JP2008016667A - Package opening method and device, polishing method and device, chip extraction method and device, and inspection method and device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To inspect a solid-state image sensor chip having a back side bonded to a package from the back side. <P>SOLUTION: A CCD 10 is mounted on a fixing plate 46, a high-power laser beam is irradiated to the CCD 10 while a region accommodating the solid-state image sensor chip 12 is shielded from light, and the package 14 is opened by releasing the bonding of a case 16 and a transparent cover 18. Then, the case 16 and solid-state image sensor chip 12 are fixed by arms 56 to 60. Next, the case 16 is exposed by polishing the fixing plate 46 from the back side of the CCD 10 with a polishing device 55, and afterwards the case 16 is further polished from the back side, thus exposing the solid-state image sensor chip 12. The CCD 10 is driven in such a state, and an extremely faint light emitted by the solid-state image sensor chip 12 is observed from the back side of the CCD 10, thus detecting defective places of the solid-state image sensor chip 12. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a package unsealing method and a package unsealing apparatus for unsealing a package in which a solid-state image sensor chip is housed, which includes a housing having an opening formed on the front side and a transparent cover bonded to the opening. It is. The present invention also relates to a polishing method and a polishing apparatus for polishing a back surface side of a package in order to take out a solid-state image sensor chip housed in the package as described above from the package or inspect from the back side. It is. Furthermore, the present invention provides a method and apparatus for taking out a solid-state image sensor chip contained in a package as described above from the package, and inspects the solid-state image sensor chip contained in the package as described above from the back side. The present invention relates to an inspection method and an inspection apparatus.

  Inspecting the surface of a solid-state image sensor chip using an optical or electron microscope as an inspection method for performing abnormality analysis and performance evaluation of an image sensor chip built in an image sensor such as a CCD image sensor or a CMOS image sensor Or a microlens, a color filter, an electrode, etc. constituting the solid-state imaging device chip are observed while being peeled in order from the front side. Since the solid-state image sensor chip is housed in the package, it is necessary to open the package when performing the inspection by the above-described method. Further, depending on the inspection, it is necessary to take out the solid-state image sensor chip from the package.

In addition, as described in Patent Document 1 below, there is a method of observing the state of ultra-weak light generated by driving the solid-state image sensor chip from the back side of the solid-state image sensor chip. When inspecting an image sensor by this inspection method, it is necessary to polish the package from the back side of the image sensor to expose the solid-state image sensor chip so that ultra-weak light is not absorbed by the package.
Japanese Patent Laid-Open No. 2001-024400

  However, conventionally, when opening a package at the time of inspection, the transparent cover arranged on the front side of the package has been pry open with a knife, a screwdriver, etc., so that dust such as package fragments adheres to the solid-state image sensor chip. Thus, even if dust can be found by inspection, there is a problem that it cannot be identified whether it is attached at the time of manufacture or attached when the package is opened.

  In addition, when the package is composed of a housing provided with an opening on the front side and a transparent cover adhered to the opening of the housing, the back surface of the solid-state image sensor chip is adhered and fixed to the package. It was difficult to take out the solid-state image sensor chip from the package and to observe the solid-state image sensor chip from the back side. That is, in any of these cases, it is necessary to polish the package from the back side to expose the back side of the solid-state image sensor chip, but at this time, there is a problem that the solid-state image sensor chip falls off the package.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a method and an apparatus capable of opening a package without adhering dust or the like to a solid-state imaging device chip. In addition, the present invention can take out the solid-state image sensor chip from the package or observe the solid-state image sensor chip from the back side even when the back surface of the solid-state image sensor chip is bonded and fixed to the package. It is an object of the present invention to provide a method and apparatus that can be used.

  In order to achieve the above object, a package unsealing method according to the present invention comprises a housing having an opening formed on the front side and a transparent cover bonded to the opening, and a package containing a solid-state image sensor chip. In the package opening method, the front surface side of the transparent cover covers an area corresponding to the solid-state imaging device chip, and an area corresponding to an adhesive portion where the housing and the transparent cover are bonded is exposed. A masking step for setting a shading mask, and in a state where the shading mask is set, irradiating a laser beam from the front side of the package toward the transparent cover, and baking the adhesive of the bonding portion, An adhesion release step for releasing the adhesion and a package opening step for removing the transparent cover from the housing are provided. That.

  Further, in the polishing method of the present invention, in order to take out the solid-state imaging device chip housed in a package consisting of a housing having an opening formed on the front side and a transparent cover bonded to the opening from the package, Alternatively, in the polishing method for polishing the back side of the package in order to inspect from the back side, the front side of the transparent cover covers a region corresponding to the solid-state imaging device chip, and the casing and the transparent A masking step for setting a light-shielding mask that exposes a region corresponding to the bonded portion to which the cover is bonded, and laser light is irradiated from the front side of the package toward the transparent cover with the light-shielding mask being set. And removing the transparent cover from the housing, and a debonding step for releasing the bonding by baking the adhesive of the bonding portion. A package opening step, a measuring step for measuring the shapes of the housing and the solid-state image sensor, and a fixing jig for moving the fixing jig based on the measured shape and fixing the housing and the solid-state image sensor And a polishing step of polishing the housing from the back side of the package until at least the solid-state imaging device chip is exposed.

  Before the masking step, the method includes an attachment step of attaching the package onto an inspection substrate with the back face facing. In the polishing step, the inspection substrate is polished to expose the casing, and then the casing is exposed. It is preferable to polish the body.

  Furthermore, in the polishing method of the present invention, in order to take out the solid-state imaging element chip housed in a package consisting of a housing having an opening formed on the front side and a transparent cover bonded to the opening, from the package, Alternatively, in the polishing method for polishing the back side of the package in order to inspect from the back side, the front side of the transparent cover covers a region corresponding to the solid-state imaging device chip, and the casing and the transparent A masking step for setting a light-shielding mask that exposes a region corresponding to the bonded portion to which the cover is bonded, and laser light is irradiated from the front side of the package toward the transparent cover with the light-shielding mask being set. And releasing the adhesive by baking the adhesive of the adhesive part, and removing the transparent cover from the housing. A package opening step, a fixing step of pouring resin into the package and fixing the solid-state image pickup device chip to the case, and at least the solid-state image pickup device chip until the solid-state image pickup device is exposed. And a polishing step for polishing from the back side.

  After the transparent cover is removed, a measuring means for measuring the shape of the housing and the solid-state imaging device chip may be provided, and the fixing means may determine the amount of the resin to be introduced based on the measurement result.

  Further, the chip take-out method of the present invention is the above-described polishing method, and after removing the bonded portion between the back surface of the solid-state image pickup device chip and the package by removing the chip, the solid-state image pickup device chip is taken out from the chip. It is characterized by having steps.

  Further, the inspection method of the present invention uses the above-described polishing method to expose the back surface of the solid-state image sensor chip, and then drives the solid-state image sensor chip to change the state of the solid-state image sensor chip to the package. It is characterized by having an observation step to observe from the back side.

  Further, the package opening device of the present invention comprises a housing having an opening formed on the front side and a transparent cover bonded to the opening, and opens the package containing the solid-state imaging device chip. A light-shielding mask that covers a region corresponding to the solid-state imaging element chip and exposes a region corresponding to a bonding portion where the casing and the transparent cover are bonded is set on the front side of the transparent cover. In a state where the masking means and the light shielding mask are set, the adhesion is released by irradiating a laser beam from the front side of the package toward the transparent cover and baking the adhesive of the adhesive part. And a package opening means for removing the transparent cover from the housing.

  Further, the polishing apparatus of the present invention takes out the solid-state imaging device chip housed in a package consisting of a housing having an opening formed on the front side and a transparent cover bonded to the opening from the package, Alternatively, in a polishing apparatus that polishes the back side of the package in order to inspect from the back side, the front side of the transparent cover covers a region corresponding to the solid-state imaging device chip, and the housing and the transparent Masking means for setting a light-shielding mask that exposes a region corresponding to the bonded portion to which the cover is bonded, and laser light is irradiated from the front side of the package toward the transparent cover with the light-shielding mask being set. And an adhesive release means for releasing the adhesion by baking the adhesive of the adhesion part, and a package for removing the transparent cover from the housing. Unsealing means, measuring means for measuring the shape of the housing and the solid-state imaging device, and fixing for moving the fixing jig based on the measured shape and fixing the housing and the solid-state imaging device And a polishing means for polishing the casing from the back side of the package until at least the solid-state imaging device chip is exposed.

  It is preferable that an inspection substrate to which the package is attached with a back surface facing is provided, and the polishing unit polishes the inspection substrate and exposes the housing, and then polishes the housing.

  The fixing jig includes a first movable portion that presses the housing from the front side so as to press against the inspection substrate, and a second movable portion that sandwiches the solid-state imaging element from the side. It is preferable.

  Further, the measuring unit performs the measurement based on the reflected light of the laser beam emitted from the laser irradiating unit, and the laser irradiating unit includes an output variable mechanism that varies an output of the laser beam. It is preferable to irradiate a high-power laser beam for canceling the laser beam and a low-power laser beam for the measurement.

  The masking means is attached to one end of the light shielding mask, and is movable between a light shielding position where the light shielding mask is set on the transparent cover and a retreat position where the light shielding mask is retracted from the transparent cover. The arm has an adsorption part that adsorbs to the transparent cover at the one end, adsorbs to the transparent cover when moved to the light shielding position, and after the adhesion is released, It is preferable to function as the package opening means for removing the transparent cover from the housing by moving to the retracted position.

  Further, the polishing apparatus of the present invention takes out the solid-state imaging device chip housed in a package consisting of a housing having an opening formed on the front side and a transparent cover bonded to the opening from the package, Alternatively, in a polishing apparatus that polishes the back side of the package in order to inspect from the back side, the front side of the transparent cover covers a region corresponding to the solid-state imaging device chip, and the housing and the transparent Masking means for setting a light-shielding mask that exposes a region corresponding to the bonded portion to which the cover is bonded, and laser light is irradiated from the front side of the package toward the transparent cover with the light-shielding mask being set. And an adhesive release means for releasing the adhesion by baking the adhesive of the adhesion part, and a package for removing the transparent cover from the housing. A package opening means, a fixing means for pouring resin into the package to fix the solid-state image sensor chip to the case, and at least the solid-state image sensor chip until the solid-state image sensor chip is exposed. And polishing means for polishing from the back side.

  After removing the transparent cover, a measuring unit that measures the shape of the housing and the solid-state imaging device chip may be provided, and the fixing unit may determine the amount of the resin to be input based on the measurement result.

  The chip take-out apparatus of the present invention uses the above-described polishing apparatus to remove the chip from which the solid-state image pickup device chip is taken out after polishing and removing the adhesive portion between the back surface of the solid-state image pickup device chip and the package. It is characterized by having means.

  In addition, the inspection apparatus of the present invention uses the above-described polishing apparatus to expose the back surface of the solid-state image sensor chip, and then drives the solid-state image sensor chip to change the state of the solid-state image sensor chip to the package. It is characterized by having observation means to observe from the back side.

  According to the present invention, the transparent cover is removed after irradiating the laser beam to release the adhesion to the housing, so that the inspector removes the transparent cover from the housing using a knife or a driver. Compared to the case, the package can be opened without attaching dust or the like to the solid-state imaging device chip.

  In addition, since the solid-state image pickup device chip is fixed by pouring resin into the fixing jig or the package, the solid-state image pickup device chip may fall off even if the image sensor is polished from the back side. Absent. For this reason, even when the back surface of the solid-state image sensor chip is bonded and fixed to the package, the solid-state image sensor chip is taken out from the package and inspected without being dropped, or inspected by observing from the back side. I can do it.

  Furthermore, when the package is mounted on the inspection substrate with the back surface facing, and polishing is performed, if the back surface of the package is polished after polishing the inspection substrate, the polishing generated on the back surface side of the package It is possible to prevent debris from entering the front side of the package.

  As shown in FIG. 1, a CCD image sensor (CCD) 10 includes a solid-state image sensor chip 12 that is an inspection object of the present invention, and a package 14 that houses the solid-state image sensor chip 12. The solid-state imaging element chip 12 is formed with a photoelectric conversion element that accumulates charges corresponding to the amount of received light for each pixel, and the CCD 10 outputs the charges accumulated in each pixel of the solid-state imaging element chip 12 as an imaging signal. To do.

  The package 14 includes a case 16 and a transparent cover 18, and the solid-state image pickup device chip 12 is fixed with its back surface adhered to the bottom surface of the case 16 with an adhesive. The case 16 is made of, for example, ceramic and includes a plurality of terminals 20 provided so as to be exposed from the side surface to the back surface. The terminal 20 is made of a metal contact piece having a U-shaped cross section that is insert-molded in the case 16, and one end portion provided inside the case 16 is connected to the solid-state imaging element chip 12 via a bonding wire 22. The transparent cover 18 is made of, for example, glass, and is bonded to the opening on the front side of the case 16 with an adhesive to seal the package 14.

  In FIG. 2, the inspection apparatus 30 of the present invention performs inspection by observing the state of ultra-weak light generated from the solid-state imaging device chip 12 from the back side of the CCD 10 while driving the CCD 10. Is what you do. The inspection device 30 includes a transport mechanism 32, a light shielding / adsorption arm 34, a laser irradiator 36, a light receiving unit 38, a polishing mechanism 40, and an observation mechanism 42. Each unit of these inspection devices 30 is connected to a control unit 44 to be integrated. It is driven and controlled.

  As described above, since the inspection apparatus 30 performs inspection while driving the CCD 10, it is necessary to electrically connect the CCD 10 and the inspection apparatus 30. For this reason, as shown in FIG. 3, the inspection apparatus 30 uses a fixed plate 46 for fixing the CCD 10, and performs the inspection with the CCD 10 attached to the fixed plate 46.

  As shown in FIG. 4, the fixed plate 46 has a wiring pattern 48 formed on the front side to which the CCD 10 is attached, and the CCD 10 is in a state where the terminal 20 exposed on the back is in contact with one end of the wiring pattern 48. To be fixed to the fixing plate 46. The other end of the wiring pattern 48 is connected to the control unit 44, and the CCD 10 and the inspection apparatus 30 are electrically connected via the wiring pattern 48. Further, the fixed plate 46 is formed to be sufficiently larger than the CCD 10 and has a function of preventing polishing debris from polishing from the back side of the CCD 10 from the back side to the front side. .

  The transport mechanism 32 includes a holding unit that holds the fixed plate 46, and a cam, a gear, and a motor for moving the holding unit. The transport mechanism 32 moves the holding unit under the control of the control unit 44, and transports the CCD 10 together with the fixed plate 46 to each part of the inspection apparatus 30.

  As shown in FIG. 5, the light shielding / adsorption arm 34 has a suction cup-shaped tip, and discharges air between the transparent cover 18 and the light shielding / adsorption arm 34 from the discharge port 49. By this, it adsorbs to the transparent cover 18.

  Further, the tip portion of the light shielding / sucking arm 34 is formed of a material that blocks laser light, covers an area corresponding to the solid-state imaging device chip 12, and has a transparent cover 18 and a case 16, as shown in FIG. The outer periphery is formed in a rectangular shape that is slightly larger than the solid-state imaging device chip 12 and slightly smaller than the transparent cover 18 so as to expose a region corresponding to the bonded portion 50 to which the is bonded. The light shielding / sucking arm 34 is driven by the control unit 44, and is between a light shielding / sucking position attracted to the front surface of the transparent cover 18 so as to cover the solid-state imaging device chip 12 and a retreat position away from the CCD 10. Moving.

  The laser irradiator 36 irradiates the CCD 10 with a high-power laser beam for baking the adhesive of the bonding portion 50 and a low-power laser beam for measuring the shape of the CCD 10. Is varied by an output variable mechanism 51 controlled by the control unit 44. The laser irradiator 36 irradiates the front side of the CCD 10 with high-power laser light in a state where the light shielding / adsorption arm 34 is adsorbed to the transparent cover 18. As a result, the adhesive of the bonding portion 50 is baked, the bonding between the transparent cover 18 and the case 16 is released, and the package 14 can be opened by moving the light shielding / sucking arm 34 to the retracted position.

  Further, the laser irradiator 36 irradiates the CCD 10 with low-power laser light after the package 14 is opened. The laser light is reflected by the fixed plate 46, the case 16 disposed on the upper surface of the fixed plate 46, and the solid-state imaging device chip 12, and is received by the light receiving unit 38. The light receiving unit 38 is connected to a measuring unit 52 provided in the control unit 44. The measurement unit 52 calculates the distance from the laser irradiator 36 to each reflection point based on the state of the reflected light obtained from the light receiving unit 38. Subsequently, the measurement unit 52 generates shape data representing the shape such as the size and height of the outer periphery of the case 16 and the solid-state imaging device chip 12 from the distance from the laser irradiator 36 to each reflection point. Is stored in the memory 53.

  The polishing mechanism 40 includes a fixing jig 54 and a polishing device 55. As shown in FIGS. 7 and 8, the fixing jig 54 includes a plurality of arms 56 to 60 and an arm moving mechanism 61 that holds the arms 56 to 60 movably. The mechanism 61 is driven to move the arms 56 to 60. The control unit 44 refers to the shape data stored in the memory 53 and moves the arms 56 and 57 so as to press the case 16 against the fixed plate 46. Further, the arm 58 is moved to the upper surface of the solid-state image sensor chip 12 so that the solid-state image sensor chip 12 does not fall off from the case 16 during polishing, which will be described later, and the solid-state image sensor chip 12 is moved from both sides by the arms 59 and 60. Hold it in place.

  As the polishing apparatus 55, for example, a high performance IC back surface polishing apparatus (C9107) manufactured by Hamamatsu Photonics is used. Based on the shape data stored in the memory 53, the polishing device 55 polishes the fixing plate 46 from the back side to expose the case 16, and further polishes the case 16 from the back side, as shown in FIG. Then, the back surface of the solid-state image sensor chip 12 is exposed.

  As the observation mechanism 42, a known emission microscope is used. Then, while driving the CCD 10, the observation mechanism 42 observes the ultra-weak light emitted from the solid-state imaging device chip 12 from the back side of the CCD 10, thereby analyzing the abnormal part.

  Hereinafter, the inspection procedure of the CCD 10 using the inspection apparatus 30 having the above-described configuration will be described with reference to the flowchart shown in FIG. In the inspection of the CCD 10, first, the CCD 10 is attached to the fixed plate 46. Subsequently, the light shielding / sucking arm 34 is moved to the light shielding / sucking position and sucked to the front surface of the transparent cover 18. In this state, the laser irradiator 36 irradiates the CCD 10 with a high-power laser beam for baking the adhesive, thereby releasing the adhesion between the case 16 and the transparent cover 18. At this time, since the solid-state image sensor chip 12 is shielded from light, it is not damaged by the laser beam.

  When the adhesion between the case 16 and the transparent cover 18 is released, the light shielding / sucking arm 34 is moved to the retracted position while the suction with the transparent cover 18 is maintained, and the package 14 is opened. When the package 14 is opened, the laser irradiator 36 irradiates the CCD 10 with low-power laser light for measuring the shape of the CCD 10. Then, the measurement unit 52 generates shape data indicating the shape of the CCD 10 based on the reflected light of the shape measurement laser beam received by the light receiving unit 38.

  Subsequently, the arms 56 to 60 are moved based on the shape data, and the case 16 and the solid-state imaging device chip 12 are fixed. Thereafter, the polishing device 55 polishes the fixed plate 46 from the back side of the CCD 10 based on the shape data to expose the case 16, and then polishes the case 16 from the back side to remove the solid-state imaging device chip 12. Expose. Then, while driving the CCD 10 in this state, the observation mechanism 42 observes the state of ultra-weak light generated by the solid-state image sensor chip 12 from the back side of the CCD 10, thereby analyzing the abnormal portion of the solid-state image sensor chip 12. Done.

  In the above embodiment, the case and the solid-state imaging device chip are described as being fixed by the fixing jig. However, the present invention is not limited to this. For example, the solid-state imaging element chip may be fixed to the case with resin. In this case, as in the inspection apparatus 100 shown in FIG. 11, a resin loading mechanism 102 is provided, and a laser irradiator 104 that irradiates only high-power laser light for baking the adhesive of the bonding portion 50 is provided.

  Then, as shown in FIG. 12, after opening the package 14 in the same procedure as in the above-described embodiment, the resin is poured into the case 16 by the resin loading mechanism 102, and the resin 106 is cured as shown in FIG. By doing so, the solid-state imaging device chip 12 may be fixed to the case 16. By doing so, the arm, the output variable mechanism, the light receiving unit, the measuring unit, and the like can be eliminated, so that the cost of the inspection apparatus can be suppressed.

  Of course, in order to securely fix the case, the case may be pressed against the fixing plate by the arm. Further, similarly to the above-described embodiment, an output variable laser irradiator, an output variable mechanism, a light receiving unit, a measurement unit, and the like are provided, and the shape of the CCD is measured after opening the package, and the flow is performed based on the measurement result. The amount of resin may be determined. By doing so, an optimal amount of resin can be poured according to the shape of the CCD and the volume of the package required from the shape of the CCD.

  In the above-described embodiment, an example in which an emission microscope is used as the observation mechanism has been described. However, the light emission state of the solid-state imaging device chip may be observed using other observation equipment. Further, the present invention is not limited to the example of observing the light emission state of the solid-state image sensor chip. For example, the abnormal portion may be analyzed by observing the heat generation state of the solid-state image sensor chip accompanying the drive of the CCD.

  Furthermore, in the present invention, even when the package is opened using a laser beam, the surface of the solid-state image sensor chip is compared with the case where the package is opened using a knife or a driver as in the past. It is possible to obtain an effect of preventing the adhesion of dust and the like. For this reason, after opening a package using a laser beam, you may observe and inspect a solid-state image sensor chip from the front side using an optical or an electron microscope, for example.

  In the present invention, since the solid-state imaging device chip is fixed when the package is polished from the back side, the solid-state imaging device chip can be obtained even if the bonding portion between the solid-state imaging device chip and the package is removed by polishing. It is possible to obtain an effect that does not fall off the package. For this reason, the solid-state image sensor chip may be taken out of the package after polishing and inspected by observing the solid-state image sensor chip from the front side using an optical or electron microscope, or by inspecting the cross section.

  When the solid-state image sensor chip fixed by the resin is taken out from the package and the solid-state image sensor chip is observed from the front side, the solid-state image sensor chip is taken out from the package together with the resin, and then, for example, by plasma etching. Remove the resin. Thereafter, the solid-state image sensor chip may be observed and inspected.

  Further, the present invention is not limited to the inspection of the solid-state image sensor chip mounted on the CCD image sensor, but can be applied to the inspection of the solid-state image sensor chip mounted on the CMOS image sensor.

It is an exploded view of CCD. It is a block diagram showing the structure of an inspection apparatus. It is sectional drawing showing a mode that CCD was attached to the plate for fixation. It is a top view of a plate for fixation. It is sectional drawing showing a mode that the light-shielding and adsorption | suction arm was set in the front surface of the transparent cover. It is a top view showing a mode that the light-shielding / sucking arm was set on the front surface of the transparent cover. It is sectional drawing showing a mode that the case and the solid-state image sensor chip were fixed by the arm. It is a top view showing a mode that the case and the solid-state image sensor chip were fixed by the arm. It is sectional drawing showing the plate for fixation and CCD after grinding | polishing. It is a flowchart showing an inspection procedure. It is a block diagram showing the structure of an inspection apparatus. It is a flowchart showing an inspection procedure. It is sectional drawing showing a mode that the solid-state image sensor chip was fixed with resin.

Explanation of symbols

10 CCD
DESCRIPTION OF SYMBOLS 12 Solid-state image sensor chip 14 Package 16 Case 18 Transparent cover 30, 100 Inspection apparatus 34 Light-shielding / adsorption arm 36, 104 Laser irradiation device 38 Light receiving part 40 Polishing mechanism 42 Observation mechanism 44 Control part 46 Fixed plate 51 Output variable mechanism 52 Measurement part 54 Fixing jig 55 Polishing device 102 Resin loading mechanism

Claims (21)

In the package unsealing method for unsealing a package containing a solid-state imaging device chip, comprising a housing having an opening formed on the front side and a transparent cover bonded to the opening,
A masking step of setting a light-shielding mask on the front surface side of the transparent cover so as to cover an area corresponding to the solid-state image sensor chip and to expose an area corresponding to an adhesive portion where the casing and the transparent cover are bonded. When,
In the state where the light shielding mask is set, an adhesion release step of releasing the adhesion by irradiating a laser beam from the front side of the package toward the transparent cover and baking the adhesive of the adhesion part;
A package opening method comprising: a package opening step for removing the transparent cover from the housing. In order to take out a solid-state image sensor chip housed in a package consisting of a housing having an opening formed on the front side and a transparent cover bonded to the opening, or to inspect from the back side In the polishing method for polishing the back side of the package,
A masking step of setting a light-shielding mask on the front surface side of the transparent cover so as to cover an area corresponding to the solid-state image sensor chip and to expose an area corresponding to an adhesive portion where the casing and the transparent cover are bonded. When,
In the state where the light shielding mask is set, an adhesion release step of releasing the adhesion by irradiating a laser beam from the front side of the package toward the transparent cover and baking the adhesive of the adhesion part;
A package opening step for removing the transparent cover from the housing;
A measuring step for measuring the shape of the housing and the solid-state imaging device;
A fixing step of moving the fixing jig based on the measured shape and fixing the housing and the solid-state imaging device;
A polishing method comprising: a polishing step of polishing the housing from the back side of the package until at least the solid-state imaging device chip is exposed. Before the masking step, the method includes an attachment step of attaching the package on an inspection substrate with the back face facing,
3. The polishing method according to claim 2, wherein, in the polishing step, the casing is polished after the inspection substrate is polished to expose the casing.   A polishing method according to claim 2 or 3, further comprising: a chip take-out step for removing the solid-state image sensor chip from the surface after polishing and removing an adhesive portion between the back surface of the solid-state image sensor chip and the package. A method for taking out a chip.   The state of the solid-state image sensor chip is changed from the back side of the package while driving the solid-state image sensor chip after exposing the back surface of the solid-state image sensor chip using the polishing method according to claim 2. An inspection method comprising an observation step for observation. In order to take out a solid-state image sensor chip housed in a package consisting of a housing having an opening formed on the front side and a transparent cover bonded to the opening, or to inspect from the back side In the polishing method for polishing the back side of the package,
A masking step of setting a light-shielding mask on the front surface side of the transparent cover so as to cover an area corresponding to the solid-state image sensor chip and to expose an area corresponding to an adhesive portion where the casing and the transparent cover are bonded. When,
In the state where the light shielding mask is set, an adhesion release step of releasing the adhesion by irradiating a laser beam from the front side of the package toward the transparent cover and baking the adhesive of the adhesion part;
A package opening step for removing the transparent cover from the housing;
A fixing step of pouring resin into the package and fixing the solid-state imaging device chip to the housing;
A polishing method comprising: a polishing step of polishing the housing from the back side of the package until at least the solid-state imaging device chip is exposed. After removing the transparent cover, comprising a measuring means for measuring the shape of the housing and the solid-state imaging device chip,
The polishing method according to claim 6, wherein the fixing unit determines an amount of the resin charged based on the measurement result.   8. A polishing step according to claim 6 or 7, further comprising a step of removing a chip from the solid-state image pickup device chip after removing the bonded portion between the back surface of the solid-state image pickup device chip and the package by polishing. A method for taking out a chip.   The state of the solid-state image sensor chip is changed from the back side of the package while driving the solid-state image sensor chip after exposing the back surface of the solid-state image sensor chip using the polishing method according to claim 6 or 7. An inspection method comprising an observation step for observation. In a package unsealing apparatus for unsealing a package containing a solid-state imaging device chip, comprising a housing having an opening formed on the front side and a transparent cover bonded to the opening,
Masking means for setting a light-shielding mask on the front side of the transparent cover so as to cover a region corresponding to the solid-state image sensor chip and to expose a region corresponding to a bonding portion where the casing and the transparent cover are bonded. When,
In a state where the light shielding mask is set, an adhesive releasing means for releasing the adhesion by irradiating a laser beam from the front side of the package toward the transparent cover and baking the adhesive of the adhesion part;
A package opening device comprising: package opening means for removing the transparent cover from the housing. In order to take out a solid-state image sensor chip housed in a package consisting of a housing having an opening formed on the front side and a transparent cover bonded to the opening, or to inspect from the back side In the polishing apparatus for polishing the back side of the package,
Masking means for setting a light-shielding mask on the front side of the transparent cover so as to cover a region corresponding to the solid-state image sensor chip and to expose a region corresponding to a bonding portion where the casing and the transparent cover are bonded. When,
In a state where the light shielding mask is set, an adhesive releasing means for releasing the adhesion by irradiating a laser beam from the front side of the package toward the transparent cover and baking the adhesive of the adhesion part;
A package opening means for removing the transparent cover from the housing;
Measuring means for measuring the shape of the housing and the solid-state imaging device;
A fixing means for moving the fixing jig based on the measured shape and fixing the housing and the solid-state imaging device;
A polishing apparatus comprising: polishing means for polishing the housing from the back side of the package until at least the solid-state imaging device chip is exposed. An inspection board to which the package is attached in a state where the back faces each other,
The polishing apparatus according to claim 11, wherein the polishing unit polishes the casing after the inspection substrate is polished to expose the casing.   The fixing jig includes a first movable portion that presses the housing from the front side so as to press against the inspection substrate, and a second movable portion that sandwiches the solid-state imaging element from the side. 13. The polishing apparatus according to claim 11 or 12, characterized in that: The measurement means performs the measurement based on the reflected light of the laser light emitted from the laser irradiation means,
The laser irradiation means includes an output variable mechanism that varies the output of the laser light, and irradiates the high-power laser light for releasing the adhesion and the low-power laser light for the measurement. The polishing apparatus according to claim 11. The masking means has an arm movable between a light shielding position where the light shielding mask is attached to one end and the light shielding mask is set on the transparent cover, and a retreat position where the light shielding mask is retracted from the transparent cover. And having
The arm includes a suction portion that is attracted to the transparent cover at the one end, and is attracted to the transparent cover when moved to the light shielding position, and is moved to the retracted position after the adhesion is released. The polishing apparatus according to claim 11, wherein the polishing apparatus functions as the package opening means for removing the transparent cover from the housing.   16. A polishing apparatus according to claim 11, further comprising a chip take-out means for removing the solid-state image pickup device chip from the surface after polishing and removing a bonded portion between the back surface of the solid-state image pickup device chip and the package. A chip take-out apparatus characterized by the above.   16. The polishing apparatus according to claim 11, wherein after exposing the back surface of the solid-state image sensor chip, the state of the solid-state image sensor chip is changed while driving the solid-state image sensor chip. An inspection apparatus comprising observation means for observation from the side. In order to take out a solid-state image sensor chip housed in a package consisting of a housing having an opening formed on the front side and a transparent cover bonded to the opening, or to inspect from the back side In the polishing apparatus for polishing the back side of the package,
Masking means for setting a light-shielding mask on the front side of the transparent cover so as to cover a region corresponding to the solid-state image sensor chip and to expose a region corresponding to a bonding portion where the casing and the transparent cover are bonded. When,
In a state where the light shielding mask is set, an adhesive releasing means for releasing the adhesion by irradiating a laser beam from the front side of the package toward the transparent cover and baking the adhesive of the adhesion part;
A package opening means for removing the transparent cover from the housing;
Fixing means for pouring resin into the package and fixing the solid-state imaging device chip to the housing;
A polishing apparatus comprising: polishing means for polishing the housing from the back side of the package until at least the solid-state imaging device chip is exposed. After removing the transparent cover, comprising a measuring means for measuring the shape of the housing and the solid-state imaging device chip,
The polishing apparatus according to claim 18, wherein the fixing unit determines an amount of the resin charged based on the measurement result.   20. A polishing apparatus according to claim 18 or 19, further comprising a chip take-out means for removing the solid-state image pickup device chip from the surface after polishing and removing a bonded portion between the back surface of the solid-state image pickup device chip and the package. A chip takeout device characterized by the above.   The state of the solid-state image sensor chip is changed from the back side of the package while driving the solid-state image sensor chip after exposing the back surface of the solid-state image sensor chip using the polishing apparatus according to claim 18 or 19. An inspection apparatus comprising observation means for observation.

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