CN214507783U

CN214507783U - Part mounting device

Info

Publication number: CN214507783U
Application number: CN201821042817.5U
Authority: CN
Inventors: 高濑浩一; 角田佳久
Original assignee: Mingshang Corp
Current assignee: Mingshang Corp
Priority date: 2017-07-06
Filing date: 2018-07-03
Publication date: 2021-10-26
Anticipated expiration: 2028-07-03
Also published as: JP2019016774A; KR20200024222A; JP7148108B2

Abstract

The utility model provides a can accurately and carry out the part installation device of the location of the mounted position of electronic component on to the base plate rapidly through simple operation. The component mounting apparatus is configured to include at least: the electronic component mounting apparatus includes a movable table (3), a movable head (4), a camera unit (7), a driving mechanism (10), a soldering mechanism (12), an image processing unit (13), a monitor unit (14), an input unit (17), an arithmetic processing unit (18) that generates a substrate line connecting 2 points on the image side of the substrate side and a component line connecting 2 points on the image side of the component side and calculates positioning information in which the substrate line and the component line are superimposed, and a control unit (15) that continuously drives the movable head (4) and the movable table (3) via the driving mechanism (10) based on the positioning information calculated by the arithmetic processing unit (18) and controls the mounting position (1B) on the substrate (1) and the positioning of the electronic component (2).

Description

Part mounting device

Technical Field

The present invention relates to a component mounting apparatus such as a repair apparatus having a function of mounting an electronic component on a printed circuit board.

Background

As an apparatus for mounting electronic components on a printed circuit board, there is a repairing apparatus for mounting new electronic components on a printed circuit board after removing electronic components that have been found to be defective.

The repair device shown in patent document 1 is provided with the following mechanisms and the like: a table 3 including an X table and a Y table for moving a substrate 2 on which an electronic component (integrated circuit component) 20 such as an IC or an LSI is mounted in XY directions, the electronic component including a BGA (Ball Grid Array) having a large number of spherical electrodes called bumps (bump) and/or a large number of lead terminals; and a camera unit 4 for photographing the position of the soldering surface of the electronic component 20, the mounting position of the electronic component on the substrate 2, and the like. When the electronic component 20 is mounted on the substrate 2, the electronic component 20 is sucked by the suction nozzle 51, the camera unit 4 photographs the upper side of the substrate 2 and the lower surface of the electronic component 20, and the photographed image signals are supplied to the personal computer 35 and the respective images are displayed on the monitor 36. The operator moves the table 3 while looking at the image displayed on the monitor 36 to mount the electronic component 20 at a predetermined position on the substrate 2, thereby performing alignment.

Further, patent document 2 is a related art technique relating to a method of positioning an electronic component at the time of mounting, and includes a step of recognizing a reference mark (component mark) formed on the electronic component and serving as a reference of an arrangement position of an electrical connection portion, and a step of recognizing an identification mark (substrate mark) for identifying a mounting position of an object on a printed substrate, and performs position correction of the electronic component to mount the electronic component.

Documents of the prior art

Patent document 1: japanese patent laid-open publication No. 2005-223000

Patent document 2: japanese patent laid-open publication No. 2005-167235

SUMMERY OF THE UTILITY MODEL

[ problem to be solved by the utility model ]

In a component mounting apparatus such as a repairing apparatus, electronic components and substrates to be mounted are not of the same type, and it is required to accurately position and mount electronic components of different types at random for each operation at mounting positions which are different at random for each substrate.

However, in the repair device described in patent document 1, the operator performs the operation while viewing the image, and there is a problem that it is difficult for the operator who is not familiar with the operation of the device to accurately position the electronic component at the mounting position on the substrate, and the positioning operation takes the most time, which results in poor operation efficiency.

In the positioning method described in patent document 2, the correction value is generated based on the component mark provided on the electronic component and the board mark provided on the board, but the reference mark does not exist in all the electronic components, and the correction value is generally calculated using the external shape of the component. In this case, since the part outer shape and the part-side electrode have a relatively large tolerance, a misalignment is likely to occur between the two at the time of actual bonding, and as a result, a problem arises in that a defect due to poor soldering occurs.

In order to solve the above-described problems of the prior art, the present invention has an object to create a component mounting apparatus capable of accurately and rapidly positioning a mounting position of an electronic component on a substrate by a simple operation.

[ technical means for solving the problems ]

In a technical solution for solving the above problem, the utility model discloses a first technical solution, its characterized in that has at least:

a movable table that holds a substrate for mounting electronic components and is movable in horizontal XY two-axis directions;

a movable head portion that is provided so as to be movable in a direction along a vertical Z axis and rotatable about the vertical Z axis, and that adsorbs an electronic component to move the electronic component to a mounting position on a substrate;

a camera unit including: a component side camera for imaging the arrangement of a component side electrode of an electronic component adsorbed by a movable head, and a substrate side camera for imaging the arrangement of a pad electrode formed at a mounting position on a substrate, wherein the component side camera and the substrate side camera are arranged to be capable of moving forward and backward between a movable table and the movable head;

a soldering mechanism for connecting the component-side electrode and the pad electrode;

a drive mechanism for driving the movable table, the movable head, the camera unit, and the soldering mechanism;

an image processing unit that processes the component-side image captured by the component-side camera and the substrate-side image obtained by processing the image captured by the substrate-side camera, or processes the component-side image and the substrate-side image into a composite image in which the component-side image and the substrate-side image are superimposed;

a monitor unit that selectively displays any one of the processed component-side image, substrate-side image, and synthesized image;

an input unit for inputting coordinates via the monitor unit;

a calculation processing unit that generates a component side line connecting coordinate positions on the substrate side image side and component side image side based on 2-point coordinate position information input to the substrate side images and 2-point coordinate position information input to the component side images via the input means, and calculates positioning information in which the substrate side line and the component side line are superimposed; and

and a control unit that continuously drives the movable head and the movable table via the drive mechanism based on the positioning information calculated by the arithmetic processing unit, and performs positioning of the mounting position on the substrate and the electronic component.

In the first technical means of the present invention, the electronic component can be automatically positioned at the mounting position on the substrate by performing the input operation using the input unit on the substrate-side image and the component-side image.

In addition, a second aspect of the present invention is the first aspect, wherein the following aspect is added,

the arithmetic processing unit has the following arithmetic functions:

generating a component side first line from a component side first input point and a component side second input point which are pieces of coordinate position information of 2 component side electrodes positioned on both sides of a diagonal line of the component side image, generating a substrate side first line from a substrate side first input point corresponding to the component side first input point and a substrate side second input point corresponding to the component side second input point among the plurality of component side electrodes displayed on the substrate side image, and finding a size ratio as first positioning information from a length size of the component side first line and a length size of the substrate side first line;

determining a first substrate angle which is an angle between the substrate side first line and a predetermined reference line, determining a first part angle which is an angle between the part side first line and the reference line, and determining an angle difference which is second positioning information from the first part angle and the first substrate angle; and

distance information between 2 points, which is third positioning information, is obtained from substrate coordinates, which are midpoint coordinates of the substrate-side first line, and part coordinates, which are midpoint coordinates of the part-side first line.

In addition, a third aspect of the present invention is the first aspect, wherein the following aspect is added,

the arithmetic processing unit has an arithmetic function of:

generating a component side first line from a component side first input point and a component side second input point which are coordinate position information of 2 component side electrodes located on both sides of a diagonal line of the component side image, generating a substrate side first line from a substrate side first input point and a substrate side second input point which are coordinate position information of 2 pad electrodes located on both sides of a diagonal line of the substrate side image, and finding a dimension ratio which is first positioning information from a length dimension of the component side first line and a length dimension of the substrate side first line;

generating a component side second line from a component side first input point and a component side third input point which are coordinate position information of 2 component side electrodes positioned on both sides among a plurality of component side electrodes arranged in a line along an edge of an electronic component displayed in a component side image, generating a substrate side second line from a substrate side first input point which is coordinate position information of a pad electrode corresponding to the component side first input point among pad electrodes displayed in a substrate side image and a substrate side third input point which is coordinate position information of a pad electrode corresponding to the component side third input point, determining a second substrate angle which is an angle between the second line and a predetermined reference line on the substrate side, and determining a second component angle which is an angle between the component side second line and the reference line on the substrate side, and an angle difference which is second positioning information is obtained according to the second part angle and the second substrate angle; and

In the third aspect, it is possible to obtain relative positional information in all directions (the vertical Z direction, the θ direction around the Z axis, the X axis direction, and the Y axis direction) necessary for positioning the electronic component at the mounting position on the substrate.

A fourth technical means of the present invention is the electronic component according to the second or third technical means, wherein the electronic component has an arithmetic function of calculating an offset amount in a rotation direction generated at a component coordinate which is a center of the electronic component when the electronic component is rotated by θ about the vertical Z axis, and calculating an XY offset component in the horizontal XY biaxial directions from the offset amount as correction processing information to be added to the third positioning information.

In the fourth aspect, when the component coordinates, which are the center of the electronic component, are offset from the rotation center (vertical Z axis) of the movable head holding the electronic component, the offset can be corrected with high accuracy.

A fifth aspect of the present invention is the any one of the above aspects, wherein a function of partially enlarging and displaying at least one of the component-side image and the substrate-side image in accordance with an input operation performed via the input unit is provided.

In the fifth technical means, accurate coordinate input at the time of input can be assisted.

A sixth mode of the present invention is the one described above, wherein the image processing device further includes a function of binarizing the image of at least one of the component-side image and the substrate-side image in accordance with an input operation performed via the input unit to extract the pad electrode or the component-side electrode, and detecting a center coordinate position of the pad electrode or the component-side electrode corresponding to the binarized image.

In the sixth aspect, the input point (the start point or the end point) is automatically set to the center coordinate position of the pad electrode or the component-side electrode only by clicking (inputting) the area of or the vicinity of the pad electrode or the component-side electrode displayed on the screen of the monitor section, and therefore, more accurate coordinate input is possible.

Effect of the utility model

The present invention has the above-described configuration, and therefore, the following effects are obtained.

The present invention is directed to a substrate positioning apparatus that can automatically position a substrate and an electronic component by only initially performing a simple input operation, and that can accurately and rapidly position the electronic component at a mounting position on the substrate even by an operator who is not familiar with the operation of the apparatus.

In addition, even if the types of the electronic components and the substrate are different for each operation, this can be dealt with, and therefore, the operation efficiency of positioning the electronic components at the mounting positions on the substrate can be improved.

Drawings

Fig. 1 is a schematic configuration diagram of a printed circuit board repair apparatus as an embodiment of the component mounting apparatus of the present invention.

Fig. 2 is a flowchart schematically showing the operation steps of the repairing apparatus.

Fig. 3 is a schematic diagram showing a substrate-side image captured by a substrate-side camera as a first embodiment of the present invention.

Fig. 4 is a schematic diagram showing a part-side image obtained by mirroring an image captured by the part-side camera.

Fig. 5 is a schematic view showing a composite image obtained by superimposing a substrate-side image and a component-side image.

Fig. 6 is a composite image showing a size matching process.

Fig. 7 is an explanatory diagram showing a relationship between the substrate line and the component line.

Fig. 8 is a composite image showing the angle matching process.

Fig. 9 is a composite image showing the alignment process.

Fig. 10 is a composite image showing a positioning completion state.

Fig. 11 is an explanatory diagram of the correction processing step.

Fig. 12 is a diagram showing an enlarged view of a substrate side image, where (a) is an enlarged view of the upper left portion and (b) is an enlarged view of the lower right portion.

Fig. 13 is an enlarged view showing a part-side image, where (a) is an enlarged view of the upper left portion and (b) is an enlarged view of the lower right portion.

Fig. 14 is a conceptual diagram showing image data in which the upper left portion of the substrate-side image is enlarged.

Fig. 15(a) is a conceptual diagram showing an image obtained by binarizing a part of the image data of fig. 14, and (b) is an enlarged view of an image obtained by extracting only one pad electrode from (a) and displaying the extracted pad electrode.

Fig. 16 is an explanatory diagram of a second method as a method of detecting the center coordinate position of the extracted pad electrode.

Fig. 17 is a schematic diagram showing a component-side image obtained by mirroring the bottom surface of an integrated circuit component with a lead terminal according to a second embodiment of the present invention.

Fig. 18 is a schematic view of a substrate-side image of a substrate on which an integrated circuit component with lead terminals is mounted.

Description of reference numerals

1: base plate (printed substrate)

1 a: pad electrode

1 m: coordinates of the substrate

1A: substrate side image

1B: mounting location

2: electronic component

2 a: side electrode of parts (bump electrode)

2 m: part coordinate

2A: part side image

3: movable working table

4: movable head

5: adsorption head

6: heating head

7: camera unit

8: part side camera

9: substrate side camera

10: driving mechanism

11: suction mechanism

12: soft soldering mechanism

13: image processing unit

14: monitor unit

15: control part (computer)

16: manual operation part

17: input unit

18: arithmetic processing unit

30: composite image

41: horizontal line

42: intersection of horizontal line and outer edge of pad electrode

43: horizontal line

44: perpendicular bisector of transverse line

51: vertical line

52: intersection of the vertical line and the outer edge of the pad electrode

53: longitudinal line

54: vertical bisector of longitudinal line

100: prosthetic devices (parts mounting device)

b: pad electrode

b 1-b 12: pad electrode

Lb: substrate line

Lb 1: substrate-side first wire

Lb 2: substrate side second line

Le: part line

Le 1: part side first line

Le 2: part side second line

A: starting point (substrate side first input point)

B: end point (substrate side second input point)

C: starting point (part side first input point)

D: end point (second input point on the part side)

E: auxiliary point (substrate side third input point)

F: auxiliary point (third input point of part side)

O: center coordinate position of electrode

P: cursor

P1: click position

Q: block

R: reference line

T: lead terminal (part side electrode)

T1-T12: lead terminal (part side electrode)

Phi 1: angle of the first substrate

Phi 2: angle of the first part

Phi 3: angle of the second substrate

Phi 4: angle of the second part

δ: offset of part coordinates

Detailed Description

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Fig. 1 is a schematic configuration diagram of a printed circuit board repair apparatus as an embodiment of the component mounting apparatus of the present invention. The component mounting apparatus according to the present invention includes, for example, a component soldering apparatus used in a production line or the like, in addition to the repairing apparatus described below.

The printed circuit board repairing apparatus (component mounting apparatus, hereinafter the same) 100 appropriately assists a series of repairing operations when an operator performs a series of repairing operations for a printed circuit board (hereinafter simply referred to as "board") 1 that is defective and needs to be replaced as a result of inspection (that is, a series of repairing operations for a board, such as removing an electronic component, such as an IC or LSI, having a BGA, a CSP, or a lead terminal that has caused a defect, cleaning a solder from a corresponding portion on the substrate after removal, applying a new solder to the corresponding portion, supplying a new electronic component 2 to the corresponding portion, and soldering the new electronic component 2). That is, the printed circuit board repairing apparatus 100 is designed so that a worker can perform a series of repairing operations for a printed circuit board accurately and quickly with one apparatus without requiring special experience and skill.

The printed circuit board repair apparatus 100 includes the following components: a movable table 3 which carries the substrate 1 and moves in the directions of two horizontal axes (X axis and Y axis) orthogonal to each other to enable high-precision positioning of each coordinate position; a movable head 4 having an adsorption head (adsorption bit) 5 for vacuum-adsorbing and holding the electronic component 2 and a heating head 6 having a bonding means such as a heater for heating the held electronic component 2, the movable head 4 being vertically movable along a Z axis in a vertical direction and rotatable about the Z axis (hereinafter referred to as "θ rotation" as appropriate); a camera unit 7 which has a component side camera 8 and a substrate side camera 9, and is provided so as to be movable in a horizontal direction (X-axis direction) between the movable table 3 and the movable head 4, the component side camera 8 being capable of imaging an electrode (hereinafter referred to as a component side electrode 2a) mainly composed of a bump electrode provided on the bottom surface of the electronic component 2, a lead terminal provided on the side surface, and the like, and the substrate side camera 9 being capable of imaging a pad electrode 1a mainly provided at a mounting position 1B on the surface of the substrate 1; a drive mechanism 10 that moves the movable table 3 in the horizontal 2-axis direction, moves the movable head 4 up and down in the vertical direction, rotates θ, and linearly moves the camera unit 7 forward and backward in the X-axis direction; a suction mechanism 11 provided with a vacuum pump or the like for vacuum-sucking the suction head 5; a soldering mechanism 12, which is a simple reflow soldering mechanism, for electrically connecting the component-side electrode 2a of the electronic component 2 and the pad electrode 1a of the substrate 1 by heating the electronic component 2 to a predetermined temperature at which the solder is melted by the heater head 6; an image processing unit 13 that processes and synthesizes image data transmitted from the component side camera 8 and the substrate side camera 9 in the camera unit 7; a monitor unit 14 for displaying an image processed or synthesized by the image processing unit 13 on a screen; a manual operation unit 16 for performing driving in the drive mechanism 10 by manual operation; an input unit 17 including a mouse, a touch pen, a touch panel, or the like; an arithmetic processing unit 18 that performs various calculations; and a control unit 15 (computer) for controlling each mechanism, each unit, and each part by executing a component mounting program described later; and so on.

The movable table 3 is configured such that an X table that is horizontally slidable in the X axis direction is disposed on a Y table that is horizontally slidable in the Y axis direction. Therefore, as will be described later, the coordinate position of the substrate 1 in the XY direction can be accurately positioned.

The drive mechanism 10 includes a drive motor (not shown) for horizontally sliding the Y table in the Y axis direction (also referred to as the front-rear direction) and horizontally sliding the X table in the X axis direction (the lateral direction), and the movable table 3 can be horizontally slid in the horizontal XY two axis directions by the drive force of the drive motor under the control of the control unit 15.

A manual operation unit 16 formed of, for example, a first adjustment mechanism (not shown) of a rotary type or a joystick (not shown) type and a second adjustment mechanism (not shown) is connected to the drive mechanism 10, and the Y table can be horizontally slid in the Y axis direction (also referred to as a front-rear direction) by operating one of the first adjustment mechanisms, and the movable table 3 can be horizontally slid in the X axis direction (also referred to as a left-right direction) by similarly operating the other second adjustment mechanism.

The automatic operation by the drive motor and the manual operation by the manual operation unit 16 can be switched by the selection of the operator. Accordingly, the operator can finely adjust the coordinate position of the substrate 1 mounted on the movable table 3 by selecting the manual operation and operating the first adjustment mechanism and the second adjustment mechanism, and can automatically align the coordinate position of the substrate 1 as described later by selecting the automatic operation.

Heating head 6 is provided at the lower end of movable head 4, and suction head 5 is provided at the center of heating head 6. The movable head 4 can hold the electronic component 2 by sucking the electronic component 2 by driving the suction mechanism 11 with the lower surface of the heating head 6 in contact with the electronic component 2 and performing vacuum suction via the suction head 5. Further, by stopping the vacuum suction from the suction head 5 by the suction mechanism 11, the suction holding of the electronic component 2 by the movable head 4 is released. Next, the suction holding/holding releasing operation by the movable head 4, the lifting operation and the rotating operation (θ rotation) of the movable head 4, and the moving operation of the movable table 3 in the horizontal two-axis directions (XY directions) are combined, whereby the electronic component 2 can be mounted on the substrate 1.

The movable head 4 can heat the electronic component 2 by the heating head 6. The electronic component 2 held by the movable head 4 is lowered with respect to the substrate 1 mounted on the movable table 3, the component-side electrode 2a is brought into contact with the pad electrode 1a, and the soldering mechanism 12 is driven to heat the electronic component 2 by the heating head 6, whereby the solder paste of the component-side electrode 2a is melted and soldered to the pad electrode 1a, whereby the electronic component 2 is mounted on the substrate 1.

The camera unit 7 has a structure in which a pair of board cameras (board cameras) are fixed to both upper and lower surfaces of a movable arm provided to be movable forward and backward in a state in which lenses face in opposite directions, and the upper board camera constitutes a component side camera 8 and the lower board camera constitutes a board side camera 9. The substrate camera has a function of converting an image of a subject input through a lens into an electric signal through a high-pixel CCD, a CMOS sensor, or the like and outputting the electric signal as image data.

The image processing unit 13 has a processing function of performing calculation, processing, or storage of image data transmitted from the camera unit 7. In particular, the image processing unit 13 has a function of processing an image obtained by imaging the bottom surface of the electronic component by the component side camera 8 into a component side image obtained by performing mirror image processing. Thus, when the component-side image after the mirror image processing is superimposed on the substrate-side image, the component-side electrode and the pad electrode are superimposed.

As will be described later, the arithmetic processing unit 18 performs various calculations in response to an instruction from the control unit 15. The control unit (computer) 15 is configured to include a storage unit and the like mainly including a CPU, and to install a component mounting program composed of a plurality of programs, which are modularized, such as a suction mechanism program, a soldering mechanism program, an image processing program, a driving mechanism program, an arithmetic program, and a positioning program, under the management of the OS. The control unit 15 sends various commands necessary for operating the repair apparatus 100 by executing the component mounting program, and controls the mechanisms, units, and units.

Next, in the repair apparatus 100 for a printed circuit board on which the above-described program for mounting components is mounted, a method of positioning the electronic component 2 having many bump electrodes at the mounting position 1B on the substrate 1 will be described as an example. The various operations in the following description are operations performed by each mechanism, each unit, or each part that receives various instructions based on the component mounting program executed by the control unit 15.

Fig. 2 is a schematic flowchart showing an operation process of the repairing apparatus, fig. 3 to 5 relate to a BGA type electronic component including a large number of spherical electrodes (bump electrodes) called bumps, which is a first embodiment of the present invention, fig. 3 is a schematic diagram showing a substrate-side image captured by a substrate-side camera, fig. 4 is a schematic diagram showing a component-side image obtained by mirroring an image captured by a component-side camera, and fig. 5 is a schematic diagram showing a composite image in which the substrate-side image and the component-side image are superimposed.

When the substrate 1 is mounted on the movable table 3, the movable table 3 is moved in the horizontal XY two-axis direction so that the center portion of the mounting position 1B of the substrate 1 is substantially located right below the Z axis of the movable head 4. The movement of the movable table 3 at this time may be performed manually or may be performed automatically in response to a command from the control unit 15.

The control unit 15 drives the movable head 4 to suction-hold the electronic component 2 for remounting. The solder paste is transferred to the component-side electrode 2a of the electronic component 2 as necessary.

Next, as shown in fig. 1, the control unit 15 drives the drive mechanism 10 to move the camera unit 7 into and out of the space where the substrate 1 and the electronic component 2 face each other. The bottom surface of the electronic component 2 is imaged by a component-side camera 8 provided on the upper side, and the land electrode 1a on the surface of the substrate 1 is imaged by a substrate-side camera 9 provided on the lower side.

The substrate-side image 1A (see fig. 3) of the surface of the substrate 1 captured by the substrate-side camera 9 and the bottom surface (mounting surface) image of the electronic component 2 captured by the component-side camera 8 are input to the image processing unit 13 in real time. The image processing unit 13 displays the substrate-side image 1A on the monitor unit 14 as it is, and displays an image obtained by mirroring the bottom surface of the electronic component 2 on the monitor unit 14 as a component-side image 2A (see fig. 4).

1-1. Input procedure (Manual)

(1) Starting point (substrate-side first input point) a input

The control unit 15 displays the substrate-side image 1A on the monitor unit 14, and issues a message to the operator requesting input of a start point (substrate-side first input point) a on the substrate 1 side. When the operator inputs the starting point a on the substrate 1 side on the screen of the monitor unit 14 using the input means 17 such as a mouse or a touch panel, the control unit 15 acquires the coordinate position information thereof and changes the input portion on the monitor unit 14 to, for example, red. The starting point a is preferably any of the pad electrodes 1a located at one corner and arranged on a diagonal line among the plurality of pad electrodes 1a provided at the mounting position 1B.

(2) Starting point (part side first input point) C input

Next, the control unit 15 displays the part-side image 2A on the monitor unit 14, and gives a message to the operator requesting input of a start point (part-side first input point) C on the part side. When the operator similarly inputs the starting point C on the component side on the screen of the monitor unit 14 using the input unit 17, the control unit 15 acquires the coordinate position information thereof and changes the input position on the monitor unit 14 to, for example, blue. The starting point (component side first input point) C is located on the component side electrode 2a disposed to correspond to the starting point (substrate side first input point) a.

(3) End point (substrate side second input point) B input

Next, the control unit 15 displays the substrate-side image 1A on the monitor unit 14 again, and issues a message to the operator requesting input of the end point on the substrate side (substrate-side second input point) B. When the end point B on the substrate side is input on the screen of the monitor unit 14 using the input means 17 in the same manner as described above, the control unit 15 acquires the coordinate position information thereof, and changes the input position on the monitor unit 14 to, for example, red. The end point (substrate-side second input point) B is preferably any of the plurality of pad electrodes 1a provided at the mounting position 1B, which is located at a corner on the opposite side of the start point (substrate-side first input point) a and is arranged on a diagonal line.

(4) End point (part side second input point) D input

Subsequently, the control unit 15 displays the part-side image 2A again on the monitor unit 14, and also issues a message to the operator requesting input of the end point (part-side second input point) D on the part side. When the end point D on the component side is input on the screen of the monitor unit 14 using the input unit 17 in the same manner as described above, the control unit 15 acquires the coordinate position information thereof, and changes the input position on the monitor unit 14 to, for example, blue. The position of the end point (second input point on the component side) D is set to be on the component-side electrode 2a disposed corresponding to the start point (first input point on the component side) C.

Note that the input of 2 points (start point a and end point B) on the substrate 1 side may be performed first, and then the input of 2 points (start point C and end point D) on the electronic component 2 side may be performed, or the input of 2 points (start point C and end point D) on the electronic component 2 side may be performed first, and then the input of 2 points (start point a and end point B) on the substrate 1 side may be performed.

1-2. Substrate line and part line manufacturing process (automatic)

When confirming that the 4-point input operation of A, B, C and D is completed, the control unit 15 causes the image processing unit 13 to create a substrate line Lb (a-B line) connecting a start point (substrate-side first input point) a and an end point (substrate-side second input point) B on the substrate 1 side, and create a part line Le (C-D line) connecting a start point (part-side first input point) C and an end point (part-side second input point) D on the electronic part 2 side. Then, the image processing unit 13, which has received the instruction from the control unit 15, performs processing so that the substrate line Lb is displayed in the substrate-side image 1A (see fig. 3), and performs processing so that the part line Le is displayed in the part-side image 2A (see fig. 4). Further, the image processing unit 13 processes the substrate-side image 1A and the component-side image 2A into a composite image 30 (see fig. 5) in which the two images are superimposed and integrated, and displays a substrate line Lb on the substrate 1 and a component line Le on the electronic component 2 displayed on the composite screen 30. The substrate-side image 1A, the component-side image 2A, and the composite image 30 are selectively displayed on the monitor unit 14 under the control of the control unit 15.

When the movable table 3 on which the substrate 1 is mounted is moved, the monitor unit 14 tracks the movement of the movable table and the substrate-side image 1A or the substrate-side image 1A in the composite image 30 is moved in real time, and when the electronic component 2 is similarly moved, the monitor unit 14 tracks the movement of the movable table and the component-side image 2A or the component-side image 2A in the composite image 30 is moved in real time.

Next, the control section 15 performs a positioning process for accurately mounting the electronic component 2 at the mounting position 1B on the substrate 1. As described below, the positioning step includes a size matching step, an angle aligning step, an alignment step, and the like, and is executed in accordance with a positioning program constituting a component mounting program.

1-3. Procedure for size consistency (positioning procedure: automatic)

Fig. 6 is a composite image showing a size matching process.

First, the arithmetic processing unit 18, which has received an instruction from the control unit 15, determines the length dimension of the substrate line Lb (the distance between the start point a (substrate-side first input point) and the end point (substrate-side second input point) B) from the coordinate position information of the start point a and the end point B of the substrate line Lb on the substrate 1 side. Similarly, the arithmetic processing unit 18 determines the length dimension (the distance between the start point C and the end point D) of the part line Le based on the coordinate position information of the start point (part-side first input point) C and the end point (part-side second input point) D of the part line Le on the electronic part 2 side. Then, the arithmetic processing unit 18 obtains a dimension ratio (first positioning information) between the length dimension of the substrate line Lb and the length dimension of the component line Le.

Next, the control unit 15 sends the size ratio, which is the first positioning information obtained by the arithmetic processing unit 18, to the driving mechanism 10 to drive the motor, and moves the movable head 4 in the vertical direction by an amount corresponding to the size ratio on the Z axis to move the electronic component 2 so that the length dimension of the component line Le coincides with the length dimension of the substrate line Lb. As a result, as shown in fig. 6, the size of the electronic component 2 displayed in the composite image 30 changes from the state of the broken line to the state of the solid line, and the sizes of the substrate-side image 1A and the component-side image 2A become equal.

1-4. Angle involution process (positioning process: automatic)

Subsequently, the control unit 15 automatically performs angle matching. Fig. 7 is an explanatory diagram showing a relationship between the substrate line and the component line, and fig. 8 is a composite image showing the angle matching step.

First, the arithmetic processing unit 18, which receives a command from the control unit 15, calculates an angle between the substrate line Lb and the part line Le. That is, as shown in fig. 7, the arithmetic processing unit 18 sets a predetermined reference line R (X axis, Y axis, etc.), calculates a first substrate angle Φ 1 of the substrate line Lb with respect to the reference line R and a first part angle Φ 2 of the part line Le with respect to the reference line R based on the 4-point coordinate position information of A, B, C and D, and obtains an angular difference (Φ 2- Φ 1) of the part line Le with respect to the substrate line Lb (second positioning information).

Next, the control unit 15 sends the angle difference (Φ 2- Φ 1) as the second positioning information obtained by the arithmetic processing unit 18 to the drive mechanism 10 to drive the motor, and rotates the electronic component 2 by θ about the Z axis by the rotation angle of the movable head 4 corresponding to the amount of the angle difference (Φ 2- Φ 1), thereby making the first component angle Φ 2 of the component line Le coincide with the first substrate angle Φ 1 of the substrate line Lb as shown in fig. 7 and 8. That is, as shown in fig. 7 and 8, the part line Le is set in a parallel state with respect to the substrate line Lb by rotating the part line Le from the state of the broken line to the state of the solid line.

1-5. Alignment process (positioning process: automatic)

Fig. 9 is a composite image showing the registration process, and fig. 10 is a composite image showing the positioning completed state.

First, the arithmetic processing unit 18, which has received a command from the control unit 15, obtains the midpoint of the start point a (substrate-side first input point) and the end point B (substrate-side second input point) of the substrate line Lb on the substrate 1 side from the coordinate position information of these points, and sets the midpoint as the substrate coordinate 1 m. Similarly, the arithmetic processing unit 18 obtains a midpoint between the start point (the part side first input point) C and the end point (the part side second input point) D of the part line Le on the electronic part 2 side from the coordinate position information thereof, and sets the midpoint as the part coordinate 2 m. Further, the arithmetic processing unit 18 calculates distance information between 2 points (the distance in the X direction and the distance in the Y direction) (third positioning information) based on the coordinate position information of each of the substrate coordinates 1m and the part coordinates 2 m.

Next, the control unit 15 sends the distance information between 2 points (between the substrate coordinate 1m and the component coordinate 2 m) as the third positioning information obtained by the arithmetic processing unit 18 to the drive mechanism 10 to drive the motor, and moves the movable table 3 in the horizontal two-axis directions (X direction and Y direction) by moving the substrate 1 by the distance corresponding to the distance information between 2 points, thereby moving the substrate coordinate 1m toward the component coordinate 2m as shown in fig. 9. Through this step, as shown in fig. 10, the substrate line Lb is superimposed on the component line Le, and the electronic component 2 can be aligned with the mounting position 1B of the substrate 1.

1-6. Correction procedure (automatic)

Fig. 11 is an explanatory diagram of the correction processing step.

The angle aligning step and the positioning step are described as an ideal case where the rotation θ of the movable head 4 for holding the electronic component 2 by suction about the Z axis coincides with the midpoint (component coordinate) 2m of the component line Le which is the center coordinate of the electronic component 2, and may not coincide with each other in practice. In this case, since the distance information between 2 points in the alignment step includes an error, there is a possibility that the electronic component 2 cannot be accurately positioned at the mounting position 1B of the substrate 1.

Therefore, it is preferable that the alignment step includes a correction processing step of calculating a shift amount δ in the rotation direction of the part coordinate 2m of the electronic component 2 generated when the movable head 4 is rotated by θ about the Z axis (rotation center coordinate) as shown in fig. 11, calculating XY shift components in the horizontal XY two-axis direction from the shift amount δ, and taking the XY shift components (correction processing information) into consideration in addition to the distance information between 2 points (the distance in the X direction and the distance in the Y direction between the substrate coordinate 1m and the part coordinate 2 m) as the third positioning information, assuming that the Z axis (rotation center coordinate) of the movable head 4 does not coincide with the part coordinate 2m of the electronic component 2. The correction processing step is performed by the arithmetic processing unit 18 receiving the instruction of the control unit 15 executing an arithmetic processing program constituting a program for component mounting.

The alignment step includes a correction processing step, so that the electronic component 2 can be accurately positioned at the mounting position 1B of the substrate 1, that is, the electronic component 2 is disposed directly above the mounting position 1B on the substrate 1, and the land electrodes 1a disposed on the substrate 1 and the component-side electrodes 2a on the electronic component 2 side can be set in a state of facing each other one by one.

1-7. Mounting procedure

In the mounting step, the movable head 4 is lowered to bring the component-side electrode 2a of the electronic component 2 into contact with the pad electrode 1a provided at the mounting position 1B of the substrate 1. Next, the electronic component 2 is mounted on the substrate 1 by melting the solder paste with the heating head 6 by driving the soldering mechanism 12 and soldering the component-side electrode 2a and the pad electrode 1 a. This mounting step may be performed manually by an operator or automatically by a soldering program, which is one of the component mounting programs, being executed by the controller 15.

1-8. Input operation assistance function (enlargement display process) realized by enlargement display

Fig. 12 is a diagram showing an enlarged view of a substrate-side image, (a) is an enlarged view of an upper left portion, (b) is an enlarged view of a lower right portion, fig. 13 is a diagram showing an enlarged view of a component-side image, (a) is an enlarged view of an upper left portion, and (b) is an enlarged view of a lower right portion.

In the input steps (manual operation) of A, B, C and D in the above 1, although the substrate-side image 1A and the component-side image 2A displayed on the monitor unit 14 are directly input via the input means 17, the pad electrode 1A of the substrate 1 or the component-side electrode 2A of the electronic component 2 is extremely small, and therefore, if the coordinate position itself includes a large error at the time of input, the accuracy of the substrate line Lb and/or the component line Le, and further the accuracy of positioning the electronic component 2 at the mounting position 1B on the substrate 1 may be degraded as a result.

Therefore, for example, it is preferable to have an enlargement display step as an input operation assisting function, in which, when the control unit 15 issues a message to the operator requesting input of the starting point (substrate-side first input point) a on the substrate 1 side, for example, as shown in fig. 12(a), the part-side image 2A in which the position to be input to the substrate 1 (the position near the upper left of the substrate 1) is partially enlarged is displayed on the monitor unit 14 to facilitate the input; and/or when a message requesting input of an end point (substrate-side second input point) B on the substrate 1 side is issued, as shown in fig. 12 (B), input in a state where a position to be an input target of the substrate 1(a position near the lower right portion of the substrate 1) is partially enlarged and displayed is facilitated, and similarly, when input of a start point (component-side first input point) C and an end point (component-side second input point) D on the electronic component 2 side is facilitated, the control unit 15 displays a component-side image 2A partially enlarged as shown in fig. 13(a) and 13(B) on the monitor unit 14, respectively, to facilitate input by the operator. Such an enlarged display is performed by the image processing unit 13 that receives an instruction based on an image processing program (component mounting program) executed by the control unit 15.

In this configuration, since the input can be performed using the substrate-side image 1A or the component-side image 2A in which a portion corresponding to the input position is enlarged, the accuracy of the coordinate input to the pad electrode 1A and the component-side electrode 2A can be improved. As a result, the accuracy of the substrate line Lb and the component line Le is improved, and the accuracy of positioning the electronic component 2 at the mounting position 1B on the substrate 1 can be improved.

The enlargement display function may be a configuration in which both the substrate 1 side and the electronic component 2 side are enlarged and displayed as described above, or a configuration in which only one of them is enlarged and displayed.

1-9. Input operation assistance function (high-precision alignment step) for matching an input position with a center position of an electrode

Fig. 14 is a conceptual diagram showing image data obtained by enlarging the upper left portion of the substrate-side image, fig. 15(a) is a conceptual diagram showing an image obtained by binarizing a part of the image data of fig. 14, (b) is an enlarged diagram showing an image obtained by extracting and displaying only one pad electrode from (a), and fig. 16 is an explanatory diagram of a second method as a method for detecting the center coordinate position of the extracted pad electrode.

The pad electrode 1a after the image processing and/or the bump electrode as the component-side electrode 2a shown in this example are substantially circular in shape having a predetermined area, and the input points of A, B, C and D are constituted by points (dots) having no area. Therefore, even if the enlarged display step of 8 is added to the input steps of A, B, C and D of 1, for example, the coordinate position of the start point (substrate-side first input point) a input as the pad electrode 1a on the substrate 1 side may be slightly shifted from the coordinate position of the center of the actual pad electrode 1a, or the coordinate position of the start point (component-side first input point) C input as the component-side electrode 2a on the electronic component 2 side may be slightly shifted from the coordinate position of the center of the actual component-side electrode 2a, and in such a case, the accuracy of the length dimension and/or angle of the substrate line Lb or the component line Le produced may be greatly deviated, and as a result, the positioning accuracy of the electronic component 2 to the mounting position 1B of the substrate 1 may be degraded. In particular, in recent years, a higher degree of positioning accuracy is required between an electronic component 2 having a size of several centimeters square and a substrate 1 on which the electronic component is mounted, and therefore, an operator of a manipulator is required to have a high degree of skill in connection with an input operation.

However, there is a problem in that it takes time for an operator to have a high degree of skill. In addition, even if it is not easy to have high skills, there is a problem that the operator cannot operate the apparatus when the operator is absent or returned to work.

Therefore, in the input steps of A, B, C and D, it is preferable to have a high-precision alignment step as an input operation assistance function, and for example, the coordinate position of the start point (substrate-side first input point) a is automatically set to the coordinate position of the center of the pad electrode 1a only by the position in or near the inner region of the pad electrode 1a on the input substrate 1 side, and similarly the coordinate position of the start point (component-side first input point) C is automatically set to the coordinate position of the center of the component-side electrode 2a only by the position in or near the inner region of the component-side electrode 2a on the input electronic component 2 side. The same applies to end points (substrate-side second input points) B and D (component-side second input points).

Such a high-precision registration process can be executed by the image processing unit 13 that receives a command based on an image processing program (component mounting program) executed by the control unit 15. In the following, an example of the start point (substrate side first input point) a applied to the pad electrode 1a on the substrate 1 side is described for the high-precision alignment step, but the start point (component side first input point) C, the end point (substrate side second input point) B, and the end point (component side second input point) D are also the same.

First, in the enlargement display step, as shown in fig. 14, the operator moves the position of the cursor (pointer) P to a position within or near the region of the specific pad electrode 1A on the substrate-side image 1A displayed on the monitor unit 14 in an enlarged manner in order to input the start point (substrate-side first input point) a. In fig. 14, a coordinate position of the click (hereinafter referred to as a click position) is shown by a symbol P1.

Then, the image processing unit 13 extracts the shape of one pad electrode 1 a. One pad electrode 1a is extracted by setting a specific area Q (for example, a range of 1mm in vertical and horizontal directions around the click position P1, a range of 1mm in radius, or the like) including the click position P1 inside as a search range. Within the block Q as a search range, a plurality of pad electrodes 1a are included. As shown in fig. 15 a, the image processing unit 13 binarizes the image signal of the block Q, and extracts one pad electrode 1a with priority in the order of, for example, increasing the area near the center of the block Q from the binarized image (see fig. 15 b). For example, for an extremely small block in which the length dimension of the vertical and horizontal directions of the block Q is 100 μm or less, or the radius of the block Q is 100 μm or less, the block Q is not targeted for the pad electrode 1a, and therefore can be excluded from the candidates.

Next, the image processing unit 13 detects the center coordinate position O of the extracted pad electrode 1 a. As a method of detecting the center coordinate position O of the electrode having a substantially circular shape, there is a method of measuring the center of gravity of the electrode from binarized image data (first method), a second method, and the like, and as for the second method, as shown in fig. 16, when the click position P1 is set at any position within the click pad electrode 1a, the intersection of the vertical bisector 44 and the vertical bisector 54 is found and is defined as the center coordinate position O of the extracted pad electrode 1a, the vertical bisector 44 is a vertical bisector connecting a horizontal line 41 horizontally passing through the click position P1 and a lateral line 43 connecting intersection points 42 of the left and right outer edges of the pad electrode 1a, and similarly, the vertical bisector 54 is a vertical bisector connecting vertical lines 51 passing through the click position P1 perpendicularly to vertical lines 53 connecting intersections 52 of the upper and lower outer edges of the pad electrode 1 a.

As another method, for example, a method of estimating the center coordinate position O of the extracted pad electrode 1a by performing arc approximation by a least square mapping method or an average power of four error minimization method may be used, and any method may be used.

When the detection of the center coordinate position O of the pad electrode 1a in the image processing unit 13 is completed, the control unit 15 sets the click position P1 to the center coordinate position O of the corresponding pad electrode 1a, and sets the center coordinate position O as the coordinate position of the start point (substrate-side first input point) a. In the same manner, the detected center coordinate position O of the pad electrode 1a is set as the coordinate position of the end point (substrate-side second input point) B, and the detected center coordinate position O of the component-side electrode 2a is set as the coordinate positions of the start point (component-side first input point) C and the end point (component-side second input point) D, respectively.

In this way, in the high-precision alignment step, the operator can quickly and accurately and automatically set the respective coordinate positions of A, B, C and D to the center coordinate position O of each of the pad electrode 1a and the component-side electrode 2a corresponding to the respective coordinate positions by simply moving the cursor P to the position inside or near the pad electrode 1a on the substrate 1 side or the position inside or near the component-side electrode 2a on the electronic component 2 side on the enlarged screen and performing a click (input operation). This can further improve the accuracy of coordinate input to the pad electrode 1a and the component-side electrode 2 a. As a result, the accuracy of the substrate line Lb and the component line Le is improved more than before, and the positioning accuracy of the electronic component 2 at the mounting position 1B on the substrate 1 can be dramatically improved.

The input operation assisting function may be applied to both the substrate 1 side and the electronic component 2 side as described above, or may be applied to only one of them.

Next, as a second embodiment of the present invention, a case where the component-side electrode 2a is a lead terminal (a case of a circuit component with a lead terminal) will be described. In the following description, the same components are mainly described with the same reference numerals centering on points different from those in the first embodiment (in the case where the component-side electrode is a bump electrode), but a lead terminal as another embodiment of the component-side electrode 2a is described with a lead terminal T and another embodiment of the bump electrode 1a is described with a reference numeral b.

In the case where the component-side electrode 2a is a bump electrode as in the first embodiment, since the image data of the bump electrode and the pad electrode 1a as the component-side electrode 2a are both circular in shape, even if the sizes of the electrodes are different, the center point of the component-side electrode (bump electrode) 2a and the center point of the pad electrode 1a substantially coincide with each other. Therefore, in the actual electronic component 2 and substrate 1, the difference between the length of the component line Le and the length of the substrate line Lb is small.

However, when the component-side electrode 2a is a lead terminal, the image data of the pad electrode 1a on the substrate 1 side and the component-side electrode 2a (lead terminal T) on the electronic component 2 side are both substantially rectangular, but the aspect ratio of the two is greatly different. In addition, since the pad electrode 1a on the substrate 1 side is generally larger than the component-side electrode 2a (lead terminal T), the coordinate position of the center of the pad electrode 1a and the coordinate position of the center of the component-side electrode 2a (lead terminal T) are rarely matched with each other. Therefore, when the component-side image 2A is accurately superimposed on the substrate-side image 1A, the length dimension of the substrate line Lb and the length dimension of the component line Le do not match each other, and the first substrate angle Φ 1 and the first component angle Φ 2 are also different from each other. Therefore, in many cases, it is difficult to position the electronic component 2 including the integrated circuit component with the lead terminals at the mounting position 1B of the substrate 1 with high accuracy even if the method of the above-described first embodiment is applied as it is.

Therefore, in the second embodiment, the electronic component 2 may be positioned at the mounting position 1B of the substrate 1 with high accuracy by the following method.

Fig. 17 is a schematic diagram showing a component-side image obtained by mirroring the bottom surface of an integrated circuit component with lead terminals as another example of an electronic component according to a second embodiment of the present invention, and fig. 18 is a schematic diagram showing a substrate-side image of a substrate on which the integrated circuit component with lead terminals is mounted.

As shown in fig. 17, in a component-side image 2A of the integrated circuit component with lead terminals, lead terminals T (T1 to T6) constituting the component-side electrode 2A are arranged at equal intervals on one side surface of the main package of the electronic component 2, and similarly, lead terminals T (T7 to T12) are arranged at equal intervals on the other side surface of the main package. As shown in fig. 18, in a substrate-side image 1A showing a substrate 1 having a multilayer structure, pad electrodes B (B1 to B6) connected to lead terminals T (T1 to T6) are arranged in a row at equal intervals on one side of the substrate 2 at mounting positions 1B on the substrate 1, and similarly, pad electrodes B (B7 to B12) connected to lead terminals T (T7 to T12) are arranged in a row at equal intervals on the other side of the substrate 2. Note that the shape and/or number of the integrated circuit component with a lead terminal and the pad electrode b are not limited to the present embodiment.

2-1. Input procedure (Manual)

As in the first embodiment, the operator performs an input operation using the input unit 17 on the component-side image 2A and the substrate-side image 1A displayed on the monitor unit 14.

First, in the component-side image 2A, coordinate position information of the start point C and the end point D is obtained by setting the lead terminal T12 on one side of the positions on both sides of the diagonal line as the start point (component-side first input point) C and the lead terminal T6 on the other side as the end point (component-side second input point) D, and coordinate position information is obtained by setting the lead terminal T7 on the other side corresponding to the start point C (component-side first input point) of the lead terminal T12 on one side of the plurality of component-side electrodes 2A arranged in a line along the edge of the package of the electronic component 2 as the auxiliary point (component-side third input point) F.

Similarly, in a substrate-side image 1A obtained by imaging a substrate 1 on which an electronic component 2 including an integrated circuit component with lead terminals is soldered, coordinate position information of a start point (substrate-side first input point) a of a pad electrode B12, an end point (substrate-side second input point) B of the pad electrode B6, and an auxiliary point (substrate-side third input point) E of the pad electrode B7, which correspond to the start point C (component-side first input point) of the lead terminal T12, the end point (component-side second input point) D of the lead terminal T6, and the auxiliary point (component-side third input point) F of the lead terminal T7, respectively, are obtained.

The input operation can be performed by the same method as the "input process (manual) of 1, A, B, C and D" described above.

2-2. Production of thread (automatic)

Similarly to the first embodiment, the controller 15 causes the image processor 13 to create a substrate-side first line Lb1(a-B line) connecting the start point (substrate-side first input point) a and the end point (substrate-side second input point) B and a substrate-side second line Lb2(a-E line) connecting the start point (substrate-side first input point) a and the auxiliary point (substrate-side third input point) E with respect to the substrate-side image 1A, and causes the image processor 13 to create a component-side first line Le1(C-D line) connecting the start point C (component-side first input point) and the end point (component-side second input point) D and a component-side second line Le2(C-F line) connecting the start point (component-side first input point) C and the auxiliary point (component-side third input point) F with respect to the component-side image 2A.

The controller 15 processes the substrate-side image 1A so that the substrate-side image 1A displays the substrate-side first line Lb1 and the substrate-side second line Lb2, and processes the part-side image 2A so that the part-side image 2A displays the part-side first line Le1 and the part-side second line Le 2. The control unit 15 generates a composite image (not shown) in which the substrate-side image 1A and the component-side image 2A are superimposed and synthesized, as in the first embodiment. The controller 15 selectively displays the substrate-side image 1A, the component-side image 2A, and the composite image on the monitor 14.

2-3. Procedure for size consistency (positioning procedure: automatic)

Next, the arithmetic processing unit 18, which has received the instruction from the control unit 15, obtains the length dimension of the substrate-side first line Lb1 (the distance between the start point a and the end point B) and the length dimension of the substrate-side second line Lb2 (the distance between the start point a and the auxiliary point E), respectively, in the same manner as in the first embodiment.

Similarly, the arithmetic processing unit 18 obtains the length dimension of the part-side first line Le1 (the distance between the start point C and the end point D) and the length dimension of the part-side second line Le2 (the distance between the start point C and the auxiliary point F).

Then, the arithmetic processing unit 18 obtains a dimension ratio (first positioning information) between the length dimension of the substrate-side second line Lb2 and the length dimension of the component-side second line Le 2.

Next, the controller 15 sends the size ratio, which is the first positioning information obtained by the arithmetic processing unit 18, to the driving mechanism 10 to drive the motor, moves the movable head 4 in the vertical direction on the Z axis by an amount corresponding to the size ratio, and moves the electronic component 2 so that the length dimension of the component side second line Le2 matches the length dimension of the substrate side second line Lb 2.

2-4. Angle involution process (positioning process: automatic)

First, the arithmetic processing unit 18, which has received a command from the control unit 15, calculates an angle between the substrate-side second line Lb2 and the part-side second line Le 2. That is, as in the first embodiment, the arithmetic processing unit 18 sets a predetermined reference line R (X axis, Y axis, etc.), calculates a second substrate angle Φ 3 of the substrate side second line Lb2 with respect to the reference line R and a second part angle Φ 4 of the part side second line Le2 with respect to the reference line R, and obtains an angular difference (Φ 4 — Φ 3) of the part side second line Le2 with respect to the substrate side second line Lb2 (second positioning information).

Next, the controller 15 sends the angular difference (Φ 4- Φ 3) as the second positioning information obtained by the arithmetic processing unit 18 to the drive mechanism 10 to drive the motor, rotates the movable head 4 around the Z axis by a rotation angle corresponding to the angular difference (Φ 4- Φ 3), rotates the electronic component 2 by θ, and sets the second component angle Φ 4 of the component-side second line Le2 to be equal to the second substrate angle Φ 3 of the substrate-side second line Lb2 so that the component-side second line Le2 is parallel to the substrate-side second line Lb2, in the same manner as in the first embodiment.

2-5. Alignment process (positioning process: automatic)

Upon receiving the command from the control unit 15, the arithmetic processing unit 18 obtains the midpoint of the substrate-side first line Lb1 on the substrate 1 side as the substrate coordinates 1m and obtains the midpoint of the component-side first line Le1 on the electronic component 2 side as the component coordinates 2m, in the same manner as in the first embodiment. Further, the arithmetic processing unit 18 calculates distance information between 2 points (the distance in the X direction and the distance in the Y direction) (third positioning information) based on the coordinate position information of each of the substrate coordinates 1m and the part coordinates 2 m.

Next, the control unit 15 sends the distance information between 2 points, which is the third positioning information obtained by the arithmetic processing unit 18, to the drive mechanism 10 to drive the motor, and moves the movable table 3 in the horizontal two-axis directions (X direction and Y direction) by a distance corresponding to the distance information between 2 points to move the substrate 1, thereby moving the substrate coordinates 1m toward the part coordinates 2 m. Through this step, as in the first embodiment, the substrate side first line Lb1 is superimposed on the component side first line Le1, and the electronic component 2 can be positioned at the mounting position 1B of the substrate 1.

The "2-5 alignment step" includes the same step as the "1-6 correction processing step" described in the first embodiment, and thus even when the Z axis (rotation center coordinate) of the movable head 4 does not coincide with the component coordinate 2m of the electronic component 2, the electronic component 2 can be accurately positioned at the mounting position 1B of the substrate 1, that is, the electronic component 2 can be arranged just above the mounting position 1B on the substrate 1, and alignment can be performed in a state where the lead terminals T (T1 to T12) on the electronic component 2 side and the pad electrodes B (B1 to B12) on the substrate 1 side correspond one-to-one.

Next, by performing the above-described "1-7 mounting step", the lead terminals T (T1 to T12) on the electronic component 2 side and the pad electrodes b (b1 to b12) on the substrate 1 side can be soldered.

By adopting the above-described "1-8" input operation assisting function (enlarged display step) "realized by enlarged display, it is possible to improve the positioning accuracy of the electronic component 2 with respect to the mounting position 1B of the substrate 1.

However, in the high-precision alignment step, the shape of the component-side electrode 2a is different, and therefore the "1-9" input operation assisting function for matching the input position with the center position of the electrode in the first embodiment described above cannot be adopted as it is.

That is, since the pad electrodes b (b1 to b12) and the lead terminals T (T1 to T12) as the component-side electrodes 2a in the second embodiment have a rectangular shape, the "1 to 9" input operation assisting function of matching the input position with the center position of the electrode described in the first embodiment described above cannot be used as it is when the electrode is in a circular shape. Therefore, the following steps 2 to 6 are performed.

2-6. Input operation assistance function (high-precision alignment step) for matching an input position with a center position of an electrode

For example, as for the starting point (substrate-side first input point) a at the pad electrode b12 on the substrate 2 side, the pad electrode b12 located at the position closest to the click position clicked by the operator is binarized, and the coordinate position of the center thereof is obtained. Examples of a method for determining the coordinate position of the center of the pad electrode b12 formed in a rectangular shape include a method (first method) of binarizing the image data of the pad electrode b12 and measuring the center of gravity of the electrode, and a method of scanning the image data of the pad electrode b12 in the horizontal direction (X direction) and the vertical direction (Y direction) and setting the intersection of the vertical bisector in the X direction and the vertical bisector in the Y direction as the center coordinate position. Hereinafter, similarly, the coordinate position of the center can be obtained by the same method for the pad electrode B6 (end point (substrate side second input point) B) and the pad electrode B7 (auxiliary point (substrate side third input point) E), and the lead terminal T12 (start point (component side first input point) C) on the electronic component 2 side, the lead terminal T6 (end point (component side second input point) D), and the lead terminal T7 (auxiliary point (component side third input point) F).

As described above, in the high-precision aligning step in the second embodiment, the operator can quickly and highly precisely set the coordinate position of each input point of A, B, C, D, E and F to the coordinate position of the center of each of the pad electrode b and the lead terminal T (component-side electrode 2a) corresponding thereto, and automatically set the coordinate position to the coordinate position of the center of each of the pad electrode b and the lead terminal T, simply by moving the cursor P to the position inside or near the pad electrode b on the substrate 1 side or the lead terminal T on the electronic component 2 side on the enlarged screen and performing a click (input operation). Accordingly, the accuracy of the coordinate input of the pad electrode b and the lead terminal T (the component-side electrode 2a) can be further improved. As a result, the accuracy of each of the substrate-side first line Lb1, the substrate-side second line Lb2, the component-side first line Le1, and the component-side second line Le2 is improved, and therefore, even if the electronic component 2 is an integrated circuit component with lead terminals, the accurate positioning accuracy to the mounting position 1B of the substrate 1 can be dramatically improved.

As described above, in the present invention, in the positioning steps (the size matching step, the angle matching step, and the alignment step) of the substrate 1 and the electronic component 2, which are steps other than the input step and the mounting step performed manually, or the positioning steps in which the correction processing step, the enlargement display step, and the high-precision alignment step are added to the positioning steps, the control unit 15 drives and controls the driving mechanism 10 based on the driving mechanism program constituting the component mounting program, and the movable head 4 and the movable table 3 are sequentially and continuously driven, so that the electronic component 2 can be positioned to the mounting position 1B of the substrate 1 in an extremely short time in units of several tens of milliseconds.

As described above, the positioning step of mounting the electronic component 2 at the mounting position 1B of the substrate 1 is automatically performed regardless of the skill level of the operator who operates the repairing apparatus 100, and therefore, the electronic component 2 can always be mounted on the substrate 1 quickly and accurately.

Furthermore, even when the types of electronic components 2 and/or substrates 1 are different for each operation, the electronic components 2 can be automatically positioned based on the acquired substrate-side image 1A and component-side image 2A, and therefore, electronic components 2 of different types can be accurately positioned and mounted at mounting positions 1B that are different randomly for each substrate 1.

The configuration and the operation and effects of the present invention have been described above with reference to the embodiments, but the embodiments of the present invention are not limited to the above embodiments.

For example, in the first embodiment, the case where the input position is provided at diagonal positions (positions on diagonal lines and opposite sides to each other) of the substrate 1 and the electronic component 2 has been described as a preferred embodiment, but the input position may be any position as long as the relationship of correspondence between the 2 points on the substrate 1 side and the 2 points on the electronic component 2 side can be maintained.

In the above embodiment, the description has been given in the order of the size matching step, the angle matching step, and the alignment step, but the present invention is not limited to the above embodiment, and if the order of the angle matching step, and the alignment step is maintained, the size matching step may be performed last, or the angle matching step, the size matching step, and the alignment step may be performed in this order.

In the above embodiment, the simple reflow soldering mechanism 12 in which the electronic component 2 is heated by the heater head 6 to melt the solder is described, but the present invention is not limited to the above embodiment, and may be, for example, a normal soldering mechanism using a reflow furnace, a direct heating type soldering mechanism using a soldering iron having a heater built in at its tip, or a laser type soldering mechanism.

In the above description of the high-precision registration step of the embodiment, the case where the high-precision registration step is performed after the enlargement display step is described, but the present invention is not limited to the above embodiment, and the high-precision registration step may be performed directly in the input step without performing the enlargement display step.

Industrial applicability of the invention

The utility model discloses, can realize possessing the use extension in the field of the part installation device of the function of installing the mounted position on the base plate with electronic component automatically in wider scope.

Claims

1.A component mounting apparatus, comprising at least:

a movable table (3) which holds a substrate (1) for mounting an electronic component (2) and is movable in the horizontal XY two-axis directions;

a movable head (4) that is provided so as to be movable in a direction along a vertical Z axis and rotatable about the vertical Z axis, and that adsorbs the electronic component (2) so as to move the electronic component to a mounting position (1B) on the substrate (1);

a camera unit (7) provided with: a component side camera (8) for imaging the arrangement of a component side electrode (2a) of an electronic component (2) adsorbed by the movable head (4), and a substrate side camera (9) for imaging the arrangement of a pad electrode (1a) formed at a mounting position (1B) on the substrate (1), and arranged to be capable of advancing and retreating between the movable table (3) and the movable head (4);

a soldering mechanism (12) for connecting the component-side electrode (2a) and the pad electrode (1 a);

a drive mechanism (10) for driving the movable table (3), the movable head (4), the camera unit (7), and the soldering mechanism (12) respectively;

an image processing unit (13) that processes a component-side image (2A) captured by the component-side camera (8) and a substrate-side image (1A) obtained by processing an image captured by the substrate-side camera (9), or processes a composite image (30) in which the component-side image (2A) and the substrate-side image (1A) are superimposed;

a monitor unit (14) that selectively displays any one of the processed part-side image (2A), the substrate-side image (1A), and the composite image (30);

an input means (17) for inputting coordinates via the monitor unit (14);

a calculation processing unit (18) that calculates predetermined positioning information based on coordinate position information input to the substrate-side image (1A) and coordinate position information input to the component-side image (2A) that correspond to each other via the input means (17); and

and a control unit (15) that continuously drives the movable head (4) and the movable table (3) via the drive mechanism (10) based on the positioning information calculated by the arithmetic processing unit (18) to position the electronic component (2) and the mounting position (1B) on the substrate (1).