command to the drive unit to align the terminals to be performed, and
It is characterized by comprising.

  As can be understood from the means for solving the above problems, according to the printed circuit board alignment method of the present invention, the terminals corresponding to each other overlap each other in the first and second printed circuit boards to be overlapped with each other. Each terminal of the first and second printed circuit boards is surely observed as compared with the state where the terminals of the first and second printed circuit boards overlap each other because the terminals are observed in a state where the terminals are intentionally shifted so as not to occur. Can be easily observed, and each terminal of the first and second printed circuit boards can be reliably aligned.

  Further, according to the printed circuit board positioning apparatus of the present invention, the first and second printed circuit boards to be overlapped with each other are intentionally shifted by the imaging unit and the image processing unit so that the corresponding terminals do not overlap each other. Since the respective terminals are observed in a state, the positions of the respective terminals of the first and second printed circuit boards can be reliably observed more easily than the state where the terminals of the first and second printed circuit boards are overlapped, Positioning of the terminals of the first and second printed circuit boards can be reliably performed by a command given from the command unit to the drive unit.

  Embodiments of the present invention will be described below with reference to the drawings.

  Referring to FIGS. 1A and 1B, as a printed circuit board according to this embodiment, there is a flexible printed circuit board (hereinafter, simply referred to as “FPC”). In FIG. FIG. 1B is a schematic side view when the terminals 5 of the second FPC 3 are overlapped with each other, and FIG.

  Since the first and second FPCs 1 and 3 have the same configuration, each component is described with the same reference numeral, for example, as a base material made of a resin such as polyimide or polyethylene terephthalate (PET). For example, a wiring pattern is formed on the insulating film 7 by printing a foil-like conductive material 9 made of, for example, copper, and an over resist 11 is laminated on the wiring pattern as a circuit protection member. Yes. Further, the over resist 11 is not formed on the terminal 5, and a plurality of conductive materials 9 are exposed.

  Here, a method of aligning the printed circuit board according to this embodiment will be described.

  In this embodiment, the insulating film 7 is made of polyimide, and the thickness thereof is configured so that the conductive material 9 of the terminal 5 can be seen from the back surfaces of the first and second FPCs 1 and 3. The plurality of conductive materials 9 of the terminal 5 protrude on the surface of the insulating film 7.

  Therefore, in the overlapping part of the first and second FPCs 1 and 3, the first FPC 1 is on the lower side, while the second FPC 3 is on the upper side. Part 13 can be determined.

  Actually, when the terminals 5 of the first and second FPCs 1 and 3 are overlapped with each other, the first center position CL1 of the width of the terminal 5 of the first FPC1 and the second center position CL2 of the width of the terminal 5 of the second FPC3. Must be aligned so that they overlap.

  In order to perform this easily and reliably, as a method of aligning the printed circuit board of this embodiment, as shown in FIG. 1 (C), the first and second FPCs 1 and 3 that overlap each other correspond to each other. Each terminal 5 is imaged in a state where it is deliberately shifted so that the terminals 5 to be overlapped with each other, and the corresponding terminals 5 of the first and second FPCs 1 and 3 are aligned based on the positional deviation of each imaged terminal 5 It is characterized by doing.

  Next, a printed circuit board alignment apparatus according to an embodiment of the present invention will be described.

  Referring to FIG. 4, for example, an FPC alignment device 15 serving as a printed circuit board alignment device is configured such that when two first and second FPCs 1 and 3 are overlapped and connected, This is an apparatus for performing alignment between three. For example, when the terminals 5 of the first and second FPCs 1 and 3 are connected by soldering, the terminals 5 of the first and second FPCs 1 and 3 are aligned.

  For example, the FPC alignment device 15 is provided with a fixing base 17 on which the first FPC 1 is placed. Further, above the fixed base 17, the second FPC 3 is moved independently in the X-axis and Y-axis directions orthogonal to each other on the horizontal plane and the Z-axis direction perpendicular to the X-axis and Y-axis directions. Is provided with an FPC moving device 19 composed of an X-axis, Y-axis, and Z-axis drive unit (not shown). The FPC moving device 19 is desirably configured to be able to adjust the inclination θ with respect to the horizontal plane, but is not essential. Further, as shown in FIG. 4, the FPC moving device 19 is connected to a control device 21 described later in detail.

  In this embodiment, the first FPC 1 is fixed to the fixed base 17. However, as in the case of the second FPC 3, the FPC moving device 19 makes it independent in the X-axis, Y-axis, and Z-axis directions. It may be configured to move the

  Further, above the fixed base 17, for example, a CCD camera 23 as an imaging unit for observing and imaging the conductive material 9 of the plurality of terminals 5 of the first and second FPCs 1 and 3 is provided. Reference numeral 23 is connected to the control device 21 via, for example, an image processing device 25 as image processing means for processing a captured image. The CCD camera 23 has a built-in lens 27 for changing the magnification. Further, for example, a ring type LED illumination 29 is provided as an illumination device for illuminating the imaging field of view of the CCD camera 23.

  In the image processing device 25, the position of the connecting portion 13 of each terminal 5 of the first and second FPCs 1 and 3 is determined from the image captured by the CCD camera 23. In this embodiment, It is determined in which direction the position shift of each terminal 5 is shifted in a state where the first and second FPCs 1 and 3 are intentionally shifted so that the corresponding terminals 5 do not overlap each other. For example, the positional deviation between the first center position CL1 of the terminal 5 of the first FPC 1 and the second center position CL2 of the terminal 5 of the second FPC 3 is determined by the position coordinates of each terminal 5.

  Referring to FIG. 5, the control device 21 includes a CPU 31 as a central processing unit. The CPU 31 includes an input device 33 such as a keyboard and a touch panel for inputting various data and programs, a CRT, A display device 35 such as a liquid crystal and a memory 37 for storing a program input from the input device 33, image data taken by the CCD camera 23, and the like are provided.

  Further, the CPU 31 receives the first center position CL1 on the first FPC1 side and the second FPC3 based on the images of the connecting portions 13 of the terminals 5 of the first and second FPC1 and 3 obtained by imaging. On the side of the second central position CL2, for example, a calculation device 39 for calculating a shift amount from the position coordinates of each terminal 5, and the first central position CL1 based on the shift amount calculated by the calculation device 39. And a command unit 41 for giving a command to the FPC moving device 19 so as to align the second center position CL2.

  A method of aligning by observing the overlapping portion of the conductive material 9 of each terminal 5 of the first and second FPCs 1 and 3 using the printed circuit board aligning device 15 of this embodiment with the above configuration will be described in detail. .

  First, the first FPC 1 is fixed to the fixing base 17 with the conductive material 9 exposed at the terminal 5 facing upward. Next, the second FPC 3 is moved by the FPC moving device 19 with the conductive material 9 exposed at the terminal 5 of the second FPC 3 facing downward, as shown in FIGS. 1 (A), (C) and FIG. The conductive material 9 of the terminal 5 of the second FPC 3 is moved so as to approach the conductive material 9 of the terminal 5 of the first FPC 1 through a gap in the overlapping portion of the conductive material 9 of the terminals 5 of the first and second FPCs 1 and 3.

  Thereafter, the terminals 5 of the first and second FPCs 1 and 3 which are close to each other as described above are imaged in the imaging visual field area 43 by the CCD camera 23 from one side as shown in FIG. This captured image is sent to the image processing device 25 for image processing.

  Based on the images of the connecting portions 13 of the terminals 5 of the first and second FPCs 1 and 3 in the above images, the first and second FPCs 1 and 3 are changed as shown in FIG. The image processing device 25 determines in which direction the positional deviation of each terminal 5 is shifted in a state where the terminals 5 corresponding to each other are intentionally shifted so as not to overlap each other. For example, the positional deviation between the first center position CL1 of the terminal 5 of the first FPC 1 and the second center position CL2 of the terminal 5 of the second FPC 3 is determined by the position coordinates of each terminal 5.

  In FIG. 1C, the second FPC 3 is shifted downward in the Y-axis direction with respect to the first FPC 1, so that the terminal 5 of the first FPC 1 is shifted outward from the edge of the second FPC 3. For example, in FIG. 1C, the first center position CL1 of the terminal 5 of the first FPC 1 at the upper end corresponds to the second center position CL2 of the terminal 5 of the second FPC 3 corresponding thereto. Observed with the position shifted.

  Next, the second FPC 3 is shifted upward in the figure in the Y-axis direction with respect to the first FPC 1 so that the terminal 5 of the first FPC 1 is not intentionally overlapped with the terminal 5 of the second FPC 3. The second center position CL2 of the terminal 5 of the second FPC 3 is observed in a state of being displaced from the first center position CL1 of the terminal 5 of the first FPC 1.

  As described above, the position coordinates of the first center position CL1 of the terminal 5 of the first FPC 1 and the second center position CL2 of the terminal 5 of the second FPC 3 are obtained separately, so that the first center position CL1 and the second center position CL2 A deviation amount of the center position CL2 is calculated.

  FIG. 3 shows an embodiment different from the above, and the second FPC 3 is shifted to the right in FIG. 3 in the X-axis direction with respect to the first FPC 1, so that the terminal 5 and the first FPC 1 corresponding to each other By preventing the terminal 5 of the 2FPC 3 from deliberately overlapping, for example, the first center position CL1 of the terminal 5 of the first FPC 1 at the upper end in FIG. 3 and the second center position CL2 of the terminal 5 of the second FPC 3 corresponding thereto are obtained. Observed in a misaligned state.

The amount of deviation is calculated by the arithmetic unit 39 based on the determination of the image processing device 25 described above. Based on the displacement amount described above, is given command from the command unit 41 to the FPC mobile device 19 moves in the Y-axis direction in FIG. 1 (C), the first terminal 5 of the 2FPC1,3 corresponding to each other aligned, further Ru conductive member 9 of the terminal 5 of the 2FPC3 is moved in the Z axis direction is superimposed on the conductive material 9 of the terminal 5 of the 1FPC1.
As described above, after the conductive materials 9 of the terminals 5 of the first and second FPCs 1 and 3 are accurately aligned, the second FPC 3 is lowered in the Z-axis direction by the gap so that the first and second FPC 1 , 3 are connected to each other and the connection portions 13 of the terminals 5 are overlapped. Next, the connecting portions 13 of the terminals 5 of the first and second FPCs 1 and 3 are soldered and connected.

  From the above, the first and second FPCs 1 and 3 that are overlapped with each other are observed while the terminals 5 are intentionally shifted so that the corresponding terminals 5 do not overlap with each other. The positions of the terminals 5 of the first and second FPCs 1 and 3 can be reliably observed more easily than when the terminals 5 overlap each other, and the positioning of the terminals 5 of the first and second FPCs 1 and 3 can be reliably performed. it can.

  In the printed circuit board alignment method of the above-described embodiment, the FPC alignment device 15 shown in FIG. 4 is used, but the FPC alignment device 45 shown in FIG. 6 is used. Can also be used.

  The FPC alignment device 45 will be described in detail. The same parts as those of the FPC alignment apparatus 15 in FIG. 4 described above are denoted by the same reference numerals, and different points will be mainly described.

  In the FPC alignment device 45, when the two first and second FPCs 1 and 3 are overlapped and connected, the first FPC 1 is fixed to a fixing base provided in the main body (not shown), and the second FPC 3 is located above the first FPC 1. The second FPC 3 is configured to be moved in the X-axis, Y-axis, and Z-axis directions by the FPC moving device 19.

  As the FPC moving device 19, even if the first FPC 1 is fixed and the second FPC 3 is moved, the second FPC 3 is fixed and the first FPC 1 moves in the X-axis, Y-axis, and Z-axis directions. Alternatively, both the first and second FPCs 1 and 3 may be independently moved in the X-axis, Y-axis, and Z-axis directions.

  As described above, the two first and second FPCs 1 and 3 are arranged on one side of the first and second FPCs 1 and 3 that are arranged one above the other in FIG. On the other hand, an illuminating device 29 provided with a light source for irradiating transmitted light 47 transmitted through the insulating films 7 of the first and second FPCs 1 and 3 is provided. The illumination device 29 is connected to the control device 21 to adjust the wavelength of the transmitted light 47.

  The wavelength of the transmitted light 47 is 460 to 1000 nm (0.46 to 1.0 μm) in this embodiment. The light having a wavelength of 460 to 1000 nm is transmitted through, for example, polyimide as the insulating film 7. In addition, when the wavelength of the transmitted light 47 is smaller than 460 nm, the image does not pass through the insulating film 7, and when the wavelength of the transmitted light 47 is larger than 1000 nm, it is not possible to image with the sensitivity of the CCD camera 23 as an imaging unit.

  Further, the first and second FPCs 1 and 3 to be overlaid on the side opposite to the side on which the illumination device 23 is arranged, in this embodiment, on the upper side of the first and second FPCs 1 and 3 in FIG. For example, a CCD camera 23 is provided as an imaging unit for observing the transmitted light 47 transmitted through the second FPC 1, 3 and imaging the shadow of the terminal 5 of the first FPC 1, 3. It is connected to the control device 21 via an image processing device 25 for processing the captured image.

  The image processing device 25, the calculation device 39 of the control device 21, and the command unit 41 are the same as the FPC alignment device 15 described above.

  Further, in both the alignment device 15 in FIG. 4 and the alignment device 45 in FIG. 6, the first and second FPCs 1, 3 requiring alignment accuracy of 300 μm or less can be connected. Further, it is possible to connect the first and second FPCs 1 and 3 which are narrow pitch terminals with a terminal pitch between the terminals 5 of 500 μm or less.

  In the above-described embodiment, the alignment between the first and second FPCs 1 and 3 has been described. However, when aligning the RPC and the FPC to connect each other, the RPC base material does not transmit light. Therefore, reflection illumination like the alignment apparatus 15 of FIG. 4 is used. In this case, the CCD camera 23 and the illumination device 29 are arranged on the FPC side of the RPC and FPC that are arranged one above the other.

  Further, when observing the FPC, for example, polyimide as the insulating film 7 transmits light. Therefore, the reflection illumination of the alignment device 15 in FIG. 4 or the transmission illumination of the alignment device 45 in FIG. 6 may be used. The wavelength of the transmitted light 47 is 460 to 1000 nm (0.46 to 1.0 μm) as described above.

(A) is a schematic front view when aligning the first and second printed circuit boards, (B) is a plan view, and (C) is the first and first embodiments of the present invention. It is an enlarged plan view of the terminal of 2 printed circuit boards. It is an enlarged plan view of the terminal of the 1st, 2nd printed circuit board of other embodiment of this invention. It is an enlarged plan view of the terminal of the 1st, 2nd printed circuit board of other embodiment of this invention. 1 is a schematic front view of a printed circuit board alignment apparatus according to an embodiment of the present invention. It is a block block diagram of a control apparatus. It is a schematic front view of the alignment apparatus of the other printed circuit board which concerns on embodiment of this invention. (A) is a schematic front view when aligning the first and second printed circuit boards, (B) is a plan view, and (C) is the conventional first and second printed circuit boards. It is an enlarged plan view of a terminal. It is a schematic front view of the conventional printed circuit board alignment apparatus.

Explanation of symbols

1 First FPC
3 Second FPC
5 Terminal 7 Insulating film (base material)
9 Conductive material 11 Over resist (circuit protection member)
15 FPC alignment device (printed circuit board alignment device)
19 FPC moving device (drive unit)
21 Control device 23 CCD camera (imaging part)
25 Image processing device (image processing means)
29 LED lighting (lighting device)
31 CPU
39 Arithmetic unit 41 Command unit 45 FPC alignment device (printed circuit board alignment device)
47 Transmitted light

Claims (2)

When the wiring patterns of the conductive material are printed on the base material and the terminals of the first and second printed circuit boards having the terminals with the conductive material exposed at the end portions are overlapped with each other,
The first and second printed circuit boards to be overlapped with each other are imaged in a state where the corresponding terminals are intentionally shifted so that the corresponding terminals do not overlap each other, and the first and second printed circuit boards are imaged based on the positional deviation of the captured terminals. A method of aligning printed circuit boards, comprising aligning corresponding terminals of a second printed circuit board. A printed circuit board that is printed with a wiring pattern of a conductive material on a base material and that positions the terminals of the first and second printed circuit boards having terminals with the conductive material exposed at the ends to overlap each other. In the alignment device
A drive unit that moves at least one printed circuit board of the first and second printed circuit boards in at least one direction on the overlapping plane;
An imaging unit that captures an image from one side of the terminals of the first and second printed circuit boards that overlap each other;
Image processing means for judging a positional shift of each terminal in a state where the first and second printed circuit boards are intentionally shifted so that the corresponding terminals do not overlap each other from the image captured by the imaging unit;
A computing device for calculating the positional deviation of each terminal of the first and second printed circuit boards, and a correspondence between the first and second printed circuit boards based on the positional deviation of each terminal calculated by the computing device A control unit that provides a command to the drive unit to align the terminals to be performed, and
An apparatus for aligning a printed circuit board, comprising:

Images