IL290778A - Method for determining defectiveness of pattern based on after development image - Google Patents

Method for determining defectiveness of pattern based on after development image

Info

Publication number
IL290778A
IL290778A IL290778A IL29077822A IL290778A IL 290778 A IL290778 A IL 290778A IL 290778 A IL290778 A IL 290778A IL 29077822 A IL29077822 A IL 29077822A IL 290778 A IL290778 A IL 290778A
Authority
IL
Israel
Prior art keywords
pattern based
development image
determining defectiveness
defectiveness
determining
Prior art date
Application number
IL290778A
Other languages
Hebrew (he)
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP19195527.7A external-priority patent/EP3789826A1/en
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of IL290778A publication Critical patent/IL290778A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
IL290778A 2019-09-05 2022-02-21 Method for determining defectiveness of pattern based on after development image IL290778A (en)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
EP19195527.7A EP3789826A1 (en) 2019-09-05 2019-09-05 Method for determining defectiveness of pattern based on after development image
EP19196323 2019-09-10
EP19218296 2019-12-19
EP20169181 2020-04-10
EP20176236 2020-05-25
EP20189952 2020-08-06
EP20192283 2020-08-21
PCT/EP2020/074663 WO2021043936A1 (en) 2019-09-05 2020-09-03 Method for determining defectiveness of pattern based on after development image

Publications (1)

Publication Number Publication Date
IL290778A true IL290778A (en) 2022-04-01

Family

ID=72340367

Family Applications (1)

Application Number Title Priority Date Filing Date
IL290778A IL290778A (en) 2019-09-05 2022-02-21 Method for determining defectiveness of pattern based on after development image

Country Status (5)

Country Link
KR (1) KR20220053029A (en)
CN (1) CN114556228A (en)
IL (1) IL290778A (en)
TW (2) TW202303433A (en)
WO (1) WO2021043936A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210341832A1 (en) * 2020-04-30 2021-11-04 Photronics, Inc. System, method, and program product for manufacturing a photomask
US20220128899A1 (en) * 2020-10-22 2022-04-28 D2S, Inc. Methods and systems to determine shapes for semiconductor or flat panel display fabrication
EP4152096A1 (en) * 2021-09-15 2023-03-22 ASML Netherlands B.V. System and method for inspection by failure mechanism classification and identification in a charged particle system
CN115967609A (en) * 2021-10-11 2023-04-14 中国移动通信集团山东有限公司 Content delivery network fault detection method and equipment
CN114975153A (en) * 2022-05-31 2022-08-30 长鑫存储技术有限公司 Semiconductor structure defect monitoring method and device, computer equipment and storage medium
CN114771120B (en) * 2022-06-18 2022-09-02 南通人民彩印有限公司 Pressure control method and device in micro-contact printing process and artificial intelligence system
US20240087135A1 (en) * 2022-09-09 2024-03-14 Applied Materials, Inc. Clog detection via image analytics
TWI833471B (en) * 2022-11-29 2024-02-21 孟申機械工廠股份有限公司 Defect detection method and device
CN116342983B (en) * 2023-05-29 2023-09-01 全芯智造技术有限公司 Method, electronic device and computer readable medium for generating and using graphic model
CN117213696B (en) * 2023-11-07 2024-01-30 南京易信同控制设备科技有限公司 Multichannel pressure scanning valve based on pressure sensitive core and pressure detection method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6782337B2 (en) * 2000-09-20 2004-08-24 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension an a presence of defects on a specimen
JP4954211B2 (en) 2005-09-09 2012-06-13 エーエスエムエル ネザーランズ ビー．ブイ． System and method for performing mask verification using an individual mask error model
NL1036189A1 (en) 2007-12-05 2009-06-08 Brion Tech Inc Methods and System for Lithography Process Window Simulation.
WO2018125219A1 (en) * 2016-12-30 2018-07-05 Intel Corporation Systems, methods, and apparatuses for implementing geometric kernel based machine learning for reducing opc model error
US10474042B2 (en) * 2017-03-22 2019-11-12 Kla-Tencor Corporation Stochastically-aware metrology and fabrication
CN115220311A (en) * 2017-05-05 2022-10-21 Asml荷兰有限公司 Method for predicting yield of device manufacturing process
CN107728589B (en) * 2017-09-25 2019-11-15 华南理工大学 A kind of on-line monitoring method of flexibility IC substrate etch developing process
US20200380362A1 (en) * 2018-02-23 2020-12-03 Asml Netherlands B.V. Methods for training machine learning model for computation lithography

Also Published As

Publication number Publication date
TWI780476B (en) 2022-10-11
TW202303433A (en) 2023-01-16
CN114556228A (en) 2022-05-27
WO2021043936A1 (en) 2021-03-11
KR20220053029A (en) 2022-04-28
TW202117576A (en) 2021-05-01

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