JP2010165574A - Method of manufacturing electronic components with lead line - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently manufacture in a short time an electronic component with lead wire in which processing of the tip of a lead wire and coating stripping of the metal wire can be carried out by one-time treatment process, and jointing strength and electric connection reliability can be secured without giving damages to the electronic component. <P>SOLUTION: A first and a second lead wires 6a, 6b with different lengths are mounted on a seating 20 having a heating means 22 built-in, and the tips of the first and the second lead wires are compressed and heated to strip the insulating member of the tips from the metal wire, and a first and a second metal wire exposed parts 10a, 10b are formed. Simultaneously with this, the first and the second metal wire exposed parts 10a, 10b are formed in a flat shape or substantially in a flat shape. Then, solder is coated on the first and the second metal wire exposed parts 10a, 10b and then, the first and the second metal wire exposed parts 10a, 10b and a thermistor are compressed and heated to be jointed. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an electronic component with a lead wire, and more particularly, to a method for manufacturing an electronic component with a lead wire in which a lead wire is electrically connected to a surface mount electronic component such as a surface mount thermistor.

  In personal computers and electric bicycles, a relatively large secondary battery may be used, or a plurality of fuel cells may be used in parallel. In such a case, for example, a location where temperature measurement is desired, such as a secondary battery, and a control board on which a thermistor as a temperature sensor is mounted must be separated. For this reason, a thermistor with a lead wire using a long lead wire is used. That is, by using a temperature sensor with a lead wire having a long lead wire, the lead wire is soldered and fixed on a control board such as a printed circuit board, while the temperature sensing part of the thermistor is to be temperature-detected Therefore, it is possible to accurately detect the temperature at a location where temperature measurement is desired.

  In such an electronic component with a lead wire, since the metal wire which is the core portion of the lead wire is covered with the insulating member, the insulating member of the required portion is removed to expose the surface of the metal wire, It is necessary to electrically connect the electronic component.

  On the other hand, as a method of removing the covering of the covered electric wire, for example, a method of peeling an electric wire as shown in Patent Document 1 has been proposed.

  In Patent Document 1, as shown in FIG. 14, a temperature-adjusting hot plate 101 is provided above and below a base portion 102 so as to be movable up and down. This hot plate 101 has substantially the same length as the coating peeling length, and is heated to about 300 ° C. while pressing the upper end in the axial direction of the covered electric wire 103 supplied to the base portion 102 with the hot plate 101, The covering of the portion is softened and melted, thereby forming a peeled portion 105 in which the upper half of the conductor 104 is exposed for a required length in the axial direction of the covered electric wire 103. After that, the covered electric wire 103 is held by the clamp 106 and the presser plate 107 is lowered to fix the upper portion of the covered electric wire 103, and the skinned portion is peeled off by the cutting / peeling blade 108 that operates from both ends of the skinned portion 105 to the center. 105 coatings are removed.

  As described above, in Patent Document 1, the peeled portion 105 is formed in the first step, and the covering of the peeled portion 105 is removed in the subsequent second step, whereby the entire periphery of the conductor 104 is exposed. 109 is formed.

JP-A-4-289712

  However, in the above-mentioned Patent Document 1, the coating removal from the coated electric wire 103 is performed in two stages, the first process and the second process, and the number of parts necessary for the coating removal is large and the apparatus is large. There is a problem that the processing is complicated due to the scale.

  In particular, in the case of electronic components with lead wires using surface-mount type electronic components, it is necessary to use two lead wires having different lengths, and in order to ensure bonding strength and electrical connectivity, It is desirable to form the tip portion so as to increase the bonding area between the tip portion of the lead wire and the terminal electrode of the electronic component.

  Therefore, when the method of Patent Document 1 is applied to an electronic component with a lead wire, there is a problem that a large-scale device is required, the processing becomes complicated, and the number of processes increases, resulting in poor productivity. .

  The present invention has been made in view of such circumstances, and can process the tip portion of the lead wire and remove the coating from the metal wire in one processing step, and the electronic component is damaged. Therefore, it is an object of the present invention to provide a method for manufacturing an electronic component with a lead wire that can efficiently manufacture an electronic component with a lead wire that can ensure the bonding strength and the reliability of electrical connectivity in a short time.

  In order to achieve the above object, according to the method for manufacturing an electronic component with lead wires according to the present invention, first and second lead wires in which a metal wire is covered with an insulating member, and terminal electrodes are formed at both ends of the component body. In the method of manufacturing an electronic component with a lead wire, the first lead wire is joined to one terminal electrode, and the second lead wire is joined to the other terminal electrode. The first lead wire and the second lead wire are arranged in parallel, and the second lead wire is cut so that the second lead wire is shorter than the first lead wire by a predetermined length. Cutting the lead wire, pressing and heating the tip portions of the first and second lead wires to be joined to the terminal electrode, and peeling off the insulating member at the tip portion from the metal wire. 2 metal wire exposed portions, and at the same time, the first and second gold A pressurizing / heating step for forming the line exposed portion in a flat or substantially flat shape, and bringing the first and second metal wire exposed portions into contact with solder and soldering to the first and second metal wire exposed portions; Applying the solder, applying pressure to and heating the first and second metal wire exposed portions coated with the solder uniformly or substantially uniformly, and the first and second metal wire exposed portions and the And a joining step of joining the terminal electrodes of the electronic component.

  The method for manufacturing an electronic component with a lead wire according to the present invention is characterized in that a solder fillet is formed on a side surface folded portion and an end surface portion of the one terminal electrode.

  In the method for manufacturing an electronic component with a lead wire according to the present invention, the second metal wire exposed portion is formed so as to have a gap between a tip of the covering portion and an end surface portion of the other terminal electrode, A solder fillet is formed in the side surface folded portion and end surface portion of the other terminal electrode and the gap.

  In the method for manufacturing an electronic component with a lead wire according to the present invention, the first lead wire and the second lead wire are integrally joined in the longitudinal direction to form a set of parallel lead wires. It is characterized by.

  The method for manufacturing an electronic component with a lead wire according to the present invention is characterized in that the electronic component is a surface mount type.

  According to the method for manufacturing an electronic component with a lead wire, the first lead wire and the second lead wire are arranged in parallel, and the second lead wire has a predetermined length than the first lead wire. A lead wire cutting step for cutting the second lead wire so as to be shortened, and pressurizing and heating the tip portions of the first and second lead wires to be joined to the terminal electrode, The insulating member is peeled from the metal wire to form the first and second metal wire exposed portions, and at the same time, the first and second metal wire exposed portions are formed flat or substantially flat. A heating step, a solder application step of bringing the first and second metal wire exposed portions into contact with solder to apply solder to the first and second metal wire exposed portions, and the first to which the solder is applied Pressurizing and heating the first and second metal wire exposed portions uniformly or substantially uniformly, the first and second Since it includes a joining step for joining the exposed portion of the metal wire and the terminal electrode of the electronic component, the insulating member at the tip portion can be easily peeled off from the metal wire without requiring a large-scale device or a complicated method. At the same time, the first and second metal wire exposed portions to be joined to the terminal electrode can be easily formed. In addition, since heating is performed simultaneously with pressurization in the bonding process, the applied pressure can be kept low, and damage such as cracks can be suppressed in the electronic component. Moreover, since it can solder-bond in a short time compared with a reflow furnace, it becomes a thing suitable for mass-productivity. Furthermore, since the first and second metal wire exposed portions are pressed and heated uniformly or substantially uniformly, uniform heat energy is applied to the first and second metal wire exposed portions, Therefore, since the joint surface with the terminal electrode can be formed over the entire area of the first and second metal wire exposed portions, the joint area can be increased, and the joint strength and the reliability of electrical connection can be improved. Can do.

  Further, according to the above manufacturing method, it is possible to form a solder fillet not only in the side folded portion but also in the gap between the end surface portion and the tip of the covering portion and the end surface portion of the terminal electrode. Generation | occurrence | production can be prevented effectively and, thereby, desired joining strength can be ensured and it becomes possible to obtain the electronic component with a lead wire which has favorable electrical connection property and high reliability at low cost.

  In addition, since the first lead wire and the second lead wire are integrally joined in the longitudinal direction to form a set of parallel lead wires, the placement location of the electronic component and the control board like a thermistor Even when they are separated from each other, an electronic component with a lead wire having good electrical connection and high reliability can be manufactured.

  In addition, since the electronic component is a surface mount type, it is relatively easy to manufacture a highly reliable electronic component with a lead wire capable of avoiding a short circuit between the terminal electrodes as much as possible because the terminal electrodes are relatively large. be able to.

It is a partially broken front view of the electronic component with a lead wire manufactured using the manufacturing method of this invention. It is a manufacturing-process figure which shows 1st Embodiment of the manufacturing method of the electronic component with a lead wire which concerns on this invention. The 1st and 2nd lead wire (parallel lead wire) in a lead wire cutting process is shown, (a) is a front sectional view, and (b) is an XX arrow sectional view of (a). It is the schematic of the 1st pressurization and heating apparatus used at a pressurization and a heating process. It is a figure for demonstrating a pressurization and a heating process, (a) is a front view, (b) is a YY arrow line view of (a). It is sectional drawing of the 1st and 2nd lead wire after a heating and pressurizing process, (a) is front sectional drawing, (b) It is right side sectional drawing. It is a figure which shows a solder application process. It is a front view which shows a joining process. It is a figure which shows the state after a joining process, (a) is a front view, (b) is a left view of (a). It is a figure which shows an exterior formation process, (a) is a front view, (b) is a left view of (a). It is a front view of the electronic component with a lead wire manufactured by 1st Embodiment. It is a manufacturing-process figure which shows 2nd Embodiment of the manufacturing method of the electronic component with a lead wire which concerns on this invention. It is a front view of the electronic component with a lead wire manufactured by 2nd Embodiment. It is a figure which shows the manufacturing apparatus described in patent document 1. FIG.

  Next, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a partially cutaway front view of an electronic component with a lead wire manufactured using the manufacturing method of the present invention. In this embodiment, a surface mount type thermistor (hereinafter referred to as “thermistor”) is used as the electronic component. .) Is used.

  The thermistor 1 includes a thermistor body 2 mainly composed of a ceramic material formed in a substantially rectangular parallelepiped shape, and terminal electrodes 3 a and 3 b formed at both ends of the thermistor body 2. The terminal electrodes 3a and 3b have end surface portions 4a and 4b and side surface folded portions 5a and 5b, and are formed so as to cover the end surface and the four side surfaces of the thermistor body 2. In addition, the terminal electrodes 3a and 3b have a plating film such as Ni or Sn formed on the surface of the base electrode on which a conductive material such as Ag is baked.

  By using such a surface mount type thermistor 1, the distance between the terminal electrodes 3a and 3b is relatively large compared to a single plate thermistor in which electrode layers are formed on both main surfaces of a plate-like thermistor body. Therefore, migration is difficult to occur, and a short circuit between the terminal electrodes 3a and 3b can be prevented as much as possible.

  The surface mount type thermistor 1 is originally designed to withstand use in an external environment, and thus has high reliability and environmental resistance. Therefore, there is an advantage that there is no influence by the lead wire mounting process, and the characteristic adjustment and characteristic selection of the thermistor element after the mounting can be simplified.

  Such a surface mount type thermistor 1 has an outer diameter of, for example, a length of 1.0 mm, a width of 0.5 mm, a thickness of 0.5 mm, or a length of 0.6 mm, a width of 0.3 mm, and a thickness of 0.3 mm. The chip type thermistor can be used.

  The first and second lead wires 6a and 6b include the covering portions 9a and 9b in which the metal wires 7a and 7b are covered with the insulating members 8a and 8b, and the first and second portions in which the insulating members 8a and 8b are removed. 2 metal wire exposed portions 10a and 10b. The first lead wire 6a and the second lead wire 6b are arranged in parallel, and the second lead wire 6b is formed shorter than the first lead wire 6a.

  Further, in this electronic component with lead wire, the first metal wire exposed portion 10a of the first lead wire 6a, the end surface 4a of the terminal electrode 3a, and the side folded portion 5a are joined via the solder 11a, and the solder fillet 11a 'is formed. Furthermore, the second metal wire exposed portion 10b of the second lead wire 2b is joined to the end surface portion 4b and the side folded portion 5b of the terminal electrode 3b via the solder 11b. Then, a solder fillet 11b ′ is formed in the side folded portion 5b, the end surface portion 4b, and the gap t of the terminal electrode 3b so as to have a gap t between the tip of the covering portion 9b and the end surface portion 4b of the terminal electrode 3b. Yes.

  That is, the thermistor 1 is formed such that the terminal electrodes 3a and 3b cover the end face of the thermistor body 2, but the end face parts 4a and 4b are firmly fixed to the thermistor body 2 compared to the side folded parts 5a and 5b. Is done. Therefore, by forming the solder fillets 11a 'and 11b' not only on the side folded portions 5a and 5b but also on the end surface portions 4a and 4b, it becomes possible to further prevent electrode peeling. In addition, since the solder fillet 11b 'is also formed in the gap t, the formation area of the solder fillet can be increased, and electrode peeling can be more effectively prevented. As a result, the bonding strength can be further improved, and the reliability of electrical connectivity can be further increased.

  The tip regions of the first and second lead wires 9a and 9b, the thermistor 1, and the solders 11a and 11b are covered with an exterior 12 made of an insulating member such as an epoxy resin. Further, the end portions 13a and 13b of the lead wires 6a and 6b are subjected to solder coating treatment after the insulating members 8a and 8b are removed.

  In addition, as the metal wires 7a and 7b, it is desirable to use copper having good solder wettability, but it is not particularly limited as long as it can be soldered, and iron, nickel, or alloys thereof, Composite materials and the like can be used. The insulating members 8a and 8b are not particularly limited as long as they have heat resistance that can withstand reflow soldering, and urethane resin, acrylic resin, fluorine resin, and the like can be used.

  Hereinafter, the manufacturing method of the electronic component with a lead wire mentioned above is explained in full detail. In the following embodiment, parallel lead wires are used. However, the present invention is not limited to parallel lead wires, and the same method can be used when two single lead wires are used. .

  FIG. 2 is a manufacturing process diagram showing a first embodiment of a method for manufacturing an electronic component with a lead wire according to the present invention. The manufacturing method includes a lead wire cutting step 14, a pressurizing / heating step 15, It has a solder application step 16, a joining step 17, an exterior forming step 18, and a termination processing step 19.

(1) Lead wire cutting step 14
In the lead wire cutting step 14, first, parallel lead wires are prepared in which the first and second lead wires 6a and 6b are integrally joined. Then, as shown in FIG. 3, punching is performed using a mold (not shown) so that the second lead wire 6b is shorter than the first lead 6a by a predetermined length L. Here, the predetermined length L is such that the first metal wire exposed portion 10a of the first lead wire 6a can be joined to the terminal electrode 3a of the thermistor 1 in FIG. 2 is set to such a length that the exposed portion 10b of the metal wire can be joined to the terminal electrode 3b of the thermistor 1.

(2) Pressure / heating step 15
In the pressurizing / heating step 15, the first pressurizing / heating device is used to pressurize / heat the first and second lead wires 6 a, 6 b.

  Specifically, as shown in FIG. 4, the first pressurizing / heating device includes a pedestal 20 on which the first and second lead wires 6 a and 6 b are placed, and is arranged opposite to the pedestal 20. And a pressurizing head 21 that moves up and down in the direction of arrow A. The pressure head 21 has a built-in heating means 22 such as a heater, and the base 20 uses a heat insulating material. By using the pedestal 20 as a heat insulating material, the heat from the heating means 22 incorporated in the pressure head 21 is efficiently transmitted to the tip portions of the first and second lead wires 6a and 6b without escaping to the pedestal 20. be able to.

  FIG. 5A is a front view when the tip portions of the first and second lead wires 6a and 6b are pressurized and heated, and FIG. 5B is a view taken in the direction of arrows YY in FIG. 5A. FIG.

  That is, in the pressurizing / heating step 15, as shown in FIG. 5, on the pedestal 20, the tip portion to be joined to the terminal electrodes 3 a, 3 b of the thermistor 1 faces the pressurizing part of the pressurizing head 21. 1st and 2nd lead wire 6a, 6b is mounted in this. Then, the heating means 22 is heated to a temperature equal to or higher than the melting point of the insulating members 8a and 8b (for example, 300 to 400 ° C.), and the pressure head 21 is lowered as indicated by an arrow B, and a predetermined load (for example, the first load) The tip portion of the first and second lead wires 6a, 6b is pressurized with 30N on the lead wire 6a side and 60N on the second lead wire 6b side, and the tip portion is processed into a wide flat shape (crushing) The amount is, for example, 0.3 mm on the first lead wire 6a side and 0.6 mm on the second lead wire 6b side). At this time, the tip portions of the first and second lead wires 6a and 6b that are in contact with the pressure head 21 are heated to a temperature equal to or higher than the melting point of the insulating members 8a and 8b. As a result, the insulating members 8a and 8b in the portion are softened and melted, whereby the insulating members 8a and 8b are peeled off from the metal wires 7a and 7b, and the metal wire exposed portions 10a and 10b are formed.

  In the present embodiment, the heating means 22 is built in the pressure head 21, but the heating means 22 may be built in the pedestal 20 or both the pedestal 20 and the pressure head 21. At that time, the material of the pedestal 20 is appropriately set so as to have thermal conductivity.

  FIG. 6 shows the first and second lead wires 6 a and 6 b after the pressurizing / heating step 15.

  As shown in FIG. 6, the tip portion is processed into a flat shape by the pressurizing / heating process in the pressurizing / heating step 15, and the insulating members 8a and 8b are peeled off from the metal wires 7a and 7b. Thus, the first and second metal line exposed portions 10a and 10b are formed. The coating peeling portions 8a 'and 8b' from which the insulating members 8a and 8b are peeled from the metal wires 7a and 7b are connected without being removed from the insulating members 7a and 7b.

  As described above, in the present embodiment, the processing of the tip portions of the first and second lead wires and the coating peeling of the tip portions are performed in a single processing step of pressurization / heat treatment in the pressurization / heating step 15. Will be performed at the same time.

  In the pressurizing / heating step 15, the metal wire exposed portions 10a and 10b that can be joined to the terminal electrodes 3a and 3b may be formed, and the coating peeling portions 8a ′ and 8b ′ are not necessarily cut and removed. However, for the convenience of illustration, in the following steps, the coating peeling portions 8a ′ and 8b are cut and removed.

(3) Solder application process 16
First, a solder bath adjusted to a predetermined temperature higher than the solder melting point and lower than the melting point of the insulating members 8a and 8b, for example, 250 ° C. to 310 ° C. is prepared.

  Then, after the metal wire exposed portions 10a and 10b of the first and second lead wires 6a and 6b are dipped in the flux bath and pulled up, the metal wire exposed portions 10a and 10b are placed in the solder bath 23 as shown in FIG. Then, the metal wire exposed portions 10a and 10b are brought into contact with the solder by dipping in a predetermined time (for example, 1 second), and the solder 11a and 11b are applied to the entire surface of the metal wire exposed portions 10a and 10b.

(4) Joining step 17
In this joining step 17, as shown in FIG. 8, a second pressurizing / heating device including a pedestal 24 and a pressurizing head 25 is prepared. This second pressurizing / heating device has a pulse heater 26 as a heating means capable of high-speed temperature rise / cooling, and a temperature sensor (not shown) for detecting the temperature of the tip portion built in the pressure head 25. Has been. Then, by detecting the temperature of the tip portion with a temperature sensor and performing feedback control, an optimum heating-cooling temperature profile is given to the joint portion between the terminal electrodes 3a, 3b and the metal wire exposed portions 10a, 10b, thereby reducing the minimum temperature. It is configured to be able to be joined with a limited pressure.

  Hereinafter, the processing content in this joining process 17 is demonstrated.

  First, the thermistor 1 and the first and second lead wires 6a and 6b are placed on the base 24 so that the thermistor 1 and the metal wire exposed portions 10a and 10b can be joined. Then, the pressure head 25 is lowered in the direction of arrow C, and the first and second metal wire exposed portions 10a and 10b are pressed and heated uniformly or substantially uniformly by the pressure head 25. Then, the terminal electrodes 3a and 3b and the first and second lead wires 6a and 6b are thermocompression-bonded by being cooled, thereby being soldered.

  FIG. 9 is a view showing a state in which the first and second metal wire exposed portions 10a and 10b and the terminal electrodes 3a and 3b are soldered together.

  That is, in this bonding process 17, since the heat energy is uniformly or substantially uniformly applied to the first and second metal line exposed portions 10a and 10b, a large bonding area is formed over the entire surface of the terminal electrodes 3a and 3b. can do. And the 1st metal wire exposed part 10a, the end surface part 4a of the terminal electrode 3a, and the side surface folding | returning part 5a are joined via the solder 11a, and solder fillet 11a 'is formed. Furthermore, the second metal wire exposed portion 10b, the end surface portion 4b of the terminal electrode 3b, and the side surface folded portion 5b are joined via the solder 11b, and between the tip of the covering portion 9b and the end surface portion 4b of the terminal electrode 3b. In addition, a solder fillet 11b 'is also formed in the gap t. As a result, a strong bonding strength can be obtained, and the reliability of electrical connectivity can be improved.

  Moreover, in this joining process 17, since it heats simultaneously with pressurization, a pressurizing force can be made small and therefore damage, such as a crack to the thermistor 1, can be reduced. Moreover, since time is not required unlike a reflow furnace, soldering can be performed in a short time.

(5) Exterior forming step 18
In the exterior forming process 18, as shown in FIG. 10, an insulating material such as an epoxy resin is applied so as to cover the thermistor 1, the solder fillets 11a 'and 11b', and the first and second metal wire exposed portions 10a and 10b. Then, a curing process is performed at a predetermined temperature (for example, 150 ° C.) for a predetermined time (for example, 1 hour) to form the exterior 12.

(6) Termination process 19
In the termination process 19, the first and second lead wires 6a and 6b are immersed in a solder bath, and solder is applied while removing the insulating members 8a and 8b at the ends of the first and second lead wires 6a and 6b. Then, terminal portions 13a and 13b coated with solder are formed, whereby an electronic component with lead wires as shown in FIG. 11 is manufactured.

  As described above, according to the first embodiment, the insulating members 8a and 8b at the distal end portion can be easily separated from the metal wires 7a and 7b without requiring a large-scale apparatus or a complicated method. At the same time, the wide and flat first and second metal line exposed portions 10a and 10b to be joined to the terminal electrodes 3a and 3b can be easily formed. In addition, since heating is performed simultaneously with pressurization in the bonding step 17, the applied pressure can be suppressed low, and damage such as cracks can be suppressed in the thermistor 1. Moreover, since it can solder-bond in a short time compared with a reflow furnace, it becomes a thing suitable for mass-productivity. Further, since the first and second metal line exposed portions 10a and 10b are heated uniformly or substantially uniformly, the first and second metal line exposed portions 10a and 10b have uniform or substantially uniform heat energy. Will be granted. As a result, a strong bonding strength can be obtained, and the reliability of electrical connection can be improved.

  In addition, since the solder fillets 11a 'and 11b' are formed not only in the first and second metal line exposed portion side surface folded portions 5a and 5b but also in the end surface portion 4a and the gap t, occurrence of electrode peeling is effectively prevented. Accordingly, it is possible to secure a desired bonding strength and to obtain an electronic component with a lead wire having good electrical connection and high reliability at low cost.

  FIG. 12 is a manufacturing process diagram showing the second embodiment of the manufacturing method. In the second embodiment, the terminal twisting process is performed between the exterior forming process 18 and the terminal processing process 19. 27 is interposed.

  Also in the second embodiment, the lead wire cutting step 14 to the exterior forming step 18 are executed as in the first embodiment.

  In the terminal twisting step 27, a predetermined position is twisted several times from the terminal ends of the first and second lead wires 6a and 6b constituting the parallel lead wires, and as shown in FIG. After that, as in the first embodiment, the termination process step 19 is executed to form the termination portions 29a and 29b, whereby an electronic component with a lead wire is obtained.

  In the second embodiment, since the predetermined position is twisted several times from the end, a load is applied to the joint between the first and second metal wire exposed portions 10a and 10b and the terminal electrodes 3a and 3b. Can be suppressed, and the reliability of electrical connectivity can be further improved. In particular, when an electronic component with a lead wire is manufactured using two single wires, a load is applied to the joint between the first and second metal wire exposed portions 10a and 10b and the terminal electrodes 3a and 3b. It becomes possible to suppress effectively.

  The present invention is not limited to the above embodiment. For example, in the above-described embodiment, the side folded portion 5a of the terminal electrode 3a to which the first metal line exposed portion 10a is joined and the side folded portion 5b of the terminal electrode 3b to which the second metal line exposed portion 10b is joined The first and second lead wires 6a and 6b are arranged so that the two are on the same plane, but the surface of the side folded portion 5a and the surface of the side folded portion 5b are perpendicular to each other. Similarly, when the first and second lead wires 6a and 6b are arranged, they can be easily manufactured by the method of the present invention. Further, the thermistor 1 may be arranged in an inclined shape with respect to the first and second lead wires 6a and 6b, and in this case, it can be easily manufactured by the method of the present invention.

  Further, the tip shape of the pressure head 21 in the pressurizing / heating step 15 is not limited to a flat shape, and various modifications can be made according to the desired shape of the metal wire exposed portions 10a and 10b. For example, a protrusion may be formed at the tip of the pressure head 21 such that a through hole is formed in the center of the metal wire exposed portions 10a and 10b, or the tips of the metal wire exposed portions 10a and 10b. A convex portion may be provided at the tip of the pressure head 21 as appropriate so that a groove-shaped cutout portion is formed. Moreover, you may form the front-end | tip of the pressurization head 21 in a sawtooth shape so that the surrounding end of the metal wire exposed parts 10a and 10b may have a sawtooth shape. As described above, the tip shape of the pressure head 21 is particularly limited as long as the surfaces of the metal wire exposed portions 10a and 10b can be formed flat or substantially flat and can be heated uniformly or substantially uniformly. is not.

  Moreover, in the said embodiment, the pressurization head 21 used at the pressurization / heating process 15 is such that the surfaces of the first and second metal wire exposed portions 10a and 10b can be formed flat or substantially flat at the same time. Two pressure heads are integrated, and each pressure head is configured to simultaneously press the first and second lead wires 6a and 6b. The lead wire may be pressed to process the surface of the exposed portion of the metal wire into a flat or substantially flat shape, and then moved to press the other lead wire.

  The shape of the pressure head is the same for the pressure head 25 used in the bonding step 17, so that the first and second metal wire exposed portions 10a and 10b and the terminal electrodes 3a and 3b can be soldered simultaneously. Two pressure heads are integrated, and each pressure head presses and joins the combination of each metal wire exposed portion and the corresponding terminal electrode, and then moves to move the other metal wire exposed portion and the terminal. The combination with the electrode may be pressed and joined.

  In the above embodiment, the thermistor is described as the electronic component. However, it goes without saying that the present invention can be similarly applied to other chip-type electronic components such as a capacitor.

  The present invention is a manufacturing method useful when a surface-mounted chip electronic component such as a surface-mounted thermistor is connected to a control board with a long lead wire.

1 Surface-mount thermistor (electronic component)
2 Thermistor body (component body)
3a, 3b Terminal electrodes 4a, 4b End face parts 5a, 5b Side turn part 6a First lead wire 6b Second lead wires 7a, 7b Metal wires 8a, 8b Insulating members 9a, 9b Covering part 10a First metal line exposure Part 10b Second metal wire exposed parts 11a, 11b Solder 11a ', 11b' Solder fillet 14 Lead wire cutting process 15 Pressure / heating process 16 Solder application process 17 Joining process

Claims (5)

The first and second lead wires each having a metal wire covered with an insulating member, and an electronic component having terminal electrodes formed at both ends of the component body, wherein the first lead wire is used as one terminal electrode. In the method of manufacturing an electronic component with a lead wire that joins and joins the second lead wire to the other terminal electrode,
The first lead wire and the second lead wire are arranged in parallel, and the second lead wire is shorter than the first lead wire by a predetermined length. Cutting the lead wire, and
The tip portions of the first and second lead wires to be joined to the terminal electrode are pressurized and heated, and the insulating members at the tip portions are peeled off from the metal wires to form the first and second metal wire exposed portions. Forming and simultaneously forming the first and second metal line exposed portions into a flat shape or a substantially flat shape; and
A solder application step of applying solder to the first and second metal wire exposed portions by bringing the first and second metal wire exposed portions into contact with solder;
The first and second metal wire exposed portions coated with the solder are pressed and heated uniformly or substantially uniformly to join the first and second metal wire exposed portions and the terminal electrodes of the electronic component. The manufacturing method of the electronic component with a lead wire characterized by including the joining process to make.   2. The method of manufacturing an electronic component with a lead wire according to claim 1, wherein a solder fillet is formed on a side folded portion and an end surface portion of the one terminal electrode.   The second metal wire exposed portion is formed so as to have a gap between the tip of the covering portion and the end surface portion of the other terminal electrode, and the side folded portion and the end surface portion of the other terminal electrode, and the 3. The method of manufacturing an electronic component with a lead wire according to claim 1, wherein a solder fillet is formed in the gap.   4. The first lead wire and the second lead wire are integrally joined in the longitudinal direction to form a set of parallel lead wires. The manufacturing method of the electronic component with a lead wire of description.   The method for manufacturing an electronic component with a lead wire according to any one of claims 1 to 4, wherein the electronic component is of a surface mount type.

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