JP2018029161A - Image processing system for component mounting machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To create an image processing system for a component mounting machine certainly performing joint work between a soldering bump of an electronic component and a land electrode of a substrate.SOLUTION: An image processing system for a component mounting machine has: a moving head portion; a moving table holding a substrate; a camera unit which is equipped with a component side camara shooting a solder bump of an electronic component, and a substrate side camera shooting a land electrode of the substrate; a drive mechanism which respectively moves the moving head portion, the moving table, and the camera unit; an image processing unit which performs image processing of component side imaging data and substrate side imaging data; and a monitor unit which displays images. The image processing unit has a first image processing function generating a contour image made from a contour only of the solder bump, a second image processing function generating a contour image made from a contour only of the land electrode; and a third image processing function generating a synthetic image obtained by superimposing the contour images of a solder ball and the land electrode.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an image processing system for a component mounter that mounts electronic components such as BGA and CSP on a printed circuit board.

In the field of manufacturing electronic equipment, BGA (Ball
A component mounting operation for mounting an electronic component such as a grid array (CSP) or a CSP (Chip Scale Package) on a work such as a mounting board is performed. In this component mounting operation, an electronic component on which a connection electrode such as a solder bump is formed is taken out from the component supply unit and transferred to the mounting substrate, and the connection electrode of the mounted electronic component is mounted on the mounting substrate side. Joining work to join the land is performed.
The prior art described in Patent Document 1 recognizes a reference mark (component mark) that is formed on an electronic component and serves as a reference for an arrangement position of an electrical connection portion, and a recognition mark ( A recognition step for recognizing a board mark), and mounting after correcting the position of the electronic component.

  The prior art described in Patent Document 2 includes a component recognition camera that captures an electronic component that is sucked by a suction nozzle, a substrate recognition camera that captures a substrate, an image recognition device, and the like. Yes. The image recognition device recognizes the positional deviation of the board from the image information of the board mark imaged by the board recognition camera, and uses the component mark formed on the electronic part from the image signal of the electronic part imaged by the component recognition camera as a reference. A deviation amount and an angle between the center position and the suction position of the component to be acquired are acquired, and a correction value for the electronic component is generated in consideration of the positional deviation of the substrate. Then, the electronic component is mounted on the substrate in a state corrected with this correction value.

JP 2005-167235 A JP 2009-117624 A

However, both Patent Document 1 and Patent Document 2 are configured such that correction values are generated based on the component mark provided on the electronic component and the substrate mark provided on the substrate, and the solder bump of the electronic component. This is not a configuration in which the (connecting electrode) and the land electrode of the substrate are directly confirmed. For this reason, when it actually joins, position shift arises between both, As a result, there exists a problem that the malfunction by solder failure tends to generate | occur | produce.
An object of the present invention is to create an image processing system for a component mounter for surely performing a joining operation between a solder bump of an electronic component and a land electrode of a substrate in order to solve the above-described problems in the prior art. And

Among the means for solving the above problems, the main means of the present invention is as follows.
A component side for photographing the arrangement of a movable head portion for holding an electronic component, a movable table for holding a substrate on which the electronic component is mounted, and a solder bump provided on the bottom surface of the electronic component held by the movable head portion A camera unit provided with a camera on the substrate and a substrate-side camera for photographing the arrangement of the land electrodes formed on the substrate, and a drive for moving the movable head, the movable table, and the camera unit, respectively A mechanism, an image processing unit that obtains component-side imaging data output from the component-side camera and board-side imaging data output from the substrate-side camera and performs image processing, and an image processed by the image processing unit An image processing system for a component mounter having a monitor unit to be displayed above,
A first image processing function in which an image processing unit generates a contour image including only a contour of a solder bump obtained from component-side imaging data, and a contour image including only a contour of a land electrode obtained from board-side imaging data And a third image processing function for generating a composite image in which the contour images of the solder ball and the land electrode are superimposed on each other. .

  The main means of the present invention facilitates the positioning of the solder ball and the land electrode by performing pattern matching between the solder ball contour image and the land electrode contour image while visually observing the composite image displayed on the monitor screen. Can be done.

  In addition, another means of the present invention is obtained by adding a means that the contour image has an annular shape to the above main invention.

  In the above means, the outer edge (edge) of the solder ball or land electrode is formed by using the contour image processed into an annular shape, as compared with the case where the image is taken using the solder ball or land electrode as it is. Since it becomes easier to catch more reliably, pattern matching can be performed easily and in a short time.

  According to another aspect of the present invention, the first image processing function includes the function of coloring the contour image of the solder ball in the first color, and the second image processing function converts the contour image of the land electrode to the first color. This includes a function of including a function of coloring a second color different from the color. For example, it is preferable that one of the first color and the second color is blue and the other is red.

  In the above means, the outer edge (edge) of the solder ball and the land electrode can be visually distinguished by coloring the solder ball outline image and the land electrode outline image in different colors, so that pattern matching can be performed with higher accuracy.

  According to another aspect of the present invention, in any one of the above-described means, the movable head unit includes a suction bide for sucking and fixing the electronic component and a heating head for bonding by heating the electronic component. Is added.

  In the above means, after pattern matching, the electronic component can be directly joined (soldered) on the substrate, and in the rework apparatus, the electronic component that needs to be replaced can be removed from the substrate.

  Further, according to another means of the present invention, in any one of the above means, the movable table is provided with a Y table that can slide horizontally along the Y-axis direction and an X table that can slide horizontally along the X-axis direction. It is a thing which added the means of having and comprising.

  In the above means, the land electrode on the substrate can be arranged directly under the solder bump of the electronic component by easily adjusting the coordinate position of the substrate.

  According to another aspect of the present invention, any one of the above means is provided with a means for providing a manual operation unit capable of moving the movable table.

  In the above means, the pattern matching operation can be performed with higher accuracy by finely adjusting the movable table while visually observing the composite image displayed on the screen of the monitor unit.

According to the present invention, pattern matching between a solder bump (connection electrode) of an electronic component and a land electrode of a substrate can be performed easily, quickly, reliably and with high accuracy.
After the pattern matching, the electronic component can be directly joined (soldered) on the substrate. Further, in the rework device, it is possible to reliably remove the electronic component that is mounted on the substrate and requires replacement.

  In addition, the coordinate position of the board can be determined by performing pattern matching while visually observing a composite image obtained by processing image data obtained by directly imaging the arrangement of the solder bumps of the electronic components to be bonded and the arrangement of the land electrodes of the board. Therefore, the positional deviation between the solder bump and the land electrode can be reduced, and as a result, the occurrence of defective solder can be suppressed.

It is a schematic block diagram of the rework apparatus for printed circuit boards provided with the function of a component mounting machine as an Example of this invention. It is a flowchart which shows an image processing function. The image of the bottom face of an electronic component is shown, A is the schematic of the component side imaging data which the component side camera acquired, B is the schematic of the solder bump outline image. An image of the substrate surface is shown, A is a schematic diagram of substrate-side imaging data acquired by the substrate-side camera 9, and B is a schematic diagram of a land electrode contour image. The schematic of the composite image of a solder bump outline image and an electrode outline image is shown, A shows the state immediately before overlapping and B shows the state after overlapping.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a schematic configuration diagram of a printed circuit board rework apparatus having a function of a component mounter as an embodiment of the present invention.
This rework apparatus 100 for printed circuit boards failed as a result of inspection, and caused a series of repair operations (that is, failed) for a printed circuit board (hereinafter simply referred to as “substrate”) 1 that had to be replaced. Remove electronic parts such as BGA and CSP, clean the solder on the removed board, apply new solder to the board, supply new electronic parts 2 to the board, and the new electronic parts When a worker performs a series of repair operations on a substrate such as soldering, the repair operation is suitably assisted. In other words, the printed circuit board rework device 100 allows a worker to perform a series of repair operations on the substrate continuously with one device without requiring special experience and skill from the worker. Designed to be able to.

  This printed circuit board rework apparatus 100 is capable of positioning each coordinate position of two horizontal axes (X axis and Y axis) perpendicular to each other with high accuracy, and a movable table 3 that clamps and fixes the board, It has a suction bit 5 that holds the electronic component 2 by vacuum suction and a joining means such as a heater, and has a heating head 6 that heats the held electronic component 2 and is movable with respect to the vertical Z-axis. At the same time, the movable head portion 4 that can rotate around the Z axis, and the component-side camera 8 that can photograph the solder bump (connecting electrode) 2a provided mainly on the bottom surface of the electronic component 2 and the surface of the substrate 1 mainly. And a substrate-side camera 9 capable of taking an image of the land electrode 1a provided in the camera, and provided between the movable table 3 and the movable head unit 4 so as to move forward and backward along one horizontal direction (Y-axis direction). Unit section And a drive mechanism 10 that moves the movable table 3 and the movable head portion 4 relatively in a three-dimensional direction and linearly moves the camera unit portion 7, a vacuum pump for vacuum suction of the suction bit 5, and the like. An image for processing the image data transferred from the suction mechanism 11, the heating mechanism 12 that raises the heating head 6 to a predetermined temperature at which the solder melts, and the component-side camera 8 and the board-side camera 9 in the camera unit 7. The image forming apparatus includes a processing unit 13, a monitor unit 14 that displays an image processed by the image processing unit 13 on a screen, a control unit 15 that controls each mechanism and each unit, and the like.

The movable table 3 has a configuration in which an X table that can be slid horizontally along the X-axis direction is further disposed on a Y table that is slidable horizontally along the Y-axis direction. Therefore, as described later, the coordinate position of the substrate 1 in the XY direction can be positioned with high accuracy.
The drive mechanism 10 is connected to a manual operation unit 16 including, for example, a rotary first adjustment knob (not shown) and a second adjustment knob (not shown), and one of the first adjustment knobs is connected. It is possible to slide the Y table horizontally along the Y-axis direction (also referred to as the front-rear direction) by rotating the forward or reverse direction by operating the The movable table 3 can be slid horizontally along the X-axis direction (also referred to as the left-right direction) by operating and rotating in the forward or reverse direction. Therefore, the operator can finely adjust the coordinate position of the substrate 1 clamped on the movable table 3 by operating the first adjustment knob and the second adjustment knob of the manual operation unit 16. It has become.

  The heating head 6 is provided at the lower end of the movable head portion 4, and the suction bit 5 is provided at the center of the heating head 6. The movable mechanism 4 sucks and holds the electronic component 2 by driving the suction mechanism 11 in a state where the lower surface of the heating head 6 is in contact with the electronic component 2 and vacuum-sucking it via the suction bit 5. Is possible. Further, by stopping the suction mechanism 11 and releasing the vacuum suction from the suction bit 5, the suction holding of the electronic component 2 by the movable head portion 4 is released. Then, by performing a suction holding / holding release operation by the movable head unit 4, a lifting / lowering operation and a rotation operation of the movable head unit, and a moving operation of the movable table 3 in two horizontal directions (XY directions), an electronic device described later is performed. It is possible to perform the mounting operation of the component 2.

  In addition, the movable head unit 4 can heat the electronic component 2 via the heating mechanism 12 and the heating head 6 at the lower end. The electronic component 2 held by the movable head unit 4 is lowered with respect to the substrate 1 clamped on the movable table 3, the solder bump 2 a is brought into contact with the land electrode 1 a, and the electronic component 2 is heated via the heating head 6. As a result, the solder bumps 2a are melted and solder-bonded to the land electrodes 1a, whereby the electronic component 2 is mounted on the substrate 1.

  The camera unit section 7 is configured by fixing a pair of board cameras on both upper and lower surfaces of a movable arm provided to be movable forward and backward, with the lenses facing in opposite directions, and the upper board camera is mounted on the component side. The camera 8 and the board camera on the lower side constitute the board-side camera 9, respectively. The board camera has a function of converting an image of a subject input via a lens into an electrical signal via a CCD or CMOS sensor having a high pixel count and outputting it as image data.

  The image processing unit 13 includes a storage unit that holds image data transferred from the camera unit unit 7 and an arithmetic unit that performs arithmetic processing on various data, and executes processing functions to be described later.

Next, a method for mounting the electronic component 2 on the board 1 using the function of the component mounting machine provided in the printed circuit board rework apparatus 100 will be described.
The movable head portion 4 that holds the new electronic component 2 by suction is set in the mounting start state shown in FIG. That is, the movable head unit 4 that holds the new electronic component 2 at a position directly below the Z axis of the movable head unit 4 is set to a predetermined height position in the Z axis direction, and the rotation angle around the Z axis is also a predetermined level. It is set to an angle. A solder paste is transferred to the solder bumps 2a of the electronic component 2 as necessary. Further, the movable table 3 that clamps the substrate 1 is driven via the drive mechanism 10, and the center portions of the plurality of land electrodes 1 a on the substrate 1 are set to be located directly below the Z axis of the movable head portion 4. .

Next, as shown in FIG. 1, the control unit 15 drives the drive mechanism 10 to advance the camera unit unit 7 into a space where the substrate 1 and the electronic component 2 face each other. The bottom surface of the electronic component 2 is photographed by the component-side camera 8 provided on the upper side, and the land electrode 1a on the surface of the substrate 1 is photographed by the substrate-side camera 9 provided on the lower side.
The component-side imaging data 21 (see FIG. 3A) of the bottom surface of the electronic component 2 from the component-side camera 8 and the substrate-side imaging data 31 (see FIG. 4A) of the substrate 1 surface from the substrate-side camera 9 are the image processing unit 13. Input in real time.

  FIG. 2 is a flowchart showing an image processing function executed by the image processing unit, FIG. 3 shows an image of the bottom surface of the electronic component, A is a schematic diagram of component-side imaging data acquired by the component-side camera, and B is a solder bump contour image FIG. 4 is a schematic diagram of the substrate surface, FIG. 4A is a schematic diagram of the substrate-side imaging data acquired by the substrate-side camera 9, and B is a schematic diagram of the land electrode outline image. FIG. 5 is a schematic view of a composite image of the solder bump contour image and the electrode contour image, where A indicates a state immediately before overlapping and B indicates a state after overlapping.

As shown in FIGS. 2 to 3, upon receiving a command from the control unit 15, the image processing unit 13 captures the outline of each solder bump 2 a obtained from the component-side imaging data 21 and forms an annular shape (both ring-shaped). The first image processing function S1 for generating the solder bump outline image 22 (see FIG. 3B) consisting only of the outline 23 is executed. At the same time, the image processing unit 13 performs the individual land obtained from the board-side imaging data 31. The second image processing function S2 for capturing the contour of the electrode 1a and generating a land electrode contour image 32 (see FIG. 4B) consisting only of an annular (also called ring-shaped) contour 33 is executed.
Further, the image processing unit 13 executes a third image processing function S3 for generating a composite image 40 (see FIGS. 5A and 5B) in which the solder bump outline image 22 and the land electrode outline image 32 overlap. Then, the control unit 15 displays the composite image 40 on the screen of the monitor unit 14.

Here, the solder bump contour image 22 on the electronic component 2 side is displayed as a reference image without movement, and the land electrode contour image 32 on the substrate 1 side is movable so as to be movable in the horizontal direction (X direction and Y direction). Displayed as an image. When the operator operates the manual operation unit 16 to move the movable table 3, only the land electrode contour image 32, which is a moving image, can be moved in conjunction with this movement. Therefore, as shown in FIGS. 5A and 5B, the operator operates the manual operation unit 16 and finely adjusts the movable table 3 while visually observing the composite image 40 displayed on the monitor unit 14. The coordinate position of the substrate 1 can be determined by performing a pattern matching operation for superimposing the land electrode contour image 32 on the solder bump contour image 22.
In particular, by using an image formed in an annular shape, each outer edge (edge) of the annular contour 23 of the solder bump 2a and the annular contour 33 of the land electrode 1a can be captured more reliably. Matching work can be performed easily and quickly.

In the present invention, the first image processing function S1 includes a coloring function for coloring the individual contours 23 constituting the solder bump contour image 22 to a first color (for example, red), and the second image processing function S2 is a land electrode contour. It is preferable to include a coloring function for coloring the individual contours 33 constituting the image 32 to a second color (for example, blue) different from the first color.
As a result, the operator can configure the individual contours 23 of the solder bump electrodes 2a made of the first color (blue) and the individual contours 33 of the land electrodes 1a made of the second color (red) constituting the composite image 40. By visually perceiving the difference from the third color (reddish purple) generated as an overlapping portion of each other and finely adjusting the movable table 3 so that the third color (reddish purple) does not appear, Can be superimposed with high accuracy.
Also, the outer edge (edge) of each contour 23 of the solder bump electrode 2a colored in the first color (blue) and the outer edge (edge) of each contour 33 of the land electrode 1a colored in the second color (red). Since it becomes easy to distinguish visually, pattern matching between the solder bump outline image 22 and the land electrode outline image 32 can be performed with higher accuracy.
Therefore, the coordinate position of the substrate 1 can be positioned with high accuracy by pattern matching work. As a result, the solder bumps 2a of the upper electronic component 2 and the land electrodes on the lower substrate 1 face each other with high accuracy. It can be easily set in a state of mutual contact.

When the pattern matching operation is completed, the camera unit 7 is retracted from the space where the substrate 1 and the electronic component 2 face each other, and is moved to a standby position (not shown).
Next, the control unit 15 lowers the movable head unit 4 to bring the individual electronic component 2 solder bumps 2a into contact with the individual land electrodes 1a of the substrate 1, and drives the heating mechanism 12 to heat the heating head 6. In this state, the solder is melted, and the solder bump 2a and the land electrode 1a are soldered (joining operation).
After the joining work is completed, the control unit 15 stops the suction mechanism 11 to release the holding of the electronic component 2 and raises the movable head unit 4 to return to the initial height position. Then, when the operator removes the substrate 1 from the movable table 3, the mounting operation of the electronic component 2 is completed.

  As mentioned above, although the structure of this invention and its effect were demonstrated along the Example, embodiment of this invention is not limited to the said Example.

  In the above embodiment, an example of a rework apparatus for a printed circuit board having a function of a component mounting machine has been shown and described. However, the embodiment of the present invention is not limited to the above embodiment, and the component mounting without the rework function is performed. Of course, it may be a machine.

  In the above embodiment, the case where the first color is blue and the second color is red has been described. However, the embodiment of the present invention is not limited to the above embodiment, and other color combinations are possible. It may be. Alternatively, only one of the first color and the second color may be colored. Depending on the state of the substrate that is the work target, it is preferable that only one of the outer edges (edges) of the contour is colored because there is less change from the existing state. As an example, the substrate side image may remain uncolored and a combination of coloring only the component side outline may be used.

  Further, in the above-described embodiment, the configuration has been described in which the operator finely adjusts the coordinate position of the substrate 1 clamped on the movable table by operating the manual operation unit. Is not limited to the above embodiment, and may be configured to be automatically fine-tuned by the control of the control unit.

  For example, in the above embodiment, the case where the movable table 3 moves in the horizontal direction and the movable head unit 4 moves up and down has been described, but the movable head unit moves in the horizontal direction and the movable table can move in the up and down direction. It is good also as a simple structure. In other words, the movable table 3 and the movable head unit 4 may be relatively moved in the three-dimensional direction by operating the manual operation unit 16 or automatically.

  The image processing system for a component mounter of the present invention can be used in a wider area in the field of mounting electronic components such as BGA and CSP on a printed circuit board.

1: Board (printed circuit board)
1a: Land electrode 2: Electronic component 2a: Solder bump (connection electrode)
3: Movable table 4: Movable head unit 5: Suction bit 6: Heating head 7: Camera unit unit 8: Component side camera 9: Substrate side camera 10: Drive mechanism 11: Suction mechanism 12: Heating mechanism 13: Image processing unit 14 : Monitor unit 15: Control unit 16: Manual operation unit 21: Component side imaging data 22: Solder bump outline image 23: Solder bump outline 31: Board side imaging data 32: Land electrode outline image 33: Land electrode outline 40: Composite image S1: First image processing function S2: Second image processing function S3: Third image processing function

Claims (7)

A component side for photographing the arrangement of a movable head portion for holding an electronic component, a movable table for holding a substrate on which the electronic component is mounted, and a solder bump provided on the bottom surface of the electronic component held by the movable head portion A camera unit provided with a camera on the substrate and a substrate-side camera for photographing the arrangement of the land electrodes formed on the substrate, and a drive for moving the movable head, the movable table, and the camera unit, respectively A mechanism, an image processing unit that obtains component-side imaging data output from the component-side camera and board-side imaging data output from the substrate-side camera and performs image processing, and an image processed by the image processing unit An image processing system for a component mounter having a monitor unit to be displayed above,
The image processing unit has a first image processing function for generating a contour image consisting only of the contour of a solder bump obtained from component-side imaging data, and a contour consisting of only the contour of a land electrode obtained from board-side imaging data. A component mounter comprising: a second image processing function for generating an image; and a third image processing function for generating a composite image in which contour images of the solder balls and the land electrodes are superimposed on each other Image processing system.   The image processing system for a component mounting machine according to claim 1, wherein the contour image has an annular shape.   The first image processing function includes a function of coloring a contour image of the solder ball in a first color, and the second image processing function colors the contour image of the land electrode in a second color different from the first color. The image processing system for a component mounting machine according to claim 1 or 2, comprising a function.   The image processing system for a component mounter according to claim 3, wherein one of the first color and the second color is blue and the other is red.   The image processing for a component mounting machine according to any one of claims 1 to 4, wherein the movable head unit includes a suction bit for sucking and fixing the electronic component and a heating head for bonding by heating the electronic component. system.   The movable table includes a Y table that is slidable horizontally along the Y-axis direction and an X table that is slidable horizontally along the X-axis direction. An image processing system for a component mounting machine described in 1.   The image processing system for a component mounting machine according to any one of claims 1 to 6, further comprising a manual operation unit capable of moving the movable table.

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