JP2008031483A5 - - Google Patents
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- Publication number
- JP2008031483A5 JP2008031483A5 JP2007228012A JP2007228012A JP2008031483A5 JP 2008031483 A5 JP2008031483 A5 JP 2008031483A5 JP 2007228012 A JP2007228012 A JP 2007228012A JP 2007228012 A JP2007228012 A JP 2007228012A JP 2008031483 A5 JP2008031483 A5 JP 2008031483A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- adhesive layer
- connection
- insulating adhesive
- member according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims description 24
- 239000011230 binding agent Substances 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 6
- 239000000155 melt Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 229920006132 styrene block copolymer Polymers 0.000 claims description 2
- -1 styrene-ethylene-butylene-styrene Chemical class 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims 3
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007228012A JP2008031483A (ja) | 2007-09-03 | 2007-09-03 | 接続部材および該接続部材を用いた電極の接続構造並びに接続方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007228012A JP2008031483A (ja) | 2007-09-03 | 2007-09-03 | 接続部材および該接続部材を用いた電極の接続構造並びに接続方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12798196A Division JP4032439B2 (ja) | 1995-02-07 | 1996-05-23 | 接続部材および該接続部材を用いた電極の接続構造並びに接続方法 |
Related Child Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007260097A Division JP4595981B2 (ja) | 2007-10-03 | 2007-10-03 | 接続部材および該接続部材を用いた電極の接続構造並びに接続方法 |
| JP2007260094A Division JP4631893B2 (ja) | 2007-10-03 | 2007-10-03 | 接続部材および該接続部材を用いた電極の接続構造並びに接続方法 |
| JP2007260090A Division JP4595980B2 (ja) | 2007-10-03 | 2007-10-03 | 接続部材および該接続部材を用いた電極の接続構造並びに接続方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008031483A JP2008031483A (ja) | 2008-02-14 |
| JP2008031483A5 true JP2008031483A5 (enExample) | 2010-03-11 |
Family
ID=39121238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007228012A Pending JP2008031483A (ja) | 2007-09-03 | 2007-09-03 | 接続部材および該接続部材を用いた電極の接続構造並びに接続方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2008031483A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107112253B (zh) * | 2015-01-13 | 2021-04-20 | 迪睿合株式会社 | 凸点形成用膜、半导体装置及其制造方法以及连接构造体 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4032439B2 (ja) * | 1996-05-23 | 2008-01-16 | 日立化成工業株式会社 | 接続部材および該接続部材を用いた電極の接続構造並びに接続方法 |
-
2007
- 2007-09-03 JP JP2007228012A patent/JP2008031483A/ja active Pending
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