JP2008005031A5 - - Google Patents

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Publication number
JP2008005031A5
JP2008005031A5 JP2006170177A JP2006170177A JP2008005031A5 JP 2008005031 A5 JP2008005031 A5 JP 2008005031A5 JP 2006170177 A JP2006170177 A JP 2006170177A JP 2006170177 A JP2006170177 A JP 2006170177A JP 2008005031 A5 JP2008005031 A5 JP 2008005031A5
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JP
Japan
Prior art keywords
electronic device
temperature
electronic component
current consumption
value
Prior art date
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Application number
JP2006170177A
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English (en)
Japanese (ja)
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JP4810322B2 (ja
JP2008005031A (ja
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Priority to JP2006170177A priority Critical patent/JP4810322B2/ja
Priority claimed from JP2006170177A external-priority patent/JP4810322B2/ja
Publication of JP2008005031A publication Critical patent/JP2008005031A/ja
Publication of JP2008005031A5 publication Critical patent/JP2008005031A5/ja
Application granted granted Critical
Publication of JP4810322B2 publication Critical patent/JP4810322B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006170177A 2006-06-20 2006-06-20 電子機器、消費電流制御方法、及び、消費電流制御プログラム Expired - Fee Related JP4810322B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006170177A JP4810322B2 (ja) 2006-06-20 2006-06-20 電子機器、消費電流制御方法、及び、消費電流制御プログラム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006170177A JP4810322B2 (ja) 2006-06-20 2006-06-20 電子機器、消費電流制御方法、及び、消費電流制御プログラム

Publications (3)

Publication Number Publication Date
JP2008005031A JP2008005031A (ja) 2008-01-10
JP2008005031A5 true JP2008005031A5 (enExample) 2009-02-26
JP4810322B2 JP4810322B2 (ja) 2011-11-09

Family

ID=39009097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006170177A Expired - Fee Related JP4810322B2 (ja) 2006-06-20 2006-06-20 電子機器、消費電流制御方法、及び、消費電流制御プログラム

Country Status (1)

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JP (1) JP4810322B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101840852B1 (ko) * 2011-10-10 2018-03-22 삼성전자주식회사 모바일 장치의 표면 온도 관리 방법 및 멀티칩 패키지의 메모리 열관리 방법
US9087114B2 (en) 2012-02-24 2015-07-21 Qualcomm Incorporated System and method for managing electrical current in a portable computing device
US9223376B2 (en) 2012-03-23 2015-12-29 Qualcomm Incorporated Managing electrical current in a portable computing device when two or more communications overlap in drawing power during a transmission
CN104750141A (zh) * 2013-12-31 2015-07-01 启碁科技股份有限公司 温度控制系统与方法及决定温度数字值的阈值的方法
JP2016134775A (ja) * 2015-01-20 2016-07-25 富士通株式会社 情報処理装置、情報処理方法、及び、情報処理プログラム
JP2020141215A (ja) * 2019-02-27 2020-09-03 シャープ株式会社 電子機器、端末、処理方法、温度上昇抑制システム、制御プログラム、および記憶媒体

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09329505A (ja) * 1996-06-06 1997-12-22 Sumitomo Wiring Syst Ltd ケース内の温度上昇シミュレーション方法
JP2001145274A (ja) * 1999-11-15 2001-05-25 Matsushita Electric Ind Co Ltd 充電装置を備えた携帯機器
JP2002090326A (ja) * 2000-09-20 2002-03-27 Tdk Corp 携帯用電子機器
JP2004260004A (ja) * 2003-02-26 2004-09-16 Asahi Kasei Electronics Co Ltd 電子機器及びその温度制御方法
JP4251117B2 (ja) * 2004-07-02 2009-04-08 日本電気株式会社 携帯通信端末及びその発熱対策方法

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