JP2008032702A5 - - Google Patents

Download PDF

Info

Publication number
JP2008032702A5
JP2008032702A5 JP2007175160A JP2007175160A JP2008032702A5 JP 2008032702 A5 JP2008032702 A5 JP 2008032702A5 JP 2007175160 A JP2007175160 A JP 2007175160A JP 2007175160 A JP2007175160 A JP 2007175160A JP 2008032702 A5 JP2008032702 A5 JP 2008032702A5
Authority
JP
Japan
Prior art keywords
defect
layer
defect information
manufacturing process
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007175160A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008032702A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007175160A priority Critical patent/JP2008032702A/ja
Priority claimed from JP2007175160A external-priority patent/JP2008032702A/ja
Publication of JP2008032702A publication Critical patent/JP2008032702A/ja
Publication of JP2008032702A5 publication Critical patent/JP2008032702A5/ja
Pending legal-status Critical Current

Links

JP2007175160A 2006-07-03 2007-07-03 欠陥検査装置および欠陥検査方法 Pending JP2008032702A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007175160A JP2008032702A (ja) 2006-07-03 2007-07-03 欠陥検査装置および欠陥検査方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006183112 2006-07-03
JP2007175160A JP2008032702A (ja) 2006-07-03 2007-07-03 欠陥検査装置および欠陥検査方法

Publications (2)

Publication Number Publication Date
JP2008032702A JP2008032702A (ja) 2008-02-14
JP2008032702A5 true JP2008032702A5 (https=) 2010-07-01

Family

ID=39122259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007175160A Pending JP2008032702A (ja) 2006-07-03 2007-07-03 欠陥検査装置および欠陥検査方法

Country Status (1)

Country Link
JP (1) JP2008032702A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602008004195D1 (de) * 2007-09-21 2011-02-10 Bobst Sa Verfahren zum Bestimmen der Oberflächengüte eines Trägers und zugehörige Maschine zur Transformation des Trägers
JP6123398B2 (ja) * 2013-03-18 2017-05-10 富士通株式会社 欠陥箇所予測装置、識別モデル生成装置、欠陥箇所予測プログラムおよび欠陥箇所予測方法
JP2014182219A (ja) * 2013-03-18 2014-09-29 Fujitsu Ltd 欠陥箇所予測装置、識別モデル生成装置、欠陥箇所予測プログラムおよび欠陥箇所予測方法
JP2024066136A (ja) * 2022-11-01 2024-05-15 日本電気硝子株式会社 ガラス板の製造方法及びガラス板の検査設備

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2986410B2 (ja) * 1995-07-13 1999-12-06 松下電器産業株式会社 半導体ウェハの不良解析方法及びその装置
JP2000306964A (ja) * 1999-04-22 2000-11-02 Hitachi Ltd 検査データ処理方法および検査データ処理装置
JP3920003B2 (ja) * 2000-04-25 2007-05-30 株式会社ルネサステクノロジ 検査データ処理方法およびその装置
JP4649051B2 (ja) * 2001-03-21 2011-03-09 オリンパス株式会社 検査画面の表示方法及び基板検査システム

Similar Documents

Publication Publication Date Title
CN104483811B (zh) 掩模检查装置和方法以及虚拟图产生装置和方法
US8711348B2 (en) Method of inspecting wafer
IL290778A (en) Method for determining defectiveness of pattern based on after development image
JP2009186338A5 (https=)
JP2013225618A5 (https=)
JP5795046B2 (ja) ソルダージョイントの検査方法
CN104460226B (zh) 一种光刻工艺热点的自动修复方法
EP2477469A3 (en) Suitability determination method for determination standard value and method for specifying optimum value thereof, inspection system for substrate on which components are mounted, simulation method at production site, and simulation system
US10119866B2 (en) In-process monitoring, automated decision-making, and process control for composite manufacturing using part-referenced ply-by-ply infrared thermography and other non-contact non-destructive inspection
WO2007143449A3 (en) Determining information about defects or binning defects detected on a wafer after an immersion lithography process is performed on the wafer
CN104535587A (zh) 一种基于机器视觉的pcba焊点检测方法
TW200622509A (en) A method for performing full-chip manufacturing reliability checking and correction
JP2008032702A5 (https=)
JP2005286161A5 (https=)
JP5863101B2 (ja) X線非破壊検査装置
CN104853539A (zh) 一种检测电子元件贴装精度的方法
TW200623302A (en) Inspecting method and apparatus thereof
CN101432866A (zh) 缺陷分布图案的对照方法和装置
JP2011018816A5 (https=)
JP6650379B2 (ja) 表面検査装置、表面検査方法及びデータベース
JP2008032702A (ja) 欠陥検査装置および欠陥検査方法
CN105593636B (zh) 检查基板时的测定区域补偿方法
CN102661872A (zh) 一种输电铁塔损伤的检测方法
JP6140429B2 (ja) 銅箔の表面状態の評価装置、銅箔の表面状態の評価プログラム及びそれが記録されたコンピュータ読み取り可能な記録媒体、並びに、銅箔の表面状態の評価方法
JP2010085347A5 (https=)