JP2008021664A - Method of manufacturing electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide reliable electrical connection and mechanical junction at a junction part even if, for example, ambient temperature changes, in an electronic component having an electronic component element bonded and fixed onto a substrate by a conductive adhesive. <P>SOLUTION: A manufacturing method of an electronic component is used to bond and fix the electronic component element 1C onto the substrate 12 having a plurality of electrode lands 11a, 11b by a conductive adhesive. In the manufacturing method of an electronic component, first conductive adhesives 7, 8 are applied to a region having a larger area than that of a junction interface in the junction section by the first conductive adhesive in the electronic component element 1C and are cured. Then, unneeded parts of the first conductive adhesives 7, 8 are removed, and the electronic component element 1C is bonded to the electrode lands 11a, 11b by second conductive adhesives 14, 15. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an electronic component, and more particularly, to a method for manufacturing an electronic component including a step of mounting an electronic component element such as a piezoelectric resonance element on a substrate using a conductive adhesive.

  Conventionally, an electronic component having a structure in which an electronic component element made of ceramics or the like is mounted on a substrate using a conductive adhesive has been widely used. For example, Patent Document 1 below discloses an electronic component shown in FIG.

  In the electronic component 101 shown in FIG. 9, electrode lands 103 and 104 are formed on an insulating substrate 102 made of insulating ceramics. The electronic component element 105 is bonded onto the substrate 102 using conductive adhesives 106 and 107. Here, the electronic component element 105 has a structure in which excitation electrodes 105b and 105c are formed on both principal surfaces of an electronic component element body 105a made of piezoelectric ceramics. The excitation electrode 105 c is joined to the electrode land 103 by the conductive adhesive 106. In addition, the excitation electrode 105b formed on the upper surface is connected to an electrode extension portion 105d that reaches the lower surface through the end surface of the electronic component body 105a. The electrode extension portion 105 d is joined to the electrode land 104 via the conductive adhesive 107.

A cap 108 having an opening opened downward is fixed to the substrate 102 so as to surround the electronic component element 105.
JP-A-11-265955

  However, in the electronic component 101, since the thermal expansion coefficient of the insulating ceramic constituting the substrate 102 and the thermal expansion coefficient of the piezoelectric ceramic constituting the electronic component body 105a are different, the ambient temperature changes. As a result, stress was inevitably generated in the electronic component body 105a due to the difference in thermal expansion coefficient. Therefore, when the difference in thermal expansion coefficient is large, the electronic component body 105a may be broken due to the thermal stress generated in the electronic component body 105a.

  On the other hand, unlike FIG. 9, when the electronic component element is bonded to and supported by a conductive adhesive or the like in a cantilever manner, the electronic component element can freely vibrate. Therefore, the change of the frequency temperature characteristic due to the thermal stress due to the temperature change hardly occurs. However, since stress concentrates on the joint portion of the electronic component element using the conductive adhesive, vibration resistance and impact resistance are not sufficient.

  Further, in the electronic component 101, it is considered that the conductive adhesives 106 and 107 having excellent elasticity can be used to reduce the stress caused by the above-described difference in thermal expansion coefficient. However, the conventional joining structure using the conductive adhesives 106 and 107 cannot sufficiently reduce the stress caused by the difference in thermal expansion coefficient. Therefore, cracks occurred at the bonding interface between the conductive adhesives 106 and 107 and the electronic component element 105, and the bonding reliability was not sufficient. In addition, characteristics such as the elastic modulus of the conductive adhesives 106 and 107 tend to change depending on the ambient temperature, which tends to change the electrical characteristics of the electronic component 105.

  An object of the present invention is to solve the above-mentioned drawbacks of the prior art and to provide an electronic component having a structure in which an electronic component element is bonded on a substrate using a conductive adhesive, even when the ambient temperature changes. An object of the present invention is to provide a method for manufacturing an electronic component that has excellent bonding reliability, in particular, is less prone to cracks at the bonding interface between a conductive adhesive and an electronic component element, and has little variation in characteristics.

  The present invention is an electronic component manufacturing method for fixing an electronic component element using a conductive adhesive on a substrate having a plurality of electrode lands on at least one main surface, wherein the plurality of electrode lands are one main. A step of preparing a substrate formed on the surface and an electronic component element, and a portion of the electronic component element bonded to the electrode land of the substrate so as to have an area larger than an area bonded to the electrode land. A step of applying and curing the first conductive adhesive, and an area where the first conductive adhesive is bonded to the electrode land after the first conductive adhesive is cured. A step of removing unnecessary portions of the cured first conductive adhesive by cutting; and after removing unnecessary portions of the first conductive adhesive, the first conductive adhesive and the electrode land of the substrate And bonded through a second conductive adhesive Characterized in that it comprises a that step.

  In a specific aspect of the method for manufacturing an electronic component according to the present invention, the electronic component element has first and second end portions facing each other, and is mounted on the substrate of the electronic component element. The electronic component element is bonded to the electrode land of the substrate in the vicinity of the first end and the vicinity of the second end.

  In another specific aspect of the method for manufacturing an electronic component according to the present invention, when the unnecessary portion is removed after the first conductive adhesive is cured, together with the unnecessary portion of the first conductive adhesive, A part of the electronic component element connected to the unnecessary portion of the conductive adhesive is removed by the cutting jig.

  In still another specific aspect of the method for manufacturing an electronic component according to the present invention, as the electronic component element, the first and second main surfaces facing each other and the first and second main surfaces connecting the first and second main surfaces. An electronic component main body having a second end surface, and a plurality of electrodes bonded to the plurality of electrode lands on the substrate are provided on the first main surface.

  In still another specific aspect of the method for manufacturing an electronic component according to the present invention, the electronic component main body is a piezoelectric body, and the first and second main surfaces are opposed to each other via the piezoelectric body. First and second excitation electrodes are formed, whereby a piezoelectric resonator is obtained.

  In still another specific aspect of the method for manufacturing an electronic component according to the present invention, the method further includes a step of fixing a cap to the substrate so as to cover the electronic component element after fixing the electronic component element on the substrate. It is done.

  In the method for manufacturing an electronic component according to the present invention, the first conductive adhesive is applied to the portion of the electronic component element that is bonded to the electrode land on the substrate so that the area is larger than the area that is bonded to the electrode land. Apply. Then, after the first conductive adhesive is cured, unnecessary portions of the first conductive adhesive are cut so that the first conductive adhesive has the above-mentioned area to be bonded to the electrode land. Remove with. After that, the first conductive adhesive and the electrode land of the substrate are fixed by bonding through the second conductive adhesive. Therefore, after the first conductive adhesive is cured, the internal stress in the cured first conductive adhesive can be sufficiently lowered by cutting and removing unnecessary portions of the first conductive adhesive. The first conductive adhesive having a reduced internal stress and the electrode land of the substrate are joined via the second conductive adhesive.

  Therefore, the electronic component element is bonded to the electrode land of the substrate by two-stage curing of the first conductive adhesive and the second conductive adhesive. Moreover, in the cured product of the first conductive adhesive, the internal stress is reduced by cutting and removing the unnecessary portion. Therefore, since it is possible to effectively reduce the internal stress at the joint portion due to the conductive adhesive, cracks are hardly generated at the joint interface between the conductive adhesive and the electronic component element. Therefore, it is possible to provide an electronic component excellent in the reliability of electrical connection and mechanical joining regardless of changes in ambient temperature.

  The electronic component element has first and second end portions opposed to each other, and the electronic component element is disposed in the vicinity of the first end portion and in the vicinity of the second end portion of the surface of the electronic component element mounted on the substrate. When the element is bonded to the electrode land on the substrate, according to the present invention, the electronic component is supported in the vicinity of both ends, and has excellent electrical connection and mechanical bonding reliability using a conductive adhesive. Electronic components can be provided.

  When the unnecessary portion is removed after the first conductive adhesive is cured, together with the unnecessary portion of the first conductive adhesive, an electronic component element connected to the unnecessary portion of the conductive adhesive by a cutting jig is used. When the part is also removed, the unnecessary part of the conductive adhesive can be easily removed simply by cutting in one direction with a cutting jig.

  As an electronic component element, an electronic component main body having first and second main surfaces facing each other and first and second end surfaces connecting the first and second main surfaces, and a first main surface, In the case where a plurality of electrodes bonded to a plurality of electrode lands on a substrate are provided, according to the present invention, an electronic component including an electronic component element that can be surface-mounted on the substrate from the first main surface side is provided. Can be provided.

  When the electronic component body is a piezoelectric body and the first and second excitation electrodes are formed on the first and second main surfaces so as to face each other with the piezoelectric body interposed therebetween, the substrate according to the present invention An electronic component having a piezoelectric resonator mounted thereon and excellent in electrical connection and mechanical bonding reliability can be provided.

  In the case of further comprising a step of fixing the cap to the substrate so as to cover the electronic component element after joining the electronic component element on the substrate, the electronic component element is sealed inside by the substrate and the cap according to the present invention. Electronic components can be provided.

  Hereinafter, the present invention will be clarified by describing specific embodiments of the present invention with reference to the drawings.

  In this embodiment, first, a mother electronic component element 1 shown in FIG. 2 is prepared. The mother electronic component element 1 has a rectangular plate-like mother piezoelectric plate 2. The mother piezoelectric plate 2 is made of piezoelectric ceramics polarized in the direction indicated by the arrow P. Examples of such piezoelectric ceramics include lead titanate ceramics. However, other piezoelectric ceramics may be used, or a piezoelectric single crystal such as quartz may be used.

  A first mother excitation electrode 3 is formed on the upper surface of the mother piezoelectric plate 2. The excitation electrode 3 extends on the upper surface of the piezoelectric plate 2 from the one side surface 2a side toward the other side surface 2b side. The excitation electrode 3 is opposed to the connection electrode 4 with a gap. The connection electrode 4 extends on the upper surface of the piezoelectric plate 2 from the edge formed by the upper surface and the side surface 2b toward the side surface 2a.

  On the other hand, a second excitation electrode 5 is formed on the lower surface of the piezoelectric plate 2. The second excitation electrode 5 extends from the edge formed by the side surface 2b and the lower surface toward the side surface 2a. The excitation electrode 5 of the second mother is opposed to the first mother excitation electrode 3 via the piezoelectric plate 2 at the center in the width direction connecting the side surfaces 2 a and 2 b of the piezoelectric plate 2. A connection electrode 6 is formed on the lower surface of the piezoelectric plate 2 with a gap from the second excitation electrode 5. The connection electrode 5 extends from the edge formed by the side surface 2a and the lower surface toward the side surface 2b.

  The excitation electrodes 3 and 5 and the connection electrodes 4 and 6 can be formed of a conductive material such as Ag or an Ag alloy. The conductive material is not limited to Ag or an Ag alloy, but may be another metal or alloy such as Cu or Al.

  Further, the electrode forming method is not particularly limited, and an appropriate method such as a thin film forming method such as vapor deposition, sputtering or plating, or application / curing of a conductive paste can be used.

  Next, first conductive adhesives 7 and 8 are applied to the upper surface of the mother piezoelectric plate 2 as shown in FIGS. 1A and 1B in a cross-sectional view and a plan view, and are cured. . As is apparent from FIGS. 1A and 1B, the first conductive adhesives 7 and 8 are formed on the upper surface of the mother piezoelectric plate 2, respectively, on the edge formed by the side surface 2a and the upper surface and the side surface 2b. It extends so as to be along an edge formed by the upper surface. The first conductive adhesives 7 and 8 have a trapezoidal cross section. The length of the lower base of the trapezoid in the cross section of the other first conductive adhesive 8 is made equal to the width direction dimension of the connection electrode 4. The width-direction dimension means a dimension along the width direction of the mother piezoelectric plate 2 described above, that is, the direction connecting the side surfaces 2a and 2b.

  The shape of the cross section of the first conductive adhesive 7 is also the same as the shape of the cross section of the other first conductive adhesive 8.

  The application area of the first conductive adhesives 7 and 8 is made larger than the area of the joint portion between the piezoelectric resonator and the conductive adhesive finally obtained by the present embodiment.

  In addition, the dashed-dotted lines A and B of Fig.1 (a) show a cutting line, and a cutting | disconnection is performed along the cutting lines A and B in a post process. And the unnecessary parts 7a and 8a outside the cutting lines A and B are removed by cutting the first conductive adhesives 7 and 8 along the cutting lines A and B. The area of the bonded portion between the remaining cured portions 7b and 8b from which the unnecessary portions 7a and 8a have been removed and the finally obtained piezoelectric resonator is naturally larger than the bonding interface before the unnecessary portions 7a and 8a are removed. It gets smaller.

  The first conductive adhesives 7 and 8 generate stress during curing, and the cured product has a large internal stress. However, by cutting along the cutting lines A and B and removing the unnecessary portions 7a and 8a, internal stress is reduced in the remaining first conductive adhesive portions 7b and 8b. become.

  As the first conductive adhesives 7 and 8, thermosetting adhesives containing conductive particles such as Ag can be used. Such conductive particles are not limited to Ag powder but may be powder of an appropriate metal or alloy such as Cu powder or Al powder. The conductive particles may be spherical or flat. Alternatively, a mixed powder of spherical conductive particles and flat conductive particles may be used.

  Furthermore, examples of the thermosetting resin include an epoxy resin and / or a phenol resin, but are not particularly limited thereto. Furthermore, the conductive adhesive may contain a photocurable resin instead of a thermosetting resin, and in that case, the first conductive adhesives 7 and 8 may be cured by irradiation with light. .

  In the present embodiment, the first conductive adhesives 7 and 8 have a trapezoidal cross-sectional shape in which the upper base is smaller than the lower base, but are not limited to a trapezoid and are rectangular. It may also be an inverted trapezoidal shape. For example, when the first conductive adhesive 7 is taken as an example, the area of the portion where the excitation electrode 3 provided on the piezoelectric plate 2 that is an electronic component element and the conductive adhesive 7 are joined is the area before cutting and removal. In addition, the first conductive adhesive 7 may be first applied so as to have a larger area than after cutting. That is, regardless of the cross-sectional shape, if the cutting is performed along the cutting line A and the bonding area with the excitation electrode 3 is reduced, the internal stress acting on the bonding interface can be similarly reduced.

  The mother electronic component element 1A shown in FIG. 3 is obtained by cutting along the cutting lines A and B using a cutting jig such as a cutting blade as described above. At the time of cutting, not only the cured product of the first conductive adhesives 7 and 8 but also a part of the piezoelectric plate 2 connected thereto was cut and removed along the cutting lines A and B. Therefore, the unnecessary portions 7a and 8a can be easily removed simply by cutting in one direction with the cutting blade along the cutting lines A and B. However, when cutting using the cutting jig, the cutting may be performed so that only the unnecessary portions 7a and 8a of the first conductive adhesives 7 and 8 are cut. That is, the first conductive adhesives 7 and 8 may be cut so as not to cut a part of the piezoelectric plate 2.

  Next, as shown in FIG. 4, the electrode 3 and the outer end surface of the connection electrode 6 and the side surface 2 a of the first conductive adhesive portion 7 b are the same so as to cover one side surface 2 a of the mother piezoelectric plate 2. The electrode 9 is formed by applying and curing a conductive paste so as to cover the side surface exposed in the direction. Similarly, on the other side surface 2b side, the electrode 10 is formed by applying and curing the conductive paste. The electrode 10 extends from the side surface 2b to the end surface on the side surface 2b side of the connection electrode 4 and the excitation electrode 5 and a surface exposed by cutting along the cutting line B of the first conductive adhesive portion 8b.

  As the conductive paste, an appropriate conductive paste such as an Ag paste can be used.

  In addition, you may form the electrodes 9 and 10 not only by application | coating and hardening of an electrically conductive paste but by thin film formation methods, such as vapor deposition, sputtering, or plating.

  Next, the mother electronic component element 1A is cut along the alternate long and short dash line C shown in FIG. In this way, the electronic component element 1C shown in FIG. 6 is obtained. The electronic component element 1C has a piezoelectric plate 2A obtained by the above cutting. The piezoelectric plate 2A is polarized in the arrow P direction as described above.

  An excitation electrode 3A is formed on the upper surface of the piezoelectric plate 2A, and an excitation electrode 5A is formed on the lower surface. The excitation electrodes 3A and 5A are formed by cutting the mother excitation electrodes 3 and 5, respectively. The excitation electrodes 3A and 5A are opposed to each other via the piezoelectric plate 2A at the center in the length direction of the piezoelectric plate 2A. Therefore, the electronic component element 1 </ b> C is an energy confinement type piezoelectric resonator using the thickness shear mode.

  A connection electrode 4A is formed with a gap from the excitation electrode 3A, and a connection electrode 6A is formed with a gap from the excitation electrode 5A on the lower surface of the piezoelectric plate 2A. The connection electrodes 4A and 6A are formed by cutting the connection electrodes 4 and 6 described above. The first conductive adhesive portions 7bA and 8bA are formed on the excitation electrode 3A and the connection electrode 4A on the surface end side of the piezoelectric plate 2A, respectively.

  Further, an electrode 9A is formed on one end side of the piezoelectric plate 2A, and an electrode 10A is formed on the other end side. The electrodes 9A and 10A are formed by cutting the electrodes 9 and 10.

  Next, as shown in FIG. 7, a substrate 12 having a plurality of electrode lands 11a and 11b on its upper surface is prepared. The substrate 12 is made of an insulating ceramic such as a dielectric or alumina. The electronic component element 1 </ b> C is turned over and fixed on the substrate 12 via the second conductive adhesives 13 and 14. Thereafter, the insulating adhesive 16 is applied in a rectangular frame shape, and the cap 17 is joined. The cap 17 has an opening opened downward, and is provided to surround the electronic component element 1C. In this way, it is possible to obtain a cap-type electronic component in which the electronic component element 1 </ b> C is sealed in the package constituted by the substrate 12 and the cap 17.

  As shown in FIG. 8, in the structure in which the electronic component element 1C is fixed on the substrate 12 using the second conductive adhesives 13 and 14, the difference in thermal expansion coefficient between the substrate 12 and the piezoelectric plate 2A is large. And even if the ambient temperature changes, the reliability of electrical connection and mechanical joining is effectively enhanced. This will be described with reference to FIG.

  The 2nd conductive adhesives 13 and 14 have fluidity before hardening. Therefore, when the electronic component element 1C is pressed against the second conductive adhesives 13 and 14 from the first conductive adhesive portions 7bA and 8bA side, an excessive amount of the second conductive adhesives 13 and 14 is placed on the side. It is pushed away. That is, as shown in FIG. 8, the lower surfaces and side surfaces of the first conductive adhesive portions 7bA and 8bA are joined to the electrode lands 11a and 11b via the second conductive adhesives 13 and 14, respectively. become. When the second conductive adhesives 13 and 14 are cured, the electronic component element 1C is bonded and fixed to the electrode lands 11a and 11b.

  However, the first conductive adhesive portions 7bA and 8bA are cured in advance, and the internal stress is remarkably reduced by removing the unnecessary portions 7a and 8a. In addition, since the first and second conductive adhesives are used in a two-stage curing process, the stress due to the curing can be reduced. Therefore, even if the ambient temperature changes, cracks at the bonding interface between the first conductive adhesive portions 7bA and 8bA, the excitation electrode 3A, and the connection electrode 4A hardly occur. Therefore, the reliability of electrical connection and the reliability of mechanical joining can be effectively increased.

  Next, a specific experimental example of the above embodiment will be described.

  A piezoelectric plate made of lead titanate-based ceramics was prepared, an Ag film was formed, patterned, and then cut to obtain the mother piezoelectric plate 2 shown in FIG. In this way, a piezoelectric plate 2 having a width of 3 mm, a thickness of 0.3 mm, and a length of 20 mm was prepared.

  Next, on the upper surface of the mother piezoelectric plate 2, the first conductive adhesives 7 and 8 were applied and cured. The first conductive adhesives 7 and 8 are a spherical Ag powder having a particle diameter of 1 to 3 μm, and a flat Ag powder having a length of 4 to 8 μm, a width of 2 to 4 μm, and a thickness of 0.1 to 0.2 μm. In an amount of 20:80 by weight ratio, 14% by weight of a mixture of an epoxy resin and a phenol resin having a glass transition point Tg of 130 ° C., and 3% by weight of additives such as a dispersant. Were mixed and kneaded using three rolls.

  The conductive adhesive was applied by a dispensing method, maintained at a temperature of 150 ° C. for 0.5 hours, and cured by heating. The dimension in the width direction of the application portion of the first conductive adhesives 7 and 8 was 800 μm, and the dimension in the height direction after curing was 200 μm. During heating, the temperature was maintained at 200 ° C. for 60 minutes.

  Thereafter, the first conductive adhesives 7 and 8 are cut along the cutting lines A and B, and the first conductive adhesive portions 7b which are the remaining portions of the first conductive adhesives 7 and 8 are cut. , 8b, the width dimension of the interface joined to the electrode was set to 500 μm. That is, the dimension in the width direction of the piezoelectric plate 2 after cutting was set to 2.2 mm.

  Thereafter, the mother piezoelectric plate 2 obtained as described above was cut at intervals of 0.5 mm in the length direction to produce the electronic component element 1C shown in FIG.

  For comparison, a mother piezoelectric plate on which electrodes similar to those described above were prepared except that a piezoelectric plate having dimensions of 2.2 mm in width, 20 mm in length, and 0.3 mm in thickness was prepared. The same conductive adhesive was applied so as to have a width of 500 μm and a height dimension after curing of 200 μm, and was heated and cured in the same manner. The mother piezoelectric plate thus obtained was cut in the same manner as in the example to obtain a comparative electronic component element.

  The electronic component elements of Examples and Comparative Examples obtained as described above were mounted on a substrate 12 made of alumina using a second conductive adhesive, as shown in FIG. As the second conductive adhesive, the same one as the first conductive adhesive was used. And after making it harden | cure by heating, the thermal shock cycle test was done about the electronic component of the Example and the comparative example. In the thermal shock cycle test, the process of maintaining the electronic component at −55 ° C. for 15 minutes and then maintaining at + 125 ° C. for 15 minutes was defined as one cycle, and this was repeated 500 cycles. A thermal shock cycle test was performed using 20 electronic parts of Examples and Comparative Examples, and impedance was measured after the test. When the impedance measured after the thermal shock cycle test showed an impedance of 100Ω or more, a connection failure occurred at the joint portion with the conductive adhesive, and it was determined to be defective. The results are shown in Table 1 below.

表１から明らかなように、実施例では、２０個中不良個数は０であったのに対し、比較例では、２０個中５個の不良が見られた。従って、実施例のように、第１の導電性接着剤７，８を硬化した後、不要部分を除去することにより、第１の導電性接着剤と電極との接合部分の接続の信頼性を効果的に高め得ることがわかる。

As apparent from Table 1, in the example, the number of defects in 20 was 0, whereas in the comparative example, 5 of 20 defects were observed. Therefore, as in the embodiment, after the first conductive adhesives 7 and 8 are cured, unnecessary portions are removed, thereby improving the connection reliability of the joint portion between the first conductive adhesive and the electrode. It turns out that it can raise effectively.

  In the above embodiment, the electronic component manufacturing method using the thickness-slip type piezoelectric resonator has been described. However, the present invention relates to an electronic component manufacturing method using various electronic component elements other than the piezoelectric resonator. Can be applied.

(A) And (b) is a cross section for demonstrating the process of cutting and removing an unnecessary part, after hardening the 1st conductive adhesive in the manufacturing method of the electronic component which concerns on one Embodiment of this invention. FIG. The perspective view which shows the mother piezoelectric plate prepared in 1st Embodiment. The cross-sectional view for demonstrating the mother piezoelectric plate after cutting and removing an unnecessary part after hardening a 1st insulating adhesive. FIG. 4 is a cross-sectional view of a mother piezoelectric plate showing a state where an electrode is formed by applying and curing a conductive paste following cutting and removal. The perspective view for demonstrating the process of cut | disconnecting the mother piezoelectric plate and obtaining each electronic component element. The perspective view which shows the electronic component element as a piezoelectric resonator obtained by 1st Embodiment. The disassembled perspective view for demonstrating the process of mounting the electronic component element of 1st Embodiment on a board | substrate. The front sectional view showing the structure where the electronic component element was fixed on the substrate using the 2nd conductive adhesive in a 1st embodiment. Front sectional drawing which shows an example of the conventional electronic component.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Mother electronic component element 1C ... Electronic component element 2 ... Piezoelectric plate 2a, 2b ... Side surface 2A ... Piezoelectric plate 3, 5 ... Excitation electrode 3A, 5A ... Excitation electrode 4, 6 ... Connection electrode 4A, 6A ... Connection electrode 7 , 8 ... 1st conductive adhesive 7bA, 8bA ... 1st conductive adhesive part 9A, 10A ... Electrode 11a, 11b ... Electrode land 12 ... Substrate 13, 14 ... 2nd conductive adhesive 16 ... Insulation Adhesive 17 ... Cap

Claims (6)

An electronic component manufacturing method for fixing an electronic component element using a conductive adhesive on a substrate provided with a plurality of electrode lands on at least one main surface,
Preparing a substrate on which the plurality of electrode lands are formed on one main surface and an electronic component element;
Applying and curing a first conductive adhesive on a portion of the electronic component element to be bonded to the electrode land of the substrate so as to have an area larger than an area bonded to the electrode land; and
After the first conductive adhesive is cured, unnecessary portions of the first conductive adhesive cured to have an area where the first conductive adhesive is bonded to the electrode land are removed by cutting. And a process of
An electronic component comprising: a step of bonding the first conductive adhesive and the electrode land of the substrate through a second conductive adhesive after removing an unnecessary portion of the first conductive adhesive. Manufacturing method.   The electronic component element has first and second end portions facing each other, and on the surface of the electronic component element mounted on the substrate, the first end portion vicinity portion and the second end portion vicinity 2. The method of manufacturing an electronic component according to claim 1, wherein the electronic component element is bonded to an electrode land of the substrate in a portion.   When the unnecessary portion is removed after the first conductive adhesive is cured, the electronic component element connected to the unnecessary portion of the conductive adhesive together with the unnecessary portion of the first conductive adhesive together with a cutting jig The method for manufacturing an electronic component according to claim 1, wherein a part of the electronic component is also removed.   As the electronic component element, an electronic component main body having first and second main surfaces facing each other and first and second end surfaces connecting the first and second main surfaces, and the first main surface The method of manufacturing an electronic component according to claim 1, wherein a plurality of electrodes bonded to the plurality of electrode lands on the substrate are provided.   The electronic component body is a piezoelectric body, and first and second excitation electrodes are formed on the first and second main surfaces so as to face each other with the piezoelectric body interposed therebetween, whereby a piezoelectric resonator is formed. The method of manufacturing an electronic component according to claim 4, wherein: The electronic component manufacturing method according to claim 1, further comprising a step of fixing a cap to the substrate so as to cover the electronic component element after fixing the electronic component element on the substrate. Method.

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