JP2006328993A - Waterproof electronic circuit unit - Google Patents

Waterproof electronic circuit unit Download PDF

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JP2006328993A
JP2006328993A JP2005150483A JP2005150483A JP2006328993A JP 2006328993 A JP2006328993 A JP 2006328993A JP 2005150483 A JP2005150483 A JP 2005150483A JP 2005150483 A JP2005150483 A JP 2005150483A JP 2006328993 A JP2006328993 A JP 2006328993A
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circuit board
connector
resin
mold part
electronic circuit
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Tomihiro Iiizumi
富洋 飯泉
Koji Sasaki
孝二 佐々木
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Mahle Electric Drive Systems Co Ltd
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Kokusan Denki Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To prevent resin that composes a mold part from separating from a circuit board by mechanical vibration transmitted from an external part, in an electronic circuit unit having a structure covered with the mold part, by mounting a constituting part of an electronic circuit on the circuit board. <P>SOLUTION: A connector 1 and its other constituting part 2 or 6 are mounted on the circuit board 7, and the mold part 8 composed of an insulating resin is formed so as to cover a part of the connector 1, the constituting part 2 or 6 and the circuit board 7. A plurality of through-holes 701 are formed in the circuit board 7, and the resin of the mold part for respectively covering the surface side and both reverse sides of the circuit board, is mutually connected by resin filled inside the plurality of respective through-holes 701. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、防水性を持たせる必要がある電子回路ユニットに関するものである。   The present invention relates to an electronic circuit unit that needs to be waterproof.

内燃機関用の点火装置や、内燃機関に搭載される発電機の出力電圧を調整する電圧調整器等を構成する電子回路ユニットは、図５及び図６に示したように、コネクタ１及びその他の電子部品２，３，…，６を含む電子回路の複数の構成部品を、回路基板７に実装することにより構成される。この種のユニットは、雨水等がかかる箇所に取り付けられるため、防水性を持たせておく必要がある。そのため、この種のユニットにおいては、回路基板７と電子回路の構成部品１，２，…，６とを被覆するように、絶縁性熱可塑性樹脂からなるモールド部８を形成している。モールド部８は、コネクタ１の相手側コネクタが結合される部分１ａを外部に露呈させた状態で回路基板の表裏両面と回路の構成部品とを被覆するように設けられる。この種の電子回路ユニットは例えば特許文献１に示されている。
特開２００４−３１６４３６号 As shown in FIGS. 5 and 6, the electronic circuit unit constituting the ignition device for the internal combustion engine, the voltage regulator for adjusting the output voltage of the generator mounted on the internal combustion engine, and the like are shown in FIG. A plurality of components of the electronic circuit including the electronic components 2, 3,... 6 are mounted on the circuit board 7. Since this type of unit is attached to a place where rainwater or the like is applied, it must be waterproof. For this reason, in this type of unit, a mold portion 8 made of an insulating thermoplastic resin is formed so as to cover the circuit board 7 and the components 1, 2,... The mold portion 8 is provided so as to cover both the front and back surfaces of the circuit board and the circuit components in a state where the portion 1a to which the mating connector of the connector 1 is coupled is exposed to the outside. This type of electronic circuit unit is disclosed in Patent Document 1, for example.
JP 2004-316436 A

上記のような電子回路ユニットを内燃機関や、内燃機関により駆動される車両の車体等に取り付けた場合には、機関の運転中に絶えずユニットに振動が加わるため、モールド部を構成する樹脂が回路基板から剥離することがあった。樹脂が基板から剥離すると、剥離した樹脂が振動する際に、回路基板に対して変位するため、剥離した樹脂に結合されている電子回路の半田付け部に大きな応力がかかり、その半田付け部が剥離することがあった。また一旦樹脂が回路基板から剥離すると、剥離した樹脂が大きく振動するため、樹脂に亀裂が入って、防水性が失われることもあった。特に図５に示したように、モールド部８の相対する端部に取付部８０２，８０２を設けて、これらの取付部をボルト等の締結具により取付け箇所に締め付けて固定するようにした場合には、取付部８０２，８０２からユニットに振動が加わるため、これらの取付部の近傍で樹脂が剥離したり、図５に示すように樹脂に亀裂９が生じたりすることが多かった。   When the electronic circuit unit as described above is attached to an internal combustion engine or the vehicle body of a vehicle driven by the internal combustion engine, vibration is constantly applied to the unit during operation of the engine. Sometimes peeled off from the substrate. When the resin is peeled off from the substrate, when the peeled resin vibrates, it is displaced with respect to the circuit board. Therefore, a large stress is applied to the soldered portion of the electronic circuit bonded to the peeled resin, and the soldered portion is There was sometimes peeling. Further, once the resin is peeled from the circuit board, the peeled resin vibrates greatly, so that the resin is cracked and the waterproof property may be lost. In particular, as shown in FIG. 5, when mounting portions 802 and 802 are provided at opposite ends of the mold portion 8, and these mounting portions are fastened and fixed to mounting locations by bolts or other fasteners. Since the vibration is applied to the units from the mounting portions 802 and 802, the resin often peels in the vicinity of these mounting portions, or the resin has cracks 9 as shown in FIG.

本発明の目的は、外部から伝達される振動によりモールド部を構成する樹脂が回路基板から剥離して、モールド部の樹脂に亀裂が入ったり、モールドされている部品と回路基板との半田付け部が剥離したりするおそれを無くして信頼性を高めた防水形電子回路ユニットを提供することにある。   The object of the present invention is that the resin constituting the mold part is peeled off from the circuit board due to vibration transmitted from the outside, the resin of the mold part is cracked, or the soldered part between the molded part and the circuit board It is an object of the present invention to provide a waterproof electronic circuit unit with improved reliability by eliminating the possibility of peeling.

本発明は、コネクタを含む電子回路の複数の構成部品が回路基板に実装され、コネクタの相手側コネクタが接続される部分を外部に露呈させた状態で回路基板の表裏両面と構成部品とを被覆するように絶縁性熱可塑性樹脂からなるモールド部が形成されている防水形電子回路ユニットに適用される。   In the present invention, a plurality of components of an electronic circuit including a connector are mounted on a circuit board, and both the front and back surfaces of the circuit board and the components are covered with a portion to which the mating connector of the connector is connected exposed. Thus, the present invention is applied to a waterproof electronic circuit unit in which a mold part made of an insulating thermoplastic resin is formed.

本発明においては、回路基板を厚み方向に貫通した複数の貫通孔が形成され、回路基板の表面側及び裏両側をそれぞれ覆うモールド部の樹脂が複数の貫通孔のそれぞれの内部に充填された樹脂により相互に連結されている。   In the present invention, a resin in which a plurality of through holes penetrating the circuit board in the thickness direction is formed and the resin of the mold part covering each of the front side and the back side of the circuit board is filled in each of the plurality of through holes Are connected to each other.

上記のように、回路基板を貫通させて複数の貫通孔を設けて、回路基板の表面側を覆う樹脂と裏面側を覆う樹脂とを複数の孔のそれぞれの内部に充填した樹脂により相互に連結するようにすると、回路基板の表裏両面の樹脂が機械的に強固に結合されるため、外部から振動が加わった際に樹脂が回路基板から剥離するのを防ぐことができる。樹脂が回路基板から剥離するのを防ぐことができれば、樹脂が回路基板に対して変位するのを防ぐことができるため、樹脂に結合されている部品の半田付け部に大きな応力がかかるのを防ぐことができ、部品の半田付け部が基板から剥離するのを防ぐことができる。また外部から加えられる振動によりモールド部を構成する樹脂が回路基板から剥離するのを防ぐことができるため、樹脂に亀裂が生じて防水性が失われるのを防ぐことができる。   As described above, a plurality of through holes are provided by penetrating the circuit board, and the resin that covers the front side of the circuit board and the resin that covers the back side of the circuit board are connected to each other by the resin filled in each of the plurality of holes. By doing so, since the resin on both the front and back surfaces of the circuit board is mechanically firmly bonded, it is possible to prevent the resin from peeling from the circuit board when vibration is applied from the outside. If the resin can be prevented from peeling from the circuit board, the resin can be prevented from displacing with respect to the circuit board, so that a large stress is not applied to the soldering portion of the component bonded to the resin. It is possible to prevent the soldered part of the component from peeling off from the substrate. Moreover, since it can prevent that the resin which comprises a mold part peels from a circuit board by the vibration applied from the outside, it can prevent that a resin produces a crack and loses waterproofness.

多くの場合、上記モールド部には、該モールド部を取付け箇所に固定するための締結具が挿入される取付け孔を有する取付部が一体に形成されている。このように、モールド部に取付部が設けられている場合には、該取付部から振動が伝達されるので、上記貫通孔は、取付部の近傍に設けるのが好ましい。   In many cases, the mold part is integrally formed with an attachment part having an attachment hole into which a fastener for fixing the mold part to the attachment part is inserted. Thus, when the mounting part is provided in the mold part, since vibration is transmitted from the mounting part, it is preferable to provide the through hole in the vicinity of the mounting part.

本発明が対象とする電子回路ユニットにおいては、多くの場合、回路基板が長方形状または正方形状に形成されていて、該回路基板の一つの辺に沿ってコネクタが配置される。またモールド部には、モールド部を取付け箇所に固定するための締結具が挿入される取付け孔を有する一対の取付部が、回路基板の前記一つの辺と直交する一対の辺側でモールド部から外側に張り出した状態で該モールド部と一体に形成される。   In an electronic circuit unit targeted by the present invention, in many cases, a circuit board is formed in a rectangular shape or a square shape, and a connector is disposed along one side of the circuit board. Further, the mold portion has a pair of attachment portions having attachment holes into which fasteners for fixing the mold portion to the attachment location are inserted, from the mold portion on the pair of sides orthogonal to the one side of the circuit board. It is integrally formed with the mold part in a state of protruding outward.

上記のようにモールド部に取付部を設ける場合には、回路基板を厚み方向に貫通した貫通孔を回路基板の前記一対の辺のそれぞれの近傍に複数個ずつ形成し、回路基板の一対の辺の近傍にそれぞれ形成する複数個の貫通孔をそれぞれの辺に沿って並ぶように設けるのが好ましい。   When the mounting portion is provided in the mold portion as described above, a plurality of through holes penetrating the circuit board in the thickness direction are formed in the vicinity of each of the pair of sides of the circuit board, and the pair of sides of the circuit board is formed. It is preferable to provide a plurality of through-holes formed in the vicinity of each other so as to be arranged along each side.

上記のように貫通孔を設けると、一対の取付部の近傍に複数の貫通孔を分散させて配置して、外部から振動が伝達される取付部の近傍でモールド部を効果的に強化することができるため、外部から取付部を通して伝達される振動によりモールド部を構成する樹脂が回路基板から剥離するのを確実に防ぐことができる。   When the through holes are provided as described above, a plurality of through holes are dispersed in the vicinity of the pair of attachment portions, and the mold portion is effectively strengthened in the vicinity of the attachment portion to which vibration is transmitted from the outside. Therefore, it is possible to reliably prevent the resin constituting the mold part from being peeled off from the circuit board by the vibration transmitted from the outside through the attachment part.

以上のように、本発明によれば、回路基板を貫通させて複数の貫通孔を設けて、回路基板の表面側を覆う部分と裏面側を覆う部分とを複数の孔のそれぞれの内部に充填した樹脂により相互に連結して、回路基板の表裏両面の樹脂を機械的に強固に結合したので、外部から振動が加わった際に樹脂が回路基板から剥離するのを防ぐことができる。従って、ユニットに振動が加わった際に樹脂に結合されている部品の半田付け部に大きな応力がかかるのを防ぐことができ、部品の半田付け部が基板から剥離するのを防ぐことができる。   As described above, according to the present invention, a plurality of through holes are provided by penetrating the circuit board, and a portion covering the front surface side and a portion covering the back surface side are filled in each of the plurality of holes. Since the resins on both sides of the circuit board are mechanically and firmly bonded to each other by the resin, the resin can be prevented from peeling off from the circuit board when vibration is applied from the outside. Therefore, when a vibration is applied to the unit, it is possible to prevent a large stress from being applied to the soldered portion of the component bonded to the resin, and it is possible to prevent the soldered portion of the component from peeling off from the substrate.

また本発明によれば、モールド部を構成する樹脂が回路基板から剥離するのを防ぐことができるため、樹脂に亀裂が生じて防水性が失われるのを防ぐことができる。   Moreover, according to this invention, since it can prevent that resin which comprises a mold part peels from a circuit board, it can prevent that a resin produces a crack and loses waterproofness.

特に請求項２に記載した発明によれば、モールド部に設けられる取付部の近傍に貫通孔を設けるので、取付部を通して外部から伝達される振動によりモールド部を構成する樹脂が回路基板から剥離するのを効果的に防ぐことができる。   In particular, according to the invention described in claim 2, since the through hole is provided in the vicinity of the mounting portion provided in the mold portion, the resin constituting the mold portion is peeled off from the circuit board by vibration transmitted from the outside through the mounting portion. Can be effectively prevented.

また請求項３に記載された発明によれば、外部から振動が伝達されるユニットの取付部の近傍でモールド部を効果的に強化することができるので、外部から加えられる振動によりモールド部を構成する樹脂が回路基板から剥離するのを確実に防ぐことができ、モールド部を構成する樹脂が回路基板から剥離することにより生じる種々のトラブルを回避することができる。   According to the invention described in claim 3, since the mold part can be effectively strengthened in the vicinity of the mounting part of the unit to which vibration is transmitted from the outside, the mold part is constituted by vibration applied from the outside. It is possible to reliably prevent the resin to be peeled off from the circuit board, and it is possible to avoid various troubles caused by the resin constituting the mold part being peeled off from the circuit board.

以下図面を参照して本発明の好ましい実施形態を説明する。
図１及び図２は、本発明の第１の実施形態を示したもので、図１は同実施形態に係わるユニットの平面図、図２は図１に示されたユニットを同図のII−II線に沿って断面して示した断面図である。これらの図において、７は所定の配線パターンが形成された回路基板である。回路基板７には、コネクタ１とその他の電子部品２，３，…，６とを含む電子回路の複数の構成部品が実装されている。図示の例では、回路基板７が正方形状に形成されていて、その一辺に沿うようにコネクタ１が取り付けられている。 Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
1 and 2 show a first embodiment of the present invention. FIG. 1 is a plan view of a unit according to the embodiment, and FIG. 2 shows the unit shown in FIG. FIG. 3 is a cross-sectional view taken along line II. In these drawings, reference numeral 7 denotes a circuit board on which a predetermined wiring pattern is formed. A plurality of components of an electronic circuit including the connector 1 and other electronic components 2, 3,... 6 are mounted on the circuit board 7. In the illustrated example, the circuit board 7 is formed in a square shape, and the connector 1 is attached along one side thereof.

コネクタ１は樹脂の成形品からなっていて、回路基板７の一辺７ａに沿うように配置されて回路基板の上に載せられた基部１０１と、回路基板７の板面と平行な方向に沿って基部１０１から前方に突出した外筒部１０２とを一体に有するコネクタ本体１０３と、外筒部１０２内に設けられた多数の接点と、多数の接点にそれぞれ対応するように設けられてコネクタ本体内で対応する接点に一端が接続されたリード端子１０４，１０４，…とからなっている。コネクタ本体の基部１０１から外部に導出されたリード端子１０４，１０４，…は、回路基板７側に直角に折り曲げられている。リード端子１０４，１０４，…は回路基板７に設けられたスルーホールに挿入されて、回路基板７の配線パターンに半田付けされている。   The connector 1 is made of a resin molded product. The connector 101 is disposed along one side 7a of the circuit board 7 and placed on the circuit board. The connector 1 extends along a direction parallel to the plate surface of the circuit board 7. A connector main body 103 integrally having an outer cylindrical portion 102 projecting forward from the base 101, a large number of contacts provided in the outer cylindrical portion 102, and a plurality of contacts provided corresponding to the large number of contacts, respectively. The lead terminals 104, 104,... Are connected to corresponding contacts at one end. The lead terminals 104, 104,... Led out from the base 101 of the connector body are bent at right angles to the circuit board 7 side. The lead terminals 104, 104,... Are inserted into through holes provided in the circuit board 7 and soldered to the wiring pattern of the circuit board 7.

コネクタの外筒部１０２は相手側コネクタ１０に結合される部分であり、コネクタ１が相手側コネクタ１０に結合されるまでの間外部に露呈させておく必要がある部分である。相手側コネクタ１０のハウジングにはコネクタ１の外筒部１０２を挿入する空所が設けられ、相手側コネクタ１０のハウジングの空所にコネクタ１の外筒部１０２を挿入して相手側コネクタ１０とコネクタ１とを結合した際に、相手側コネクタ１０に設けられた多数の接触子がコネクタ１の外筒部１０２内の接点に接触して、コネクタ１が接続された回路基板７側の回路と相手側コネクタ１０が接続された外部回路とが電気的に接続されるようになっている。   The outer cylindrical portion 102 of the connector is a portion that is coupled to the mating connector 10 and is a portion that needs to be exposed to the outside until the connector 1 is coupled to the mating connector 10. The housing of the mating connector 10 is provided with a space for inserting the outer tube portion 102 of the connector 1. The outer tube portion 102 of the connector 1 is inserted into the space of the housing of the mating connector 10 and the mating connector 10. When the connector 1 is coupled, a large number of contacts provided on the mating connector 10 come into contact with the contacts in the outer cylindrical portion 102 of the connector 1, and the circuit on the circuit board 7 side to which the connector 1 is connected The external circuit to which the mating connector 10 is connected is electrically connected.

ユニットに防水性を持たせるため、回路基板７と電子回路の構成部品１，２，…，６とを被覆するように、絶縁性熱可塑性樹脂からなるモールド部８が形成されている。モールド部８は、コネクタ１の相手側コネクタが結合される部分である外筒部１０２を外部に露呈させた状態で回路基板の表裏両面と回路の構成部品とを被覆するように設けられる。   In order to make the unit waterproof, a molded portion 8 made of an insulating thermoplastic resin is formed so as to cover the circuit board 7 and the electronic circuit components 1, 2,. The mold portion 8 is provided so as to cover both the front and back surfaces of the circuit board and the circuit components in a state where the outer cylinder portion 102 which is a portion to which the mating connector of the connector 1 is coupled is exposed to the outside.

モールド部８には、該モールド部を取付け箇所に固定するためのボルト等の締結具が挿入される取付け孔８０１，８０１を有する一対の取付部８０２，８０２が設けられている。取付部８０２，８０２は、回路基板の一つの辺７ａと直交する一対の辺７ｂ，７ｃ側でモールド部８から外側に張り出すようにしてモールド部８と一体に形成されている。取付部８０２，８０２は、回路基板７を一対の辺７ｂ，７ｃの対向方向に２等分する中心軸線Ｏ1−Ｏ1に対して左右対称に設けられている。   The mold portion 8 is provided with a pair of attachment portions 802 and 802 having attachment holes 801 and 801 into which fasteners such as bolts for fixing the mold portion to the attachment portion are inserted. The mounting portions 802 and 802 are formed integrally with the mold portion 8 so as to project outward from the mold portion 8 on the pair of sides 7b and 7c orthogonal to one side 7a of the circuit board. The mounting portions 802 and 802 are provided symmetrically with respect to the central axis O1-O1 that bisects the circuit board 7 in the direction opposite to the pair of sides 7b and 7c.

モールド部８は、電子回路の構成部品を実装した回路基板７を図示しない金型内にインサートした状態で、該金型内に溶融した絶縁性熱可塑性樹脂を電子部品を破壊するおそれがない圧力で注入する、いわゆるホットメルト工法により形成される。   The mold portion 8 is a pressure that does not cause the electronic parts to be destroyed by the insulating thermoplastic resin melted in the mold in a state where the circuit board 7 on which the components of the electronic circuit are mounted is inserted in a mold (not shown). It is formed by a so-called hot-melt method that is injected by the above method.

本発明においては、外部から伝達される振動によりモールド部８を構成する樹脂が回路基板７から剥離するのを防止するため、回路基板７を厚み方向に貫通した貫通孔７０１を複数個形成して、モールド部８を成形する際に貫通孔７０１内に充填される樹脂により、回路基板７の表面側及び裏両側をそれぞれ覆うモールド部の樹脂を連結するようにしている。   In the present invention, in order to prevent the resin constituting the mold portion 8 from being peeled off from the circuit board 7 by vibration transmitted from the outside, a plurality of through holes 701 penetrating the circuit board 7 in the thickness direction are formed. The resin of the mold part that covers the front side and the back side of the circuit board 7 is connected by the resin filled in the through hole 701 when the mold part 8 is molded.

本実施形態のように、モールド部８に一対の取付部８０２，８０２が形成されている場合には、上記貫通孔７０１をモールド部の取付部８０２の近傍に位置させた状態で設けるのが好ましい。本実施形態では、回路基板の一対の辺７ｂ，７ｃのそれぞれの近傍に回路基板７を厚み方向に貫通した断面が円形を呈する貫通孔７０１が４個ずつ形成されている。回路基板の一対の辺７ｂ，７ｃの近傍にそれぞれ形成された複数個の貫通孔はそれぞれの辺に沿って等間隔で並ぶように設けられていて、回路基板７の表面側及び裏面側をそれぞれ覆うモールド部の樹脂が各貫通孔７０１の内部に充填された樹脂により相互に連結されている。   When a pair of mounting portions 802 and 802 are formed in the mold portion 8 as in the present embodiment, it is preferable to provide the through hole 701 in a state of being positioned in the vicinity of the mounting portion 802 of the mold portion. . In the present embodiment, four through holes 701 each having a circular cross section through the circuit board 7 in the thickness direction are formed in the vicinity of the pair of sides 7b and 7c of the circuit board. A plurality of through holes respectively formed in the vicinity of the pair of sides 7b and 7c of the circuit board are provided so as to be arranged at equal intervals along each side, and the front side and the back side of the circuit board 7 are respectively provided. The resin of the mold part to cover is mutually connected by the resin with which the inside of each through-hole 701 was filled.

上記のように貫通孔を設けると、一対の取付部８０２，８０２の近傍で、回路基板の一対の辺のそれぞれに沿って複数の貫通孔を分散配置して、取付部を通して伝達される機械的な振動に対してモールド部をバランス良く強化することができるため、外部から取付部を通して伝達される振動によりモールド部を構成する樹脂が回路基板から剥離するのを確実に防ぐことができる。また上記のように貫通孔を設けると、モールド部８を成形する際の湯めぐり（溶融樹脂の流動）を良好にして、モールド部内に気泡や樹脂の未充填部が生じるのを防ぐことができる。   When the through holes are provided as described above, a plurality of through holes are dispersedly arranged along each of the pair of sides of the circuit board in the vicinity of the pair of mounting portions 802 and 802, and transmitted through the mounting portions. Since the mold part can be strengthened with a good balance against the vibration, it is possible to reliably prevent the resin constituting the mold part from being peeled off from the circuit board by the vibration transmitted from the outside through the mounting part. Further, when the through hole is provided as described above, it is possible to improve hot water circulation (flow of molten resin) when the mold part 8 is formed, and to prevent generation of bubbles and unfilled parts of the resin in the mold part. .

図１及び図２に示した実施形態では、回路基板に設ける貫通孔７０１を断面が円形を呈する孔としたが、各貫通孔７０１の断面形状は円形に限られるものではない。例えば図３及び図４に示したように、各貫通孔７０１を長孔状またはスリット状の孔としてもよい。   In the embodiment shown in FIGS. 1 and 2, the through hole 701 provided in the circuit board is a hole having a circular cross section, but the cross sectional shape of each through hole 701 is not limited to a circular shape. For example, as shown in FIGS. 3 and 4, each through-hole 701 may be a long hole or a slit.

本発明の第１の実施形態に係わるユニットの平面図である。It is a top view of the unit concerning the 1st Embodiment of the present invention. 図１に示されたユニットを同図のII−II線に沿って断面して示した断面図である。FIG. 2 is a cross-sectional view showing the unit shown in FIG. 1 along the line II-II in FIG. 本発明の第２の実施形態に係わるユニットの平面図である。It is a top view of the unit concerning the 2nd Embodiment of this invention. 図３に示されたユニットを同図のIV−IV線に沿って断面して示した断面図である。FIG. 4 is a cross-sectional view showing the unit shown in FIG. 3 along the line IV-IV in FIG. 従来のユニットの平面図である。It is a top view of the conventional unit. 図５に示されたユニットを同図のVI−VI線に沿って断面して示した断面図である。FIG. 6 is a cross-sectional view of the unit shown in FIG. 5 taken along line VI-VI in FIG.

符号の説明Explanation of symbols

１ コネクタ
２〜６ 電子回路の構成部品
７ 回路基板
７０１ 貫通孔
８ モールド部
８０２ 取付部
DESCRIPTION OF SYMBOLS 1 Connector 2-6 Electronic circuit component 7 Circuit board 701 Through-hole 8 Mold part 802 Attachment part

Claims (3)

コネクタを含む電子回路の複数の構成部品が回路基板に実装され、前記コネクタの相手側コネクタが接続される部分を外部に露呈させた状態で前記回路基板の表裏両面と前記構成部品とを被覆するように絶縁性熱可塑性樹脂からなるモールド部が形成されている防水形電子回路ユニットにおいて、
前記回路基板を厚み方向に貫通した複数の貫通孔が形成され、
前記回路基板の表面側及び裏面側をそれぞれ覆う前記モールド部の樹脂が前記複数の貫通孔のそれぞれの内部に充填された樹脂により相互に連結されていること、
を特徴とする防水形電子回路ユニット。 A plurality of components of an electronic circuit including a connector are mounted on a circuit board, and both the front and back surfaces of the circuit board and the component are covered with a portion to which the mating connector of the connector is connected exposed outside In a waterproof electronic circuit unit in which a mold part made of an insulating thermoplastic resin is formed,
A plurality of through holes penetrating the circuit board in the thickness direction are formed,
The resin of the mold part respectively covering the front side and the back side of the circuit board is connected to each other by a resin filled in each of the plurality of through holes,
Waterproof electronic circuit unit characterized by 前記モールド部を取付け箇所に固定するための締結具が挿入される取付け孔を有する取付部が、前記モールド部と一体に形成され、
前記貫通孔は、前記取付部の近傍に設けられていること、
を特徴とする請求項１に記載の防水形電子回路ユニット。 An attachment part having an attachment hole into which a fastener for fixing the mold part to an attachment part is inserted is formed integrally with the mold part,
The through hole is provided in the vicinity of the mounting portion;
The waterproof electronic circuit unit according to claim 1. コネクタを含む電子回路の複数の構成部品が回路基板に実装され、前記コネクタの相手側コネクタが接続される部分を外部に露呈させた状態で前記回路基板の表裏両面と前記構成部品とを被覆するように絶縁性熱可塑性樹脂からなるモールド部が形成されている防水形電子回路ユニットにおいて、
前記回路基板は長方形状または正方形状に形成されていて、該回路基板の一つの辺に沿って前記コネクタが配置され、
前記モールド部を取付け箇所に固定するための締結具が挿入される取付け孔を有する一対の取付部が、前記回路基板の前記一つの辺と直交する一対の辺側で前記モールド部から外側に張り出した状態で該モールド部と一体に形成され、
前記回路基板を厚み方向に貫通した貫通孔が前記回路基板の前記一対の辺のそれぞれの近傍に複数個ずつ形成され、
前記回路基板の一対の辺の近傍にそれぞれ形成された複数個の貫通孔はそれぞれの辺に沿って並ぶように設けられていて、前記回路基板の表面側及び裏面側をそれぞれ覆う前記モールド部の樹脂が各貫通孔の内部に充填された樹脂により相互に連結されていること、 を特徴とする請求項１に記載の防水形電子回路ユニット。
A plurality of components of an electronic circuit including a connector are mounted on a circuit board, and the front and back surfaces of the circuit board and the component are covered with a portion to which the mating connector of the connector is connected exposed to the outside. In a waterproof electronic circuit unit in which a mold part made of an insulating thermoplastic resin is formed,
The circuit board is formed in a rectangular or square shape, and the connector is disposed along one side of the circuit board,
A pair of attachment parts having attachment holes into which fasteners for fixing the mold part to the attachment location are inserted project outward from the mold part on a pair of sides orthogonal to the one side of the circuit board. Formed integrally with the mold part
A plurality of through holes penetrating the circuit board in the thickness direction are formed in the vicinity of each of the pair of sides of the circuit board,
A plurality of through holes respectively formed in the vicinity of the pair of sides of the circuit board are provided so as to be arranged along the respective sides, and the mold portion that covers the front side and the back side of the circuit board, respectively. The waterproof electronic circuit unit according to claim 1, wherein the resins are connected to each other by a resin filled in each through hole.
JP2005150483A 2005-05-24 2005-05-24 Waterproof electronic circuit unit Pending JP2006328993A (en)

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