JP2007535169A - 処理チャンバを乾式洗浄する方法およびシステム - Google Patents

処理チャンバを乾式洗浄する方法およびシステム Download PDF

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Publication number
JP2007535169A
JP2007535169A JP2007510718A JP2007510718A JP2007535169A JP 2007535169 A JP2007535169 A JP 2007535169A JP 2007510718 A JP2007510718 A JP 2007510718A JP 2007510718 A JP2007510718 A JP 2007510718A JP 2007535169 A JP2007535169 A JP 2007535169A
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JP
Japan
Prior art keywords
dry cleaning
processing system
plasma processing
cleaning process
plasma
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007510718A
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English (en)
Japanese (ja)
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JP2007535169A5 (enExample
Inventor
ノーマン・ウォデッキ
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of JP2007535169A publication Critical patent/JP2007535169A/ja
Publication of JP2007535169A5 publication Critical patent/JP2007535169A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32862—In situ cleaning of vessels and/or internal parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32963—End-point detection

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Optics & Photonics (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2007510718A 2004-04-29 2005-02-17 処理チャンバを乾式洗浄する方法およびシステム Withdrawn JP2007535169A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/834,370 US20050241669A1 (en) 2004-04-29 2004-04-29 Method and system of dry cleaning a processing chamber
PCT/US2005/005208 WO2005111265A1 (en) 2004-04-29 2005-02-17 Method and system of dry cleaning a processing chamber

Publications (2)

Publication Number Publication Date
JP2007535169A true JP2007535169A (ja) 2007-11-29
JP2007535169A5 JP2007535169A5 (enExample) 2008-02-28

Family

ID=34961726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007510718A Withdrawn JP2007535169A (ja) 2004-04-29 2005-02-17 処理チャンバを乾式洗浄する方法およびシステム

Country Status (4)

Country Link
US (1) US20050241669A1 (enExample)
JP (1) JP2007535169A (enExample)
TW (1) TWI290743B (enExample)
WO (1) WO2005111265A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007158230A (ja) * 2005-12-08 2007-06-21 Nec Electronics Corp プラズマエッチング装置のクリーニング方法、およびプラズマエッチング装置
WO2011104970A1 (ja) * 2010-02-26 2011-09-01 株式会社日立ハイテクノロジーズ エッチング装置、制御シミュレータ、及び半導体装置製造方法

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WO2006026765A2 (en) * 2004-09-01 2006-03-09 Axcelis Technologies, Inc. Plasma ashing process for increasing photoresist removal rate and plasma apparatus wuth cooling means
US7959984B2 (en) * 2004-12-22 2011-06-14 Lam Research Corporation Methods and arrangement for the reduction of byproduct deposition in a plasma processing system
US20060218680A1 (en) * 2005-03-28 2006-09-28 Bailey Andrew D Iii Apparatus for servicing a plasma processing system with a robot
US20070234955A1 (en) * 2006-03-29 2007-10-11 Tokyo Electron Limited Method and apparatus for reducing carbon monoxide poisoning at the peripheral edge of a substrate in a thin film deposition system
JP4162094B2 (ja) * 2006-05-30 2008-10-08 三菱重工業株式会社 常温接合によるデバイス、デバイス製造方法ならびに常温接合装置
CN100587902C (zh) * 2006-09-15 2010-02-03 北京北方微电子基地设备工艺研究中心有限责任公司 在线预测刻蚀设备维护的方法
TW200930135A (en) * 2007-08-31 2009-07-01 Tokyo Electron Ltd Organic electronic device, organic electronic device manufacturing method, organic electronic device manufacturing apparatus, substrate processing system, protection film structure and storage medium with control program stored therein
JP5997555B2 (ja) * 2012-09-14 2016-09-28 東京エレクトロン株式会社 エッチング装置およびエッチング方法
SG10201804237VA (en) * 2013-11-21 2018-06-28 Entegris Inc Surface coating for chamber components used in plasma systems
JP6544902B2 (ja) * 2014-09-18 2019-07-17 東京エレクトロン株式会社 プラズマ処理装置
WO2017172536A1 (en) * 2016-03-31 2017-10-05 Tokyo Electron Limited Controlling dry etch process characteristics using waferless dry clean optical emission spectroscopy
US10043641B2 (en) * 2016-09-22 2018-08-07 Applied Materials, Inc. Methods and apparatus for processing chamber cleaning end point detection
US10436717B2 (en) 2016-11-18 2019-10-08 Tokyo Electron Limited Compositional optical emission spectroscopy for detection of particle induced arcs in a fabrication process
KR20190121864A (ko) 2017-03-17 2019-10-28 도쿄엘렉트론가부시키가이샤 에칭 메트릭 향상을 위한 표면 개질 제어
CN109216241B (zh) * 2018-09-04 2021-03-12 上海华力微电子有限公司 一种刻蚀副产物智能自清洁方法
KR102054147B1 (ko) * 2019-10-21 2019-12-12 주식회사 아이엠티 테스트 장치
US12306044B2 (en) 2022-09-20 2025-05-20 Tokyo Electron Limited Optical emission spectroscopy for advanced process characterization
US12362158B2 (en) 2022-10-25 2025-07-15 Tokyo Electron Limited Method for OES data collection and endpoint detection
US12158374B2 (en) 2022-10-25 2024-12-03 Tokyo Electron Limited Time-resolved OES data collection

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JPS59142839A (ja) * 1983-02-01 1984-08-16 Canon Inc 気相法装置のクリ−ニング方法
US4563367A (en) * 1984-05-29 1986-01-07 Applied Materials, Inc. Apparatus and method for high rate deposition and etching
JPH07169693A (ja) * 1993-12-16 1995-07-04 Mitsubishi Electric Corp 横型減圧ｃｖｄ装置及びそのクリーニング方法
JP3193265B2 (ja) * 1995-05-20 2001-07-30 東京エレクトロン株式会社 プラズマエッチング装置
US5846373A (en) * 1996-06-28 1998-12-08 Lam Research Corporation Method for monitoring process endpoints in a plasma chamber and a process monitoring arrangement in a plasma chamber
JP3667893B2 (ja) * 1996-09-24 2005-07-06 川崎マイクロエレクトロニクス株式会社 半導体装置の製造方法
US6443165B1 (en) * 1996-11-14 2002-09-03 Tokyo Electron Limited Method for cleaning plasma treatment device and plasma treatment system
US6274058B1 (en) * 1997-07-11 2001-08-14 Applied Materials, Inc. Remote plasma cleaning method for processing chambers
US6534007B1 (en) * 1997-08-01 2003-03-18 Applied Komatsu Technology, Inc. Method and apparatus for detecting the endpoint of a chamber cleaning
US6081334A (en) * 1998-04-17 2000-06-27 Applied Materials, Inc Endpoint detection for semiconductor processes
US6254717B1 (en) * 1998-04-23 2001-07-03 Sandia Corporation Method and apparatus for monitoring plasma processing operations
US6010967A (en) * 1998-05-22 2000-01-04 Micron Technology, Inc. Plasma etching methods
WO2002000962A1 (en) * 2000-06-28 2002-01-03 Mks Instruments, Inc. System and method for in-situ cleaning of process monitor of semi-conductor wafer fabricator
JP2002057143A (ja) * 2000-08-07 2002-02-22 Hitachi Ltd 浮遊異物検出装置
US6852242B2 (en) * 2001-02-23 2005-02-08 Zhi-Wen Sun Cleaning of multicompositional etchant residues
WO2002090615A1 (en) * 2001-05-04 2002-11-14 Lam Research Corporation Duo-step plasma cleaning of chamber residues
US20030005943A1 (en) * 2001-05-04 2003-01-09 Lam Research Corporation High pressure wafer-less auto clean for etch applications
TW200410337A (en) * 2002-12-02 2004-06-16 Au Optronics Corp Dry cleaning method for plasma reaction chamber

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007158230A (ja) * 2005-12-08 2007-06-21 Nec Electronics Corp プラズマエッチング装置のクリーニング方法、およびプラズマエッチング装置
WO2011104970A1 (ja) * 2010-02-26 2011-09-01 株式会社日立ハイテクノロジーズ エッチング装置、制御シミュレータ、及び半導体装置製造方法

Also Published As

Publication number Publication date
TW200540942A (en) 2005-12-16
TWI290743B (en) 2007-12-01
US20050241669A1 (en) 2005-11-03
WO2005111265A1 (en) 2005-11-24

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