PL403549A1 - Sposób wykonania przekładki "heat-spreader'a" grafenowego w elektronicznych przyrządach mocy, zwłaszcza w diodach laserowych - Google Patents

Sposób wykonania przekładki "heat-spreader'a" grafenowego w elektronicznych przyrządach mocy, zwłaszcza w diodach laserowych

Info

Publication number
PL403549A1
PL403549A1 PL40354913A PL40354913A PL403549A1 PL 403549 A1 PL403549 A1 PL 403549A1 PL 40354913 A PL40354913 A PL 40354913A PL 40354913 A PL40354913 A PL 40354913A PL 403549 A1 PL403549 A1 PL 403549A1
Authority
PL
Poland
Prior art keywords
electronic power
heat
spreader
making
laser diodes
Prior art date
Application number
PL40354913A
Other languages
English (en)
Other versions
PL222948B1 (pl
Inventor
Marian Teodorczyk
Elżbieta Dąbrowska-Tumańska
Anna Młożniak
Małgorzata Jakubowska
Andrzej Maląg
Original Assignee
Instytut Technologii Materiałów Elektronicznych
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Instytut Technologii Materiałów Elektronicznych filed Critical Instytut Technologii Materiałów Elektronicznych
Priority to PL403549A priority Critical patent/PL222948B1/pl
Priority to EP14164719.8A priority patent/EP2792719B1/en
Publication of PL403549A1 publication Critical patent/PL403549A1/pl
Publication of PL222948B1 publication Critical patent/PL222948B1/pl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/80—Processes for incorporating ingredients
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Przedmiotem wynalazku jest sposób wykonania przekładki "heat-spreader-a" grafenowego w elektronicznych przyrządach mocy, zwłaszcza w diodach laserowych, charakteryzujący się tym, że obejmuje etapy: a) naniesienia na radiator wspomnianego elektronicznego przyrządu mocy, a zwłaszcza na chłodnicę lasera półprzewodnikowego, zawiesiny składającej się z nanopłatków grafenu w ilości od 3% wag. do 20% wag. w octanie karbinolu butylowego, do otrzymania warstwy o grubości od 20 µm do 200 µm, b) suszenia otrzymanej warstwy w temperaturze pokojowej w powietrzu przez czas od 10 do 20 minut, c) suszenia otrzymanej warstwy w suszarce tunelowej w temperaturze około 120°C przez czas od 10 do 20 minut.
PL403549A 2013-04-15 2013-04-15 Sposób wykonania przekładki - ,,heat-spreader-a" grafenowego w elektronicznych przyrządach mocy, zwłaszcza w diodach laserowych PL222948B1 (pl)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PL403549A PL222948B1 (pl) 2013-04-15 2013-04-15 Sposób wykonania przekładki - ,,heat-spreader-a" grafenowego w elektronicznych przyrządach mocy, zwłaszcza w diodach laserowych
EP14164719.8A EP2792719B1 (en) 2013-04-15 2014-04-15 Method of manufacturing a spacer - graphene heat-spreader, in electronic power devices, especially in laser diodes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PL403549A PL222948B1 (pl) 2013-04-15 2013-04-15 Sposób wykonania przekładki - ,,heat-spreader-a" grafenowego w elektronicznych przyrządach mocy, zwłaszcza w diodach laserowych

Publications (2)

Publication Number Publication Date
PL403549A1 true PL403549A1 (pl) 2014-10-27
PL222948B1 PL222948B1 (pl) 2016-09-30

Family

ID=50486801

Family Applications (1)

Application Number Title Priority Date Filing Date
PL403549A PL222948B1 (pl) 2013-04-15 2013-04-15 Sposób wykonania przekładki - ,,heat-spreader-a" grafenowego w elektronicznych przyrządach mocy, zwłaszcza w diodach laserowych

Country Status (2)

Country Link
EP (1) EP2792719B1 (pl)
PL (1) PL222948B1 (pl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021124129A1 (de) * 2021-09-17 2023-03-23 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches halbleiterbauelement und optoelektronisches modul

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100085713A1 (en) * 2008-10-03 2010-04-08 Balandin Alexander A Lateral graphene heat spreaders for electronic and optoelectronic devices and circuits
PL222519B1 (pl) 2011-09-19 2016-08-31 Inst Tech Materiałów Elektronicznych Sposób otrzymywania warstw grafenowych i pasta zawierająca nanopłatki grafenowe

Also Published As

Publication number Publication date
EP2792719A3 (en) 2015-08-26
EP2792719A2 (en) 2014-10-22
PL222948B1 (pl) 2016-09-30
EP2792719B1 (en) 2016-12-21

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