JP2008053506A - Vibration component mounting circuit board and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the generation of abnormal sound due to the vibration of a buzzer, while avoiding the increase of part counts, processing man hour, and assembling man hour. <P>SOLUTION: In a control module 10 in which a buzzer 20 is mounted in a printed circuit board 11, a moisture-proof coating 16 which coats and prevents the moisture of the electric component mounting area 14 of the printed circuit board 11 is coated on the leg 24 of the buzzer 20 mounted in the printed circuit board 11. Since the leg of the buzzer is fixed by the moisture-proof coating material coated on the leg of the buzzer, it is possible to prevent the generation of abnormal sound caused by the leg to hit the printed circuit board accompanying the vibration of the buzzer. In the step to coat the moisture-proof coating material on the component mounting area by coating the moisture-proof coating material also on the leg of the buzzer, it becomes not necessary to increase the part count, the processing man hour, and the assembling man hour. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a vibration component-mounted circuit board and a method for manufacturing the same, and more particularly to an effective circuit board mounted circuit board for a control module of an automobile electrical component.

In a conventional mounting circuit board for a control module of an automobile electrical component, a buzzer as a vibration part for generating sound is assembled to a printed wiring board, and the printed wiring board is warped when the printed wiring board is assembled to a case. May occur.
This warp creates a gap between the foot of the buzzer and the printed wiring board, and when the buzzer is activated, the buzzer's foot hits the printed wiring board due to the vibration of the buzzer, causing abnormal noise. was there.
In response to this problem, mounting the buzzer on the printed wiring board with the vibration absorbing sheet sandwiched suppresses the transmission of the buzzer vibration to the printed wiring board and prevents the generation of noise due to the buzzer vibration. There is something devised as such. For example, see Patent Document 1.
Japanese Patent Laid-Open No. 2006-156689

  However, in the above-described control module mounting circuit board, the vibration absorbing sheet for absorbing the buzzer vibration is interposed in the gap between the buzzer and the printed wiring board. There was a problem that increased.

  An object of the present invention is to provide a vibration component mounting circuit board capable of preventing the generation of abnormal noise due to vibration of vibration components while avoiding an increase in the number of components, processing steps, and assembly steps, and a method for manufacturing the same. It is in.

Typical means for solving the above-described problems are as follows.
(1) In a vibration component mounting circuit board in which a vibration component is mounted on a printed wiring board by soldering the lead through the through hole of the printed wiring board and soldering,
A plurality of moisture-proof coating materials that coat and dampen the electrical wiring and electrical components of the printed wiring board protrude in a direction facing the printed wiring board along the outer periphery of the vibration component mounted on the printed wiring board. A vibration component mounting circuit board, wherein the circuit board is applied between a foot portion that is formed and the printed wiring board.
(2) The vibration component mounting circuit board according to (1), wherein the moisture-proof coating material fixes at least two feet of the vibration component to the printed wiring board.
(3) The feet of the vibration component fixed to the printed wiring board by the moisture-proof coating material are formed on both sides across a virtual line formed by a soldering portion where the lead of the vibration component is soldered. The vibration component mounting circuit board according to (1) or (2), wherein
(4) arranging a vibration component on the printed circuit board;
Soldering the vibration component to the electrical wiring of the printed wiring board;
A moisture proof coating material that coats the electrical wiring and the electrical components connected to the electrical wiring to prevent moisture is applied between the foot of the vibration component soldered to the printed wiring board and the printed wiring board. Steps,
A method for manufacturing a vibration component mounting circuit board, comprising:

According to the above (1) and (2), since the foot of the vibration component is fixed to the printed circuit board by the moisture-proof coating material applied to the foot of the vibration component and the printed circuit board, the vibration of the vibration component Accordingly, it is possible to prevent the generation of noise due to the foot of the vibration component hitting the printed wiring board.
According to the above (3), by forming the foot portions fixed by the moisture-proof coating material on both sides across the virtual line formed by the connection portion, the site for fixing the vibration component to the printed wiring board becomes wide. Therefore, the vibration component and the printed wiring board can be more securely fixed.
According to the above (4), in the step of applying the moisture-proof coating material to the electrical component and the electrical wiring of the printed wiring board, the moisture-proof coating material can also be applied between the foot of the vibration component and the printed wiring board. Therefore, without increasing the number of parts, the number of processing steps, and the number of assembling steps, it is possible to prevent the generation of abnormal noise due to the foot of the vibrating component hitting the printed wiring board with the vibration of the vibrating component.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  In the present embodiment, the vibration component mounting circuit board according to the present invention is configured as a control module (hereinafter referred to as a control module) of a power slide door device which is an example of an automobile electrical component.

As shown in FIG. 1, the control module 10 includes a printed wiring board 11. The printed wiring board 11 is configured by attaching a copper foil to a base material 12 formed in a substantially rectangular flat plate shape using an insulating material such as a glass epoxy resin. Is illustrated.) 13 is patterned.
An electrical component mounting area 14 is configured by an electrical wiring 13 on the printed wiring board 11, and an electrical component 15 such as a coil, a capacitor, a resistor (passive component), and a transistor (active component) is disposed in the electrical component mounting area 14. Then, it is electrically and mechanically connected by the soldering part 15a.
A moisture-proof coating material 16 is applied to the electrical component mounting area 14 so as to coat (cover) the electrical component 15 and the electrical wiring 13.

A buzzer 20 as a vibration component for generating sound is disposed on one side of the electrical component mounting area 14 of the printed wiring board 11 and is electrically and mechanically connected by a soldering portion 23.
The buzzer 20 is configured to generate a sound by vibrating a vibrator (not shown) by energizing an electromagnet (not shown). For example, the power slide door opens and closes by generating the sound. The driver is informed of this.
As shown in FIG. 1, the buzzer 20 includes a cylindrical case 21.
From one end surface of the case 21 (hereinafter referred to as the back surface), a pair of leads 22 for energizing the electromagnet are provided in parallel with the center line of the cylinder. The pair of leads 22 and 22 are respectively inserted into a pair of through holes 17 and 17 provided in the printed wiring board 11 and electrically and mechanically by a pair of soldering portions 23 and 23 respectively formed at the tip portions. It is connected.

On the back surface of the case 21 of the buzzer 20, three low-foot portions 24 for fixing the buzzer 20 to the printed wiring board 11 are arranged at equal intervals in the circumferential direction and project in parallel with the leads 22. Has been.
The buzzer 20 is mounted with an appropriate distance S (see FIG. 2B) with respect to the main surface of the printed wiring board 11, and in this state, the three legs 24 are connected to the main surface of the printed wiring board 11. It is placed in contact with the surface.
A moisture proof coating material 16 is applied to each of the three feet 24, and as shown in FIG. 1B, the moisture proof coating material 16 has a gap between the feet 24 and the printed wiring board 11. The filling portion 25 is formed by filling T.
The filling portion 25 of the moisture-proof coating material 16 fixes at least two feet 24 to the printed wiring board 11.
The two feet 24 and 24 fixed to the printed wiring board 11 by the moisture-proof coating material 16 are on both sides of the virtual line formed by the soldering portions 23 and 23 to which the pair of leads 22 and 22 are soldered. Is formed.

Here, the moisture-proof coating material 16 performs a dew-proof (moisture-proof) treatment of electrical parts, and is composed of, for example, a solute such as an acrylic resin, polyurethane, or epoxy synthetic resin dissolved in a volatile solvent (solvent). It is a solution.
As described above, since the moisture-proof coating material 16 can be adjusted to an arbitrary viscosity by melting the solute drip-proof material with a solvent, it can be easily and accurately applied to the printed wiring board 11 by a dispenser or the like.

  Next, an operation when the buzzer 20 of the control module 10 according to the above configuration is operated will be described.

When the buzzer 20 is sounded, the buzzer 20 vibrates as a whole.
At this time, if the printed wiring board 11 is warped, at least one of the three legs 24 of the buzzer 20 cannot be brought into contact with the printed wiring board 11 and the printed wiring board 11 A gap T is formed between 11 and the foot 24.
In the state where the warp has occurred, when the moistureproof coating material 16 is not applied and filled in the three feet 24 of the buzzer 20 (see FIG. 2B), the three buzzers 20 The leg portion 24 of the foot vibrates with respect to the printed wiring board 11 along with the vibration of the buzzer 20, so that the end surface of the foot portion 24 is at the gap T between the printed wiring board 11 and the foot portion 24. To generate noise.

  On the other hand, in the present embodiment, even if the printed wiring board 11 is warped and the gap T between the three legs 24 of the buzzer 20 and the printed wiring board 11 is formed, this gap T is filled with a moisture-proof coating material 16, whereby the three feet 24 of the buzzer 20 and the printed wiring board 11 are fixed by the moisture-proof coating material 16, so that the buzzer 20 is entirely Even if it vibrates, the three legs 24 of the buzzer 20 do not strike the printed wiring board 11 to generate noise.

  That is, in the control module 10 according to the present embodiment, by applying the moisture-proof coating material 16 to the feet 24 of the buzzer 20, the three feet 24 of the buzzer 20 when the buzzer 20 vibrates as a whole. It is possible to prevent a phenomenon in which abnormal noise is generated by hitting the printed wiring board 11.

  Next, a method for manufacturing the control module according to the present embodiment will be described with reference to FIG.

  An electrical component 15 such as a coil, a capacitor, a resistor, and a transistor is disposed in the electrical component mounting area 14 of the printed wiring board 11, and a pair of leads 22 of the buzzer 20, as shown in FIG. 22 is inserted through the through holes 17 and 17 provided in the printed wiring board 11 and arranged.

Next, as shown in FIG. 2B, a pair of soldering portions 23, 23 are formed at the tip ends of the pair of leads 22, 22 inserted into the printed wiring board 11 by flow soldering, respectively. As a result, the buzzer 20 is electrically and mechanically connected to the printed wiring board 11.
In this state, the buzzer 20 is fixed at an appropriate interval S with respect to the main surface of the printed wiring board 11, and the feet 24 are in contact with the main surface of the printed wiring board 11.

Thereafter, when the moisture-proof coating material 16 is applied to the electrical component mounting area 14 by the dispenser 30, the moisture-proof coating material 16 is applied to the three legs 24 of the buzzer 20 as shown in FIG. Are also applied by the dispenser 30, respectively.
At this time, since the distance S between the buzzer 20 and the printed wiring board 11 is large, the moisture-proof coating material 16 is dropped in the vicinity of the foot part 24 by the dispenser 30, whereby the foot part 24 of the buzzer 20 and the printed wiring board 11 are separated. When the gap T is generated due to warpage, the moisture-proof coating material 16 can be filled into the gap T to form the filling portion 25.

According to the manufacturing method of the control module described above, in the step of applying the moisture-proof coating material 16 to the electrical component mounting area 14 of the printed wiring board 11 by the dispenser 30, the moisture-proof coating material 16 is applied to the three feet 24 of the buzzer 20. Since it can be applied by the dispenser 30, it is not necessary to increase the number of parts, the number of processing steps, and the number of assembling steps.
Therefore, it is possible to prevent the generation of noise due to the foot portion 24 of the buzzer 20 hitting the printed wiring board 11 while avoiding an increase in the manufacturing cost of the control module.

  Further, since the state of the filling portion 25 in the foot portion 24 of the buzzer 20 of the moisture-proof coating material 16 can be confirmed from the interval S between the buzzer 20 and the printed wiring board 11, the quality and reliability of application of the moisture-proof coating material 16. Can be improved.

Needless to say, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention.

  For example, the moisture-proof coating material is not limited to being applied by a dispenser, but can be applied by various application methods such as a screen printing method, an inkjet printing method, a spray method, a brush method, and a dipping method.

  The vibration component is not limited to a buzzer, and may be a vibration component serving as a vibration generation source such as an electromagnetic relay (relay) or a chime.

  In the above-described embodiment, the three filling portions 25 for filling the moisture-proof coating material 16 with respect to the three foot portions 24 of the buzzer 20 are provided at three places. Good.

  In the above embodiment, the case where the vibration component mounting circuit board is applied to the control module of the power slide door device which is an example of the automobile electrical component has been described. However, the present invention can be used to mount a vibrating body such as other automotive electrical components. It can be applied to all circuit boards.

The control module which is one embodiment of this invention is shown, (a) is a front view, (b) is sectional drawing which follows the bb line of (a). It is each fragmentary sectional view which shows the manufacturing method of the control module which is one embodiment of this invention, (a) has shown the step which arrange | positions a buzzer on a printed wiring board, (b) has shown the buzzer on a printed wiring board. (C) shows the step of applying the moisture-proof coating material to the foot of the buzzer.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Control module (vibrating body mounting circuit board), 11 ... Printed wiring board, 12 ... Base material, 13 ... Electrical wiring, 14 ... Electrical component mounting area, 15 ... Electrical component, 15a ... Soldering part, 16 ... Moisture-proof coating Material: 17 ... Through hole, 20 ... Buzzer (vibrating component), 21 ... Case, 22 ... Lead, 23 ... Soldering part, 24 ... Foot part, 25 ... Filling part, 30 ... Dispenser, S ... Buzzer and printed wiring board , T: gap due to warpage of the printed wiring board.

Claims (4)

In the vibration component mounting circuit board on which the vibration component is mounted on the printed wiring board, the lead is inserted into the through hole of the printed wiring board and soldered,
A plurality of moisture-proof coating materials that coat and dampen the electrical wiring and electrical components of the printed wiring board protrude in a direction facing the printed wiring board along the outer periphery of the vibration component mounted on the printed wiring board. A vibration component mounting circuit board, wherein the circuit board is applied between a foot portion that is formed and the printed wiring board.   2. The vibration component mounting circuit board according to claim 1, wherein the moisture-proof coating material fixes at least two feet of the vibration component to the printed wiring board.   The feet of the vibration component fixed to the printed wiring board by the moisture-proof coating material are formed on both sides across a virtual line formed by a soldering portion where the lead of the vibration component is soldered. The vibration component mounting circuit board according to claim 1, wherein: Placing vibration components on a printed circuit board;
Soldering the vibration component to the electrical wiring of the printed wiring board;
A moisture proof coating material that coats the electrical wiring and the electrical components connected to the electrical wiring to prevent moisture is applied between the foot of the vibration component soldered to the printed wiring board and the printed wiring board. Steps,
A method for manufacturing a vibration component mounting circuit board, comprising:

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