JP2008073743A - Method and structure of soldering cylindrical conductor to metallic body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and structure of soldering a cylindrical conductor to a metallic body by which the soldering can be performed in a uniform state less in quality fluctoation in a short time. <P>SOLUTION: The axis 5a of a conductive pin 5 mounted with an annular solder wire 6 is inserted into the insertion hole 4 of a copper foil 3 which is inserted in the upper face of the conductor 2. Then, the head 5b of the conductive pin 5 is pressed against the copper foil 3 inserted and formed on the insertion hole 4 periphery. The solder wire 6 mounted on the circumferential face of the axis 5a of the conductive pin 5 is held between the head 5b of the conductive pin 5 and the copper foil 3 of the insertion hole 4 periphery. Simultaneously, the solder wire 6 mounted on the circumferential face of the axis 5a of the conductive pin 5 is fused by the copper foil 3 heat stored during the forming. Thus, the entire circumference of the head 5b of the conductive pin 5 is uniformly soldered and connected to the copper foil 3 of the insertion hole 4 periphery, making the soldering structure 1 having an antenna function. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a soldering method and a soldering structure for a rod-shaped conductor of an electronic component in an electronic device used in, for example, an electric device and an automobile.

  2. Description of the Related Art Conventionally, various electronic components and electric elements are mounted on a mounting board mounted on the above-described electric device or automobile. Some of these have the function of a capacitor or antenna that is made by sandwiching a dielectric plate such as ceramics or plastic between two metal plates, and are soldered to the metal plate to supply power to the metal plate. The conductive pins are connected to a printed circuit board having a power feeding circuit.

  As a method for soldering the rod-shaped conductor to the metal plate, for example, as shown in FIGS. 9 and 10, the shaft portion 5 a of the conductive pin 5 is inserted into the insertion hole 4 of the copper foil 3 molded on the upper surface of the dielectric 2. And solder 7 is melted and soldered with a soldering iron 8 so that the entire head 5b of the conductive pin 5 is covered. However, in general, the outer diameter of the lead portion and the pin portion that requires soldering of electronic parts and electronic elements is as fine as about 1 mm. It is necessary to use a soldering iron, be careful not to cause excess or deficiency in the amount of solder, or use a dedicated soldering iron.

  As another soldering method, for example, the tip of the solder thin wire is pressed against the electrode on the printed circuit board by the wedge, and the solder thin wire is pressed by the pressing force and ultrasonic wave applied by the wedge and the heat applied by the heater. There is a lead connection method of an electronic component of Patent Document 1 in which a thermocompression bonding is applied to an electrode.

JP-A-6-326456

  However, since the soldering method as described above generates pores and voids in the dielectric due to the soldering iron that generates heat higher than the melting temperature of the solder, or structural changes due to heat occur in the dielectric, the two metals In a capacitor type element in which a dielectric is sandwiched between plates, there is a drawback that the relative permittivity changes and the electrical characteristics change.

  Further, in the method of soldering the lead portion and pin portion having a small diameter, the solder amount affects the electrical characteristics, so that it is necessary to ensure an even amount of solder. Therefore, it is necessary to devise a soldering iron and a solder supply method so as not to cause an excessive or insufficient amount of solder, and there are problems that work tact time becomes longer due to careful work and variations in quality occur.

  In view of the above problems, the present invention provides a method for soldering a rod-shaped conductor to a metal body, which can be soldered in a short time to a uniform and low quality variation when soldering a metal body and a rod-shaped conductor. And to provide a soldering structure.

  The method of soldering the rod-shaped conductor to the metal body according to the first aspect of the present invention is a method of inserting the rod-shaped conductor into an insertion hole formed in the metal body and soldering the metal body and the rod-shaped conductor. The rod-shaped conductor having the linear solder attached facing the entire peripheral edge of the insertion hole is inserted into the insertion hole of the metal body that is kept at a temperature higher than the temperature at which the linear solder melts. It is characterized by attaching.

  According to the present invention, the rod-shaped conductor with the linear solder attached is inserted into the insertion hole of the metal body, and the linear solder attached to the rod-shaped conductor is melted and soldered by heat retention of the metal body. That is, since the metal body and the rod-shaped conductor are soldered in a short time, it is possible to prevent the conventional structure change of the dielectric material due to reheating, the excessive or insufficient solder amount, and the like.

  The said metal body can be comprised with the metal foil, metal plate, etc. which have electroconductivity, for example. Moreover, the rod-shaped conductor can be constituted by, for example, a metal pin having conductivity. The linear solder can be constituted by linear or thread-like solder such as eutectic solder mainly composed of an alloy of lead and tin, lead-free solder not containing lead.

  The lead-free solder is, for example, tin (Sn) -silver (Ag) -copper (Cu), tin (Sn) -copper (Cu) -nickel (Ni), tin (Sn) -zinc (Zn) -copper ( The main component is Cu), tin (Sn) -zinc (Zn) -bismuth (Bi), tin (Sn) -copper (Cu), tin (Sn) -zinc (Zn), tin (Sn) -bismuth (Bi). It can be constituted by. Moreover, you may add components other than the said component, or change the combination of a component according to a use and the objective.

  The method for soldering a rod-shaped conductor to a metal body according to a second aspect of the present invention is characterized in that the metal body is a copper foil or an aluminum foil in combination with the structure according to the first aspect.

  According to this invention, the rod-shaped conductor to which the linear solder is attached is inserted into the insertion hole of the metal body made of copper foil or aluminum foil, and the wire attached to the rod-shaped conductor by heat retention of the copper foil or aluminum foil. Since the solder is melted and soldered, for example, there is no structural change of the dielectric formed by molding a metal body on at least one surface, and there is no excess or deficiency in the amount of solder. Soldering of the rod-shaped conductor can be performed.

  According to a third aspect of the present invention, there is provided a method of soldering a rod-shaped conductor to a metal body, wherein the rod-shaped conductor is inserted into an insertion hole formed in a resin-molded metal body, and the metal body and the rod-shaped conductor are soldered. In the attaching method, the insertion hole of the metal body in which the rod-like conductor having the linear solder attached facing the entire peripheral edge of the insertion hole is kept at a temperature higher than the temperature at which the linear solder melts. It is characterized by being inserted into and soldered.

  According to the present invention, the wire attached to the rod-shaped conductor by heat retention of the metal body that is stored during resin molding is inserted into the insertion hole of the resin-molded metal body through the rod-shaped conductor to which the linear solder is mounted. Molten solder is soldered. That is, since the amount of heat held by the resin mold is large, the amount of heat supplied to the linear solder is large, and stable soldering with no solder unevenness can be achieved. Further, the present invention is directed to a method of melting and soldering linear solder attached to a rod-like conductor by heat retention of a metal body stored during resin molding.

  According to a fourth aspect of the present invention, there is provided a method for soldering a rod-shaped conductor to a metal body. In addition to the structure according to the third aspect, the metal body is resin-molded by insert molding. The heat is retained by the residual heat at the time of the insert molding.

  According to this invention, the rod-shaped conductor with the linear solder attached is inserted into the insertion hole of the resin-molded metal body by insert molding, and attached to the rod-shaped conductor by heat retention of the metal body stored during insert molding. The formed linear solder is melted and soldered. In other words, since the resin mold and the metal body are heated to approximately the same temperature during insert molding, the heat given to the resin-molded metal body is greater than the amount of heat necessary to melt the linear solder. Therefore, a sufficient amount of heat supply for melting the linear solder can be obtained, and stable soldering without solder unevenness can be achieved without adding thermal energy more than necessary. In addition, for example, the structure of a dielectric formed by attaching a metal body to at least one surface, solder amount excess / deficiency failure, etc. do not occur, and the rod-shaped conductor is soldered to a capacitor, antenna element, etc. Can do. Further, the present invention is directed to a method of melting and soldering linear solder attached to a rod-like conductor by heat retention of a metal body stored during insert molding.

  According to a fifth aspect of the present invention, there is provided a method for soldering a rod-shaped conductor to a metal body, in combination with the structure according to any one of the first to fourth aspects, wherein the metal body is at least one surface of a dielectric. It is attached to

  According to the present invention, the metal body attached to at least one surface of the dielectric is heat-retained by the residual heat of the dielectric stored during molding, and the rod-shaped conductor with the linear solder attached to the insertion hole of the metal body. When inserted, the linear solder is melted and soldered by heat retention of the metal body. That is, the amount of heat retained by the dielectric is greater than the amount of heat retained by the metal body, and a sufficient heat supply amount for melting the linear solder can be obtained, so that stable soldering without solder unevenness can be achieved.

  Examples of the dielectric base material include plastics such as polyphenylene sulfite (PPS; melting point of about 290 ° C., processing temperature of about 320 ° C.), polycarbonate (PC; melting point of about 260 ° C., processing temperature of about 300 ° C.), etc. Are preferably used. In addition, if the plastic has a higher melting point than the linear solder, the dielectric may be made of a single or composite plastic other than the PPS and PC. Furthermore, a dielectric material having a desired dielectric constant may be configured by mixing a dielectric material with a powder of a high dielectric material (such as barium titanate).

  The soldering structure of the rod-shaped conductor to the metal body according to the sixth aspect of the invention is a solder in which the rod-shaped conductor is inserted into an insertion hole formed in the metal body, and the metal body and the rod-shaped conductor are soldered. In the attachment structure, the linear solder attached to the rod-shaped conductor so as to face the entire peripheral edge of the insertion hole is melted by heat retention of the metal body, and the rod-shaped conductor and the metal body are soldered. It is characterized by.

  According to the present invention, the rod-shaped conductor with the linear solder attached is inserted into the insertion hole of the metal body, and the linear solder attached to the rod-shaped conductor is melted and soldered by heat retention of the metal body. In other words, the metal body and the rod-shaped conductor are soldered structures that can be soldered in a short time. Can be prevented.

  The soldering structure of the rod-shaped conductor to the metal body according to the invention described in claim 7 is characterized in that, in addition to the structure according to claim 6, the metal body is a copper foil or an aluminum foil. .

  According to this invention, the rod-shaped conductor to which the linear solder is attached is inserted into the insertion hole of the metal body made of copper foil or aluminum foil, and the wire attached to the rod-shaped conductor by heat retention of the copper foil or aluminum foil. This is a soldering structure in which the solder is melted and soldered. In other words, for example, there is no change in the structure of a dielectric formed by attaching a metal body to at least one surface, and there is no excess or deficiency in the amount of solder, and the soldering structure of a rod-shaped conductor to a capacitor, antenna element, etc. can do.

  In the soldering structure of the rod-shaped conductor to the metal body according to the eighth aspect of the invention, the rod-shaped conductor is inserted into an insertion hole formed in the resin-molded metal body, and the metal body and the rod-shaped conductor are In the soldered soldering structure, the linear solder attached to the rod-shaped conductor so as to face the entire peripheral edge of the insertion hole is melted by heat retention of the metal body, and the rod-shaped conductor and the metal The body is soldered.

  According to the present invention, the wire attached to the rod-shaped conductor by heat retention of the metal body that is stored during resin molding is inserted into the insertion hole of the resin-molded metal body through the rod-shaped conductor to which the linear solder is mounted. This is a soldering structure in which the solder is melted and soldered. That is, since the resin mold has a large amount of heat, it is a stable soldering structure with a large amount of heat supply to the linear solder and no solder unevenness. Moreover, the structure which melted and soldered the linear solder with which the rod-shaped conductor was mounted | worn by heat retention of the metal body heat-stored at the time of resin molding is made into object.

  A soldering structure for a rod-like conductor to a metal body according to a ninth aspect of the invention is combined with the structure according to the eighth aspect, wherein the metal body is heat-retained by residual heat at the time of insert molding. And

  According to the present invention, the wire attached to the rod-like conductor by inserting the rod-like conductor attached with the linear solder into the insertion hole of the insert-molded metal body and heat retaining the metal body stored during the insert molding. This is a soldering structure in which the solder is melted and soldered. In other words, since the amount of heat retained by insert molding is greater than the amount of heat retained by the resin mold, a sufficient amount of heat supply can be obtained to melt the linear solder, and solder can be added without adding more heat energy than necessary. Stable soldering without unevenness is possible. In addition, for example, the structure of a dielectric formed by attaching a metal body to at least one surface, solder amount excess / deficiency failure, etc. do not occur, and the rod-shaped conductor is soldered to a capacitor, antenna element, etc. Can do. Moreover, the structure which melts and solders the linear solder with which the rod-shaped conductor was mounted | worn by heat retention of the metal body heat-stored at the time of insert molding is made into object.

  According to a tenth aspect of the present invention, there is provided a soldering structure for a rod-like conductor to a metal body, in combination with the structure according to any one of the sixth to ninth aspects, wherein the metal body is at least one of dielectrics. It is formed on a surface.

  According to the present invention, the metal body attached to at least one surface of the dielectric is heat-retained by the residual heat of the dielectric stored during molding, and the rod-shaped conductor with the linear solder attached to the insertion hole of the metal body. This is a soldering structure in which linear solder is melted and soldered by heat retention of the metal body when inserted. That is, the amount of heat retained by the dielectric is larger than the amount of heat retained by the metal body, and a sufficient heat supply amount for melting the linear solder can be obtained, so that a stable soldering structure free from solder unevenness can be obtained.

  According to this invention, the rod-shaped conductor with the linear solder attached is inserted into the insertion hole of the metal body, and the linear solder attached to the rod-shaped conductor is melted and soldered by heat retention of the metal body. For example, it is possible to prevent pores and voids from being generated in the dielectric itself in which a metal body is formed on at least one surface, or structural changes due to reheating to occur in the dielectric. In addition, the linear solder is mounted on the rod-shaped conductor so as to face the entire peripheral edge of the insertion hole so that the solder amount becomes a constant amount, so there is no excess or deficiency in the solder amount, and uniform and quality. Soldering can be performed in a short time in a state with little variation.

  The object of the present invention is to insert a rod-like conductor with linear solder into the insertion hole of a metal body for the purpose of being able to solder in a short time in a uniform and low quality variation. This was achieved by melting and soldering the linear solder attached to the rod-like conductor by heat retention.

An embodiment of the present invention will be described in detail with reference to the drawings.
The drawings show a soldering method and a soldering structure for soldering a conductive pin, which is an example of a rod-like conductor, to a copper foil on an upper surface of a dielectric, which is an example of a metal body. In FIGS. In the soldering structure 1 of the present invention, a conductive copper foil 3 is insert-molded in advance on the upper surface of a dielectric 2 made of plastic, and an eutectic crystal is formed in the insertion hole 4 formed in the center of the copper foil 3. This is a structure in which a conductive pin 5 having a ring-shaped linear solder 6 made of solder is inserted and the copper foil 3 and the conductive pin 5 are soldered and connected by the residual heat of the dielectric 2.

  As shown in FIG. 1, the method of soldering the conductive pin 5 to the copper foil 3 includes connecting the conductive pin 5 with the ring-shaped linear solder 6 to the insertion hole 2 a of the dielectric 2 and the dielectric 2. The copper foil 3 attached to at least the upper surface of the dielectric 2 is linear due to the residual heat of the dielectric 2 stored during insert molding when the two copper foils 3 are inserted through the insertion holes 4 sandwiched between them. The heat is kept at a temperature higher than the temperature at which the solder 6 melts, the heat of the copper foil 3 is used to melt the linear solder 6 attached to the conductive pin 5, and the copper foil 3 and the conductive pin 5 are soldered. This is a connection method (see FIGS. 3 and 4).

  As shown in FIGS. 3 and 4, the soldering structure 1 has a conductive structure in which a ring-shaped linear solder 6 is mounted in the insertion holes 4 of the upper and lower copper foils 3 sandwiching the dielectric 2. The linear solder 6 attached to the shaft portion 5a of the conductive pin 5 is opposed to the entire peripheral edge portion of the insertion hole 4 by heat retention of the copper foil 3 on the upper surface of the dielectric 2 that has been inserted through the pin 5 and stored during molding. The copper foil 3 and the conductive pin 5 are integrally soldered and connected by melting.

  In the embodiment, the dielectric 2 is formed in a substantially square shape when viewed from above with polyphenylene sulfite (PPS), which is an example of plastic, and the vertical dimension, the horizontal dimension, and the thickness are set to numerical values to be described later. Yes. Moreover, the copper foil 3 which has electroconductivity is mold | molded on the upper and lower surfaces of the dielectric 2 so that it may not protrude outside the four edge part of the dielectric 2 (refer FIG. 4). The copper foil 3 may be molded in a state where the upper and lower surfaces of the dielectric 2 are covered. Further, the shape, length, width and thickness of the dielectric 2 and the thickness of the copper foil 3 may be changed according to the application and purpose. Further, instead of the copper foil 3, an aluminum foil may be insert-molded.

  Moreover, the temperature of the copper foil 3 immediately after taking out from the molding machine is higher than the melting temperature of the linear solder 6 (melting temperature of eutectic solder = about 183 ° C.) due to the residual heat of the dielectric 2 stored during molding. If the soldering is performed until the temperature of the copper foil 3 is lowered to the melting temperature of the linear solder 6 or less, the copper foil 3 is electrically conductive for supplying power from the above-described copper foil 3 and a circuit on the substrate side described later. The pins 5 can be soldered together.

  As shown in FIG. 4, an insertion hole 4 having a diameter that allows the shaft portion 5 a of the conductive pin 5 to be inserted is provided in the thickness direction at the center of the copper foil 3 molded on the upper and lower surfaces of the dielectric 2. . In addition, an insertion hole 2a having a hole diameter communicating with the insertion hole 4 of the copper foil 3 and allowing the shaft part 5a of the conductive pin 5 to be inserted is provided in the center of the dielectric 2 in the thickness direction. Instead of the copper foil 3, for example, a metal foil such as an aluminum foil may be insert-molded, or a copper or aluminum metal plate may be insert-molded.

  As shown in FIG. 2, the conductive pin 5 is formed of a conductive metal such as brass, and the total length A of the pin and the diameter B of the shaft portion 5a are set to numerical values to be described later. Further, the rod-shaped shaft portion 5 a formed on the insertion side is formed to have a diameter that allows insertion into the insertion hole 4 of the copper foil 3 and the insertion hole 2 a of the dielectric 2, and is inserted into one surface of the dielectric 2. When the molded copper foil 3 is inserted through the insertion hole 4, the length of the copper foil 3 is allowed to protrude downward from the insertion hole 4 of the copper foil 3 that is insert-molded on the other surface.

  Moreover, the head 5b formed at the upper end of the shaft portion 5a is formed to have a larger diameter than the insertion hole 4 of the copper foil 3 and the insertion hole 2a of the dielectric 2, and is substantially the same as the copper foil 3 at the periphery of the insertion hole 4. It is formed in a size and shape that can be contacted evenly. The total length A of the conductive pin 5, the diameter B of the shaft portion 5a, and the diameter of the head portion 5b are changed according to the hole diameter and thickness of the insertion holes 2a and 4 formed in the dielectric 2 and the copper foil 3. Also good.

  The linear solder 6 is formed in a ring shape by eutectic solder mainly composed of an alloy of lead and tin and having a melting temperature of about 183 ° C. The head 5 b of the conductive pin 5 and the copper foil 3 at the periphery of the insertion hole 4 are formed. Are formed in a size, shape, and thickness (including wire diameter) that are substantially evenly contacted with each other. Further, the inner diameter of the linear solder 6 is formed to be a hole diameter that allows the shaft portion 5a of the conductive pin 5 to be inserted.

  Further, when the linear solder 6 is attached to the peripheral surface of the shaft portion 5a of the conductive pin 5, the shaft portion 5a of the conductive pin 5 is inserted into the linear solder 6 so that the shaft portion 5a is as close as possible to the head portion 5b. Insert and fix. Note that the size, shape, and thickness of the linear solder 6 may be changed according to the size of the conductive pin 5.

  In place of the method of inserting and fixing the ring-shaped linear solder 6, for example, the linear solder 6 may be wound around the peripheral surface of the shaft portion 5a as close as possible to the head 5b and cut so that the amount of solder is uniform. However, it is preferable to wrap the linear solder 6 around the peripheral surface of the shaft portion 5a only once so that the amount of solder does not become excessive or insufficient.

  Moreover, instead of eutectic solder, for example, lead-free solder that does not contain lead may be used. In this case, the melting point of the lead-free solder is higher than that of the eutectic solder (about 183 ° C.), and has a melting point of about 210 ° C. or about 220 ° C. Therefore, the dielectric is made of a material having a higher melting point than the lead-free solder. If 2 is formed, lead-free solder can be used for soldering connection.

  The illustrated embodiment is configured as described above, and a method of soldering and connecting the conductive pins 5 to the copper foil 3 on the upper surface of the dielectric 2 by the soldering method of the present invention will be described below.

  First, as shown in FIGS. 1 and 2, after the copper foils 3 and 3 are insert-molded on the upper and lower surfaces of the dielectric 2 by a molding machine, the conductive pins 5 to which the ring-shaped linear solder 6 is attached are inserted. The shaft portion 5a is inserted into the insertion hole 4 of the copper foil 3 on the upper surface side which is retained by the residual heat of the dielectric 2 immediately after being taken out from the molding machine, and the head 5b of the conductive pin 5 is inserted into the periphery of the insertion hole 4 Against the copper foil 3.

  As shown in FIGS. 3 and 4, the linear solder 6 attached to the peripheral surface of the shaft portion 5 a of the conductive pin 5 is placed between the head 5 b of the conductive pin 5 and the copper foil 3 at the peripheral portion of the insertion hole 4. Sandwich. Moreover, the linear solder 6 attached to the peripheral surface of the shaft portion 5a of the conductive pin 5 is melted by heat retention of the copper foil 3 stored during molding, and the head of the conductive pin 5 is centered on the shaft portion 5a of the conductive pin 5. Since the entire circumference of the portion 5b and the copper foil 3 at the periphery of the insertion hole 4 are soldered and connected uniformly, the soldering structure 1 having an antenna function can be obtained.

  That is, since the amount of heat held when the copper foil 3 is resin-molded is large, the amount of heat supplied to the linear solder 6 is large, and stable soldering without uneven solder can be performed. Since it is heated so that the temperature is almost the same, it is easy to increase the heat given to the resin-molded copper foil 3 than the amount of heat necessary to melt the linear solder 6. A sufficient amount of heat supply to melt the linear solder 6 can be obtained, and stable soldering without uneven solder can be performed without adding more heat energy than necessary.

  5 and 6 show characteristic measurement results of the experimental structure 1 having an antenna function in which 200 conductive pins 5 are soldered and connected under the same conditions by the conventional soldering method and the soldering method of the present invention. Yes. The vertical axis shown in each figure represents the electrical characteristics of the experimental structure 1 measured by the electrical specific measuring apparatus, and the horizontal axis represents the experiments from No. 1 to No. 200 soldered by the conventional method and the method of the present invention. This shows the order in which the structural bodies 1 are arranged in the order of measurement.

  The dielectric 2 of the experimental structure 1 used in the experiment is formed in a substantially square shape when viewed from above, and is formed so that the vertical dimension = approximately 28 mm, the lateral dimension = approximately 28 mm, and the thickness = 4 mm. Further, a copper foil 3 having a thickness of about 70 μm is insert-molded on both upper and lower surfaces of the dielectric 2 having a melting temperature of about 295 ° C.

  The conductive pin 5 is formed to have a total length A = approximately 7.0 mm and a diameter B = approximately 1.0 mm. Further, a linear solder 6 having a melting temperature of about 183 ° C. is attached in a ring shape on the peripheral surface of the shaft portion 5 a of the conductive pin 5.

  When comparing the electrical characteristics of the experimental structure 1 formed by soldering and connecting with the conventional soldering method and the soldering method of the present invention, the conventional method solders at a temperature higher than the melting temperature of the linear solder 6. When heating with a trowel, pores and voids are generated in the dielectric 2, and structural changes due to reheating occur in the dielectric 2, so that the electrical characteristics of the dielectric 2 change. That is, as shown in FIG. 5, since the variation in electrical characteristics is large and the standard deviation σ is approximately 0.37, uniform soldering cannot be performed.

  On the other hand, the method of the present invention melts and solders the linear solder 6 attached to the conductive pin 5 by heat retention of the copper foil 3 stored during insert molding, so that pores and voids are generated in the dielectric 2. And the structural change due to reheating does not occur in the dielectric 2, and the dielectric constant is stable. As shown in FIG. 6, the variation in electrical characteristics due to structural changes due to heat, excessive or insufficient solder amount, etc. is reduced to approximately 1/100, and the standard deviation σ of electrical characteristics is approximately 0.04. Solder connection can be made in a stable state.

  That is, the entire circumference of the head 5b of the conductive pin 5 and the copper foil 3 insert-molded around the peripheral edge of the insertion hole 4 are soldered and connected uniformly.

  FIG. 7 is a measurement result showing a temperature change after molding of the copper foil 3 inserted on the upper surface of the dielectric 2 when soldering and connecting with the linear solder 6 made of eutectic solder. In other words, the work of inserting the conductive pin 5 with the linear solder 6 into the insertion hole 4 of the copper foil 3 insert-molded on the upper surface of the dielectric 2 and soldering it is completed in a few seconds, but it is taken out from the molding machine. From just after that, it was measured how long the temperature of the copper foil 3 reached the melting temperature of the linear solder 6, and as shown by the broken line in the figure, immediately after taking out from the molding machine in the environment of room temperature 20 ° C. The temperature of the copper foil 3 is about 215 ° C. However, after about 40 seconds have passed since the removal, the temperature of the copper foil 3 is equal to the melting temperature of the linear solder 6 (melting temperature of eutectic solder = about 183 ° C. ). In addition, the vertical axis | shaft shown in a figure represents the temperature of the copper foil 3, and the horizontal axis represents elapsed time in a second unit (sec).

  Therefore, there is a time margin of about 40 seconds until the temperature of the copper foil 3 kept by the residual heat at the time of insert molding is lowered to a temperature lower than the melting temperature of the linear solder 6, so the solder of the present invention. A heating time sufficient for soldering can be ensured by the attaching method.

  As described above, when the conductive pin 5 to which the linear solder 6 is attached is inserted into the insertion hole 4 of the copper foil 3 which is insert-molded on the upper surface of the dielectric 2, The copper foil 3 attached to the upper and lower surfaces of the dielectric 2 is preheated by the remaining heat, and the linear solder 6 attached to the conductive pin 5 is melted and soldered by the heat retention of the copper foil 3. It is.

  That is, since the conductive pin 5 is soldered by using heat retention that is lower than the structural change temperature of the dielectric 2 and higher than the temperature at which the linear solder 6 melts, pores and voids are generated in the dielectric 2 itself. Or structural change due to reheating can be prevented from occurring in the dielectric 2. Further, since the linear solder 6 is mounted on the conductive pin 5 so as to face the entire peripheral edge of the insertion hole 4 so that the solder amount becomes a constant amount, the solder amount does not cause an excess or deficiency and is uniform. Soldering can be performed in a short time in a state with little variation in quality. In addition, no special jigs or fine adjustment work is required, and soldering is performed by using the heat retention of the copper foil 3 stored during molding, so it is very economical without adding more heat energy than necessary. It is.

  FIG. 8 shows another example of the method of soldering the conductive pin 5 to the copper foil 3 attached to one surface of the dielectric 2 constituting the soldering structure 1, and the conductive with the linear solder 6 attached thereto. When the shaft portion 5a of the pin 5 is inserted into the insertion hole 4 of the copper foil 3 provided on one surface of the dielectric 2, one side of the dielectric 2 is caused by the residual heat of the dielectric 2 stored during insert molding. Since the copper foil 3 attached to the copper foil 3 is preheated, and the linear solder 6 attached to the conductive pin 5 is melted and soldered by heat retention of the copper foil 3, the operation is substantially equivalent to that of the above embodiment. And there can be an effect.

In the correspondence between the configuration of the present invention and the above-described embodiment,
The metal body of the present invention corresponds to the copper foil 3 of the example,
Similarly,
The rod-shaped conductor corresponds to the conductive pin 5,
The present invention is not limited to the configuration of the above-described embodiment, but can be applied based on the technical idea shown in the claims, and many embodiments can be obtained.

  The soldering method of the present invention can also be used for soldering a rod-shaped conductor to a capacitor.

  In addition, the ring-shaped linear solder 6 in the embodiment has a substantially round cross-sectional shape regardless of which part is cut, but is formed in a substantially flat cross-sectional shape such as a plate shape or a sheet shape, for example. Solder may be used.

The perspective view which shows the soldering method of the conductive pin to the copper foil by this invention. The perspective view which shows the attachment method of a ring-shaped linear solder and a conductive pin. The perspective view which shows the state which soldered the electrically conductive pin to the copper foil of a dielectric material upper surface. Sectional drawing which shows the structure which soldered the conductive pin to the copper foil of a dielectric material upper surface. The graph which shows the experimental result by the conventional soldering method. The graph which shows the experimental result by the soldering method of this invention. The graph which shows the copper foil temperature change after insert molding. Sectional drawing which shows the other example which soldered the conductive pin to the copper foil of the dielectric material single side | surface. The perspective view which shows the soldering method of the conductive pin by the conventional soldering method. The perspective view which shows the soldering state of the conductive pin by a soldering iron.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Soldering structure 2 ... Dielectric material 3 ... Copper foil 4 ... Insertion hole 5 ... Conductive pin 5a ... Shaft part 5b ... Head 6 ... Linear solder 7 ... Solder 8 ... Solder iron

Claims (10)

In a method of inserting a rod-shaped conductor through an insertion hole formed in a metal body and soldering the metal body and the rod-shaped conductor,
The rod-shaped conductor having the linear solder attached facing the entire peripheral edge of the insertion hole is inserted into the insertion hole of the metal body that is kept at a temperature higher than the temperature at which the linear solder melts. A method of soldering a rod-shaped conductor to a metal body, characterized by comprising: The method of soldering a rod-shaped conductor to a metal body according to claim 1, wherein the metal body is a copper foil or an aluminum foil. In a method of inserting a rod-shaped conductor through an insertion hole formed in a resin-molded metal body and soldering the metal body and the rod-shaped conductor,
The rod-shaped conductor having the linear solder attached facing the entire peripheral edge of the insertion hole is inserted into the insertion hole of the metal body that is kept at a temperature higher than the temperature at which the linear solder melts. A method of soldering a rod-shaped conductor to a metal body, characterized by comprising: 4. The method of soldering a rod-shaped conductor to a metal body according to claim 3, wherein the metal body is resin-molded by insert molding, and the metal body is retained by residual heat during the insert molding. 5. The method of soldering a rod-shaped conductor to a metal body according to claim 1, wherein the metal body is attached to at least one surface of the dielectric body. In the soldering structure in which the rod-shaped conductor is inserted into the insertion hole formed in the metal body, and the metal body and the rod-shaped conductor are soldered,
The linear solder attached to the rod-shaped conductor so as to face the entire peripheral edge of the insertion hole is melted by heat retention of the metal body, and the rod-shaped conductor and the metal body are soldered. A soldering structure of a rod-shaped conductor to a metal body. The said metal body is copper foil or aluminum foil, The soldering structure of the rod-shaped conductor to the metal body of Claim 6 characterized by the above-mentioned. In a soldering structure in which a rod-shaped conductor is inserted into an insertion hole formed in a resin-molded metal body, and the metal body and the rod-shaped conductor are soldered,
The linear solder attached to the rod-shaped conductor so as to face the entire peripheral edge of the insertion hole is melted by heat retention of the metal body, and the rod-shaped conductor and the metal body are soldered. A soldering structure of a rod-shaped conductor to a metal body. The said metal body is heat-retained by the residual heat at the time of insert molding, The soldering structure of the rod-shaped conductor to the metal body of Claim 8 characterized by the above-mentioned. 10. The bar-shaped conductor soldering structure to a metal body according to claim 6, wherein the metal body is attached to at least one surface of the dielectric.

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