JP2012221301A5 - - Google Patents

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Publication number
JP2012221301A5
JP2012221301A5 JP2011087431A JP2011087431A JP2012221301A5 JP 2012221301 A5 JP2012221301 A5 JP 2012221301A5 JP 2011087431 A JP2011087431 A JP 2011087431A JP 2011087431 A JP2011087431 A JP 2011087431A JP 2012221301 A5 JP2012221301 A5 JP 2012221301A5
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JP
Japan
Prior art keywords
semiconductor integrated
integrated circuit
temperature
circuit
power supply
Prior art date
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Application number
JP2011087431A
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English (en)
Japanese (ja)
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JP2012221301A (ja
JP5296136B2 (ja
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Publication date
Application filed filed Critical
Priority claimed from JP2011087431A external-priority patent/JP5296136B2/ja
Priority to JP2011087431A priority Critical patent/JP5296136B2/ja
Priority to EP12771976.3A priority patent/EP2698684B1/en
Priority to CN201280016549.9A priority patent/CN103460159B/zh
Priority to US14/009,593 priority patent/US8975951B2/en
Priority to PCT/JP2012/059818 priority patent/WO2012141182A1/ja
Publication of JP2012221301A publication Critical patent/JP2012221301A/ja
Publication of JP2012221301A5 publication Critical patent/JP2012221301A5/ja
Publication of JP5296136B2 publication Critical patent/JP5296136B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011087431A 2011-04-11 2011-04-11 電子機器、その制御方法、及び半導体集積回路 Active JP5296136B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011087431A JP5296136B2 (ja) 2011-04-11 2011-04-11 電子機器、その制御方法、及び半導体集積回路
PCT/JP2012/059818 WO2012141182A1 (ja) 2011-04-11 2012-04-10 半導体集積回路
CN201280016549.9A CN103460159B (zh) 2011-04-11 2012-04-10 半导体集成电路
US14/009,593 US8975951B2 (en) 2011-04-11 2012-04-10 Semiconductor integrated circuit
EP12771976.3A EP2698684B1 (en) 2011-04-11 2012-04-10 Semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011087431A JP5296136B2 (ja) 2011-04-11 2011-04-11 電子機器、その制御方法、及び半導体集積回路

Publications (3)

Publication Number Publication Date
JP2012221301A JP2012221301A (ja) 2012-11-12
JP2012221301A5 true JP2012221301A5 (enExample) 2013-03-07
JP5296136B2 JP5296136B2 (ja) 2013-09-25

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ID=47272711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011087431A Active JP5296136B2 (ja) 2011-04-11 2011-04-11 電子機器、その制御方法、及び半導体集積回路

Country Status (1)

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JP (1) JP5296136B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8975954B2 (en) * 2013-01-08 2015-03-10 Qualcomm Incorporated Method for performing adaptive voltage scaling (AVS) and integrated circuit configured to perform AVS
US9037882B2 (en) * 2013-02-27 2015-05-19 Qualcomm Incorporated System and method for thermal management in a portable computing device using thermal resistance values to predict optimum power levels
US8963620B2 (en) 2013-07-23 2015-02-24 International Business Machines Corporation Controlling circuit voltage and frequency based upon location-dependent temperature
JP2015130035A (ja) 2014-01-07 2015-07-16 富士通株式会社 半導体装置および制御方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007079848A (ja) * 2005-09-13 2007-03-29 Sony Computer Entertainment Inc 電源装置およびそれを用いた電子機器
JP2007165527A (ja) * 2005-12-13 2007-06-28 Renesas Technology Corp 半導体集積回路の制御方法
JP2010526380A (ja) * 2007-05-03 2010-07-29 ディーエスエム ソリューションズ，インコーポレイテッド 適応電力管理のための方法及びシステム
JP5498047B2 (ja) * 2009-04-01 2014-05-21 株式会社東芝 半導体集積回路

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