JPH09160622A - Method and device for assembling electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component assembing device which mounts an electronic component on a substrate in an arbitrary shape that is positioned in an arbitrary direction. SOLUTION: This device consists of the electronic component 1, a robot 8 which moves a television camera 3 to the position of the substrate 2, a lighting device 10 for generating an image of the substrate 2, an image processor 5 which processes the image from the television camera 3, a controller 6 which controls the whole device, and a fixing jig 4 for fixing the substrate. Then the insertion position of the electronic component on the substrate and a change in its attitude are calculated from the detected position and angle deviation of the substrate and the calculation results are used to insert the electronic component into the substrate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for assembling electronic components.

[0002]

2. Description of the Related Art FIG. 26 is a block diagram showing a conventional electronic component assembling apparatus. In FIG. 26, 1 is an electronic component for inserting into the substrate, 2 is a substrate for inserting the electronic component, 4 is a fixing jig for fixing the substrate 2, 7 is a hand for gripping the electronic component 1, and 100- Reference numeral 102 denotes an XYZ axis stage for moving the electronic component 1 gripped by the hand 7 in the XYZ axis directions shown in FIG. 26, and 103 denotes a θ axis for rotating the electronic component 1 gripped by the hand 7 in the θ axis direction. The stage 104 is an XYZ axis + θ axis stage 100 to 10
3 is a stage controller for controlling 3, 6 is a control device for controlling the electronic component assembling device, and 105 is an input device for inputting the mounting position of the electronic component.

The conventional electronic component assembling apparatus is constructed as described above, and the electronic component 1 is assembled as follows. First, the electronic component 1 such as an IC and a condenser is grasped by the hand 7, and the hand 7 grasping the electronic component 1 is moved to a position just above the position where the electronic component 1 is inserted on the XY axis stages 100 to 101. The stage 103 is rotated according to the insertion position, and then the Z-axis stage 102 is lowered to move the substrate 2
The electronic component 1 is assembled to the substrate 2 by inserting the electronic component 1 into the designated insertion position.

Electronic component insertion position data of such an electronic component assembling apparatus is generated from CAD data of a board, for example, or an operator inputs numerical data for positioning using the input device 105 as necessary. I am doing it.

[0005]

In the conventional electronic component assembling apparatus as described above, when only a substrate having a fixed shape is sent, highly accurate positioning is possible, but a different shape is required. When a large number of types are sent, it is difficult to perform stable and accurate positioning, and not only the jig cost will increase if a positioning jig is manufactured for each board shape, but also time is required for setup change. There was a problem of hanging up.

With respect to the generation of insertion data, in the case of a board having a fixed shape, the data from the outer shape of the board or the reference hole for insertion to the insertion position of the electronic component is relatively generated using CAD data or the like. Although it can be easily generated, it is difficult to set the reference position of the substrate from CAD data or the like because it is difficult to perform accurate positioning in the case of a deformed substrate, and the same can be said for the insertion position of the electronic component.

The present invention has been made in order to solve such a problem, and when assembling an electronic component on a substrate, the electronic component can be highly accurately even when the substrate has an arbitrary shape and an arbitrary angle. It is an object of the present invention to provide an assembling apparatus and an assembling method for assembling a substrate on a substrate.

It is another object of the present invention to provide a teaching device and a teaching method for teaching the insertion position data of an electronic component even when the substrate has an arbitrary shape and an arbitrary angle.

[0009]

An electronic component assembling apparatus according to a first aspect of the present invention is an apparatus for positioning and assembling electronic components at an assembling position on a substrate, and image generating means for generating an image of the substrate, The board has an image pickup means for picking up an image produced by the image generating means, and a measuring means for measuring data on the substrate from an image picked up by the image pickup means, and the board using the data on the board measured by the measuring means. Is obtained, and electronic components are assembled to the board by using the state data and the data concerning the board.

An electronic component assembling apparatus according to a second invention is the electronic component assembling apparatus according to the first invention, wherein a robot is used for at least one of positioning and assembling the electronic component on the substrate.

An electronic component assembling apparatus according to a third aspect of the present invention is the electronic component assembling apparatus according to the first or second aspect, wherein the measuring means has a detecting means for detecting positional data of two different points on the substrate. It is a thing.

An electronic component assembling apparatus according to a fourth aspect of the present invention is the electronic component assembling apparatus according to any one of the first to third aspects, wherein the board state data is the coordinates of the representative point of the board and the tilt angle. It is a thing.

An electronic component assembling apparatus according to a fifth aspect of the present invention is the electronic component assembling apparatus according to any one of the first to fourth aspects, wherein the measuring means detects the position data and the angle data of the representative point on the substrate. To have.

An electronic component assembling apparatus according to a sixth aspect of the present invention is the electronic component assembling apparatus according to any one of the second to fifth aspects, wherein the image pickup means is fixed to the hand coordinate system of the robot hand.

An electronic component assembling apparatus according to a seventh aspect of the present invention is the electronic component assembling apparatus according to the sixth aspect of the present invention, wherein the electronic component assembling apparatus has an image pickup means fixed to the base coordinate system of the robot.

An electronic component assembling method according to an eighth aspect of the present invention is a method of positioning and assembling an electronic component at an assembling position on a substrate, generating an image of the substrate, detecting data of its characteristic points, and detecting this data. The state data of the board is obtained by using the state data and the data about the board, and electronic parts are inserted into the board by using a robot.

An electronic component assembling method according to a ninth aspect of the invention is the electronic component assembling method according to the eighth aspect of the invention, in which after obtaining the state data of the substrate, the state obtained from the reference state data of the substrate and the image of the substrate. The correction amount of the state data of the electronic component is obtained from the difference from the data, and the first insertion state data of the electronic component is obtained from the correction amount and the reference state data of the electronic component.

An electronic component assembling method according to a tenth aspect of the invention is the ninth aspect.
In the electronic component assembling method of the invention described above, the first insertion state data is obtained, the electronic component is grasped by the robot hand and conveyed to a position near the insertion point, and then the actual insertion hole of the electronic component is set in the hand coordinate system of the robot hand. An image is picked up by an image pickup means fixed to the first part of the electronic component by using state data of this image.
The insertion state data of is corrected to obtain the second insertion state data.

The electronic component assembling apparatus of the eleventh invention is the third invention.
In the electronic component assembling apparatus of the invention of claim 2,
The detection means for detecting the position data of the points has a function of identifying two different points on the substrate.

The electronic component assembling apparatus according to the twelfth aspect of the invention is the third aspect.
Alternatively, in the electronic component assembling apparatus of the fifth invention, the detecting means has a reference frame rotating function for detecting the rotational displacement of the substrate.

An electronic component assembling apparatus according to a thirteenth invention is the first aspect.
The electronic component assembling apparatus according to any one of the first to seventh or tenth to twelfth aspects of the invention is provided with a jig base on which a substrate that transmits light and has no insertion resistance of the electronic component is placed.

A fourteenth electronic component assembling method is a method of positioning and assembling an electronic component at an assembling position on a substrate, generating an image of the substrate, detecting data of its characteristic points, and using this data. To obtain board condition data,
Further detecting the electronic component insertion state data on the board,
This insertion state data and the state data of the board are used to teach the electronic component insertion state data regarding the board.

A fifteenth electronic component assembling method is the same as the fourteenth electronic component assembling method, wherein an image pattern relating to the electronic component is used for detecting the electronic component insertion state data on the substrate.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION

First Embodiment of the Invention FIG. 1 is a configuration diagram showing an embodiment of the present invention. In FIG. 1, electronic component 1, substrate 2,
The fixing jig 4, the control device 6, and the hand 7 are the same as those in the prior art. Reference numeral 10 is a lighting device for generating an image of the substrate, 11 is a lighting controller for controlling the lighting device 10, and 3 is a hand 7 attached to the tip of the robot 8.
The television camera 5 is attached to the robot 8 so as to be movable without changing its relative position with respect to the television camera 5 for picking up an image illuminated on the substrate 2 by the illumination device 10, and the television camera 5 is a television camera 3.
An image processing device for processing an image from the robot, 8 is a robot having a television camera 3 in the tip arm portion for moving the electronic component 1 to the position of the substrate 2, and 9 is a robot controller for controlling the robot 8. is there. The electronic component is assembled on the substrate by the apparatus having such a configuration. FIG. 2 is a flowchart showing the electronic component assembling method.

Next, the operation of this embodiment will be described. First, the substrate 2 is positioned by the fixing jig 4. The television 8 is moved by the robot 8 to a position where an image for measuring the amount of positional deviation of the board 2 into which the electronic component 1 is inserted is captured. The illumination device 10 is irradiated onto the substrate 2, and the television camera 3 captures an image of the substrate 2. An example of this captured image is shown in FIG. In FIG. 3, 15 is a board image, 16 is an image of the electronic component insertion hole in the board image 15, and 17 is an alignment mark in which a hole is formed in the board 2 used for measuring the amount of positional deviation of the board 2. A method for measuring the amount of positional deviation of the board image 15 in FIG. 3 will be described with reference to FIGS. In FIG. 4, reference numeral 18 is reference template matching (hereinafter abbreviated as TM) data used to measure the amount of positional deviation of the board image 15. In FIG. 5, 19 is the TM recognition result of the reference TM data 18 in the board image 15.

The reference TM data 18-1 shown in FIG. 4 is converted into the image data in the board image 15 shown in FIG.
The image data is sequentially superposed by the calculation processing of M, and the position data (X1, Y1) at which the reference TM data 18 best matches in the board image 15 is obtained. Similarly, the reference T
The M data 18-2 is also processed by the image data in the board image 15 and the TM processing by the image processing device 5, and the position data (X
2, Y2) is calculated. The positional deviation amount (Δx, Δy, Δθ) of the substrate 2 is obtained from the position data obtained above as follows. The position data Pp of the substrate is Pp = (Xp, Yp) = ((X1 + X2) / 2, (Y1 + Y2) / 2) The angle data θp of the substrate is θp = tan ((y2-y1) / (x2-x1)) The substrate data is Pt = (Xt, Yt), θt. The position correction amount ΔP and the angle correction amount Δθ are ΔP = Pp−Pt = (ΔX, ΔY) = (Xp−Xt, Yp−Yt) Δθ = θp−θt Next, using this positional deviation amount, each electronic component 1 The positional deviation amount (Δx, Δy,
The position where the electronic component 1 is inserted is shifted by Δθ).

Next, the robot 8 is moved to the electronic component 1 take-out position, and the electronic component 1 is gripped by the hand 7,
The amount of positional deviation (Δx, Δy, Δ
θ) Move including the corrected amount. Substrate 2 on this
The following processing is performed in order to accurately correct the positions of the electronic component insertion hole 16 and the electronic component 1. The board 2 is irradiated with the illuminating device 10, and the television camera 3 captures an image of the electronic component insertion hole of the board 2. The image at this time is shown in FIG.
The data are shown in Figure 7. In FIG. 6, 20 is the imaged electronic component insertion hole image, and 21 is the T image by the image processing device 5.
This is a search area for performing M arithmetic processing. In FIG.
Reference numeral 22 is electronic component insertion hole reference TM data used for measuring the amount of positional deviation of the electronic component insertion hole 16. The image processing apparatus 5 using the reference TM data 22 for the electronic component insertion hole
The TM calculation processing is performed in the search area 21 to obtain the position data (XIC1, YIC1) that best matches the TM data. FIG. 8 shows a state in which the TM data 22 is aligned with the insertion hole.
Shown in

From the position data obtained above, the amount of positional deviation (ΔXIC, ΔYIC) of the electronic component insertion hole 16 is obtained as follows. Position data of electronic component insertion hole PIC = (XIC1, Y
IC1) Reference electronic component insertion hole position data PICt = (XI
Ct, YICt). ΔP = PIC−PICt = (ΔXIC, YIC) Here, PICt = (XICt, YICt) is the insertion hole position data on the substrate, where ΔP = Pp−Pt and Δθ = θ.
Data obtained by correction using p-θt. By this process, the position where the robot 8 inserts the electronic component 1 is shifted by the amount of positional deviation (ΔXIC, YIC) of the electronic component insertion hole 16 and the robot, and then the electronic component 1 is inserted into the substrate 2. By the same process, the inserting operation is performed until there are no electronic components 1 to be inserted into the board 2. When the positional deviation amount between the alignment mark 17 of the board 2 and the electronic component insertion hole 16 is small, the positional deviation amount of the alignment mark 17 of the substrate 2 is only corrected without measuring the positional deviation amount of the electronic component insertion hole. It is also possible to insert the electronic component 1 into the substrate 2 with.

Embodiment 2 In the first embodiment, the reference TM data for measuring the position of each point is one type as shown in FIG. 4, but in the present embodiment, the position of each point is measured as shown in FIG. Standard TM data 24 to measure
On the other hand, the reference TM data rotated by an arbitrary angle is prepared. By adding this TM data rotated by an arbitrary angle, the individual TM data of the first embodiment (see FIG.
18-1, 18-2, etc.) can only deal with the inclination of a slight angle, but the one of the present embodiment can cope with the inclination of the substrate at any angle. In FIG. 9, 25 is a T rotated by 90 degrees clockwise with respect to the reference TM data 24.
M data, 26 is TM data rotated 180 degrees clockwise with respect to the reference TM data 24, and 27 is reference TM data 2
4 is TM data rotated 90 degrees counterclockwise with respect to 4.

The TM data 24 to 27 are subjected to TM arithmetic processing by the image processing device 5 in the same manner as in the first embodiment, and the image data are sequentially superposed.
The position data and the degree of coincidence of the positions where ~ 27 most matched in the board image 15 are obtained. By using the TM data of the angle having the highest degree of coincidence, the angle can be obtained together with the X and Y positions. As a result, it is possible to obtain the positional deviation of the substrate 2 in the rotation direction θ in addition to the positional deviation of X and Y.
Needless to say, one type of TM data can be used when the substrate 2 has a small inclination.

Embodiment 3 In the first embodiment, the same TM data is used when the reference TM data is rotated by 180 °, but in this embodiment, different TM data is used at the position rotated by 180 ° as shown in FIG. Thus, even if the substrate is turned upside down by nearly 180 ° and positioned, the positional shift amount of the substrate can be obtained.

Embodiment 4 FIG. In the first to third embodiments described above, the amount of positional deviation of the substrate 2 is measured using the reference TM data for each of the two portions of the substrate 2, but in the present embodiment, as shown in FIG. A registration mark 62 having directivity in the rotation direction is imprinted on the substrate 2, and the TM data 32 is used to obtain the deviation of the position and the angle of the imprint 62 on the substrate. The reference TM data 32 is prepared by rotating the reference TM data by an arbitrary angle, as in the second embodiment, in order to measure the rotation direction of the substrate 2. The reference TM data 32 is subjected to TM arithmetic processing on the substrate 2 by the image processing device 5 in the same manner as in the above embodiment, and the position and angle (Xp, Yp, θp) of the substrate are obtained. FIG. 11 shows the recognition result 33 obtained by the arithmetic processing at this time. From the position data obtained from the above, the amount of deviation of the position and angle of the substrate 2 (Δ
x, Δy, Δθ) is obtained as follows. If the data Pt of the reference substrate is Pt = (Xt, Yt) and θt, the positional displacement amount ΔP and the angular displacement amount Δθ are ΔP = Pp−Pt = (ΔX, ΔY) = (Xp−Xt, Yp−Yt) Δθ = θp -Θt

Embodiment 5 FIG. In the above-described first to fourth embodiments, the partial pattern of the substrate 2 is used to correct the position of the substrate 2, but in the present embodiment, the entire substrate is used as the reference TM data 34 as shown in FIG. The reference TM data 34 is prepared by rotating the reference TM data by an arbitrary angle, as in the second embodiment, in order to measure the rotation direction of the substrate 2. In FIG. 12, 35 is a reference TM
It is a recognition result using the data 34. Similar to the fourth embodiment, the TM processing is performed on the reference TM data 34 by the image processing device to obtain the substrate position (Xp, Yp, θp),
The positional deviation amount (Δx, Δy, Δθ) of the substrate 2 is calculated.

Embodiment 6 FIG. FIG. 13 is a configuration diagram showing another embodiment of the present invention. In FIG. 13, 2, 4
6 to 10, 10 and 12 are the same as those in the above-described embodiment.
In the present embodiment, the television camera 3 that takes an image of the entire substrate
The television camera 3 provided with the robot 6 and attached to the robot 8 is set to have a higher magnification than the television camera 36. Also, 37
Is a camera fixing base for fixing the television camera 36 without changing the relative position to the fixing jig 4. FIG. 17 shows a flow chart of the work in this embodiment.

With the above structure, the television camera 3
At 6, the positional deviation amount (Δx, Δy, Δθ) of the substrate 2 is obtained by the same method as in the first embodiment. The robot 8 holds the electronic component 1 while measuring the amount of positional deviation of the substrate 2 with the TV camera 36, and the amount of positional deviation (Δx, Δy, Δ
The robot 8 moves to the position where θ) is corrected. Next, the substrate 2 is imaged by the television camera 3 attached to the robot 8. FIG. 14 shows an electronic component insertion hole image 38 which is a captured image of the board 2. Further, reference numeral 39 is a search area in which the image processing apparatus 5 performs TM arithmetic processing. FIG. 15 shows electronic component insertion hole reference TM data used to measure the position of the electronic component insertion hole image. Similar to the first embodiment, the image processing device 5 performs the arithmetic processing of TM to measure the positions (XIC1, YIC1) of the electronic component insertion holes of the board 2. FIG. 16 shows the TM recognition result 41. Then, similarly to the first embodiment, the amount of positional deviation (ΔXIC, ΔYIC) between the insertion hole 16 of the electronic component and the robot is calculated, the insertion position is corrected by the amount of positional displacement, and then the electronic component 1 is inserted into the substrate 2.

With this structure, the electronic component 1 can be picked up by the robot 8 while the position of the substrate is being obtained, so that not only the insertion time of the electronic component 1 can be shortened, but also the two TV cameras having different magnifications can be used. Even if the displacement of the board 2 is large, the low-magnification TV camera 36 can be used to obtain an approximate positional deviation, and then the high-magnification TV camera 3 can be used to obtain the positional deviation, enabling highly accurate positional deviation correction in a wide range. Becomes Needless to say, if there is enough time to assemble the electronic component 1 on the substrate 2, the same process can be performed even if the robot 8 has two TV cameras 3 having different magnifications.

Embodiment 7 In the present embodiment, the entire device configuration is the same as in FIG. In FIG. 13, reference numeral 12 is a teaching device 12 for teaching the mounting position data of the electronic component 1 on the board 2. A method of teaching the mounting position data of the electronic component 1 to the board 2 with the above-described configuration will be described. FIG. 18 is a flowchart of the operation in this embodiment.

First, the teaching device 12 displays an image of the substrate 2 taken by the television camera 36 on the teaching device 12. FIG.
A board image 15 is shown in FIG. Reference numeral 51 is a teaching mark used for teaching the reference position of the substrate. The teaching mark 51 is moved on the teaching device 12 in order to teach the reference position used to determine the reference position of the substrate, and is moved near the reference position to be taught. An area wider than the teaching mark 51 is used as a search area for obtaining the reference position. FIG. 20 shows the state where the teaching mark 51 is moved and the search area 52 at this time. Next, in the search area 52, the image data are sequentially superposed by the arithmetic processing of TM of the image processing device 5 as in the first embodiment, and the reference TM data 54 becomes the board image 50.
Position data (X1, Y1) of the best match in the
Find (X2, Y2). In FIG. 21, reference TM data 5
3 and the recognition result 54 are shown. The reference position data (Xt, Yt, θt) of the substrate 2 is obtained from the position data obtained as described above as follows. The reference position data Pt of the substrate is Pt = (Xt, Yt) = ((X1 + X2) / 2, (Y1
+ Y2) / 2) Further, the reference angle data θt θt = tan ((Y2-Y1) / (X2-X1)) of the board is used to teach the position of mounting the electronic component 1 on the board 2 from FIGS. It is shown using. In FIG. 22, 16 is an electronic component insertion hole image that is a hole image into which the electronic component 1 is inserted, and 56 is a teaching mark used to teach the insertion position of the electronic component 1. Further, in FIG. 23, reference numeral 57 is a search area 57 used for TM recognition of the insertion position of the electronic component 1. Further, in FIG. 24, reference numeral 58 is reference TM data used for measuring the insertion position of the electronic component 1, and reference numeral 59 is T obtained by calculating TM using the reference TM data 58.
This is the M recognition result.

In order to determine the position where each electronic component 1 is inserted into the substrate 2, the teaching mark 56 is moved on the teaching device 12 and moved near the position of the electronic component 1 to be inserted. An area wider than the teaching mark 56 is used as a search area for obtaining the electronic component insertion position. FIG. 23 shows the state where the teaching mark 56 is moved and the search area 57 at this time. Next, in the search area 57, image data are sequentially superposed by the arithmetic processing of TM of the image processing device 5 as in the first embodiment, and the reference TM data 58 becomes the electronic component insertion hole image 5.
Position data (XIC1, Y
IC1) is calculated. FIG. 24 shows the reference TM data 53 and the recognition result 54. Position data obtained from the above (XIC
1, YIC1) and reference position data (Xt, Y) of the substrate 2
t) from the electronic component insertion reference position data (XICt, YI
Ct) is generated. Electronic component insertion reference position data PICt = (XICt, YICt) = (Xt-XIC
1, Yt-YIC1) This operation is performed for each electronic component 1 to be inserted.

In the present embodiment, the explanation has been given by using the television camera 36 in the configuration of FIG. 13. However, in order to generate teaching data with higher accuracy, the robot 8 of the configuration of FIG. By attaching the high-magnification television camera 3 and moving the television camera 3 to the position taught in the above embodiment using the robot 8 and teaching the electronic component 1 in the same manner, teaching can be performed with higher accuracy. Needless to say. In addition, although the present embodiment has been described using the configuration of FIG. 13, the configuration of FIG. 1 is used to move the robot 8 to a position where the television camera 3 that can image the entire substrate 2 can be imaged, and the reference of the substrate 2 It goes without saying that the same teaching method can be performed by teaching the position and the mounting position of the electronic component 1 on the substrate 2. Furthermore, in the present embodiment, the teaching mark 56 is moved in only one direction in FIG. 22, but the teaching mark 56 is also tilted in accordance with the tilt of the electronic component insertion hole image 55. By teaching,
It goes without saying that it is possible to teach the position data (XIC1, YIC1) of the electronic component 1 including the inclination θt.

Embodiment 8 FIG. Also in this embodiment,
The configuration of FIG. 13 is used as in the seventh embodiment. In this embodiment, in order to obtain the reference position of the substrate, the substrate 2 with alignment marks having directivity in the rotation direction is used as shown in FIG. The teaching method is the same as in the seventh embodiment,
This embodiment teaches a directional alignment mark at one location. After teaching, using the reference TM data as in the seventh embodiment, the position data (Xp, Yp,
θp) is calculated. The reference position data of the board is as follows. Substrate reference position data Pt = (Xt, Yt) = (Xp, Yp) Substrate reference angle data θt = θp Regarding the teaching of the insertion position of the electronic component 1, the seventh embodiment will be described.
Is the same as

Embodiment 9 FIG. Also in this embodiment,
The configuration of FIG. 13 is used as in the seventh embodiment. In the present embodiment, the entire image of the substrate 2 is used to obtain the reference position of the substrate as shown in FIG. The teaching method is the same as in the seventh embodiment, but this embodiment teaches the entire image of the substrate at one location. After teaching, the position and angle data (Xp, Yp, θp) of the substrate are obtained in the search area using the reference TM data as in the seventh embodiment. The reference position data Pt and the reference angle data θt of the substrate are as follows. Pt = (Xt, Yt) = (Xp, Yp) θt = θp Regarding the teaching of the insertion position of the electronic component 1, the seventh embodiment is described.
Is the same as

Embodiment 10. FIG. 25 shows a structure for simplifying the fixing of the board 2 to be inserted and enabling the insertion and assembly of parts on the odd-shaped board 2. Transmission plate 6 capable of transmitting light
A layer (for example, a sponge) 60 that transmits light and does not have insertion resistance of the electronic component 1 is placed on the upper surface of 1 and fixed with a transparent adhesive. The parts are placed on the sponge 60 without any special fixing. The electronic component 1 to be inserted is grasped by the hand 7 of the robot 8, the insertion position is confirmed by the television camera 3, and the robot 8 inserts and assembles it. The lead protruding from the substrate 2 after the insertion is automatically inserted into the sponge 46 and the lead is not bent. As a substance that transmits light and does not have insertion resistance of electronic parts, sponge-like, jelly-like, clay-like, or
It goes without saying that other similar ones are possible.

In the above-described embodiment, the TM data is used to process the image data. However, the same processing can be performed by using the image feature value data other than the TM data (center of gravity, principal axis of inertia, etc.). It goes without saying that you can do it. Further, in the above-described embodiment, the rotary joint type robot 8 is moved to insert the electronic component 1, but the same can be done by using the direct acting joint type robot or the orthogonal three-axis stage. If rotation is required to insert the electronic component 1,
The same thing can be done by adding a rotation (θ) axis to the three orthogonal axes. Further, in the above-described embodiment, the lighting device 10 is arranged at the position facing the television camera 3 with respect to the substrate 2, but the same can be achieved by disposing the lighting device 10 in the same direction as the television camera 3. Further, it goes without saying that the use of a grayscale image for the TM data enables more stable and highly accurate measurement.

[0045]

The electronic component assembling apparatus according to the first aspect of the present invention is an apparatus for positioning and assembling electronic components at an assembling position on a substrate, and image generating means for generating an image of the substrate,
It has an image pickup means for picking up an image produced by this image generating means, and a measuring means for measuring data on the substrate from the image picked up by this image pickup means, and the state of the substrate using the data on the substrate measured by this measuring means. Data (position / orientation misalignment and shape) is obtained, and electronic components are mounted on the board using this state data and data related to the board. Therefore, not only the board position / orientation but also the board shape can be recognized. This makes it possible to automate the work of assembling electronic components on other types of boards.

The electronic component assembling apparatus of the second invention is different from the electronic component assembling apparatus of the first invention in that the robot is used for at least one of positioning and assembling the electronic component on the substrate. A flexible assembling apparatus can be realized by responding to changes in positioning and insertion operation of components to board insertion positions by changing programs and teaching.

An electronic component assembling apparatus according to a third aspect of the present invention is the electronic component assembling apparatus according to the first or second aspect, wherein the measuring means has a detecting means for detecting position data of two different points on the substrate. Therefore, not only the positional deviation of the substrate but also the angular deviation can be calculated.

An electronic component assembling apparatus according to a fourth aspect of the present invention is the electronic component assembling apparatus according to any one of the first to third aspects, wherein the board state data is the coordinates of the representative point of the board and the tilt angle. Therefore, the insertion position of the electronic component can be accurately calculated, and the reliability of the insertion work is improved.

An electronic component assembling apparatus according to a fifth aspect of the present invention is the electronic component assembling apparatus according to any one of the first to fourth aspects, wherein the measuring means detects the position data and the angle data of the representative point on the substrate. Since it has the above-mentioned structure, not only the positional deviation of the substrate but also the angular deviation can be known by detecting only one point of the substrate.

The electronic component assembling apparatus according to the sixth aspect of the present invention is the electronic component assembling apparatus according to any one of the second to fifth aspects, wherein the image pickup means is fixed to the hand coordinate system of the robot hand. The coordinate transformation formula that defines the hand coordinate system viewed from the base coordinate system and the size difference between the actual robot shape parameters and the error caused by thermal expansion due to temperature changes can be corrected, Improves reliability of insertion work.

The electronic component assembling apparatus according to the seventh aspect of the present invention is the electronic component assembling apparatus according to the sixth aspect of the present invention, which has the image pickup means fixed to the base coordinate system of the robot. The robot can be operated during the detection, facilitating speeding up of the work. Further, the image pickup means fixed to the robot hand can be downsized, and the moving speed of the robot can be increased and the weight of hand transportation can be increased.

The electronic component assembling method of the eighth invention is a method of positioning and assembling an electronic component at an assembling position on a substrate, generating an image of the substrate, detecting data of its characteristic points, and detecting this data. Using the status data and the insertion hole position defined on the board, electronic parts are inserted into the board using a robot, so that the board has a complicated shape. Can also correctly detect the state. , Improve the reliability of electronic component insertion work.

An electronic component assembling method according to a ninth aspect of the invention is the electronic component assembling method according to the eighth aspect of the invention, in which after obtaining the state data of the substrate, the reference state data of the substrate and the state data obtained from the image of the substrate are added. The correction amount of the state data of the electronic component is obtained from the difference between the two, and the first insertion state data (position, posture) of the electronic component is obtained from the correction amount and the reference state data of the electronic component. If the component insertion position and posture are stored in advance, the electronic component insertion position and posture can be obtained from the displacement amount of the board.

The electronic component assembling method of the tenth invention is the ninth aspect.
In the electronic component assembling method according to the invention described above, the first insertion state data is obtained, the electronic component is gripped by the robot hand and conveyed to near the insertion point, and then the actual insertion hole of the electronic component is fixed to the hand coordinate system of the robot hand. Since the first insertion state data of the electronic component is corrected and the second insertion state data is obtained using the state data of this image, the position of the electronic component insertion hole on the substrate is obtained. It is possible to insert electronic components correctly even if there are variations.

The eleventh aspect of the electronic component assembling apparatus is the third aspect.
In the electronic component assembling apparatus of the invention of claim 2,
The detection means for detecting the position data of the point is different on the substrate 2
Since it has the function of identifying points, the substrate is
Even if it is rotated near 0 °, it is possible to correctly identify the state, it is possible to ensure the insertion work, and prevent the occurrence of defects.

The electronic parts assembling apparatus of the twelfth invention is the third invention.
Alternatively, in the electronic component assembling apparatus according to the fifth aspect of the invention, since the detecting means has the reference frame rotating function for detecting the rotational displacement of the board, even if the board is positioned in a state of being largely rotated, the state is correctly recognized. You can
This not only ensures the insertion work of the electronic components, but also improves the operation rate of the device.

The electronic parts assembling apparatus of the thirteenth invention is the first aspect.
In the electronic component assembling apparatus according to any one of the first to seventh or tenth to twelfth inventions, since a jig base for mounting a substrate that transmits light and does not have insertion resistance of the electronic component is provided, There is an effect that it is possible to create a highly versatile and inexpensive positioning jig that can correspond to the electronic component insertion hole position.

A fourteenth electronic component assembling method is a method for positioning and assembling an electronic component at an assembling position on a substrate, generating an image of the substrate, detecting data of its characteristic points, and using this data. To obtain board condition data,
Further detecting the electronic component insertion state data on the board,
Since the electronic component insertion state data regarding the board is taught by using the insertion state data and the state data of the board, even if the data regarding the insertion position on the board is not known in advance, the first data is displayed on the device. The data can be automatically read when the board is positioned, and there is an effect that it is easy to consistently automate from the data input of the target component to the assembly.

The fifteenth electronic component assembling method is the same as the fourteenth electronic component assembling method, wherein the image pattern relating to the electronic component is used for detecting the electronic component insertion state data on the substrate. This has the effect of facilitating automatic detection of the insertion position.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a first embodiment of a board assembling apparatus according to the present invention.

FIG. 2 is a flowchart of the first embodiment of the board assembling apparatus according to the present invention.

FIG. 3 is a diagram showing a board image of the first embodiment of the board assembling apparatus according to the present invention.

FIG. 4 is a diagram showing reference TM data of the first embodiment of the board assembling apparatus according to the present invention.

FIG. 5 is a diagram showing a TM recognition result in the first embodiment of the board assembling apparatus according to the present invention.

FIG. 6 is a diagram showing an electronic component insertion hole image of the first embodiment of the board assembling apparatus according to the present invention.

FIG. 7 is a diagram showing reference TM data for electronic component insertion holes according to the first embodiment of the board assembly apparatus of the present invention.

FIG. 8 is a diagram showing a TM recognition result in the first embodiment of the board assembling apparatus according to the present invention.

FIG. 9 is a diagram showing TM data for an arbitrary angle in the second embodiment of the board assembling apparatus according to the present invention.

FIG. 10 is a third embodiment of the board assembling apparatus according to the present invention.
It is a figure which shows the reference | standard TM data of.

FIG. 11 is a fourth embodiment of the board assembling apparatus according to the present invention.
It is a figure which shows the reference | standard TM data of.

FIG. 12 is a fifth embodiment of the board assembling apparatus according to the present invention.
It is a figure which shows the reference | standard TM data of.

FIG. 13 is a sixth embodiment of the board assembling apparatus according to the present invention.
It is a schematic diagram which shows.

FIG. 14 is a sixth embodiment of the board assembling apparatus according to the present invention.
It is a figure which shows the electronic component insertion hole image of.

FIG. 15 is a sixth embodiment of the board assembling apparatus according to the present invention.
It is a figure which shows the reference TM data for electronic component insertion holes.

FIG. 16 is a sixth embodiment of the board assembling apparatus according to the present invention.
It is a figure which shows the TM recognition result of.

FIG. 17 is a sixth embodiment of the board assembling apparatus according to the present invention.
It is a flowchart of FIG.

FIG. 18 is a seventh embodiment of the board assembling apparatus according to the present invention.
It is a flowchart of FIG.

FIG. 19 is a seventh embodiment of the board assembling apparatus according to the present invention.
It is a figure which shows the board | substrate image of.

FIG. 20 is a seventh embodiment of the board assembling apparatus according to the present invention.
It is a figure which shows the search area of.

FIG. 21 is a seventh embodiment of the board assembling apparatus according to the present invention.
It is a figure which shows the TM recognition result of.

FIG. 22 is a seventh embodiment of the board assembling apparatus according to the present invention.
It is a figure which shows the electronic component insertion hole image of, and a teaching mark.

FIG. 23 is a seventh embodiment of the board assembling apparatus according to the present invention.
It is a figure which shows the search area of.

FIG. 24 is a seventh embodiment of the board assembling apparatus according to the present invention.
It is a figure which shows the TM recognition result of.

FIG. 25 is a schematic diagram illustrating a substrate mounting plate according to an embodiment of the present invention.

FIG. 26 is a schematic view showing a conventional board assembling apparatus.

[Explanation of symbols]

1 electronic parts, 2 substrate, 3 TV camera, 4 fixing jig, 5 image processing device, 6 control device, 7 hands,
8 robots, 9 robot controllers, 10 lighting devices, 11 lighting controllers, 12 teaching devices, 1
5 board image, 16 electronic component insertion hole image, 17 alignment mark, 18 reference TM data, 19TM recognition result,
20 electronic component insertion hole image, 21 search area, 22
Reference TM data for electronic component insertion hole, 23 TM recognition result, 24 reference TM data, 2590 degree TM data, 2
6 180 degree TM data, 27-90 degree TM data,
30 standard TM data 1, 31 standard TM data 2, 3
2 reference TM data, 33 TM recognition result, 34 reference TM data, 35 TM recognition result, 36 TV camera, 37 camera fixing base, 38 electronic component insertion hole image,
39 search area, 40 reference TM data for electronic component insertion hole, 41 TM recognition result, 51 teaching mark, 52
Search area, 53 reference TM data, 54 TM recognition result, 56 teaching mark, 57 search area, 58 reference TM data, 59 TM recognition result, 60 sponge, 6
1 transmission plate, 100 X-axis stage, 101 Y-axis stage, 102 Z-axis stage, 103 θ-axis stage,
104 stage controller, 105 input device

Claims (15)

[Claims] 1. An apparatus for positioning and assembling an electronic component at an assembling position on a substrate, an image generating unit for generating an image of the substrate, an image capturing unit for capturing an image produced by the image generating unit, and an image capturing unit for capturing the image. A measuring means for measuring data relating to the substrate from an image captured by the means,
An electronic component assembling apparatus, characterized in that condition data of the substrate is obtained using the data concerning the substrate measured by the measuring means, and an electronic component is assembled to the substrate using the condition data and the data concerning the substrate. 2. The electronic component assembling apparatus according to claim 1, wherein a robot is used for at least one of positioning and assembling the electronic component on the substrate. 3. The electronic component assembling apparatus according to claim 1 or 2, wherein the measuring means has a detecting means for detecting position data of two different points on the substrate. 4. The electronic component assembling apparatus according to any one of claims 1 to 3, wherein the board state data includes coordinates of a representative point of the board and a tilt angle. 5. The electronic component assembling apparatus according to claim 1, wherein the measuring means has a detecting means for detecting position data and angle data of a representative point on the board. apparatus. 6. The electronic component assembling apparatus according to claim 2, wherein the image pickup means is fixed to a hand coordinate system of the robot hand. 7. The electronic component assembling apparatus according to claim 6, further comprising an image pickup means fixed to a base coordinate system of the robot. 8. A method of positioning and assembling an electronic component at an assembling position on a substrate, wherein an image of the substrate is generated, data of characteristic points thereof is detected, and data of the state of the substrate is obtained using this data, An electronic component assembling method characterized in that an electronic component is inserted into the substrate by using a robot using the state data and the data regarding the substrate. 9. The electronic component assembling method according to claim 8, wherein after obtaining the state data of the substrate, the state of the electronic component is calculated from the difference between the reference state data of the substrate and the state data obtained from the image of the substrate. An electronic component assembling method, wherein a correction amount of data is obtained, and first insertion state data of the electronic component is obtained from the correction amount and reference state data of the electronic component. 10. The method of inserting an electronic component according to claim 9, wherein the first insertion state data is obtained, and the electronic component is grasped by a robot hand and conveyed to a position near an insertion point, and then an actual insertion hole of the electronic component is obtained. Is imaged by the imaging means fixed to the hand coordinate system of the robot hand, and the first insertion state data of the electronic component is corrected using the state data of this image,
An electronic component assembling method, characterized in that second insertion state data is obtained. 11. The electronic component assembling apparatus according to claim 3, wherein the detecting means for detecting position data of two different points on the board has a function of identifying two different points on the board. Parts assembly equipment. 12. The electronic component assembling apparatus according to claim 3, wherein the detecting means has a function of rotating the reference frame for detecting the rotational displacement of the substrate. 13. The method according to any one of claims 1 to 7 or claim 10.
13. The electronic component assembling apparatus according to any one of items 1 to 12, further comprising a jig base on which a substrate that transmits light and has no insertion resistance of the electronic component is placed. 14. A method for positioning and assembling an electronic component at an assembling position on a board, wherein an image of the board is generated, data of characteristic points thereof is detected, and the status data of the board is obtained using this data, An electronic component assembling method further comprising detecting electronic component insertion state data on the board, and teaching the electronic component insertion state data regarding the board using the insertion state data and the board state data. 15. The electronic component assembling method according to claim 14, wherein an image pattern relating to the electronic component is used for detecting the electronic component insertion state data on the substrate.