JP2008026248A - Probe, probe unit therewith, probe card therewith, and manufacturing method of probe unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a prove unit capable of corresponding to narrow pitch layout, measuring positively without distortion of springs, and swapping easily of parts for damaged probes. <P>SOLUTION: In the prove unit which is equipped with a prove 100 and a prove supporting section 200 fitting the prove 100 on a probe card, the probe supporting section 200 includes a first guide plate 210, which has a first aperture 211 corresponding to a layout pattern of an electrode pad 811 of a semiconductor integrated circuit 810 as object to be measured, a second guide plate 220, which has a second aperture 221 corresponding to the layout pattern, and a spacer 230 connecting both the guide plates 210 and 220 in parallel, while a thickness dimension of the first guide plate 210 is smaller than a length dimension from a flange section 113 to the apex of a contacting section 111 of the probe 100, the first aperture 211 is larger than the contacting section 111 and smaller than the flange section 113 in diameter size, the second aperture 221 is larger than a guide tube 130 and also larger than a spring 120 in diameter size, and distance between both the guide plates 210 and 220 is smaller than the length dimension from the flange section 113 to the apex of the contacting section 112. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a probe, a probe unit using the probe, and a probe card using the probe unit.

  As a conventional vertical type probe card, a probe support member having a plurality of probes each provided with a bent portion at the middle portion, two support members for supporting the probes on both upper and lower sides of the bent portion, and the probe An intermediate substrate formed with a conductive pattern connected to the upper end of the probe supported by the support member and having a contact pad exposed on the lower surface; and a main substrate formed with a conductive pattern in contact with the contact pad. In some cases, the contact portion at the tip of the probe is configured to vertically contact a conductive pad of a semiconductor integrated circuit as a measurement object.

  This type of vertical probe card is excellent in that various electrical characteristics of several other semiconductor integrated circuits can be measured simultaneously from the high integration and miniaturization of the semiconductor integrated circuit. The intermediate substrate connects between the probe arranged at a high density and the conductive pattern of the main substrate that cannot be formed at a density as high as the arrangement of the probe.

  However, the conventional vertical probe card configured in this way makes it difficult to electrically connect the conductive pattern of the intermediate board and the conductive pattern of the main board, and the conductive pattern of the intermediate board and the probe. There is a problem of becoming. In order to solve this problem, if the electrical connection of each part is strengthened, there is a problem that replacement when the probe is damaged becomes difficult.

Therefore, the present application has developed a probe described in Japanese Patent Application Laid-Open No. 2002-267686 as a solution to this problem.
The probe has a conductive metal cylinder and a contact inserted and connected to the lower end of the metal cylinder. The metal cylinder has a part of the peripheral surface removed. It is an elastic body that expands and contracts in the vertical direction.

  Further, as this type of probe card, there are JP-A-2000-241447, JP-A-2001-255340, JP-A-2002-139513, and JP-A-2003-167001.

JP2002-267686A JP 2000-241447 A JP 2001-255340 A JP2002-139513 JP2003-167001

However, since what was described in Patent Document 1 is an elastic body by removing a part of the peripheral surface of the metal cylinder, it is difficult to process and causes an increase in cost. Further, in this case, the portion that has become a spring and the portion that is directly a cylinder are made of the same metal cylinder, and thus must be made of the same material. In addition, since the metal cylinder must be thicker than a spring formed by winding a general wire rod, there is a problem in that it cannot be arranged at a narrow pitch required at present or in the future.
Furthermore, since the contact is strongly connected to the metal cylinder, it is very difficult to replace only the damaged contact when the contact is damaged, and the metal cylinder must be replaced. is there. The same applies when only the metal cylinder is damaged.

In addition, in Patent Document 2, a stem, which is a part of a plunger, is inserted into a barrel, and a coil spring is positioned outside the barrel. There is a problem in that it cannot be arranged at a narrow pitch.
Furthermore, since the stem is configured to be narrower than the other part of the plunger, there is a problem that the electrical resistance of this part is increased.
Further, it is difficult to bend the opening end of the barrel inward in the radial direction. There is also a problem of cost increase accompanying this.

Moreover, what was described in patent document 3 has a 1st contact part, a 2nd contact part, and the coil spring interposed between both, and the 2nd contact part has a 1st contact part of the 1st contact part. A shaft hole is formed in which the shaft portion is inserted and slides.
For this reason, there is a problem that the arrangement at the narrow pitch required at present or in the future cannot be performed as a result of the second contact portion becoming thicker by the amount corresponding to the shaft hole.

Moreover, although what was described in patent document 4 is comprised so that the lower end part of a conductive needlelike object (equivalent to a probe) may be inserted in a coil spring, this lower end part is set shorter than a coil spring. ing.
For this reason, the edge part of the lower end part of an electroconductive needle-like object inevitably contacts a coil spring, and there exists a problem that a motion is jerky and a smooth test | inspection cannot be performed.

Moreover, since the thing described in patent document 5 is arrange | positioned inside the coil spring by which a cylinder is compressed, and a plunger is arrange | positioned in a cylinder, it becomes thick as a whole, and is requested | required now or in the future. There is a problem in that it cannot be arranged at a narrow pitch.
Further, since the cylinder and the coil spring are arranged side by side, there is a problem that catching is likely to occur. In addition, when overdrive is applied, the lower side of the coil spring is distorted and displaced outward. Such a problem also becomes an obstacle to the arrangement at a narrow pitch.

  The present invention was devised in view of the above circumstances, can cope with a narrow pitch arrangement, and can perform reliable measurement without distortion of the spring, and can easily replace a damaged probe component. It is an object to provide a simple probe, a probe unit using the probe, a probe card using the probe unit, and a method for manufacturing the probe unit.

  The probe according to the present invention is a probe body in which one end is a contact portion that contacts an electrode pad of a measurement object, the other end is a connection portion connected to a connection pad of a probe card, and a flange portion is provided on the contact portion side. And a spring that is inserted from the connecting portion side of the probe body and contacts the flange portion, and a guide tube that is inserted from the connecting portion side of the probe body and contacts the spring. The guide tube is made of a conductive material, and the spring in the natural length state is set to be smaller than the length dimension from the flange portion to the connection portion, and the probe body is inserted into the spring in the natural length state. In this state, when the guide tube is inserted into the probe body, the guide tube is not completely inserted into the probe body.

  The probe unit according to the present invention includes the probe and a probe support portion for attaching the probe to a probe card, and the probe support portion is a first corresponding to the arrangement pattern of the electrode pads of the measurement object. A first guide plate having an opening, a second guide plate having a second opening corresponding to the arrangement pattern of the electrode pads of the measurement object, the first guide plate, and the second guide plate. A spacer for connecting the guide plate in parallel, the thickness dimension of the first guide plate is set smaller than the length dimension from the flange portion of the probe to the tip of the contact portion, The first opening is set to be larger in diameter than the contact portion of the probe and smaller in diameter than the flange portion, and the upper opening is set to be larger in diameter than the guide tube and larger in diameter than the spring, The distance between the first guide plate and the second guide plate is smaller than the length of the flange portion of the probe to the tip of the connecting portion.

  Further, in a state where the support portion is attached to the space transformer substrate constituting the probe card, the connection portion of the probe is not in contact with the connection pad of the substrate, and only the end portion of the guide tube is in contact with the contact pad of the probe. When a predetermined overdrive is applied after the part contacts the electrode pad of the object to be measured, the probe connection part contacts the inner wall of the guide tube and is connected to the upper end of the guide tube and the connection pad of the substrate. It has become so.

  Furthermore, the probe card according to the present invention includes the probe unit.

  In the method of manufacturing the probe unit according to the present invention, a spacer is interposed between the first guide plate and the second guide plate, the first opening of the first guide plate, and the second guide plate of the second guide plate. A probe support part assembling step, wherein the first guide plate, the second guide plate and the spacer are fixed to each other so that the two openings coincide with each other in the vertical direction; And a contact portion where one end contacts the electrode pad of the measurement object, and the other end is a connection portion connected to the connection pad of the probe card, and a flange portion is provided on the contact portion side. A probe body insertion step of inserting the probe body into which the spring is inserted from the connection portion side into the probe body from the second opening toward the first opening, and a guide tube is inserted into the probe body from the second opening Guide tube insertion And a process.

  In another probe unit manufacturing method according to the present invention, the first guide plate and the second guide plate are stacked, the first opening of the first guide plate, and the second guide plate A stacking step for causing the second opening to coincide with the vertical direction, a contact portion where one end is in contact with the electrode pad of the measurement object, and a connection portion where the other end is connected to the connection pad of the probe card, A probe body insertion step of inserting a probe body into which a spring is inserted from the connection portion side into the probe body provided with the flange portion from the second opening toward the first opening; a first guide plate; The guide plate is maintained in a parallel state while the guide plates are spaced apart from each other, and a predetermined distance is secured between the first guide plate and the second guide plate. Insert a spacer between the guide plates. A probe support part assembling step for fixing the first guide plate, the second guide plate and the spacer to each other as a probe support portion, and a guide tube insertion step for inserting the guide tube into the probe main body from the second opening And have.

Since the probe according to the present invention is composed of three parts, that is, a probe main body, a spring fitted to the probe main body, and a guide tube attached to the probe main body, the structure thereof is relatively simpler than the conventional one. For this reason, cost can be reduced and reliable measurement is possible.
In addition, since the structure is simple, it is thinner than the conventional one, and is suitable for arrangement at a narrow pitch that is required now or in the future.

  FIG. 1 is a schematic cross-sectional view of a main part of a probe card using a probe unit according to an embodiment of the present invention. FIG. 2 is a diagram of a semiconductor integrated circuit using the probe card using the probe unit according to the embodiment of the present invention. FIG. 3 is a schematic cross-sectional view when measuring various electrical characteristics, and FIG. 3 is a drawing of a probe main body and a spring constituting the probe used in the probe unit according to the embodiment of the present invention. (A) is a schematic front view of the spring, (B) is a schematic front view of the probe main body, (C) is a schematic front view of the probe main body inserted into the spring, and FIG. FIG. 5 is a schematic perspective view of various guide tubes constituting the probe used in the probe unit according to the embodiment, and FIG. 5 is a schematic diagram showing a first manufacturing method of the probe unit according to the embodiment of the present invention. FIG. 6 is a schematic sectional view showing a first manufacturing method of the probe unit according to the embodiment of the present invention, and FIG. 7 shows a first manufacturing method of the probe unit according to the embodiment of the present invention. FIG. 8 is a schematic cross-sectional view, FIG. 8 is a schematic cross-sectional view showing a procedure for assembling the probe unit according to the embodiment of the present invention to the probe card, and FIG. 9 is a second method for manufacturing the probe unit according to the embodiment of the present invention. FIG. 10 is a schematic cross-sectional view showing a second manufacturing method of the probe unit according to the embodiment of the present invention.

  The probe 100 according to the embodiment of the present invention has a contact portion 111 with one end contacting the electrode pad 811 of the semiconductor integrated circuit 810 that is a measurement object, and a guide tube 130 with the other end connected to the connection pad 2100 of the probe card. A probe main body 110 having a flange portion 113 provided on the contact portion 111 side, a spring 120 into which the probe main body 110 is inserted from the connection portion 112 side and contacting the flange portion 113, and the probe The main body 110 is inserted from the connection portion 112 side, and includes a guide tube 130 that contacts the spring 120. The probe main body 100 and the guide tube 130 are made of a conductive material and are in a natural length state. The spring 120 is set smaller than the length from the flange portion 113 to the connection portion 112. When the guide tube 130 is inserted into the probe body 100 with the probe body 100 inserted into the spring 120 in the natural length state, the guide tube 130 is not completely inserted into the probe body 100. Yes.

  The probe body 100 is made of a conductive material having conductivity such as platinum or palladium alloy, and is a needle-like body having a length of about 3 to 6 mm and a diameter of 0.04 to 0.1 mm. 3, one end is sharpened as a contact portion 111 that contacts the electrode pad 811 of the semiconductor integrated circuit 810, and the other end is sharpened as an upper end portion of the guide tube 130 connected to the connection pad 2100 of the probe card. It has become.

  In the probe main body 100, a flange portion 113 is formed at a position separated from the contact portion 111 by about 0.5 to 1.0 mm. The flange portion 113 is set to have a diameter larger than that of the first opening 211 opened in the first guide plate 210 of the probe support portion 200 described later. Further, the flange portion 113 is larger in diameter than an inner diameter of a spring 120 described later, and is set to be substantially the same as the outer diameter. Therefore, when the contact portion 111 of the probe main body 100 is inserted into the first opening 211 of the first guide plate 210 from above, the probe main body 100 is supported by the flange portion 113 with respect to the first guide plate 210. Will be. When the probe main body 100 is inserted into the spring 120 from the connection portion 112 side, the spring 120 is supported by the flange portion 113.

  The spring 120 is formed, for example, by winding a spring stainless steel wire, a piano wire, a phosphor bronze wire, or the like. When the spring 120 is in a natural length state, that is, when no external force is applied, the length of the spring 120 is set to be smaller than the length dimension from the flange portion 113 to the connection portion 112. Therefore, when the spring 120 is inserted into the probe main body 100 from the connection portion 112 side, the connection portion 112 that is one end of the probe main body 100 protrudes from the spring 120.

  The guide tube 130 is made of a conductive material such as nickel or copper alloy, and has a length of about 1 to 3 mm and a diameter of 0.06 to 0.1 mm (FIG. 4 ( (See A). Since the probe main body 100 is inserted into the guide tube 130 from the connection portion 112 side, the inner diameter thereof is set larger than the outer diameter of the probe main body 100. Further, since the guide tube 130 is inserted into the second opening 221 of the second guide plate 220 constituting the probe support 200, the outer diameter of the guide tube 130 is the inner diameter of the second opening 221. It is set smaller. As shown in FIG. 4, the guide tube 130 has a shape other than a simple cylindrical shape, for example, the upper end is slanted as shown in FIG. 4 (B), or the upper end as shown in FIG. 4 (C). Are tapered, those having two peaks at the upper end as shown in FIG. 4D, and those having four peaks at the upper end as shown in FIG. 4E.

As described above, the probe support unit 200 that supports the probe 100 including the three parts of the probe main body 100, the spring 120, and the guide tube 130 is configured as follows.
That is, the probe support unit 200 attaches the probe 100 to a probe card, and is a first guide plate in which a first opening 211 corresponding to the arrangement pattern of the electrode pads 811 of the semiconductor integrated circuit 810 is opened. 210, a second guide plate 220 having a second opening 221 corresponding to the arrangement pattern of the electrode pads 811 of the semiconductor integrated circuit 810, and the first guide plate 210 and the second guide plate 220. A spacer 230 connected in parallel, and the thickness of the first guide plate 210 is set to be smaller than the length from the flange portion 113 of the probe 100 to the tip of the contact portion 111; The first opening 211 is set to have a diameter larger than that of the contact portion 111 of the probe 100 and smaller than that of the flange portion 113. The opening 221 is set larger in diameter than the guide tube 130 and larger in diameter than the spring 120, and the distance between the first guide plate 210 and the second guide plate 220 is the flange portion of the probe 100. It is set smaller than the length dimension from 113 to the tip of the connecting portion 112.

  First, the first guide plate 210 is made of an insulating material and has a thickness dimension of about 0.2 to 0.8 mm. The first guide plate 210 has a plurality of first openings 211 corresponding to the arrangement pattern of the electrode pads 811 of the semiconductor integrated circuit 810 that is the measurement object.

  On the other hand, the second guide plate 220 is made of a material having insulating properties like the first guide plate 210. The thickness dimension of the second guide plate 220 is set to about 0.5 to 1.0 mm. The second guide plate 220 is provided with a plurality of second openings 221 corresponding to the arrangement pattern of the electrode pads 811 of the semiconductor integrated circuit 810 that is the measurement object. That is, when the first guide plate 210 and the second guide plate 220 are stacked, the first opening 211 and the second opening 221 are in perfect communication with each other.

  Since the contact portion 111 of the probe main body 100 penetrates the first opening 211 and the guide tube 130 penetrates the second opening 221, the first opening 211 is the second opening 221. The diameter is set smaller.

  In addition, the first opening 211 must not pass through the flange portion 113 and must pass through the contact portion 111, so that the inner diameter thereof is smaller than the outer diameter of the flange portion 113, and the outer diameter of the contact portion 111. It is set larger.

3 Further, since the second opening 221 needs to pass through the flange portion 113 and the spring 120, the inner diameter thereof is larger than the outer diameter of the flange portion 113 and larger than the outer diameter of the spring 120. Is set. Moreover, since the guide tube 130 penetrates, the inner diameter of the second opening 221 is set larger than the outer diameter of the guide tube 130.

  The spacer 230 connects the first guide plate 210 and the second guide plate 220 in parallel. Moreover, the first opening 211 of the first guide plate 210 and the second opening 221 of the second guide plate 220 are arranged in the vertical direction even when both guide plates 210 and 220 are connected by the spacer 230. Must match.

  The probe unit 1000 composed of such components includes the probe 100 and a probe support part 200 for attaching the probe 100 to a probe card. The probe support part 200 is an electrode pad of a measurement object. A first guide plate 210 having a first opening corresponding to the arrangement pattern and a second guide plate 220 having a second opening 221 corresponding to the arrangement pattern of the electrode pads 811 of the semiconductor integrated circuit 810. And a spacer 230 for connecting the first guide plate 210 and the second guide plate 220 in parallel. The thickness of the first guide plate 210 is determined from the flange portion 113 of the probe. The first opening 211 is set to be smaller than the length of the contact portion 111 up to the tip, and the first opening 211 is the contact portion 11 of the probe 100. The second opening 221 is set to be larger in diameter than the guide tube 130 and larger in diameter than the spring 120, and is set to be smaller in diameter than the flange portion 113. The distance between 210 and the second guide plate 220 is set to be smaller than the length dimension from the flange portion 113 of the probe 100 to the tip of the connection portion 112.

  Note that the first guide plate 210 and the spacer 230 may be formed separately or may be formed integrally. However, in the second manufacturing method described later, it is a precondition that they are separate.

Next, a first manufacturing method of the probe unit 1000 will be described with reference to FIGS.
In the first manufacturing method, a spacer is interposed between the first guide plate 210 and the second guide plate 220, and the first opening 211 of the first guide plate 210 and the second guide plate 220 are A probe support part assembling step in which the first opening 221 and the first guide plate 210, the second guide plate 220, and the spacer 230 are fixed to each other so that the second opening 221 coincides with the vertical direction; A mounting step of mounting the support 200 on the assembly table 700, an upper end of the guide tube 130 in which one end contacts the electrode pad 811 of the semiconductor integrated circuit 810 and the other end is connected to the connection pad 2100 of the probe card. The probe body 100 in which the spring 120 is inserted from the connection portion 112 side is connected to the probe body 100 having the flange portion 113 on the contact portion 111 side. A probe body insertion step of inserting the opening 221 toward the first opening 211, and a guide tube insertion step of inserting the guide tube 130 relative to the probe body 100 from the second opening 221.

  In this first manufacturing method, the probe 100 is attached to the assembled probe support 200 starting from the probe support assembly process.

  In the probe support part assembling step, the first guide plate 210 and the second guide plate 220 are connected in parallel by the spacer 230, and the first opening 211 and the second guide plate of the first guide plate 210 are connected. As the second opening 221 of 220, the one corresponding to the vertical direction is used.

  As shown in FIG. 5, the assembled probe support 200 is placed on the assembly base 700 in which the recess 710 is formed (placement process). The concave portion 710 is set to a size that can accommodate all the first openings 211. The depth of the recess 710 is set so that the tip of the contact portion 111 does not reach the bottom when the contact portion 111 of the probe 100 is inserted into the first opening 211. For this reason, the probe 100 is assembled to the probe support 200 by the flange portion 113 provided on the probe main body 100 and the concave portion 710 of the assembly base 700 so that the tips of the contact portions 111 are all located on the same plane. is there.

  Next, the spring 120 into which the probe main body 100 is inserted from the connecting portion 112 side (see FIG. 3C) is inserted through the second opening 221 up to the first opening 211 (probe main body inserting step). . Here, since the first opening 211 and the second opening 221 coincide with each other in the vertical direction, each probe 100 is vertically supported by the probe support 200 (see FIG. 6).

Next, the connecting portion 112 of the probe main body 100 is inserted into the guide tube 130 from the second opening 221 (see FIG. 7, guide tube inserting step).
At this time, the upper end of the guide tube 130 protrudes from the second guide plate 220 as shown in FIG.

In this way, the probe unit 1000 is completed.
A space transformer substrate 2000 constituting a probe card is attached to the probe unit 1000. In other words, the space transformer substrate 2000 is pressed from above the probe unit 1000 by pressing down the guide tube 130 protruding from the second guide plate 220 against the elastic force of the spring 120, thereby pressing the space transformer substrate 2000. The second guide plate 220 is fixed in close contact with the second guide plate 220.
At this time, only the guide tube 130 of the probe 100 is surely brought into contact with the connection pad 2100 formed on the space transformer substrate 2000. That is, in this state, the connection part 112 of the probe 100 is not in contact with the connection pad 2100.

  The space transformer substrate 2000 is made of a resin printed board or a ceramic board, and has a connection pad 2100 formed on one surface and an upper pad 2200 electrically connected to the connection pad 2100 formed on the other surface. Yes. The space transformer substrate 2000 is attached to the support member 2300 as shown in FIG. The upper pad 2200 is electrically connected to a pad of a mother boat (not shown).

Measurement of various electrical characteristics of the semiconductor integrated circuit 810 using the probe card configured as described above is performed as follows.
First, a wafer 800 on which a large number of semiconductor integrated circuits 810 as measurement objects are formed is placed on a table 850. The table 850 and the probe card are moved relatively closer to bring the contact portion 111 of the probe 100 into contact with the electrode pad 811 of the semiconductor integrated circuit 810.

  Further, the table 850 and the probe card are moved relatively close to each other to add overdrive. By applying overdrive, the probe main body 100 of the probe 100 is pushed up, the flange portion 113 moves upward and comes off the upper surface of the first guide plate 210, and the upper end portion of the guide tube 130 is connected to the connection pad 2100. Abut.

  In this state, the spring 120 is further compressed by being overdriven. Since the pressing force pressed against the flange portion 113 of the probe main body 100 and the lower end of the guide tube 130 constituting the probe 100 is determined only by overdrive, there is no variation in the pressing force in each probe main body 100 and the guide tube 130. .

  Repeated use of this type of probe card may damage the probe 100 and the like. If the damaged probe 100 is used, an accurate measurement cannot be performed. Therefore, the damaged probe 100 needs to be replaced with a new one. Note that the damaged probe 100 refers to any of the probe main body 100, the spring 120, the guide tube 130, or some of these that have malfunctioned.

Replacement of the damaged probe 100 is performed as follows.
First, the probe unit 1000 is removed from the probe support part 200 together with the space transformer substrate 2000. Then, the space transformer substrate 2000 is removed from the probe unit 1000. Then, the guide tube 130 constituting the probe 100 protrudes from the second opening 221 of the second guide plate 220 by the elastic force of the spring 120. The damaged probe 100 is extracted through the second opening 221 and replaced with a new probe 100. Then, the space transformer substrate 2000 is attached to the probe unit 1000 again, and the probe unit 1000 is attached to the support member 2300 together with the space transformer substrate 2000.

  In the first manufacturing method described above, the probe 100 is incorporated into the assembled probe support 200. However, in the second manufacturing method, the probe 100 is assembled before the probe support 200 is assembled.

  That is, in the second manufacturing method, the first guide plate 210 and the second guide plate 220 are stacked, and the first opening 211 of the first guide plate 210 and the second guide plate 220 are A stacking step for causing the two openings 221 to coincide with each other in the vertical direction, a contact portion 111 that contacts one of the electrode pads 811 of the semiconductor integrated circuit 810, and a guide tube 130 that connects the other end to the connection pad 2100 of the probe card. A probe that inserts the probe body 100 in which the spring 120 is inserted from the connection part 112 side toward the first opening 211 from the connection part 112 side into the probe body 100 provided with the flange part 113 on the contact part 111 side. While maintaining the parallel state of the main body insertion step and the first guide plate 210 and the second guide plate 220, the two guide plates 210 and 220 are relatively moved. A spacer 230 is interposed between the first guide plate 210 and the second guide plate 220 and a spacer 230 is interposed between the first guide plate 210 and the second guide plate 220 in a state where a predetermined distance is secured between the first guide plate 210 and the second guide plate 220. A probe support part assembly process in which the guide plate 210, the second guide plate 220, and the spacer 230 are fixed to each other to form the probe support 200, and a guide for inserting the guide tube 130 into the probe main body 100 from the second opening 221. A tube insertion step.

  That is, in the second manufacturing method, the first opening plate 211 and the second opening plate 221 are aligned with each other, and the first guide plate 210 and the second guide plate 220 are stacked. To do.

  The laminated guide plates 210 and 220 are placed on the assembly table 700 (see FIG. 9). The assembly table 700 is the same as that used in the first manufacturing method.

  In this state, the probe main body 100 inserted from the connection part 112 side into the spring 120 from the second opening 221 is inserted from the second opening 221 (see FIG. 10).

  Next, only the second guide plate 220 is raised. Of course, the second guide plate 220 is raised while the parallel state between the first guide plate 210 and the second guide plate 220 is maintained.

  In a state where a predetermined interval is secured between the first guide plate 210 and the second guide plate 220, a spacer 230 is interposed between the two guide plates 210, 220, and the first guide plate 210, The second guide plate 220 and the spacer 230 are fixed to each other to form the probe support 200. This state is the same as in FIG.

  Then, the guide tube 130 is inserted into the probe main body 100 from the second opening 221. This state is the same as in FIG.

It is a schematic sectional drawing of the principal part of the probe card using the probe unit which concerns on embodiment of this invention. It is a schematic sectional view at the time of measuring electrical specifications of a semiconductor integrated circuit by a probe card using a probe unit according to an embodiment of the present invention. It is drawing of the probe main body and spring which comprise the probe used for the probe unit which concerns on embodiment of this invention, Comprising: The figure (A) is a schematic front view of a spring, The figure (B) is a probe main body. FIG. 3C is a schematic front view of the probe main body inserted into the spring. It is a schematic perspective view of the various guide tubes which comprise the probe used for the probe unit which concerns on embodiment of this invention. It is a schematic sectional drawing which shows the 1st manufacturing method of the probe unit which concerns on embodiment of this invention. It is a schematic sectional drawing which shows the 1st manufacturing method of the probe unit which concerns on embodiment of this invention. It is a schematic sectional drawing which shows the 1st manufacturing method of the probe unit which concerns on embodiment of this invention. It is a schematic sectional drawing which shows the procedure of assembling the probe unit which concerns on embodiment of this invention to a probe card. It is a schematic sectional drawing which shows the 2nd manufacturing method of the probe unit which concerns on embodiment of this invention. It is a schematic sectional drawing which shows the 2nd manufacturing method of the probe unit which concerns on embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Probe 110 Probe main body 111 Contact part 112 Connection part 113 Flange part 120 Spring 130 Guide pipe 200 Probe support part 210 1st guide plate 211 1st opening 220 2nd guide plate 221 2nd opening 230 Spacer 700 Assembly stand 710 Recess 800 Wafer 810 Semiconductor integrated circuit 811 Electrode pad 850 Table 2000 Space transformer substrate 2100 Connection pad 2200 Upper pad 2300 Support member

Claims (6)

  A probe body in which one end is in contact with the electrode pad of the object to be measured, and the other end is a connection section connected to the inner wall of the guide tube, and a flange body is provided between the contact section and the connection section. A probe that is inserted from the connection portion side of the probe main body and is in contact with the flange portion; and a guide tube that is inserted from the connection portion side of the probe main body and is in contact with the spring. The tube is made of a conductive material, and the spring in the natural length state is set smaller than the length dimension from the flange portion to the connection portion, and the probe body is inserted into the spring in the natural length state Thus, when the guide tube is inserted into the connection portion of the probe body, the guide tube is not completely inserted into the connection portion of the probe body.   A probe according to claim 1 and a probe support part for attaching the probe to a probe card are provided, and the probe support part has a first opening corresponding to an arrangement pattern of electrode pads of a measurement object. The first guide plate, the second guide plate having a second opening corresponding to the arrangement pattern of the electrode pads of the measurement object, and the first guide plate and the second guide plate are parallel to each other. And a thickness dimension of the first guide plate is set smaller than a length dimension from the flange portion of the probe to the tip of the contact portion, and the first opening is The upper opening is set to be larger in diameter than the guide tube and larger in diameter than the spring, and the first guide plate and the first guide plate Second guy The distance between the plates, the probe unit, characterized in that it is set smaller than the length of the flange portion of the probe to the tip of the connecting portion.   In a state where the support portion is attached to the space transformer substrate constituting the probe card, the connection portion of the probe is not in contact with the connection pad of the substrate, and only the upper end portion of the guide tube is in contact with the contact portion of the probe. When a predetermined overdrive is applied after contacting the electrode pad of the object to be measured, the connecting portion of the probe comes into contact with the inner wall of the guide tube and is connected to the upper end portion of the guide tube and the connecting pad of the substrate. The probe unit according to claim 2.   A probe card comprising the probe unit according to claim 2.   A spacer is interposed between the first guide plate and the second guide plate, and the first opening of the first guide plate is aligned with the second opening of the second guide plate in the vertical direction. A probe support part assembling step for fixing the first guide plate, the second guide plate and the spacer to each other as a probe support part, a placing process for placing the probe support part on the assembly table, and one end A contact part that contacts the electrode pad of the object to be measured and a connection part that contacts the inner wall of the guide tube at the other end, and a spring is inserted from the connection part side into the probe body provided with a flange part on the contact part side A probe body insertion step of inserting the probe body from the second opening toward the first opening, and a guide tube insertion step of inserting a guide tube into the probe body from the second opening. A probe unit Method.   A laminating step of laminating the first guide plate and the second guide plate and causing the first opening of the first guide plate and the second opening of the second guide plate to coincide with each other in the vertical direction; One end is a contact part that contacts the electrode pad of the object to be measured, and the other end is a connection part that contacts the inner wall of the guide tube, and a spring is connected to the probe body having a flange part on the contact part side from the connection part side. The probe main body insertion step of inserting the inserted probe main body from the second opening toward the first opening and the first guide plate and the second guide plate are maintained in a parallel state while both guide plates are A spacer is interposed between the two guide plates in a state in which a predetermined interval is secured between the separation step of relatively separating the first guide plate and the second guide plate, and the first guide plate and the second guide plate The guide plate and spacer of the A probe support portion assembling process of the blanking supporting portion, the manufacturing method of the probe unit, characterized by comprising a guide tube insertion step of inserting the guide tube relative to the probe body from the second opening.

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