JP2007042874A - Printed-wiring board and method and device for aligning it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To surely align the places of the terminals of the superposing sections of the terminal sections of two printed-wiring boards by image-sensing the places by an image processing means when the terminal sections are superposed. <P>SOLUTION: When each terminal 3 is superposed mutually in first and second printed-wiring boards 1A and 1B in which the wiring patterns of conductive materials 9 are printed on a base material 7, and in which the conductive materials 9 are exposed at ends, connecting sections 13 for a connection and straight sections 15 extended to the connecting sections 13 and used for an alignment are formed previously to the conductive materials 9 at each terminal 3. An image is sensed by the image processing means 25 from one sides of the terminals 3 of the mutually superposed first and second printed-wiring boards 1A and 1B in this case. The places of the connecting sections 13 with each superposed terminal 3 are aligned at the places of the straight sections 15 for the alignment in the sensed image in this case. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a printed circuit board, and a method and apparatus for positioning the printed circuit board, and in particular, when the terminal parts of two printed circuit boards are overlapped, the position of the terminal part of the overlapping part is, for example, a CCD camera. The present invention relates to a printed circuit board that takes an image by image processing means such as two and aligns terminal portions of two printed circuit boards, and a method and apparatus for aligning the printed circuit boards.

  Conventionally, as a printed circuit board, there are flexible printed circuit boards 101A and 101B (hereinafter simply referred to as “FPC”) as shown in FIG. The FPCs 101A and 101B form a wiring pattern by printing a foil-like conductive material 105 made of, for example, copper on an insulating film 103 as a base material made of, for example, polyimide or polyethylene terephthalate (PET). An over resist 107 is laminated on the wiring pattern as a protective member. Further, the over resist 107 is not formed on the terminal portion 109, and the conductive material 105 is exposed.

  In order to join the two FPCs 101A and FPCs 101B with the terminal unit 109, for example, as shown in FIG. 5, the terminal units 109 of the two first and second FPCs 101A and 101B are connected to the CCD camera 111A, It is important to accurately align the FPCs 101A and 101B with predetermined positions by observing with 111B or the like.

  Conventionally, as an observation method for aligning printed circuit boards, as disclosed in Patent Document 1, CCD cameras 111A, 111B, a microscope, and the like are applied by irradiating irradiation light to the terminal portions 109 of the FPCs 101A, 101B. Observation is performed by the observation device 113 including the observation unit. For example, there is a type in which irradiation light in an infrared wavelength region is irradiated on the surfaces of the FPCs 101A and 101B from an oblique direction, and a wiring pattern of the FPC 101 is observed by reflected light upward from the FPCs 101A and 101B.

As shown in FIG. 5, when the terminal portions 109 of the two first and second FPCs 101 </ b> A and 101 </ b> B are overlapped, before the terminal portions 109 are overlapped, the FPC 101 observation method described above is used. Thus, the exposed surface of the conductive material 105 of the terminal portion 109 of each of the FPCs 101A and 101B is observed from the upper and lower directions by the CCD cameras 111A and 111B as the first and second observation portions 113, respectively. At this time, the position coordinates in the X-axis and Y-axis directions orthogonal to each other on the horizontal plane of each terminal unit 109 are measured. Based on the data of the position coordinates, for example, the first FPC 101A is fixed to the fixing base 115, and the first The second FPC 101B moves in the vertical Z-axis direction and the three axial directions of the X-axis and Y-axis directions so that the conductive material 105 of each terminal portion 109 of the first and second FPCs 101A and 101B is overlapped. The movement is aligned.
JP-A-8-222832

  By the way, in the conventional observation method of the FPCs 101A and 101B, the terminal portions 109 of the first and second FPCs 101A and 101B need to be observed by two separate CCD cameras 111A and 111B. There is a problem that the cost of equipment increases and a large space is required.

  Furthermore, for the reasons described above, a measuring device for measuring the position coordinates of each terminal portion 109 in the X-axis and Y-axis directions, and a drive shaft and an arithmetic device for adjusting the movement position based on the data of the position coordinates Therefore, there is a problem that the cost of equipment is increased.

  In addition, there is a problem that the tact time is increased because the first and second FPCs 101A and 101B are composed of two steps, that is, the first and second FPCs 101A and 101B are overlapped.

  Further, as shown in FIGS. 6 and 7, the portion where the first and second FPCs 101A and 101B overlap (VI portion in FIG. 6) is, for example, 1 to 2 mm. The image of the conductive material 105 of each terminal portion 109 of the first and second FPCs 101A and 101B is applied by the CCD camera 111 with light from the LED illumination 117 of the illumination device from one surface, for example, a visual field range of 3.2 × 2.4 mm. The conductive material 105 of the first FPC 101A becomes an image transmitted through the insulating film 103 that is the base material of the second FPC 101B, and the conductive material 105 of the second FPC 101B also transmits through the insulating film 103 on the back side. As a result, the difference in luminance between the conductive members 105 of the terminal portions 109 of the first and second FPCs 101A and 101B is not clear. C101A, those are difficult to read the luminance of the conductive material 105 of the terminal portions 109 of 101B. Therefore, the above overlapping portion cannot be observed with high accuracy in image processing.

  The present invention has been made to solve the above-described problems.

  The printed circuit board according to the present invention is a printed circuit board having a terminal part in which a wiring pattern of a conductive material is printed on a base material and the conductive material is exposed at an end, and the conductive material of the terminal part is connected And an alignment straight portion for alignment that extends from the connection portion.

In the printed circuit board alignment method according to the present invention, each of the first and second printed circuit boards having a terminal portion in which a wiring pattern of a conductive material is printed on a base and the conductive material is exposed at an end portion. When overlapping the terminal parts with each other,
In advance, a connection portion for connection and an alignment straight portion for alignment extending to the connection portion are provided on the conductive material of each terminal portion, and the connection portions overlap each other. An image processing means picks up images from one side of the terminal portions of the first and second printed circuit boards, and the connection of the terminal portions overlaps in the picked-up image depending on the position of the alignment straight portion. The position of the part is aligned.

In the printed circuit board alignment apparatus according to the present invention, each of the first and second printed circuit boards having a terminal portion in which a wiring pattern of a conductive material is printed on a base material and the conductive material is exposed at an end portion. In a printed circuit board alignment apparatus for aligning terminal portions to overlap each other,
In advance, each terminal portion of the first and second printed circuit boards is provided with a connection portion for connection and an alignment straight portion for alignment that extends to the connection portion. A drive unit that moves at least one printed circuit board of the first and second printed circuit boards in at least one direction on the plane to be superimposed;
An imaging unit for imaging from one side of the terminal part of the first and second printed circuit boards overlapping each other;
Image processing means for judging the position of the connecting portion of each terminal portion of the first and second printed circuit boards and the position of the alignment straight portion from the images picked up by the image pickup portion;
An arithmetic device for calculating a displacement amount of the connection portion by the alignment straight portion, and a position of the connection portion of each terminal portion of the first and second printed circuit boards based on the displacement amount calculated by the arithmetic device A control unit that provides a command to align the position to the drive unit, and
It is characterized by comprising.

  As can be understood from the means for solving the above problems, according to the printed circuit board of the present invention, the conductive material of each terminal portion of the first and second printed circuit boards is used for alignment with the connecting portion. Since the straight portion is provided, the alignment straight portion can be clearly identified in a state where the connection portions of the first and second printed circuit boards are overlapped, and the first and second positions are determined by the position of the alignment straight portion. Positioning of the connection part of the printed circuit board can be easily performed.

  According to the printed circuit board alignment method of the present invention, since the connecting portion and the alignment straight portion are provided in the conductive material of each terminal portion of the first and second printed circuit boards, the first and second The alignment straight portion can be clearly observed by the image processing means in a state where the printed circuit board connection portions are overlapped, and the first and second printed circuit board connection portions are aligned by the position of the alignment straight portion. Can be easily performed. Therefore, in the prior art, the two steps of observing the pair of first and second printed circuit boards and the step of superimposing can be performed simultaneously in one step in the present invention. Improvements can be made.

  For the above reason, the drive shafts for aligning the first and second printed circuit boards need only be in at least one axial direction, and almost no drive shaft movement correction is required. .

  In addition, since it is possible to observe with one field of view in a state where the first and second printed circuit boards are overlapped, only one imaging unit is required, and the cost is reduced.

  According to the printed circuit board alignment apparatus of the present invention, the first and second printed circuit boards are provided with connecting portions and alignment straight portions on the conductive material of the terminal portions of the first and second printed circuit boards. An image captured by the imaging unit with the circuit boards stacked can be clearly determined by the image processing means as to the alignment straight part, and the connection part of the first and second printed circuit boards is determined by the position of the alignment straight part. Can be easily aligned. Therefore, in the prior art, the two steps of observing the pair of first and second printed circuit boards and the step of superimposing can be performed simultaneously in one step in the present invention. Improvements can be made.

  For the above reason, the drive shafts for aligning the first and second printed circuit boards need only be in at least one axial direction, and almost no drive shaft movement correction is required. .

  In addition, since it is possible to observe with one field of view in a state where the first and second printed circuit boards are overlapped, only one imaging unit is required, and the cost is reduced.

  Embodiments of the present invention will be described below with reference to the drawings.

  Referring to FIGS. 1 to 3, the printed circuit boards according to this embodiment include flexible printed circuit boards 1A and 1B (hereinafter simply referred to as “FPC”). In FIG. 1, the first FPC 1A and FIG. 2 is a plan view when the terminal portions 3 of the second FPC 1B are overlapped. FIG. 2 shows an enlarged longitudinal sectional view along the longitudinal direction of the first and second FPCs 1A and 1B in FIG. FIG. 3 shows a state where an image is picked up by, for example, a CCD camera 5 as an image processing means from above the mating portion. FIG. 3 is an enlarged longitudinal sectional view taken along the width direction of the first and second FPCs 1A and 1B in FIG. Is shown.

  Since the first and second FPCs 1A and 1B have the same configuration, each component will be described with the same reference numeral. For example, a base made of a resin such as polyimide or polyethylene terephthalate (PET) is used. A wiring pattern is formed by printing a foil-like conductive material 9 made of copper, for example, on an insulating film 7 as a material, and an over resist 11 is laminated on the wiring pattern as a circuit protection member. is doing. Further, the overresist 11 is not formed on the terminal portion 3, and a plurality of conductive materials 9 are exposed.

  In this embodiment, the insulating film 7 is made of polyimide, has a thickness of about 0.03 to 0.1 mm, and the conductive material 9 of the terminal portion 3 is formed from the back surfaces of the first and second FPCs 1A and 1B. It is configured to be seen through. Each of the plurality of conductive materials 9 of the terminal portion 3 protrudes on the surface of the insulating film 7 and has a thickness of about 20 μm.

  In addition, the conductive material 9 of each of the terminal portions 3 of the first and second FPCs 1A and 1B is connected to the connection portion 13 for overlapping and connecting to each other, and the position extended to the connection portion 13 And an alignment straight portion 15 for alignment. In addition, said connection part 13 is 1.0-2.0 mm normally, On the other hand, it is desirable for said alignment straight part 15 to be at least 1.0 mm or more, and to be 2-3 mm at maximum. Is preferred.

  Note that the state in which the terminal portions 3 of the first and second FPCs 1A and 1B are overlapped is a cross-sectional form as shown in FIG. 2, and therefore the conductive material 9 is actually a dotted line in FIG. As shown, the overlapped state is shown by a solid line for easy understanding. Further, the alignment straight portion 15 of the first FPC 1A described above is a portion indicated by ◯ in the A portion of FIG. 1, and the alignment straight portion 15 of the second FPC 1B is the portion of the B portion of FIG. The part marked with ○.

  In this embodiment, since the first FPC 1A is on the lower side in the overlapping portion of the first and second FPCs 1A and 1B, the position of the connecting portion 13 is adjusted by the alignment straight portion 15 of the first FPC 1A. Can be clearly determined. On the other hand, since the second FPC 1B is positioned on the upper side and the conductive material 9 faces downward, the alignment straight portion 15 can be identified through the insulating film 7, and the alignment straight portion 15 can be identified. Thus, the connecting portion 13 of the second FPC 1B can be clearly determined. Therefore, the displacement amount of the connecting portion 13 can be calculated at the position of the alignment straight portion 15 of the first FPC 1A and the alignment straight portion 15 of the second FPC 1B.

  In order to accurately align and observe the state where the connecting portions 13 of the conductive material 9 exposed at the terminal portions 3 of the first and second FPCs 1A and 1B are overlapped as described above, the present invention The printed circuit board alignment apparatus 17 according to the embodiment is used.

  Referring to FIGS. 2 and 3, as the printed circuit board alignment device 17, for example, a fixing base 19 on which the first FPC 1A is placed is provided. Further, above the fixed base 19, the second FPC 1B is independently moved in the X-axis, Y-axis direction and the Z-axis direction perpendicular to the X-axis and Y-axis directions perpendicular to each other on the horizontal plane. An FPC moving device 21 configured by an X-axis, Y-axis, and Z-axis drive unit (not shown) for caulking is provided. The FPC moving device 21 is connected to a control device 23, which will be described in detail later, as shown in FIG.

  In this embodiment, the first FPC 1A is fixed to the fixed base 19. However, in the same manner as the second FPC 1B, the FPC moving device 21 uses the X-axis, Y-axis, and Z-axis directions. It is also possible to adopt a configuration in which each is independently moved.

  Further, above the fixed base 19, for example, a CCD camera 5 is provided as an imaging unit for observing and imaging the plurality of conductive materials 9 of the terminal portions 3 of the first and second FPCs 1A and 1B. The CCD camera 5 is connected to the control device 23 via, for example, an image processing device 25 as image processing means for processing a captured image. The CCD camera 5 has a built-in lens 27 for changing the magnification. Further, for example, a ring-shaped LED illumination 29 is provided as an illumination device for illuminating the imaging field of view of the CCD camera 5.

  In the image processing apparatus 25, the CCD camera 5 determines the position of the alignment straight portion 15 of each terminal portion 3 of the first and second FPCs 1A and 1B from the captured image. Depending on the position of the alignment straight portion 15, whether or not the connecting portion 13 of each terminal portion 3 of the first and second FPCs 1A and 1B is misaligned, and if there is a misalignment, the misalignment is in any direction. It is determined whether or not there is a deviation.

  The range of the imaging field of view of the CCD camera 5 is 3.2 × 2.4 mm as shown in FIG. 1, for example, when a double lens is used.

  The reason why the alignment straight portion 15 is at least 1.0 mm or more is that when the conductive materials 9 of the terminal portions 3 of the first and second FPCs 1A and 1B are overlapped with each other, the conductivity of the terminal portions 3 is superposed. This is because the positional deviation of the material 9 can be clearly read by the CCD camera 5. Moreover, if the alignment straight portion 15 is at least 1.0 mm or more, the longitudinal direction of each alignment straight portion 15 of the first and second FPCs 1A and 1B is inclined at an angle θ with respect to the X-axis direction. Therefore, the angle θ can be corrected to 0 ° (zero) so as to be in the same direction as the X-axis direction.

  Referring to FIG. 4, the control device 23 includes a CPU 31 as a central processing unit. The CPU 31 includes an input device 33 such as a keyboard and a touch panel for inputting various data and programs, a CRT, and the like. A display device 35 such as a liquid crystal and a memory 37 for storing a result of image processing performed by the image processing device 25 on a program input from the input device 33, image data captured by the CCD camera 5, and the like.

  Further, the CPU 31 is connected by the alignment straight portion 15 based on the images of the alignment straight portions 15 of the terminal portions 3 of the first and second FPCs 1A and 1B obtained by imaging. An arithmetic unit 39 that calculates the amount of deviation of the unit 13 and the position of the connecting part 13 of each terminal unit 3 of the first and second FPCs 1A and 1B are aligned based on the amount of deviation calculated by the arithmetic unit 39. A command unit 41 that gives a command to the FPC moving device 21 is connected.

  With the above configuration, a method of aligning by observing the overlapping portions of the conductive materials 9 of the terminal portions 3 of the first and second FPCs 1A and 1B using the printed circuit board alignment device 17 of this embodiment. explain.

  First, the first FPC 1 </ b> A is fixed to the fixing base 19 with the conductive material 9 exposed at the terminal portion 3 facing upward. Next, the second FPC 1B is moved by the FPC moving device 21 with the conductive material 9 exposed at the terminal portion 3 of the second FPC 1B facing downward, as shown in FIGS. The conductive material 9 of the terminal portion 3 of the second FPC 1B is connected to the conductive material 9 of the terminal portion 3 of the first FPC 1A through the gap G in the overlapping portion of the conductive material 9 of each terminal portion 3 of the second FPC 1A, 1B. Moved to overlap.

  In this embodiment, for example, a stopper (not shown) is provided, and the outer portions of the first and second FPCs 1A and 1B are abutted against the stopper to be positioned.

  Thereafter, the terminal portions 3 of the first and second FPCs 1A and 1B that are overlapped with each other as described above are brought into an imaging visual field range 3.2 × 2 by the CCD camera 5 from one side as shown in FIG. The image is taken at 4 mm. This captured image is sent to the image processing device 25 for image processing.

  In the above image, the alignment straight portion 15 where the terminal portions 3 of the first and second FPCs 1A and 1B do not overlap, in this embodiment, in particular, the first FPC 1A in the portion A of FIG. By observing the positions of the upper end portion of the alignment straight portion 15 and the upper end portion of the straight portion 15 of the second FPC 1B in the portion B of FIG. 1, the terminal portions 3 of the first and second FPCs 1A and 1B are observed. The image processing device 25 determines whether or not the conductive material 9 is misaligned, and if there is a misalignment, in which direction the misalignment is shifted. Based on the determination of the image processing device 25, the amount of deviation is calculated by the arithmetic device 39.

  In addition, since the alignment straight part 15 of the first FPC 1A can clearly read the difference in luminance from the insulating film 7 as the base material, the above-described deviation amount becomes clear and can be easily calculated.

  If the amount of deviation is almost 0 (zero), there is no need to correct the alignment, which is ideal, but if there is the amount of deviation, a command is issued from the command unit 41 to the FPC moving device 21. Given, moved in that direction and aligned.

  In this embodiment, as shown in FIG. 1, there is no deviation in the X-axis direction, and a slight deviation occurs in the Y-axis direction. Therefore, the amount of deviation in the X-axis direction is calculated, and the second FPC 1B is moved downward in FIG. 1 by the amount of deviation by the FPC moving device 21, thereby being aligned at an accurate position. Become.

  In addition, since it is a precondition that the plurality of conductive materials 9 of the terminal portions 3 of the first and second FPCs 1A and 1B are wired at the same pitch, determining the deviation as described above is as follows. In FIG. 1, at least one of the plurality of alignment straight portions 15 of the first FPC 1A, for example, the alignment straight portion 15 on the upper end side in FIG. 1 and the alignment straight portion 15 on the upper end side are arranged. It is only necessary to observe the position with the alignment straight portion 15 on the upper end side of the second FPC 1B to be overlaid. Alternatively, in FIG. 1, the alignment straight portion 15 on the lower end side of the first FPC 1A and the alignment straight portion 15 on the lower end side of the second FPC 1B may be observed. Alternatively, the alignment straight portion 15 of the first FPC 1A on the upper end side and the lower end side and the alignment straight portion 15 of the second FPC 1B are observed at the same time. The movement may be corrected by equally distributing.

  As described above, after the conductive materials 9 of the terminal portions 3 of the first and second FPCs 1A and 1B are accurately aligned, the second FPC 1B is lowered in the Z-axis direction by the gap G. The connecting portions 13 of the terminal portions 3 of the first and second FPCs 1A and 1B come into contact with each other and are overlapped. Next, the connection portions 13 of the terminal portions 3 of the first and second FPCs 1A and 1B are soldered and connected.

  As described above, conventionally, before the first and second FPCs 1A and 1B are overlapped, the positions of the terminal portions 3 of the first and second FPCs 1A and 1B have to be confirmed by separate observation devices. However, in this embodiment, since the connecting portion 13 and the alignment straight portion 15 are provided on the conductive material 9 of each terminal portion 3 of the first and second FPCs 1A and 1B, the first and second FPCs 1A and 1B are provided. Observation with the CCD camera 5 in a state where the FPCs 1A and 1B are overlapped with each other has the following effects.

  (1) Conventionally, the two steps of observing a pair of first and second FPCs 1A and 1B and the step of superimposing can be performed simultaneously in the present embodiment in one step. The tact time can be improved.

  (2) Ideally, the drive shaft for aligning the first and second FPCs 1A and 1B is not required at all, but actually, only one axial direction is required, and almost two or more axes are required. No movement correction (movement in the Z-axis direction or X-axis direction) is required.

  (3) Conventionally, when the terminal portions 3 of the first and second FPCs 1A and 1B are observed from the surface side, naturally two CCD cameras 5 are necessary. In this embodiment, however, observation is performed with one field of view. Therefore, only one CCD camera 5 is required, and the cost is reduced.

  (4) In the embodiment described above, 3.2 × 2.4 mm of the imaging field of the CCD camera 5 is the field when the 2 × lens 27 is used. Since the field of view is 4.8 × 6.4 mm, it is possible to observe more non-overlapping straight portions, so that the observation accuracy can be increased.

It is a top view when aligning the 1st, 2nd printed circuit board of embodiment of this invention. It is sectional drawing of the arrow II-II line | wire of FIG. It is sectional drawing of the arrow III-III line | wire of FIG. It is a block block diagram of a control apparatus. It is a schematic front view when aligning the conventional 1st and 2nd printed circuit board. It is a top view when aligning the conventional 1st and 2nd printed circuit board. It is sectional drawing of the arrow VII-VII line of FIG.

Explanation of symbols

1A First FPC (Printed Circuit Board)
1B Second FPC (Printed Circuit Board)
3 Terminal section 5 CCD camera (imaging section)
7 Insulation film (base material)
DESCRIPTION OF SYMBOLS 9 Conductive material 11 Over resist 13 Connection part 15 Positioning straight part 17 Printed circuit board positioning apparatus 19 Fixing base 21 FPC moving apparatus (drive part)
23 control device 25 image processing device (image processing means)
37 Memory 39 Computing device 41 Command section

Claims (3)

  A printed circuit board having a terminal portion with a conductive material wiring pattern printed on a substrate and an exposed end portion of the conductive material, wherein the conductive material of the terminal portion includes a connecting portion for connection and the connecting portion. A printed circuit board comprising: an alignment straight portion extending for alignment. When the wiring patterns of the conductive material are printed on the base material and the terminal portions of the first and second printed circuit boards having the terminal portions with the conductive material exposed at the end portions are overlapped with each other,
In advance, a connection portion for connection and an alignment straight portion for alignment extending to the connection portion are provided on the conductive material of each terminal portion, and the connection portions overlap each other. An image processing means picks up images from one side of the terminal portions of the first and second printed circuit boards, and the connection of the terminal portions overlaps in the picked-up image depending on the position of the alignment straight portion. A printed circuit board alignment method comprising aligning positions of parts. A printed circuit in which a wiring pattern of a conductive material is printed on a base material and the terminal portions of the first and second printed circuit boards having terminal portions with the conductive material exposed at the end portions are aligned to overlap each other. In the substrate alignment device,
In advance, each terminal portion of the first and second printed circuit boards is provided with a connection portion for connection and an alignment straight portion for alignment that extends to the connection portion. A drive unit that moves at least one printed circuit board of the first and second printed circuit boards in at least one direction on the plane to be superimposed;
An imaging unit for imaging from one side of the terminal part of the first and second printed circuit boards overlapping each other;
Image processing means for judging the position of the connecting portion of each terminal portion of the first and second printed circuit boards and the position of the alignment straight portion from the images picked up by the image pickup portion;
An arithmetic device for calculating a displacement amount of the connection portion by the alignment straight portion, and a position of the connection portion of each terminal portion of the first and second printed circuit boards based on the displacement amount calculated by the arithmetic device A control unit that provides a command to align the position to the drive unit, and
An apparatus for aligning a printed circuit board, comprising:

Images