JP2001244694A - Component connecting equipment of high-density board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide component connecting equipment of a high-density board wherein an installation member is connected at high precision for stable production. SOLUTION: There are provided a high-density board 3 which comprises first position mark pairs 23a and 23b related to first conductive terminals 21, an installation member 4 which comprises second position mark pairs 25a and 25b corresponding to second conductive terminals 24, a calculating unit which calculates first and second theoretical reference points corresponding to the coordinate position of each position mark pair based on the image signal of first and second position mark pairs, two axles positioning apparatuses 9 and 11 where the first and second theoretical reference points are agreed with each other for polymerizing-driving, and a heating/melting means wherein, with the first and second theoretical reference points agreed with each other, a solder material applied to at least either of the first and second conductive terminals is heated and melted for bonding.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a component connecting device for a high-density substrate, that is, an improvement in a soldering device. Considers that the reference position fluctuates due to thermal deformation, etc., and realizes connection independent of reference hole and contour dimensional accuracy, etc. is there.

[0002]

2. Description of the Related Art In general, when generating circuit terminals or mounting components on a printed circuit board, one of the mounting reference holes of the printed circuit board is used as a coordinate origin, and design data of the printed circuit board is used as input information to a predetermined position. And the insertion and placement of parts are performed automatically.

On the other hand, in a high-density substrate having no space for providing a reference hole, that is, a ceramic substrate, a circuit terminal is generated and components are placed using a contour corner of the substrate as a coordinate origin instead of the reference hole. .

In the case of a ceramic substrate, distortion of the substrate material occurs at the stage of firing the substrate. Therefore, the original dimensions are designed in such a manner that the distortion is predicted. Care has been taken to avoid any inaccuracies.

However, in the above-described conventional high-density board component connection apparatus, there is a limit in improving the accuracy of the coordinate origin, and when the high-density board is a mass-produced product, there is a variation between individual board materials. Also, there are problems with the accuracy of the mounting jig.

Therefore, in a general manufacturing facility,
It was necessary to prepare for an error of several tens μm or more. This is a major obstacle from the viewpoint of the board design in stably performing higher-density mounting.

Therefore, in order to partially cope with the above-mentioned obstacles, various component connection devices utilizing an image recognition technique using a CCD camera have been conventionally proposed. For example, in a substrate bonding apparatus described in JP-A-3-287321, a CCD is used for each pair of position marks.
A camera is installed.

In the electronic component positioning apparatus described in Japanese Patent Application Laid-Open No. 63-312695, there is shown an example of utilizing a CCD camera in which all the related conductive patterns or position marks are placed in the same field of view.

However, according to the prior art described in the above publication, when the substrate material is a high-density substrate, for example, a ceramic substrate, the material is distorted at the stage of firing the substrate. Even if a simple reference position is directly detected, a position shift in each connection portion still remains.

[0010] Therefore, there is a limit in the connection of the high-density conductive terminals, so that it is not possible to achieve sufficient component connection accuracy.

[0011]

As described above, in the conventional component connection apparatus for high-density substrates, even if the reference position is directly detected by image recognition, the positional deviation due to the material distortion generated in the substrate firing stage remains. Therefore, there is a problem that sufficient component connection accuracy cannot be achieved.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and calculates a reference point at which a high-density substrate and an installation member are to be superimposed on a coordinate point taken from an image, and calculates a reference point for a dense part. It is an object of the present invention to obtain a high-density substrate component connection device capable of stably producing a high-density substrate to which an installation member is connected by intensively improving positioning accuracy.

[0013]

According to a first aspect of the present invention, there is provided a component connecting apparatus for a high-density substrate, comprising: a high-density substrate having a first conductive terminal group formed closely; A first pair of position marks provided on the high-density substrate at the same time as the generation of the first conductive terminal group so as to be a reference point associated with the conductive terminal group, and each conductive mark of the first conductive terminal group. And an installation member having a second conductive terminal group electrically connected to the terminal, and a second position arranged on the installation member so as to be located at a position corresponding to the first position mark pair. A mark pair, an image detection device installed to collectively capture the first and second position mark pairs in the field of view, and respective coordinate positions of the first and second position mark pairs detected by the image detection device First and second theoretical groups corresponding to In a state in which the arithmetic device for calculating the points, the two-axis positioning device for matching the first and second theoretical reference points to drive the two together, and the first and second theoretical reference points are matched, And a heating and melting means for heating and melting the solder material applied to at least one of the first and second conductive terminal groups for bonding.

According to a second aspect of the present invention, there is provided a component connecting apparatus for a high-density substrate, wherein the arithmetic unit comprises:
First axis calculating means for calculating a first axis connecting the center points of the respective position marks of the first position mark pair;
Second axis calculating means for calculating a second axis connecting the center points of the respective position marks of the second position mark pair,
And a parallelism calculating means for calculating the parallelism between the first and second axes.

According to a third aspect of the present invention, there is provided a component connecting apparatus for a high-density substrate, wherein
Calculating the midpoint of the first axis as a first theoretical reference point;
The midpoint of the second axis is calculated as a second theoretical reference point.

According to a fourth aspect of the present invention, in the second or third aspect, when the degree of parallelism exceeds a predetermined value, the bonding operation by the heating and melting means is performed. It is provided with alarm means for generating an alarm output for stopping.

According to a fifth aspect of the present invention, there is provided a component connecting apparatus for a high-density substrate, wherein the parallelism is within a predetermined value when the parallelism exceeds a predetermined value. And a rotary positioning control device for controlling the two-axis positioning device.

According to a sixth aspect of the present invention, there is provided a component connecting apparatus for a high-density substrate, wherein the first and second pairs of position marks are the first and second position mark pairs, respectively. And on both sides of the second conductive terminal group.

According to a seventh aspect of the present invention, in the component connection device for a high-density substrate according to any one of the first to fifth aspects, the first and second pairs of position marks are respectively formed by the first and second position mark pairs. And a portion of any of the conductive terminals of the second conductive terminal group, and the arithmetic unit is configured such that when the shared portion of the conductive terminal has a unique shape different from the other conductive terminals, The first and second theoretical reference points are calculated based on the substitute position mark coordinates detected by the singular shape, and when the shared portion of the conductive terminal has the same shape as the other conductive terminals, the shared portion of the shared terminal is calculated. The first and second theoretical reference points are calculated based on alternative position mark coordinates detected by a combination of the approximate coordinate position information and the shape information.

According to an eighth aspect of the present invention, there is provided an apparatus for connecting components of a high-density substrate according to any one of the first to seventh aspects, wherein the high-density substrate is formed of a ceramic substrate.

According to a ninth aspect of the present invention, in the component connection device for a high-density substrate, the installation member is formed of a transparent or translucent member. The second pair of position marks is to be image-detected by light transmitted through the installation member.

According to a tenth aspect of the present invention, there is provided an apparatus for connecting components of a high-density substrate, wherein the installation member is formed of a flexible substrate such as a polyester film in any one of the first to ninth aspects. It is.

[0023] According to an eleventh aspect of the present invention, in the component connection device for a high-density substrate, the image detecting device according to any one of the first to tenth aspects includes a CCD camera.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a side view schematically showing an overall mechanism of Embodiment 1 of the present invention.
FIG. 2 is an enlarged plan view showing part A in FIG. 1 in detail.

FIG. 3 is a functional block diagram showing a peripheral configuration of the control device according to the first embodiment of the present invention, and FIG. 4 is a flowchart showing a control operation according to the first embodiment of the present invention.

In FIG. 1, reference numerals 1a, 1b, and 1c denote bases divided into three parts, which are fixedly installed on a common base and are related to each other. 2a and 2b are a pair of mounting jigs individually installed on the upper surfaces of the pedestals 1a and 1b.

Reference numeral 3 denotes a high-density substrate made of a ceramic substrate or the like, which is mounted on a mounting jig 2a on the pedestal 1a side by a loader mechanism (not shown). 4 is a high density substrate 3
This is an installation member which is a connection component of the above, is made of a flexible substrate such as a polyester film, and is installed on the mounting jig 2b on the pedestal 1b side.

The details of the high-density substrate 3 and the mounting member 4 will be described later with reference to an enlarged plan view of a portion A in FIG. 1 (FIG. 2).

Numeral 5 denotes a plurality of suction cups arranged opposite to the upper surface of the installation member 4, which are driven up and down by an air cylinder 6 and to which a negative pressure is applied by a vacuum pump (not shown). .

Reference numeral 7 denotes a Y-axis table, which is slidably mounted on a table 8 fixed to the base 1c.
The slide motion in the Y-axis direction (the thickness direction in FIG. 1) is performed by the servo motor 9.

Reference numeral 10 denotes an X-axis table, which is slidably mounted on the Y-axis table 7, and
1 performs a sliding motion in the X-axis direction (the left-right direction in FIG. 1). The suction cup 5 is fixed to the right end of the X-axis table 10 via an air cylinder 6.

The positioning member 4 is held by the suction cup 5 at the time of positioning, and is controlled by the servomotors 9 and 11.
They are driven in the Y-axis direction and the X-axis direction, respectively.

A stand 12 slides on the pedestal 1a, and is driven forward and backward in the direction of arrow 14 by an air cylinder 13 fixed on the pedestal 1a. Reference numeral 15 denotes a flat soldering iron provided at one end of the stand 12 so as to be able to move up and down, and is driven to move up and down in the direction of an arrow 17 via an air cylinder 16 fixed to the stand 12.

The flat soldering iron 15 is previously heated to a predetermined temperature by a power source (not shown).

Numeral 18 denotes a CCD camera (hereinafter simply referred to as "camera") arranged on the upper portions of the pedestals 1a to 1c.
It constitutes a part of the image detection device. The camera 18 is fixedly installed so that a part or the whole of the high-density substrate 3 and a part or the whole of the installation member 4 are regarded as one field of view.

An illumination device 19 illuminates the photographing surface of the camera 18 and is provided on the stand 12 by a mechanism (not shown). Reference numeral 20 denotes a transmissive illumination device provided on the pedestal 1a, which is positioned in a concave portion of the pedestal 1a so as to face the lower surface of the installation member 4. The transmitted illumination device 20 is effective when the installation member 4 is made of a translucent material such as a polyester film.

In the configuration shown in FIG. 1, the camera 18, the illumination device 19, and the transmission illumination device 20 are all fixed to the pedestal 1a.

Next, the portion A in FIG. 1 will be described in detail with reference to FIG. In FIG. 2, reference numeral 21 denotes a first conductive terminal group formed in advance at the tip of the high-density substrate 3, which is constituted by a large number of conductive terminals closely arranged with each other. Is wire-bonded to the electronic component 22 installed in the electronic device.

Reference numerals 23a and 23b denote a first pair of position marks provided at a reference point associated with the first conductive terminal 21. In this case, the first conductive mark 21 is generated at the same time as the first conductive terminal 21 is generated. Print-generated on both sides of the terminal 21.

Here, the first position mark pair 23
a and 23b are different from the planar shape of the first conductive terminal 21 and are treated as unique symbols having no other similar shape.

On the other hand, the installation member 4 is driven in the directions of arrows Y and X in FIG. 2 by the servo motors 9 and 11 described above (see FIG. 1). In addition,
Although not shown here, for example, a connector for connecting an external device is attached to the installation member 4 on the left side of FIG.

Reference numeral 24 denotes a second group of conductive terminals provided at the tip of the installation member 4, which is connected to a connector (not shown) provided at the other end of the installation member 4. It is composed of a number of conductive terminals connected via a circuit pattern.

Each conductive terminal of the second conductive terminal group 24 is previously plated with solder so as to be connected to each conductive terminal of the first conductive terminal group 21. However, in the second conductive terminal group 24, the circuit pattern portion excluding the solder plating portion is coated with a transparent or translucent film material.

25a and 25b are the second conductive terminal groups 24
A second pair of position marks generated on both sides of
It is provided corresponding to the first pair of position marks 23a and 23b.

In this case, the second position mark pair 25
a, 25b are first position mark pairs 23a, 23
Like b, it is treated as a unique symbol with no other similar shape.

As described above, the high-density substrate 3 includes the first conductive terminal group 21 formed in close contact with the first position mark pair 23 located on both sides of the first conductive terminal group 21.
a, 23b, the installation member 4 includes a second conductive terminal group 24 electrically connected to the first conductive terminal group 21,
The second pair corresponding to the first pair of position marks 23a and 23b
And position mark pairs 25a and 25b.

Further, the camera 18 constituting the image detecting device
(See FIG. 1) is installed so that the first and second position mark pairs 23a, 23b, 25a, 25b can be collectively captured in the field of view.

Further, the installation member 4 is made of a transparent or translucent member, and the second pair of position marks 25 a and 25 b is a component of the transmitted light passing through the installation member 4 by the illumination from the transmission illumination device 20. It is assumed that the image is detected.

Next, a control mechanism according to the first embodiment of the present invention will be described with reference to FIG. The control mechanism in FIG. 3 includes a microcomputer and functions in relation to the camera 18 in FIG.

In FIG. 3, reference numeral 26 denotes an image detection device for processing an output signal of the camera 18, and an image signal from the camera 18, that is, the NTSC standard (National Teal).
revision System Committe
The image signal according to e) is received, and chromaticity information and coordinate information corresponding to each pixel are digitized and supplied to a personal computer 27 (hereinafter abbreviated as “PC”).

The personal computer 27 calculates predetermined control information based on coordinate information and the like from the image detection device 26, and for example, first and second position mark pairs 23a and 23
Movement distance information and the like for positioning in the X and Y axis directions such that b, 25a, and 25b match are generated.

Reference numeral 28 denotes a positioning control device connected to the personal computer 27, which functions in connection with a two-axis positioning device including the servomotors 9 and 11 (see FIG. 1). The positioning control device 28 receives predetermined moving distance information from the personal computer 27 and supplies a pulse train of an amount proportional to the target moving amount to the two servo amplifiers 29 and 30.

The two servo amplifiers 29 and 30 rotationally drive the servomotors 9 and 11 in accordance with the respective target movement amounts, and measure the rotation amounts of the servomotors 9 and 11 using an encoder (not shown). Then, the moving operation corresponding to the instructed pulse amount is performed.

Reference numeral 31 denotes a sequence controller connected to the personal computer 27 and various actuators.
Along with exchanging the F signal, an electromagnetic valve for controlling the air pressure to the suction cup 5 and the air cylinders 6, 13, 16 is ON / OFF controlled. Here, the solenoid valves for controlling the suction cup 5 and the air cylinders 6, 13, 16 are shown by blocks.

The flat soldering iron 15 and the air cylinder 16 in FIG. 1 constitute a heating and melting means associated with the personal computer 27 and the sequence controller 31.
The heating and melting of the solder material by the flat soldering iron 15 is performed after overlapping the theoretical reference points because the position mark pairs do not always match due to thermal deformation.

The personal computer 27 constitutes an arithmetic unit in association with the positioning control device 28 and the sequence controller 31, and the first and second position mark pairs 23 detected by the camera 18 and the image detecting device 26.
First and second theoretical reference points corresponding to the respective coordinate positions of a, 23b, 25a, and 25b (see FIG. 2) are calculated.

Also, a personal computer 27 constituting an arithmetic unit
Calculates a first axis connecting the center points of the respective position marks of the first pair of position marks 23a and 23b.
Axis calculating means, and a second pair of position marks 25a,
25b includes a second axis calculating means for calculating a second axis connecting the center points of the respective position marks, and a parallelism calculating means for calculating the parallelism between the first and second axes.

Thus, the personal computer 27 calculates the midpoint of the first axis as the first theoretical reference point, and calculates the midpoint of the second axis as the second theoretical reference point. .

Positioning control device 28, servo amplifier 2
The servomotors 9 and 30 and the servomotors 9 and 11 constitute a two-axis positioning device for matching the first and second theoretical reference points calculated by the personal computer 27 and driving them together.

When the positioning control device 28 constitutes a three-axis control device, the parallelism calculated by the personal computer 27 (the first position mark pair 23a, 23a) is used.
b and the degree of parallelism between the second position mark pair 25a and 25b) exceed a predetermined value (in a mismatch state).
At this time, a third servomotor (both not shown) is driven via a third servo amplifier to rotate the air cylinder 6 so that the degree of parallelism is within a predetermined value.

Flat soldering iron 15 constituting heating and melting means
Heats and fuses the solder material in a state where the first and second theoretical reference points coincide with each other.

Although not shown here, alarm means (buzzer, lamp, etc.) is provided to the sequence controller 31.
Is connected, and when the calculated degree of parallelism exceeds a predetermined value, an alarm output for stopping the bonding operation by the heating and melting means is generated.

Next, a specific operation of the first embodiment of the present invention will be described with reference to the flowchart of FIG. In FIG. 4, first, the operation starts (step 10).
0), the high-density substrate 3 and the installation member 4 are installed on the mounting jigs 2a and 2b, respectively (step 10).
1).

Following the completion of the installation step 101, the illumination device 19 and the transmission illumination device 20 are turned on, and an object is photographed by the camera 18 (step 102).
Subsequently, in order to detect the coordinates of the symbol mark from the photographed image, a center point of a figure portion having the same shape as the shape of each symbol mark pair stored in advance is determined (step 103).

The coordinate detecting step 103 can be executed by a known technique generally called a pattern matching method, and is processed in the personal computer 27 via the image detecting device 26.

Next, a first axis connecting the center points of the first position mark pairs 23a and 23b on the high-density substrate 3 side and a second position mark pair 25 on the installation member 4 side.
The degree of parallelism (degree of coincidence of each axis) with the second axis connecting the center points of the marks a and 25b is calculated (step 10).
4).

Subsequently, the calculation result of the parallelism is compared with a predetermined value (predetermined allowable error) (step 105). If it is determined that the parallelism error is large (the parallelism exceeds the predetermined value), An alarm output is generated to prompt the user to cancel the abnormality (step 106), and the process returns to step 101.

If it is determined in step 105 that the parallelism error is small (not more than a predetermined value), the air cylinder 6 is lowered, the suction cup 5 is set to a negative pressure, and the air cylinder 6 is raised and installed again. The member 4 is lifted (Step 107).

If it is determined in step 105 that the parallelism error is equal to or less than the predetermined value, the first intermediate point between the marks of the first pair of position marks 23a, 23b and the second pair of position marks 25a, 25a, The second intermediate point between the marks 25b is calculated as the coordinates of the first and second theoretical reference points (step 108).

Subsequently, the distance between the first and second theoretical reference points is calculated, and the necessary movement distance information on the X axis and the Y axis is output to the positioning control device 28 (step 109).

The parallelism calculation step 104, the error determination calculation step 105, the reference point coordinate calculation step 1
08 and the distance information calculation output step 109 are executed by the calculation device in the personal computer 27.

Next, the positioning controller 28 determines the X-axis and Y-axis based on the moving distance information output from the personal computer 27.
A pulse train proportional to the required moving distance of the axis is generated, and an input pulse train corresponding to the moving distance information is output (step 11).
0).

Further, in order to determine whether or not the above pulse train is sufficient, the residual (pool pulse) between the pulse train generated in step 110 and the feedback pulse train generated from the encoder in step 113 (described later) is determined. A comparison is made to determine whether the difference is equal to or smaller than a predetermined value (allowable residual) (step 111).

If it is determined that the number of accumulated pulses is large (exceeds a predetermined value), the servo motors 9 and 11 are driven (step 112), and a feedback pulse corresponding to the number of rotations of the servo motors 9 and 11 is generated. Is generated from the encoder (step 113).

The step 111 for judging the presence / absence and magnitude of the droop pulse and the control output step 112 for the servomotors 9 and 11 are executed by the servo amplifiers 29 and 30.

On the other hand, if it is determined in step 111 that the number of accumulated pulses has become small (below a predetermined value), the air cylinder 6 is lowered and the installation member 4 is lowered while holding the suction member (step 114). .

Subsequently, when the installation member 4 is lowered together with the air cylinder 6, the air cylinders 13 and 16 are driven to move the flat soldering iron 15 forward and downwardly press the end surface of the installation member 4 (step 115). ).

Thus, the first and second conductive terminal groups 2
1, 24 are melt-bonded. Next, the air cylinder 13,
Then, the flat soldering iron 15 is driven to move upward and is made to wait for retreat (step 116), the negative pressure of the suction cup 5 is released, and the air cylinder 6 is driven to move upward (step 11).
7).

Finally, the servo motors 9 and 11 are driven to return the X-axis table 10 and the Y-axis table 7 to the origin positions, and the high-density substrate 3 and the installation member 4 are taken out by an unloader mechanism (not shown). , Return to the origin of the XY table and take out the product (step 118).

When the series of operation steps 101 to 118 is completed, the process returns to step 101, and the next operation is restarted.

As described above, the first and second position mark pairs 2 in the final actual product (the high-density substrate 3 after the firing step)
Grasp the actual position of 3a, 23b, 25a, 25b,
By estimating the center position of the high-density substrate 3 or the installation member 4 based on these coordinates, both can be superposed with high accuracy.

Therefore, as compared with the conventional method based on the reference hole and the contour, a higher precision is obtained without being affected by the mounting accuracy to the mounting jigs 2a and 2b and the thermal deformation of the substrate and the members. Joining becomes possible.

Further, it is possible to correct the center position reflecting the result of the test hitting, and the first and second conductive terminals 21 and The twenty-four conductive terminals can be joined with high accuracy.

Each position mark pair 23a, 23
Since b, 25a, and 25b are arranged on both sides of each of the electrical terminal groups 21 and 24, a reference point for positioning each of the electrical terminal groups 21 and 24 can be easily recognized.

Since the installation member 4 is made of a transparent or translucent member and is illuminated from the lower surface of the installation member 4, the second conductive terminal group 24 and the position mark pair The imaging of 25a and 25b becomes easy, and their coordinate positions can be easily recognized.

Further, when it is determined that there is a large error in the degree of parallelism between the electric terminal groups 21 and 24, an erroneous connection can be prevented by generating an alarm output.

Embodiment 2 In the first embodiment, the reference points for overlapping the conductive terminals 21 and 24 (position mark pairs 23a, 23b, 25a, and 2a).
5b) is equally arranged on both sides of each of the conductive terminal groups 21 and 24, but may be arranged at an arbitrary position with respect to each of the conductive terminal groups 21 and 24.

Normally, it is difficult to print a pair of position marks on both sides of each of the conductive terminal groups 21 and 24 depending on the component arrangement of the high-density substrate 3 and the installation member 4 and the design specifications of the circuit pattern. In some cases, it is desired to generate a position mark pair (reference point) at an arbitrary position.

In such a case, on the design drawing, the amount of positional deviation from both sides of each of the conductive terminal groups 21 and 24 to the position mark pair is bias-corrected and treated as the coordinates of the virtual position mark. Can be.

Therefore, even if various restrictions are imposed on the board design, high-precision component connection can be performed.

Embodiment 3 In the first embodiment,
In FIG. 2, a position mark pair different from the conductive terminal groups 21 and 24 was used as a reference point for overlapping the conductive terminal groups 21 and 24.
May be used also as each position mark pair.

In this case, each position mark pair is also used by a part of one of the conductive terminals of each of the conductive terminal groups 21 and 24. It can be generated not only on both sides of 21 and 24 but also at an arbitrary position.

Further, even in the high-density substrate 3 (or the installation member 4) where there is no place to print the position mark and the position mark cannot be printed, for example, the first
Out of the conductive terminal groups 21 (see FIG. 2), the first position mark pair 23
a and 23b can be used as an alternative.

[0094] In addition, the arithmetic unit, based on at least one of the approximate coordinate position information and the shape information of the conductive terminal also serving as each position mark pair, performs the first
And a second theoretical reference point can be calculated.

Specifically, when the shared portion of the conductive terminal has a unique shape different from other conductive terminals, the arithmetic unit determines the first and the second position mark coordinates based on the alternative position mark coordinates detected by the unique shape. A second theoretical reference point is calculated.

Further, when the common part of the conductive terminal has the same shape as the other conductive terminals, the arithmetic unit determines that the substitute position mark coordinate detected by the combination of the approximate coordinate position information and the shape information of the common part. Based on the first
And a second theoretical reference point is calculated.

That is, when the conductive terminal is also used as a position mark, there are a large number of position marks of the same shape. By inputting the shape information into the personal computer 27 in advance, the shared terminal (reference point information) can be recognized.

For example, by searching for a conductive terminal located at a coordinate position corresponding to the predetermined approximate coordinate position information and having the same shape as the predetermined shape, the position of the shared terminal (alternate position mark) can be known. .

On the other hand, if the predetermined shape of the dual-purpose terminal is extremely peculiar, the coordinate position information is not used.
A shared terminal (alternate position mark) can be specified based only on the shape information.

Embodiment 4 The first embodiment
In Nos. 1 to 3, the intermediate point between the marks of each position mark pair is used as a theoretical reference point for superimposing the high-density substrate 3 and the installation member 4, but another point may be used.

For example, as a result of the trial hitting operation, if it is found that a higher accuracy can be achieved by using a position different from the intermediate point between the marks as the theoretical reference point, calculation of the reference point coordinates in FIG. In step 108, a bias value may be added to the correction value from the intermediate point.

As a result, it is possible to operate according to the actual situation, and to realize more accurate component connection.

Embodiment 5 FIG. Further, in the first embodiment, when the parallelism error between the high-density substrate 3 and the installation member 4 is large, an abnormality alarm is issued in step 106, but a special problem arises due to the parallelism error. If it is understood that there is no alarm means, the alarm means may be omitted.

Although the installation of the rotary positioning control device was not considered, the provision of the rotary positioning control device and the servomotor for the third axis (rotary axis) makes it possible to reduce By driving the rotation servomotor, the installation member 4 can be angularly moved to automatically correct the parallelism, and the positioning can be controlled so as to correct the poor parallelism.

Embodiment 6 FIG. In the first embodiment, the case where the high-density substrate 3 is formed of a general ceramic substrate has been described. However, the present invention can be applied to other high-density substrates, and has the same operation and effect.

Further, in order to facilitate recognition of the second conductive terminal group 24 and the pair of position marks 25a and 25b, the case where the installation member 4 is transparent or translucent has been described. Obviously, if the second position marks 25a and 25b are provided on the surface (the surface photographed by the camera) opposite to the non-conductive terminal 24 (the solder connection surface), the same operation and effect can be obtained even with an opaque material.

Although the installation member 4 is formed of a flexible substrate such as a general polyester film, any other substrate member may be used. Further, in order to take an image of the board connection portion, a CCD
Although the camera 18 is used, another imaging device may be used.

[0108]

As described above, according to the first aspect of the present invention, a high-density substrate having a closely formed first conductive terminal group and a reference related to the first conductive terminal group are provided. As a point, the first pair of position marks provided on the high-density substrate at the same time as the generation of the first conductive terminal group and the respective conductive terminals of the first conductive terminal group are electrically connected. An installation member having a second conductive terminal group connected to the first position mark pair, a second position mark pair disposed on the installation member to be at a position corresponding to the first position mark pair, An image detection device installed to collectively capture the second position mark pair in the field of view, and first and second positions corresponding to respective coordinate positions of the first and second position mark pairs detected by the image detection device. An arithmetic unit for calculating the theoretical reference point of (2), A two-axis positioning device for causing the first and second theoretical reference points to coincide with each other and driving them together, and a first and second conductive terminal with the first and second theoretical reference points coincident with each other Heat-fusing means for heating and melting and bonding the solder material applied to at least one of the groups, and
Since the reference point at which the high-density substrate and the installation member are to be superimposed is calculated from the captured coordinate points, the positioning accuracy can be intensively improved with respect to the dense part,
There is an effect that a component connection device for a high-density substrate that can stably produce a high-density substrate to which the installation member is connected is obtained.

According to a second aspect of the present invention, in the first aspect, the arithmetic unit calculates a first axis connecting the center points of the respective position marks of the first position mark pair. Calculating means, second axis calculating means for calculating a second axis connecting the center points of the respective position marks of the second position mark pair, and parallelism calculating for calculating the parallelism between the first and second axes. Therefore, a high-density board component connection device capable of stably producing a high-density board to which an installation member is connected can be obtained. Has the effect.

According to a third aspect of the present invention, in the second aspect, the arithmetic unit sets the midpoint of the first axis to the first axis.
Is calculated as the theoretical reference point of the second axis, and the midpoint of the second axis is
High-density substrate, which can improve the positioning accuracy intensively for dense parts and can stably produce a high-density substrate to which the installation members are connected. This has the effect of obtaining the component connection device of FIG.

According to a fourth aspect of the present invention, in the second or third aspect, when the parallelism exceeds a predetermined value, an alarm output for stopping the bonding operation by the heating and melting means is issued. The provision of the alarm means for generating an effect provides an effect of obtaining a component connection device for a high-density substrate in which erroneous connection is prevented.

According to a fifth aspect of the present invention, in the second or third aspect, when the parallelism exceeds a predetermined value, the two-axis positioning device is set so that the parallelism is within the predetermined value. Is equipped with a rotation positioning control device that controls the
There is an effect that a component connection device for a high-density substrate that can stably produce a high-density substrate to which the installation member is connected is obtained.

According to a sixth aspect of the present invention, in any one of the first to fifth aspects, the first and second pair of position marks are respectively formed by the first and second conductive terminals. Since it is arranged on both sides of the group, the reference point can be easily recognized, and the effect of obtaining a high-density board component connection device capable of stably producing a high-density board to which the installation members are connected is obtained. is there.

According to a seventh aspect of the present invention, in any one of the first to fifth aspects, the first and second position mark pairs are respectively formed by the first and second conductive terminals. If the shared part of one of the conductive terminals has a unique shape that is different from the other conductive terminals, the arithmetic unit may use the alternative detected by the unique shape. First and second theoretical reference points are calculated based on the position mark coordinates, and when the shared portion of the conductive terminal has the same shape as the other conductive terminals, the approximate coordinate position information and shape information of the shared portion The first and second theoretical reference points are calculated on the basis of the alternative position mark coordinates detected by the combination of the position marks. To be able to generate a reference point, the effect of component connection device is obtained of a high density substrate that can be installed member is stable production of high density boards connected.

According to an eighth aspect of the present invention, in any one of the first to seventh aspects, the high-density substrate is formed of a ceramic substrate, so that a high-density substrate using a general material is used. There is an effect that a component connection device for a high-density substrate that can be stably produced can be obtained.

According to a ninth aspect of the present invention, in any one of the first to eighth aspects, the installation member is constituted by a transparent or translucent member, and the second position mark pair is formed. Since the image is detected by the transmitted light passing through the installation member, it is easy to take an image of the pattern on the installation member, and it is possible to obtain a high-density substrate component connection device capable of stably producing a high-density substrate. Has the effect.

According to the tenth aspect of the present invention, in any one of the first to ninth aspects, since the installation member is formed of a flexible substrate such as a polyester film, a general material is used. There is an effect that a component connection device for a high-density substrate that can stably produce a high-density substrate connected to the installed member is obtained.

Further, according to the eleventh aspect of the present invention, there is provided a component connection device for a high-density substrate, wherein the image detection device includes a CCD camera. There is an effect that a component connection device for a high-density substrate that can image a substrate connection portion using a camera and can stably produce a high-density substrate connected to the installation member is obtained.

[Brief description of the drawings]

FIG. 1 is a side view schematically showing an overall mechanism according to Embodiment 1 of the present invention.

FIG. 2 is an enlarged plan view showing part A in FIG. 1 in detail.

FIG. 3 is a functional block diagram showing a control device peripheral structure according to the first embodiment of the present invention;

FIG. 4 is a flowchart showing a control operation according to the first embodiment of the present invention.

[Explanation of symbols]

1a to 1c Base, 2a, 2b mounting jig, 3 high-density board, 4 installation members, 5 suction cups, 6, 13, 16 air cylinders, 7 Y-axis table, 9, 11 servo motor (2-axis positioning device), 10 X-axis table, 15 flat soldering iron (heating and melting means), 18 CCD camera (image detection device), 19 illumination device, 20 transmission illumination device, 2
1 first conductive terminal group, 23a, 23b first position mark pair, 24 second conductive terminal group, 25a,
25b second position mark pair, 26 image detecting device, 27 personal computer (computing device), 28
Positioning controller, 31 sequence controller, 1
02 Image capturing step, 103 Position mark coordinate detecting step, 104 Parallelism calculating step, 10
5 Parallelism determination step, 106 warning step, 10
8 Reference point coordinate calculation step, 115 fusion bonding step.

Continued on the front page F term (reference) 5E313 AA12 CC02 CD05 EE02 EE03 EE24 FF22 FF28 FG06 5E338 AA12 AA18 CC01 DD11 DD32 EE41 5E344 AA02 BB05 BB12 DD02 EE23

Claims (11)

[Claims] 1. A high-density substrate having a closely formed first conductive terminal group, and said first conductive terminal so as to be a reference point associated with said first conductive terminal group. A first pair of position marks provided on the high-density substrate simultaneously with the generation of the group, and a second conductive terminal electrically connected to each conductive terminal of the first conductive terminal group An installation member having a group, a second position mark pair arranged on the installation member so as to be at a position corresponding to the first position mark pair, and a first and a second position mark pair. An image detection device installed so as to collectively view the field of view, and first and second theoretical reference points corresponding to respective coordinate positions of the first and second position mark pairs detected by the image detection device An arithmetic unit for calculating A two-axis positioning device for causing the first and second theoretical reference points to coincide with each other and to drive them together, and in a state where the first and second theoretical reference points are coincident with each other,
A high-density board component connection device, comprising: a heating and melting unit that heats and melts and bonds a solder material applied to at least one of the first and second conductive terminal groups. 2. The arithmetic unit comprises: first axis calculating means for calculating a first axis connecting a center point of each position mark of the first position mark pair; and each of the second position mark pairs. 2. The apparatus according to claim 1, further comprising: a second axis calculator for calculating a second axis connecting the center points of the position marks; and a parallelism calculator for calculating a parallelism between the first and second axes. 2. The component connection device for a high-density substrate according to 1. 3. The arithmetic unit calculates an intermediate point of the first axis as the first theoretical reference point, and calculates an intermediate point of the second axis as the second theoretical reference point. The component connection device for a high-density substrate according to claim 2, wherein: 4. The apparatus according to claim 2, further comprising an alarm unit for generating an alarm output for stopping the bonding operation by the heating and melting unit when the degree of parallelism exceeds a predetermined value. Item 4. A component connection device for a high-density substrate according to Item 3. 5. A rotary positioning control device for controlling the two-axis positioning device such that when the parallelism exceeds a predetermined value, the parallelism is within a predetermined value. The component connection device for a high-density substrate according to claim 2 or 3. 6. The apparatus according to claim 1, wherein the first and second position mark pairs are arranged on both sides of the first and second conductive terminal groups, respectively. The high-density substrate component connection device according to any one of the above. 7. The first and second position mark pairs are also used by a part of any one of the first and second conductive terminal groups, and the arithmetic unit is When the shared portion of the conductive terminal has a unique shape different from other conductive terminals, the first and second theoretical reference points are calculated based on the alternative position mark coordinates detected by the unique shape. If the shared portion of the conductive terminal has the same shape as the other conductive terminal, based on the alternative position mark coordinates detected by a combination of the approximate coordinate position information and the shape information of the shared portion, 6. The method according to claim 1, wherein the first and second theoretical reference points are calculated.
A component connection device for a high-density substrate according to any one of the above. 8. The component connection device for a high-density substrate according to claim 1, wherein the high-density substrate is formed of a ceramic substrate. 9. The installation member is formed of a transparent or translucent member, and the image of the second position mark pair is detected by light transmitted through the installation member. 9. The component connection device for a high-density substrate according to claim 1. 10. The high-density board component connection apparatus according to claim 1, wherein the installation member is formed of a flexible board such as a polyester film. 11. The component connection device for a high-density substrate according to claim 1, wherein the image detection device includes a CCD camera.