JP2020004786A - Printed circuit board rework apparatus and rework method using the same - Google Patents

Abstract

To provide a printed circuit board rework apparatus that can easily and reliably remove a chip component and a rework method using the same.SOLUTION: A printed circuit board rework apparatus 10 that performs a series of repair operations for attaching a new chip part 21 after removing a chip part 21 to be reworked from a printed circuit board 20 includes at least a rework jig 1 configured with one or more needles 2 hanging down toward the printed circuit board 20, lifting and lowering means 16 for supporting the rework jig 1 such that the rework jig 1 can be lifted and lowered, a thermosetting adhesive attached to the tip of the needle 2, and heating means 17 for heating the printed circuit board 20 to melt a solder.SELECTED DRAWING: Figure 1

Description

  The present invention prints a series of repair work on a printed circuit board, such as removing a chip component to be repaired from a substrate, cleaning residual solder on the substrate after the removal, mounting a new chip component on the substrate, and soldering a new chip component. The present invention relates to a substrate rework apparatus and a rework method using the same.

  Repair from semiconductor devices such as semiconductor integrated circuits (ICs) and large-scale integrated circuits (LSIs), or printed circuit boards on which semiconductor elements and electric elements (chip components) such as transistors, diodes, resistors and capacitors are mounted at high density. 2. Description of the Related Art There is known a printed circuit board rework apparatus that supports a repair operation such as removing a target IC or chip component and attaching a new non-defective IC or chip component.

  Such a rework apparatus involves an operation of removing a chip component from a printed circuit board. For example, a rework apparatus disclosed in Patent Document 1 sucks an upper surface of a chip component to be removed by a vacuum nozzle, and prints the chip component in this state. After the solder between the substrates is heated and melted by hot air or the like, the chip components are removed from the printed circuit board by moving the vacuum nozzle upward.

  By the way, printed circuit boards used in recent high-performance communication terminal equipment and the like tend to be miniaturized, and ICs and chip components mounted on the printed circuit boards also tend to be miniaturized. As an example, a chip component commonly used as a 0402 type has a lateral dimension of 0.4 mm (= 400 micrometers) and a vertical dimension of 0.2 mm (= 200 micrometers). It is extremely difficult to do.

Such a minute chip component has an extremely small area of the upper surface where the vacuum nozzle sucks. Further, since the surface tension of the solder in the molten state acts as a resistance force when lifting the chip component, it is necessary to suck the chip component with a suction force larger than the resistance force.
However, as the chip component becomes smaller in size, it tends to be more difficult to secure the suction force required to hold the chip component by suction. There is a problem that there is a limit to the method of sucking chip components with a vacuum nozzle.

  On the other hand, to remove chip components from the printed circuit board, a camera attached to the rework device takes an image of the vicinity of the micro chip components and uses a pin-shaped picking tool, so-called set pin (tweezer), while enlarging and displaying it on the monitor (See, for example, Patent Document 2).

The rework apparatus described in Patent Document 2 employs a heating mechanism 12 for turning on and heating a halogen lamp on the upper surface of a substrate when removing and attaching a chip component from the substrate, and a bottom heater 120 having a ceramic heater 124 disposed on the lower surface of the substrate. Is heating.
In the work of removing the chip component using this reworking device, the operator takes an image of the vicinity of the chip component with the camera 14 installed right above the set pin 40 and looks at the monitor, while using the rotary handle 62 to rotate the head component in the X direction. The position of the pin tip 401 of the set pin 40 and the chip component are aligned (positioned) in the X-Y direction while operating the moving mechanism with the rotary handle 94 to operate the substrate Y-direction moving mechanism. When the alignment is completed, the heating mechanism 12 is moved above the set pins 40 to turn on the halogen lamp and heat the substrate. Subsequently, the pin tip 401 of the set pin 40 is lowered to the height position of the chip component while operating the elevating mechanism of the head unit 10 with the handle 20, and then the pin tip 401 is closed while operating the opening and closing mechanism with the handle 30. To hold the chip components from both sides. Then, the set pin 40 holding the chip component is raised while operating the lifting mechanism of the head unit 10 by the handle 20, and the chip component is removed from the printed circuit board.

JP-A-2004-260053 JP 2011-129647 A

  However, in the method of holding the chip component from both sides with the set pins 40 and removing the chip component, when the chip components are held from both sides and when the chip component held between the set pins 40 is removed, the pin of the set pin 40 must be used. Since the tip 401 must be opened and closed, it is necessary to secure a space for that.

However, since the set pin 40 is usually formed so that the upper part of the pin tip 401 gradually widens toward the upper end, the height of the other IC or chip component arranged adjacent to the chip component to be removed is higher. If the chip component is higher than the chip component to be removed, the set pin 40 can easily come into contact with the next tall chip component, making it difficult to remove the chip component using the set pin 40 from the printed circuit board. Problem.
Further, in a printed circuit board on which a large number of minute chip components are densely arranged, there is a problem that a gap between adjacent chip components is narrow, and it is difficult to secure a space for opening and closing the pin tip 401.

  SUMMARY OF THE INVENTION The present invention has been devised in order to solve the above-described problems in the prior art, and has created a reworking apparatus for a printed circuit board and a reworking method using the same, which can easily and reliably remove chip components from the printed circuit board. The task is to

Among the means for solving the above problems, the first main means of the present invention is:
A printed circuit board rework apparatus for performing a series of repair work for attaching a new chip part after removing a chip part to be reworked from the printed board,
At least a rework jig configured to have at least one needle hanging down toward a printed circuit board, elevating means for supporting the rework jig so as to be able to move up and down, and thermosetting attached to the tip of the needle And a heating means for heating the printed circuit board to melt the solder.
In the main means of the present invention, the chip component to be reworked is fixed by using a thermosetting adhesive attached to the tip of the needle, so that it is easy and reliable simply by pulling up the chip component or the fixed needle. And removing the chip component from the printed circuit board.

In addition, another means of the present invention further includes a means that the curing temperature of the thermosetting adhesive is set to a temperature higher than room temperature and lower than a melting temperature of solder to the main means. It is a thing.
With the above means, it is possible to achieve that the thermosetting adhesive is cured before the solder is melted, and the chip component is fixed to the tip of the needle.

Further, another means of the present invention is obtained by adding a means for providing an XY table for moving a printed board in two horizontal directions to any one of the above means.
According to the above-described means, it is possible to achieve alignment in two horizontal directions between the chip component on the printed board and the tip of the needle.

According to another aspect of the present invention, any one of the above means includes a camera capable of photographing a tip of a needle to which a thermosetting adhesive is attached and a chip component on a printed circuit board. A photographing means arranged to be able to move forward and backward between the substrate and the substrate.
In the above-described means, the position of the tip part of the needle and the tip part of the needle on the printed circuit board can be precisely aligned in two horizontal directions by adjusting while viewing the image of the monitor section taken through the camera.

The second main means of the present invention is:
A rework jig configured with a needle with a thermosetting adhesive attached to the tip, elevating means for supporting the rework jig so as to be able to move up and down, and melting solder on a printed circuit board on which chip components are mounted Heating means, and a rework method using a printed circuit board rework device comprising:
At least, a step of lowering the rework jig using the lifting / lowering means to bring the tip of the needle into contact with the chip component, and interposing a thermosetting adhesive between the tip of the needle and the chip component,
Heating the printed circuit board using a heating means,
A step of curing the thermosetting adhesive before the solder on the printed board is melted and fixing the chip component to the tip of the needle,
Lifting the rework jig by means of lifting and lowering, and removing the chip component fixed to the tip of the needle from the printed circuit board.
According to the second main means of the present invention, it is possible to fix the tip between the tip of the needle and the chip component before the solder is melted, that is, when the chip component is fixed on the printed circuit board. Adhesion failure between the tip of the chip and the chip component can be eliminated. Further, the chip component can be easily removed from the printed circuit board by a simple operation of merely raising the rework jig.

Further, another means of the present invention, the second main means, before the step of interposing a thermosetting adhesive, has a step of applying alcohol or spraying nitrogen to solder on a printed circuit board, Means.
According to the above-described means, since a sharp corner which is easily formed on the solder remaining on the land at the rework position after the chip component is removed can be eliminated, it is possible to easily mount the new chip component at the rework position. .

Further, another means of the present invention, in any one of the above means, after the step of removing the chip component from the printed board,
A step of applying cream solder to the surface of the solder remaining on the land at the rework position after the chip component is removed on the printed circuit board, and a step of supplying a new chip component onto the land and soldering And means for providing.
Also in the above means, the shape of the solder remaining on the land can be further made substantially spherical, so that the soldering of the new chip component to the rework position can be facilitated.

The present invention has the above-described configuration, and has the following effects.
With the printed circuit board rework apparatus and the rework method using the same of the present invention, a chip component to be reworked can be fixed using a thermosetting adhesive attached to the tip of the needle, and the needle is fixed after the fixation. The chip component can be easily and reliably removed from the printed board simply by pulling it up.

BRIEF DESCRIPTION OF THE DRAWINGS The outline of the rework apparatus for printed circuit boards of this invention is shown, A is a front view and B is a side view. It is a front view which shows the outline of the rework jig mounted in the rework apparatus for printed circuit boards. It is a side view which decomposes | disassembles and shows the outline of a rework jig. It is explanatory drawing which shows the removal process of a chip component using the rework apparatus for printed circuit boards. It is explanatory drawing which shows the attachment process of the new chip component using the rework apparatus for printed circuit boards.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 schematically shows a printed circuit board rework apparatus of the present invention, wherein A is a front view, B is a side view, FIG. 2 is a front view schematically showing a rework jig mounted on the printed board rework apparatus, and FIG. FIG. 4 is an exploded side view schematically showing a rework jig.

  As shown in FIG. 1, a printed circuit board reworking apparatus (hereinafter, appropriately referred to as a reworking apparatus) 10 of the present invention performs a series of reworking operations on a chip component that needs to be replaced when the operator performs the reworking operation. It assists suitably. The rework apparatus 10 is mounted on the printed board 20 and an XY table 11 capable of moving the printed board 20 to respective coordinate positions on the X axis in the left-right direction and the Y axis in the front-rear direction and performing high-precision positioning. An imaging means 12 capable of imaging the tip (lower end) of a small chip component 21 (see FIG. 4) to be reworked and a needle 2 suspended from a rework jig 1 to be described later; A monitor section 14 capable of displaying images of the tips of the needles 2 individually or at a desired resolution / magnification or in a state where the images are superimposed on each other; A movable unit 13 that can move the rework device 10 vertically; a lifting / lowering unit 16 that moves the movable unit 13 up and down along the vertical direction (Z-axis direction); It is configured to include a heating means 17 to melt the solder and heating the fine chip components 21.

  The XY table 11 has a configuration in which a Y table 11b for fixing the printed circuit board 20 is further installed on an X table 11a installed on a work table of the rework device 10, and the X table 11a is moved in the X-axis direction. In addition, since the Y table 11b moves horizontally in the Y-axis direction orthogonal to the Y table 11b, highly accurate positioning in the XY directions is possible.

The photographing means 12 includes, for example, a CCD camera and a light guide unit including a half mirror and a reflection mirror for guiding an image to the CCD camera. Alternatively, it is configured to have two CCD cameras capable of separately photographing the upper and lower sides. An upper window is provided on the upper surface facing the rework jig 1, and a lower window is provided on the lower surface facing the printed circuit board 20.
The photographing means 12 is provided so as to be able to advance and retreat by a slide mechanism (not shown) arranged between the rework jig 1 and the printed circuit board 20. The light reflected on each surface of the printed circuit board 20 and the rework jig 1 is simultaneously received by the CCD camera, converted into a predetermined electric signal, subjected to predetermined signal processing, and transmitted to the monitor unit 14 as an image signal. The monitor unit 14 displays the received image signal as a two-dimensional image at a predetermined resolution and magnification.

  In the monitor unit 14, an image obtained by photographing the rework jig 1 from the viewpoint of the printed circuit board 20 from below and an image obtained by photographing the chip components on the printed circuit board 20 from the upper side are individually or superimposed by the operator's selection. It can be displayed as a composite image. Thus, the operator moves the printed circuit board 20 on the XY table 11 in the X and Y directions while watching the monitor image, and moves the printed circuit board 20 between the rework jig 1 and the chip component 21 to be reworked. It is possible to correct the positional deviation and perform positioning between the rework jig 1 and the printed circuit board 20. As described above, the photographing unit 12 creates a real-time image signal on the same coordinate plane of the rework jig 1 and the printed circuit board 20, while the monitor unit 14 displays the image signal as a two-dimensional image. Therefore, the worker can use this two-dimensional image as two-dimensional position information between the rework jig 1 and the printed circuit board 20.

  After the positioning of the printed circuit board 20 with respect to the rework jig 1, the photographing means 12 is pulled rearward by a slide mechanism movable in the front-rear direction Y axis so as not to hinder the rework operation, and at a predetermined position. stand by. Thereby, the rework jig 1 attached to the movable portion 13 that is movable along the vertical Z axis can be lowered to a position where it comes into contact with the chip component 21 to be reworked.

As shown in FIGS. 2 and 3, the rework jig 1 includes a disposable needle (needle) 2 and a clamp member 5 including a clamp body 3 and a clamper 4 for holding the needle 2. Is done. The clamp body 3 is formed in a rectangular shape, and an installation portion 3A formed by cutting the clamp body 3 into approximately half is formed at the lower end position. A single groove 3a extending in the vertical direction is formed at the center of the installation portion 3A, and a pair of screw holes 3b are formed at the left and right sides of the groove 3a.
The clamper 4 is formed of, for example, a plate-shaped cut piece that remains when the clamp body 3 is cut into approximately half. A single groove 4a extending in the vertical direction is formed at the center of the clamper 4, and a pair of screw holes 4b is formed at the left and right sides of the groove 4a.
Then, the needle 2 is arranged between the groove 3a on the clamp body 3 side and the groove 4a on the clamper 4 side, and the screw 6 is inserted into a pair of screw holes 3b, 4b with the clamper 4 facing the installation portion 3A. By screwing, the needle 2 is sandwiched between the installation portion 3A on the clamp body 3 side and the clamper 4.

  The heating means 17 is provided in the vicinity of the rework jig 1 and is a hot air heater (not shown) for directly heating the chip component by blowing hot air of about 240 ° C. from the front side of the printed circuit board 20 to heat the chip component. 11 and a far-infrared heater 17B for heating the back side of the printed circuit board 20 to about 240 ° C., and using both of them to heat the printed circuit board 20 simultaneously from both the front and back sides. By doing so, it is possible to melt the solder in a short time.

  Although not shown in the drawings, the rework apparatus 10 is provided with a well-known vacuum nozzle 30 (see FIG. 5) as a supply unit for supplying a new chip component to an arbitrary position on a printed circuit board. I have. When a new chip component is shared with the printed circuit board 20, there is no problem in supplying the new chip component using the vacuum nozzle 30 because the resistance force due to the surface tension of the solder does not act.

  Next, a step of a chip component removing operation in the rework method using the printed board rework apparatus 10 will be described with reference to FIG.

First, the rework jig 1 having the needle 2 clamped by the clamp member 5 is fixed to the movable portion 13. Then, a thermosetting adhesive a is attached to the tip (lower end) of the needle 2. For example, the tip of the needle 2 can be attached by immersing it in a container containing the thermosetting adhesive a.
Subsequently, after fixing the printed circuit board 20 on the XY table 11 of the printed circuit board rework apparatus 10, the printed circuit board 20 is moved in the XY direction using the XY table 11 and the operation unit 15, and the monitor is operated. Utilizing the two-dimensional position information between the rework jig 1 and the printed circuit board 20 displayed on the part 14, the tip of the needle 2 provided on the rework jig 1 and the target to be reworked on the printed circuit board 20 to be removed should be removed The printed circuit board 20 is positioned so that the chip component 21 overlaps the screen of the monitor unit 14. The position on the printed circuit board 20 to which the chip component 21 to be removed to be removed is soldered is referred to as a rework position P.

Next, as shown in FIG. 4A, if necessary, alcohol 41 is applied to the surface of the solder 22 fixing the chip component 21 to be reworked on the printed circuit board 20 or nitrogen gas (N ₂ It is preferred to carry out spraying of gas). The application of the alcohol 31 or the spraying of nitrogen gas on the surface of the solder 22 makes it difficult to form sharp corners on the solder 22 remaining on the land 23 after the chip component 21 is removed, and the solder 22 is rounded. This is to facilitate the formation of a substantially spherical shape.
Next, as shown in FIG. 4 (b), the movable part 13 is lowered using the elevating means 16 constituting the rework device, and the tip of the needle 2 to which the thermosetting adhesive a is adhered is subjected to rework. Is brought into contact with the upper surface of the chip component 21. Thereby, the thermosetting adhesive a is interposed between the upper surface of the chip component 21 and the tip of the needle 2. Specifically, the thermosetting adhesive a is transferred from the tip of the needle 2 to the upper surface of the chip component 21, and the tip of the needle 2 is placed in the thermosetting adhesive a formed in a hemispherical shape on the upper surface of the chip component 21. Intervenes in a buried state.
In this state, the printed circuit board 20 is heated from both front and back sides by using the heating means 17 to melt the solder 22 fixing the chip component 21 on the land 23. At this time, since the curing temperature of the thermosetting adhesive a is higher than normal temperature and lower than the melting temperature of the solder 22, the thermosetting adhesive a is cured before the solder 22 melts, The chip component 21 is firmly fixed to the tip.

Then, as shown in FIG. 4 (c), the movable part 13 is raised using the lifting / lowering means 16 to pull up the chip component 21 fixed to the tip of the needle 2, thereby attaching the chip component 21 to the printed circuit board 20. It can be easily removed from the rework position P.
In this method, since the rework jig 1 provided with the needle 2 only needs to be raised linearly along the vertical direction, the chip components 21 are densely arranged, and the gap between the adjacent chip components 21 is narrow. Even in this case, the chip component 21 to be reworked can be reliably removed.
After the chip component 21 has been removed, the clamp member 5 holding the needle 2 is removed from the rework jig 1, and the screw 6 of the clamp member 5 is further unscrewed so that the tip end is located between the clamp member 3 and the clamper 4. The needle 2 to which the top part 21 is fixed is removed. Then, a new needle 2 is clamped by the clamp member 5 as necessary to prepare for the next operation.

Next, a process of attaching a new chip component in a rework method using the printed circuit board rework apparatus 10 will be described with reference to FIG.
As shown in FIG. 5A, when a sharp corner 22a (see FIG. 4C) is formed on the solder 22 remaining on the land 23 at the rework position P, the surface of the solder 22 is formed. , A paste-like cream solder (not shown) is applied. Thus, the sharp corners formed in the solder 22 are eliminated, and the shape of the solder 22 can be made to be a rounded and substantially spherical shape.
Next, the vacuum nozzle 30 is attached to the rework jig 1 from which the clamp member 5 has been removed, and the new chip component 21 is sucked and sucked by the vacuum nozzle 30, and the new chip component 21 is attached to the printed circuit board 20 in the same manner as described above. It is positioned at the upper rework position P. Then, as shown in FIG. 5B, the vacuum nozzle 30 is lowered, and the new chip component 21 is placed at the rework position P on the printed circuit board 20. Since the solder 22 on the land 23 is in a molten state, the terminals 21a of the new chip component 21 and the lands 23 are soldered.
Then, the suction of the vacuum nozzle 30 is stopped and raised, whereby the mounting of the new chip component 21 to the rework position P on the printed circuit board 20 is completed.

  As described above, according to the printed circuit board reworking apparatus 10 and the reworking method using the same, when the gap between the adjacent chip parts 21 is narrow, or when the chip parts arranged adjacent to the tall parts, 21 can be easily and reliably removed.

As described above, the configuration of the present invention and the operation and effect thereof have been described with reference to the examples. However, the embodiments of the present invention are not limited to the above examples.
For example, in the above-described embodiment, the number of the needles 2 to be clamped by the clamp member 5 has been described as one, but a plurality of needles are clamped by the clamp member 5 and a plurality of chip components 21 can be simultaneously removed. It is good.

  Further, in the above embodiment, the photographing means 12 which is disposed between the rework jig 1 and the printed board 20 so as to be able to advance and retreat, photographs the tip of the needle from below, and photographs the chip component from above has been described. In addition, it is preferable to provide auxiliary photographing means for simultaneously photographing the tip of the needle and the chip component from obliquely above, since positioning is further facilitated.

  Further, the order of each step in the removing operation of the chip component and the order of each step in the attaching operation of the new chip component are not limited to the above-described embodiment, and may be changed as needed.

  INDUSTRIAL APPLICABILITY The rework apparatus for a printed board and the rework method using the same according to the present invention can achieve a wider range of applications in the field of reworking chip components mounted on a printed board.

1: Rework jig 2: Needle 3: Clamp body 3A: Installation part 3a: Groove 3b: Screw hole 4: Clamper 4a: Groove 4b: Screw hole 5: Clamp member 6: Screw 10: Rework device 11: XY table 11a: X table 11b: Y table 12: imaging means 13: movable part 14: monitor part 15: operation part 16: elevating means 17: heating means 17B: far infrared heater 20: printed circuit board 21: chip component 21a: terminal 22: Solder 22a: Corner 23 of solder: Land 30: Vacuum nozzle 31: Alcohol a: Thermosetting adhesive P: Rework position

Claims (7)

A rework apparatus for a printed circuit board, which performs a series of repair operations for attaching a new chip component (21) after removing a chip component (21) to be reworked from the printed circuit board (20),
At least a rework jig (1) including at least one needle (2) suspended from the printed circuit board (20), and the rework jig (1) is supported so as to be able to move up and down. Elevating means (16), a thermosetting adhesive (a) attached to the tip of the needle (2), and a heating means (17) for heating the printed circuit board (20) to melt the solder (22). And a reworking device for a printed circuit board.   The printed circuit board rework apparatus according to claim 1, wherein a curing temperature of the thermosetting adhesive (a) is set to a temperature higher than a normal temperature and lower than a melting temperature of the solder (22).   The rework apparatus for printed circuit boards according to claim 1 or 2, further comprising an XY table (11) for moving the printed circuit board (20) in two horizontal directions.   It has a camera capable of photographing the tip of the needle (2) to which the thermosetting adhesive (a) is attached and the chip component (21) on the printed circuit board (20). 4. The reworking device for printed circuit boards according to claim 1, further comprising a photographing means (12) arranged to be able to move forward and backward between the printed circuit boards (20). A rework jig (1) having a needle (2) having a thermosetting adhesive (a) attached to a tip thereof, and an elevating means (16) for supporting the rework jig (1) so as to be able to elevate and lower. ) And a heating means (17) for melting a solder (22) on a printed circuit board (20) on which a chip component (21) is mounted, using a printed circuit board reworking apparatus (10). hand,
At least the rework jig (1) is lowered using the lifting / lowering means (16) to bring the tip of the needle (2) into contact with the tip component (21), and the tip of the needle (2) and the tip Interposing the thermosetting adhesive (a) with the component (21);
Heating the printed circuit board (20) by the heating means (17);
Curing the thermosetting adhesive (a) before the solder (22) on the printed circuit board (20) melts, and fixing the chip component (21) to the tip of the needle (2);
Raising the rework jig (1) using the lifting / lowering means (16), and removing the chip component (21) fixed to the tip of the needle (2) from the printed circuit board (20); A rework method using a printed circuit board rework apparatus, comprising:   6. The rework apparatus for a printed circuit board according to claim 5, further comprising a step of applying alcohol or spraying nitrogen to the solder on the printed circuit board before the step of interposing the thermosetting adhesive. Rework method using. After the step of removing the chip component (21) from the printed circuit board (20),
A step of applying cream solder to the surface of the solder (22) remaining on the land (23) at the rework position (P) after the chip component (21) is removed on the printed circuit board (20); The rework method using the rework apparatus for a printed circuit board according to claim 5, further comprising a step of supplying the component (21) onto the land (23) and soldering the component.