JP2008038934A - 制振構造体 - Google Patents
制振構造体 Download PDFInfo
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- JP2008038934A JP2008038934A JP2006210257A JP2006210257A JP2008038934A JP 2008038934 A JP2008038934 A JP 2008038934A JP 2006210257 A JP2006210257 A JP 2006210257A JP 2006210257 A JP2006210257 A JP 2006210257A JP 2008038934 A JP2008038934 A JP 2008038934A
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- vibration
- viscoelastic resin
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- steel plate
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- 238000013016 damping Methods 0.000 claims description 52
- 229910000831 Steel Inorganic materials 0.000 claims description 35
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- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 229910018134 Al-Mg Inorganic materials 0.000 claims description 14
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- 239000002994 raw material Substances 0.000 description 3
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- 239000004709 Chlorinated polyethylene Substances 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
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- 230000007547 defect Effects 0.000 description 2
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- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 238000011835 investigation Methods 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 239000002932 luster Substances 0.000 description 2
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- 239000004014 plasticizer Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
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- 229910001069 Ti alloy Inorganic materials 0.000 description 1
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- 239000000654 additive Substances 0.000 description 1
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
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- 229920001778 nylon Polymers 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229920001485 poly(butyl acrylate) polymer Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
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- 238000004080 punching Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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Images
Landscapes
- Connection Of Plates (AREA)
- Vibration Prevention Devices (AREA)
Abstract
【解決手段】表材1,裏材2で粘弾性樹脂層3を挟み込んだ積層構造をもち、カシメ接合で表材1,裏材2が一体化されている。粘弾性樹脂層3は所定サイズに裁断された粘弾性樹脂フィルムからなり、スペーサ4の格子部4bで隣り合う粘弾性樹脂層3を相互に仕切ることが好ましい。
【選択図】図1
Description
複合型制振鋼板の加工性を改善するため、溶接,カシメ等により表材と裏材とを一体化することが知られている(特許文献1)。表裏一体化により表材又は裏材の塑性変形に他方の鋼板が追従し、反り等の形状不良なく所定形状に曲げ加工できるとされている。
開口部を有するスペーサを二枚の金属板の間に挟み間隙を一定に維持すると、粘弾性樹脂を偏りなく充填できるので、制振性能を初めとする品質も一定化する。
Zn11Mg2相の生成抑制は、0.0005質量%以上(好ましくは、0.001質量%以上)のB含有によっても達成される。しかし、0.045質量%を超える過剰量のB含有では、めっき層中にTi-B系析出物、Al-B系析出物が成長し、めっき層に凹凸(ブツ)が生じ、外観を損ねるようになる。
粘弾性樹脂から作成されたフィルムを適宜のサイズに裁断し、表材1又は裏材2の上に接着又は粘着させる。樹脂フィルムは、必要とする制振性能を付与する上で0.1mm以上の膜厚が好ましいが、5mmを超える厚膜になると加工性,施工性に支障をきたす。
表材1,裏材2,開口部4aで区画される空隙に粘弾性樹脂フィルムが確保されるため、表材1,裏材2がカシメ接合された後、更には制振構造体が建築物躯体に取り付けられた後でも粘弾性樹脂層3が均一な厚みで表材1,裏材2間に分布する。
スペーサ4としては、粘弾性樹脂フィルムより若干薄い板厚:0.4mmのめっき鋼板を素材とし、214.5mm×734mmの開口部4aを縦横に複数形成した。なお、隣り合う開口部4a間の格子部4bの幅は60mmに設定した。
〔試験方法〕
制振構造体の所定位置に図4の位置関係で6個の振動センサーSを取り付け、インパルスハンマHで制振構造体を加振して振動センサーSで振動加速度を測定し(図5)、ハンマ加振力に対する振動加速度レベルの比として伝達関数を求めた。
測定結果を対比すると、溶接接合した制振構造体に比較してカシメ接合した制振構造体が制振性能に優れており、制振性能の面からもカシメ接合の有意性を確認できた(図6)。
Claims (3)
- 粘弾性樹脂層を挟んで二枚の金属板を重ね合わせた積層構造をもち、一方の金属板から起立した円筒部が締結用ボルト孔となり、前記円筒部の先端を拡開して他方の金属板に形成した開口縁部に噛み合わせたカシメ接合部で二枚の金属板が相互に接合されていることを特徴とする制振構造体。
- 金属板の何れか一方又は双方がZn-Al-Mg合金めっき鋼板又は塗装Zn-Al-Mg合金めっき鋼板である請求項1記載の制振構造体。
- 開口部を有するスペーサが二枚の金属板の間に挟まれ、金属板,スペーサで区画される空隙に粘弾性樹脂が充填されている請求項1記載の制振構造体。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2006210257A JP4964531B2 (ja) | 2006-08-01 | 2006-08-01 | 制振構造体 |
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JP2006210257A JP4964531B2 (ja) | 2006-08-01 | 2006-08-01 | 制振構造体 |
Publications (2)
Publication Number | Publication Date |
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JP2008038934A true JP2008038934A (ja) | 2008-02-21 |
JP4964531B2 JP4964531B2 (ja) | 2012-07-04 |
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JP2006210257A Active JP4964531B2 (ja) | 2006-08-01 | 2006-08-01 | 制振構造体 |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5285082U (ja) * | 1975-12-22 | 1977-06-24 | ||
JPS6452731U (ja) * | 1987-09-28 | 1989-03-31 | ||
JPH0581351U (ja) * | 1992-04-08 | 1993-11-05 | 甲南電機株式会社 | 油圧ブレーカ用防振ブラケット |
JPH06340024A (ja) * | 1993-06-01 | 1994-12-13 | Yuusan Gasket Kk | 制振板および制振構造 |
JP2000291711A (ja) * | 1999-04-02 | 2000-10-20 | Sanwa Packing Kogyo Co Ltd | 緩衝ワッシャ及び緩衝構造 |
WO2004048803A1 (ja) * | 2002-11-27 | 2004-06-10 | Asahi Rubber Co., Ltd. | 複合型制振材 |
JP2005337487A (ja) * | 2004-04-28 | 2005-12-08 | Sekisui Chem Co Ltd | 制振鋼板 |
-
2006
- 2006-08-01 JP JP2006210257A patent/JP4964531B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5285082U (ja) * | 1975-12-22 | 1977-06-24 | ||
JPS6452731U (ja) * | 1987-09-28 | 1989-03-31 | ||
JPH0581351U (ja) * | 1992-04-08 | 1993-11-05 | 甲南電機株式会社 | 油圧ブレーカ用防振ブラケット |
JPH06340024A (ja) * | 1993-06-01 | 1994-12-13 | Yuusan Gasket Kk | 制振板および制振構造 |
JP2000291711A (ja) * | 1999-04-02 | 2000-10-20 | Sanwa Packing Kogyo Co Ltd | 緩衝ワッシャ及び緩衝構造 |
WO2004048803A1 (ja) * | 2002-11-27 | 2004-06-10 | Asahi Rubber Co., Ltd. | 複合型制振材 |
JP2005337487A (ja) * | 2004-04-28 | 2005-12-08 | Sekisui Chem Co Ltd | 制振鋼板 |
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