JP2008042257A - Inspection device for solid-state imaging element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection device for a solid-state imaging element which is sealed in a package and can correctly inspect a plurality of imaging elements in a short time. <P>SOLUTION: When a plurality of imaging devices having a solid-state imaging element sealed into a package are installed in an inspection device, the optical axis of a light to be emitted to each imaging device is deviated from the center of the imaging device. However, a light is first emitted from a position approximate to each of the imaging devices in a state where the optical axes are each deviated from the center of each of the imaging devices and photographing is executed. An image acquired this time has a modulated distribution of quantities of lights to be emitted to the imaging devices, and the position of the optical axes for the center of the imaging devices are evaluated based on an unevenness of luminance data of the image reflecting the distribution. The optical axes are each shifted based on the evaluation, a light is emitted in a state where the center of each of the imaging devices matches the position of each of the optical axes to execute photographing, and inspection is correctly executed based on an image acquired this time. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an apparatus for inspecting the performance of a solid-state image sensor, and more particularly, to an apparatus for inspecting the performance of a solid-state image sensor enclosed in a package.

  Solid-state imaging devices such as CCD (Charge Coupled Device) and CMOS (Complementary Metal-Oxide Semiconductor) are used in imaging devices such as digital cameras that have become widespread in recent years. In recent years, although a method for manufacturing this solid-state imaging device has been established, in order to supply a stable product to the market, it is essential to perform a thorough performance inspection at each stage of manufacturing.

  This performance inspection includes an inspection performed at the stage where the solid-state imaging device is manufactured on the wafer and an inspection performed after packaging, and it is preferable to inspect a plurality of them simultaneously for shortening the inspection time. However, when a plurality of solid-state image sensors are inspected substantially simultaneously, accurate inspection cannot be performed unless the optical axis of the light applied to each solid-state image sensor coincides with the center of each solid-state image sensor. .

  When testing such a plurality of solid-state imaging devices before packaging and dicing, the solid-state imaging devices are manufactured with high precision positioning on the wafer. The positions between the elements are orderly, and these positional shifts are not a major problem, but complicated adjustments are required in response to changes in the alignment interval of the solid-state image pickup elements accompanying changes in the wafer to be inspected.

  In order to improve this, an inspection device for a solid-state imaging device having a mechanism for adjusting the position of an optical fiber with inspection light emitted from the optical fiber is known (see Patent Document 1).

  On the other hand, when the solid-state imaging device is inspected after being packaged, the inspection is performed due to variations in the size of each package or variations in the installation position when installing the solid-state imaging device to be inspected in the inspection device. The optical positional relationship between the solid-state imaging device and the inspection light to be irradiated has shifted.

In order to improve this, the image obtained from the imaging device to be inspected is compared with the image to be obtained when the solid-state imaging device is normally manufactured, and the positions of the inspection light and the solid-state imaging device to be inspected are corrected. An inspection apparatus is known (see Patent Document 2).
Japanese Patent Laying-Open No. 2005-164526 JP 2002-347376 A

  The method used in the inspection apparatus disclosed in Patent Document 1 is that a plurality of solid-state image sensors are used when there are variations in the arrangement of the plurality of solid-state image sensors as in the case of inspecting a solid-state image sensor enclosed in a package. There is a problem that it is difficult to inspect them almost simultaneously.

  In addition, since the inspection apparatus disclosed in Patent Document 2 uses the entire image obtained from the solid-state imaging device to be inspected and the entire pre-recorded image, the amount of information to be processed is large and a plurality of solid-state imaging devices are used. There is a problem that it takes time to inspect.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a solid-state image sensor inspection apparatus capable of accurately inspecting a plurality of solid-state image sensors in a short time.

  The inspection apparatus of the present invention irradiates light from a light source through a condensing optical system to an imaging device in which a solid-state imaging device is sealed in a package, evaluates an imaging signal output from the imaging device, and performs a performance of the solid-state imaging device. A device containing a plurality of image pickup devices arranged and held, and acquiring an image pickup signal from each of the image pickup devices held in the device containment unit individually A device holding means connected to a circuit; and a plurality of collections that are provided between the device holding means and the light source and individually guide light from the light source to each of the imaging devices held by the device holding means. An optical system supporting means for supporting an optical optical system, and a light amount distribution of light irradiated on the solid-state imaging device based on a signal acquired for each imaging device from the acquisition circuit Evaluation means for individually evaluating the position of the optical axis of the condensing optical system with respect to the solid-state imaging device, and in a plane parallel to the light receiving surface of the solid-state imaging device according to an evaluation signal obtained from the evaluation means And moving means for individually moving each of the condensing optical systems.

  In addition, the optical system includes an adjusting unit that moves the condensing optical system between the device holding unit and the light source, and adjusts a distance at which the solid-state imaging element is irradiated with light from the condensing optical system. Irradiating light from the light source by bringing the condensing optical system close to the solid-state imaging device to actively modulate the light amount distribution, and the evaluating means is based on the modulation of the light amount distribution. The position of the optical axis of the condensing optical system with respect to the solid-state image sensor is evaluated.

  In addition, the acquisition circuit acquires a signal output from each of the imaging devices as a substantially rectangular image reflecting the light amount distribution, and the evaluation unit includes data along a line parallel to a long side of the image. And the data along a line parallel to the short side of the image, the position of the optical axis of the condensing optical system with respect to the solid-state imaging device is evaluated.

  According to the inspection apparatus of the present invention, based on a signal acquired from the light source for each imaging device, the light amount distribution of the light irradiated to the solid-state imaging device enclosed in each imaging device is evaluated, and according to this evaluation Since each condensing optical system is moved and the optical axis of the light irradiated to the solid-state image sensor is moved, it is possible to accurately inspect a plurality of solid-state image sensors having variations in installation positions substantially simultaneously and in a short time. it can.

  In addition, the condensing optical system is brought close to the solid-state image sensor, and the light amount distribution of the light irradiated to the solid-state image sensor is actively modulated. Based on the modulated light amount distribution, the condensing optical system for the solid-state image sensor is Since the position of the optical axis is evaluated, the position of the optical axis of the condensing optical system with respect to the solid-state imaging device can be easily evaluated.

  In addition, signals output from each imaging device are acquired as an image reflecting the light amount distribution, and solid-state imaging is performed from data along a line parallel to the long side and data along a line parallel to the short side of the image. Since the position of the optical axis of the condensing optical system with respect to the element is evaluated, the amount of data and calculation required for evaluating the position of the optical axis are small, and a plurality of solid-state imaging elements can be inspected in a short time.

As shown in FIGS. 1 and 2, an imaging device 11 to be inspected by a solid-state image sensor inspection apparatus 5 (inspection apparatus) includes an imaging chip 12 (solid-state image sensor), a wiring board 13, a sealing resin 14, and the like. The

  The wiring board 13 is a printed board using glass epoxy or the like as the base material 16. The upper and lower surfaces of the substrate 16 are provided with an internal electrode 17 for electrically connecting to the imaging chip 12, an external electrode 18 for connecting the external device such as the inspection apparatus 5 and the imaging chip 12, and the like. Yes. The internal electrode 17 and the external electrode 18 are electrically connected by a conductive film 21 provided on the inner wall of a through hole 19 formed in the base material 16. The internal electrode 17, the external electrode 18, and the conductive film 21 are made of a metal such as aluminum, gold, or copper, or an alloy thereof. The upper and lower surfaces of the wiring board 13 are covered and protected by a solder resist 22 except for the surfaces of the internal electrode 17 and the external electrode 18.

  The sealing resin 14 is made of a thermosetting resin, and seals the upper surface of the wiring board 13 and the periphery of the imaging chip 12. This sealing resin 14 prevents oxidation and corrosion of input / output electrodes 28, internal electrodes 17, and bonding wires 23, which will be described later, due to moisture and oxygen in the air, and improves the mechanical strength of the imaging device 11.

  The imaging chip 12 is fixed to the wiring board 13 with a die bonding paste or resin. The input / output electrode 28 of the imaging chip 12 is electrically connected to the internal electrode 17 by a bonding wire 23 made of a metal such as aluminum or gold. When the imaging chip 12 is fixed to the wiring board 13 when the imaging chip 12 is fixed to the wiring board 13, the imaging chip 12 is inclined and fixed to the wiring board 13, which causes shading in an image captured by the imaging device 11 later.

  As shown in FIGS. 3 and 4, the imaging chip 12 includes an image sensor 26 (light receiving surface), a microlens array 27, input / output electrodes 28, spacers 29, and a cover glass 31.

  The image sensor 26 is manufactured in the vicinity of the surface of the wafer 32 made of a semiconductor such as silicon or gallium arsenide with a predetermined size and alignment interval using a well-known semiconductor processing technique. The image sensor 26 has a large number of light receiving elements arranged in a matrix, and a color filter in which any of R, G, and B is arranged so as to correspond to each of the light receiving elements is produced. . This color filter makes it possible to obtain a color image. Further, since this color filter is manufactured by coloring a resin or the like, if the thickness or coloring of the resin is uneven, the sensitivity of the image sensor 26 becomes non-uniform.

  The microlens array 27 is provided on the surface of the image sensor 26, and is provided so that microlenses are arranged so as to correspond to the respective light receiving elements. The microlens array 27 efficiently guides light incident on the image sensor 26 to the light receiving element, and improves the sensitivity of the image sensor 26. In addition, since the microlens is made of a material such as resin that is easily molded but easily scratched, an image to be photographed is damaged when the microlens array 27 is damaged in the manufacturing process of the image sensor 26 or the like. Cause defects.

  A plurality of input / output electrodes 28 are provided in line on two opposing sides of the image sensor 26. The input / output electrode 28 is made of a metal such as aluminum, gold, or copper, and is electrically connected to the image sensor 26 to enable signal input to the image sensor 26 and signal output from the image sensor 26.

  The spacer 29 is formed in a square shape using an inorganic material such as silicon, and is fixed to the surface of the imaging chip 12 between the image sensor 26 and the input / output electrode 28 so as to surround the image sensor 26. . The spacer 29 creates a space between the cover glass 31 and the imaging chip 12 and prevents positional interference between the cover glass 31 and the microlens array 27.

  The cover glass 31 is manufactured by fixing the glass substrate 33 to the wafer 32 via the spacers 29 and dicing, thereby protecting each image sensor 26 from the outside. The glass substrate 33 and the cover glass 31 are low α-ray glass, which emits less α-rays and prevents the light receiving element from being damaged by α-rays. Note that an infrared cut filter or an optical low-pass filter may be bonded to the upper surface of the cover glass 31.

  As shown in FIG. 5, the inspection apparatus 5 that inspects the performance of the solid-state imaging device includes an illumination unit 36 that irradiates inspection light to the imaging devices 11a and 11b to be inspected, and an inspection board on which a plurality of imaging devices can be installed simultaneously. 37 (device holding means), a control unit 38 connected to the illumination unit 36 and the inspection substrate 37, and the like.

  The inspection board 37 includes device housing portions 39a and 39b in which the imaging devices 11a and 11b to be inspected are installed. The imaging devices 11a and 11b are connected to a data acquisition unit 48 (acquisition circuit), which will be described later, via the device storage units 39a and 39b.

  The illumination unit 36 includes a light source 41, a reflecting mirror 42, and a light collecting unit 43. The light source 41 emits light that irradiates the imaging devices 11 a and 11 b, and the reflecting mirror 42 reflects the light emitted from the light source 41 and efficiently guides it to the light collecting unit 43.

  The condensing part 43 (optical system support means) includes a lens unit 44a (condensing optical system) above the device housing part 39a and a lens unit 44b (condensing optical system) above the device housing part 39b. The lens unit 44a collects light incident from the light source 41 or the reflecting mirror 42, and irradiates the imaging device 11a installed in the device housing portion 39a with inspection light from the pinhole 46a. Similarly, the lens unit 44b irradiates the imaging device 11b installed in the device housing portion 39b with inspection light from the pinhole 46b.

  The control unit 38 includes a control unit 47, a data acquisition unit 48 (acquisition circuit), an evaluation unit 49 (evaluation unit), a horizontal movement unit 51 (movement unit), a vertical movement unit 52 (adjustment unit), an inspection unit 53, and the like. Is done. The control unit 47 comprehensively controls each unit of the control unit 38. For example, the control unit 47 controls output such as the light amount of the light source 41 via the illumination driver 54.

  The data acquisition unit (data acquisition means) 48 drives the imaging devices 11a and 11b via the imaging device driver 56, and acquires imaging signals output from the imaging devices 11a and 11b. The data acquisition unit 48 includes an amplifier (AMP) 61, an A / D converter (A / D) 62, and a DSP (Digital Signal Processor) 63. When the imaging devices 11a and 11b receive light from the pinholes 46a and 46b, the imaging devices 11a and 11b output analog imaging signals to the AMP 61. The analog imaging signal is amplified by the AMP 61 and converted into digital image data by the A / D 62. This digital image data is input to the DSP 63 as R, G, B image data that is exactly proportional to the amount of charge accumulated in each pixel of the imaging device, buffered, and then recorded in the RAM 64 via the data bus 79. Is done.

  The RAM 64 is a working memory, which temporarily stores image data, and also stores temporary data necessary for arithmetic processing using the image data, a control program necessary for operating the inspection apparatus 5, and the like. Record data temporarily. Further, a VRAM area for storing data necessary for displaying inspection data or the like on the display 66 is secured in the RAM 64.

  The ROM 67 records inspection programs necessary for various inspections performed by the inspection device 5, control programs necessary for controlling the inspection device, settings of the inspection device 5, and the like.

  The evaluation unit (evaluation means) 49 evaluates the coordinates of the optical axis of the light irradiated to the imaging device based on the image data recorded in the RAM 64 and uses the center of the image sensor 26 as an evaluation signal. Output to the horizontal movement unit 51.

  Upon receiving the evaluation signal, the horizontal moving unit 51 (moving means) drives the motor 68 composed of a plurality of motors so that the lens units 44a and 44b are respectively horizontal, that is, parallel to the image sensors of the imaging devices 11a and 11b. The optical axes La and Lb are moved to the centers of the image sensors of the imaging devices 11a and 11b to be moved and inspected. When the movement of each position of the optical axes La and Lb is completed, an inspection start signal is output to the inspection unit 53.

  The vertical movement unit 52 (adjustment means) vertically moves or moves a vertical movement unit 83 (described later) by the motor 69 to adjust the distance between the lens units 44a and 44b and the imaging devices 11a and 11b. When shooting is performed to move the positions of the optical axes La and Lb of the light applied to the imaging devices 11a and 11b, the lens units 44a and 44b are lowered, and the lens units 44a and 44b are moved to the imaging devices 11a and 11b. Close to. Further, when the inspection of the imaging devices 11a and 11b is started, the lens units 44a and 44b are adjusted so that the distance between the lens units 44a and 44b and the imaging devices 11a and 11b is an appropriate distance for the preset inspection. Move vertically.

  Upon receiving the inspection start signal from the horizontal movement unit 51, the inspection unit 53 reads the inspection program from the ROM 67 and executes various inspections. The inspection performed by the inspection unit 53 includes inspection of defects such as point scratches and line scratches in addition to characteristics such as sensitivity and shading. The inspection unit 53 records the results of various inspections, image data used for the inspection, and the like on a hard disk drive (HDD) 71.

  The operation unit 72 is operated when setting the inspection apparatus 5 or the like, and also when manually inspecting the imaging device 11, changing inspection conditions, or performing more detailed inspections. Operated.

  As shown in FIG. 6, the lens unit 44a configuring the light condensing unit 43 includes a lens holder 81a, a drive plate 82a, a vertical movement unit 83, and the like.

The lens holder 81a is provided so as to protrude downward from an opening 84a provided in the drive plate 82a. The lens holder 81a is provided with a lens 86a that condenses light incident on the opening 84a and a diffusion plate 87a that diffuses the light collected by the lens 86a. Further, the lens holder 81a includes a pinhole 46a that irradiates light to the imaging device 11a to be inspected at the bottom thereof. The position of the optical axis La of the light emitted from the lens unit 44a is determined by the position of the pinhole 46a, and in the initial setting, the optical axis La is at the position where the center of the device accommodating portion 39a is irradiated with light.

  The drive plate 82a has a substantially square shape, and an opening 84a through which light incident from the light source 41 or the reflecting mirror 42 passes is provided at the center. The drive plate 82a has teeth 91a, 91b, 91c, 91d on the lower surface. The tooth 91a engages with the gear 92a, the tooth 91b engages with the gear 92b, the tooth 91c engages with the gear 92c, and the tooth 91d engages with the gear 58d. The gears 92a, 92b, 92c, and 92d have a cylindrical shape and are provided so as to be rotatable around a rotation axis.

  When the gear 92a or the gear 92c is rotated, the corresponding teeth 91a or the teeth 91c are engaged with each other, and the drive plate 82a is moved horizontally in a direction perpendicular to the central axes of the gear 92a and the gear 92c. At this time, the gear 92b and the tooth 91b, and the gear 92d and the tooth 91d slide while engaged, and do not hinder the above-described movement. Similarly, by rotating the gear 92b or the gear 92d, the drive plate 82a can be moved horizontally in a direction perpendicular to the rotation axes of the gear 92b and the gear 92d.

  The vertical movement portion 83 includes an opening 88a for projecting the lens holder 81a, grooves 93a, 93b, 93c, and 93d for rotatably installing gears 58a, 58b, 58c, and 58d, and gears 92a, 92b, 92c, and 92d, respectively. Grooves 94a, 94b, 94c, and 94d are provided for storing other gears and wires to be rotated. The vertical movement unit 83 is provided so as to be movable in the vertical direction by a known mechanism using a motor 69 or a gear (not shown). The lens unit 44a is moved up and down in the vertical direction. 44b and the imaging devices 11a and 11b to be inspected are adjusted.

  Further, as shown in FIG. 7, the lens unit 44b provided in the same vertical movement unit 83 is also configured in the same manner as the lens unit 44a. The gear 92b constituting the lens unit 44a is the motor 68a, and the gear 92c is the motor. The gear 95b connected to 68b and constituting the lens unit 44b is connected to the motor 68c, and the gear 95a is connected to the motor 68d. Therefore, in order to adjust the position of the optical axis La relative to the imaging device 11a and the position of the optical axis Lb relative to the imaging device 11b, the lens unit 44a and the lens unit 44b are individually moved.

  The operation of the inspection apparatus 5 configured as described above will be described. As shown in FIG. 8, the imaging devices 11a and 11b to be inspected are installed in the device housing portions 39a and 39b, and the lens units 44a and 44b are brought close to the imaging devices 11a and 11b.

  At this time, as shown in FIG. 9A, in order to perform an ideal inspection, it is desirable that the optical axis La coincides with the center position of the imaging device 11a. However, it is difficult to align and install with high precision as in the case of inspecting the image sensor 26 produced on the wafer 32. In reality, as shown in FIG. 9B, the center of the imaging device 11a is In other words, the device is displaced from the position of the optical axis La and installed in the device accommodating portion 39a.

  Therefore, as shown in FIG. 9C, in order to carry out various inspections after moving the lens unit 44a in accordance with the center of the imaging device 11a and matching the optical axis La with the center of the imaging device 11, After the imaging device 11a is installed in the housing portion 39a, the imaging device 11a is irradiated with light in a state where the position of the optical axis La is shifted with respect to the center of the imaging device 11a (see FIG. 9B). I do.

  Then, based on the luminance data (light quantity distribution) of the image obtained at this time, the relative position of the optical axis La with respect to the center of the imaging device 11a is evaluated. Based on this evaluation, the lens unit 44a is moved to the center of the imaging device 11a. Similarly, evaluation and movement of the position of the optical axis Lb with respect to the imaging device 11b are performed, and after the evaluation and movement of the position of the optical axis corresponding to all imaging devices to be inspected are completed, each imaging device 11a, An image is taken at 11b, and an accurate inspection is performed almost simultaneously using the obtained image.

  As described above, the inspection apparatus 5 of the present invention performs imaging when the optical axis of light applied to the imaging device for inspection is shifted from the center of the imaging device. Photographing is performed while the position of the optical axis of the light irradiated with respect to the center of the device is shifted, and the position of the optical axis relative to the imaging device is evaluated from the image obtained at this time.

  For example, as shown in FIG. 10A, since the lens unit 44a is brought close to the imaging device 11a, the image 96 is taken when the center of the imaging device 11a and the optical axis La substantially coincide. Is the highest at the center of the image 96, that is, at the center point M where the optical axis La intersects the imaging device 11a, and the luminance gradually decreases toward the periphery of the image 96.

  Therefore, for example, as shown in FIG. 10B, when data of the image 96 along the line X1-X2 parallel to the long side 97 of the image 96 is acquired, the midpoint of the point X1 and the point X2, that is, the image 96 is obtained. Luminance data 98 having a maximum value at the center point M is obtained. As shown in FIG. 10C, when the data of the image 96 along the line Y1-Y2 parallel to the short side 99 of the image 96 is acquired, the midpoint of the point Y1 and the point Y2, that is, the center of the image 96 is obtained. Luminance data 101 having a maximum value at the point M is obtained.

  Thus, when the lens unit 44a is brought close to the imaging device 11a and light is irradiated onto the imaging device 11a, the distance between the lens unit 44a and the imaging device 11a is short at the center point M where the optical axis La intersects the imaging device 11a. The optical path of the irradiating light is short, and the distance between the lens unit 44a and the imaging device 11a is long in the peripheral part of the imaging device 11a, so that the optical path of the irradiating light becomes long. As shown in FIG. That is, data with high brightness at the center point M and low brightness at the periphery of the image 96 can be acquired.

  Therefore, the position of the optical axis La with respect to the imaging device 11a can be easily utilized by actively utilizing the undulation of the luminance data by bringing the lens unit 44a close to the imaging device 11a and irradiating the imaging device 11a with light. evaluate.

  For example, as shown in FIG. 11A, the luminance data of the image 102 obtained by photographing when the optical axis La is shifted from the center of the imaging device 11a is captured with the optical axis La of the inspection light. The point m where the image sensor 12 of the device 11a intersects is set to the maximum value, and decreases as the distance from the point m increases.

  At this time, as shown in FIG. 11B, when data of the image 102 along the line X1-X2 parallel to the long side 103 of the image 102 is acquired, luminance data 104 having a maximum value at the point X3 is obtained. . Accordingly, the point X3 is obtained from the acquired luminance data 104, and the difference ΔX between the point X3 and the center point M of the imaging device 11a is obtained, whereby the length of the image 102 with respect to the position of the optical axis La, that is, the center of the imaging device 11a. The position of the optical axis La in the direction of the side 103 can be evaluated.

  Similarly, as shown in FIG. 11C, when data of the image 102 along Y1-Y2 parallel to the short side 106 of the image 102 is acquired, luminance data 107 having a maximum value at the point Y3 is obtained. Accordingly, the point Y3 is obtained from the acquired luminance data 107, and the difference ΔY between the point Y3 and the center point M of the imaging device 11a is obtained, whereby the position of the optical axis La, that is, the short of the image 102 with respect to the center of the imaging device 11a. The position of the optical axis La in the direction of the side 106 can be evaluated.

  Note that the position of the center point M of the image 96 and the image 102 is known data before the acquisition of the image 96 and the image 102 from the size of the image sensor 26 of the imaging device 11 and the number of pixels thereof.

  As described above, obtaining the difference ΔX and the difference ΔY corresponds to evaluating the relative position of the optical axis La with respect to the center point M of the imaging device 11a. Therefore, the lens unit 44a is moved by the difference ΔX. At the same time, the optical axis La can be made to coincide with the center point M of the imaging device 11a by moving the lens unit 44a by the difference ΔY.

  As described above, according to the inspection apparatus 5 of the present invention, when the optical axis of the light to be irradiated is deviated from the center of the imaging device, photographing is performed by bringing the lens unit close to the imaging device to be inspected. The brightness data of the obtained image is undulated, the position of the optical axis of the light irradiated to the center of the imaging device is evaluated from the modulated brightness data, and the light of the light irradiated to the center of the imaging device Since the axis is moved, the amount of data and the amount of calculation required to evaluate the position of the optical axis and move it to an appropriate position for inspection are small. Therefore, it is possible to accurately inspect a plurality of imaging devices almost simultaneously and in a short time.

  In the above embodiment, the position of the optical axis of the irradiated light with respect to the center of the imaging device is matched by moving the lens unit. However, the position of the imaging device installed on the inspection board is not limited to this. It may be moved.

  Moreover, in said embodiment, when evaluating the position of the optical axis La of the light to irradiate with respect to the center of the imaging device 11a from the acquired image, and moving, the line X1 passing through the center point M of the acquired image Although the luminance data along -X2 and the line Y1-Y2 is used, the present invention is not limited to this, and luminance data along lines parallel to the long side and the short side of the acquired image may be acquired. In addition, it is not always necessary that the luminance data be along a line parallel to the long side and the short side, and the luminance data along lines that are not parallel to each other can be used in the same manner as in the above-described embodiment in order to emit light with respect to the center of the imaging device. The position of the axis can be evaluated and moved.

  Furthermore, in the above embodiment, the position of the optical axis of the irradiated light is evaluated from the acquired image with respect to the center of the imaging device, and when moving, 2 parallel to the long side and the short side of the acquired image. Although data along a book line is acquired, the present invention is not limited to this, and three or more luminance data may be used. Further, the data to be used is not limited to the luminance.

  Further, in the above embodiment, the luminance data is undulated by bringing the imaging device and the lens unit close to each other, and based on this, the position of the optical axis of the light irradiated to the imaging device is evaluated and moved. However, the present invention is not limited to this, and image data to be acquired may be modulated by appropriately reducing the diameter of light applied to the imaging device, and the relative position of the optical axis with respect to the center of the imaging device may be evaluated.

  Since the inspection apparatus of the present invention is an inspection apparatus that is effective when it is difficult to match the optical axis of light irradiated to the center of the imaging device, the inspection target is not limited to the imaging device, but as an imaging chip inspection apparatus. Can also be used. Furthermore, the imaging chip can use the inspection apparatus of the present invention for inspection of an imaging device having an image sensor such as a CCD or CMOS, regardless of the imaging method. Further, the manufacturing method, shape, and the like of the imaging device and the imaging chip are not limited to the examples shown in the above embodiments. Furthermore, even when a lens having a special shape or property is attached to the imaging device, the inspection apparatus of the present invention can inspect this.

  Further, in the above-described embodiment, the two device storage units and the lens units respectively corresponding thereto are provided, and the two imaging devices are inspected substantially simultaneously. However, the device storage unit and the lens unit are not limited to this. A plurality of imaging devices may be inspected substantially at the same time.

  In the above embodiment, the data acquisition unit 48 (acquisition circuit) is provided in the control unit 38. However, the present invention is not limited to this, and the data acquisition unit 48 may be provided on the inspection substrate 37 (device holding unit). .

  Note that, according to the inspection apparatus 5 of the present invention, as shown in the above-described embodiment, the position of the optical axis of the light individually irradiated to the plurality of imaging devices is evaluated and moved. In addition, it is possible to inspect imaging devices with different standards and substantially simultaneously, and work can be made more efficient when a solid-state imaging device is newly developed, so that development costs can be reduced.

It is a perspective view of an imaging device inspected with an inspection device of the present invention. It is sectional drawing of the imaging device inspected with the inspection apparatus of this invention. It is a perspective view of the imaging chip which comprises the imaging device test | inspected with the test | inspection element of this invention. It is a perspective view which shows the manufacturing method of the imaging device test | inspected with the test | inspection apparatus of this invention. It is the schematic showing the structure of the inspection apparatus of this invention typically. It is a disassembled perspective view which shows the structure of a lens unit and a condensing part. It is a perspective view which shows that a some lens unit drives individually. It is a flowchart which shows the effect | action of the test | inspection apparatus of this invention. It is sectional drawing which shows the positional relationship of the center of an imaging device, and an optical axis. It is a graph which shows the brightness | luminance data acquired when the position of the optical axis of test | inspection light corresponds with the center of an imaging device. It is a graph which shows the brightness | luminance data acquired when the position of the optical axis of test | inspection light has shifted | deviated from the center of the imaging device.

Explanation of symbols

5 Inspection apparatus 11, 11a, 11b Imaging device 12 Imaging chip (solid-state imaging device)
26 Image sensor (light receiving surface)
36 Illumination unit (inspection light irradiation means)
37 Inspection board (device holding means)
39 Image sensor installation unit 41 Light source 43 Condensing unit 44a, 44b Lens unit (condensing optical system)
46a, 46b Pinhole 48 Data acquisition unit (data acquisition means)
49 Evaluation Department (Evaluation Method)
51 Horizontal moving part (moving means)
52 Vertical moving part (adjustment means)
53 Inspection part 96,102 Image 98,101,104,107 Luminance data (light quantity distribution)
La, Lb Optical axis of inspection light M Center point m point ΔX, ΔY Difference

Claims (3)

In an inspection apparatus for inspecting the performance of a solid-state imaging device by irradiating light from a light source through a condensing optical system to an imaging device enclosing a solid-state imaging device in a package and evaluating an imaging signal output from the imaging device,
Device holding means connected to an acquisition circuit for individually acquiring an image pickup signal from each of the image pickup devices held in the device containing portion, having a device containing portion for arranging and holding a plurality of the image pickup devices When,
Optical system support means that is provided between the device holding means and the light source, and supports a plurality of condensing optical systems that individually guide light from the light source to each of the imaging devices held by the device holding means. When,
Evaluation that individually evaluates the position of the optical axis of the condensing optical system with respect to the solid-state image sensor based on a light amount distribution of light irradiated on the solid-state image sensor based on a signal acquired from the acquisition circuit for each imaging device Means,
A solid-state imaging device comprising: a moving unit that individually moves each of the condensing optical systems in a plane parallel to a light-receiving surface of the solid-state imaging device in accordance with an evaluation signal obtained from the evaluation unit; Element inspection equipment. An adjustment unit that moves the light collection optical system between the device holding unit and the light source, and adjusts a distance at which the solid-state imaging device is irradiated with light from the light collection optical system;
The adjusting means actively modulates the light amount distribution by irradiating light from the light source with the condensing optical system in proximity to the solid-state imaging device,
The solid-state image sensor inspection apparatus according to claim 1, wherein the evaluation unit evaluates a position of an optical axis of the condensing optical system with respect to the solid-state image sensor based on the modulation of the light amount distribution. The acquisition circuit acquires a signal output from each of the imaging devices as a substantially rectangular image reflecting the light amount distribution,
The evaluation means evaluates the position of the optical axis of the condensing optical system with respect to the solid-state imaging device from data along a line parallel to the long side of the image and data along a line parallel to the short side of the image. 3. The inspection device for a solid-state imaging device according to claim 1, wherein the inspection device is a solid-state imaging device.

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