JP2008066745A - Method for mounting electronic part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To accurately mount electronic parts where connection surfaces of bare IC chips and the like are directed upwardly that are supplied on a substrate at a high speed. <P>SOLUTION: The system includes a step of positioning the substrate 3, a step of taking electronic parts 2 out of a part supplying section 5 that supplies the electronic parts 2 whose connection surfaces are directed upwardly, a step of keeping a plurality of the parts 2 taken out of the section 5 in a row in the X direction by a first shuttle 27 and moving them to a transfer position in the X direction, a step of taking a plurality of the parts 2 at the transfer position from the first shuttle 27 to a second shuttle 28 and positioning each part 2 at a part supply position B by turning upside down the second shuttle 28 and moving the same in the X direction, and a step of receiving the part 2 at the part supply position B with a mounting head 15 and mounting the same on the substrate 3 positioned at a mounting position A by moving it in the receiving X direction. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component mounting method for mounting an electronic component, such as a bare IC chip, supplied on a substrate with a connection surface facing upward.

  As an electronic component mounting method for mounting an electronic component on a substrate, a plurality of mounting heads are arranged on the outer periphery of a rotating body that rotates intermittently at intervals of the intermittent rotation angle, and each mounting head is located between a supply position and a mounting position. And move the component supply unit to the supply position by moving the component supply unit, position the predetermined mounting position of the board at the mounting position, and mount the electronic component at the predetermined position on the board with the mounting head Various methods, such as a method of positioning and fixing a substrate, a method of taking a predetermined electronic component from a component supply unit with a mounting head movable in the X and Y directions, and moving to a predetermined mounting position on the substrate Things are known.

As an electronic component mounting method for mounting a bare IC chip on a substrate, the bare IC chip is supplied onto an XY table in a diced wafer state, and a predetermined bare IC chip is supplied to the first supply position on the XY table. And the reverse transfer means holds the predetermined bear IC chip at the first supply position, reverses it upside down and transfers it to the second supply position, and holds it at the second supply position by the mounting head. On the other hand, the substrate is placed and fixed on a support table movable in the Y direction by the Y direction table, the mounting head is moved to the X direction position of the mounting position on the substrate by the X direction table, and the mounting position on the substrate is changed. The substrate is moved by the Y direction table so that the Y direction position matches the Y direction position of the mounting head, and the mounting positions of the bare IC chip and the substrate are aligned, and then the mounting head That is configured to mount the IC chip is known (e.g., see Patent Document 1).
JP 2000-68327 A

  By the way, in the electronic component mounting method for mounting bare IC components as described above, the mounting head is moved and positioned in the X direction between the second component supply position and the mounting position, and the substrate is orthogonal to the X direction. By moving and positioning in the Y direction, high-precision and high-speed mounting is realized, but in order to further increase the speed, the second component supply position is arranged near the board, It is necessary to supply and position the bare IC component at the second component supply position at a high speed.

  However, in the electronic component mounting method described above, it takes a lot of time to hold the bare IC chip at the first supply position by the reversing transfer means, move it upside down, and position it at the second component supply position. In particular, since the size of IC wafers has been increasing in recent years, the moving distance between the first supply position and the second supply position is large, making it difficult to realize high-speed mounting.

  In view of such circumstances, the present invention provides an electronic component mounting method capable of mounting an electronic component supplied with a connection surface facing upward such as a bare IC chip on a substrate with high accuracy and high speed. Objective.

  The electronic component mounting method of the present invention includes a step of positioning a board, a step of taking out an electronic component from a component supply unit that supplies an electronic component having a connection surface facing upward, and a plurality of electronic components taken out from the component supply unit. Holding in a single line in the X direction with the shuttle of No. 1 and moving in the X direction to the delivery position, and receiving a plurality of electronic components from the first shuttle to the second shuttle at the delivery position, A process in which the shuttle is turned upside down and moved in the X direction to position each electronic component at the component supply position, and the electronic component is received by the mounting head at the component supply position and moved in the X direction and positioned at the mounting position. And a process of mounting on the board.

  According to this configuration, since the operation of taking out the electronic component and transferring it to the first shuttle is a simple operation, it can be transferred to the first shuttle at a high speed, and the second shuttle can be transferred from the first shuttle at the delivery position. By transferring multiple electronic components to the shuttle at once, the electronic components can be turned upside down at the same time and each electronic component can be sequentially supplied to the component supply position. Supply speed can be increased, and high-speed electronic component mounting can be realized.

  The first and second shuttles may be reciprocated, but if a plurality of shuttles are circulated, a further increase in speed can be realized. In addition, if the board is positioned in two directions in the XY direction in the board positioning process, if the board can be positioned at high speed, the mounting position by the mounting head can be fixed and mounting at higher speed and higher accuracy is possible. Further, when the substrate is positioned in one direction in the Y direction, the positioning of the substrate can be speeded up and can be mounted at a high speed.

  Further, instead of the second shuttle, a plurality of electronic components are collectively collected from the first shuttle at the delivery position by a turning shuttle that is mounted on a rotary table that can be rotated around a fixed axis and can turn to the parts supply position. If the electronic shuttle is turned upside down and turned to position each electronic component at the component supply position, the speed can be increased with a simpler structure than when the second shuttle is reciprocated or circulated.

  In addition, when electronic components are received by multiple mounting heads at the component supply position and mounted on the substrate by each mounting head at the mounting position, the tact time of the mounting process by the mounting head can be shortened to achieve higher-speed mounting. Can do.

  Also, the substrate positioning step moves and positions the mounting head and the substrate in one axial direction when moving and positioning in the Y direction orthogonal to the moving direction of the mounting head, so that the high speed can be achieved with a simple configuration. Can be implemented with accuracy.

  Further, in the mounting process, if both the electronic component and the mounting position of the board are recognized by the recognition means that can move between the mounting position and the retracted position by the mounting head, highly accurate mounting can be realized.

  According to the electronic component mounting method of the present invention, since the operation of taking out the electronic component and transferring it to the first shuttle is a simple operation, it can be transferred to the first shuttle at high speed and the first position can be transferred at the delivery position. By transferring a plurality of electronic components from one shuttle to the second shuttle at a time, the plurality of electronic components can be turned upside down and supplied to the component supply position sequentially. It is possible to increase the supply speed of the electronic component to the component supply position, and it is possible to realize high-speed mounting of the electronic component supplied with the connection surface facing upward.

(First embodiment)
Hereinafter, a first embodiment of the electronic component mounting method of the present invention will be described with reference to FIGS.

  An electronic component mounting apparatus 1 that performs the electronic component mounting method according to the present embodiment mounts an electronic component 2 supplied with a connection surface facing upward, such as a bare IC chip, on a substrate 3. And the component supply unit 5. In the main body part 4, the loading means 6 is provided on one side part of the main body part 4 in the X direction so as to transport the substrate 3 from one side (right side) to the other side (left side) in the left-right direction (X direction). A substrate positioning means 7 is disposed at the center, an unloading means 8 is disposed at the other side, and a conveying means 9 that conveys the substrate 3 through the component supply section 5 in the X direction is disposed.

  The board positioning means 7 is configured to position the position where the electronic component 2 of the board 3 is to be mounted at a mounting position A (see FIG. 3) set at a predetermined position in the X direction and the Y direction perpendicular thereto. Yes. Therefore, a support base 11 that fixes and supports the substrate 3 is disposed on an XY table 10 that can be moved and positioned in the X direction and the Y direction, and a transfer rail that can be connected to the carry-in means 6 and the carry-out means 8 on both front and rear sides thereof. 12 is disposed so as to be movable up and down, and lifting means (not shown) for moving the XY table 10 up and down is provided. Thus, the XY table 10 is lowered by the elevating means, the transfer rail 12 is moved to the upper position, and the substrate 3 is transferred to the transfer rail 12 with the carry-in means 6 and the transfer rail 12 connected. Thereafter, the XY table 10 is raised and the transfer rail 12 is moved to a lower position, whereby the substrate 3 is fixedly supported by the support base 11 and positioned in the XY direction by the XY table 10.

  A mounting means 13 is disposed above the substrate positioning means 7. The mounting means 13 moves the mounting head 15 in the X direction on the X direction table 14 in the Y direction position of the mounting position A, and between a component supply position B (see FIG. 3) described later and the mounting position A. It is configured to reciprocate. The mounting head 15 has a suction nozzle that sucks and holds the electronic component 2, its lifting and lowering means, and a pressurizing means that loads a predetermined pressurizing force, and further includes a heating means as necessary.

  Further, the electronic component 2 held by the mounting head 15 is recognized on the upper side between the mounting head 15 and the support base 11, and the position where the electronic component on the substrate 3 is to be mounted can be recognized on the lower side. Simultaneous recognition means 16 is provided. Note that the simultaneous recognition means 16 is configured to sequentially recognize the mounting positions of the electronic component 2 and the board 3 by switching the optical path with a prism or the like while being positioned at the mounting position, and recognizes them completely at the same time literally. is not. Of course, it may be recognized at the same time literally, but there are many cases where the configuration becomes complicated and the cost is high, which is not preferable.

  Reference numeral 17 denotes a transfer station disposed under one side of the substrate positioning means 17 in the movement path of the mounting head 15, and transfers an adhesive, a sealing agent, etc. to the electronic component 2 held by the mounting head 15. It is configured to grant.

  Component supply means 18 and 19 are disposed on the front side and the rear side of the component supply unit 5 and are connected to each other in a replaceable manner. The front-side component supply means 18 includes a component magazine 20 containing a plurality of semiconductor wafers formed by arranging a large number of electronic components 2 and being diced into individual pieces and supported on an expanded sheet, and a desired magazine. The magazine lifter 21 positions the semiconductor wafer at a predetermined supply height position. The rear component supply means 19 includes a plurality of component supply cassettes 22 mounted with a tape-shaped component assembly containing a large number of electronic components 2 mounted in parallel. The component takeout position can be positioned at a predetermined Y direction position.

  An expand base 23 (see FIG. 3) is installed at the front part of the component supply unit 5 so as to be movable up and down on a Y-direction table (not shown), and the component supply unit 18 is provided by a wafer drawing unit (not shown). The semiconductor wafer is introduced from the component magazine 20 into the expanding table 23 (see FIG. 3), and the expanding sheet is expanded on the expanding table 23 to separate the electronic components 2 at intervals. A desired electronic component 2 is positioned at a predetermined Y-direction position by a direction table.

  Reference numeral 24 is a recognition camera for recognizing the electronic component 2 on the expand base 23 or the component supply cassette 22 positioned at a predetermined Y direction position, and is arranged to be movable in the X direction and positioned at the predetermined Y direction position. It is configured to recognize any electronic component 2 that has been made.

  Between the component supply unit 5 and the component supply position B with respect to the mounting head 15, the electronic component 2 supplied with the connection surface facing upward in the component supply unit 5 is taken out, and the connection surface is directed downward to the component supply position B. A component reversal transfer means 25 to be supplied is disposed.

  As shown in detail in FIGS. 3A and 3B, the component reversal transfer unit 25 includes a transfer unit 26 that takes out each electronic component 2 from the component supply unit 5 and transfers it, and a transfer unit 26. A plurality of transferred electronic components 2 are held in a row in the X direction and can be moved in the X direction to the delivery position, and the plurality of electronic components 2 from the first shuttle 27 are collectively collected. The second shuttle 28 is configured to hold and turn upside down and move in the X direction to position each electronic component 2 at the component supply position B.

  In the illustrated example, the transfer means 26 is configured such that four suction nozzles 29 are arranged radially and can be rotated around a central horizontal axis, and the four electronic components 2 are sequentially held by the component supply unit 5. To the transfer position for the first shuttle 27, where it is sequentially transferred to the first shuttle 27, and then the first shuttle 27 is moved to the transfer position for the second shuttle 28, where four electrons are transferred. The components 2 are collectively delivered to the second shuttle 28, and each electronic component 2 is turned upside down by the second shuttle 28 so that the connection surface faces downward and is sequentially supplied to the component supply position B. ing.

  Next, the mounting operation of the electronic component 2 on the board 3 in the above configuration will be described. After the board 3 supplied by the carry-in means 6 is transferred onto the transfer rail 12 provided on the XY table 10. The transfer rail 12 is lowered and placed on the support table 11. After that, the XY table 10 is positioned so that the position where the electronic component 3 is to be mounted on the substrate 3 coincides with the mounting position A.

  On the other hand, the semiconductor wafer supplied by the component supplying means 18 and introduced onto the expanding table 23 is expanded by the expanding table 23 to separate each electronic component 2 and then the Y direction table is operated. The electronic component 2 to be mounted is positioned so as to be located immediately below the movement path of the suction nozzle 29 of the transfer means 26 of the component reversal transfer means 25. The same applies when the electronic component 2 is supplied by the component supply means 19. Next, the recognition camera 24 is positioned immediately above the electronic component 2 to be mounted, the suitability of the electronic component 2 and its position are recognized, the position of the Y direction table is corrected based on the recognition result, and the transfer means. 26, the position where the suction nozzle 25 should be positioned is obtained.

  Next, the suction nozzle 29 of the transfer means 26 is positioned at the position of the electronic component 2 to be mounted, and the electronic component 2 is sucked and held by the suction nozzle 29 and then lifted as described above. To the first shuttle 27 and sequentially delivered from the first shuttle 27 to the second shuttle 28, and the second shuttle 28 allows a plurality of electronic components 2 to be delivered. Are turned upside down at a time and are sequentially supplied to the component supply position B with the connection surface facing downward.

  At that time, the mounting head 15 of the mounting means 13 has moved to the component supply position B. After the electronic component 2 is held by the mounting head 15, the X-direction table 14 is actuated and the mounting head 15 is moved to the mounting position A. Is positioned.

  At the same time, the simultaneous recognition means 16 is positioned at the mounting position A of the substrate 3, and the position mark provided at the mounting position of the substrate 3 is recognized in this state, and the electronic component 2 held by the mounting head 15. And the position correction by the XY table 10 or the X direction table 14 is performed so that a predetermined positioning accuracy is ensured, and the position of the electronic component 2 is positioned with high accuracy at the mounting position of the substrate 3.

  Thereafter, the suction nozzle of the mounting head 15 is lowered by the raising / lowering means and pressurized by the pressurizing means, and the electronic component 2 is mounted. If necessary, the electronic component 2 is heated by heating means provided in the mounting head 15, and the electrodes of the electronic component 2 and the electrodes of the substrate 2 are joined by heating and pressing. Further, if necessary, the mounting head 15 is moved to the transfer station 17 before mounting and transferred with an adhesive or sealant. In that case, the mounting head 15 is heated by a heating means at the time of mounting so that the adhesive or sealant is transferred. Mounting including the curing process is completed.

  When the above-described mounting operation is repeated as appropriate and mounting of the required number of electronic components 2 on the substrate 3 is completed, the substrate 3 is unloaded for the next process by the unloading means 8 and the conveying means 9, and the next substrate 2 is carried in by the carrying-in means 6 and installed on the support base 11.

  According to this embodiment, in the component reversal transfer means 25, the process of taking out and transferring the electronic component 2 by the transfer means 26 is a simple operation, so that it can be transferred to the first shuttle 27 at high speed. The plurality of electronic components 2 are collectively delivered from the first shuttle 27 to the second shuttle 28, so that the plurality of electronic components 2 are turned upside down and the respective electronic components 2 are sequentially mounted. Since it can be supplied to the component supply position B set in the vicinity of A, the speed of the supply of the electronic component 2 to the component supply position B can be increased, and the mounting process by the mounting head 15 can also be increased. High-speed mounting of the electronic component 2 supplied with the connection surface facing upward can be realized.

  In addition, the simultaneous recognition means 16 that can move between the mounting position A by the mounting head 15 and the retracted position that avoids interference with the mounting head 15 recognizes both the mounting position of the electronic component 2 and the board 3. As a result, high-precision mounting can be realized.

  3A shows an example in which a single mounting head 15 is disposed on the mounting means 13, and FIG. 3B shows an example in which a plurality of mounting heads 15 are disposed. FIG. When a plurality of mounting heads 15 are disposed as shown in FIG. 6, the number of times the mounting head 15 reciprocates between the component supply position B and the mounting position A can be reduced, and the mounting speed can be improved accordingly. .

  In the above description of the embodiment, the substrate positioning unit 7 includes the XY table 10 and the mounting position is fixed at a fixed position. However, the substrate positioning unit 7 is positioned only in the Y direction. It may be configured by a Y table, and the mounting position may be combined with the X direction position of the mounting head 15 so that an arbitrary position within the range of the X direction width of the substrate 3 is set as the mounting position. Since positioning is sufficient, high-speed mounting with high accuracy can be realized with a simple configuration.

(Second Embodiment)
Next, a second embodiment of the electronic component mounting method of the present invention will be described with reference to FIG. In the description of the present embodiment, the description of the same components as those of the preceding embodiment will be omitted, and only the differences will be described.

  In the present embodiment, instead of the second shuttle 28 in the first embodiment, a plurality of electronic components 2 are collectively held at the delivery position, are turned upside down, and are rotatable about a fixed axis. A swivel shuttle 36 that is mounted on 35 and swivel to the component supply position B is provided.

  According to the present embodiment, higher speed can be realized with a simpler configuration than when the second shuttle 28 is reciprocated or circulated.

  According to the electronic component mounting method of the present invention, an electronic component is taken out from the component supply unit and transferred to the first shuttle at a high speed, and a plurality of electronic components are collectively transferred from the first shuttle to the second shuttle. By delivering and electronically turning multiple electronic components upside down and supplying each electronic component sequentially to the component supply position, it is possible to speed up the supply of electronic components to the component supply position, so the connection surface faces upward Thus, it can be suitably used for a component mounting apparatus for mounting electronic components supplied in this manner.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing an overall schematic configuration in a first embodiment of an electronic component mounting method of the present invention. The perspective view which shows schematic structure of the principal part in the same embodiment. The component supply process in the embodiment is shown, (a) is an operation explanatory diagram when there is one mounting head, (b) is an operation explanatory diagram when there is one mounting head. The component supply process in 2nd Embodiment of the electronic component mounting method of this invention is shown, (a) is a top view, (b) is operation | movement explanatory drawing.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Electronic component 3 Board | substrate 5 Component supply part 7 Board | substrate positioning means 13 Mounting means 15 Mounting head 16 Simultaneous recognition means 25 Component inversion transfer means 26 Transfer means 27 1st shuttle 28 2nd shuttle 35 Rotary table 36 Swing shuttle A Mounting position B Parts supply position

Claims (5)

  The step of positioning the substrate, the step of taking out the electronic components from the component supply unit that supplies the electronic components with the connection surface facing upward, and the plurality of electronic components taken out from the component supply unit in a row in the X direction by the first shuttle And moving to the delivery position in the X direction, receiving a plurality of electronic components from the first shuttle to the second shuttle at the delivery position, turning the second shuttle upside down, and moving in the X direction. A step of moving and positioning each electronic component at a component supply position, and a step of receiving the electronic component by the mounting head at the component supply position and moving it in the X direction and mounting the electronic component on the substrate positioned at the mounting position. A method for mounting electronic components.   In place of the second shuttle, a plurality of electronic components are collectively collected from the first shuttle at the delivery position by a turning shuttle that is mounted on a rotary table that can rotate around a fixed axis and can turn to the parts supply position. 2. The electronic component mounting method according to claim 1, wherein the electronic shuttle is turned upside down and turned to position each electronic component at a component supply position.   The electronic component mounting method according to claim 1, wherein electronic components are received by a plurality of mounting heads at a component supply position, and mounted on a substrate by each mounting head at the mounting position.   The electronic component mounting method according to claim 1, wherein the step of positioning the substrate moves and positions in a Y direction orthogonal to a moving direction of the mounting head.   5. In the mounting step, both the electronic component and the mounting position of the board are recognized by a recognition means that can move between a mounting position and a retracted position by the mounting head. Electronic component mounting method described in one.

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