IL290778A - A method for determining pattern defects based on an image after development - Google Patents

A method for determining pattern defects based on an image after development

Info

Publication number
IL290778A
IL290778A IL290778A IL29077822A IL290778A IL 290778 A IL290778 A IL 290778A IL 290778 A IL290778 A IL 290778A IL 29077822 A IL29077822 A IL 29077822A IL 290778 A IL290778 A IL 290778A
Authority
IL
Israel
Prior art keywords
development
image
pattern defects
defects based
determining pattern
Prior art date
Application number
IL290778A
Other languages
Hebrew (he)
Other versions
IL290778B1 (en
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP19195527.7A external-priority patent/EP3789826A1/en
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of IL290778A publication Critical patent/IL290778A/en
Publication of IL290778B1 publication Critical patent/IL290778B1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706835—Metrology information management or control
    • G03F7/706837—Data analysis, e.g. filtering, weighting, flyer removal, fingerprints or root cause analysis
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706835—Metrology information management or control
    • G03F7/706839—Modelling, e.g. modelling scattering or solving inverse problems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Data Mining & Analysis (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Manufacturing & Machinery (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
IL290778A 2019-09-05 2022-02-21 Method for determining defects in a print based on an image after development IL290778B1 (en)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
EP19195527.7A EP3789826A1 (en) 2019-09-05 2019-09-05 Method for determining defectiveness of pattern based on after development image
EP19196323 2019-09-10
EP19218296 2019-12-19
EP20169181 2020-04-10
EP20176236 2020-05-25
EP20189952 2020-08-06
EP20192283 2020-08-21
PCT/EP2020/074663 WO2021043936A1 (en) 2019-09-05 2020-09-03 Method for determining defectiveness of pattern based on after development image

Publications (2)

Publication Number Publication Date
IL290778A true IL290778A (en) 2022-04-01
IL290778B1 IL290778B1 (en) 2025-12-01

Family

ID=72340367

Family Applications (2)

Application Number Title Priority Date Filing Date
IL324560A IL324560A (en) 2019-09-05 2020-09-03 Method for determining defects of a print based on an image after development
IL290778A IL290778B1 (en) 2019-09-05 2022-02-21 Method for determining defects in a print based on an image after development

Family Applications Before (1)

Application Number Title Priority Date Filing Date
IL324560A IL324560A (en) 2019-09-05 2020-09-03 Method for determining defects of a print based on an image after development

Country Status (5)

Country Link
KR (2) KR102812085B1 (en)
CN (2) CN114556228B (en)
IL (2) IL324560A (en)
TW (3) TWI780476B (en)
WO (1) WO2021043936A1 (en)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI834969B (en) 2020-04-30 2024-03-11 美商福昌公司 System and method for manufacturing a photomask, and mask design correction system
US12372864B2 (en) * 2020-10-22 2025-07-29 D2S, Inc. Methods and systems to determine shapes for semiconductor or flat panel display fabrication
US12524867B2 (en) 2021-05-21 2026-01-13 Kla Corporation System and method for optical wafer characterization with image up-sampling
KR20240023167A (en) 2021-07-23 2024-02-20 디2에스, 인코포레이티드 Methods and systems for determining parasitics for semiconductor or flat panel display manufacturing
EP4152096A1 (en) * 2021-09-15 2023-03-22 ASML Netherlands B.V. System and method for inspection by failure mechanism classification and identification in a charged particle system
CN115967609B (en) * 2021-10-11 2024-05-24 中国移动通信集团山东有限公司 Content distribution network fault detection method and device
CN116091379B (en) * 2021-10-29 2025-09-16 上海芯上微装科技股份有限公司 Automatic defect classification system and training and classifying method thereof
US20230169246A1 (en) 2021-11-28 2023-06-01 D2S, Inc. Interactive compaction tool for electronic design automation
US12475283B2 (en) 2022-01-19 2025-11-18 D2S, Inc. Generating and display an animation of a predicted overlap shape in an IC design
US20230274068A1 (en) 2022-02-23 2023-08-31 D2S, Inc. Performing non-preferred direction detailed routing followed by preferred direction global and detailed routing
DE102022201967A1 (en) * 2022-02-25 2023-09-14 Robert Bosch Gesellschaft mit beschränkter Haftung Uncertainty estimation of a position reconstruction of semiconductor components on a wafer
US12260543B2 (en) * 2022-03-28 2025-03-25 Applied Materials Israel Ltd. Machine learning based examination of a semiconductor specimen and training thereof
CN114975153A (en) * 2022-05-31 2022-08-30 长鑫存储技术有限公司 Semiconductor structure defect monitoring method and device, computer equipment and storage medium
CN114771120B (en) * 2022-06-18 2022-09-02 南通人民彩印有限公司 Pressure control method and device in micro-contact printing process and artificial intelligence system
TWI883336B (en) 2022-06-30 2025-05-11 聯華電子股份有限公司 Photomask inspection method
US12136225B2 (en) * 2022-09-09 2024-11-05 Applied Materials, Inc. Clog detection via image analytics
TWI833471B (en) * 2022-11-29 2024-02-21 孟申機械工廠股份有限公司 Defect detection method and device
CN115795871A (en) * 2022-11-30 2023-03-14 中国科学院上海光学精密机械研究所 Reconstruction Method of Defect Morphology of Multilayer Film in Extreme Ultraviolet Lithography Mask
CN118507369A (en) * 2023-02-16 2024-08-16 联华电子股份有限公司 Method and system for predicting etching parameter conditions
CN120898174A (en) * 2023-04-06 2025-11-04 Asml荷兰有限公司 Methods and systems for context-aware overlay adjustment
CN116342983B (en) * 2023-05-29 2023-09-01 全芯智造技术有限公司 Method, electronic device and computer readable medium for generating and using graphic model
TWI881507B (en) * 2023-10-26 2025-04-21 由田新技股份有限公司 Substrate etching information analysis system and substrate etching information analysis method
US12579631B2 (en) 2023-09-26 2026-03-17 Kla Corporation Method to calibrate, predict, and control stochastic defects in EUV lithography
KR20250060671A (en) * 2023-10-26 2025-05-07 (주)지아이에스 Inspection method for via-hole of the wafer used deep-learning
CN117213696B (en) * 2023-11-07 2024-01-30 南京易信同控制设备科技有限公司 Multi-channel pressure scanning valve based on pressure-sensitive core and its pressure detection method
TWI875407B (en) * 2023-12-25 2025-03-01 國立勤益科技大學 Bi-directional slope dynamic tablet chipping detection device
CN118519320B (en) * 2024-07-24 2024-11-19 江苏雷博微电子设备有限公司 A method for replacing developer in a coating developer based on neural network
CN118763014B (en) * 2024-09-05 2024-12-27 深圳仕上电子科技股份有限公司 Method and system for detecting surface quality of thin film of semiconductor device
CN120404735B (en) * 2025-04-16 2025-11-25 湖南合创机械铸造有限公司 Machine Vision-Based Casting Inspection Method and System
CN120430649B (en) * 2025-04-23 2025-10-28 南方电网能源发展研究院有限责任公司 A power engineering technical and economic analysis system based on big data and big models
CN120916345A (en) * 2025-07-31 2025-11-07 江西红板科技股份有限公司 High-precision circuit board wet film processing method and system

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6782337B2 (en) * 2000-09-20 2004-08-24 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension an a presence of defects on a specimen
CN101305320B (en) 2005-09-09 2012-07-04 Asml荷兰有限公司 Mask verification system and method using independent mask error model
NL1036189A1 (en) 2007-12-05 2009-06-08 Brion Tech Inc Methods and System for Lithography Process Window Simulation.
US10386828B2 (en) * 2015-12-17 2019-08-20 Lam Research Corporation Methods and apparatuses for etch profile matching by surface kinetic model optimization
US10365617B2 (en) * 2016-12-12 2019-07-30 Dmo Systems Limited Auto defect screening using adaptive machine learning in semiconductor device manufacturing flow
WO2018125219A1 (en) * 2016-12-30 2018-07-05 Intel Corporation Systems, methods, and apparatuses for implementing geometric kernel based machine learning for reducing opc model error
US10474042B2 (en) * 2017-03-22 2019-11-12 Kla-Tencor Corporation Stochastically-aware metrology and fabrication
KR102296942B1 (en) * 2017-05-05 2021-09-01 에이에스엠엘 네델란즈 비.브이. How to predict the yield of a device manufacturing process
WO2018233947A1 (en) * 2017-06-20 2018-12-27 Asml Netherlands B.V. DETERMINATION OF EDGE ROUGHNESS PARAMETERS
CN107728589B (en) * 2017-09-25 2019-11-15 华南理工大学 A method for on-line monitoring of flexible IC substrate etching and development process
EP3462240A1 (en) * 2017-09-27 2019-04-03 ASML Netherlands B.V. Method of determining control parameters of a device manufacturing process
CN111448519A (en) * 2017-12-11 2020-07-24 Asml荷兰有限公司 Voltage contrast measurement mark
CN111788589A (en) * 2018-02-23 2020-10-16 Asml荷兰有限公司 Methods for training machine learning models for computational lithography

Also Published As

Publication number Publication date
TW202534562A (en) 2025-09-01
CN114556228A (en) 2022-05-27
KR102812085B1 (en) 2025-05-23
TWI780476B (en) 2022-10-11
TWI901907B (en) 2025-10-21
TW202117576A (en) 2021-05-01
CN118859641A (en) 2024-10-29
TW202303433A (en) 2023-01-16
IL290778B1 (en) 2025-12-01
KR20250078605A (en) 2025-06-02
IL324560A (en) 2026-01-01
KR20220053029A (en) 2022-04-28
CN114556228B (en) 2024-07-23
WO2021043936A1 (en) 2021-03-11

Similar Documents

Publication Publication Date Title
IL290778A (en) A method for determining pattern defects based on an image after development
EP4077722C0 (en) METHOD FOR DETECTING AN ANALYTE
EP4365305C0 (en) METHOD FOR PROOFING AN ANALYTE
IL285723A (en) A system for evaluating surface finish quality and a method
HUE071150T2 (en) Apparatus and method for diagnosing a battery
EP3824653C0 (en) METHOD FOR A LANGUAGE PROCESSING SYSTEM
IL291166A (en) Method for detecting biomarkers
PL3832295T3 (en) Device and method for checking for surface defect, using image sensor
HUE063889T2 (en) Method and means for configuring and receiving a positioning reference signal
DK3738773T3 (en) APPARATUS FOR MEASURING ELEVATIONS ON THE SURFACE OF A BODY OF REVOLUTION
EP3876065C0 (en) Method for determining a path along an object, system and method for automatically inspecting an object
IL280789A (en) A method for creating and identifying an optimally allowed image within a diamond
PL3849181T3 (en) METHOD AND DEVICE FOR CREATING A PREDICTION CANDIDATE BASED ON HMVP
IL281899B1 (en) Determining defect location using a correction loop for pixel alignment
EP3617680C0 (en) METHOD FOR CALIBRATING A TEMPERATURE MEASURING DEVICE
DK3530560T3 (en) APPARATUS FOR MONITORING A BOAT DRIVE
DK3454572T3 (en) METHOD FOR DETECTING A DEFECTIVE IN A HEARING INSTRUMENT
EP3956812A4 (en) ALIGNMENT CALIBRATION SYSTEM FOR IMAGE CAPTURE
IL284945A (en) Selecting a design file for a test image for design alignment
DK2830313T3 (en) METHOD AND APPARATUS FOR DETERMINING A REFERENCE IMAGE SET.
IL266978B1 (en) Method and device for detecting an object by a broadband laser pulse
PL3553675T3 (en) A method and apparatus for performing service operations based on an image
EP3807595C0 (en) Method for calibrating a gyrometer built into an object
DK3671264T3 (en) SENSOR AND METHOD FOR REGISTERING AN OBJECT
KR102044018B9 (en) Water Quality Inspection Device for Intercepting Facility